TW201606800A - 異向導電性膜及連接構造體 - Google Patents

異向導電性膜及連接構造體 Download PDF

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Publication number
TW201606800A
TW201606800A TW104120910A TW104120910A TW201606800A TW 201606800 A TW201606800 A TW 201606800A TW 104120910 A TW104120910 A TW 104120910A TW 104120910 A TW104120910 A TW 104120910A TW 201606800 A TW201606800 A TW 201606800A
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Prior art keywords
conductive film
conductive particles
anisotropic conductive
array direction
particles
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TW104120910A
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English (en)
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TWI659432B (zh
Inventor
Seiichiro Shinohara
Yasushi Akutsu
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Dexerials Corp
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Publication of TWI659432B publication Critical patent/TWI659432B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01—ELECTRIC ELEMENTS
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K2201/001—Conductive additives
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    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Abstract

為了使異向導電性膜之導電粒子的分散狀態即便導電粒子高密度地分散亦可容易地檢查，而設為如下情形：於含有絕緣接著劑2與分散於該絕緣接著劑2之導電粒子3的異向導電性膜1A之俯視中，導電粒子3不存在之直線狀的線(消失線3)以特定之間隔存在。具體而言，藉由將導電粒子排列於第1排列方向與第2排列方向而配置為格子狀，相對於第1排列方向或第2排列方向使消失線傾斜。

Description

異向導電性膜及連接構造體
本發明係有關於一種異向導電性膜、使用異向導電性膜之連接方法及藉由異向導電性膜連接之連接構造體。
異向導電性膜被廣泛地使用於將IC晶片等電子零件構裝於基板時。近年來，對於行動電話、筆記型個人電腦等小型電子機器要求配線的高密度化，作為使異向導電性膜因應此高密度化之手段，已知有將導電粒子矩陣狀地平均配置於異向導電性膜的絕緣接著劑層之技術。
