CN109790425A - 导电性膜、卷绕体、连接结构体和连接结构体的制造方法 - Google Patents
导电性膜、卷绕体、连接结构体和连接结构体的制造方法 Download PDFInfo
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- CN109790425A CN109790425A CN201780061285.1A CN201780061285A CN109790425A CN 109790425 A CN109790425 A CN 109790425A CN 201780061285 A CN201780061285 A CN 201780061285A CN 109790425 A CN109790425 A CN 109790425A
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- bonding agent
- film
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- stripping
- bonding
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Abstract
导电性膜具备长条的剥离膜、以及设置于剥离膜上的具有导电性的多个粘接剂膜片。并且,多个粘接剂膜片沿着剥离膜的长边方向X排列。因此,能够任意地设定粘接剂膜片的形状。由此,能够对形状多样的粘接面贴附粘接剂膜片,并且能够有效地利用粘接剂膜片。
Description
技术领域
本发明涉及导电性膜、卷绕体、连接结构体和连接结构体的制造方法。
背景技术
将IC芯片等第一电路构件与玻璃基板等第二电路构件连接来制造连接结构体时,有时使用各向异性导电性膜等导电性膜(例如参照专利文献1、2)。导电性膜是在长条的剥离膜的整个面形成有粘接剂膜的膜。各向异性导电性膜是在长条的剥离膜的整个面形成有在粘接剂中分散有导电粒子的粘接剂膜的膜。导电性膜以卷绕于卷芯的卷绕体的形式提供,在将第一电路构件与第二电路构件连接时,从卷绕体卷出。然后,将导电性膜的粘接剂膜贴附于第一电路构件的粘接面,之后,隔着粘接剂膜使第一电路构件的粘接面与第二电路构件的粘接面重合。
现有技术文献
专利文献
专利文献1:日本特开2008-274019号公报
专利文献2:日本特开2015-135748号公报
发明内容
发明要解决的课题
但是,根据连接结构体的种类不同,贴附粘接剂膜的粘接面的形状不同。因此,如果在剥离膜的整个面形成有粘接剂膜,则仅能够在具有与剥离膜相同宽度的矩形的粘接面上贴附粘接剂膜。在粘接面的形状并非具有与剥离膜相同宽度的矩形的情况下,在剥离膜上所形成的粘接剂膜内,仅有一部分粘接剂膜贴附于粘接面。因此,剩余的粘接剂膜会浪费。
因此,本发明的一个方面的目的在于提供一种能够对形状多样的粘接面贴附粘接剂膜并且能够有效地利用粘接剂膜的导电性膜、卷绕体、连接结构体和连接结构体的制造方法。
解决课题的手段
本发明的一个方面涉及的导电性膜具备长条的剥离膜、以及设置于剥离膜上的具有导电性的多个粘接剂膜片,多个粘接剂膜片沿着剥离膜的长边方向排列。
该导电性膜中,在长条的剥离膜上,多个粘接剂膜片沿着剥离膜的长边方向排列。因此,能够任意地设定粘接剂膜片的形状。由此,能够对形状多样的粘接面贴附粘接剂膜片,并且能够有效地利用粘接剂膜片。
上述导电性膜中,多个粘接剂膜片可以在剥离膜的长边方向上分隔开。该导电性膜中,由于多个粘接剂膜片在剥离膜的长边方向上分隔开,因此能够在不对相邻的粘接剂膜片造成影响的情况下将粘接剂膜片贴附于粘接面。由此,能够对粘接面容易地贴附粘接剂膜片。另外,能够进一步扩展粘接剂膜片的形状自由度。
上述导电性膜中,多个粘接剂膜片可以呈相同形状。该导电性膜中,由于多个粘接剂膜片呈相同形状,因此能够对呈相同形状的多个粘接面有效率地贴附粘接剂膜片。
上述导电性膜中,多个粘接剂膜片可以配置于剥离膜的宽度方向上的中央部。该导电性膜中,由于多个粘接剂膜片配置于剥离膜的宽度方向上的中央部,因此能够容易地进行将粘接剂膜片贴附于粘接面时导电性膜相对于粘接面的定位。
上述导电性膜中,多个粘接剂膜片可以配置于剥离膜的宽度方向上的端部。该导电性膜中,由于多个粘接剂膜片配置于剥离膜的宽度方向上的端部,因此即使在粘接面的一个方向侧没有足够空间的情况下,也能够容易地将粘接剂膜片贴附于粘接面。
上述导电性膜中,多个粘接剂膜片也可以沿着剥离膜的宽度方向排列。该导电性膜中,由于多个粘接剂膜片也沿着剥离膜的宽度方向排列,因此能够提高粘接剂膜片相对于剥离膜的密度。由此,能够在剥离膜上设置更多的粘接剂膜片。
上述导电性膜中,剥离膜的长边方向上的多个粘接剂膜片的间隔可以大于或等于0.1mm且小于或等于10mm。该导电性膜中,由于剥离膜的长边方向上的多个粘接剂膜片的间隔大于或等于0.1mm,因此能够在不对相邻的粘接剂膜片造成影响的情况下将粘接剂膜片容易地贴附于粘接面。另一方面,由于该间隔小于或等于10mm,因此能够提高粘接剂膜片相对于剥离膜的密度,能够在剥离膜上设置更多的粘接剂膜片。
上述导电性膜中,剥离膜的宽度方向上的剥离膜的端缘与最接近该端缘的粘接剂膜片的间隔可以大于或等于0.1mm且小于或等于10mm。该导电性膜中,由于剥离膜的宽度方向上的剥离膜的端缘与最接近该端缘的粘接剂膜片的间隔大于或等于0.1mm,因此即使剥离膜的端部与其他构件发生干涉等,也能够抑制粘接剂膜片从剥离膜剥离。另一方面,由于该间隔小于或等于10mm,因此能够在剥离膜上有效率地设置粘接剂膜片。
