WO2017140092A1 - 基于一体封装工艺的摄像模组及其一体基座组件和制造方法 - Google Patents
基于一体封装工艺的摄像模组及其一体基座组件和制造方法 Download PDFInfo
- Publication number
- WO2017140092A1 WO2017140092A1 PCT/CN2016/092020 CN2016092020W WO2017140092A1 WO 2017140092 A1 WO2017140092 A1 WO 2017140092A1 CN 2016092020 W CN2016092020 W CN 2016092020W WO 2017140092 A1 WO2017140092 A1 WO 2017140092A1
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- WO
- WIPO (PCT)
- Prior art keywords
- camera module
- circuit board
- motor
- base portion
- lens
- Prior art date
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Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
Definitions
- the invention relates to the field of camera modules, and further relates to a camera module based on an integrated packaging process and an integrated base assembly and a manufacturing method thereof.
- the COB (Chip on Board) process is an extremely important process in the assembly and manufacture of camera modules.
- the structure of the conventional COB process camera module is assembled by components such as a circuit board, a photosensitive chip, a mirror holder, a motor drive, and a lens.
- FIG. 1 it is a schematic diagram of a camera module manufactured by a conventional COB process.
- the camera module includes a circuit board 1P, a light sensor chip 2P, a bracket 3P, a filter 4P, a motor 5P and a lens 6P.
- the photosensitive chip 2P is mounted on the wiring board 1P
- the filter 4P is mounted on the bracket 3P
- the lens 6P is mounted to the motor 5P
- the motor 5P is mounted to the bracket 3P so that the lens 6P is located Above the photosensitive chip 2P.
- circuit devices 11P such as resistors, capacitors, etc.
- circuit board 1P some circuit devices 11P, such as resistors, capacitors, etc.
- circuit board 1P has the circuit device 11P, and the assembly coordination relationship between the circuit board 1P, the circuit device 11P and the bracket 3P in the conventional COB process has some disadvantages, and the camera is limited to some extent.
- the circuit device 11P is directly exposed to the surface of the circuit board 1P, so that in the subsequent assembly process, for example, the process of attaching the bracket 3P and soldering the motor 5P is inevitably affected, during soldering.
- the solder resist, dust, and the like are easily adhered to the circuit device 11P, and the circuit device 11P and the photosensitive chip 2P are located in a space in which the mutual contact is made, so that dust contaminants easily affect the photosensitive chip 2P, and such influence may cause assembly.
- the camera module has black spots and other undesirable phenomena, which reduces the yield of the product.
- the bracket 3P is located outside the circuit device 11P, so when mounting the lens holder and the circuit board 1P, it is necessary to reserve a certain safety distance between the bracket 3P and the circuit device 11P, and in the horizontal direction and The safety distance needs to be reserved in the upward direction, which increases the demand for the thickness of the camera module to a certain extent, making it difficult to reduce the thickness.
- the bracket 3P is pasted to the circuit board 1P by a glue or the like, and an AA (Active Arrangement) process is usually performed when pasting, that is, the bracket 3P and the circuit board are adjusted.
- 1P and the central axis of the motor 5P are made to be consistent in the horizontal direction and the vertical direction. Therefore, in order to satisfy the AA process, it is necessary to pre-determine between the bracket 3P and the circuit board 1P and between the mirror base and the motor 5P. Set more glue so that there is room for adjustment between each other, and On the one hand, this requirement increases the thickness requirement of the camera module to a certain extent, so that the thickness thereof is difficult to reduce. On the other hand, the multiple-paste assembly process easily causes the tilt of the assembly to be inconsistent, and
- the flatness of the lens holder 3P, the wiring board 1P, and the motor 5P is required to be high.
- the circuit board 1P provides the most basic fixing and supporting carrier, and therefore, the circuit board 1P itself is required to have a certain structural strength, and this requirement makes the circuit board 1P have a large thickness, thereby On the other hand, the thickness requirement of the camera module is added.
- camera modules are increasingly moving toward high performance, lightness and thinness, and in the face of high-performance development requirements such as high pixel and high image quality, electronic circuits in circuits More and more components, larger and larger chip areas, and more passive components such as drive resistors and capacitors, which make the specifications of electronic devices larger and larger, the difficulty of assembly increases, and the overall size of camera modules
- An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly and a manufacturing method thereof, wherein the circuit board assembly includes a molding portion and a wiring board portion, and the molding portion is molded In the circuit board section.
- An object of the present invention is to provide a molding module based on a molding process and a molded wiring board assembly therefor, and a manufacturing method thereof, wherein the molded wiring board assembly includes at least one circuit component, the circuit component being wrapped around the circuit board assembly It is not directly exposed to the external environment.
- An object of the present invention is to provide a molding module based on a molding process and a molded wiring board assembly therefor, and a manufacturing method thereof, wherein the molded circuit board assembly includes a molding portion and a wiring board portion, and the molding portion mold The circuit board portion is molded, and the circuit component disposed on the wiring portion is moldedly wrapped.
- An object of the present invention is to provide a camera module based on a molding process, a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board portion includes a circuit board body and a photosensitive chip, and the chip is disposed on the circuit board The inner surface, the molding portion surrounds the outer side of the photosensitive chip.
- An object of the present invention is to provide a camera module based on a molding process, a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board body has an inner ring groove, and the photosensitive chip is disposed in the inner ring groove. Thereby, the height requirement for the molded portion can be reduced.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly therefor, and a method of manufacturing the same, wherein the circuit board body has a chip path adapted to be received from the back side of the circuit board main body
- the installation and the photosensitive area of the photosensitive chip face the front side, which provides a more convenient installation method of flipping the photosensitive chip.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein a filter is mounted on an inner port of the chip channel of the main body of the circuit board, thereby eliminating the need for Provide an additional location to mount the filter.
- An object of the present invention is to provide a camera module based on a molding process, and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit body has at least one reinforcing hole, and the molding portion extends to the reinforcing hole, thereby increasing the The bonding force of the molded portion and the wiring board portion, and the structural strength of the wiring board main body is increased by the molding portion.
- An object of the present invention is to provide a camera module based on a molding process and a molded wiring board assembly and a manufacturing method thereof, wherein the molding portion includes a support table adapted to support the filter to provide the filter The installation location of the piece.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein a molded portion is adapted to be mounted with a motor assembly or a lens, which can be used as a conventional bracket. Providing the motor assembly or the support fixed position of the lens.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the molding portion replaces a conventional bracket, so that assembly and assembly of the bracket and the circuit board are not required during assembly. Process to increase process accuracy.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module is assembled from the molded circuit board assembly, and can have a smaller thickness and have A camera module with better performance.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module is assembled and manufactured by molding, thereby changing the COB process of the conventional camera module. .
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly therefor, and a manufacturing method thereof, wherein the camera module includes a seat, and the holder is mounted to the molding portion The filter is mounted to the holder.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly therefor, and a manufacturing method thereof, the lens comprising a lens barrel, the filter being mounted in the lens barrel, thereby There is no need to provide additional components to mount the filter.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the filter is mounted on an upper end of the chip path, thereby reducing the camera module Back focus.
- An object of the present invention is to provide a camera module based on a molding process, a molded wiring board assembly and a manufacturing method thereof, wherein the base portion is integrally packaged to the wiring board portion, and the molding portion
- the structural strength requirement can be achieved with a small thickness, so that the longitudinal dimension of the camera module can be reduced.
- An object of the present invention is to provide a camera module based on a molding process, a molded circuit board assembly and a manufacturing method thereof, wherein, in manufacturing the camera module, a plurality of the moldings are simultaneously packaged in one package.
- the board realizes the jigsaw operation of the camera module and improves production efficiency.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board portion includes a reinforcing layer which is laminated on the bottom of the circuit board main body To enhance the structural strength and heat dissipation performance of the circuit board body.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board set thereof And a manufacturing method, wherein the molding portion includes a lens mounting portion adapted to mount a lens of the camera module to provide a stable mounting position for the lens.
- An object of the present invention is to provide a molding module based on a molding process, and a molded wiring board assembly and a manufacturing method thereof, wherein the molding portion molds a side surface and a bottom surface of the wiring board main body to enhance the image capturing mold The structural strength of the group.
- An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly thereof
- An aspect of the present invention provides a camera module, including:
- At least one lens At least one lens
- At least one photosensitive chip At least one photosensitive chip
- At least one filter At least one filter
- At least one integral base assembly At least one integral base assembly
- At least one seat At least one seat
- the integrated base assembly includes a base portion and a circuit board portion, the base portion is integrally packaged on the circuit board portion, and the photosensitive chip is mounted on the circuit board portion, the base portion Forming at least one through hole for providing a light path for the photosensitive chip, the lens is located in a light path of the photosensitive chip, the holder is mounted on the base portion, and the filter is mounted on the branch And a light path located in the photosensitive chip.
- the holder has a first seating groove on the top side, the first seating groove is in communication with the through hole, and the filter is mounted on the first seating groove.
- the mount has a second seating groove on the bottom side to engage the top end of the base portion.
- the base portion has a mounting slot, the mounting slot is in communication with the through hole, and the mount is mounted to the mounting slot.
- the base portion has a mounting groove, and the mounting groove communicates with the through hole.
- the base portion forms a platform to which the mount is mounted.
- the mounting groove has at least one notch that communicates the through hole with the outside, and the support includes at least one extended edge, and the extended edge is adapted to be overlapped with the notch.
- the mounting slot has at least one indentation forming a U-shaped structure, the abutment portion including at least one extended edge that fills an opening of the U-shaped structure.
- the unitary base assembly includes at least one circuit component that encases the circuit component.
- the lens is at least partially mounted to the mount.
- the camera module includes at least one motor mounted to the motor, the motor being at least partially mounted to the mount.
- the lens is mounted to the base portion.
- the camera module includes at least one motor mounted to the motor, the motor being mounted to the base portion or mounted to the mount.
- the integrated package is in a molded, one-piece package.
- the unitary base assembly includes an annular barrier element disposed on the circuit board portion and the barrier element is at least partially integrally encapsulated by the base portion.
- the base portion has at least one first inner side surface integrally extending from the circuit board portion, forming at least a portion of the through hole, the first inner side surface being inclined upward extend.
- the first inner side has an inclination angle ⁇ with the optical axis of the camera module, wherein the size of ⁇ ranges from 3° to 85°.
- the first inner side surrounds a lower end of the through hole, and an inner diameter of the lower end of the through hole gradually increases from bottom to top.
- the base portion has a second inner side surface, the second side surface is bent and extended from the first inner side surface, and the second inner side surface surrounds an upper end of the through hole.
- the second inner side surface extends upward in an inclined shape.
- the second inner side has an inclination angle ⁇ with the optical axis of the camera module, wherein the size of ⁇ ranges from 3° to 45°.
- the base portion has an outer side surface that is integrally inclined upwardly from the circuit board portion and has an inclination angle ⁇ between the optical axis of the camera module, wherein the size of ⁇ The range is from 3° to 45°.
- the present invention provides a camera module including:
- At least one lens At least one lens
- At least one sensor chip At least one sensor chip
- At least one integral base assembly At least one integral base assembly
- the integrated base assembly includes a base portion and a circuit board portion, the base portion is integrally connected to the circuit board portion, and the photosensitive chip is mounted on the circuit board portion, the base Forming at least one through hole for providing a light path for the photosensitive chip, the lens is located in a light path of the photosensitive chip, the base portion has at least a first inner side surface, forming at least a part of the through hole, The first inner side surface extends upward in an inclined manner.
- the present invention provides a camera module including:
- At least one lens At least one lens
- At least one sensor chip At least one sensor chip
- At least one integral base assembly At least one integral base assembly
- the integrated base assembly includes a base portion and a circuit board portion, the base portion is molded on the circuit board portion, and the base portion forms at least one through hole for the photosensitive chip and The lens provides a light path.
- the base portion has a top surface that extends in a planar manner.
- the base portion has a mounting groove, the mounting groove communicates with the through hole, and the base portion includes at least one raised step, the raised step forming the mounting groove.
- the circuit board portion includes at least one side, and the base covers at least one of the side surfaces of the circuit board portion.
- the base portion further covers a bottom portion of the circuit board portion.
- the base portion has two mounting slots in sequence along the optical axis direction of the camera module, and each of the mounting slots communicates with the through hole such that a stepped structure is formed inside the base portion.
- the camera module includes at least one filter, the filter being mounted to the top surface such that the filter is mounted flat.
- the lens is mounted to the top surface.
- the camera module includes at least one motor mounted to the motor, the motor being mounted to the top surface of the base portion.
- the camera module includes at least one filter, and the filter is mounted to the mounting slot.
- the lens is mounted to the raised step.
- the camera module includes at least one motor mounted to the motor, the motor being mounted to the raised step.
- the camera module includes a filter that is mounted to the mounting slot at a lower position.
- the lens is mounted to the mounting slot in the upper position.
- the base portion extends integrally upward from the mounting slot in a higher position to form a lens inner wall.
- the inner surface of the lens is flat and adapted to mount an unthreaded lens.
- At least one lens mount mounted to the base portion, the lens mount being adapted to mount the lens.
- the camera module includes at least one seat and at least one filter, the holder is mounted to the mounting slot, and the filter is mounted to the holder.
- the wiring board portion has an inner groove communicating with the through hole, and the photosensitive chip is housed in the inner groove.
- the lens includes a lens barrel and at least one lens, each of the lenses being mounted to the lens barrel, the filter being mounted to the lens barrel, below the lens.
- the camera module includes at least one motor and at least one filter, the filter is mounted to the motor, the lens is mounted to the motor, and the filter is located at the filter Above.
- the unitary base assembly includes at least one circuit component that encases the circuit component.
- the circuit component is selected from the group consisting of: one or more of a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, a processor, and a memory.
- the wiring board portion has at least one via that communicates with both sides of the wiring board portion, and the photosensitive chip is mounted to the via.
- the circuit board portion has a reinforcement hole, and the base portion extends into the reinforcement hole.
- the circuit board portion includes a reinforcement layer, and the laminate is disposed on the bottom of the circuit board portion unit.
- the circuit board portion includes a shielding layer wrapped around the camera module.
- the circuit board portion includes a shielding layer surrounding the inner side of the base portion.
- the circuit board portion includes a circuit board body material selected from the group consisting of: a combination of a soft and hard bonding board, a ceramic substrate, and a PCB hard board.
- the base portion material is selected from the group consisting of: one or more of nylon, LCP, PP, and resin.
- the molding portion molding process is an insert molding or a molding process.
- the photosensitive chip is electrically connected to the wiring board portion through at least one connecting wire.
- the present invention provides a camera module including:
- At least one lens At least one lens
- At least one photosensitive chip At least one photosensitive chip
- At least one integral base assembly At least one integral base assembly
- At least one motor At least one motor
- the integrated base assembly includes a base portion and a circuit board portion, the base portion is integrally packaged on the circuit board portion, the photosensitive chip is mounted on the circuit board portion, and the lens is located at the a photosensitive path of the photosensitive chip, the base portion forming a through hole, providing a light path for the photosensitive chip;
- the integrated base assembly includes at least one motor connection structure, the motor connection structure is preset to the base portion, and the motor is electrically connected to the circuit board portion through the motor connection structure, and the lens is Mounted to the motor to facilitate adjustment of the lens by the motor.
- the circuit board portion includes a circuit board body that is integrally molded to the circuit board body in a molded manner.
- the motor connection structure includes at least one lead wire and at least one lead slot
- the lead wire is disposed on the base portion, and is electrically connected to the circuit board main body
- the pin slot is Provided at an upper end of the base portion, the lead includes a motor connection end, the motor connection end is exposed on the bottom wall of the slot, so that at least one motor pin of the motor is plugged into the pin
- the slot is electrically connected to the motor connection end.
