WO2016002336A1 - 異方導電性フィルム及び接続構造体 - Google Patents

異方導電性フィルム及び接続構造体 Download PDF

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Publication number
WO2016002336A1
WO2016002336A1 PCT/JP2015/063297 JP2015063297W WO2016002336A1 WO 2016002336 A1 WO2016002336 A1 WO 2016002336A1 JP 2015063297 W JP2015063297 W JP 2015063297W WO 2016002336 A1 WO2016002336 A1 WO 2016002336A1
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Prior art keywords
conductive film
anisotropic conductive
conductive particles
arrangement direction
particles
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PCT/JP2015/063297
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English (en)
French (fr)
Inventor
誠一郎 篠原
恭志 阿久津
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デクセリアルズ株式会社
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Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to CN201580036022.6A priority Critical patent/CN106663885B/zh
Priority to US15/316,649 priority patent/US10121756B2/en
Priority to KR1020167035431A priority patent/KR102379812B1/ko
Publication of WO2016002336A1 publication Critical patent/WO2016002336A1/ja

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    • H—ELECTRICITY
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83885—Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/83855 - H01L2224/8388, e.g. for hybrid thermoplastic-thermosetting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present invention relates to an anisotropic conductive film, a connection method using the anisotropic conductive film, and a connection structure connected by the anisotropic conductive film.
  • Anisotropic conductive films are widely used when electronic parts such as IC chips are mounted on a substrate.
  • electronic parts such as IC chips are mounted on a substrate.
  • insulating adhesives for anisotropic conductive films are used.
  • a technique for evenly arranging conductive particles in a matrix in a layer is known.
  • connection resistance varies even if the conductive particles are evenly arranged. This is because the conductive particles located on the edge of the terminal flow out into the space due to melting of the insulating adhesive and are not easily sandwiched between the upper and lower terminals.
  • the conductive particles are arranged in a grid, the first arrangement direction of the conductive particles is the longitudinal direction of the anisotropic conductive film, and the second arrangement direction intersecting the first arrangement direction is It has been proposed to incline at 5 ° or more and 15 ° or less with respect to the direction orthogonal to the longitudinal direction of the anisotropic conductive film (Patent Document 1).
  • an object of the present invention is to make it possible to easily inspect the dispersion state of conductive particles in an anisotropic conductive film even in an anisotropic conductive film in which conductive particles are dispersed at a high density.
  • the inventor has a linear shape in which the conductive particles are not present in a plan view even when the conductive particles are dispersed in a lattice shape in the insulating adhesive layer or randomly.
  • the line was observed, it was found that the dispersed state of the conductive particles could be easily inspected using the line, and the present invention was completed.
  • the present invention is an anisotropic conductive film comprising an insulating adhesive layer and conductive particles dispersed in the insulating adhesive layer, Provided is an anisotropic conductive film in which straight lines (hereinafter referred to as vanishing lines) having no conductive particles in plan view exist at predetermined intervals.
  • straight lines hereinafter referred to as vanishing lines
  • the conductive particles are arranged in a lattice pattern by arranging them in the first arrangement direction and the second arrangement direction, and the vanishing lines are arranged in the first arrangement direction or Provided is an aspect that is inclined with respect to the second arrangement direction, and using the anisotropic conductive film of this aspect, the connection terminal of the first electronic component and the connection terminal of the second electronic component are anisotropically conductive.
  • a connection method for connecting, wherein a direction substantially orthogonal to the first arrangement direction or the second arrangement direction of the anisotropic conductive film is aligned with the longitudinal direction of the connection terminals of the first electronic component or the second electronic component I will provide a.
  • substantially orthogonal includes not only a direction strictly orthogonal to the first arrangement direction but also a range of deviation caused when an electronic component is mounted using an anisotropic conductive film. Usually, ⁇ 3 ° is included with respect to the direction orthogonal to the first arrangement direction.
  • connection structure in which the connection terminals of the first electronic component and the connection terminals of the second electronic component are anisotropically conductively connected using the anisotropic conductive film described above.
  • the anisotropic conductive film of the present invention since it has vanishing lines, the visual field can be scanned based on the vanishing lines when the anisotropic conductive film is inspected for alignment by visual inspection or image inspection. Therefore, it becomes easy to inspect the whole. In addition, by scanning the field of view with reference to the vanishing line, it becomes easy to specify the position of the occurrence of the defect. Therefore, it is easy to reduce the oversight of defects such as aggregation and missing of conductive particles in the anisotropic conductive film, and to maintain high quality of the anisotropic conductive film.
  • the area occupied by the conductive particles in the field of view becomes sparse due to the disappearance line, it becomes easy to perform macroscopic observation. That is, even when the conductive particles are evenly dispersed, for example, by arranging them in a lattice pattern, the presence of vanishing lines makes it easy to grasp the conductive particles as a group of particles, so the regularity of forming the group is good. Can be easily grasped. Therefore, it is possible to reduce oversight of problems such as aggregation or loss of conductive particles, whether the number density of the conductive particles is low or high.
  • the regularity of the region where the conductive particles do not exist can be known in advance, so that the state of trapping the conductive particles in the bumps can be determined. It becomes easy to grasp.
