WO2018012668A1 - 안테나 모듈 형성용 복합기판 및 이의 제조방법 - Google Patents
안테나 모듈 형성용 복합기판 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2018012668A1 WO2018012668A1 PCT/KR2016/009611 KR2016009611W WO2018012668A1 WO 2018012668 A1 WO2018012668 A1 WO 2018012668A1 KR 2016009611 W KR2016009611 W KR 2016009611W WO 2018012668 A1 WO2018012668 A1 WO 2018012668A1
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- WIPO (PCT)
- Prior art keywords
- copper foil
- foil layer
- insulating adhesive
- composite substrate
- magnetic
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/08—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers
- H01F10/10—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition
- H01F10/12—Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/366—Electric or magnetic shields or screens made of ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
- H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
- H04B5/263—Multiple coils at either side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
Definitions
- the present invention relates to a composite module for forming an antenna module and a method for manufacturing the same, which can simultaneously provide functions such as wireless charging (WPC), MST, NFC, etc., and reduce cost and simplify process.
- WPC wireless charging
- Terminals may be divided into mobile / portable terminals and stationary terminals according to their mobility.
- the mobile terminal may be classified into a handheld terminal and a vehicle mount terminal according to whether a user can directly carry it.
- Mobile terminals such as mobile phones, PDAs, PMPs, navigation, laptops, etc., include basic functions such as calling, video / music playback, directions, etc.
- DMB wireless Internet
- device-to-device It provides functions such as near field communication.
- the mobile terminal is provided with a plurality of antennas for wireless communication such as wireless internet and Bluetooth, and also functions such as information exchange, payment, ticket reservation, search, etc. between the terminals using near field communication (ie NFC).
- NFC near field communication
- the portable terminal is equipped with at least one antenna module for the portable terminal used in the wireless communication and short-range communication method.
- the rear cover of the mobile terminal is formed of an insulating material made of polycarbonate, it does not affect the communication of the antenna module mounted on the battery pack or the rear cover.
- the trend of manufacturing for example, design trends such as grip and appearance
- the above-described antenna signal is shielded by a metal material, so that wireless communication and short-range wireless communication cannot be performed.
- the antenna module embedded in the terminal has a thick thickness and a complicated manufacturing process.
- the present invention has been made to solve the above problems, while providing a plurality of antenna functions such as wireless charging (WPC), MST, NFC, etc., the thinning due to the simplification of the process, low cost and reduced thickness can be simultaneously exhibited.
- An object of the present invention is to provide a composite substrate for forming an antenna module and a method of manufacturing the same.
- the present invention is a non-magnetic substrate having a first copper foil layer; A second nonmagnetic substrate having a second copper foil layer; And a magnetic sheet disposed between the first nonmagnetic substrate and the second nonmagnetic substrate and integrally laminated with the nonmagnetic substrates.
- the composite substrate, the roll is continuous in the longitudinal direction by integrating the first and second non-magnetic substrates respectively disposed on the magnetic sheet and the upper and lower surfaces thereof through a roll-to-roll method (roll-to-roll) It is preferable that the) form.
- the magnetic sheet includes a magnetic powder and a polymer resin.
- the magnetic powder may be selected from the group consisting of magnetic metal powder, metal flakes and ferrite.
- the polymer resin may be selected from the group consisting of non-halogen epoxy resins, silicones, urethanes, polyimides, and polyamides.
- the magnetic sheet includes 70 to 95% by weight of magnetic powder based on the total weight of the magnetic sheet, the magnetic permeability ( ⁇ ⁇ ⁇ ) may range from 50 to 250.
- the first nonmagnetic substrate and the second nonmagnetic substrate may further include a first insulating adhesive layer and a second insulating adhesive layer, respectively.
- the composite substrate includes (i) a first copper foil layer, a first insulating adhesive layer, a magnetic sheet, a second insulating adhesive layer, and a second copper foil layer, or (ii) a first copper foil layer and a first insulating layer.
- a second copper foil layer which may be sequentially stacked.
- each of the first and second nonmagnetic substrates may be a flexible copper clad laminate (FCCL) or a flexible printed circuit board (FPCB).
- FCCL flexible copper clad laminate
- FPCB flexible printed circuit board
- the first and second insulating adhesive layer may be made of a polymer resin selected from the group consisting of polyimide and epoxy resin, respectively, and further selected from the group consisting of a thermoplastic resin, an inorganic filler, and a curing agent. It may further comprise a species or more.
- a peel strength value of the first or second insulating adhesive layer on the magnetic sheet may be 0.6 to 3.0 kgf / cm 2 , and permeability may range from 50 to 250.
- the thickness of the magnetic sheet is in the range of 20 to 150 ⁇ m after processing
- the thickness of the first copper foil layer and the second copper foil layer is in the range of 6 to 105 ⁇ m each
- the thickness of the first insulating adhesive layer and the second insulating adhesive layer May each range from 1 to 30 ⁇ m.