- the motor connection structure includes at least one lead slot and at least one circuit contact, the circuit contact is electrically connected to the circuit board main body, and the pin slot is disposed on the base portion. Extending from the circuit board body to a top end of the base portion, and the circuit contacts are exposed in the pin slots, so that when at least one motor pin of the motor is plugged into the pin slot Connected to the circuit contacts.
- the motor connection structure includes at least one engraving line disposed on the base portion and electrically connected to the circuit board body to facilitate electrical connection of a motor pin.
- the base portion has a thickness ranging from 0.3 to 1.2 mm.
- the camera module has a lateral cross-sectional dimension ranging from 5 to 20 mm.
- the height of the camera module ranges from 3 to 6 mm.
- the thickness of the circuit board portion ranges from 0.15 to 0.5 mm.
- the base portion is adjacent to the outside of the photosensitive chip, thereby expanding the The thickness of the base portion is such that the base portion and the circuit board portion have stronger connection fastness.
- the present invention provides an integrated base assembly that utilizes a camera module that includes:
- the base portion is integrally packaged in the circuit board portion, a photosensitive chip of the camera module is adapted to be mounted on the circuit board portion, and the base portion forms at least one through hole for providing the photosensitive chip A light path, the lens being located in a light path of the photosensitive chip.
- the unitary base assembly includes at least one circuit component that encases the circuit component.
- the integral base assembly includes at least one circuit component, and the circuit component is located inside the base portion, the base portion not covering the circuit component.
- FIG. 1 is a cross-sectional view of a camera module of a conventional COB packaging process.
- FIG. 2 is a cross-sectional view of a camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 3 is a schematic exploded view of a camera module in accordance with a first preferred embodiment of the present invention.
- FIG. 4 is a partially enlarged view of a camera module in accordance with a first preferred embodiment of the present invention.
- Figure 5 is a schematic view showing the process of forming a molded circuit assembly of a camera module in accordance with a first preferred embodiment of the present invention.
- Figure 6A is a cross-sectional view showing a first modified embodiment of a molded wiring board assembly of a camera module according to a first preferred embodiment of the invention.
- Figure 6B is a partially enlarged schematic view showing a first modified embodiment of the molded wiring board assembly of the camera module in accordance with the first preferred embodiment of the present invention.
- Figure 7A is a cross-sectional view showing a second modified embodiment of a molded wiring board assembly of a camera module in accordance with a first preferred embodiment of the present invention.
- Figure 7B is a partially enlarged schematic view showing a second modified embodiment of the circuit board assembly of the camera module in accordance with the first preferred embodiment of the present invention.
- Figure 8A is a cross-sectional view showing a third modified embodiment of the wiring board assembly of the camera module in accordance with the first preferred embodiment of the present invention.
- Figure 8B is a partial enlarged view of a third modified embodiment of the circuit board assembly of the camera module in accordance with the first preferred embodiment of the present invention.
- FIG. 9 is a cross-sectional view of a camera module in accordance with a second preferred embodiment of the present invention.
- Figure 10 is a schematic exploded view of a camera module in accordance with a second preferred embodiment of the present invention.
- Figure 11 is a partially enlarged view of a camera module in accordance with a second preferred embodiment of the present invention.
- Figure 12 is a cross-sectional view of a camera module in accordance with a third preferred embodiment of the present invention.
- Figure 13 is a schematic view showing the process of forming a molded circuit assembly of a camera module in accordance with a third preferred embodiment of the present invention.
- Figure 14 is a cross-sectional view showing a camera module in accordance with a fourth preferred embodiment of the present invention.
- Figure 15 is an exploded view of a camera module in accordance with a fourth preferred embodiment of the present invention.
- Figure 16 is a cross-sectional view showing a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.
- Figure 17 is a perspective exploded view of a camera module based on a molding process in accordance with a fifth preferred embodiment of the present invention.
- Figure 18A is another embodiment of a molding process based camera module in accordance with a fifth preferred embodiment of the present invention.
- Figure 18B is another embodiment of a molding process based camera module in accordance with a fifth preferred embodiment of the present invention.
- Figure 18C is another embodiment of a molding process based camera module in accordance with a fifth preferred embodiment of the present invention.
- Figure 19 is a cross-sectional view showing a camera module based on a molding process in accordance with a sixth preferred embodiment of the present invention.
- Figure 20 is a cross-sectional view showing a camera module based on a molding process in accordance with a seventh preferred embodiment of the present invention.
- Figure 21 is a schematic cross-sectional view showing an image forming process based on a molding process in accordance with an eighth preferred embodiment of the present invention.
- Figure 22 is a cross-sectional view showing a camera module based on a molding process in accordance with a ninth preferred embodiment of the present invention.
- Figure 23 is a cross-sectional view showing a camera module based on a molding process in accordance with a tenth preferred embodiment of the present invention.
- Figure 24 is a cross-sectional view showing a camera module based on a molding process in accordance with an eleventh preferred embodiment of the present invention.
- 25A and 25B are schematic cross-sectional views showing different angles of a camera module based on a molding process in accordance with a twelfth preferred embodiment of the present invention.
- Figure 26 is a partial perspective view of a camera module based on a molding process in accordance with a twelfth preferred embodiment of the present invention.
- Figure 27 is a cross-sectional view showing a camera module based on an integrated packaging process in accordance with a thirteenth preferred embodiment of the present invention.
- Figure 28 is a schematic illustration of the manufacturing process of an integral base assembly in accordance with a thirteenth preferred embodiment of the present invention.
- Figure 29 is a schematic illustration of a method of manufacturing an integrated base assembly in accordance with a thirteenth preferred embodiment of the present invention.
- FIG. 30 is another embodiment of a camera module based on an integrated packaging process in accordance with a thirteenth preferred embodiment of the present invention.
- 31A, 31B, 31C, and 31D are different embodiments of a camera module based on an integrated packaging process and a motor connection structure thereof according to a fourteenth preferred embodiment of the present invention.
- FIG. 32 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof according to a fifteenth preferred embodiment of the present invention.
- FIG 33 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a sixteenth preferred embodiment of the present invention.
- Figure 34 is a cross-sectional view showing a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a seventeenth preferred embodiment of the present invention.
- 35 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with an eighteenth preferred embodiment of the present invention.
- FIG. 36 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a nineteenth preferred embodiment of the present invention.
- FIG. 37 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a twentieth preferred embodiment of the present invention.
- FIG. 38 is a cross-sectional view of a camera module and an integrated base assembly thereof based on an integrated packaging process in accordance with a twenty-first preferred embodiment of the present invention.
- 39 is a cross-sectional view of a camera module based on an integrated packaging process and an integrated base assembly thereof in accordance with a twenty-second preferred embodiment of the present invention.
- FIG. 40 is another embodiment of a camera module based on an integrated packaging process in accordance with a twenty-second preferred embodiment of the present invention.
- 41 is a schematic diagram showing the structural strength comparison between an imaging and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.
- FIG. 42 is a schematic diagram showing the horizontal dimension comparison of a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention.
- FIG. 43 is a schematic diagram showing the height comparison between the camera module and the conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.
- Figure 44 is a schematic illustration of the flatness of a camera module based on an integrated packaging process in accordance with the above-described preferred embodiment of the present invention.
- 45 is a schematic diagram showing the comparison of imaging quality of a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention.
- 46A and 46B are schematic diagrams showing a comparison of a manufacturing process of a camera module and a conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.
- Figure 47 is a side cross-sectional view of a camera module based on an integrated packaging process in accordance with a twenty-third preferred embodiment of the present invention.
- Figure 48 is a side cross-sectional view of a camera module based on an integrated packaging process in accordance with a twenty-fourth preferred embodiment of the present invention.
- Figure 49A is a schematic view of a molded image forming module formed by a comparative technique.
- Figure 49B is a schematic view of a conventional molded image forming module in the comparative art.
- Figure 49C is a schematic view of a conventional molded image forming module in the comparative art.
- Figure 49D is a schematic view of a conventional molded image forming module in the comparative art.
- Figure 49E is a schematic view of a conventional molded image forming module in the comparative art.
- Figure 50 is a cross-sectional view showing a camera module of a twenty-fifth preferred embodiment of the present invention.
- Figure 51 is a perspective view of a molded wiring board assembly of a camera module in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 52 is a perspective view showing a tilt angle of a molded wiring board assembly of a camera module according to a twenty-fifth preferred embodiment of the present invention.
- Figure 53 is a schematic view of a light ray of a camera module in accordance with a twenty-fifth preferred embodiment of the present invention.
- 54A and 54B are schematic views showing a manufacturing process of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 55 is a schematic illustration of the demolding process of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 56 is a variant embodiment of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 57 is another modified embodiment of a molded wiring board assembly in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 58 is a schematic diagram of an application of a camera module in accordance with a twenty-fifth preferred embodiment of the present invention.
- Figure 59 is a variant embodiment of a camera module in accordance with a twenty-first preferred embodiment of the present invention.
- the term “a” is understood to mean “at least one” or “one or more”, that is, in one embodiment, the number of one element may be one, and in other embodiments, the element The number can be multiple, and the term “a” cannot be construed as limiting the quantity.
- the camera module can be applied to various electronic devices to assist in the shooting activities through the camera module.
- the camera module can be used to capture images or video images of objects or people.
- the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be, but not limited to, a mobile phone, a tablet device, a television, an intelligent vehicle, an intelligent monitoring device, and the like.
- the camera module can be a dynamic focus camera module including a molded circuit board assembly 1010, a lens 1050, a motor 1060, and a sensor chip 1030.
- a dynamic focus camera module including a molded circuit board assembly 1010, a lens 1050, a motor 1060, and a sensor chip 1030.
- the camera module can be embodied as a fixed focus camera module without the motor.
- the lens may be mounted to a lens holder and then mounted to the molded circuit board assembly.
- the motor 1060 is mounted to the molded wiring board assembly 1010, and the lens 1050 is mounted to the motor 1060 such that the lens 1050 is supported above the molded wiring board assembly 1010.
- the molded wiring board assembly 1010 includes a molding portion 1011 and a wiring board portion 1012, and the molding portion 1011 is molded to connect the wiring board portion 1012.
- the circuit board portion 1012 includes a circuit board main body 10121.
- the photo sensor chip 1030 is disposed on the circuit board main body 10121 and located inside the molding portion 1011.
- the motor 1060 is mounted on the molding portion 1011 of the molded wiring board assembly 1010 and electrically connected to the wiring board portion 1012, and the lens 1050 is mounted to the motor 1060.
- the lens 1050 can be adapted by the motor 1060 to auto focus.
- the lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the sensor chip. 1030 is received to be suitable for photoelectric conversion.
- the circuit board portion 1012 includes a photosensitive circuit and at least one circuit component 10122.
- the photosensitive circuit is preset in the circuit board main body 10121, and the circuit component 10122 is electrically connected to the photosensitive circuit and the photosensitive chip 1030 for the photosensitive operation process of the photosensitive chip 1030.
- the circuit component 10122 can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the motor 1060 when assembling the image forming mold, is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the motor pin 1061 is soldered to The circuit board main body 10121.
- the molding portion 1011 can enclose the circuit component 10122 inside, thus making the circuit component 10122 not directly exposed to the space, more specifically, not exposed to the In the closed environment in which the photosensitive chip 1030 communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive chip.
- the molding portion 1011 forms a through hole 101100 such that the molding portion 1011 surrounds the outside of the photosensitive chip 1030 and provides a light path of the lens 1050 and the photosensitive chip 1030. In other words, the molding portion forms a light window for the photosensitive chip, and in the camera module, light passing through the lens 1050 further passes through the light window to reach the photosensitive chip.
- the molding portion 1011 envelops the circuit component 10122 has the advantages of protecting the circuit component 10122 and corresponding performance improvement of the camera module, but those skilled in the art should understand that The molding portion 1011 is not limited to wrapping the circuit component 10122. That is, in other embodiments of the present invention, the molding portion 1011 may be directly molded to the wiring board of the circuit component 10122 which is not protruded, or may be molded to the outside of the circuit component 10122. Different locations, such as around, or embedded in the interior of the board body 10121.
- the molding portion 1011 is convexly surrounding the outside of the photosensitive chip 1030, and in particular, the molding portion 1011 is integrally closed and connected to have The sealing property is good, so that when the motor 1060 is mounted on the molding portion 1011, the photosensitive chip 1030 is sealed inside to form a closed inner space.
- a conventional wiring board may be used as the wiring board main body 10121, and the surface of the wiring board main body 10121 may be molded, such as by an injection molding machine, by insert molding ( Insert molding process).
- the wiring board after the SMT process Surface Mount Technology surface mount process is molded to form the molding portion 1011, or the molding portion 1011 is formed by a molding process commonly used in a semiconductor package.
- the circuit board main body 10121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molding portion 1011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding material 1011 can be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process can be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the motor 1060 is mounted on the molding portion 1011 of the molded wiring board assembly 1010, so that the molding portion 1011 is equivalent to the function of the bracket in the conventional camera module.
- the motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes.
- the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011 is fixed to the circuit board main body 10121 by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted.
- the fixing has better connection stability and controllability of the process, and there is no need to reserve an AA-adjusted glue space between the molding portion 1011 and the circuit board main body 10121, thereby reducing the conventional camera module AA.
- the adjusted reserved space is such that the thickness of the camera module is reduced; on the other hand, the molding portion 1011 is wrapped around the circuit component 10122, so that the conventional bracket function and the circuit component can be spatially overlapped, It is required to reserve a safe distance around the circuit device like a conventional camera module, so that the height of the molding portion 1011 having a bracket function can be set in a small range, thereby further providing a reduction in the thickness of the camera module. space.
- the molding portion 1011 replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly, and reduces the cumulative tolerance of the assembly of the camera module.
- the molding portion 1011 includes a support table 10111, and the support table 10111 is adapted to mount a filter 1040 such that the filter 1040 is located above the photosensitive chip 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive chip 1030.
- the filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).
- the support table 10111 of the molding portion 1011 forms an inner ring groove 10113 to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011 replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011, the filter 1040 and the circuit component 10122 are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030, so that the imaging mode The group is minimized. At the same time, by means of the molding process, the molding portion 1011 is provided with the flat support table 10111, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.
- the inner ring groove 10113 has an L-shaped cross section and communicates with the through hole 101100 of the molding portion 1011 so that the filter 1040 is supported and mounted on the photosensitive chip 1030. path.
- the photosensitive chip 1030 is connected to the wiring board main body 10121 through a series of leads 1031, and is electrically connected to the photosensitive circuit.
- the lead 1031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 1031 of the photosensitive chip 1030 may be connected to the circuit board body 10121 by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection between the photosensitive chip 1030 and the circuit board main body 10121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection between the photosensitive chip 1030 and the circuit board main body 10121 can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- the photosensitive chip 1030 is disposed on the upper surface of the circuit board main body 10121, such as attached to the upper surface, and the molding portion 1011 surrounds the The outside of the photosensitive chip 1030, when manufacturing the molded wiring board assembly 1010, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the circuit board main body 10121 may be first installed.
- the photosensitive chip 1030, and then outside the photosensitive chip 1030, the edge position of the wiring board main body 10121, molding the molding portion 1011, and protruding the circuit component of the wiring board main body 10121 10122 is wrapped inside it.
- the edge position of the circuit board main body 10121 may be first molded to form the molding portion 1011, and the circuit protruding from the circuit board main body 10121 may be formed.
- the element 10122 is wrapped inside, and then the photosensitive chip 1030 is mounted on the wiring board main body 10121 so as to be located inside the molding portion 1011.
- the molded wiring board assembly 1010A includes a molding portion 1011A and a wiring board portion 1012A, and the molding portion 1011A is molded to connect the wiring board portion 1012A.
- the circuit board portion 1012A includes a circuit board main body 10121A, and the photo sensor chip 1030 is disposed on the circuit board main body 10121A and located inside the molding portion 1011A.