  • FIG. 1 is a top view of anisotropic conductive film 1A of an example.
  • FIG. 2 is a layout diagram of conductive particles in the anisotropic conductive film 1A of the example.
  • FIG. 3 is a layout diagram of conductive particles in the anisotropic conductive film 1B of the example.
  • FIG. 4 is a layout diagram of conductive particles in the anisotropic conductive film 1C of the example.
  • FIG. 5 is a layout diagram of conductive particles in the anisotropic conductive film 1D of the example.
  • FIG. 6A is an arrangement view of conductive particles in the anisotropic conductive film 1E of the example.
  • FIG. 6B is a layout diagram of conductive particles in the anisotropic conductive film 1E ′ of the example.
  • FIG. 7 is a layout diagram of conductive particles in the anisotropic conductive film 1F of the example.
  • FIG. 8 is a layout diagram of conductive particles in the anisotropic conductive film 1G of
  • FIG. 1 is a plan view of an anisotropic conductive film 1A according to an embodiment of the present invention
  • FIG. 2 is an arrangement view of conductive particles in the anisotropic conductive film 1A.
  • This anisotropic conductive film 1A has an insulating adhesive layer 2 and conductive particles 3 fixed to the insulating adhesive layer 2 in a grid-like arrangement. More specifically, this anisotropic conductive film 1A is obtained by slitting a long anisotropic conductive film in a strip shape, and the conductive particles 3 are in the longitudinal direction of the anisotropic conductive film 1A formed in a strip shape.
  • D1 is arranged at a pitch P1 in the first arrangement direction L1 parallel to D1, and parallel to the width direction D2 of the anisotropic conductive film 1A perpendicular to the longitudinal direction D1 of the anisotropic conductive film 1A, that is, the first Arranged at a pitch P2 in a second arrangement direction L2 orthogonal to the arrangement direction L1, a four-way lattice is formed.
  • vanishing lines L3 formed by the absence of the conductive particles 3 at lattice points on a line inclined with respect to the first arrangement direction L1 or the second arrangement direction L2 of the conductive particles 3. Is inclined at an inclination angle ⁇ with respect to the first arrangement direction L1, or at an inclination angle ⁇ with respect to the second arrangement direction L2.
  • the vanishing lines L3 are preferably formed in parallel at a predetermined interval.
  • the disappearance line L3 exists in the anisotropic conductive film 1A, when the alignment state of the conductive particles 3 of the anisotropic conductive film 1A is inspected by visual inspection or image inspection, as shown in FIG. It is possible to set the visual field 10 with the line L3 as a diagonal line and scan the visual field 10 so as to maintain a predetermined angle with the vanishing line L3 while examining the number and arrangement of the conductive particles 3 in the visual field 10. Therefore, it becomes easy to completely scan the entire surface of the anisotropic conductive film 1A in the visual field 10.
  • the disappearance line L3 makes it easy to maintain high quality of the anisotropic conductive film 1A, shortens the time required for product inspection, and improves product productivity.
  • the short direction of the connection terminal 4 is arranged along the longitudinal direction D1 of the anisotropic conductive film 1A.
  • the inclination angle ⁇ of the vanishing line L3 For example, a glass substrate and a flexible printed wiring board for a television display
  • the size of the connection surface of the connection terminal 4 is 8 to 200 ⁇ m in width and 1500 ⁇ m or less in length, as in the case of FOG (Film on ⁇ Glass) joining (FPC: Flexible Printed Circuits) ⁇ is preferably 15 to 75 °.
  • the vanishing line passes through the diagonal of the unit cell 5 of the basic arrangement of the conductive particles 3 (that is, the arrangement when the vanishing line L3 is not present).
  • the inclination angle ⁇ can be adjusted by the size of the pitch P1 in the first arrangement direction L1 of the conductive particles 3 and the pitch P2 in the second arrangement direction L2.
  • the pitch P1 in the first arrangement direction L1 is set to be the same as that in the second arrangement direction L2 in that the inclination angle ⁇ is smaller than the angle ⁇ formed by the width direction L2 of the anisotropic conductive film 1A and the vanishing line L3. Make it longer than the pitch.
  • the vanishing line passes through the diagonals of the two unit cells 5 connected in the first arrangement direction L1 as in the anisotropic conductive film 1C shown in FIG. L3 may be formed.
  • the basic arrangement of the conductive particles 3 and the direction of the vanishing line L3 are not particularly limited.
  • the second arrangement direction L2 may be inclined with respect to the first arrangement direction L1 of the conductive particles 3 like an anisotropic conductive film 1D shown in FIG.
  • the angle ⁇ between the second arrangement direction L2 and the first arrangement direction L1 is preferably 15 to 75 °, more preferably 18 to 72 °, and still more preferably 20 to 70 °.
  • the basic arrangement of the conductive particles 3 is a hexagonal lattice, and the disappearance is inclined with respect to the first arrangement direction L1.
  • the line L3 may be provided.
  • the arrangement direction as the basis of the conductive particles 3 can be any direction with respect to the longitudinal direction D1 of the anisotropic conductive film.
  • FIG. 1 shows a case where rectangular connection terminals (bumps) are anisotropically conductively connected by the anisotropic conductive film 1D by inclining the second arrangement direction L2 with respect to the first arrangement direction L1.