但是,在将粘接剂膜片高精度地贴附于粘接面时,需要确定导电性膜上的粘接剂膜片的位置。因此,考虑通过摄像装置来检测导电性膜上的粘接剂膜片的位置。然而,如果考虑之后将粘接剂膜片贴附于粘接面,则优选在剥离膜的与粘接剂膜片相反的一侧配置摄像装置。因此,上述导电性膜中,剥离膜可以具有透光性。该导电性膜中,由于剥离膜具有透光性,因此,即使将摄像装置配置于剥离膜的与粘接剂膜片相反的一侧,也能够通过该摄像装置来检测导电性膜上的粘接剂膜片的位置。
上述导电性膜中,剥离膜的透过率可以大于或等于15%且小于或等于100%。该导电性膜中,由于剥离膜的透过率大于或等于15%,因此能够容易地从剥离膜侧检测粘接剂膜片的位置。另一方面,由于剥离膜的透过率小于或等于100%,因此能够容易地制作剥离膜。
上述导电性膜中,剥离膜的雾度值可以大于或等于3%且小于或等于100%。该导电性膜中,由于剥离膜的雾度值大于或等于3%,因此能够容易地从剥离膜侧检测粘接剂膜片的位置。另一方面,由于剥离膜的雾度值小于或等于100%,因此能够容易地制作剥离膜。
上述导电性膜可以进一步具备设置于粘接剂膜片上的第二剥离膜片。该导电性膜中,由于粘接剂膜片的表面被第二剥离膜片覆盖,因此能够保护粘接剂膜片。因此,例如在将导电性膜卷绕为卷绕体的情况下,能够抑制粘接剂膜片被转印至与内周侧或外周侧相邻的剥离膜。
上述导电性膜中,粘接剂膜片可以在粘接剂中分散有导电粒子。该导电性膜中,由于粘接剂膜片在粘接剂中分散有导电粒子,因此能够具有各向异性导电性。
本发明的一个方面涉及的卷绕体具备上述任一导电性膜、以及卷绕有导电性膜的卷芯。
该卷绕体中,由于在卷芯上卷绕有上述任一导电性膜,因此能够对形状多样的粘接面贴附粘接剂膜片,并且能够有效地利用粘接剂膜片。
本发明的一个方面涉及的连接结构体具备:具有第一粘接面的第一电路构件、具有第二粘接面的第二电路构件、以及将第一粘接面与第二粘接面连接的上述任一粘接剂膜片。
该连接结构体中,通过上述任一粘接剂膜片而将第一粘接面与第二粘接面连接。因此,不论第一粘接面和第二粘接面的形状如何,都能够获得在第一粘接面和第二粘接面上适当地贴附有粘接剂膜片的连接结构体。
本发明的一个方面涉及的连接结构体的制造方法具备:膜制造工序,制造导电性膜,该导电性膜在长条的剥离膜上设有具有导电性的多个粘接剂膜片,并且多个粘接剂膜片沿着剥离膜的长边方向排列;以及连接工序,隔着导电性膜的粘接剂膜片将第一电路构件的第一粘接面与第二电路构件的第二粘接面连接。
该连接结构体的制造方法中,制造在剥离膜上设置有多个粘接剂膜片的导电性膜,并隔着该导电性膜的粘接剂膜片将第一粘接面与第二粘接面连接。并且,由于粘接剂膜片能够任意地设定形状,因此不论第一粘接面和第二粘接面的形状如何,都能够制造在第一粘接面和第二粘接面上适当地贴附有粘接剂膜片的连接结构体。另外,能够有效地利用粘接剂膜片。
上述连接结构体的制造方法中,粘接剂膜片可以在粘接剂中分散有导电粒子。该连接结构体的制造方法中,由于粘接剂膜片在粘接剂中分散有导电粒子,因此能够具有各向异性导电性。
上述连接结构体的制造方法中,膜制造工序可以具有:粘接剂膜层形成工序,在剥离膜上的整个面形成具有导电性的粘接剂膜层;粘接剂膜层切断工序,沿着形成粘接剂膜片轮廓的轮廓线切断粘接剂膜层;以及空白剥离工序,沿着经切断的轮廓线将粘接剂膜层上的成为粘接剂膜片以外的部分的空白部分从剥离膜剥离。该连接结构体的制造方法中,在剥离膜上的整个面形成粘接剂膜层,沿着轮廓线切断粘接剂膜层,并且沿着经切断的轮廓线将空白部分从剥离膜剥离。由此,能够容易地在剥离膜上设置多个粘接剂膜片。
上述连接结构体的制造方法中,粘接剂膜层可以在粘接剂中分散有导电粒子。该连接结构体的制造方法中,由于粘接剂膜层在粘接剂中分散有导电粒子,因此切断粘接剂膜层而成的粘接剂膜片能够具有各向异性导电性。
上述连接结构体的制造方法中,连接工序可以具有:位置检测工序,通过摄像装置来检测导电性膜上的粘接剂膜片的位置;贴附工序,基于通过位置检测工序所检测出的位置将粘接剂膜片贴附于第一粘接面;以及重合工序,隔着粘接剂膜片将第一粘接面与第二粘接面重合。该连接结构体的制造方法中,通过摄像装置来检测导电性膜上的粘接剂膜片的位置,基于该检测出的位置将粘接剂膜片贴附于第一粘接面。因此,能够提高粘接剂膜片相对于粘接面的位置精度。并且,由于隔着该粘接剂膜片将第一粘接面与第二粘接面重合,因此能够容易地将粘接剂膜片放置于第一粘接面和第二粘接面内。
上述连接结构体的制造方法中,膜制造工序可以制造在粘接剂膜片上设置有第二剥离膜片的导电性膜。该连接结构体的制造方法中,由于粘接剂膜片的表面被第二剥离膜片覆盖,因此能够保护粘接剂膜片。因此,例如在导电性膜卷绕为卷绕体的情况下,能够抑制粘接剂膜片被转印至与内周侧或外周侧相邻的剥离膜。
上述连接结构体的制造方法中,膜制造工序可以具有:粘接剂膜层形成工序,在剥离膜上的整个面形成具有导电性的粘接剂膜层,进一步在粘接剂膜层上的整个面覆盖第二剥离膜;粘接剂膜层切断工序,沿着形成粘接剂膜片轮廓的轮廓线切断粘接剂膜层和第二剥离膜;以及空白剥离工序,沿着经切断的轮廓线将粘接剂膜层和第二剥离膜上的成为粘接剂膜片以外的部分的空白部分从剥离膜剥离。该连接结构体的制造方法中,在剥离膜上的整个面形成粘接剂膜层,在粘接剂膜层上的整个面覆盖第二剥离膜,沿着轮廓线切断粘接剂膜层,并且沿着经切断的轮廓线将空白部分从剥离膜剥离。由此,能够容易地在剥离膜上设置多个粘接剂膜片,并且能够在粘接剂膜片上覆盖第二剥离膜片。
上述连接结构体的制造方法中,粘接剂膜层可以在粘接剂中分散有导电粒子。该连接结构体的制造方法中,由于粘接剂膜层在粘接剂中分散有导电粒子,因此切断粘接剂膜层而成的粘接剂膜片能够具有各向异性导电性。