- the total thickness of the composite substrate may range from 34 to 420 ⁇ m.
- the first copper foil layer and the second copper foil layer may be to form a first antenna pattern portion and a second antenna pattern portion each having a predetermined area, line width and shape.
- the composite substrate includes at least one through hole penetrating the first nonmagnetic substrate, the magnetic sheet, and the second nonmagnetic substrate, and the first antenna pattern portion and the second antenna pattern portion are separated from each other through the through hole. It may be connected.
- the composite substrate includes at least one of a wireless power consortium (WPC) antenna pattern, a magnetic secure transmission (MST) antenna pattern, and a near field communication (NFC) antenna pattern.
- WPC wireless power consortium
- MST magnetic secure transmission
- NFC near field communication
- the antenna pattern may be included, and preferably, may be a combo type including two or more antenna patterns.
- the overall thickness of the antenna module is reduced, so that the thickness and the process can be simplified.
- FIG. 1 to 4 schematically illustrate the cross-sectional structure of an antenna module forming composite board according to an embodiment of the present invention.
- FIG. 5 is a graph illustrating magnetic permeability of the composite substrate for forming an antenna module manufactured in Example 1.
- FIG. 6 is a graph showing the magnetic permeability change of the magnetic sheet according to the content of the magnetic powder.
- a part when a part is 'connected' to another part, it includes not only 'directly connected' but also 'indirectly connected' with another element in between. do.
- the term 'comprising' a certain component means that the component may further include other components other than the component, unless specifically stated otherwise.
- Current electromagnetic shielding materials may be (1) a single material such as a soft magnetic alloy, a soft magnetic ferrite sintered body, or (2) a composite material formed by mixing a soft magnetic metal powder or a soft magnetic ferrite powder with a ceramic or a synthetic resin to be molded. have.
- the core of the electromagnetic shielding material is to maintain an appropriate permeability and magnetic loss rate.
- Permeability refers to the amount of passing frequency signal generated during communication
- magnetic loss rate refers to the amount of frequency that can not pass through the shielding material.
- the magnetic permeability and magnetic loss rate are inversely proportional.
- Different shielding materials have different permeability and magnetic loss rates for each frequency band. Therefore, you should use the appropriate material according to the frequency band you want to use.
- wireless charging uses a frequency specification of 100 ⁇ 357 KHz in the magnetic induction method, 13.56MHz for NFC communication.
- Ni-Zn ferrite material is used as a shielding material that satisfies all of them because of its excellent performance in wireless charging (WPC) and NFC communication, relatively easy manufacturing, and price competitiveness.
- alternative materials such as soft magnetic metal-resin (Metal-Resin) composite material and Mn-Zn ferrite sheet have been steadily being developed.
- the conventional ferrite sheet or composite material has a thick thickness and a complicated manufacturing process, which does not meet the tendency of thinning and simplifying a mobile device.
- the present invention is to provide a double-sided composite substrate having a novel structure that can provide a wireless charging, NFC, MST antenna function in combination using a composite substrate manufactured in a single process.
- the present invention constitutes an integrated composite substrate in which a nonmagnetic substrate (eg, FCCL) and a magnetic sheet (polymeric magnet sheet, polymer magnet sheet PMS) are laminated. Accordingly, it is not necessary to use a separate ferrite sheet, and by implementing an integrated structure of the magnetic sheet and the nonmagnetic substrate, the overall thickness of the antenna module is reduced, so that the thickness and the process can be simplified.
- a nonmagnetic substrate eg, FCCL
- a magnetic sheet polymeric magnet sheet, polymer magnet sheet PMS
- the composite substrate may be manufactured in a roll type through a conventional roll to roll process, cost reduction effects may be further increased by simplifying the manufacturing process.
- the soft magnetic metal-resin composite material according to the present invention the investment cost of mass production equipment is smaller than the existing Ni-Zn ferrite sheet, it is possible to produce a roll-to-roll method Since the coil is buried, the thickness can be reduced, and the laminated structure can be designed. Thus, when mass production technology is secured, cost competitiveness is superior to that of the existing ferrite sheet. Accordingly, the present invention can provide a novel composite material that can be used as a shielding material of the wireless charging receiving module in place of the conventional ferrite sheet.
- the antenna module according to the present invention largely includes a magnetic sheet and two non-magnetic substrates.
- the nonmagnetic substrate may include a copper foil layer, or a copper foil layer and an insulating adhesive layer, respectively.
- FIG. 1 schematically illustrates a cross-sectional structure of an antenna module forming composite substrate 100 according to an embodiment of the present invention.
- the upper and lower surfaces of the magnetic sheet 10 may respectively include a copper foil layer 21 and an insulating adhesive layer ( Two non-magnetic substrates 20, on which 22 are laminated, are disposed on both sides, and these are a structure in which they are integrally laminated.
- the antenna module forming composite substrate 100, the first copper foil layer 21; A first insulating adhesive layer 22; Magnetic sheet 10; A second insulating adhesive layer 22; And a second copper foil layer 21, which has a structure in which they are sequentially stacked.