  • the connection terminal 4 when the longitudinal direction of the rectangular connection terminal 4 is aligned with the direction perpendicular to the first arrangement direction L1 (that is, when the short direction of the connection terminal 4 is aligned with the first arrangement direction L1), the connection terminal 4, the number of conductive particles that can flow into the insulating resin during anisotropic conductive connection and cannot contribute to the connection can be reduced. Therefore, the rectangular region used for the anisotropic conductive connection can be different. A sufficient number of conductive particles 3 contributing to conduction can be ensured wherever the film surface of the directionally conductive film 1A is taken.
  • the vanishing line L3 may be formed in parallel with the first arrangement direction L1 of the conductive particles 3, and similarly, the second arrangement direction of the conductive particles 3 is used. You may form in parallel with L2. From the point of improving the trapping property of the conductive particles in the bumps and the point of facilitating confirmation of the supplemental state in the bumps of the conductive particles after the anisotropic conductive connection, the vanishing lines L3 are arranged in the first arrangement direction of the conductive particles 3.
  • the vanishing line L3 is formed from the first arrangement direction L1 or the second arrangement in that the yield is improved by easy inspection during film production. It is preferable to be parallel to the arrangement direction L2.
  • the vanishing line L3 may be observed as a line-shaped region in which the conductive particles 3 are not present in the randomly dispersed conductive particles 3. .
  • the anisotropic conductive film of the present invention is not particularly limited with respect to the configuration of the conductive particles 3 itself, the layer configuration of the insulating adhesive layer 2 and the constituent resin, and can take various forms.
  • the conductive particles 3 can be appropriately selected from those used for known anisotropic conductive films. Examples thereof include metal particles such as nickel, cobalt, silver, copper, gold, and palladium, and metal-coated resin particles. Two or more kinds can be used in combination.
  • the particle diameter of the conductive particles 3 is preferably 1 to 50 ⁇ m, more preferably 1 to 20 ⁇ m, from the viewpoint of short circuit prevention and stability of interelectrode bonding.
  • the pitch of the conductive particles 3 in the first arrangement direction L1 and the pitch in the second arrangement direction L2 are preferably 0.5 to 128 times the particle diameter of the conductive particles 3, respectively. It is preferably 0.8 to 64 times, more preferably 1.2 to 32 times. If these pitches are too short, short-circuiting is likely to occur when the terminals are connected using an anisotropic conductive film. Conversely, if the pitches are too long, the number of conductive particles captured between the terminals will be insufficient.
  • the density of the conductive particles 3 is preferably 100 to 100,000 / mm 2 , more preferably 200 to 80,000 / mm 2 , particularly 300 to 50,000 / mm 2 . This particle density is appropriately adjusted according to the particle diameter and arrangement direction of the conductive particles 3.
  • an insulating resin layer used in a known anisotropic conductive film can be appropriately employed.
  • a cationic polymerization type resin layer, a thermal anion polymerization type resin layer containing an epoxy compound and a thermal anion polymerization initiator, or the like can be used.
  • these resin layers can be polymerized as necessary.
  • the insulating adhesive layer 2 may be formed from a plurality of resin layers.
  • a mold having a dent corresponding to the arrangement of the conductive particles 3 is produced by a known method such as machining, laser processing, or photolithography.
  • the conductive particles are put into a mold, and the composition for forming an insulating adhesive layer is filled on the mold, and cured to fix the conductive particles, and then removed from the mold.
  • the mold may be made of a material having low rigidity.
  • mold which has a dent corresponding to arrangement
  • a member in which through holes are formed in a predetermined arrangement is provided on the insulating adhesive layer forming composition layer.
  • the conductive particles 3 may be supplied and passed through the through holes.
  • connection terminals of the first electronic component and the connection terminals of the second electronic component such as a flexible substrate and a glass substrate are anisotropically conductively connected, as shown in FIG. L1 or the second arrangement direction L2 is aligned with the longitudinal direction D1 of the anisotropic conductive film, and the direction substantially perpendicular to the first arrangement direction L1 or the second arrangement direction L2 is the first electronic component or the second electronic component.
  • acquisition number of the electrically-conductive particle 3 in the connection terminal 4 can fully be raised.
  • the confirmation of the arrangement of the conductive particles in the connection structure of the first electronic component and the second electronic component thus anisotropically connected can be easily performed using the vanishing line as a guide.
  • the present invention also includes such a connection structure.
  • Examples 1-6, Comparative Examples 1-3 As shown in Table 1, in Examples 1 to 6 and Comparative Examples 2 and 3, anisotropic conductive films having conductive particles arranged as shown in FIG. 2 (4-way lattice) or FIG. It produced using the electroconductive particle shown in 1 and resin. In this case, the pitch P1 in the first arrangement direction L1 and the pitch P2 in the second arrangement direction L2 of the conductive particles were set to the sizes shown in Table 1. In Comparative Example 1, the arrangement of the conductive particles was random.
  • a mixed solution of an insulating resin containing a thermoplastic resin, a thermosetting resin, and a latent curing agent with the composition shown in Table 1 is prepared and applied to a PET film having a film thickness of 50 ⁇ m. And dried in an oven at 80 ° C. for 5 minutes to form an adhesive layer having a thickness of 20 ⁇ m on the PET film.