- the motor 1060 is mounted on the molding portion 1011A of the wiring board assembly 10A, and is electrically connected to the wiring board portion 1012A, and the lens 1050 is mounted to the motor 1060, and The lens 1050 can be adjusted by the motor 1060 to be suitable for autofocus.
- the lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the sensor chip. 1030 is received to be suitable for photoelectric conversion.
- the circuit board portion 1012A includes a light sensing circuit and at least one circuit component 10122A.
- the photosensitive circuit is preset in the circuit board main body 10121A, and the circuit component 10122A is electrically connected
- the photosensitive circuit and the photosensitive chip 1030 are used for the photosensitive operation of the photosensitive chip 1030.
- the circuit component 10122A can be, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the motor 1060 when assembling the image forming mold, is electrically connected to the photosensitive circuit through at least one motor pin 1061A, and the motor pin 1061A is soldered to The circuit board main body 10121.
- the molding portion 1011A encloses the circuit component 10122A inside, thus making the circuit component 10122A not directly exposed to the space, more specifically, not exposed to the photosensitive In the closed environment in which the chip 1030 communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive chip.
- the molding portion 1011A forms a through hole 101100A such that the molding portion surrounds the outside of the photosensitive chip 1030 and provides a light path of the lens 1050 and the photosensitive chip 1030.
- the circuit board main body 10121A includes an inner recess 101211A, and the photosensor chip 1030 is disposed in the inner recess 101211A.
- the inner groove 101211A is disposed in the circuit board main body 10121A, and the photosensitive chip 1030 is accommodated therein, so that the photosensitive chip 1030 can be prevented from protruding significantly.
- the height of the photosensitive chip 1030 relative to the molding portion 1011A is lowered, thereby reducing the height limitation of the photosensitive chip 1030 to the molding portion 1011A, providing further reduction High probability.
- a conventional wiring board may be used as the wiring board main body 10121A, and the surface of the wiring board main body 10121A may be molded, such as by an injection molding machine, by insert molding. (insert molding) Process
- the wiring board after the SMT process is molded to form the molding portion 1011A, or the molding portion 1011A is formed by a molding process commonly used in a semiconductor package.
- the inner groove 101211 needs to be opened to the circuit board main body 10121A. That is, the inner groove 101211A is opened on the conventional circuit board to be adapted to accommodate the mounting of the photosensitive chip 1030.
- the circuit board main body 10121A may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molding portion 1011A is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding part 1011A may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the motor 1060 is mounted to the molding portion 1011A of the molded wiring board assembly 1010A, so that the molding portion 1011A is equivalent to the function of the bracket in the conventional camera module,
- the motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes.
- the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011A is fixed to the circuit board main body 10121A by a molding process, and does not need to be pasted and fixed.
- the plastic method has better connection stability and controllability of the process than the adhesive fixing, and there is no need to reserve an AA-adjusted glue space between the molding portion 1011A and the circuit board main body, thereby reducing the conventional imaging mode.
- the reserved space of the group AA is adjusted so that the thickness of the camera module is reduced; on the other hand, the molding portion 1011A is wrapped around the circuit component 10122A, so that the conventional bracket function and circuit components can be spatially overlapped.
- There is no need to reserve a safe distance around the circuit device like the conventional camera module so that the height of the molding portion 1011A having the function of the bracket can be set in a small range, thereby further providing the thickness of the camera module can be reduced. Small space.
- the molding portion 1011A replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the molding portion 1011A includes a support table 10111A adapted to mount the filter 1040 such that the filter 1040 is positioned above the photosensitive chip 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive chip 1030.
- the filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).
- the support table 10111A of the molding portion 1011A forms an inner ring groove 10113A to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011 replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion The 1011A, the filter 1040, and the circuit component 10122A are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030, thereby minimizing the camera module. At the same time, the molding portion 1011A is provided with the flat support table 10111A by means of a molding process, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.
- the inner ring groove 10113A may have an L-shaped cross section and communicate with the through hole 101100A of the molding portion 1011A, so that the filter 1040 is supported and mounted on the photosensitive chip 1030. path.
- the photosensitive chip 1030 is connected to the wiring board main body 10121A through a series of leads 1031A, and is electrically connected to the photosensitive circuit.
- the lead 51A may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 1031A of the photosensitive chip 1030 may be connected to the circuit board body 10121A by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection between the photosensitive chip 1030 and the circuit board main body 10121A can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection of the photosensitive chip 1030 to the circuit board main body 10121A can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- the photosensitive chip 1030 is disposed in the inner groove 101211A of the circuit board main body 10121A, and the molding portion 1011A surrounds the photosensitive chip. Outside of 1030.
- the inner groove 101211A may be first opened on the circuit board main body 10121A, and then Installed in the inner groove 12110A of the circuit board main body 10121
- the photosensitive chip 1030, and then the outer side of the photosensitive chip 1030, the edge position of the wiring board main body 10121A, molding the molding portion 1011A, and the circuit protruding from the wiring board main body 10121A Element 10122A is wrapped inside it.
- the inner groove 101211A may be opened on the circuit board main body 10121A, and then the molding portion may be molded at an edge position of the circuit board main body 10121A. 1011A, and the circuit component 10122A protruding from the circuit board main body 10121A is wrapped therein, and then the photosensitive chip 1030 is mounted in the inner groove 101211A of the circuit board main body 10121A, so that Located inside the molded portion 1011A.
- the molded wiring board assembly 1010B includes a molding portion 1011B and a wiring board portion 1012B that is moldedly joined to the wiring board portion 1012B.
- the wiring board portion 1012B includes a wiring board main body 10121B, and the photosensitive chip 1030 is disposed on the wiring board main body 10121B and located inside the molding portion 1011B.
- the motor 1060 is mounted on the molding portion 1011B of the wiring board assembly 10B, and is electrically connected to the wiring board portion 1012B, and the lens 1050 is mounted to the motor 1060, and The lens 1050 can be adapted by the motor 1060 to auto focus.
- the lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the sensor chip. 1030 is received to be suitable for photoelectric conversion.
- the circuit board portion 1012B includes a photosensitive circuit (not shown) and at least one circuit component 10122B.
- the photosensitive circuit is preset in the circuit board main body 10121B, and the circuit component 10122B is electrically connected to the photosensitive circuit and the photosensitive chip 1030 for the photosensitive operation process of the photosensitive chip 1030.
- the circuit component 10122B can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the motor 1060 when assembling the image forming mold, is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the wire is soldered to the line Plate body 10121B.
- the molding portion 1011B encloses the circuit component 10122B inside, thus making the circuit component 10122B not directly exposed to the space, more specifically, not exposed to the photosensitive In the closed environment in which the chip 1030 communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive chip.
- the molding portion 1011B forms a through hole 101100B such that the molding portion surrounds the outside of the photosensitive chip 1030 and provides a light path of the lens 1050 and the photosensitive chip 1030.
- the circuit board main body 10121B has a passage 101212B, and a lower portion of the passage 101212B is adapted to mount the photosensitive chip 1030.
- the via 101212B causes the upper and lower sides of the wiring board main body 10121B to communicate, so that when the photosensitive chip 1030 is mounted on the back surface of the wiring board main body 10121B and the photosensitive area is mounted upward on the wiring board main body 10121B,
- the photosensitive chip 1030B of the photosensitive chip 1030 is capable of receiving light entering by the lens 1050.
- the via 101212B has an outer ring groove 101213B on the bottom side to provide a mounting position of the photosensitive chip 1030.
- the bottom surface of the photosensitive chip 1030 and the surface of the circuit board main body 10121B are in the same plane, and may be
- the bottom surface of the photosensitive chip 1030 is recessed inwardly with respect to the surface of the circuit board main body 10121B, that is, the bottom surface of the photosensitive chip 1030 may not protrude from the bottom surface of the circuit board main body 10121B, thereby securing the mold.
- the surface flatness of the plastic circuit board assembly 1010B is recessed inwardly with respect to the surface of the circuit board main body 10121B, that is, the bottom surface of the photosensitive chip 1030 may not protrude from the bottom surface of the circuit board main body 10121B, thereby securing the mold.
- the via 101212B is stepped to facilitate mounting of the photosensitive chip 1030, providing a stable mounting position for the photosensitive chip 1030 and exposing its photosensitive region to the inner space.
- a chip mounting method different from the conventional one is provided, that is, a Flip Chip.
- the photosensitive chip 1030 is attached to the wiring board main body 10121B from the back surface direction of the wiring board main body 10121B instead of being required from the front surface of the wiring board main body 10121, that is, from the wiring board as in the above embodiment.
- the photosensitive region of the photosensitive chip 1030 is mounted on the wiring board main body 10121 upward.
- Such a structure and mounting manner are such that the photosensitive chip 1030 and the molding portion 1011B are relatively independent, the mounting of the photosensitive chip 1030 is not affected by the molding portion 1011B, and the molding of the molding portion 1011B The influence of the molding on the photosensitive chip 1030 is also small.
- the photosensitive chip 1030 is embedded on the outer side surface of the circuit board main body 10121B, and does not protrude from the inner side surface of the circuit board main body 10121B, so that a larger space is left inside the circuit board main body 10121B.
- the height of the molded portion 1011B is not limited by the height of the photosensitive chip 1030, so that the molded portion 1011B can reach a smaller height.
- a conventional wiring board may be used as the wiring board main body 10121B, and the surface of the wiring board main body 10121B may be molded, such as by an injection molding machine, by insert molding ( Insert molding process to form the molding portion 1011B by a wiring board after performing an SMT process (Surface Mount Technology surface mount process), or to form the molding portion 1011B by a molding process commonly used in a semiconductor package, and The via 101212B is opened on the wiring board main body 10121B.
- the circuit board main body 10121B may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molding portion 1011B is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding part 1011B may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the motor 1060 is mounted on the molding portion 1011B of the molded wiring board assembly 1010B, so that the molding portion 1011B is equivalent to the function of the bracket in the conventional camera module,
- the motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes.
- the bracket of the camera module of the conventional COB process is fixed to the circuit board by sticking, and the molding part 1011 is fixed to the circuit board main body 10121B by a molding process, and does not require a sticking and fixing process, and the molding method has better connection stability and controllability with respect to the pasting fixing, and is in the molding portion 1011 on the line.
- the molding part 1011B is wrapped In the circuit component 10122B, the conventional bracket function and the circuit component can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like the conventional camera module, thereby making the molding portion having the bracket function.
- the height of the 1011B can be set in a smaller range, thereby further providing a space in which the thickness of the camera module can be reduced.
- the molding portion 1011B replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the molding portion 1011B includes a support table 10111B adapted to mount the filter 1040 such that the filter 1040 is positioned above the photosensitive chip 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive chip 40.
- the filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).
- the support table 10111B of the molding portion 1011B forms an inner ring groove 10113B to provide a sufficient installation space for the filter 1040. It is worth mentioning that the molding portion 1011B replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011B, the filter 1040 and the circuit component 10122B are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030, so that the camera module is minimized. At the same time, the molding portion 1011B is provided with the flat support table 10111B by means of a molding process, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.
- the inner ring groove 10113B has an L-shaped circular cross section that communicates with the through hole 101100B of the molding portion 1011B so that the filter 1040 is supported and mounted on the photosensitive chip 1030. Photosensitive path.
- the photosensitive chip 1030 is disposed on a lower surface of the wiring board main body 10121B, and the molding portion 1011B surrounds the outside of the wiring board main body 10121B. edge.
- different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the via 101212B may be first opened on the wiring board main body 10121B, and then The photosensitive chip 1030 is flip-chip mounted on the via 101212B of the wiring board main body 10121, and then the molded portion 1011B is molded at an edge position of the wiring board main body 10121B outside the photosensitive chip 1030.
- the via 101212B may be first opened on the wiring board main body 10121B, and then the molding portion 1011B may be molded at an edge position of the wiring board main body 10121B, and The circuit component 10122B protruding from the circuit board main body 10121B is wrapped therein, and then the photosensitive chip 1030 is mounted on the circuit board main body 10121B so as to be located outside the circuit board main body 10121B. Ring groove 101213B.
- the molding portion 1011B may be molded at an edge position of the wiring board main body 10121B, and the circuit component protruding from the wiring board main body 10121B may be formed.
- 10122B is wrapped around the inside of the circuit board main body 10121B to open the passage 101212B, the via 101212B is then opened in the board main body 10121B, and then the photoreceptor chip 1030 is flip-chip mounted on the via 101212B of the board main body 10121B.
- the molded wiring board assembly 1010C includes a molding portion 1011C and a wiring board portion 1012C that is moldedly joined to the wiring board portion 1012C.
- the circuit board portion 1012C includes a circuit board main body 10121C, and the photo sensor chip 1030 is disposed on the circuit board main body 10121C and located inside the molding portion 1011C.
- the motor 1060 is mounted on the molding portion 1011C of the wiring board assembly 10C, and is electrically connected to the wiring board portion 1012C, and the lens 1050 is mounted to the motor 1060, and
- the lens 1050 can be adapted by the motor 50 to be auto focus.
- the lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050 to be further used by the sensor chip. 1030 is received to be suitable for photoelectric conversion.
- the circuit board portion 1012C includes a photosensitive circuit (not shown) and at least one circuit component 10122C.
- the photosensitive circuit is preset in the circuit board main body 10121C, and the circuit component 10122C is electrically connected to the photosensitive circuit and the photosensitive chip 1030 for the photosensitive operation process of the photosensitive chip 1030.
- the circuit component 10122C can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the motor 1060 when assembling the image forming mold, the motor 1060 is electrically connected to the photosensitive circuit through a motor pin 1061, and the motor pin 106 is soldered to The circuit board main body 10121C.
- the molding portion 1011C wraps the circuit component 10122C inside, thus making the circuit component 10122C not directly exposed to the space, more specifically, not exposed to the photosensitive In the closed environment in which the chip 1030 communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive chip.
- the molding portion 1011C forms a through hole 101100C such that the molding portion surrounds the outside of the photosensitive chip 1030 and provides a light path of the lens 1050 and the photosensitive chip 1030.
- the circuit board main body 10121C has at least one via 101214C, and the molding portion 1011 is immersed in the via 101214C.
- Each of the via holes 101214C is provided in a molding region of the wiring board main body, and is disposed in coordination with the circuit component 10122C. It is to be noted that the via 101214C is disposed such that the molding portion 1011C is immersed in the wiring board main body 10121C at the time of molding, and the molding portion 1011C and the wiring board main body 10121C are reinforced. The bonding force between the molding portion 1011C and the wiring board main body 10121C is not easily detached, and the structural strength of the wiring board main body 10121C itself is enhanced, so that the wiring board main body 10121C can have a smaller thickness. .
- the location and number of vias 101214C can be set as desired, and those skilled in the art will appreciate that the location and number of vias 101214C are not a limitation of the present invention.
- the circuit board main body 10121C may further be provided with the inner groove 101211A or the passage 101212B, so that the molded circuit board assembly
- the 1010C can have different advantages, such as smaller thickness and higher structural strength.
- the arrangement of the via holes 101214C on the circuit board main body 10121C in the embodiment may bring some advantages, such as increasing the mode of the circuit board main body 10121C and the molding portion 1011C. Plastic bonding, reinforcing the structural strength of the circuit board main body 10121C, etc., of course, those skilled in the art should understand that the arrangement of the via hole 101214C of the circuit board main body 10121C is not a limitation of the present invention. That is, in other embodiments of the present invention, the vias 101214C may not be provided, or different layouts, different numbers of the vias 101214C may be provided as needed.
- a conventional wiring board may be used as the wiring board main body 10121C, and the surface of the wiring board main body 10121C may be molded, such as by an injection molding machine, by insert molding ( Insert molding process).
- the wiring board after the SMT process (Surface Mount Technology surface mount process) is molded to form the molding portion 1011C, or the molding portion 1011C is formed by a molding process commonly used in a semiconductor package.