上述连接结构体的制造方法中,连接工序可以具有:位置检测工序,通过摄像装置来检测导电性膜上的粘接剂膜片的位置;贴附工序,基于通过位置检测工序所检测出的位置将粘接剂膜片贴附于第一粘接面;重合工序,隔着粘接剂膜片将第一粘接面与第二粘接面重合;以及第二剥离膜片剥离工序,在贴附工序之前将第二剥离膜片从粘接剂膜片剥离。该连接结构体的制造方法中,通过摄像装置来检测导电性膜上的粘接剂膜片的位置,基于该检测出的位置将粘接剂膜片贴附于第一粘接面。因此,能够提高粘接剂膜片相对于粘接面的位置精度。并且,由于隔着该粘接剂膜片将第一粘接面与第二粘接面重合,因此能够容易地将粘接剂膜片放置于第一粘接面和第二粘接面内。并且,由于在贴附工序之前将第二剥离膜片从粘接剂膜片剥离,因此能够将粘接剂膜片确实地贴附于第一粘接面。
上述连接结构体的制造方法中,可以通过贴附工序将该粘接剂膜片贴附于第一粘接面后,将剥离膜从粘接剂膜片剥离。该连接结构体的制造方法中,由于在将粘接剂膜片贴附于第一粘接面后将剥离膜从粘接剂膜片剥离,因此能够容易地将粘接剂膜片贴附于第一粘接面。
上述连接结构体的制造方法中,连接工序可以进一步具有膜切断工序,即:在位置检测工序之前,将导电性膜切断为在剥离膜上设置有一个或多个粘接剂膜片的多个导电性膜片,位置检测工序中,可通过摄像装置来检测导电性膜片上的粘接剂膜片的位置。该连接结构体的制造方法中,由于将导电性膜切断为多个导电性膜片,因此即使在多个部位贴附粘接剂膜片的情况、想要改变粘接剂膜片的贴附方向的情况等时,也能够灵活地应对。并且,由于通过摄像装置来检测导电性膜片上的粘接剂膜片的位置,因此,即使将导电性膜切断为多个导电性膜片,也能够提高粘接剂膜片相对于粘接面的位置精度。
发明效果
根据本发明,能够对形状多样的粘接面贴附粘接剂膜,并且能够有效地利用粘接剂膜。
附图说明
[图1]是表示本实施方式涉及的卷绕体的立体图。
[图2]是表示本实施方式涉及的各向异性导电性膜的平面图。
[图3]是图2所示的III-III线的截面图。
[图4]是用于说明粘接剂膜片相对于剥离膜的位置的平面图。
[图5]是表示本实施方式涉及的连接结构体的截面图。
[图6]是表示本实施方式涉及的连接结构体的制造方法的流程图。
[图7]是表示图6所示的膜制造工序的流程图。
[图8]图8(a)、图8(b)、图8(c)和图8(d)是用于说明图6所示的膜制造工序的截面图。
[图9]图9(a)、图9(b)、图9(c)和图9(d)是用于说明图6所示的膜制造工序的立体图。
[图10]是表示图6所示的连接工序的流程图。
[图11]是用于说明图6所示的连接工序的概略工序图。
[图12]是表示变形例的各向异性导电性膜的平面图。
[图13]图13(a)、图13(b)和图13(c)是表示变形例的各向异性导电性膜的平面图。
[图14]图14(a)、图14(b)和图14(c)是表示变形例的各向异性导电性膜的平面图。
[图15]是表示变形例的各向异性导电性膜的平面图。
[图16]是表示变形例的各向异性导电性膜的平面图。
[图17]图17(a)、图17(b)和图17(c)是表示变形例的各向异性导电性膜的平面图。
[图18]图18(a)、图18(b)和图18(c)是表示变形例的各向异性导电性膜的平面图。
[图19]是表示变形例1的各向异性导电性膜的截面图。
[图20]图20(a)、图20(b)、图20(c)、图20(d)和图20(e)是用于说明变形例1的各向异性导电性膜的制造方法中的膜制造工序的截面图。
[图21]是表示变形例2的连接结构体的制造方法中的连接工序的流程图。
[图22]是用于说明图21所示的连接工序的概略工序图。
[图23]是用于说明图21所示的膜切断工序的平面图。
具体实施方式
以下,一边参照附图一边对本发明的优选实施方式进行详细说明。本实施方式将本发明涉及的导电性膜应用于具有各向异性导电性的各向异性导电性膜。但是,本发明涉及的导电性膜也能够应用于不具有各向异性导电性的各种导电性膜。需要说明的是,附图中,对相同或相应部分赋予相同符号,并省略重复的说明。另外,附图中,为了容易理解说明,适宜变更了尺寸比例等。
[卷绕体]
如图1所示,卷绕体1具备长条的(带状的)各向异性导电性膜2、以及卷绕有各向异性导电性膜2的卷芯3。即,卷绕体1是在卷芯3上卷绕各向异性导电性膜2而成的。
卷芯3具备芯材3a、以及一对侧板3b。芯材3a形成为圆柱状。各向异性导电性膜2卷绕于芯材3a的外周面。一对侧板3b安装于芯材3a的轴线方向上的两端部。一对侧板3b从左右支撑各向异性导电性膜2。一对侧板3b的间隔略微宽于各向异性导电性膜2的宽度。
[各向异性导电性膜]
如图1~图3所示,各向异性导电性膜2具备长条的(带状的)剥离膜4、以及设置于剥离膜4上的具有导电性的多个粘接剂膜片5。粘接剂膜片5为了具有导电性而在粘接剂6中分散有导电粒子7。需要说明的是,俯视时,各向异性导电性膜2的轮廓由剥离膜4的轮廓决定。
剥离膜4贴附于粘接剂膜片5,并支撑粘接剂膜片5。剥离膜4的材料例如可使用聚对苯二甲酸乙二醇酯(PET)、聚乙烯、聚丙烯等。剥离膜4中可含有任意的填充剂。另外,对于剥离膜4的表面,可实施脱模处理、等离子体处理等。
但是,在将粘接剂膜片5高精度地贴附于粘接对象(未图示)的粘接面(未图示)时,需要确定各向异性导电性膜2上的粘接剂膜片5的位置。因此,考虑通过摄像装置21(参照图11)来检测各向异性导电性膜2上的粘接剂膜片5的位置。然而,如果考虑之后将粘接剂膜片5贴附于粘接面,则优选在剥离膜4的与粘接剂膜片5相反的一侧配置摄像装置21。