然而，即便將導電粒子平均配置，亦產生連接電阻變動之問題。原因在於，位於端子之邊緣上的導電粒子因為絕緣性接著劑之熔融而流出至間隔，難以藉上下之端子夾持。
對於此問題，提出有將導電粒子排列成格子狀，將導電粒子之第1排列方向設為異向導電性膜之長邊方向，使交叉於第1排列方向之第2排列方向相對於與異向導電性膜之長邊方向正交的方向傾斜5°以上，15°以下(專利文獻1)。
[專利文獻1]日本專利4887700號公報
然而，若以異向導電性膜進行連接之電子零件的凸塊大小(bump size)變小，排列成格子狀之導電粒子的密度(每單位面積之導電粒子之個數)升高，則有導電粒子之排列狀態的檢查費時，檢查精度亦降低之問題。
因此，本發明之課題在於，即使是在高密度地分散有導電粒子之異向導電性膜中亦可容易地進行異向導電性膜中之導電粒子分散狀態之檢查。
本發明人發現如下情形而完成本發明：於異向導電性膜中，即便於導電粒子於絕緣接著劑層分散成格子狀之情形或隨機分散之情形時，若於俯視下觀察導電粒子不存在之直線狀的線，則使用此線可容易地檢查導電粒子之分散狀態。
即，本發明提供一種含有絕緣接著劑層與分散於該絕緣接著劑層的導電粒子之異向導電性膜，於俯視下，導電粒子不存在之直線狀的線(以下稱為消失線)以特定間隔存在。
尤其，上述異向導電性膜中，提供如下態樣：導電粒子藉由排列於第1排列方向與第2排列方向而被配置成格子狀，消失線相對於第1排列方向與第2排列方向而傾斜；又提供一種連接方法，該方法使用此態樣之異向導電性膜，將第1電子零件之連接端子與第2電子零件之連接端子進行異向導電性連接，其中，使異向導電性膜之大致正交於第1排列方向或第2排列方向的方向，對準於第1電子零件或第2電子零件之連接端子之長邊方向。
此處，所謂大致正交，不僅含有確實地正交於第1排列方向之方向，亦含有使用異向導電性膜而構裝電子零件時產生之偏移的範圍。一般而言，相對於正交於第1排列方向之方向，含有±3°。
此外，本發明提供一種連接構造體，其使用上述異向導電性膜而異向導電性連接有第1電子零件之連接端子與第2電子零件之連接端子。
根據本發明之異向導電性膜，由於具有消失線，故於將異向導電性膜藉目視或影像檢查來檢查排列狀態時，可將消失線作為基準而掃描視野，因此可輕易地不遺漏地檢查整體。又，藉由以消失線為基準掃描視野，輕易地特定出不良狀況之發生部位的位置。因此，可輕易地減少沒有注意到異向導電性膜中導電粒子之凝集或缺少等不良狀況的情形，高度地維持異向導電性膜之品質。
又，藉由具有消失線，於面視野中導電粒子之占有面積變得稀疏，故容易進行巨觀之觀察。即，即便於因導電粒子排列成格子狀等而平均分散之情形時，藉由存在消失線，變得易於將導電粒子作為粒子之集合體而掌握，故能夠簡便地瞭解形成群的規則性之好壞。因此，不論是導電粒子之個數密度低亦或高之情形時，皆可減少沒有注意到導電粒子之凝集或缺少等不良狀況的情形。
進而，藉由本發明之異向導電性膜，即便於使用其之異向導電性連接後，亦可預先知悉不存在導電粒子之區域的規則性，從而容易瞭解凸塊中之導電粒子之捕捉狀態。
1A、1B、1C、1D、1E、1E’、1F、1G‧‧‧異向導電性膜
2‧‧‧絕緣接著劑層
3‧‧‧導電粒子
4‧‧‧連接端子
5‧‧‧單位格子
10‧‧‧視野
D1‧‧‧異向導電性膜之長邊方向
D2‧‧‧異向導電性膜之寬邊方向
L1‧‧‧第1排列方向
L2‧‧‧第2排列方向
L3‧‧‧消失線
P1‧‧‧導電粒子之第1排列方向之節距
P2‧‧‧導電粒子之第2排列方向之節距
α‧‧‧傾斜角
β‧‧‧傾斜角
γ‧‧‧由第1排列方向與第2排列方向形成之角
[圖1]圖1係實施例之異向導電性膜1A的俯視圖。