- the antenna module forming composite substrate 100 may include a magnetic sheet 10 through a roll-to-roll method; It is preferable that the first nonmagnetic substrate 20 and the second nonmagnetic substrate 20, which are respectively disposed on upper and lower portions of the magnetic sheet, are integrally formed to have a continuous roll shape in the longitudinal direction. However, this is not particularly limited.
- a release film may be further laminated on the first copper foil layer 21 and the second copper foil layer 21, respectively.
- the magnetic sheet 10 includes a magnetic material to shield electromagnetic waves and at the same time exhibits adhesion, heat resistance, and interlayer adhesion.
- the magnetic sheet 10 may be in the form of an insulating layer, a film, or a sheet, and may use a polymeric magnet sheet (PMS) including conventional magnetic powder and polymer resin known in the art.
- PMS polymeric magnet sheet
- the magnetic powder is not particularly limited as long as it is a magnetic component.
- Examples include magnetic metal powders, metal flakes, ferrites or mixtures of one or more thereof.
- Preferably it is a ferrite powder.
- the size, shape and content of the magnetic powder is not particularly limited and may be appropriately controlled within the conventional range known in the art.
- the polymer resin constituting the magnetic sheet 10 may use any conventional polymer known in the art without limitation.
- it is an epoxy resin
- it is a non-halogen type epoxy resin which does not contain halogen elements, such as a bromine (Br) in a molecule
- the said polymer resin is not limited to an epoxy resin, For example, it may contain silicone, urethane, polyimide, polyamide, etc. further.
- the use ratio of the magnetic powder and the polymer resin is not particularly limited, but may be in the range of 50 to 95: 5 to 50 by weight, for example, preferably 70 to 90: 10 to 30 It may be in the weight ratio range.
- the thickness of the magnetic sheet 10 is not particularly limited, but may be, for example, in the range of 20 to 150 ⁇ m, preferably in the range of 30 to 80 ⁇ m, and more preferably in the range of 30 to 60 ⁇ m.
- the magnetic sheet contains 70 to 95% by weight of magnetic powder based on the total weight of the magnetic sheet, the magnetic permeability ( ⁇ ⁇ ⁇ , ⁇ ') is 50 to 250, the magnetic permeability loss ( ⁇ '') may be less than 50.
- the magnetic permeability and the magnetic permeability loss means that it is measured in the frequency 1 MHz ⁇ 100 MHz, preferably 3 MHz ⁇ 13.56 MHz band.
- the magnetic sheet 10 may be prepared according to a conventional method known in the art, for example, after forming a composition for forming a magnetic sheet including a magnetic powder, a solvent and a polymer resin, the composition into a thin sheet shape It can be produced by molding and heating.
- the above-mentioned composition may be directly coated on a nonmagnetic substrate such as FCCL, FPCB, etc., and then laminated and cured through roll lamination to produce an integrated composite substrate.
- the first non-magnetic substrate and the second non-magnetic substrate 20 may be made of a copper foil layer, or an insulating adhesive layer and a copper foil layer may be stacked.
- Conventional substrates, copper foils with resins, copper foil layers or sheets having a shape can be used without limitation.
- the first nonmagnetic substrate and the second nonmagnetic substrate may be the same or different from each other, and preferably, a flexible copper clad laminate (FCCL) or a flexible printed circuit board (FPCB) may be used.
- FCCL flexible copper clad laminate
- FPCB flexible printed circuit board
- the first non-magnetic substrate 20 disposed on one surface of the magnetic substrate 10 includes a first insulating adhesive layer 22 and a first copper foil layer 21, and the other surface of the magnetic substrate 10.
- the second nonmagnetic substrate 20 disposed in the substrate also includes a second insulating adhesive layer 22 and a second copper foil layer 21.
- first copper foil layer 21 and the second copper foil layer 21 serve to form the first antenna pattern portion and the second antenna pattern portion, respectively, through conventional dry or wet etching known in the art.
- first antenna pattern portion and the second antenna pattern portion may be formed to have the same or different predetermined areas, line widths, and shapes depending on the use of the antenna module to be applied.
- the thicknesses of the first copper foil layer 21 and the second copper foil layer 21 may be the same or different from each other, and are not particularly limited. In one example each may be in the range of 6 to 105 ⁇ m, preferably 12 to 50 ⁇ m range.
- first insulating adhesive layer 22 and the second insulating adhesive layer 22 may be more physically bonded and bonded to other substrates, such as the magnetic sheet 10, which are in physical contact with the first and second nonmagnetic substrates 20. While solidifying, it serves to insulate the first copper foil layer 21 and the second copper foil layer 21 from the outside.
- the first insulating adhesive layer 22 and the second insulating adhesive layer 22 may be formed of a conventional polymer resin known in the art as a coating layer or a film. In this case, the first insulating adhesive layer 22 and the second insulating adhesive layer 22 may have the same or different polymer composition.