因此,剥离膜4可以具有透光性,以便能够通过摄像装置21从剥离膜4侧检测粘接剂膜片5的位置。
该情况下,剥离膜4的透过率可以设为大于或等于15%且小于或等于100%,优选设为大于或等于15%且小于或等于99%,进一步优选设为大于或等于16%且小于或等于98%。
剥离膜4的透过率可以如下测定。在雾度计(例如日本电色工业株式会社制NDH-5000)上设置切断为50mm×50mm的正方形的剥离膜,测定总透光率。并且,将该测定结果设为剥离膜4的透过率。
另外,剥离膜4的雾度值可以设为大于或等于3%且小于或等于100%,优选设为大于或等于3%且小于或等于99%,更优选设为大于或等于4%且小于或等于99%。
剥离膜4的雾度值可以如下测定。在雾度计(例如日本电色工业株式会社制NDH-5000)上设置切断为50mm×50mm的正方形的剥离膜,测定雾度值。并且,将该测定结果设为剥离膜4的雾度值。
作为形成粘接剂膜片5的粘接剂6,例如可使用热塑性树脂、热固性树脂、热塑性树脂和热固性树脂的混合系、光固化性树脂。作为热塑性树脂,例如可使用苯乙烯树脂系、聚酯树脂系。作为热固性树脂,例如可使用环氧树脂系、有机硅树脂系。使用热塑性树脂、热固性树脂的情况下,通常需要加热加压。对于热塑性树脂而言,是为了使树脂流动而获得与被粘接体的密合力,另外,对于热固性树脂而言,是为了进一步进行树脂的固化反应。另外,光固化性树脂在固化中不需要加热,因此在需要低温下连接的情况下有用。
作为形成粘接剂膜片5的导电粒子7,例如可使用Au、Ag、Ni、Cu、Pd、焊料等金属粒子;碳粒子。另外,导电粒子7也可以为利用Au、Pd等贵金属类被覆Ni、Cu等过渡金属类的表面而成的粒子。另外,导电粒子7也可以为通过利用导电物质被覆玻璃、陶瓷、塑料等非导电粒子的表面等方法而在非导电粒子表面形成了导通层的粒子。导电粒子7进一步也可以为利用贵金属类构成了最外层的粒子、使用了热熔融金属粒子的粒子等。
多个粘接剂膜片5沿着剥离膜4的长边方向X排列。剥离膜4的长边方向X是指各向异性导电性膜2从卷绕体1卷出的方向。
此处,多个粘接剂膜片5可以在剥离膜4的长边方向X上分隔开,也可以在剥离膜4的长边方向X上相连接。如图2所示,本实施方式中,多个粘接剂膜片5在剥离膜4的长边方向X上分隔开。然而,多个粘接剂膜片5也可以如图12所示的各向异性导电性膜2A那样在剥离膜4的长边方向X上相连接。
另外,粘接剂膜片5的形状没有特别限定,可以设为各种形状。如图2所示,本实施方式中,粘接剂膜片5形成为圆形。然而,粘接剂膜片5也可以如图13(a)所示的各向异性导电性膜2B1那样形成为椭圆,也可以如图14(a)所示的各向异性导电性膜2C1那样形成为细长的直线状。这些情况下,粘接剂膜片5可以如图13(a)所示的各向异性导电性膜2B1和图14(a)所示的各向异性导电性膜2C1那样,在剥离膜4的相对于长边方向X正交的方向上延伸,也可以如图13(b)所示的各向异性导电性膜2B2和图14(b)所示的各向异性导电性膜2C2那样,在剥离膜4的与长边方向X平行的方向上延伸,还可以如图13(c)所示的各向异性导电性膜2B3和图14(c)所示的各向异性导电性膜2C3那样,在剥离膜4的相对于长边方向X倾斜的方向上延伸。
另外,粘接剂膜片5也可以形成有孔。如图2所示,本实施方式中,粘接剂膜片5未形成孔。然而,也可以如图18(a)所示的各向异性导电性膜2G1、图18(b)所示的各向异性导电性膜2G2、和图18(c)所示的各向异性导电性膜2G3那样,在粘接剂膜片5中形成有孔5a。孔5a为通过将粘接剂膜片5的一部分打通(打穿)而成的孔。孔5a的形状、大小、位置、数量等没有特别限定。例如,孔5a可以为与粘接剂膜片5相似的形状,也可以并非与粘接剂膜片5相似的形状。作为孔5a的形状,可列举正圆、椭圆等圆形,三角形、四边形等多边形,星形、各种记号等复杂的形状等。作为四边形,可列举正方形、长方形、梯形等。孔5a的位置可以为粘接剂膜片5的中央部,也可以为粘接剂膜片5的端部。一个粘接剂膜片5中所形成的孔5a的数量可以为一个,也可以为两个以上。在一个粘接剂膜片5中形成有多个孔5a的情况下,各孔5a的形状、大小等可相同也可以不同。图18(a)所示的各向异性导电性膜2G1中,在具有四边形轮廓的粘接剂膜片5的中央部形成有与粘接剂膜片5相似的四边形的孔5a。图18(b)所示的各向异性导电性膜2G2中,在具有圆形轮廓的粘接剂膜片5的中央部形成有与粘接剂膜片5相似的圆形的孔5a。图18(c)所示的各向异性导电性膜2G3中,在具有四边形轮廓的粘接剂膜片5的中央部形成有圆形的四边形的孔5a。
另外,多个粘接剂膜片5可以为相同的形状,也可以为不同的形状。如图2所示,本实施方式中,多个粘接剂膜片5全部为相同的形状。然而,多个粘接剂膜片5也可以如图15所示的各向异性导电性膜2D那样为不同的形状。该情况下,可以所有的粘接剂膜片5互为不同的形状,也可以不同形状的粘接剂膜片5与相同形状的粘接剂膜片5混合存在。
另外,多个粘接剂膜片5可以配置于剥离膜4的宽度方向Y上的任一位置。剥离膜4的宽度方向Y是指与剥离膜4的长边方向X和剥离膜4的厚度方向Z(参照图3)正交的方向。例如,如图2所示,本实施方式中,粘接剂膜片5配置于剥离膜4的宽度方向Y上的中央部。然而,粘接剂膜片5也可以如图16所示的各向异性导电性膜2E那样,配置于剥离膜4的宽度方向Y上的端部。