- the circuit board main body 10121C may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molding portion 1011C is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding part 1011C may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the motor 1060 is mounted on the molding portion 1011C of the molded wiring board assembly 1010C, so that the molding portion 1011C is equivalent to the function of the bracket in the conventional camera module,
- the motor 1060 provides a support, fixed position, but assembly is different from conventional COB processes.
- the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011C is fixed to the circuit board main body 10121C by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted.
- the fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the main body of the circuit board in the molding part 1011C, thereby reducing the pre-adjustment of the conventional camera module AA.
- the space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011C is wrapped around the circuit component 10122C, so that the conventional bracket function and circuit components can be spatially overlapped, without the need for
- the camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011C having the bracket function can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced.
- the molding portion 1011C replaces the conventional bracket, avoiding the tilt error caused by the bracket during the sticking assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the molding portion 1011C includes a support table 10111C adapted to mount the filter 1040 such that the filter 1040 is positioned above the photosensitive chip 1030. That is, the light entering the lens 1050 passes through the filter 1040 and reaches the photosensitive chip 40.
- the filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).
- the support table 10111C of the molding portion 1011C forms an inner ring groove 10113C for the filtering Sheet 1040 provides ample installation space. It is worth mentioning that the molding portion 1011C replaces the conventional bracket, and connects the motor 1060 with the filter 1040 while providing the mounting position of the filter 1040 so that the molding portion 1011C, the filter 1040 and the circuit component 10122C are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030, so that the camera module is minimized. At the same time, by means of the molding process, the molding portion 1011C is provided with the flat support table 10111C, so that the filter 1040 can be mounted flat, ensuring the consistency of the optical path.
- the inner ring groove 10113C has an L-shaped cross section and communicates with the through hole 101100C of the molding portion 1011C, so that the filter 1040 is supported and mounted on the photosensitive path of the photosensitive chip 1030. .
- the photosensitive chip 1030 is connected to the wiring board main body 10121C through a series of leads 1031, and is electrically connected to the photosensitive circuit.
- the lead 1031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 1031 of the photosensitive chip 1030 may be connected to the circuit board body 10121C by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection between the photosensitive chip 1030 and the circuit board main body 10121C can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection between the photosensitive chip 1030 and the circuit board main body 10121C can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- the photosensitive chip 1030 is disposed on the upper surface of the wiring board main body 10121C, and the molding portion 1011C surrounds the outer side of the photosensitive chip,
- different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the photosensitive chip 1030 may be first mounted on the circuit board main body 10121C, and then in the Outside the photosensitive chip 1030, the edge portion of the wiring board main body 10121C is molded to form the molding portion 1011C, and the circuit component 10122C protruding from the wiring board main body 10121C is wrapped therein.
- the edge position of the circuit board main body 10121C may be first molded to form the molding portion 1011C, and the circuit protruding from the circuit board main body 10121C may be formed.
- the element 10122C is wrapped inside, and then the photosensitive chip 1030 is mounted on the wiring board main body 10121C so as to be located inside the molding portion 1011C.
- the camera module is a fixed focus camera module.
- the camera module includes a molded circuit board assembly 1010D, a lens 1050D, and a photosensitive chip 1030D.
- the lens 1050D is mounted over the molded wiring board assembly 1010D. Further, the molded wiring board assembly 1010D includes a molding portion 1011D and a wiring board portion 1012D, and the molding portion 1011D is molded to connect the wiring board portion 1012D.
- the circuit board portion 1012D includes a circuit board main body 10121D, and the photo sensor chip 1030D is disposed on the circuit board main body 10121D and located inside the molding portion 1011D.
- the lens 1050D is located in the photosensitive path of the photosensitive chip 1030D, thereby being in the When the camera module is used to capture an image of an object, the light reflected by the object can be further received by the sensor chip 1030D after being processed by the lens 1050D to be suitable for photoelectric conversion.
- the circuit board portion 1012D includes a light sensing circuit and at least one circuit component 10122.
- the photosensitive circuit is preset in the circuit board main body 10121D, and the circuit component 10122D is electrically connected to the photosensitive circuit and the photosensitive chip 1030D for the photosensitive operation process of the photosensitive chip 1030D.
- the circuit component 10122D can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the molding portion 1011D wraps the circuit component 10122D inside, thus making the circuit component 10122D not directly exposed to the space, more specifically, not exposed to the photosensitive
- the closed environment in which the chip 1030D communicates is different from the manner in which the circuit components in the conventional camera module exist, such as a container member, thereby preventing dust and debris from staying at the circuit component 10122D and contaminating the sensor chip 1030D.
- the molding portion 1011D forms a through hole 101100D such that the molding portion 1011D surrounds the outside of the photosensitive chip 1030D and provides a light path of the lens 1050D and the photosensitive chip 1030D.
- a conventional wiring board may be used as the wiring board main body 10121D, and the surface of the wiring board main body 10121D may be molded, such as by an injection molding machine, by insert molding.
- An insert molding process is performed by molding a wiring board after performing an SMT process (Surface Mount Technology surface mount process) to form the molding portion 1011D, or forming the molding portion by a molding process commonly used in a semiconductor package. 1011D.
- the circuit board main body 10121D may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the molding portion 1011D is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding part 1011D may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the lens 1050D is mounted on the molding portion 1011D of the molded wiring board assembly 1010D, so that the molding portion 1011D is equivalent to the function of the bracket in the conventional camera module.
- the lens 1050D provides support, fixed position, but assembly is different from conventional COB processes.
- the bracket of the camera module of the conventional COB process is fixed to the circuit board in a pasting manner, and the molding portion 1011D is fixed to the circuit board main body 10121D by a molding process, and does not need to be pasted and fixed, and the molding method is relatively pasted.
- the fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molding part 1011D and the circuit board main body, thereby reducing the pre-adjustment of the conventional camera module AA.
- the space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011D is wrapped around the circuit component 10122D, so that the conventional bracket function and the circuit component can be spatially overlapped, without the need for
- the camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011D having the function of the bracket can be set in a small range, thereby further providing a space in which the thickness of the camera module can be reduced. A fixed-focus camera module with a smaller thickness.
- the molding portion 1011D replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the molding portion 1011D includes a support table 10111D, and the support table 10111D is adapted to mount a filter 1040D such that the filter 1040D is positioned above the photosensitive chip 1030D. That is, the light entering the lens 1050D passes through the filter 1040D and reaches the photosensitive chip 40D.
- the filter 1040D can be implemented as, but not limited to, an infrared cut filter (IRCF).
- the support table 10111D of the molding portion 1011D forms an inner ring groove 10113D to provide a sufficient installation space for the filter 1040D.
- the molding portion 1011D replaces the conventional bracket, and connects the lens 1050D with the wiring board portion 1012D while providing the mounting position of the filter 1040D, so that the molding portion The 1011D, the filter 1040D, and the circuit component 10122D are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030D, thereby minimizing the camera module.
- the molding portion 1011D is provided with the flat support table 10111D, so that the filter 1040D can be mounted flat, ensuring the consistency of the optical path.
- the inner ring groove 10113D is L-shaped and communicates with the through hole 101100D of the molding portion 1011D so that the filter 1040D is supported to be mounted on the photosensitive path of the photosensitive chip 1030D.
- the photosensitive chip 1030D is connected to the wiring board main body 10121D through a series of leads 1031D, and is electrically connected to the photosensitive circuit.
- the lead 51D may be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the series of leads 1031D of the photosensitive chip 1030D may be connected to the circuit board body 10121D by a conventional COB method, such as, but not limited to, soldering. That is to say, the connection between the photosensitive chip 1030D and the circuit board main body 10121D can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection of the photosensitive chip 1030D to the circuit board main body 10121D can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- the traditional manufacturing process after the circuit board is finished with the SMT, the traditional COB package is applied, and then the chip is attached, the gold wire is attached, and the plastic bracket or the motor is attached by glue.
- the molded portion 1011D is formed on the surface of the wiring board by a molding process, and then the chip is attached to the gold wire.
- the photosensitive chip 121D is disposed on the upper surface of the wiring board main body 10121D, and the molding portion 1011D surrounds the outer side of the photosensitive chip,
- the photosensitive chip 1030D may be first mounted on the circuit board main body 10121D, and then in the Outside the photosensitive chip 1030D, the edge position of the wiring board main body 10121D is molded to form the molding portion 1011D, and the circuit protruding from the wiring board main body 10121D Element 10122D is wrapped inside it.
- the edge position of the circuit board main body 10121D may be first molded to form the molding portion 1011D, and the circuit protruding from the circuit board main body 10121D may be formed.
- the element 10122D is wrapped inside, and then the photosensitive chip 1030D is mounted on the wiring board main body 10121D so as to be located inside the molding portion 1011D.
- the lens 1050D can also be combined with different embodiments of the molded circuit assembly in the above preferred embodiment to be assembled into a fixed-focus camera module of different configurations, that is, the lens 1050D and the molding line, respectively.
- the board assembly 1010A, the molded circuit board assembly 1010B, and the molded circuit board assembly 1010C are assembled to form different fixed focus camera modules.
- the structure of the molded circuit board assembly can be referred to the above preferred embodiment. No longer.
- the camera molding is a dynamic focus camera module including a molded circuit board assembly 1010E, a lens 1050E, and a motor 1060E.
- the motor 1060E is mounted to the molded wiring board assembly 1010E, and the lens 1050E is mounted to the motor 1060E such that the lens 1050E is supported above the molded wiring board assembly 1010E.
- the molded wiring board assembly 1010E includes a molding portion 1011E and a wiring board portion 1012E that is moldedly joined to the wiring board portion 1012E.
- the circuit board portion 1012E includes a circuit board main body 10121E and a photo sensor chip 1030E.
- the photo sensor chip 1030E is disposed on the circuit board main body 10121E and located inside the molding portion 1011E.
- the motor 1060E is mounted on the molding portion 1011E of the wiring board assembly 10E, and is electrically connected to the wiring board portion 1012E, and the lens 1050E is mounted to the motor 1060E, and
- the lens 1050 can be adapted to autofocus by the motor 1060E.
- the lens 1050 is located in the photosensitive path of the photosensitive chip 1030E, so that when the camera module is used to collect an image of an object, the light reflected by the object can be further processed by the lens 1050E and then the photosensitive chip. 1030E is received to be suitable for photoelectric conversion.
- the circuit board portion 1012E includes a light sensing circuit and at least one circuit component 10122E.
- the photosensitive circuit is preset in the circuit board main body 10121E, and the circuit component 10122E is electrically connected to the photosensitive circuit and the photosensitive chip 1030E for the photosensitive operation process of the photosensitive chip 1030E.
- the circuit component 10122E can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the motor 1060E when the image forming molding is assembled, the motor 1060E is electrically connected to the photosensitive circuit through a motor pin 1061E, and the wire is soldered to the wiring board Body 10121E.
- the molding portion 1011E encloses the circuit component 10122E inside, thus making the circuit component 10122E not directly exposed to the space, more specifically, not exposed to the photosensitive In the closed environment in which the chip 1030E communicates, it is different from the existing circuit elements in the conventional camera module, such as a resisting container member, thereby preventing dust and debris from staying in the circuit components and contaminating the photosensitive chip.
- the molding portion 1011E forms a through hole 101100E such that the molding portion surrounds the outside of the photosensitive chip 1030E and provides a light path of the lens 1050E and the photosensitive chip 1030E.
- the circuit board main body 10121E has a passage 101212E, and a lower portion of the passage 101212E is adapted to mount the photosensitive chip 1030E.
- the via 101212E causes the upper and lower sides of the wiring board main body 10121E to communicate with each other, so that when the photosensitive chip 1030E is mounted on the back surface of the wiring board main body 10121E and the photosensitive region is mounted upward on the wiring board main body 10121E,
- the photosensitive area of the photosensitive chip 1030E is capable of receiving light entering by the lens 1050E.
- the via 101212E has an outer ring groove 101213E that provides a mounting position of the photosensitive chip 1030E.
- the photosensitive chip 1030E is mounted on the outer ring groove 101213, the outer surface of the photosensitive chip 1030E and the surface of the circuit board main body 10121E are in the same plane, thereby ensuring the molding line.
- the via 101212E is stepped to facilitate mounting of the photosensitive chip 1030E, providing a stable mounting position for the photosensitive chip 1030E and exposing its photosensitive region to the inner space.
- a different chip mounting method that is, a chip flipping method
- the photosensitive chip 1030E is attached to the wiring board main body 10121E from the back surface direction of the wiring board main body 10121E, instead of being required from the front surface of the wiring board main body 10121, that is, from the wiring board as in the above embodiment.
- the photosensitive region of the photosensitive chip 1030 is mounted on the wiring board main body 10121 upward.
- Such a structure and mounting manner are such that the photosensitive chip 1030E and the molding portion 1011E are relatively independent, and the mounting of the photosensitive chip 1030E is not affected by the molding portion 1011E, and the molding of the molding portion 1011E The influence of the molding on the photosensitive chip 1030E is also small.
- the photosensitive chip 1030E is embedded on the outer side surface of the circuit board main body 10121E, and does not protrude from the inner side surface of the circuit board main body 10121E, so that a larger space is left inside the circuit board main body 10121E.
- the height of the molded portion 1011E is not limited by the height of the photosensitive chip 1030E, so that the molded portion 1011E can reach a smaller height.
- a conventional wiring board may be used as the wiring board main body 10121E, and the surface of the wiring board main body 10121E may be molded, such as by an injection molding machine, by insert molding ( Insert molding process to form the molding portion 1011E by a wiring board after performing an SMT process (Surface Mount Technology surface mount process), or to form the molding portion 1011E by a molding process commonly used in a semiconductor package, and The via 101212E is opened on the wiring board main body 10121E.
- the circuit board main body 10121E may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCE hard board (without a soft board), and the like.
- the manner in which the molding portion 1011E is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the molding material 1011E may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process may be adopted. Resin. It should be understood by those skilled in the art that the foregoing alternative manufacturing methods and materials that can be selected are merely illustrative of the manner in which the present invention can be implemented, and are not limited by the present invention. system.
- the motor 1060E is mounted on the molding portion 1011E of the circuit board assembly 10E, so that the molding portion 1011E is equivalent to the function of the bracket in the conventional camera module, Motor 1060E provides support, fixed position, but assembly is different from conventional COE processes.
- the bracket of the camera module of the conventional COE process is fixed to the circuit board in a pasting manner, and the molding portion 1011E is fixed to the circuit board main body 10121E by a molding process, and the bonding process is not required, and the molding method is relatively pasted.
- the fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molding parts 1011E between the circuit board bodies, thereby reducing the pre-adjustment of the conventional camera module AA.
- the space is left to reduce the thickness of the camera module; on the other hand, the molding portion 1011E is wrapped around the circuit component 10122E, so that the conventional bracket function and the circuit component can be spatially overlapped, without the need for
- the camera module reserves a safe distance around the circuit device, so that the height of the molding portion 1011E having the bracket function can be set to a small range, thereby further providing a space in which the thickness of the camera module can be reduced.
- the molding portion 1011E replaces the conventional bracket, avoiding the tilt error caused by the bracket during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the camera module includes a filter 1040E, and the filter 1040E is mounted on the circuit board body 10121E, above the sensor chip 1030E. That is, the upper port of the path 101212E of the circuit board main body 10121E is located such that the light entering by the lens 1050E passes through the filter 1040E first when passing through the path 101212E.
- the molding portion 1011E does not need to provide the mounting position of the filter 1040E, and it is not necessary to provide the support table 10111, and the filter board body 11E is used for the filtering.
- the sheet 1040E provides a mounting position that reduces the distance between the filter 1040E and the photosensitive chip 1030E, so that the height of the molded portion 1011E is further reduced.
- the filter 1040E can be implemented as, but not limited to, an infrared cut filter (IRCF).