- the first insulating adhesive layer 22 and the second insulating adhesive layer 22 may be formed of a conventional polyimide resin, an epoxy resin, or a mixture thereof.
- other thermosetting resins not described above or thermoplastic resins, inorganic fillers, curing agents, and the like conventional in the art may be further included.
- Polyimide (PI) resin is a polymer material having an imide ring, and exhibits excellent flame resistance, heat resistance, ductility, chemical resistance, abrasion resistance and weather resistance based on the chemical stability of the imide ring. In addition, it exhibits low thermal expansion, low breathability and excellent electrical properties. Therefore, when the polyimide resin is used as the first insulating adhesive layer 22 and the second insulating adhesive layer 22, the flame retardancy can be sufficiently secured due to the flame retardancy of the polyimide itself. In addition, the surface hardness is increased, the scratch resistance is increased, heat resistance is increased by the high glass transition temperature, and it is possible to secure a high bendability compared to the epoxy resin.
- the polyimide (PI) may be a thermosetting polyimide of the art, or may use a commercially available soluble polyimide (soluble PI) or a polyamic acid composition.
- soluble PI soluble polyimide
- Non-limiting examples of the polyimide resin that can be used include polyimide, polyamide, polyamideimide, polyamic acid resin or composite resin thereof.
- thermosetting resins When using the soluble polyimide or polyamic acid composition in the present invention, conventional thermosetting resins known in the art may be used.
- thermosetting resins that can be used include epoxy resins, polyurethane resins, phenol resins, vegetable oil-modified phenol resins, xylene resins, guanamine resins, diallyl phthalate resins, vinyl ester resins, unsaturated polyester resins, and furan resins.
- Polyimide resin, cyanate resin, maleimide resin and benzocyclobutene resin may be one or more selected from the group consisting of.
- it is an epoxy resin, a phenol resin, or a vegetable oil modified phenol resin.
- a double epoxy resin is preferable because it is excellent in reactivity and heat resistance.
- the epoxy resin can be used without limitation to conventional epoxy resins known in the art, it is preferred that two or more epoxy groups are present while containing a halogen element in one molecule.
- Non-limiting examples of the epoxy resins that can be used include bisphenol A / F / S resins, novolak type epoxy resins, alkylphenol novolak type epoxy, biphenyl type, aralkyl type and naphthol ( Naphthol) type, dicyclopentadiene type, or a mixed form thereof.
- More specific examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, naphthalene type epoxy resins, anthracene epoxy resins, biphenyl type epoxy resins, tetramethyl biphenyl type epoxy resins, and phenol novolacs.
- the above-mentioned epoxy resins may be used alone or in combination of two or more thereof.
- the non-halogen adhesive composition according to the present invention can obtain the effects of improving the adhesiveness, flexibility and relaxation of the thermal stress by containing a thermoplastic resin.
- thermoplastic resins that can be used include acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), poly Butadiene, styrene-butadiene-ethylene resin (SEBS), acrylic acid and / or methacrylic acid ester resin (acrylic rubber) possessing a side chain of 1 to 8 carbon atoms ), Polyvinyl butyl al, polyamide, polyester, polyimide, polyamideimide, polyurethane or a mixture of one or more thereof.
- NBR acrylonitrile-butadiene copolymer
- ABS acrylonitrile-butadiene rubber-styrene resin
- SEBS poly Butadiene
- acrylic acid and / or methacrylic acid ester resin acrylic rubber possessing a side chain of 1 to 8 carbon atoms
- Polyvinyl butyl al polyamide, polyester, polyimide, polyamideimide, polyurethane or
- the said thermoplastic resin contains the functional group which can react with an epoxy resin.
- the functional group which can react with an epoxy resin.
- it is 1 or more types of functional groups chosen from the group which consists of an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methoxy group, and an isocyanate group. Since such functional groups form strong bonds with epoxy resins, heat resistance is improved after curing, which is preferable.
- an acrylonitrile-butadiene copolymer in consideration of the effect of mitigating adhesion, flexibility and thermal stress. It is preferable that such a copolymer contains the functional group which can react with an epoxy resin.
- the functional group include amino groups, carboxyl groups, epoxy groups, hydroxyl groups, methoxy groups, isocyanate groups, vinyl groups, silanol groups, and the like, and particularly preferably include carboxyl groups.
- Specific examples of the NBR possessing the carboxyl group include PNR-1H (manufactured by JSR Corporation), Nipol 1072J, Nipol DN631 (manufactured by Nippon Zeon Corporation), and the like.
- thermoplastic resin content is not particularly limited, and may be in the range of 1 to 35% by weight based on the total weight of the adhesive composition, for example, preferably 5 to 30% by weight. If it is out of the said range, sufficient adhesiveness cannot be obtained and heat resistance will fall.
- conventional curing agents known in the art may be used without limitation, and may be appropriately selected and used depending on the type of epoxy resin to be used.
- curing agents that can be used include phenolic, anhydride, dicyanamide, and aromatic polyamine curing agents.