另外,多个粘接剂膜片5可以在剥离膜4的宽度方向上排列为一列,也可以在剥离膜4的宽度方向上排列为多列。如图2所示,本实施方式中,多个粘接剂膜片5在剥离膜4的宽度方向上排列为一列。然而,多个粘接剂膜片5也可以如图17(a)所示的各向异性导电性膜2F1那样,在剥离膜4的宽度方向上排列为两列,也可以如图17(b)所示的各向异性导电性膜2F2那样,在剥离膜4的宽度方向上排列为三列,还可以如图17(c)所示的各向异性导电性膜2F3那样,在剥离膜4的长边方向上,剥离膜4的宽度方向上的排列数不同。
另外,从剥离膜4的宽度方向Y观察,在剥离膜4的长边方向X上分隔开的多个粘接剂膜片5可以配置于彼此不重叠的位置,也可以配置于彼此重叠的位置。如图2所示,本实施方式中,从剥离膜4的宽度方向Y观察,在剥离膜4的长边方向X上分隔开的多个粘接剂膜片5配置于彼此不重叠的位置。然而,在剥离膜4的长边方向X上分隔开的多个粘接剂膜片5也可以如图13(c)所示的各向异性导电性膜2B3和图14(c)所示的各向异性导电性膜2C3那样,配置于从剥离膜4的宽度方向Y观察而彼此重叠的位置。
如图4所示,剥离膜4的长边方向X上的多个粘接剂膜片5的间隔A可以设为大于或等于0.1mm且小于或等于10mm,优选设为大于或等于0.1mm且小于或等于0.8mm,更优选设为大于或等于0.2mm且小于或等于0.5mm。另外,剥离膜4的宽度方向Y上的剥离膜4的端缘与最靠近该端缘的粘接剂膜片5的间隔B可以设为大于或等于0.1mm且小于或等于10mm,优选设为大于或等于0.1mm且小于或等于0.8mm,更优选设为大于或等于0.2mm且小于或等于0.5mm。
[连接结构体]
如图5所示,连接结构体10具备:具有第一粘接面11a的第一电路构件11、具有第二粘接面12a的第二电路构件12、以及将第一粘接面11a与第二粘接面12a连接的粘接剂膜片5。
第一电路构件11例如为IC芯片、LSI芯片、电阻体芯片、电容器芯片等芯片部件。第一电路构件11中,与第二电路构件12相对向的面为第一粘接面11a。在第一粘接面11a,配置有用于与第二电路构件12导通的第一电极(未图示)。
第二电路构件12例如为玻璃基板、聚酰亚胺基板、聚对苯二甲酸乙二醇酯基板、聚碳酸酯基板、环烯烃聚合物(COP)基板、聚萘二甲酸乙二醇酯基板、玻璃增强环氧基板、纸苯酚基板、陶瓷基板、层叠板等具有透光性的基板。第二电路构件12中,与第一电路构件11的第一粘接面11a相对向的面为第二粘接面12a。在第二粘接面12a,配置有用于与第一电路构件11导通的第二电极(未图示)。
需要说明的是,也可以不对第一电路构件11与第二电路构件12进行明确区分而对各电路构件应用任何构件。作为第一电路构件11,例如可使用玻璃基板、聚酰亚胺基板、聚对苯二甲酸乙二醇酯基板、聚碳酸酯基板、环烯烃聚合物(COP)基板、聚萘二甲酸乙二醇酯基板、玻璃增强环氧基板、纸苯酚基板、陶瓷基板、层叠板等具有透光性的基板。另外,作为第二电路构件12,例如可使用IC芯片、LSI芯片、电阻体芯片、电容器芯片等芯片部件。
粘接剂膜片5为从上述各向异性导电性膜2剥离下来的粘接剂膜片5。粘接剂膜片5通过粘接剂6而将第一粘接面11a与第二粘接面12a连接,通过分散在粘接剂6中的导电粒子7而使第一粘接面11a的第一电极与第二粘接面12a的第二电极导通。
[连接结构体的制造方法]
如图6所示,连接结构体的制造方法具备:膜制造工序(S1)、以及在膜制造工序(S1)之后进行的连接工序(S2)。
膜制造工序(S1)中,制造各向异性导电性膜2,该各向异性导电性膜2在长条的剥离膜4上设有具有导电性的多个粘接剂膜片5,并且多个粘接剂膜片5沿着剥离膜4的长边方向排列。粘接剂膜片5为了具有各向异性导电性而在粘接剂6中分散有导电粒子7。连接工序(S2)中,隔着各向异性导电性膜2的粘接剂膜片5将第一电路构件11的第一粘接面11a与第二电路构件12的第二粘接面12a连接。
如图7所示,膜制造工序(S1)具备:粘接剂膜层形成工序(S11)、在粘接剂膜层形成工序(S1)之后进行的粘接剂膜层切断工序(S12)、以及在粘接剂膜层切断工序(S12)之后进行的空白剥离工序(S13)。
粘接剂膜层形成工序(S11)中,首先,如图8(a)和图9(a)所示,准备剥离膜4。然后,如图8(b)和图9(b)所示,在剥离膜4上的整个面形成具有导电性的粘接剂膜层5A。粘接剂膜层5A为在粘接剂6中分散有导电粒子7的粘接剂膜层。形成粘接剂膜层5A的粘接剂6和导电粒子7与形成上述粘接剂膜片5的粘接剂6和导电粒子7相同。
粘接剂膜层切断工序(S12)中,如图8(c)和图9(c)所示,沿着形成粘接剂膜片5轮廓的轮廓线5B将形成于剥离膜4上的粘接剂膜层5A切断。由此,粘接剂膜层5A被分离为位于轮廓线5B的内侧的内侧部分5A1、和位于轮廓线5B的外侧的多个空白部分5A2。内侧部分5A1为成为粘接剂膜片5的部分。空白部分5A2为成为粘接剂膜片5以外部分的部分。粘接剂膜层5A的切断例如通过将粘接剂膜层5A抵压至在外周面形成有切割刀的辊切机而进行。由此,即使粘接剂膜片5为复杂形状、微细形状等,也能够容易地沿着轮廓线5B将粘接剂膜层5A切断。
空白剥离工序(S13)中,如图8(d)和图9(d)所示,沿着经切断的轮廓线5B,将粘接剂膜层5A中的成为粘接剂膜片5以外的部分的空白部分5A2从剥离膜4剥离。空白部分5A2的剥离例如通过使粘着带粘着于空白部分5A2,拉伸该粘着带,将空白部分5A2从剥离膜4剥离而进行。如此,剥离膜4上残留的内侧部分5A1成为粘接剂膜片5。由此,制造出在剥离膜4上设置有多个粘接剂膜片5的各向异性导电性膜2。
以上述方式制造的各向异性导电性膜2在以卷绕于卷芯3的卷绕体1的形式进行保管、搬运等后,转移至连接工序(S2)。需要说明的是,各向异性导电性膜2也可以不卷绕成卷绕体1而转移至连接工序(S2)。