- IRCF infrared cut filter
- the filter 10140E can be mounted on the circuit board main body 10121E by means of the arrangement of the path 101212E in the FC chip flipping manner, thereby making
- the circuit board assembly 10E and the camera module assembled by the circuit board assembly 10E have advantages brought by the FC mounting method and the mounting manner of the filter 1040E, such as facilitating assembly, reducing thickness, and the like.
- the mounting position of the filter 1040E is not limited by the present invention. In other embodiments of the present invention, the filter 1040E may also be installed in different positions, for example. The but not limited to, the molded portion 1011, a bracket, a motor, or the like.
- the molding portion 1011E connects the motor 1060E with the circuit board portion 1012E instead of the conventional bracket, and the circuit board portion 1012E provides the mounting position of the filter 1040E, so that The molding portion 1011E, the filter 1040E, and the circuit component 10122E are reasonably arranged to fully utilize the remaining space outside the photosensitive area of the photosensitive chip 1030E, thereby minimizing the camera module.
- the molding portion 1011E is provided with a flat fixed position, so that the motor 1060E can be mounted flat, ensuring the consistency of the optical path.
- the photosensitive chip 1030E is disposed on a lower surface of the circuit board main body 10121E, and the molding portion 1011E surrounds the circuit board main body.
- different manufacturing sequences may be selected, such as, but not limited to, in one embodiment, the via 101212E may be first opened on the wiring board main body 10121E, and then The photosensitive chip 1030E is flip-chip mounted on the via 101212E of the wiring board main body 10121, and then the molding portion 1011E is molded at an edge position of the wiring board main body 10121E outside the photosensitive chip 1030E.
- the via 101212E may be first formed on the wiring board main body 10121E, and then the molding portion 1011E is molded at an edge position of the wiring board main body 10121E, and The circuit component 10122E protruding from the circuit board main body 10121E is wrapped therein, and then the photosensitive chip 1030E is mounted on the circuit board main body 10121E so as to be located outside the circuit board main body 10121E. Ring groove 101213E.
- the molding portion 1011E may be molded at an edge position of the wiring board main body 10121E, and the circuit component protruding from the wiring board main body 10121E may be formed.
- 10122E is wrapped around the inside of the circuit board main body 10121E to open the path 101212E, and then the path 101212E is opened on the circuit board main body 10121E, and then the photosensitive chip 1030E is flip-chip mounted on the circuit board main body.
- the path 101212E of 10121E is molded at an edge position of the wiring board main body 10121E, and the circuit component protruding from the wiring board main body 10121E may be formed.
- 10122E is wrapped around the inside of the circuit board main body 10121E to open the path 101212E, and then the path 101212E is opened on the circuit board main body 10121E, and then the photosensitive chip 1030E is flip-chip mounted on the circuit board main body.
- the path 101212E of 10121E is molded at an edge position of the wiring board main body 10121
- the mounting manner of the molded circuit board assembly 1010E and the filter 1040E can also be applied to a fixed focus camera module.
- the camera module further includes a bracket 1070 mounted to the molded wiring board assembly 1010, and the motor 1060 is mounted to the molding.
- the lens 1050 is mounted to the motor 1060 to facilitate securing the lens 1050 over the molded wiring board assembly 1010. That is to say, the molded circuit board assemblies 1010, 1010A, 1010B, and 1010C can be combined with a conventional bracket to be assembled into different types of camera modules, such as a dynamic focus camera module and a fixed focus camera module.
- the filter 1040 may be selectively mounted to the bracket 1070, the molding portion 1011, or the motor 1060.
- the camera module adopting the molding process can increase the competitiveness of the product in the market, especially in the high-end products, the camera module mainly has the following advantages:
- the length and width dimensions of the module can be reduced, and the molded part and the resistive container part can overlap in space;
- the conventional solution bracket needs to be outside the capacitor, and a certain safety distance needs to be reserved.
- the molding manufacturing method of the present invention can directly utilize the capacitor space and directly fill the plastic around the capacitor to form a bracket.
- the capacitor top end distance bracket needs to reserve a safety gap to prevent interference.
- the circuit components such as capacitors, can be directly filled with plastic, and no space gap is required.
- the resistor capacitor parts can be wrapped by molding, which can avoid the bad black spots of the module, such as solder resist and dust, and improve the product yield.
- the camera module includes a circuit board assembly 2010, a sensor chip 2030, and a lens 2050.
- the photosensitive chip 2030 is mounted on the circuit board assembly 2010, the lens 2050 is located on the circuit board assembly 2010, and the lens 2050 is located in a photosensitive path of the photosensitive chip 2030.
- the circuit board assembly 2010 can be coupled to the electronic device for use with the electronic device. It will be understood by those skilled in the art that the lens 2050 and the chip can cooperate with each other to capture an image. Specifically, light reflected by a subject, such as an object or a character, is received by the photosensitive chip 2030 for photoelectric conversion after passing through the lens 2050. In other words, the photosensitive chip 2030 can convert an optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the circuit board assembly 2010, thereby generating and capturing the object on the electronic device. Related images.
- the circuit board assembly 2010 includes an encapsulation portion 2011 and a circuit board portion 2012 that are integrally packaged and connected to the circuit board portion 2012, such as moldedly connected to the circuit board portion 2012. More specifically, the encapsulation portion 2011 is molded and attached to the wiring board portion by molding in a mold (Molding On Board, MOB), and the molding process may be a process such as injection molding or molding.
- a mold Molding On Board, MOB
- the circuit board portion 2012 includes a circuit board main body 20121, and the package portion 2011 is integrally connected to the circuit board main body 20121.
- the encapsulation portion 2011 forms a through hole 201100 such that the encapsulation portion 2011 surrounds the outside of the photosensitive chip 2030 and provides a light path of the lens 2050 and the photosensitive chip 2030.
- the photosensitive chip 2030 is disposed on the circuit board main body 20121 at a position corresponding to the through hole 201100.
- the circuit board portion 2012 includes a connection line 2031 and at least one circuit component 20122.
- the connection line 2031 is preset to the circuit board main body 20121, and the circuit component 20122 is electrically connected to the connection circuit for The photosensitive operation process of the photosensitive chip 2030.
- the circuit component 20122 can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the encapsulation portion 2011 can enclose the circuit component 20122 component inside, thus making the circuit component 20122 not directly exposed to the space, more specifically, not exposed to the
- the photosensitive chip 2030 is in a closed environment in which it is connected.
- the circuit device in different conventional camera modules exists in such a manner that the resisting container member protrudes from the circuit board, thereby preventing dust and debris from staying in the circuit component 20122 and contaminating the photosensitive chip 2030.
- the circuit component 20122 is exemplified by the circuit board body 20121, and in other embodiments of the invention, the circuit component 20122 is embedded in the circuit.
- the inside of the board main body 20121 does not protrude from the board main body 20121, and it will be understood by those skilled in the art that the structure, type, and position of the circuit element 20122 are not limited by the present invention. It can be understood that in the camera module of the transmission, the circuit device protrudes from the circuit board, and the base can only be mounted on the circuit component 20122. The outer side, therefore, both the circuit device and the base require a certain spatial position, and therefore the size of the circuit board in the lateral direction is relatively high.
- the package portion 2011 is integrally packaged in the circuit board body 20121 and covers the circuit component 20122, and thus the package portion 2011 and the circuit component 20122
- the spaces overlap each other, thereby increasing the space that the encapsulation portion 2011 can be disposed inward, reducing the external extension requirement of the circuit board main body 20121, thereby reducing the lateral dimension of the camera module, so that it can satisfy Equipment for miniaturization needs.
- the encapsulation portion 2011 encapsulating the circuit component 20122 has the advantage of protecting the circuit component 20122 from being contaminated and being accidentally touched, and at the same time bringing advantages to the corresponding camera module.
- the package portion 2011 is not limited to covering the circuit element 20122. That is, in other embodiments of the present invention, the package portion 2011 may be directly molded to the circuit board main body 20121 of the circuit component 20122 without protruding, or may be molded on the circuit component. The outside of 20122, around and other different locations.
- the encapsulation portion 2011 is convexly surrounding the outer side of the photosensitive chip 2030, and in particular, the encapsulation portion 2011 is integrally closed and connected to have a good sealing property, so that when the lens 2050 is mounted on the photosensitive path of the photosensitive chip 2030, the photosensitive chip 2030 is sealed inside to form a corresponding closed inner space.
- a conventional wiring board can be selected as the wiring board main body 20121, and molding is performed on the surface of the wiring board main body 20121.
- the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The encapsulation portion 2011 is formed by the encapsulation portion 2011, or by a molding process commonly used in semiconductor packaging.
- each of the photosensitive chips 2030 is attached to the wiring board main body 20121, and then the photosensitive chips 2030 are electrically connected to the wiring board main body 20121, for example, by a gold wire.
- the circuit board main body 20121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the encapsulation portion 2011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the encapsulating portion 2011 may be selected from materials such as, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc. for the injection molding process, and the molding process may adopt a ring. Oxygen resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the process of manufacturing the circuit board assembly 2010 may be performed by first performing an SMT process on the circuit board main body 20121, and then mounting the photosensitive chip 2030 on the circuit board main body 20121. And electrically connecting the photosensitive chip 2030 to the circuit board main body 20121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 20121, such as a molded package, by insert molding.
- the encapsulation portion 2011, or the encapsulation portion 2011 is formed by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the circuit board assembly 2010 is not a limitation of the present invention.
- the camera module includes a filter 2040, and the filter 2040 is mounted on the package portion. 2011, in order to provide stable, flat mounting conditions for the filter 2040.
- the filter 2040 is implemented as an Infra-Red Cut Filter (IRCF), which uses a precision optical coating.
- IRCF Infra-Red Cut Filter
- the technology alternately applies a high refractive index optical film on an optical substrate to realize a high-transmission, near-infrared (700-1100 nm) cut-off optical filter in the visible light region (400-630 nm), which can eliminate infrared light to the photosensitive chip.
- imaging effects such as CCD or CMOS.
- the photosensitive chip 2030 such as CCD or CMOS
- the human eye can only see visible light in the 380-780 nm band, and the photosensitive chip 2030 can sense more.
- Multi-bands such as infrared light and ultraviolet light, are especially sensitive to infrared light, so infrared light must be suppressed in the camera module, and high transmission of visible light is maintained, so that the sensing of the photosensitive chip 2030 is close.
- the image captured by the camera module is also in line with the sensing of the eye, so the infrared cut filter is indispensable for the camera module.
- the filter 2040 may be selected from the group consisting of a wafer level infrared cut filter, a narrow band filter, and a blue glass IRCF. It will be understood by those skilled in the art that the type of filter 2040 is not a limitation of the present invention.
- the filter In the conventional COB assembled camera module, the filter is usually mounted on a plastic base, and the base is usually attached to the circuit board by bonding, so the plastic base and the corresponding mounting manner are not easily offset. Or tilting, and the surface of the plastic holder is poorly flat, so that the filter 2040 cannot be provided with good mounting conditions.
- the filter 2040 is mounted to the encapsulation portion 2011, and based on the molding process, good surface flatness can be obtained, thereby providing a flattening of the filter 2040.
- the mounting conditions and the manner of integral molding make the package portion 2011 less prone to offset and tilting, thereby reducing the cumulative tolerance when the filter 2040 is mounted.
- the top surface 20112 of the encapsulation portion 2011 extends integrally planarly, and the filter 2040 is mounted to the top surface 20112 of the encapsulation portion 2011.
- the filter 2040 may be bonded to the top surface 20112 of the package portion 2011 by bonding.
- the camera module includes a motor 2060, such as a voice coil motor, a piezoelectric motor.
- the lens 2050 is mounted on the motor 2060 to facilitate the movement of the lens 2050 by the motor 2060 to adjust the focal length of the camera module, that is, the camera module is a moving focus module ( Automatic Focus Module, AFM).
- AFM Automatic Focus Module
- the camera module may not have a driver, that is, the motor 2060 is not provided, and a certain focus camera module is formed.
- the motor 2060 is mounted to the encapsulation portion 2011 of the circuit board assembly 2010, and further, the motor 2060 is mounted to the top surface 20112 of the encapsulation portion 2011, that is, the filter 2040 and the motor 2060 coordinately occupy the top surface 20112 of the package portion 2011.
- the motor 2060 is electrically connected to the circuit board body 20121 through at least one motor pin 2061.
- the lens 2050 is mounted on the motor 2060, and the motor 2060 and the filter 2040 are mounted on the package portion 2011, so that the package portion 2011 is equivalent to the base of the conventional camera module.
- the function provides a supported, fixed position for the motor 2060 and the filter 2040, but is manufactured, assembled, and shaped differently than conventional COB processes.
- the base of the camera module of the conventional COB process is fixed to the circuit board in an adhesive manner, and the package portion 2011 is fixed to the circuit board main body 20121 by molding on the circuit board, and does not require a bonding and fixing process.
- the molding method has better connection stability and controllability of the process than the bonding and fixing method, and has high flatness, and provides good mounting conditions for the motor 2060 and the filter 2040, and the
- the encapsulation portion 2011 and the circuit board main body 20121 do not have an AA-adjusted glue space, thereby eliminating the reserved space for the adjustment of the conventional camera module AA, so that the thickness of the camera module is reduced;
- the encapsulation portion 2011 encloses the circuit component 20122, so that the conventional pedestal space and the circuit component 20122 installation space can be spatially overlapped, and there is no need to reserve a safe distance around the circuit device like a conventional camera module, thereby having a pedestal
- the package portion 2011 of the function can be disposed in a small size, thereby further providing a space in which the thickness of the camera module can be reduced.
- the encapsulation portion 2011 replaces the conventional base, avoiding the tilt error caused by the base during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module
- the shape of the encapsulation portion 2011 can be determined as needed, for example, extending inwardly at the position of the circuit component 20122 to form a protrusion, thereby increasing the corresponding width of the encapsulation portion 2011, and In the position where the circuit component 20122 is absent, the package portion 2011 extends uniformly to form a relatively regular shape with a small width. It should be understood by those skilled in the art that the specific shape of the package portion 2011 is not a limitation of the present invention.
- the photosensitive chip 2030 can be electrically connected to the circuit board main body 20121 through at least one connection line 2031, and can be electrically connected to the connection line.
- the connecting line 2031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the connecting line 2031 of the photosensitive chip 2030 may be connected to the circuit board main body 20121 by a conventional COB method, for example, but not limited to, a soldering manner. That is to say, the connection between the photosensitive chip 2030 and the circuit board main body 20121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection of the photosensitive chip 2030 to the circuit board main body 20121 can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- each of the photosensitive chips 2030 is disposed on an upper surface of the wiring board main body 20121, and the encapsulation portion 2011 surrounds an outer side of the photosensitive chip 2030.
- the photosensitive chip 2030 may be first mounted on the circuit board main body 20121, and then in the Outside the photosensitive chip 2030, the package portion 2011 is molded on the wiring board main body 20121, and the circuit element 20122 protruding from the wiring board main body 20121 is covered inside.
- the package portion 2011 may be molded on the circuit board main body 20121, and the circuit component 20122 protruding from the circuit board main body 20121 may be covered.
- the photosensitive chip 2030 is then mounted on the wiring board main body 20121 so as to be located inside the package portion 2011.
- FIG. 18A is another embodiment of a camera module according to a fifth preferred embodiment of the present invention.
- the camera module may be a Fix Focus Module (FFM).
- FFM Fix Focus Module
- the lens 2050 is mounted on the top surface 20112 of the package portion 2011, that is, the focal length of the camera module cannot be freely adjusted.
- the lens 2050 and the filter 2040 coordinately configure the top surface 20112 of the encapsulation portion 2011. It will be understood by those skilled in the art that the type of imaging molding is not a limitation of the present invention.
- the encapsulation portion 2011 can be used to support the mounting of the filter 2040 and the lens 2050, having the function of a conventional base, and based on the advantages of molding,
- the encapsulation portion 2011 can control the flatness and consistency of the encapsulation portion 2011 by means of a mold, thereby providing a flat and consistent installation environment for the filter color of the camera module and the lens 2050, thereby further It is easy to ensure the consistency of the optical axes of the lens 2050 and the filter 2040 and the photosensitive chip 2030, which is not easily achieved by the conventional camera module.