[圖2]圖2係實施例之異向導電性膜1A中導電粒子之配置圖。
[圖3]圖3係實施例之異向導電性膜1B中導電粒子之配置圖。
[圖4]圖4係實施例之異向導電性膜1C中導電粒子之配置圖。
[圖5]圖5係實施例之異向導電性膜1D中導電粒子之配置圖。
[圖6A]圖6A係實施例之異向導電性膜1E中導電粒子之配置圖。
[圖6B]圖6B係實施例之異向導電性膜1E’中導電粒子之配置圖。
[圖7]圖7係實施例之異向導電性膜1F中導電粒子之配置圖。
[圖8]圖8係實施例之異向導電性膜1G中導電粒子之配置圖。
以下，一面參照圖式一面詳細說明本發明。再者，各圖中，同一符號表示同一個或同等之組成元件。
圖1係本發明一實施例之異向導電性膜1A的俯視圖，圖2係該異向導電性膜1A中導電粒子之配置圖。
此異向導電性膜1A具有絕緣接著劑層2與以格子狀之配置固定於絕緣接著劑層2之導電粒子3。更具體而言，此異向導電性膜1A係將長條之異向導電性膜製成帶狀者，導電粒子3以節距P1排列於第1排列方向L1，該第1排列方向L1與形成為帶狀之異向導電性膜1A之長邊方向D1平行，並且以節距P2平行地排列於異向導電性膜1A的寬邊方向D2，即排列於與第1排列方向L1正交之第2排列方向L2而形成四方格子，其 中該寬邊方向D2與異向導電性膜1A之長邊方向D1正交。
此異向導電性膜1A中，藉由在相對於導電粒子3之第1排列方向L1或第2排列方向L2而傾斜之線上的格子點不存在導電粒子3而形成之線L3，係形成為相對於第1排列方向L1以傾斜角α傾斜，或相對於第2排列方向L2以傾斜角β傾斜。消失線L3較佳以特定間隔平行地形成。
藉由在異向導電性膜1A存在消失線L3，於以目視檢查或影像檢查對異向導電型膜1A之導電粒子3的排列狀態進行檢查時，如圖2所示，設定將消失線作為對角線之視野10，可一面調查視野10內之導電粒子3的個數，一面以視野10與消失線L3維持特定角度之方式進行掃描。因此，以視野10不遺漏地掃描異向導電性膜1A上之整面變得容易。
進而，目視檢查中，於視野10由於將消失線3作為對稱之軸而可輕易辨識導電粒子3之排列的對稱性，故變得容易發現導電粒子3之凝集或缺少等不良狀況。因此，因存在有消失線L3，而可輕易高度地維持異向導電性膜1A之品質，又，可縮短檢查製品所需之時間，提升製品之生產性。
如圖1所示，一般於電子機器之生產線的異向導電性連接中，連接端子4之短邊方向以沿著異向導電性膜1A的長邊方向D1之方式配置。因此，為了將以微間距形成之連接端子4進行異向導電性連接，較佳縮小消失線L3之傾斜角α，例如於將接合電視之顯示用玻璃基板與可撓性印刷配線板(FPC：Flexible Printed Circuits)的FOG(Film on Glass)進行接合之情形般，連接端子4之連接面之大小為寬8~200μm，長1500μm以下時，較佳將傾斜角α設為15~75°。
作為傾斜角α之調整方法，如圖2所示，以通過成為導電粒子3之基本排列(即，無消失線L3之情形之排列)之單位格子5的對角之方式形成消失線L3之情形時，傾斜角α可藉由導電粒子3之第1排列方向L1之節距P1與第2排列方向L2之節距P2的大小進行調整。例如，自將傾斜角α設為小於由異向導電性膜1A之寬方向L2與消失線L3形成之角β之方面，將第1排列方向L1之節距P1設為長於第2排列方向L2之節距。
又，於減小傾斜角α之情形時，如4所示之異向導電性膜1C般，亦可以通過連接於第1排列方向L1之2個單位的單位格子5之對角的方式形成消失線L3。
本發明中，成為導電粒子3之基本的排列或消失線L3之方向並無特別限制。例如，亦可如圖5所示之異向導電性膜1D般，使第2排列方向L2相對於導電粒子3之第1排列方向L1傾斜。於此情形時，較佳將由第2排列方向L2與第1排列方向L1形成之角γ設為15~75°，更佳設為18~72°，進而較佳設為20~70°。