如图10所示,连接工序(S2)具备:位置检测工序(S21)、贴附工序(S22)、以及重合工序(S23)。
位置检测工序(S21)中,首先,将各向异性导电性膜2从卷绕体1卷出。然后,如图11所示,通过摄像装置21来检测各向异性导电性膜2上的粘接剂膜片5的位置。此时,摄像装置21可以配置于剥离膜4的粘接剂膜片5侧,也可以配置于剥离膜4的与粘接剂膜片5相反的一侧。如图11所示,本实施方式中,摄像装置21配置于剥离膜4的与粘接剂膜片5相反的一侧。该情况下,通过使用具有透光性的剥离膜4,从而摄像装置21能够从剥离膜4侧检测各向异性导电性膜2上的粘接剂膜片5的位置。
贴附工序(S22)中,基于通过位置检测工序(S21)所检测出的位置,将粘接剂膜片5贴附于第一粘接面11a。然后,将剥离膜4从贴附于第一粘接面11a的粘接剂膜片5剥离。
重合工序(S23)中,隔着粘接剂膜片5将第一粘接面11a与第二粘接面12a重合。由此,第一粘接面11a与第二粘接面12a通过粘接剂膜片5的粘接剂6而被暂时连接。然后,对第一电路构件11和第二电路构件12进行加压,从而利用粘接剂膜片5的导电粒子7使第一电路构件11与第二电路构件12导通,并且对粘接剂膜片5的粘接剂6施加热或光,从而使该粘接剂6固化。由此,能够获得第一粘接面11a与第二粘接面12a通过粘接剂膜片5连接而成的连接结构体10。
如此,本实施方式涉及的各向异性导电性膜2中,在长条的剥离膜4上,多个粘接剂膜片5沿着剥离膜4的长边方向X排列。因此,能够任意地设定粘接剂膜片5的形状。由此,能够对形状多样的粘接面贴附粘接剂膜片5,并且能够有效地利用粘接剂膜片5。
另外,该各向异性导电性膜2中,多个粘接剂膜片5在剥离膜4的长边方向X上分隔开的情况下,能够在不对相邻的粘接剂膜片5造成影响的情况下将粘接剂膜片5贴附于粘接面。由此,能够对粘接面容易地贴附粘接剂膜片5。另外,能够进一步扩展粘接剂膜片5的形状自由度。
另外,该各向异性导电性膜2中,在多个粘接剂膜片5呈相同形状的情况下,能够对呈相同形状的多个粘接面有效率地贴附粘接剂膜片5。
另外,该各向异性导电性膜2中,在多个粘接剂膜片5配置于剥离膜4的宽度方向上的中央部的情况下,能够在将粘接剂膜片5贴附于粘接面时容易地进行各向异性导电性膜2相对于粘接面的定位。
另外,该各向异性导电性膜2中,在多个粘接剂膜片5配置于剥离膜4的宽度方向上的端部的情况下,即使在粘接面的一个方向侧没有足够空间的情况下,也能够容易地将粘接剂膜片5贴附于粘接面。
另外,该各向异性导电性膜2中,在多个粘接剂膜片5也沿着剥离膜4的宽度方向Y排列的情况下,能够提高粘接剂膜片5相对于剥离膜4的密度。由此,能够在剥离膜4上设置更多的粘接剂膜片5。
另外,该各向异性导电性膜2中,在剥离膜4的长边方向X上的多个粘接剂膜片5的间隔大于或等于0.1mm的情况下,能够在不对相邻的粘接剂膜片5造成影响的情况下将粘接剂膜片5容易地贴附于粘接面。另一方面,在该间隔小于或等于10mm的情况下,能够提高粘接剂膜片5相对于剥离膜4的密度,从而能够在剥离膜4上设置更多的粘接剂膜片5。
另外,该各向异性导电性膜2中,在剥离膜4的宽度方向上的剥离膜4的端缘与最接近该端缘的粘接剂膜片5的间隔大于或等于0.1mm的情况下,即使剥离膜4的端部与其他构件发生干涉等,也能够抑制粘接剂膜片5从剥离膜4剥离。另一方面,在该间隔小于或等于10mm的情况下,能够在剥离膜4上有效率地设置粘接剂膜片5。
另外,该各向异性导电性膜2中,在剥离膜4具有透光性的情况下,即使将摄像装置21配置于剥离膜4的与粘接剂膜片5相反的一侧,也能够通过该摄像装置21来检测各向异性导电性膜2上的粘接剂膜片5的位置。
另外,该各向异性导电性膜2中,在剥离膜4的透过率大于或等于15%的情况下,能够容易地从剥离膜4侧检测粘接剂膜片5的位置。另一方面,在剥离膜4的透过率小于或等于100%的情况下,能够容易地制作剥离膜4。
另外,该各向异性导电性膜2中,在剥离膜4的雾度值大于或等于3%的情况下,能够容易地从剥离膜4侧检测粘接剂膜片5的位置。另一方面,在剥离膜4的雾度值小于或等于100%的情况下,能够容易地制作剥离膜4。
本实施方式涉及的卷绕体1中,由于上述各向异性导电性膜2卷绕于卷芯3,因此能够对形状多样的粘接面贴附粘接剂膜片5,并且能够有效地利用粘接剂膜片5。
本实施方式涉及的连接结构体10中,通过上述粘接剂膜片5而将第一粘接面11a与第二粘接面12a连接。因此,不论第一粘接面11a和第二粘接面12a的形状如何,都能够获得在第一粘接面11a和第二粘接面12a适当地贴附有粘接剂膜片5的连接结构体10。
本实施方式涉及的连接结构体的制造方法中,制造在剥离膜4上设有多个粘接剂膜片5的各向异性导电性膜2,并且隔着该各向异性导电性膜2的粘接剂膜片5将第一粘接面11a与第二粘接面12a连接。并且,由于粘接剂膜片5能够任意地设定形状,因此不论第一粘接面11a和第二粘接面12a的形状如何,都能够制造在第一粘接面11a和第二粘接面12a适当地贴附有粘接剂膜片5的连接结构体10。另外,能够有效地利用粘接剂膜片5。
另外,该连接结构体的制造方法中,在剥离膜4上的整个面形成粘接剂膜层5A,沿着轮廓线5B切断粘接剂膜层5A,并且沿着经切断的轮廓线5B将空白部分5A2从剥离膜4剥离。由此,能够容易地在剥离膜4上设置多个粘接剂膜片5。
另外,该连接结构体的制造方法中,通过摄像装置21来检测各向异性导电性膜2上的粘接剂膜片5的位置,基于该检测出的位置将粘接剂膜片5贴附于第一粘接面11a。因此,能够提高粘接剂膜片5相对于粘接面的位置精度。并且,由于隔着该粘接剂膜片5将第一粘接面11a与第二粘接面12a重合,因此能够容易地将粘接剂膜片5放置于第一粘接面11a和第二粘接面12a内。