  • the number coincidence rate is preferably B evaluation or more.

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Abstract

　異方導電性フィルムにおける導電粒子の分散状態を、導電粒子が高密度に分散していても容易に検査できるようにするために、絶縁接着剤層（２）と該絶縁接着剤層（２）に分散した導電粒子（３）とを含む異方導電性フィルム（１Ａ）の平面視において、導電粒子（３）の存在しない直線状のライン（消失線（Ｌ３））が所定間隔で存在するようにする。具体的には、導電粒子を、第１の配列方向と第２の配列方向に配列することにより格子状に配置し、消失線を第１の配列方向又は第２の配列方向に対して傾斜させる。

Description

異方導電性フィルム及び接続構造体
　本発明は、異方導電性フィルム、異方導電性フィルムを用いる接続方法、及び異方導電性フィルムで接続された接続構造体に関する。
　異方導電性フィルムは、ＩＣチップ等の電子部品を基板に実装する際に広く使用されている。近年では、携帯電話、ノートパソコン等の小型電子機器において配線の高密度化が求められており、この高密度化に異方導電性フィルムを対応させる手法として、異方導電性フィルムの絶縁接着剤層に導電粒子をマトリクス状に均等配置する技術が知られている。
　しかしながら、導電粒子を均等配置しても接続抵抗がばらつくという問題が生じる。これは、端子の縁辺上に位置した導電粒子が絶縁性接着剤の溶融によりスペースに流れ出て、上下の端子で挟まれにくいためである。
　この問題に対しては、導電粒子を格子状に配列し、導電粒子の第１の配列方向を異方導電性フィルムの長手方向とし、第１の配列方向に交差する第２の配列方向を、異方導電性フィルムの長手方向に直交する方向に対して５°以上１５°以下で傾斜させることが提案されている（特許文献１）。
特許４８８７７００号公報
　しかしながら、異方導電性フィルムで接続する電子部品のバンプサイズが小さくなり、格子状に配列させた導電粒子の密度（単位面積当たりの導電粒子の個数）が高まると、導電粒子の配列状態の検査に手間が掛かり、検査精度も低下するという問題があった。
　そこで、本発明は、異方導電性フィルムにおける導電粒子の分散状態の検査を、導電粒子を高密度に分散させた異方導電性フィルムにおいても容易に行えるようにすることを課題とする。
　本発明者は、異方導電性フィルムにおいて、絶縁接着剤層に導電粒子が格子状に分散している場合でも、ランダムに分散している場合でも、平面視において導電粒子が存在しない直線状のラインが観察されるようにすると、そのラインを用いて導電粒子の分散状態を容易に検査できることを見出し、本発明を完成させた。
　即ち、本発明は、絶縁接着剤層と、該絶縁接着剤層に分散した導電粒子を含む異方導電性フィルムであって、
平面視において導電粒子の存在しない直線状のライン（以下、消失線という）が所定間隔で存在する異方導電性フィルムを提供する。
　特に、上述の異方導電性フィルムのうち、導電粒子が、第１の配列方向と第２の配列方向に配列することにより格子状に配置されており、消失線が、第１の配列方向又は第２の配列方向に対して傾斜している態様を提供し、またこの態様の異方導電性フィルムを用いて、第１電子部品の接続端子と第２電子部品の接続端子を異方導電性接続する接続方法であって、異方導電性フィルムの第１の配列方向又は第２の配列方向に略直交する方向を第１電子部品又は第２電子部品の接続端子の長手方向に合わせる接続方法を提供する。
　ここで、略直交するとは、第１配列方向に厳密に直交する方向だけでなく、異方導電性フィルムを用いて電子部品を実装する際に生じるずれの範囲を含む。通常、第１配列方向に直交する方向に対して、±３°が含まれる。
　加えて、本発明は、上述の異方導電性フィルムを用いて第１電子部品の接続端子と第２電子部品の接続端子が異方導電性接続されている接続構造体を提供する。
　本発明の異方導電性フィルムによれば、消失線を有するので、異方導電性フィルムを目視又は画像検査で配列状態を検査する際に、消失線を基準にして視野を走査することができるので、全体をもれなく検査することが容易になる。また、消失線を基準にして視野を走査することにより不具合の発生箇所の位置の特定が容易となる。そのため、異方導電性フィルムにおける導電粒子の凝集や欠落などの不具合の見落としを低減し、異方導電性フィルムの品質を高く維持することが容易となる。