- FIG. 18B is another embodiment of a camera module according to a fifth preferred embodiment of the present invention.
- the camera module may be a Fix Focus Module (FFM).
- FFM Fix Focus Module
- the lens 2050 is mounted on a lens holder 2080, and the lens holder 2080 is mounted on the top surface 20112 of the package portion 2011, that is, the focal length of the camera module cannot be freely Adjustment.
- the lens holder 2080 can be a threaded bracket on the inner wall or a bracket without a thread.
- FIG. 18C is another embodiment of a camera module according to a fifth preferred embodiment of the present invention.
- the camera module may be a Fix Focus Module (FFM).
- FFM Fix Focus Module
- the lens 2050 is mounted on a lens holder 2080.
- the lens holder 2080 is mounted on a seat 2070.
- the holder 2070 is mounted on a top side of the package portion 2011.
- the package portion 2011 has a mounting groove 20113A, and the mounting groove 20113A communicates with the through hole 201100 to provide sufficient installation space for the filter 2040. That is, the top surface 20112 of the encapsulation portion 2011 has a stepped structure, and does not extend integrally. The steps of the top surface 20112 can be used to mount the filter 2040, the lens 2050 or The motor 2060.
- the height of the mounting slot 20113A is greater than the thickness of the filter 2040, so that when the filter 2040 is mounted on the mounting slot 20113A, the filter 2040 does not protrude from the The top of the package part 2011.
- the filter 2040 is square, and the shape of the mounting groove 20113A is adapted to the shape of the filter 2040. That is, the mounting groove 20113A has a square ring shape and communicates with the through hole 201100.
- the mounting slot 20113A can be used to mount the filter 2040, while in other implementations of the invention, the mounting slot 20113A can be used to mount the installation.
- the moving focus module is taken as an example for description, and in other embodiments of the present invention, the camera may be a certain focus module, It will be understood by those skilled in the art that the type of camera module is not a limitation of the present invention.
- the camera module includes a seat 2070B for mounting the filter 2040.
- the holder 2070B is mounted to the package portion 2011, the filter 2040 is mounted to the package portion 2011, and the motor 2060 or the lens 2050 is mounted to the holder 2070B.
- the holder 2070B has a first seating groove 2071B and a second seating groove 2072B for mounting the filter 2040.
- the surface of the filter 2040 does not protrude from the top end of the holder 2070B.
- the second seating groove 2072B is mounted on the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070, and the position of the filter 2040 is relatively downward, thereby reducing The back focal length of the camera module is small.
- the holder 2070B extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive chip 2030, and utilizes the space in the through hole 201100.
- the filter 2040 When the filter 2040 is stably mounted, the filter 2040 does not occupy an external space.
- the distance inwardly extending from the holder 2070B is outside the photosensitive area of the photosensitive chip 2030, that is, the holder 2070B does not block the photosensitive area of the photosensitive chip 2030.
- the size of the holder 2070B can be designed according to specific needs.
- a moving focus module is described as an example.
- the lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070B. That is, the holder 2070 provides a mounting position for the filter 2040 and the motor 2060.
- the camera module may also be a fixed focus module.
- the lens 2050 is mounted to the holder 2070B, that is, the holder 2070B provides a mounting position for the filter 2040 and the lens 2050, as will be understood by those skilled in the art.
- the specific structure of the support 2070B and the type of the camera module are not limitations of the present invention.
- Figure 21 is a schematic cross-sectional view showing an image forming process based on a molding process in accordance with an eighth preferred embodiment of the present invention.
- the package portion 2011 has a mounting groove 20113C, and the mounting groove 20113C communicates with the through hole 201100. That is to say, the top surface 20112 of the encapsulation portion 2011 has a stepped structure and does not extend integrally.
- the camera module includes a seat 2070C for mounting the filter 2040.
- the holder 2070C is mounted on the package portion 2011, the filter 2040 is mounted on the package portion 2011, and the motor 2060 or the lens 2050 is mounted on the package portion 2011.
- the holder 2070C is mounted on the mounting groove 20113C of the package portion 2011, and the height of the mounting groove 20113C is greater than the mounting height of the holder 2070C, so that the holder 2070C does not protrude. Out of the end of the encapsulation portion 2011. That is, the support 2070C can be set It is placed inside the package portion 2011.
- the holder 2070C has a first seating groove 2071C and a second seating groove 2072C for mounting the filter 2040.
- the surface of the filter 2040 does not protrude from the top end of the holder 2070C.
- the second seating groove 2072C is mounted on the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070C, and the position of the filter 2040 is downward.
- the back focus of the camera module is reduced.
- the support 2070C may not have the second seat groove 2072C, and the flat bottom surface of the support 72C is directly attached to the package portion 2011.
- the holder 2070C extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive chip 2030, and utilizes the space in the through hole 201100.
- the filter 2040 When the filter 2040 is stably mounted, the filter 2040 does not occupy an external space. Further, the holder 2070 is located outside the photosensitive area of the photosensitive chip 2030 so as not to block the photosensitive path of the photosensitive chip.
- the distance inwardly extending from the holder 2070C is outside the photosensitive area of the photosensitive chip 2030, that is, the holder 2070C does not block the photosensitive chip 2030 to avoid affecting the object.
- the photosensitive process of the photosensitive chip 2030, the size of the support 2070C can be designed according to specific needs.
- the second seating groove 2072C and the mounting groove 20113C of the package cooperate with each other to form a matching snap-fit structure, so that the support 2070C can be stably installed.
- the installation slot 20113C In contrast to the third preferred embodiment, the filter 2040 in this embodiment is smaller than the photosensitive chip 2030, and the camera module having a smaller back focus can be obtained.
- a moving focus module is described as an example.
- the lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070C. That is, the holder 2070C provides a mounting position for the filter 2040 and the motor 2060.
- the camera module may also be a fixed focus module.
- the lens 2050 is mounted to the holder 2070C, that is, the holder 2070C provides a mounting position for the filter 2040 and the lens 2050, as will be understood by those skilled in the art.
- the specific structure of the support 2070 and the type of the camera module are not limitations of the present invention.
- FIG. 22 it is a schematic cross-sectional view of a camera module based on a molding process in accordance with a ninth preferred embodiment of the present invention.
- the filter 2040 is mounted to a motor 2060D that is mounted to the package portion 2011 so that no additional components need to be provided to mount the filter 2040. .
- the motor 2060D includes a lower end 2062D that is adapted to be mounted to the filter 2040. That is, the lens 2050 is attached to the upper end of the motor 2060D, and the filter 2040 is attached to the lower end portion 2062D of the motor 2060D, below the lens 2050.
- the filter 2040 is mounted to the motor 2060D so that no additional components need to be provided to mount the filter 2040, and the motor 2060D is directly mounted.
- the motor 2060D is provided with flat mounting conditions.
- the lens 2050E includes a lens barrel 2051E and at least one lens 2052E, and each of the lenses 2052E is mounted in the lens barrel 2051E.
- the filter 2040 is mounted within the barrel 2051E below each of the lenses 2052E so that no additional components need to be provided to mount the filter 2040.
- the lens barrel 2051E includes a bottom portion 20511E for mounting the filter 2040.
- the base of the lens barrel 2051E is adapted to the shape of the filter 2040, that is, the base has a hollow square structure to facilitate mounting the filter 2040 therein.
- the upper portion of the lens barrel 2051E is used to mount the lens 2052E, and the shape of the lens 2052E is adapted, and the lower portion is used to mount the filter 2040 and is adapted to the shape of the filter 2040.
- the upper portion of the lens barrel 2051E is a circular tubular cylinder, and the inner portion of the lower portion is square, and the circular tube and the square are integrally connected.
- the motor 2060 is mounted to the package portion 2011, and the filter 2040 is mounted to the lens barrel 2051E, so that it is not necessary to provide an additional component to mount the filter 2040.
- the circuit board assembly 2010 includes a circuit board main body 20121F having a passage 201212F, and a lower portion of the passage 201212F is adapted to mount the photosensitive chip 2030.
- Each of the paths causes the upper and lower sides of the circuit board main body 20121F to communicate, so that when the photosensitive chip 2030 is attached to the circuit board main body 20121F by the back surface of the circuit board main body 20121F and the photosensitive area is upward
- the photosensitive area of the photosensitive chip 2030 is capable of receiving light entering by the lens 2050.
- the circuit board main body 20121F has an outer groove 201213F, and the outer groove 201213F communicates with the corresponding path to provide a mounting position of the photosensitive chip 2030.
- the outer surface of the photosensitive chip 2030 and the outer surface of the circuit board main body 20121F are in the same plane, thereby ensuring the circuit board. Surface flatness of component 2010.
- the passage is stepped to facilitate mounting of the photosensitive chip 2030, providing a stable mounting position for the photosensitive chip 2030, and exposing its photosensitive region to the inner space.
- a chip mounting method different from the conventional one that is, a flip chip (FC) is provided.
- the photosensitive chip 2030 is attached to the wiring board main body 20121F from the back surface direction of the wiring board main body 20121F instead of the front surface of the wiring board main body 20121F, that is, from the wiring board as in the above embodiment.
- the photosensitive region of the photosensitive chip 2030 is mounted on the wiring board main body 20121F upward.
- the structure and the mounting manner are such that the photosensitive chip 2030 and the package portion 2011 are relatively independent, and the mounting of the photosensitive chip 2030 is not affected by the package portion 2011, and the molding portion of the package portion 2011 is molded.
- the effect of the photosensitive chip 2030 is also small.
- the photosensitive chip 2030 is embedded in the line
- the outer side surface of the road board main body 20121F does not protrude from the inner side surface of the circuit board main body 20121F, so that a larger space is left inside the circuit board main body 20121F, so that the height of the encapsulation portion 2011 is not
- the height of the photosensitive chip 2030 is limited, so that the package portion 2011 can reach a smaller height.
- the filter 2040 is mounted on the upper end of the path, that is, the filter 2040 covers the path of the circuit board body 20121F.
- the filter 2040 does not need to be mounted on the package portion 2011, thereby greatly reducing the back focus of the array camera module and reducing the height of the image.
- the filter 2040 can be an embodiment of an infrared cut filter IRCF. That is, the filter 2040 is mounted to the wiring board main body 20121F without providing an additional component such as a holder.
- the package portion 2011 has a mounting groove 20113G, and the mounting groove 20113G communicates with the through hole 201100. That is to say, the top surface 20112G of the encapsulation portion 2011 has a stepped structure and does not extend integrally.
- the camera module includes a seat 2070G for mounting the filter 2040.
- the holder 2070G is mounted to the package portion 2011, the filter 2040 is mounted to the holder 2070G, and the motor 2060 or the lens 2050 is mounted to the package portion 2011.
- the holder 2070G can be fixedly mounted to the package portion 2011 by bonding.
- the encapsulation portion 2011 has a convex step 20115G on at least two side faces of the top side, at least one side surface does not have the above-mentioned convex step 20115G, and a mounting groove 20113G is formed. That is, in this embodiment, the cross section of the mounting groove 20113G is not a closed structure, but a notch 201131G exists at least on one side. For the sake of smoothness, at least two symmetrical said raised steps 20115G may be provided, ie two symmetrical said mounting grooves 20113 are formed. For example, the number of the protrusion steps 20115G may be one, two, three or four.
- the two sides of the symmetry may be selectively disposed on the two sides of the symmetry, and the other two sides are symmetrically formed by the notch 201131G; when the number of the protrusions 20115G is three Optionally, any three sides are disposed, and one of the notches 201131G is formed; when the number of the protruding steps 20115G is four, the notch 201131G is not formed, that is, the raised step 20115G is closed, The installation slot 20113G is closed.
- the support 2070G and the protruding step 20115 of different structures and the mounting groove 201131G formed thereof are matched, when the support 2070G is mounted on the mounting groove 20113G,
- the notch 201131G is filled to form a closed inner environment for the photosensitive chip 2030.
- the mount 2070G can extend to the gap 201131G.
- the shape of the protruding step 20115G may be a regular linear structure or an irregular bending structure.
- the cross-sectional structure of the support 2070G may be a regular structure or an irregular bent structure.
- the support 2070G includes at least one extended edge 2073G, and the extended edge 2073G corresponds to the notch 201131G of the mounting slot 20113G.
- the number of positions of the extended sides 2073G corresponds to the number and position of the notches 201131G.
- the extended side 2073G is not required to be provided, and each side of the support 2070 corresponds to the mounting groove 20113G.
- the encapsulation portion 2011 may not be provided with the protruding step 20115G, that is, the encapsulation portion 2011 forms a platform structure, and the support 2070 is mounted on the The platform structure, and correspondingly, the support 2070G includes four extending sides 2073G, respectively adapted to be overlapped on the sides of the encapsulation portion 2011.
- the width of each of the extended sides may be determined according to the width of the encapsulation portion 2011, and is not limited to a uniform width, that is, the support may have a wider extension edge 2073G, or may have a narrower The extended edge 2073G.
- the holder 2070G is mounted on the mounting groove 20113G of the package portion 2011, and the height of the mounting groove 20113G is greater than the mounting height of the holder 2070G, so that the holder 2070G does not protrude.
- the height of the mounting groove 20113G is 0.05 mm larger than the height of the support 2070G, so that when the motor 2060 is mounted on the package portion 2011, the bottom of the motor 2060 is not directly in contact with the The holder 2070G and the lens mounted in the motor 2060 are also not in contact with the holder 2070G.
- a moving focus camera module is taken as an example, the motor is mounted on the package portion 2011, and in other embodiments of the present invention, The camera module may also be a fixed focus module.
- the lens 2050 is mounted on the package portion 2011. In particular, the holder 2070G is not in direct contact with the lens barrel and the lens of the lens 2050.
- the top portion of the encapsulation portion 2011 may form the convex step 20115 on three sides, and the other side without the convex step 20115 to directly support the support 2070G.
- the left and right sides have the raised step 20115, and the inner side thereof is used to mount the holder 2070G.
- the top surface of the encapsulation portion 2011 on the left side directly supports the support 2070G
- the inner side of the convex step 20115 on the right side is used to perform the support 2070G on the right side.
- the top surface of the raised step 20115 may be higher than the top surface of the support 2070G, such that the motor 2060 is attached to the raised step 20115, because the package portion 2011 The motor 2060 is only integrally formed with the convex step 20115 of the package portion 2011, so that the tilt of the motor 2060 can be reduced.
- the circuit component 20122 may not be uniformly arranged on the circuit board main body 20121, so the position of the package portion 2011 reserved on the circuit board main body 20121 is not a regular symmetrical relationship. For example, a wider one is reserved on the side with the circuit element 20122, and the side without the circuit element 20122 is relatively narrow. In this case, there is a problem in that the package portion is narrow.
- the mounting slot is more difficult to set, and in this embodiment of the invention, the mounting slot 20113G is U-shaped, that is, on the narrow side of the encapsulation portion 2011, the mounting slot 20113G The 113G is open to the outside, and the package portion 2011 is wider.
- the mounting groove 20113G communicates only with the through hole 201100, and does not communicate with the external environment, thereby forming a U-shaped mounting groove 20113G.
- the holder 2070G is mounted to the mounting groove 20113G, and stable support can be obtained in a wider or narrower region of the package portion 2011, so that the filter 2040 is stably mounted.
- the extended side 2073G of the holder 2070G is filled in the opening of the U-shaped structure, so that the mounting groove 20113G is closed, and the top surface height of the package portion 2011 is relatively uniform for easy installation.
- the motor 60 or the lens 50 is used to the mounting groove 20113G, and stable support can be obtained in a wider or narrower region of the package portion 2011, so that the filter 2040 is stably mounted.