另外,该连接结构体的制造方法中,由于在将粘接剂膜片5贴附于第一粘接面11a后将剥离膜4从粘接剂膜片5剥离,因此能够容易地将粘接剂膜片5贴附于第一粘接面11a。
本发明并不限定于上述实施方式,只要不脱离本发明的主旨就能够适宜变更。以下,对上述实施方式的变形例进行说明。
[变形例1]
如图19所示,变形例1的各向异性导电性膜2H进一步具备覆盖粘接剂膜片5的第二剥离膜片8。即,各向异性导电性膜2H具备:长条的剥离膜4;设置于剥离膜4上且在粘接剂6中分散有导电粒子7的多个粘接剂膜片5;以及设置于各粘接剂膜片5上的第二剥离膜片8。第二剥离膜片8是通过覆盖粘接剂膜片5的表面来保护粘接剂膜片5的膜。因此,变形例1中,卷绕体1通过将该各向异性导电性膜2H卷绕于卷芯3而成。
变形例1中,膜制造工序(S1)和连接工序(S2)如下所述。
膜制造工序(S1)的粘接剂膜层形成工序(S11)中,首先,如图20(a)所示,准备剥离膜4。接着,如图20(b)所示,在剥离膜4上的整个面形成粘接剂膜层5A。接着,如图20(c)所示,在粘接剂膜层5A上的整个面覆盖(贴附)第二剥离膜8A。第二剥离膜8A的材料与第二剥离膜片8相同。
膜制造工序(S1)的粘接剂膜层切断工序(S12)中,如图20(d)所示,沿着轮廓线5B将形成于剥离膜4上的粘接剂膜层5A和第二剥离膜8A切断。由此,粘接剂膜层5A被分离为位于轮廓线5B的内侧的内侧部分5A1、和位于轮廓线5B的外侧的多个空白部分5A2。同样地,第二剥离膜8A被分离为位于轮廓线5B的内侧的内侧部分8A1、和位于轮廓线5B的外侧的多个空白部分8A2。
膜制造工序(S1)的空白剥离工序(S13)中,如图20(e)所示,沿着经切断的轮廓线5B,将空白部分5A2和空白部分8A2从剥离膜4剥离。如此,在剥离膜4上残留内侧部分5A1和内侧部分8A1。剥离膜4上残留的内侧部分5A1和内侧部分8A1成为粘接剂膜片5和第二剥离膜片8。由此,制造出在剥离膜4上设置有被第二剥离膜片8覆盖的多个粘接剂膜片5的各向异性导电性膜2H。
以上述方式制造的各向异性导电性膜2H在以卷绕于卷芯3的卷绕体1的形式进行保管、搬运等后,转移至连接工序(S2)。需要说明的是,各向异性导电性膜2H也可以不卷绕成卷绕体1而转移至连接工序(S2)。
连接工序(S2)中,在贴附工序(S22)之前进行第二剥离膜片剥离工序。剥离工序中,首先,在从卷绕体1拉出的各向异性导电性膜2H中,将第二剥离膜片8从粘接剂膜片5剥离。第二剥离膜片8的剥离例如可以通过使粘着带粘着于第二剥离膜片8,拉伸该粘着带,将第二剥离膜片8从粘接剂膜片5剥离而进行。需要说明的是,剥离工序只要先于贴附工序(S22),就可以在连接工序(S2)的任一阶段进行。然后,与上述实施方式同样。
如此,在变形例1的各向异性导电性膜2H中,由于粘接剂膜片5的表面被第二剥离膜片8覆盖,因此能够保护粘接剂膜片5。因此,在各向异性导电性膜2H卷绕于卷芯3而成的卷绕体1中,能够抑制粘接剂膜片5被转印至与内周侧或外周侧相邻的剥离膜4。
另外,变形例1中,在剥离膜4上的整个面形成粘接剂膜层5A,在粘接剂膜层5A上的整个面覆盖第二剥离膜8A,沿着轮廓线5B切断粘接剂膜层5A,并且沿着经切断的轮廓线5B将空白部分5A2从剥离膜4剥离。由此,能够容易地在剥离膜4上设置多个粘接剂膜片5,并且能够在粘接剂膜片5上覆盖第二剥离膜片8。
另外,由于在贴附工序之前将第二剥离膜片8从粘接剂膜片5剥离,因此能够将粘接剂膜片5确实地贴附于第一粘接面11a。
[变形例2]
如图21所示,变形例2的连接结构体的制造方法中,连接工序(S2)进一步具备在位置检测工序(S21)之前进行的膜切断工序(S24)。
膜切断工序(S24)中,如图22和图23所示,首先,将各向异性导电性膜2切断为多个各向异性导电性膜片2Z。各向异性导电性膜片2Z是在剥离膜4上设置有一个或多个粘接剂膜片5的膜片。然后,在膜切断工序(S24)之后紧跟着的位置检测工序(S21)中,通过摄像装置21来检测各向异性导电性膜片2Z上的粘接剂膜片5的位置。在各向异性导电性膜片2Z,可以仅设置有一个粘接剂膜片5,也可以设置有两个以上的粘接剂膜片5。本实施方式中,在各向异性导电性膜片2Z仅设置有一个粘接剂膜片5。
该连接结构体的制造方法中,由于将各向异性导电性膜2切断为多个各向异性导电性膜片2Z,因此即使在多个部位贴附粘接剂膜片5的情况、想要改变粘接剂膜片5的贴附方向的情况等时,也能够灵活地应对。并且,由于通过摄像装置21来检测各向异性导电性膜片2Z上的粘接剂膜片5的位置,因此,即使将各向异性导电性膜2切断为多个各向异性导电性膜片2Z,也能够提高粘接剂膜片5相对于粘接面的位置精度。
[变形例3]
上述实施方式中,作为将本发明涉及的导电性膜应用于具有各向异性导电性的各向异性导电性膜的实施方式进行了说明,但本发明涉及的导电性膜并不限定于具有各向异性导电性的各向异性导电性膜。即,粘接剂膜片和粘接剂膜层只要具有导电性即可,也可以不在粘接剂中分散有导电粒子。作为此时的粘接剂膜片和粘接剂膜层,可列举包含氧化铟锡(Indium-Tin-Oxide:ITO)、氧化铟、氧化锡等金属氧化物、导电性纤维的粘接剂膜片和粘接剂膜层等。作为该导电性纤维,例如可列举:金、银、铂等金属纤维,以及碳纳米管等碳纤维。
符号说明