- Non-limiting examples of hardeners that can be used include phenolic hardeners such as phenol novolak, cresol novolak, bisphenol A novolak, naphthalene type; And polyamine curing agents such as metaphenylenediamine, diaminodiphenylmethane (DDM) and diaminodiphenylsulfone (DDS), and the like, and these may be used alone or in combination of two or more thereof.
- DDM diaminodiphenylmethane
- DDS diaminodiphenylsulfone
- the content of the curing agent is not particularly limited, and may be in the range of 5 to 10 parts by weight based on 100 parts by weight of the total thermosetting resin composition.
- the present invention may include conventional inorganic fillers known in the art.
- Non-limiting examples of inorganic fillers include silicas such as natural silica, fused silica, amorphous silica, crystalline silica, and the like; Boehmite, alumina, aluminum hydroxide [Al (OH) 3 ], talc, spherical glass, calcium carbonate, magnesium carbonate, magnesia, clay, calcium silicate, titanium oxide, antimony oxide, fiberglass, boric acid Aluminum, barium titanate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, boron nitride, silicon nitride, talc, mica and the like. These inorganic fillers may be used alone or in combination of two or more.
- the size of the inorganic filler is not particularly limited, and the average particle diameter may be in the range of 0.5 to 10 ⁇ m.
- the content of the inorganic filler is not particularly limited, and may be in the range of 5 to 20 parts by weight based on 100 parts by weight of the total thermosetting resin composition.
- thermosetting resin composition of the present invention is a flame retardant generally known in the art as needed, other thermosetting resins or thermoplastic resins and oligomers thereof not described above, as long as they do not impair the intrinsic properties of the resin composition.
- Various polymers such as, solid rubber particles or other additives such as ultraviolet absorbers, antioxidants, polymerization initiators, dyes, pigments, dispersants, thickeners, leveling agents and the like may be further included.
- thermosetting adhesive composition constituting the first insulating adhesive layer 22 and the second insulating adhesive layer 22, 30 to 50 parts by weight of an epoxy resin based on 100 parts by weight of the total composition; 5 to 30 parts by weight of the thermoplastic resin; 5 to 10 parts by weight of a curing agent (additive); And 5 to 20 parts by weight of an inorganic filler.
- the epoxy resin may implement chemical resistance and bendability, and the thermoplastic resin exhibits adhesion and flexural improvement and thermal stress relaxation effect.
- the thermosetting adhesive composition may include an organic solvent, and the amount of the organic solvent may be in the range of remaining amount to meet 100 parts by weight of the total composition.
- thermosetting adhesive composition composed of the above components may be coated and dried on the first copper foil layer or the second copper foil layer to form a first insulating adhesive layer or a second insulating adhesive layer.
- the thicknesses of the first insulating adhesive layer 22 and the second insulating adhesive layer 22 may be appropriately adjusted in consideration of handling of the substrate, physical rigidity, thinning of the substrate, and the like. .
- the thicknesses of the first insulating adhesive layer 22 and the second insulating adhesive layer may be the same or different from each other, for example, may be in the range of 1 to 30 ⁇ m, and preferably in the range of 5 to 15 ⁇ m.
- the peel strength value of the first and second insulating adhesive layers 22 to the magnetic sheet 10 may be 0.6 to 3.0 kgf / cm 2 , preferably 1.0 to 2.0 kgf /. can be 2 cm.
- the permeability may be 50 to 250, preferably 100 to 200.
- the composite substrate 100 for forming an antenna module of the present invention may further include a release film on the first copper foil layer 21 and the second copper foil layer 21 disposed at the outermost sides.
- the release film may be applied without limitation to conventional configurations known in the art, for example, release films such as plastic films or release films may also be used.
- plastic film examples include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, polyethylene film, polypropylene film, cellophane, diacetylcellulose film, triacetylcellulose film, acetylcellulose Butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone film, polyether ether ketone film , Polyethersulfone film, polyetherimide film, polyimide film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, cycloolefin resin film and the like. These plastic films may be either transparent or translucent, may be colored, or may be non-colored, and may be appropriately selected depending on the intended use.
- PET polyethylene terephthalate
- the composite substrate for forming an antenna module according to the present invention may have four embodiments as follows.
- FIG. 1 schematically illustrates a cross-sectional structure of an antenna module forming composite substrate 100 according to an embodiment of the present invention.
- the upper and lower surfaces of the magnetic sheet 10 may respectively include a copper foil layer 21 and an insulating adhesive layer ( Two non-magnetic substrates 20, on which 22 are laminated, are disposed on both sides, and these are a structure in which they are integrally laminated.
- FIG. 2 schematically illustrates a cross-sectional structure of an antenna module forming composite substrate 200 according to another embodiment of the present invention, wherein the first copper foil layer 21 and the first insulating layer are formed on one surface of the magnetic sheet 10.
- the adhesive layer 22 is sequentially laminated, and the second copper foil layer 21 is laminated on the other surface of the magnetic sheet 10, and these are laminated in one piece.