此情形時，如圖6A、圖6B所示之異向導電性膜1E、1E’般，亦可將成為導電粒子3之基本的排列設為六方格子，設置相對於其第1排列方向L1傾斜之消失線3。成為導電粒子3之基本的排列方向可採用相對於異向導電性膜之長邊方向D1之任意方向。
在使第2排列方向L2相對於第1排列方向L1傾斜，藉此以異向導電性膜1D異向導電性連接矩形連接端子(凸塊)之情形時，如圖1所示，若將矩形連接端子4的長邊方向對準正交於第1排列方向L1之方向(即，將連接端子4之短邊方向對準第1排列方向L1)，則由於位在連接端子 4之緣部，可減低於異向導電性連接時流至絕緣性樹脂而無法貢獻於連接的導電粒子之數目，故即便於異向導電性膜1A之膜面內的某處採用使用於異向導電性連接之矩形區域，亦可確保充分之貢獻於傳導的導電粒子3之個數。
如圖7所示之異向導電性膜1F般，亦可將消失線L3形成為與導電粒子3之第1排列方向L1平行，同樣地，亦可形成為與導電粒子3之第2排列方向L2平行。自提升導電粒子之凸塊之捕捉性之觀點及容易確認異向導電性連接後導電粒子之凸塊的補充狀態之觀點而言，較佳將消失線L3形成為相對於導電粒子之第1排列方向L1或第2排列方向L2傾斜，自藉由在膜之製造時易於進行檢查而提升產率之觀點而言，較佳將消失線L3形成為與第1排列方向L1或第2排列方向L2平行。
如圖8所示之異向導電性膜1G般，於隨機地分散之導電粒子3中，亦可以不存在導電粒子3之線狀區域觀察消失線L3之方式實施。
本發明之異向導電性膜針對導電粒子3本身之組成、絕緣接著劑2之層組成及組成樹脂，並無特別限制，可採用各種態樣。
例如，作為導電粒子3，可自用於公知之異向導電性膜者中適當地選擇而使用。例如，可列舉鎳、鈷、銀、銅、金、鈀等之金屬粒子，被覆金屬之樹脂粒子等。亦可併用2種以上。
自防止短路與電極間之接合的穩定性之觀點而言，導電粒子3之粒徑較佳為1~50μm，更佳為1~20μm。
於將導電粒子3排列成格子狀之情形時，導電粒子3之第1排列方向L1之節距與第2排列方向L2之節距各自較佳為導電粒子3之粒 徑的0.5~128倍，較佳為0.8~64倍，更佳為1.2~32倍。該等節距若過短，則使用異向導電性膜連接端子間之情形時，容易產生短路，相反地若過長則於端子間被捕捉之導電粒子數變得不足夠。
導電粒子3之密度較佳為100~100000個/mm2，更佳為200~80000個/mm2，尤佳為300~50000個/mm2。此粒子密度可根據導電粒子3之粒徑與排列方向適當地作調整。
另一方面，作為絕緣接著劑劑2，可適當採用於公知之異向導電性膜所使用的絕緣性樹脂層。例如，可使用含有丙烯酸酯化合物與光自由基聚合起始劑之光自由基聚合型樹脂層、含有丙烯酸酯化合物與熱自由基聚合起始劑之熱自由基聚合型樹脂層、含有環氧化合物與熱陽離子聚合起始劑之熱陽離子聚合型樹脂層、含有環氧化合物與熱陰離子聚合起始劑之熱陰離子聚合型樹脂層等。又，該等樹脂層亦可視需要製成各自聚合者。又，亦可由多層樹脂層形成絕緣接著劑層2。
作為將導電粒子3以上述配置固定於絕緣接著劑層2之方法，可藉機械加工、雷射加工、影印石版術(photo-lithography)等公知之方法製作對應於導電粒子3的配置之具有凹陷的模具，將導電粒子置入該模具，於其上填充絕緣接著劑層形成用組成物，使其硬化而固定導電粒子，自模具取出。亦可藉剛性低之材質製成模具。
或者，亦可製作具有凹陷的模具，該凹陷係對應於無消失線L3之情形時之導電粒子3的配置，於該模具之表面黏貼對應於消失線L3之膠帶而覆蓋對應於消失線L3之部分的凹陷，繼而將導電粒子3置入該模具，與上述相同地使用絕緣接著劑層組成物，而將導電粒子3固定於絕緣 性接著劑層。