　また、消失線を有することにより面視野における導電粒子の占有面積が疎になるため、巨視的な観察を行い易くなる。即ち、導電粒子が格子状に配列するなどにより均等に分散している場合でも、消失線が存在することにより導電粒子を粒子の集合体群として捉え易くなるので、群を形成する規則性の良否を簡便に把握することが可能となる。したがって、導電粒子の個数密度が低い場合でも高い場合でも、導電粒子の凝集や欠落などの不具合の見落としを低減することができる。
　さらに、本発明の異方導電性フィルムによれば、それを用いた異方導電性接続後においても、導電粒子の存在しない領域の規則性があらかじめ分かることから、バンプにおける導電粒子の捕捉状態が把握しやすくなる。
図１は、実施例の異方導電性フィルム１Ａの平面図である。 図２は、実施例の異方導電性フィルム１Ａにおける導電粒子の配置図である。 図３は、実施例の異方導電性フィルム１Ｂにおける導電粒子の配置図である。 図４は、実施例の異方導電性フィルム１Ｃにおける導電粒子の配置図である。 図５は、実施例の異方導電性フィルム１Ｄにおける導電粒子の配置図である。 図６Ａは、実施例の異方導電性フィルム１Ｅにおける導電粒子の配置図である。 図６Ｂは、実施例の異方導電性フィルム１Ｅ’における導電粒子の配置図である。 図７は、実施例の異方導電性フィルム１Ｆにおける導電粒子の配置図である。 図８は、実施例の異方導電性フィルム１Ｇにおける導電粒子の配置図である。
　以下、本発明を、図面を参照しつつ詳細に説明する。なお、各図中、同一符号は同一又は同等の構成要素を表している。
　図１は、本発明の一実施例の異方導電性フィルム１Ａの平面図、図２は、その異方導電性フィルム１Ａにおける導電粒子の配置図である。
　この異方導電性フィルム１Ａは、絶縁接着剤層２と、絶縁接着剤層２に格子状の配置で固定された導電粒子３を有する。より具体的には、この異方導電性フィルム１Ａは長尺の異方導電性フィルムを帯状にスリットしたものであり、導電粒子３は、帯状に形成された異方導電性フィルム１Ａの長手方向Ｄ１に平行な第１の配列方向Ｌ１にピッチＰ１で配列すると共に、異方導電性フィルム１Ａの長手方向Ｄ１と直交する異方導電性フィルム１Ａの幅方向Ｄ２に平行に、即ち、第１の配列方向Ｌ１と直交する第２の配列方向Ｌ２に、ピッチＰ２で配列し、４方格子を形成している。
　この異方導電性フィルム１Ａでは、導電粒子３の第１の配列方向Ｌ１又は第２の配列方向Ｌ２に対して傾斜した線上の格子点に導電粒子３が存在しないことにより形成される消失線Ｌ３が、第１の配列方向Ｌ１に対して傾斜角αで傾斜し、あるいは第２の配列方向Ｌ２に対して傾斜角βで傾斜して形成されている。消失線Ｌ３は、所定間隔で平行に形成されていることが好ましい。
　異方導電性フィルム１Ａに消失線Ｌ３が存在することにより、目視検査又は画像検査で異方導電性フィルム１Ａの導電粒子３の配列状態を検査する場合に、図２に示したように、消失線Ｌ３を対角線とする視野１０を設定し、視野１０内の導電粒子３の個数及び配置を調べつつ、視野１０が消失線Ｌ３と所定角度を維持するように走査することができる。したがって、視野１０で異方導電性フィルム１Ａ上の全面をもれなく走査することが容易となる。
　さらに、目視検査では、視野１０において、消失線Ｌ３を対称の軸として、導電粒子３の配列の対称性を認識し易くなるので、導電粒子３の凝集や欠落などの不具合を発見することが容易となる。よって、消失線Ｌ３があることにより、異方導電性フィルム１Ａの品質を高く維持することが容易となり、また、製品検査に要する時間を短縮することが可能となり、製品の生産性が向上する。
　図１に示したように、一般に、電子機器の生産ラインにおける異方導電性接続では、接続端子４の短手方向が、異方導電性フィルム１Ａの長手方向Ｄ１に沿うように配置される。そのため、ファインピッチで形成された接続端子４を異方導電性接続するためには、消失線Ｌ３の傾斜角αを小さくすることが好ましく、例えば、テレビのディスプレイ用のガラス基板とフレキシブルプリント配線板（ＦＰＣ：Flexible Printed Circuits）とを接合するＦＯＧ（Film on Glass）接合を行う場合のように、接続端子４の接続面の大きさが、幅８～２００μｍ、長さ１５００μｍ以下のとき、傾斜角αを１５～７５°とすることが好ましい。
　傾斜角αの調整方法としては、図２に示したように、導電粒子３の基本となる配列（即ち、消失線Ｌ３が無い場合の配列）の単位格子５の対角を通るように消失線Ｌ３を形成する場合に、傾斜角αは、導電粒子３の第１の配列方向Ｌ１のピッチＰ１と、第２の配列方向Ｌ２のピッチＰ２の大きさにより調整することができる。例えば、傾斜角αを、異方導電性フィルム１Ａの幅方向Ｌ２と消失線Ｌ３とがなす角βよりも小さくする点から、第１の配列方向Ｌ１のピッチＰ１を第２の配列方向Ｌ２のピッチよりも長くする。