- the extended side 2073G of the holder 2070G is filled in the opening of the U-shaped structure, so that the mounting groove 20113G is closed, and the top surface height of the package portion 2011 is relatively uniform for easy installation.
- the height of the mounting groove 20113G is greater than the height of the support 2070G, so in the U-shaped opening area of the mounting groove 20113G, when the support 2070G is When the mounting slot 20113G is mounted, there is a gap between the support 2070G and the side of the motor 2060, so in the camera module, the gap is sealed by a seal, so that the photosensitive The chip 2030 is isolated from the outside.
- the seal is a gel. That is, after the camera module is assembled, the holder 2070G is attached to the package portion 2011 by the gel to seal.
- the holder 2070G has a first seating groove 2071G and a second seating groove 2072G, and the first seating groove 2071G is used to mount the filter 2040.
- the surface of the filter 2040 does not protrude from the top end of the holder 2070G.
- the second seating groove 2072G is mounted to the encapsulation portion 2011 such that the encapsulation portion 2011 extends upward along the support 2070G, and the filter 2040 is positioned downwardly, thereby The back focus of the camera module is reduced.
- the shape of the first seat groove 2071G matches the shape of the filter 2040, and the shape of the second seat groove 2072 matches the shape of the mounting groove 20113 of the package portion 2011.
- the holder 2070G extends into the through hole 201100 and extends downward to support the filter 2040 over the photosensitive chip 2030, and utilizes the space in the through hole 201100.
- the filter 2040 When the filter 2040 is stably mounted, the filter 2040 does not occupy an external space.
- the distance inward of the holder 2070G is outside the photosensitive area of the photosensitive chip 2030, that is, the holder 2070G does not block the photosensitive chip 2030 to avoid affecting the object.
- the photosensitive process of the photosensitive chip 2030, the size of the support 2070G can be designed according to specific needs.
- the second seating groove 2072G and the mounting groove 20113G of the encapsulation portion 2011 cooperate to form a matching snap-fit structure, thereby stabilizing the support 2070G.
- the filter 2040 in this embodiment is smaller than the photosensitive chip 2030, and the camera module having a smaller back focus can be obtained.
- a moving focus module is described as an example.
- the lens 2050 is press-fitted to the motor 2060, and the motor 2060 is mounted to the holder 2070G. That is, the holder 2070C provides a mounting position for the filter 2040 and the motor 2060.
- the camera module may also be a fixed focus module.
- the lens 2050 is mounted to the holder 2070G, that is, the holder 2070G provides a mounting position for the filter 2040 and the lens 2050, as will be understood by those skilled in the art. Support 2070G
- the specific structure and type of the camera module are not limitations of the present invention.
- the support 2070G can be designed as a different structure according to different needs, such as the support 1070 of the foregoing embodiment, the support 2070 and the subsequent support 3070G, the branch.
- the seat 3070H facilitates the mounting of different components, such as the filter 2040, the motor 2060, the lens 2050, and the like.
- the filter 2040 is mounted to the holder 2070G
- the holder 2070G is mounted to the package portion 2011,
- the lens 2050 is mounted to the motor 2060.
- the bottom portion of the motor 2060 is supported by the package portion 2011, and the other portion is located above the support 2070G, for example, while being lapped to the support 2070G to form a moving focus module.
- the bottom portion of the lens 2050 is supported by the package portion 2011, and the other portion is located above the support 2070G to form a certain focus module.
- the filter 2040 is mounted to the holder 2070
- the holder 2070 is mounted to the package portion 2011, and the lens is mounted to the motor 2060.
- the motor 2060 is completely supported and mounted on the package portion 2011 without the support of the support 2070, that is, the support is completely inside the package portion 2011.
- the lens 2050 is completely supported and mounted on the package portion 2011 to form a certain focus module.
- the motor 2060 or the lens 2050 is fully supported and mounted on the holder 2070, that is, the holder 2070 is disposed on the package portion 2011 and the Between the motor 2060 or the lens 2050.
- the filter 2040 is not mounted to the holder but is mounted to the photosensitive chip 2030 or the wiring board main body 20121.
- the camera module may also be fixed-focus molding, and those skilled in the art. It should be understood that the type of camera module is not a limitation of the present invention. As shown in FIGS. 27 to 29, it is a camera module based on an integrated packaging process according to a thirteenth preferred embodiment of the present invention.
- the camera module can be applied to various electronic devices to assist the electronic device to perform shooting activities through the camera module.
- the camera module can be used to capture images or video images of objects or people. Wait.
- the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be, but not limited to, a mobile phone or a tablet device.
- the camera module includes an integrated base assembly 3010, a sensor chip 3030, and a lens 3050.
- the photosensitive chip 3030 is mounted on the integrated base assembly 3010, the lens 3050 is located on the integrated base assembly 3010, and the lens 3050 is located in a photosensitive path of the photosensitive chip 3030.
- the integral base assembly 3010 can be coupled to the electronic device for use with the electronic device. It should be understood by those skilled in the art that the lens 3050 and the photosensitive chip 3030 can cooperate with each other to capture an image. Specifically, light reflected by a subject, such as an object or a character, is received by the sensor chip 3030 for photoelectric conversion after passing through the lens 3050. In other words The sensor chip 3030 can convert an optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the integrated base assembly 3010, thereby generating and photographing on the electronic device. Object related image.
- the unitary base assembly 3010 includes a base portion 3011 and a circuit board portion 3012 integrally connected to the circuit board portion 3012, such as moldedly connected to the circuit board portion 3012. . More specifically, the base portion 3011 is molded and connected to the wiring board portion 3012 by molding in a Molding On Board (MOB). That is, the base portion 3011 is directly connected to the circuit board portion 3012 instead of being connected by an intermediate such as glue, so that the base portion 3011 has a good connection with the circuit board portion 3012. Firmness.
- MOB Molding On Board
- the circuit board portion 3012 includes a circuit board main body 30121, and the base portion 3011 is integrally connected to the circuit board main body 30121.
- the base portion 3011 defines a through hole 301100 such that the base portion 3011 surrounds the outside of the photosensitive chip 3030 and provides a light path of the lens 3050 and the photosensitive chip 3030.
- the photosensitive chip 3030 is disposed on the circuit board main body 30121 at a position corresponding to the through hole 301100.
- the circuit board portion 3012 includes a connection circuit and at least one circuit component 30122.
- the connection circuit is preset to the circuit board main body 30121, and the circuit component 30122 is electrically connected to the connection circuit for the photo sensor chip.
- the circuit component 30122 can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, a processor, a memory, and the like.
- the base portion 3011 can cover the circuit component 30122 inside, thus making the circuit component 30122 not directly exposed to the space, more specifically, not exposed to the
- the photosensitive chip 3030 is in a closed environment in which it is connected.
- the circuit device in different conventional camera modules exists in such a manner that the resisting container member protrudes from the circuit board, thereby preventing dust and debris from staying in the circuit component 30122 and contaminating the photosensitive chip 3030.
- the circuit component 30122 is illustrated as being exemplified by the circuit board body 30121. In other embodiments of the invention, the circuit component 30122 is embedded in the circuit.
- the inside of the board main body 30121 does not protrude from the board main body 30121, and it should be understood by those skilled in the art that the structure, type, and position of the circuit element 30122 are not limited by the present invention. It can be understood that in the camera module of the transmission, the circuit device protrudes from the circuit board, and the base can only be mounted on the outer side of the circuit component 30122, so the circuit device and the base need to be fixed. The spatial position, therefore, requires a higher dimension in the lateral direction of the board.
- the base portion 3011 is integrally packaged in the circuit board main body 30121, and covers the circuit component 30122, so the base portion 3011 and the circuit
- the components 30122 overlap each other in space, thereby increasing the space that the base portion 3011 can be disposed inwardly, reducing the external extension requirement of the circuit board main body 30121, thereby reducing the lateral size of the camera module, so that It can meet the needs of miniaturization equipment.
- the base portion 3011 enclosing the circuit component 30122 has the advantage of protecting the circuit component 30122 from being contaminated and being accidentally touched, and bringing the corresponding camera module.
- the base portion 3011 is not limited to a covering Circuit element 30122. That is, in other embodiments of the present invention, the base portion 3011 may be directly molded to the circuit board main body 30121 of the circuit component 30122 that is not protruding, or may be molded on the circuit. Different positions such as the outer side and the periphery of the element 30122.
- the base portion 3011 is convexly surrounding the outer side of the photosensitive chip 3030.
- the base portion 3011 is integrally closed and connected to have a good sealing property.
- the lens 3050 is mounted on the photosensitive path of the photosensitive chip 3030, the photosensitive chip 3030 is sealed inside to form a corresponding closed inner space.
- a conventional wiring board can be selected as the wiring board main body 30121, and molding is performed on the surface of the wiring board main body 30121.
- the circuit board after the SMT process may be integrally packaged by an injection molding machine by an insert molding process, such as molding, to form the The base portion 3011, or the base portion 3011 is formed by a molding process commonly used in a semiconductor package.
- each of the photosensitive chips 3030 is attached to the wiring board main body 30121, and then the photosensitive chips 3030 and the wiring board main body 30121 are electrically connected, for example, by a gold wire.
- the circuit board main body 30121 may be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
- the manner in which the base portion 3011 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
- the material of the base portion 3011 can be selected, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene, polypropylene), etc., and the molding process can be adopted. Epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
- the process of manufacturing the integrated base assembly 3010 may be performed by performing an SMT process on the circuit board main body 30121, and then mounting the photosensitive chip 3030 on the circuit board main body. 30121, and electrically connecting the photosensitive chip 3030 to the circuit board main body 30121, such as a gold wire electrical connection, and then integrally packaging the circuit board main body 30121, such as molding and packaging, by insert molding.
- the base portion 3011 is formed, or the base portion 3011 is formed by a molding process commonly used in a semiconductor package. It will be understood by those skilled in the art that the order of manufacture of the unitary base assembly 3010 is not a limitation of the present invention.
- the camera module includes a filter 3040 that is mounted to the base portion 3011 to provide stable, flat mounting conditions for the filter 3040.
- the filter 3040 is implemented as an Infra-Red Cut Filter (IRCF), which uses a precision optical coating.
- IRCF Infra-Red Cut Filter
- the technology alternately applies a high refractive index optical film on an optical substrate to realize a high-transmission, near-infrared (700-1100 nm) cut-off optical filter in the visible light region (400-630 nm), which can eliminate infrared light to the photosensitive chip.
- 3030 imaging effects such as CCD or CMOS.
- the sensor chip 3030 such as CCD or CMOS
- the sensing of light and Different from the human eye the human eye can only see visible light in the 380-780 nm band, and the photosensitive chip 3030 can sense more wavelength bands, such as infrared light and ultraviolet light, especially sensitive to infrared light, so in the imaging mode In the group, the infrared light must be suppressed, and the high transmittance of the visible light is kept, so that the sensing of the photosensitive chip 3030 is close to the human eye, so that the image captured by the camera module also conforms to the sensing of the eye, so
- the infrared cut filter 3040 is indispensable for the camera module.
- the filter 3040 may be selected from the group consisting of a wafer level infrared cut filter, a narrow band filter, and a blue glass IRCF. It will be understood by those skilled in the art that the type of filter 3040 is not a limitation of the present invention.
- the filter In the conventional COB assembled camera module, the filter is usually mounted on a plastic base, and the base is usually attached to the circuit board by bonding, so the plastic base and the corresponding mounting manner are not easily offset. Or tilting, and the surface of the plastic bracket is poorly flat, so the filter 3040 cannot be provided with good mounting conditions.
- the filter 3040 is mounted to the base portion 3011, and based on the molding process, good surface flatness can be obtained, thereby providing the filter 3040 with a flat surface.
- the mounting conditions and the integrally formed manner make the base portion 3011 less prone to eccentricity and tilting, thereby reducing the cumulative tolerance when the filter 3040 is mounted.
- the shape of the base portion 3011 can be determined as needed, for example, extending inwardly at the position of the circuit component 30122 to form a protrusion, thereby increasing the corresponding width of the base portion 3011. In the absence of the circuit component 30122, the base portion 3011 extends uniformly to form a relatively regular shape with a small width. It will be understood by those skilled in the art that the specific shape of the base portion 3011 is not a limitation of the present invention.
- the base portion 3011 includes a covering portion 30114 and a filter mounting portion 30115.
- the filter mounting portion 30115 is integrally molded and integrally connected to the covering portion 30114.
- the covering portion 30114 Molded to the circuit board body 30121 for cladding the circuit component 30122.
- the filter mounting section 30115 is for mounting the filter 3040.
- the filter 3040 of the camera module is mounted to the filter mounting section 30115 such that the The filter 3040 is located on the corresponding photosensitive path of the photosensitive chip 3030, and does not require an additional filter 3040 mounting bracket.
- the base portion 3011 has the function of a conventional mirror base here, but based on the advantages of the integrated packaging process, the top of the filter mounting section 30115 can be made to have a good process by means of a mold process.
- the flatness is such that the filter 3040 is mounted flat, which is also superior to the conventional camera module.
- the filter mounting portion 30115 forms a mounting slot 30113, and the mounting slot 30113 communicates with the through hole 301100 to provide sufficient installation space for the filter 3040, so that the filter 3040 It does not protrude from the top surface of the filter mounting section 30115. That is, the mounting groove 30113 is disposed at the upper end of the base portion 3011, so that the filter 3040 is stably mounted to the base portion 3011 and does not protrude from the base portion 3011. The top of the.
- the mounting slot 30113 can be used to mount the filter 3040, while in other implementations of the invention, the mounting slot 30113 can be used for mounting.
- the components of the motor or lens of the camera module those skilled in the art should understand that the use of the mounting slot 30113 is not a limitation of the present invention.
- the base portion 3011 has the mounting groove 30113, and the mounting groove 30113 communicates with the through hole 301100 to provide a sufficient installation space for the filter 3040. That is, the top surface 30112 of the base portion 3011 has a stepped structure, and does not extend integrally. The steps of the top surface 30112 can be used to mount the filter 3040 and the lens 3050. Or the motor 3060.
- the height of the mounting groove 30113 is greater than the thickness of the filter 3040, so that when the filter 3040 is mounted on the mounting groove 30113, the filter 3040 does not protrude from the The top end of the base portion 3011.
- the filter 3040 has a square shape, and the shape of the mounting groove 30113 is adapted to the shape of the filter 3040. That is, the mounting groove 30113 has a square ring shape in cross section and communicates with the through hole 301100.
- the mounting slot 30113 can be used to mount the filter 3040, while in other implementations of the invention, the mounting slot 30113 can be used to mount the device.
- the camera module includes a motor 3060, such as a voice coil motor, and the lens 3050 is mounted to the motor 3060 to facilitate movement of the lens 3050 by the motor 3060. Adjusting the focal length of the camera module, that is, the camera module is an Automatic Focus Module (AFM).
- the motor 3060 is electrically connected to the circuit board body 30121 through at least one motor pin 3061.
- the moving focus module is taken as an example for description, and in other embodiments of the present invention, the camera may be a certain focus module, It will be understood by those skilled in the art that the type of camera module is not a limitation of the present invention.
- the motor 3060 is mounted to the base portion 3011 of the unitary base assembly 3010. Further, the motor 3060 is mounted to the top surface 30112 of the base portion 3011, that is, the The filter 3040 and the motor 3060 coordinately occupy the top surface 30112 of the base portion 3011.
- the motor 3060 is electrically connected to the circuit board body 30121 through at least one motor pin 3061.
- the lens 3050 is mounted on the motor 3060, and the motor 3060 and the filter 3040 are mounted on the base portion 3011, so that the base portion 3011 functions as a base of a conventional camera module.
- the motor 3060 and the filter 3040 are provided with a supported, fixed position, but the manufacturing, assembly, and form are different from the conventional COB process.
- the base of the camera module of the conventional COB process is fixed to the circuit board in an adhesive manner, and the base portion 3011 is fixed to the circuit board main body 30121 by molding on the circuit board, and the bonding and fixing process is not required.