又，為了將導電粒子3於絕緣接著劑層2放置成上述配置，亦可於絕緣接著劑層形成組成物層之上，設置以特定之配置形成有貫通孔之構件，並於其上供給導電粒子3，使其通過貫通孔。
又，使用具有貫通孔之構件，於將導電粒子3通過於此貫通孔而配置導電粒子之情形時，作為具有貫通孔之構件，亦可製作具有對應於無消失線L3之情形之導電粒子3的配置之貫通孔者，將此構件之貫通孔以對應於消失線L3之膠帶堵塞，自其上供給導電粒子3。
本發明中，導電粒子排列成格子狀，使用消失線相對於第1排列方向或第2排列方向呈傾斜之異向導電性膜，於將IC晶片、IC模組等第1電子零件之連接端子與可撓性基板、玻璃基板等第2電子零件之連接端子進行異向導電性連接之情形時，如圖1所示般，使導電粒子3之第1排列方向L1或第2排列方向L2對準異向導電性膜之長邊方向D1，使大致正交於第1排列方向L1或第2排列方向L2之方向對準第1電子零件或第2電子零件之連接端子4的長邊方向。藉此，可充分提高連接端子4中導電粒子3之捕捉數。
根據本發明，以此方式亦可大致、容易地進行異向導電性連接之第1電子零件與第2電子零件的連接構造體中導電粒子之配置以及消失線的確認。本發明亦包含有關之連接構造體。
實施例
以下，根據實施例具體地說明本發明。
實施例1~6、比較例1~3
如表1所示，於實施例1~6及比較例2、3，使用表1所示之導電粒子與樹脂，製作導電粒子如圖2(四方格子)或圖6(六方格子)所示之配置的異向導電性膜。於此情形時，將導電粒子之第1排列方向之節距P1與第2排列方向之節距P2設為如表1所示之大小。
比較例1中，導電粒子之配置設為隨機。
更具體而言，以表1所示之組成製備含有熱塑性樹脂、熱硬化性樹脂及潛在性硬化劑之絕緣性樹脂的混合溶液，將其塗佈於膜厚50μm之PET膜上，利用80℃之烘箱乾燥5分鐘，於PET膜上形成厚度20μm之接著層。
另一方面，製作具有對應於表1所示之導電粒子之排列的凸部圖案的模具，將公知之透明性樹脂的丸粒(pellet)以熔融之狀態流入該模具，藉冷卻而固定，凹部形成如表1所示之排列圖案的樹脂模具。將導電粒子填充於此樹脂模具之凹部，於其上被覆上述絕緣性樹脂之接著層，藉由紫外線硬化使含有於該絕緣性樹脂之熱硬化性樹脂硬化。然後，自模具剝離絕緣性樹脂，製造各實施例及比較例之異向導電性膜。
再者，比較例1中將導電粒子分散於低沸點溶劑並噴霧而隨機地配置於同一平面上。
評價 進行以下(a)~(e)之評價
於各實施例及比較例之異向導電性膜選擇任意之導電粒子，將其作為基準點而於第1排列方向及第2排列方向各自設定500×500μm之區域，藉由顯微鏡觀察(倍率：100倍)檢查於所欲之消失線上之格子點導電粒子是否 缺少。進而於未重複該領域之部分，重複十次相同之檢查。再者，於觀察區域之設定，亦可設定存在有特定數目之導電粒子的區域(例如30個×30個)，取代設定特定面積之區域。
此觀察結果中，將存在於消失線上之格子點的導電粒子之數目與消失線上的格子點之數目的比例為5%以下者，評價為有消失線，將此情形以外者評價為無消失線。將結果示於表1。
(b)連結粒子之有無
與(a)相同地觀察各實施例及比較例之異向導電性膜，檢查是否具有連結有2個以上之導電粒子者。
此觀察結果中，將連結而存在有2個以上之導電粒子之部分的個數與無連結粒子之情形時的設計粒子數之比例為5%以下者，評價為無2個以上之連結粒子，將此情形以外者評價為有2個以上之連結粒子。其結果為，比較例1雖被評價為有2個以上之連結粒子，但其他被評價為無2個以上之連結粒子。再者，2個連結粒子之粒子數只要為全部粒子數之5%以下則無實用上之問題。
(c)個數一致率