　また、傾斜角αを小さくする場合に、図４に示す異方導電性フィルム１Ｃのように、第１の配列方向Ｌ１につながった２個分の単位格子５の対角を通るように消失線Ｌ３を形成してもよい。
　本発明において、導電粒子３の基本となる配列や消失線Ｌ３の方向には特に制限がない。例えば、図５に示す異方導電性フィルム１Ｄのように、導電粒子３の第１の配列方向Ｌ１に対して第２の配列方向Ｌ２を傾斜させさせても良い。この場合、第２の配列方向Ｌ２が第１の配列方向Ｌ１となす角γを１５～７５°、より好ましくは１８～７２°、更により好ましくは２０～７０°とすることが好ましい。
　この場合、図６Ａ、図６Ｂに示す異方導電性フィルム１Ｅ、１Ｅ’のように、導電粒子３の基本となる配列を６方格子とし、その第１の配列方向Ｌ１に対して傾斜した消失線Ｌ３を設けてもよい。導電粒子３の基本となる配列方向は、異方導電性フィルムの長手方向Ｄ１に対して任意の方向をとることができる。
　第２の配列方向Ｌ２を第１の配列方向Ｌ１に対して傾斜させることにより、異方導電性フィルム１Ｄで矩形の接続端子（バンプ）を異方導電性接続する場合に、図１に示したように、矩形の接続端子４の長手方向を、第１の配列方向Ｌ１に直交する方向に合わせると（即ち、接続端子４の短手方向と第１の配列方向Ｌ１を合わせると）、接続端子４の縁部に位置することにより異方導電性接続時に絶縁性樹脂に流され、接続に寄与できない導電粒子の数を低減させることができるので、異方導電性接続に使用する矩形領域を異方導電性フィルム１Ａのフィルム面内のどこで採っても、導通に寄与する導電粒子３を十分な個数で確保することができる。
　図７に示す異方導電性フィルム１Ｆのように、消失線Ｌ３を、導電粒子３の第１の配列方向Ｌ１と平行に形成してもよく、同様に、導電粒子３の第２の配列方向Ｌ２と平行に形成してもよい。導電粒子のバンプにおける捕捉性を向上させる点、及び異方導電性接続後の導電粒子のバンプにおける補足状態を確認し易くする点からは、消失線Ｌ３を、導電粒子３の第１の配列方向Ｌ１又は第２の配列方向Ｌ２に対して斜めに形成することが好ましく、フィルムの製造時に検査がし易いことにより歩留まりが向上する点からは消失線Ｌ３を第１の配列方向Ｌ１又は第２の配列方向Ｌ２と平行に成することが好ましい。
　図８に示す異方導電性フィルム１Ｇのように、ランダムに分散している導電粒子３の中に、導電粒子３が存在しないライン状の領域として消失線Ｌ３が観察されるようにしてもよい。
　本発明の異方導電性フィルムは、導電粒子３自体の構成、絶縁接着剤層２の層構成及び構成樹脂については、特に制限はなく、種々の態様をとることができる。
　例えば、導電粒子３としては、公知の異方導電性フィルムに用いられているものの中から適宜選択して使用することができる。例えば、ニッケル、コバルト、銀、銅、金、パラジウムなどの金属粒子、金属被覆樹脂粒子などが挙げられる。２種以上を併用することもできる。
　導電粒子３の粒子径は、短絡防止と電極間接合の安定性の点から、好ましくは１～５０μｍ、より好ましくは１～２０μｍである。
　導電粒子３を格子状に配列する場合、導電粒子３の第１の配列方向Ｌ１のピッチと第２の配列方向Ｌ２のピッチは、それぞれ好ましくは導電粒子３の粒子径の０．５～１２８倍であり、好ましくは０．８～６４倍、より好ましくは１．２～３２倍である。これらのピッチが、短すぎると異方導電性フィルムを用いて端子間を接続した場合に、短絡が生じ易くなり、反対に長すぎると端子間に捕捉される導電粒子数が不十分となる。
　導電粒子３の密度は、好ましくは１００～１０００００個／ｍｍ2、より好ましくは２００～８００００個／ｍｍ2、特に３００～５００００個／ｍｍ2である。この粒子密度は、導電粒子３の粒子径と配列方向によって適宜調整される。
　一方、絶縁接着剤層２としては、公知の異方導電性フィルムで使用される絶縁性樹脂層を適宜採用することができる。例えば、アクリレート化合物と光ラジカル重合開始剤とを含む光ラジカル重合型樹脂層、アクリレート化合物と熱ラジカル重合開始剤とを含む熱ラジカル重合型樹脂層、エポキシ化合物と熱カチオン重合開始剤とを含む熱カチオン重合型樹脂層、エポキシ化合物と熱アニオン重合開始剤とを含む熱アニオン重合型樹脂層等を使用することができる。また、これらの樹脂層は、必要に応じて、それぞれ重合したものとすることができる。また、絶縁接着剤層２を、複数の樹脂層から形成してもよい。
　絶縁接着剤層２に導電粒子３を上述の配置で固定する方法としては、導電粒子３の配置に対応した凹みを有する型を機械加工やレーザー加工、フォトリソグラフィなど公知の方法で作製し、その型に導電粒子を入れ、その上に絶縁接着剤層形成用組成物を充填し、硬化させて導電粒子を固定し、型から取り出せばよい。剛性の低い材質で型を作成しても良い。