- FIG. 3 schematically illustrates a cross-sectional structure of an antenna module forming composite substrate 300 according to another embodiment of the present invention, in which a first copper foil layer 21 is stacked on one surface of a magnetic sheet 10.
- the second insulating adhesive layer 22 and the second copper foil layer 21 are sequentially stacked on the other surface of the magnetic sheet 10, and they are integrally laminated.
- FIG. 4 schematically illustrates a cross-sectional structure of an antenna module forming composite substrate 300 according to another embodiment of the present invention, wherein the first copper foil layer 21 and the second copper foil are formed on both surfaces of the magnetic sheet 10.
- the layer 21 is laminated
- the configuration of the magnetic sheet 10, the first and second copper foil layers 21, and the first and second insulating adhesive layers 22 are omitted from the description of FIG. 1.
- the composite substrate for forming an antenna module according to the present invention may be manufactured without limitation in accordance with conventional methods known in the art, and may have two embodiments as follows.
- the first embodiment of manufacturing the composite substrate for forming an antenna module of the present invention after coating the adhesive composition constituting the insulating adhesive layer on the first copper foil layer (or second copper foil layer), if necessary, the magnetic sheet And / or disposing the second copper foil layer (or the first copper foil layer) so as to be laminated and cured by applying continuous roll lamination.
- This first embodiment can be implemented in the following five ways.
- thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer and the second copper foil layer, respectively; And (ii) interposing a magnetic sheet between the insulating adhesive layer of the first copper foil layer and the insulating adhesive layer of the second copper foil layer and then laminating by applying roll lamination.
- thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer and the second copper foil layer, respectively;
- coating and drying the magnetic sheet forming composition on the insulating adhesive layer, respectively;
- thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer (i) coating and drying the thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer; (ii) arranging the insulating adhesive layer, the magnetic sheet, and the second copper foil layer of the first copper foil layer, respectively, and applying roll lamination to apply lamination and curing.
- thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer (i) coating and drying the composition for forming a magnetic sheet on the insulating adhesive layer; And (iii) arranging the magnetic sheet and the second copper foil layer of the first copper foil layer to face each other, and then laminating and hardening by applying roll lamination.
- the crimping process conditions can be appropriately adjusted within the conventional range known in the art.
- thermocompression Lami Conditions during the process (roll-to-roll) may be carried out under a temperature of 50 ⁇ 200 °C, a pressure of 3 ⁇ 200 kgf / cm 2 , and a compression rate of 0.1m / min to 20m / min conditions.
- this is not particularly limited.
- each of the first copper foil layer, the second copper foil layer, and the magnetic sheet may have a sheet shape, and may be wound in a roll shape after being continuously laminated according to the roll-to-roll method described above.
- a second embodiment of manufacturing the composite substrate for forming an antenna module of the present invention is a method of curing by applying a batch oven, instead of using the roll lamination process described above.
- thermosetting composition for forming an insulating adhesive layer on one surface of the first copper foil layer
- thermosetting composition for forming an insulating adhesive layer on one surface of the second copper foil layer
- curing the resultant of step (ii) in the batch oven
- the conditions in the batch oven are not particularly limited as long as it is a temperature and time condition capable of sufficiently curing the thermosetting composition for forming the adhesive layer.
- the composite substrate for forming an antenna module of the present invention configured as described above may configure the antenna module using a conventional method known in the art.
- the first copper foil layer and the second copper foil layer in the composite substrate may form a first antenna pattern portion and a second antenna pattern portion each having a predetermined area, line width, and shape.
- the composite substrate includes at least one through hole penetrating through the first nonmagnetic substrate, the magnetic sheet, and the second nonmagnetic substrate, and the first antenna pattern portion and the second antenna pattern portion are connected to each other through the through hole. Can be.
- the composite board for forming an antenna module according to the present invention may be mounted inside a mobile terminal, and may include at least one antenna pattern among a WPC antenna pattern, an MST antenna pattern, and an NFC antenna pattern, and preferably include two or more antenna patterns. It may be a combo type. For example, it may be a combo type including a magnetic secure transmission (MST) antenna pattern, and a near field communication (NFC) antenna pattern.
- MST magnetic secure transmission
- NFC near field communication
- thermosetting composition for forming insulating adhesive layer 1. Preparation of thermosetting composition for forming insulating adhesive layer
- the total concentration of the organic solid component and the inorganic solid component is 30 mass% by mixing the components of the insulating adhesive epoxy composition in accordance with the proportions of the blending examples shown in Table 1 below, and adding the methyl ethyl ketone (MEK) solvent to the obtained mixture. A dispersion was prepared. In Table 1, the amount of each composition is used in parts by weight.
- MEK methyl ethyl ketone
- thermosetting resin composition for forming the insulating adhesive layer on the mat-treated surface of the first copper foil and the second copper foil, respectively, and applying the dispersion solution with an applicator so that the thickness after drying is 7 ⁇ m, at 160 ° C.
