USD664511S1 - Adhesive tape for semiconductor manufacturing - Google Patents

Adhesive tape for semiconductor manufacturing Download PDF

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Publication number
USD664511S1
USD664511S1 US29/389,790 US201129389790F USD664511S US D664511 S1 USD664511 S1 US D664511S1 US 201129389790 F US201129389790 F US 201129389790F US D664511 S USD664511 S US D664511S
Authority
US
United States
Prior art keywords
adhesive tape
semiconductor manufacturing
view
semiconductor
ornamental design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/389,790
Inventor
Kouhei Taniguchi
Takayuki Matsuzaki
Shinya Katou
Kouji Komorida
Michio Mashino
Tatsuya Sakuta
Rie Katou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Assigned to HITACHI CHEMICAL COMPANY, LTD. reassignment HITACHI CHEMICAL COMPANY, LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KATOU, RIE, KATOU, SHINYA, KOMORIDA, KOUJI, MASHINO, MICHIO, MATSUZAKI, TAKAYUKI, SAKUTA, TATSUYA, TANIGUCHI, KOUHEI
Priority to US29/413,548 priority Critical patent/USD689831S1/en
Application granted granted Critical
Publication of USD664511S1 publication Critical patent/USD664511S1/en
Assigned to SHOWA DENKO MATERIALS CO., LTD. reassignment SHOWA DENKO MATERIALS CO., LTD. CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI CHEMICAL COMPANY, LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). Assignors: SHOWA DENKO MATERIALS CO., LTD.
Assigned to RESONAC CORPORATION reassignment RESONAC CORPORATION CHANGE OF ADDRESS Assignors: RESONAC CORPORATION
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a top plan view of our new design;
FIG. 2 is a bottom plan view;
FIG. 3 is a left side view;
FIG. 4 is a right side view;
FIG. 5 is a rear side view;
FIG. 6 is a front side view;
FIG. 7 is a cross sectional view taken at line 7-7 of FIG. 1;
FIG. 8 is an exploded view; and,
FIG. 9 is a close-up view of region 9 in FIG. 1.

Claims (1)

  1. The ornamental design for an adhesive tape for semiconductor manufacturing, as shown and described.
US29/389,790 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing Active USD664511S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/413,548 USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010024762 2010-10-15
JPD2010-024762 2010-10-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US29/413,548 Continuation USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

Publications (1)

Publication Number Publication Date
USD664511S1 true USD664511S1 (en) 2012-07-31

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US29/389,790 Active USD664511S1 (en) 2010-10-15 2011-04-15 Adhesive tape for semiconductor manufacturing
US29/413,548 Active USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

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Application Number Title Priority Date Filing Date
US29/413,548 Active USD689831S1 (en) 2010-10-15 2012-02-16 Adhesive tape for semiconductor manufacturing

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US (2) USD664511S1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Taniguchi et al., U.S. Appl. No. 29/389,788, filed Apr. 15, 2011.
Taniguchi et al., U.S. Appl. No. 29/389,794, filed Apr. 15, 2011.
Taniguchi et al., U.S. Appl. No. 29/389,797, filed Apr. 15, 2011.

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10725398B2 (en) 2010-06-11 2020-07-28 Ricoh Company, Ltd. Developer container having a cap with three portions of different diameters
US11429036B2 (en) 2010-06-11 2022-08-30 Ricoh Company, Ltd. Information storage system including a plurality of terminals
USD743400S1 (en) * 2010-06-11 2015-11-17 Ricoh Company, Ltd. Information storage device
USD758482S1 (en) 2010-06-11 2016-06-07 Ricoh Company, Ltd. Toner bottle
US9599927B2 (en) 2010-06-11 2017-03-21 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US10754275B2 (en) 2010-06-11 2020-08-25 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US9989887B2 (en) 2010-06-11 2018-06-05 Ricoh Company, Ltd. Apparatus and method for preventing an information storage device from falling from a removable device
US20180253028A1 (en) 2010-06-11 2018-09-06 Yasufumi Takahashi Apparatus and method for preventing an information storage device from falling from a removable device
USD757161S1 (en) 2010-06-11 2016-05-24 Ricoh Company, Ltd. Toner container
US11768448B2 (en) 2010-06-11 2023-09-26 Ricoh Company, Ltd. Information storage system including a plurality of terminals
US11275327B2 (en) 2010-06-11 2022-03-15 Ricoh Company, Ltd. Information storage system including a plurality of terminals
US11188007B2 (en) 2010-06-11 2021-11-30 Ricoh Company, Ltd. Developer container which discharges toner from a lower side and includes a box section
US9256158B2 (en) 2010-06-11 2016-02-09 Ricoh Company, Limited Apparatus and method for preventing an information storage device from falling from a removable device
USD804435S1 (en) * 2010-10-15 2017-12-05 Hitachi Chemical Company, Ltd. Flap in an adhesive tape for semiconductor manufacturing
USD962882S1 (en) * 2019-11-14 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD998577S1 (en) 2019-11-14 2023-09-12 Resonac Corporation Temporary protective film for manufacturing semiconductor devices
USD946540S1 (en) * 2020-11-02 2022-03-22 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD962883S1 (en) * 2020-11-02 2022-09-06 Showa Denko Materials Co., Ltd. Temporary protective film for manufacturing semiconductor devices
USD999179S1 (en) 2020-11-02 2023-09-19 Resonac Corporation Temporary protective film for manufacturing semiconductor devices

Also Published As

Publication number Publication date
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