　あるいは、消失線Ｌ３が無い場合の導電粒子３の配置に対応した凹みを有する型を作製し、その型の表面に、消失線Ｌ３に対応するテープを貼って消失線Ｌ３に対応する部分の凹みを塞ぎ、次いでその型に導電粒子３を型に入れ、上述と同様に絶縁接着剤層形成用組成物を用いて導電粒子３を絶縁性接着剤層に固定してもよい。
　また、絶縁接着剤層２に導電粒子３を上述の配置におくために、絶縁接着剤層形成組成物層の上に、貫通孔が所定の配置で形成されている部材を設け、その上から導電粒子３を供給し、貫通孔を通過させてもよい。
　また、貫通孔を有する部材を使用し、その貫通孔に導電粒子３を通して導電粒子を配置する場合に、貫通孔を有する部材として、消失線Ｌ３が無い場合の導電粒子３の配置に対応した貫通孔を有するものを作製し、その部材の貫通孔を、消失線Ｌ３に対応するテープで塞ぎ、その上から導電粒子３を供給してもよい。
　本発明のうち、導電粒子が格子状に配列し、消失線が第１の配列方向又は第２の配列方向に対して傾斜している異方導電性フィルムを用いて、ＩＣチップ、ＩＣモジュールなどの第１電子部品の接続端子と、フレキシブル基板、ガラス基板などの第２電子部品の接続端子を異方導電性接続する場合、図１に示したように、導電粒子３の第１の配列方向Ｌ１又は第２の配列方向Ｌ２を異方導電性フィルムの長手方向Ｄ１に合わせ、第１の配列方向Ｌ１又は第２の配列方向Ｌ２に略直交する方向を第１電子部品又は第２電子部品の接続端子４の長手方向に合わせる。これにより、接続端子４における導電粒子３の捕捉数を十分に高めることができる。
　本発明によれば、こうして異方導電性接続した第１電子部品と第２電子部品の接続構造体における導電粒子の配置の確認も消失線を目安に容易に行うことができる。本発明は、かかる接続構造体も包含する。
　以下、実施例に基づき、本発明を具体的に説明する。
　実施例１～６、比較例１～３
　表１に示すように、実施例１～６及び比較例２、３では、導電粒子が図２（４方向格子）又は図６Ａ（６方格子）に示す配置の異方導電性フィルムを、表１に示す導電粒子と樹脂を使用して作製した。この場合、導電粒子の第１の配列方向Ｌ１のピッチＰ１と第２の配列方向Ｌ２のピッチＰ２を表１に示す大きさとした。
　比較例１においては、導電粒子の配置をランダムとした。
　より具体的には、表１に示す組成で熱可塑性樹脂、熱硬化性樹脂及び潜在性硬化剤を含む絶縁性樹脂の混合溶液を調製し、それを、フィルム厚さ５０μｍのＰＥＴフィルム上に塗布し、８０℃のオーブンにて５分間乾燥させ、ＰＥＴフィルム上に厚み２０μｍの粘着層を形成した。
　一方、表１に示す導電粒子の配列に対応する凸部のパターンを有する金型を作成し、公知の透明性樹脂のペレットを溶融させた状態で該金型に流し込み、冷やして固めることで、凹部が表１に示す配列パターンの樹脂型を形成した。この樹脂型の凹部に導電粒子を充填し、その上に上述の絶縁性樹脂の粘着層を被せ、紫外線硬化により該絶縁性樹脂に含まれる熱硬化性樹脂を硬化させた。そして、型から絶縁性樹脂を剥離し、各実施例及び比較例の異方導電性フィルムを製造した。
　なお、比較例１では導電粒子を、低沸点溶媒に分散し噴霧してランダムに同一平面上に配置した。
　評価
　次の（ａ）～（ｅ）の評価を行った。
（ａ）消失線の有無
　各実施例及び比較例の異方導電性フィルムにおいて、任意の導電粒子を選択し、それを基点として第１の配列方向及び第２の配列方向にそれぞれ５００×５００μｍの領域を設定し顕微鏡観察（倍率：１００倍）により、所期の消失線上の格子点で導電粒子が欠落しているか否かを検査した。さらにこの領域が重複しない部分で、同様の検査を１０回繰り返した。なお、観察領域の設定において、所定面積の領域を設定することに代えて、所定数の導電粒子が存在する領域（例えば、３０個×３０個）を設定してもよい。
　この観察結果において、消失線上の格子点に存在する導電粒子の数と消失線上の格子点の数との割合が５％以下のものを消失線有り、それ以外を消失線無しと評価した。結果を表１に示す。
（ｂ）連結粒子の有無
　（ａ）と同様にして各実施例及び比較例の異方導電性フィルムを観察し、２個以上の導電粒子が連結しているものが有るか否かを検査した。
　この観察結果において、２個以上の導電粒子が連結して存在する部分の個数と、連結粒子が無い場合の設計粒子数との割合が５％以下のものを２個以上の連結粒子無し、それ以外のものを２個以上の連結粒子有りと評価した。その結果、比較例１では２個以上の連結粒子が有りと評価されたが、他は無しと評価された。なお、２個連結粒子の粒子数が、全粒子数の５％以下であれば実用上問題は無い。
（ｃ）個数一致率
　消失線を含む５００×５００μｍの領域に含まれる導電粒子の個数を、顕微鏡を用いた目視観察によりカウントした、次に、同じ領域に含まれる導電粒子の個数を、画像処理機（ＷｉｎＲｏｏｆ：三谷商事社製）を用いてカウントし、次式により個数一致率を算出した。