- the adhesive epoxy composition was prepared in a semi-cured state by drying in a blow oven for 5 minutes.
- the composite substrate of Example 7 was prepared by directly interposing a magnetic sheet between the first copper foil and the second copper foil without using an epoxy adhesive and then performing lamination.
- Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Adhesive compounding ratio Epoxy 1 100 100 100 100 100 100 100 0 Thermoplastic 2 50 50 50 60 60 70 0 Inorganic fillers 3 10 15 20 15 20 15 0 Curing Agent 4 10 10 10 10 10 0 characteristic Adhesive force (kgf / cm 2 ) 1.2 1.3 1.4 1.5 1.4 1.4 0.7 Heat resistance (@ 300 °C) O O O O O O O O O O O Flame retardant (UL 94 V-0) O O O O O O O O O O O O O O O O O O O O
- Epoxy Resin 1 Bisphenol A Type, Kukdo Chemical YD-011
- Thermoplastic resin 2 Carboxyl group-containing acrylonitrile butadiene rubber [CTBN (Carboxyl-Terminated Butadiene Acrylonitrile Rubber), ZEON Nippol 1072
- Inorganic filler 3 Aluminum hydroxide, Showa Denko H42M
- Curing agent 4 4,4'-diaminodiphenyl sulfone
- the copper foil (the circuit) is peeled off at a rate of 50 mm / min in a 90 degree direction with respect to the surface of the laminate under a condition of 25 ° C.
- the lowest value of the force required to measure was measured and expressed as peel strength.
- a test piece was produced by cutting a composite substrate into 25 mm sides, and the test piece was suspended for 10 seconds on a solder bath at 288 ° C. Afterwards, the appearance defects such as lifting and cracking of the composite substrate and color change of the insulating layer were observed. At this time, the case where appearance defects such as lifting and cracking occurred was evaluated as "defect" and represented by x, and the case where there was no appearance defects such as lifting and cracking was evaluated as "good” and represented by ⁇ .
- the composite substrate was evaluated by immersion in HCl (10%), NaOH (10%) aqueous solution, MEK, and IPA solvent for 10 minutes. Afterwards, the appearance defects such as lifting and cracking of the composite substrate and color change of the insulating layer were observed. At this time, the case of appearance defects such as lifting and cracking was determined as NG, and the case of appearance defects such as lifting and cracking was judged as Pass. In addition, it was determined that the chemical resistance was good when the peel strength was 70% or more compared to the peel strength before immersion.
- Samples were prepared by removing all of the copper foil by etching the composite substrate.
- the flame retardance of the sample was measured. The case where the flame retardance that satisfies the UL94V-0 standard was evaluated as "good” and represented by ⁇ , and the case where the sample did not satisfy the UL94VTM-0 standard was evaluated as "bad” and represented by x.
- Permeability of the composite substrate for antenna module formation was evaluated according to the magnetic filler content.
- the magnetic permeability measurement method includes coil inductance measurement method, 1-2th coil coupling coefficient measurement method, LCR meter measurement method, antenna reflection coefficient, impedance analyzer, and network analyer measurement method.
- the coil inductance measuring method, the 1-2th coil coupling coefficient measuring method, and the LCR meter measuring method are measured at a relatively low frequency band, and the other three methods are capable of measuring up to a high frequency band.
- the measurement of permeability described above is usually very demanding, so a 5-50% error is known to be common.
- the magnetic permeability was measured in the 3 MHz frequency band using an expensive Impedance / Material Analyzer (E4991A) for more accurate measurement, and the results are shown in Table 4 below.
- the composite substrate according to the present invention can adjust the magnetic permeability by changing the content of the magnetic filler (magnetic powder). Accordingly, the composite substrate according to the present invention was found to be able to replace the conventional ferrite sheet by forming a composite material according to the frequency band to be used.