藉由使用顯微鏡之目視觀察，計數含有於含消失線之500×500μm的區域之導電粒子的個數，繼而使用影像處理機(WinRoof：三谷商事公司製)，計數含有於相同區域之導電粒子的個數，利用下式算出個數一致率。
個數一致率(%)=100-(| N1-N2 |/N1)×100
(其中，N1：藉由目視觀察計數之導電粒子的個數
N2：藉由影像處理機計數之導電粒子的個數)
對應於個數一致率之數值，以下述基準進行評價。將結果示於表1。
A：個數一致率為97%以上
B：個數一致率為92%以上~未達97%
C：個數一致率為85%以上~未達92%
D：個數一致率未達85%
實用上，個數一致率較佳為B評價以上。
(d)初期傳導電阻
將各實施例及比較例之異向導電性膜夾持在用於評價初期傳導及傳導可靠性之FPC與玻璃基板之間，進行加熱加壓(180℃，3MPa，5秒)而獲得各評價用連接物，測量此評價用連接物之傳導電阻。將結果示於表1。
此處，該評價用FPC與玻璃基板對應有其等之端子圖案，尺寸如下所述。
評價用FPC
聚醯亞胺基材：(厚度25μm)
配線規格：Cu配線(高度18μm)、鍍Au
配線尺寸：寬25μm×長1000μm
玻璃基板
玻璃材質：康寧公司製
外直徑：15×70mm
厚度：0.5mm
電極：ITO配線
(e)傳導可靠性
將用於評價初期傳導電阻之FPC與各實施例及比較例的異向導電性膜之評價用連接物於溫度85℃、濕度85%RH之恆溫槽放置500小時後之傳導電阻，與初期傳導電阻同樣地進行測量。將結果示於表1。
再者，若此傳導電阻為5Ω以上，則由所連接之電子零件的實用性之傳導穩定性之方面而言欠佳。
由表1可知，若消失線形成於導電粒子之排列，則使導電粒子之檢查效率獲得提升。
比較例1中，推測由於粒子隨機地存在，影像處理機判斷為雜訊，檢測成功率顯著地變低。

Claims (11)

  1. 一種異向導電性膜，其含有絕緣接著劑層與分散於該絕緣接著劑層之導電粒子，該異向導電性膜於俯視下，不存在導電粒子之直線狀的線(以下稱為消失線)以特定間隔存在。
  2. 如申請專利範圍第1項之異向導電性膜，其中，導電粒子藉由排列於第1排列方向與第2排列方向而被配置成格子狀，消失線相對於第1排列方向與第2排列方向而傾斜。
  3. 如申請專利範圍第1或2項之異向導電性膜，其中，異向導電性膜形成為帶狀，相對於其長邊方向傾斜地形成有消失線。
  4. 如申請專利範圍第3項之異向導電性膜，其中，由異向導電性膜之長邊方向與消失線形成之角度小於由異向導電性膜之寬邊方向與消失線形成之角度。
  5. 如申請專利範圍第2項之異向導電性膜，其中，導電粒子之第1排列方向與異向導電性膜之長邊方向平行。
  6. 如申請專利範圍第2項之異向導電性膜，其中，導電粒子之第1排列方向與第2排列方向正交。
  7. 如申請專利範圍第2項之異向導電性膜，其中，導電粒子之第1排列方向與第2排列方向傾斜地相交。
  8. 如申請專利範圍第1或2項之異向導電性膜，其中，導電粒子之密度為100~100000個/mm2。
  9. 一種連接方法，其使用申請專利範圍第2~8項中任一項之異向導電性膜，將第1電子零件之連接端子與第2電子零件之連接端子進行異向導 電性連接，該方法使異向導電性膜之大致正交於第1排列方向與第2排列方向的方向對準於第1電子零件或第2電子零件之連接端子之長邊方向。
  10. 如申請專利範圍第9項之連接方法，其中，連接端子之連接面的大小為寬度8~200μm，長度1500μm以下。
  11. 一種連接構造體，其使用申請專利範圍第1~8項中任一項之異向導電性膜而異向導電性連接有第1電子零件之連接端子與第2電子零件之連接端子。
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