　個数一致率（％）＝１００－（│Ｎ１－Ｎ２│／Ｎ１）×１００
（但し、Ｎ１：目視観察によりカウントした導電粒子の個数
　　　　Ｎ２：画像処理機によりカウントした導電粒子の個数）
　個数一致率の数値に応じて、次の基準で評価した。結果を表１に示す。
Ａ：個数一致率が９７％以上
Ｂ：個数一致率が９２％以上～９７％未満
Ｃ：個数一致率が８５％以上９２％未満
Ｄ：個数一致率が８５％未満
　実用上、個数一致率は、Ｂ評価以上であることが好ましい。
（ｄ）初期導通抵抗
　各実施例及び比較例の異方導電性フィルムを、初期導通および導通信頼性の評価用ＦＰＣとガラス基板の間に挟み、加熱加圧（１８０℃、３ＭＰａ、５秒）して各評価用接続物を得、この評価用接続物の導通抵抗を測定した。結果を表１に示す。
　ここで、この評価用ＦＰＣとガラス基板は、それらの端子パターンが対応しており、サイズは次の通りである。
　評価用ＦＰＣ
　ポリイミド基材（厚み２５μｍ）
　配線仕様：Ｃｕ配線（高さ１８μｍ）、Ａｕメッキ
　配線サイズ：幅２５μｍ×長さ１０００μｍ
　ガラス基板
　ガラス材質：コーニング社製
　外径：１５×７０ｍｍ
　厚み：０．５ｍｍ
　電極：ＩＴＯ配線　
（ｅ）導通信頼性
　初期導通抵抗の評価用ＦＰＣと各実施例及び比較例の異方導電性フィルムとの評価用接続物を温度８５℃、湿度８５％ＲＨの恒温槽に５００時間おいた後の導通抵抗を、初期導通抵抗と同様に測定した。結果を表１に示す。
　なお、この導通抵抗が５Ω以上であると、接続した電子部品の実用的な導通安定性の点から好ましくない。
Figure JPOXMLDOC01-appb-T000001
　表１から、導電粒子の配列に消失線が形成されていると、導電粒子の検査効率が向上することがわかる。
　比較例１では、粒子がランダムに存在しているため、画像処理機がノイズと判定し、検出成功率が著しく低くなったと推察される。
　１Ａ、１Ｂ、１Ｃ、１Ｄ、１Ｅ、１Ｅ’、１Ｆ、１Ｇ　異方導電性フィルム
　２　　絶縁接着剤層
　３　　導電粒子
　４　　接続端子
　５　　単位格子
１０　　視野
Ｄ１　　異方導電性フィルムの長手方向
Ｄ２　　異方導電性フィルムの幅方向
Ｌ１　　第１の配列方向
Ｌ２　　第２の配列方向
Ｌ３　　消失線
Ｐ１　　導電粒子の第１の配列方向のピッチ
Ｐ２　　導電粒子の第２の配列方向のピッチ
　α　　傾斜角
　β　　傾斜角
　γ　　第１の配列方向Ｌ１と第２の配列方向Ｌ２がなす角

Claims (11)

  1. 　絶縁接着剤層と、該絶縁接着剤層に分散した導電粒子を含む異方導電性フィルムであって、
    平面視において導電粒子の存在しない直線状のライン（以下、消失線という）が所定間隔で存在する異方導電性フィルム。
  2. 　導電粒子が、第１の配列方向と第２の配列方向に配列することにより格子状に配置され、消失線が、第１の配列方向又は第２の配列方向に対して傾斜している請求項１記載の異方導電性フィルム。
  3. 　異方導電性フィルムが帯状に形成されており、その長手方向に対して斜めに消失線が形成されている請求項１又は２記載の異方導電性フィルム。
  4. 　異方導電性フィルムの長手方向と消失線がなす角度が、異方導電性フィルムの幅方向と消失線のなす角度よりも小さい請求項３記載の異方導電性フィルム。
  5. 　導電粒子の第１の配列方向が異方導電性フィルムの長手方向と平行である請求項２～４のいずれかに記載の異方導電性フィルム。
  6. 　導電粒子の第１の配列方向と第２の配列方向が直交している請求項２～５のいずれかに記載の異方導電性フィルム。
  7. 　導電粒子の第１の配列方向と第２の配列方向が斜めに交わっている請求項２～５のいずれかに記載の異方導電性フィルム。
  8. 　導電粒子の密度が１００～１０００００個／ｍｍ2である請求項１～７のいずれかに記載の異方導電性フィルム。
  9. 　請求項２～８のいずれかに記載の異方導電性フィルムを用いて、第１電子部品の接続端子と第２電子部品の接続端子を異方導電性接続する接続方法であって、異方導電性フィルムの第１の配列方向又は第２の配列方向に略直交する方向を第１電子部品又は第２電子部品の接続端子の長手方向に合わせる接続方法。
  10. 　接続端子の接続面の大きさが、幅８～２００μｍ、長さ１５００μｍ以下である請求項９記載の接続方法。
  11. 　請求項１～８のいずれかに記載の異方導電性フィルムを用いて第１電子部品の接続端子と第２電子部品に接続端子が異方導電性接続されている接続構造体。
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