- Example 8 Example 9 Example 10 Example 4 Example 11 Magnetic filler content (wt%) 80 83 86 89 92 Permeability 100 150 180 200 230
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Abstract
Description
실시예1 | 실시예2 | 실시예3 | 실시예4 | 실시예5 | 실시예6 | 실시예7 | ||
접착제 배합비 | 에폭시1 | 100 | 100 | 100 | 100 | 100 | 100 | 0 |
열가소성 수지2 | 50 | 50 | 50 | 60 | 60 | 70 | 0 | |
무기충전제3 | 10 | 15 | 20 | 15 | 20 | 15 | 0 | |
경화제4 | 10 | 10 | 10 | 10 | 10 | 10 | 0 | |
특성 | 접착력( kgf/cm2 ) | 1.2 | 1.3 | 1.4 | 1.5 | 1.4 | 1.4 | 0.7 |
내열성(@300℃) | O | O | O | O | O | O | O | |
난연성(UL 94 V-0) | O | O | O | O | O | O | O |
단위 | ||
총 두께 | ㎛ | 145 |
자성시트 두께 | ㎛ | 60 |
투자율(magnetic permeability) | - | 200 |
박리 강도(Peel Strength) | kgf/cm2 | 1.50 |
내열성(Solder floating) | 288℃,10 sec | Pass |
내화학성(chemical resistance) | 10% NaOH, 10% HCl, MEK, IPA | Pass |
단위 | 복합 소재 | |
자성시트 두께 | ㎛ | 60 |
투자율(magnetic permeability) | 투자율(μ′) | 200 |
투자 손실(μ″) | < 50 |
실시예 8 | 실시예 9 | 실시예 10 | 실시예4 | 실시예 11 | |
자성 필러 함량(wt%) | 80 | 83 | 86 | 89 | 92 |
투자율 | 100 | 150 | 180 | 200 | 230 |
Claims (18)
- 제1동박층을 갖는 제1비(非)자성 기판;제2동박층을 갖는 제2비(非)자성 기판; 및상기 제1비자성 기판과 제2비자성 기판 사이에 배치되고, 상기 비자성 기판들과 일체로 합지된 자성시트를 포함하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 복합기판은 롤투롤 방식을 통해 일체화되어 길이방향으로 연속하는 롤(roll) 형태인 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 자성시트는 자성 분말과 고분자 수지를 포함하는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제3항에 있어서,상기 자성 분말은, 자성을 띠는 금속 분말, 금속 플레이크(flake) 및 페라이트로 이루어진 군에서 선택되는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제3항에 있어서,상기 고분자 수지는, 비할로겐계 에폭시수지, 실리콘, 우레탄, 폴리이미드, 및 폴리아미드로 구성된 군에서 선택되는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제3항에 있어서,상기 자성시트는 당해 자성시트의 전체 중량을 기준으로 70 내지 95 중량%의 자성분말을 포함하며,투자율(透磁率)이 50 내지 250 인 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 제1비(非)자성 기판과 제2(非)비자성 기판은, 각각 제1절연성 접착층과 제2절연성 접착층을 더 포함하는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제7항에 있어서,상기 복합기판은,(i) 제1동박층, 제1절연성 접착층, 자성시트, 제2절연성 접착층, 및 제2동박층을 포함하거나,(ii) 제1동박층, 제1절연성 접착층, 자성시트, 및 제2동박층을 포함하거나,(iii) 제1동박층, 자성시트, 제2절연성 접착층, 및 제2동박층을 포함하거나, 또는(iv) 제1동박층, 자성시트, 및 제2동박층을 포함하며, 이들이 순차적으로 적층된 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 제1 및 제2 비자성 기판은, 각각 연성 동박 적층판(FCCL) 또는 연성 인쇄회로기판(FPCB)인 것을 특징으로 하는 안테나 모듈 형성용 복합 기판.
- 제7항에 있어서,상기 제1 및 제2절연성 접착층은, 각각 폴리이미드 및 에폭시 수지로 구성된 군에서 선택되는 고분자 수지로 이루어지는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제10항에 있어서,상기 제1 및 제2절연성 접착층은, 각각 열가소성 수지, 무기충전제, 및 경화제로 구성된 군에서 선택되는 1종 이상을 더 포함하는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 복합기판에서 자성시트에 대한 절연성 접착층의 박리강도(Peel Strength) 값은 0.6 내지 3.0 kgf/cm2 인 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제8항에 있어서,상기 자성시트의 두께는 20 내지 150 ㎛ 범위이며,제1동박층과 제2동박층의 두께는 각각 6 내지 105 ㎛ 범위이며,제1절연성 접착층과 제2절연성 접착층의 두께는 각각 1 내지 30 ㎛ 범위인 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 복합기판의 총 두께는 34 내지 420 ㎛ 범위인 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제1항에 있어서,상기 제1동박층과 제2동박층은, 소정의 면적, 선폭과 형상을 갖는 제1안테나 패턴부와 제2안테나 패턴부를 각각 형성하는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제15항에 있어서,상기 복합기판은 제1비자성 기판, 자성시트 및 제2비자성 기판을 관통하는 관통홀을 하나 이상 포함하며, 상기 관통홀을 통해 제1안테나 패턴부와 제2안테나 패턴부가 서로 연결되는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- 제15항에 있어서,상기 복합기판은 WPC 안테나 패턴, MST 안테나 패턴 및 NFC 안테나 패턴 중 적어도 1개의 안테나 패턴을 포함하는 것을 특징으로 하는 안테나 모듈 형성용 복합기판.
- (i) 제1동박층과 제2동박층의 일면 상에 절연성 접착층 형성용 열경화성 조성물을 각각 코팅 및 건조하는 단계; 및(ii) 상기 제1동박층의 절연성 접착층과 제2동박층의 절연성 접착층 사이에 자성시트를 개재시킨 후, 롤라미네이션(Roll Lamination)을 적용하여 합지하는 단계를 포함하는 제1항의 안테나 모듈 형성용 복합기판의 제조방법.
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CN108605423A (zh) | 2018-09-28 |
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