1:卷绕体,2(2A、2B1、2B2、2B3、2C1、2C2、2C3、2D、2E、2F1、2F2、2F3、2G1、2G2、2G3、2H):各向异性导电性膜(导电性膜),2Z:各向异性导电性膜片(导电性膜片),3:卷芯,3a:芯材,3b:侧板,4:剥离膜,5:粘接剂膜片,5A:粘接剂膜片层,5A1:内侧部分,5A2:空白部分,5B:轮廓线,6:粘接剂,7:导电粒子,8:第二剥离膜片,8A:第二剥离膜,8A1:内侧部分,8A2:空白部分,10:连接结构体,11:第一电路构件,11a:第一粘接面,12:第二电路构件,12a:第二粘接面,21:摄像装置,X:长边方向,Y:宽度方向,Z:厚度方向。
Claims (26)
1.一种导电性膜,其具备:长条的剥离膜;以及设置于所述剥离膜上的具有导电性的多个粘接剂膜片,
所述多个粘接剂膜片沿着所述剥离膜的长边方向排列。
2.根据权利要求1所述的导电性膜,所述多个粘接剂膜片在所述剥离膜的长边方向上分隔开。
3.根据权利要求1或2所述的导电性膜,所述多个粘接剂膜片呈相同形状。
4.根据权利要求1~3中任一项所述的导电性膜,所述多个粘接剂膜片配置于所述剥离膜的宽度方向上的中央部。
5.根据权利要求1~3中任一项所述的导电性膜,所述多个粘接剂膜片配置于所述剥离膜的宽度方向上的端部。
6.根据权利要求1~5中任一项所述的导电性膜,所述多个粘接剂膜片也沿着所述剥离膜的宽度方向排列。
7.根据权利要求1~6中任一项所述的导电性膜,所述剥离膜的长边方向上的所述多个粘接剂膜片的间隔大于或等于0.1mm且小于或等于10mm。
8.根据权利要求1~7中任一项所述的导电性膜,所述剥离膜的宽度方向上的所述剥离膜的端缘与最接近所述端缘的所述粘接剂膜片的间隔大于或等于0.1mm且小于或等于10mm。
9.根据权利要求1~8中任一项所述的导电性膜,所述剥离膜具有透光性。
10.根据权利要求9所述的导电性膜,所述剥离膜的透过率大于或等于15%且小于或等于100%。
11.根据权利要求9或10所述的导电性膜,所述剥离膜的雾度值大于或等于3%且小于或等于100%。
12.根据权利要求1~11中任一项所述的导电性膜,其进一步具备设置于所述粘接剂膜片上的第二剥离膜片。
13.根据权利要求1~12中任一项所述的导电性膜,所述粘接剂膜片在粘接剂中分散有导电粒子。
14.一种卷绕体,其具备:权利要求1~13中任一项所述的导电性膜;以及卷绕有所述导电性膜的卷芯。
15.一种连接结构体,其具备:具有第一粘接面的第一电路构件;具有第二粘接面的第二电路构件;以及将所述第一粘接面与所述第二粘接面连接的权利要求1~13中任一项所述的粘接剂膜片。
16.一种连接结构体的制造方法,其具备:
膜制造工序,制造导电性膜,所述导电性膜在长条的剥离膜上设有具有导电性的多个粘接剂膜片,并且所述多个粘接剂膜片沿着所述剥离膜的长边方向排列;以及
连接工序,隔着所述导电性膜的所述粘接剂膜片将第一电路构件的第一粘接面与第二电路构件的第二粘接面连接。
17.根据权利要求16所述的连接结构体的制造方法,所述粘接剂膜片在粘接剂中分散有导电粒子。
18.根据权利要求16或17所述的连接结构体的制造方法,所述膜制造工序具有:
粘接剂膜层形成工序,在所述剥离膜上的整个面形成具有导电性的粘接剂膜层;
粘接剂膜层切断工序,沿着形成所述粘接剂膜片轮廓的轮廓线将所述粘接剂膜层切断;以及
空白剥离工序,沿着经切断的所述轮廓线,将所述粘接剂膜层中的成为所述粘接剂膜片以外的部分的空白部分从所述剥离膜剥离。
19.根据权利要求18所述的连接结构体的制造方法,所述粘接剂膜层在粘接剂中分散有导电粒子。
20.根据权利要求16~19中任一项所述的连接结构体的制造方法,所述连接工序具有:
位置检测工序,通过摄像装置来检测所述导电性膜上的所述粘接剂膜片的位置;
贴附工序,基于通过所述位置检测工序所检测出的位置,将所述粘接剂膜片贴附于所述第一粘接面;以及
重合工序,隔着所述粘接剂膜片将所述第一粘接面与所述第二粘接面重合。
21.根据权利要求16或17所述的连接结构体的制造方法,所述膜制造工序制造在所述粘接剂膜片上设置有第二剥离膜片的所述导电性膜。
22.根据权利要求21所述的连接结构体的制造方法,所述膜制造工序具有:
粘接剂膜层形成工序,在所述剥离膜上的整个面形成具有导电性的粘接剂膜层,进一步在所述粘接剂膜层上的整个面覆盖第二剥离膜;
粘接剂膜层切断工序,沿着形成所述粘接剂膜片轮廓的轮廓线将所述粘接剂膜层和所述第二剥离膜切断;以及
空白剥离工序,沿着经切断的所述轮廓线,将所述粘接剂膜层和所述第二剥离膜中的成为所述粘接剂膜片以外的部分的空白部分从所述剥离膜剥离。
23.根据权利要求22所述的连接结构体的制造方法,所述粘接剂膜层在粘接剂中分散有导电粒子。
24.根据权利要求21~23中任一项所述的连接结构体的制造方法,所述连接工序具有:
位置检测工序,通过摄像装置来检测所述导电性膜上的所述粘接剂膜片的位置;
贴附工序,基于通过所述位置检测工序所检测出的位置,将所述粘接剂膜片贴附于所述第一粘接面;
重合工序,隔着所述粘接剂膜片将所述第一粘接面与所述第二粘接面重合;以及
第二剥离膜片剥离工序,在所述贴附工序之前将所述第二剥离膜片从所述粘接剂膜片剥离。
25.根据权利要求20或24所述的连接结构体的制造方法,所述贴附工序中,在将所述粘接剂膜片贴附于所述第一粘接面后,将所述剥离膜从所述粘接剂膜片剥离。
26.根据权利要求20、24或25所述的连接结构体的制造方法,所述连接工序进一步具有膜切断工序:在所述位置检测工序之前,将所述导电性膜切断为在所述剥离膜上设置有一个或多个所述粘接剂膜片的多个导电性膜片,
所述位置检测工序中,通过所述摄像装置来检测所述导电性膜片上的所述粘接剂膜片的位置。
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