- the molding method has better connection stability and controllability of the process with respect to the bonding and fixing manner, and has higher flatness, and provides good mounting conditions for the motor 3060 and the filter 3040, and
- the base portion 3011 and the circuit board main body 30121 do not have an AA-adjusted glue space, thereby eliminating the reserved space of the conventional camera module AA adjustment.
- the thickness of the camera module is reduced.
- the base portion 3011 covers the circuit component 30122, so that the conventional base space and the circuit component 30122 installation space can be spatially overlapped.
- a safe distance is reserved around the circuit device, so that the base portion 3011 having a base function can be disposed in a small size, thereby further providing a space in which the thickness of the camera module can be reduced.
- the base portion 3011 replaces the conventional base, avoiding the tilt error caused by the base during the assembly and assembly, and reducing the cumulative tolerance of the assembly of the camera module.
- the shape of the base portion 3011 can be more determined, for example, extending inwardly at the position of the circuit component 30122 to form a protrusion, thereby increasing the corresponding width of the base portion 3011. In the position where the circuit component 30122 is absent, the joined body molding portion uniformly extends to form a relatively regular shape with a small width. It will be understood by those skilled in the art that the shape of the base portion 3011 is not a limitation of the present invention.
- the photosensitive chip 3030 can be electrically connected to the wiring board main body 30121 through at least one connection line 3031, and can be electrically connected to the connection line.
- the connection line 3031 can be implemented as, for example but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire.
- the connecting line 3031 of the photosensitive chip 3030 may be connected to the circuit board main body 30121 by a conventional COB method, for example, but not limited to, a soldering manner. That is to say, the connection between the photosensitive chip 3030 and the circuit board main body 30121 can fully utilize the existing mature connection technology to reduce the cost of the improved technology, fully utilize the traditional process and equipment, and avoid waste of resources.
- the connection between the photosensitive chip 3030 and the circuit board main body 30121 can also be realized by any other connection manner of the inventive object of the present invention, and the present invention is in this aspect. Unlimited.
- each of the photosensitive chips 3030 is disposed on an upper surface of the circuit board main body 30121, and the base portion 3011 surrounds an outer side of the photosensitive chip 3030.
- different manufacturing sequences may be selected.
- the photosensitive chip 3030 may be first mounted on the circuit board main body 30121, and then On the outer side of the photosensitive chip 3030, the base portion 3011 is molded on the wiring board main body 30121, and the circuit component 30122 protruding from the wiring board main body 30121 is covered inside.
- the base portion 3011 may be molded on the circuit board main body 30121, and the circuit component 30122 protruding from the circuit board main body 30121 may be packaged.
- the photosensitive chip 3030 is attached to the inside of the wiring board main body 30121 so as to be located inside the base portion 3011.
- another embodiment of a camera module according to a thirteenth preferred embodiment of the present invention may be a Fix Focus Module (FFM).
- FAM Fix Focus Module
- the lens 3050 is mounted on the top surface 30112 of the base portion 3011, that is, the focal length of the camera module cannot be freely adjusted.
- the lens 3050 and the filter 3040 coordinately configure the top surface 30112 of the base portion 3011, and the filter 3040 is mounted with the mounting groove 30113.
- the type of imaging molding is not a limitation of the present invention.
- the base portion 3011 can be used Supporting the mounting of the filter 3040 and the lens 3050, having the function of a conventional base, and based on the advantages of molding, the base portion 3011 can control the flatness and consistency of the base portion 3011 by means of a mold. Thereby providing a flat and consistent mounting environment for the filter 3040 and the lens 3050 of the camera module, thereby more easily ensuring the optical axis consistency of the lens 3050 and the filter 3040 and the sensor chip 3030. This is not easy to achieve with traditional camera modules.
- the integrated base assembly 3010 of the camera module includes a motor connection structure 3013 for connecting the motor of the camera module. 3060.
- the motor 3060 has at least one motor pin 3061.
- the motor connection structure 3013 includes at least one lead 30131, and each of the leads 30131 is for electrically connecting the motor 3060 and the circuit board main body 30121.
- Each of the leads 30131 is electrically connected to the board main body 30121. Further, each of the leads 30131 is electrically connected to a connection circuit of the circuit board main body 30121.
- the lead wire 30131 is disposed to the base portion 3011 and extends to a top end of the base portion 3011.
- the lead wire 30131 includes a motor connection end 3013111311 exposed at a top end of the base portion 3011 for electrically connecting the motor pin 3061 of the motor 3060. It is worth mentioning that the lead wire 30131 can be disposed in an embedded manner when the base portion 3011 is formed. In the conventional connection mode, components such as a drive motor are connected to the circuit board by providing separate wires, and the manufacturing process is relatively complicated, and the method of embedding the lead wires 30131 in the molding of the present invention can replace the conventional one. Processes such as motor welding and make the circuit connection more stable.
- the lead wire 30131 is a wire that is embedded inside the base portion 3011.
- the motor pin 3061 motor pin 3061 may be connected to the motor connection end 301311 through an anisotropic conductive film, or may be connected to the motor connection end 301311 by soldering.
- the buried position of the lead 30131 and the position of the motor connecting end 301311 of the lead 30131 at the base portion 3011 can be set as needed, for example, in an embodiment of the invention.
- the motor connection end 301311 of the lead wire 30131 may be disposed at a periphery of the base portion 3011, that is, a top surface of the base portion 3011, a top surface of the filter mounting portion 30115, and In another embodiment of the present invention, the motor connection end 301311 can be disposed on the inner circumference of the base portion 3011, that is, the bottom surface of the mounting groove 30113 of the base portion 3011, so that the motor can be provided. 3060 different installation locations.
- the motor connection end 301311 is disposed on the peripheral top surface of the base portion, when the motor 3060 needs to be mounted to the mounting groove 30113.
- the motor connecting end 301311 is disposed on the inner circumference of the base portion 3011, that is, the bottom surface of the mounting groove 30113.
- each of the photosensitive chips 3030 may be attached to the wiring board main body 30121, and then the MOB manner is molded on the wiring board main body 30121.
- a base portion 3011, and the lead wire 30131 may be disposed inside the base portion 3011 in a buried manner during molding, and the lead wire 30131 is electrically connected to the circuit board main body 30121, and the lead wire 30131 is caused
- the motor connection end 301311 is displayed at a top end of the base portion to facilitate connection to the motor pin 3061 of the motor 3060.
- each of the motor pins 3061 of the motor 3060 is soldered.
- the method is connected to the motor connection end 301311 of the lead wire 30131, so that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire is required to connect the motor 3060 and the circuit board main body 30121. And the length of the motor pin 3061 of the motor 3060 can be reduced.
- FIG 31B is an equivalent embodiment of the motor connection structure in accordance with the above-described preferred embodiment of the present invention.
- the motor connection structure 3013 includes a lead slot 30133 for receiving the motor pin 3061 motor pin 3061 of the motor 3060 of the camera module.
- the lead groove 30133 is provided at an upper end of the base portion 3011.
- the motor connection structure 3013 includes at least one lead 30134, each of the leads 30134 for electrically connecting the motor 3060 and the circuit board body 30121.
- the lead wire 30134 is disposed to the base portion 3011 and extends upward to a groove bottom wall of the lead groove 30133 of the base portion 3011.
- the lead 30134 includes a motor connection end 301341 exposed on the bottom wall of the pin slot 30133 of the base portion 3011 for electrically connecting the motor pin 3061 of the motor 3060 to the motor pin 3061.
- the motor connection end 301341 can be implemented as a pad.
- the lead wire 30134 may be implemented as a wire that is buried inside the base portion 3011.
- the photosensitive chip 3030 is first mounted, and then the base portion 3011 is molded on the circuit board main body 30121 in an MOB manner, and preset
- the lead groove 30133 of a predetermined length, and the lead wire 30134 may be disposed in a buried manner at the time of molding, and the lead wire 30134 is electrically connected to the circuit board main body 30121, and the motor of the lead wire 30134 is caused
- a connection end 3013111341 is displayed on the bottom wall of the pin slot 30133 of the base portion 3011 to facilitate connection to the motor pin 3061 of the motor 3060.
- each of the motor pins 3061 of the motor 3060 is inserted into the lead slot 30133, and is connected to the ground by soldering.
- the motor connection end 3013111341 of the lead 30134 so that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire is required to connect the motor 3060 and the circuit board main body 30121, and
- the motor pin 3061 of the motor 3060 can be stably connected to prevent externally unneeded contact with the motor pin 3061.
- the lead 30134 may be implemented as a wire that is embedded inside the base portion 3011.
- the motor connection structure 3013 includes a lead slot 30135 for receiving the motor pin 3061 of the motor 3060 of the camera module.
- the lead groove 30135 is provided to the base portion 3011.
- the motor connection structure 3013 includes at least one circuit contact 30132 that is preset to the circuit board body 30121 and electrically connected to the connection line of the circuit board body 122. Further, each of the lead slots 30135 extends from the top end of the base portion 3011 to the board body 30121, and causes the circuit contacts 30132 to be displayed.
- the motor pin 3061 is adapted to be inserted into the lead slot 30135 and may be soldered to the circuit contact 30132.
- the pin slot 30135 is such that the circuit contact 30132 is shown through the pin slot 30135 to facilitate connection to the motor pin 3061 of the motor 3060.
- each of the motor pins 3061 of the motor 3060 is inserted into the lead slot 30135 and connected to the line by soldering.
- the motor connecting structure 3013 includes an engraving line 30136 for electrically connecting the connecting line on the board main body 30121, the photosensitive chip 3030, and a motor and the like.
- the engraving line 30136 can be disposed by laser forming (LDS) when the base portion 3011 is formed.
- LDS laser forming
- components such as a drive motor are connected to the wiring board by providing separate wires, and the manufacturing process is relatively complicated, and the manner of providing the engraving line 30136 in the molding of the present invention can be replaced.
- the engraving line 30136 may be formed by the fact that the base portion 3011 is now provided with an engraving groove, and then an electric circuit is provided in the engraving groove by electroplating.
- the manner in which the motor 3060 of the camera module is coupled to the integrated base assembly 3010 can be freely combined with the connection manners corresponding to FIGS. 6A, 6B, 6C, and 6D, and is selected to be suitable.
- the motor 3060 is connected in a manner such as the lead slot 30133 and the lead 30134, the lead slot 30135, and the circuit contact 30132.
- the motor 3060 can be coupled to the unitary base assembly 3010 in a conventional manner, such as by welding. It will be understood by those skilled in the art that the manner in which the motor 3060 and the unitary base assembly 3010 are coupled is not a limitation of the present invention.
- the unitary base assembly 3010 includes a circuit board body 30121A.
- the circuit board main body 30121A includes two inner recesses 301211A, and each of the photosensor chips 3030 is disposed in the corresponding inner recess 301211A.
- the photosensitive chip 3030 is disposed in the inner groove 301211A, and the photosensitive chip 3030 is accommodated therein, so that the photosensitive chip 3030 does not protrude significantly.
- the upper surface of the circuit board main body 30121A reduces the height of the photosensitive chip 3030 relative to the base portion 3011, thereby reducing the height restriction of the photosensitive chip 3030 on the base portion 3011, and further reducing the height.
- the possibility that the photosensitive chip 3030 is mounted in the inner groove 301211A can protect the photosensitive chip 3030, especially the connecting line 3031, from external components from being inadvertently touched by the photosensitive chip 3030.
- the photosensitive chip 3030 is connected to the circuit board main body 30121 through the connection line 3031, and is electrically connected to the connection line.
- the leads can be implemented, for example, but not limited to, Gold wire, copper wire, aluminum wire, silver wire. That is, the photosensitive chip 3030 and the connecting line 3031 are both located in the inner groove 301211A of the wiring board main body 30121A.
- the inner groove 301211A needs to be disposed on the circuit board main body 30121A. That is, the inner groove 301211A is opened on a conventional wiring board to be adapted to accommodate the mounting of the photosensitive chip 3030.
- Figure 33 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with a sixteenth preferred embodiment of the present invention.
- the integrated base assembly 3010 includes a circuit board body 30121B having a via 301212B, and a lower portion of the via 301212B is adapted to mount the photosensitive chip 3030.
- the via 301212B causes the upper and lower sides of the wiring board main body 30121B to communicate, so that when the photosensitive chip 3030 is mounted on the back surface of the wiring board main body 30121B and the photosensitive area is mounted upward on the circuit board main body 30121B,
- the photosensitive area of the photosensitive chip 3030 is capable of receiving light entering by the lens 3050.
- the circuit board main body has an outer groove 301213B, and the outer groove 301213B communicates with the corresponding path 301212B to provide a mounting position of the photosensitive chip 3030.
- the outer surface of the photosensitive chip 3030 and the surface of the circuit board main body 30121B are in the same plane, thereby ensuring the integrated base.
- the via 301212B is stepped, thereby facilitating mounting of the photosensitive chip 3030, providing a stable mounting position for the photosensitive chip 3030, and displaying the photosensitive region therein. space.
- a chip mounting method different from the conventional one that is, a flip chip (FC) is provided.
- the photosensitive chip 3030 is attached to the wiring board main body 30121B from the back surface direction of the wiring board main body 30121B instead of being required from the front surface of the wiring board main body 30121B, that is, from the wiring board as in the above embodiment.
- the photosensitive area of the photosensitive chip 3030 is attached to the wiring board main body 30121B upward.
- the structure and the mounting manner are such that the photosensitive chip 3030 and the base portion 3011 are relatively independent, and the mounting of the photosensitive chip 3030 is not affected by the base portion 3011, and the mold of the base portion 3011 The influence of the molding on the photosensitive chip 3030 is also small.
- the photosensitive chip 3030 is embedded on the outer side surface of the circuit board main body 30121B, and does not protrude from the inner side surface of the circuit board main body 30121B, so that a larger space is left inside the circuit board main body 30121B.
- the height of the base portion 3011 is not limited by the height of the photosensitive chip 3030, so that the base portion 3011 can reach a smaller height.
- the filter 3040 is mounted on the upper end of the via 301212B, that is, the filter 3040 does not need to be mounted on the base portion 3011. Thereby reducing the back focus of the camera module and reducing the height of the camera.
- the filter 3040 can be an embodiment of an infrared cut filter IRCF.
- the integrated base assembly 3010 includes a reinforcement layer 30123C that is laminatedly coupled to the bottom layer of the circuit board body 30121 to enhance the structural strength of the circuit board body 30121. That is, the reinforcing layer 30123C is placed on the underlayer of the base portion 3011 and the region where the photosensitive chip 3030 is located on the circuit board main body 30121, so that the circuit board main body 30121 stably and reliably supports the The base portion 3011 and the photosensitive chip 3030.
- the reinforcing layer 30123C is a metal plate attached to the bottom layer of the circuit board main body 30121 to increase the structural strength of the circuit board main body 30121, and on the other hand, the integrated base assembly is added.
- the heat dissipation performance can effectively dissipate the heat generated by the photosensitive chip 3030.
- the circuit board main body 30121 can adopt an FPC (Flex Print Circuit), and the rigidity of the FPC by the reinforcing layer 30123C enables the FPC with good bending performance to satisfy.
- the load bearing requirements of the integral base assembly that is to say, the circuit board body 30121 has a wider range of options, such as a PCB (Printed Circuit Board), FPC, RG (Rigid Flex, soft and hard board).
- the structural strength of the circuit board main body 30121 is increased by the reinforcing layer 30123B and the heat dissipation performance is improved, so that the thickness of the circuit board main body 30121 can be reduced, so that the height of the integrated base assembly is further reduced, and The height of the assembled camera module is reduced.
- Figure 35 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with an eighteenth preferred embodiment of the present invention.
- the circuit board main body 30121D has at least one reinforcing hole 301214D, and the base portion 3011 extends into the reinforcing hole 301214D, thereby enhancing the structural strength of the circuit board main body 30121D.
- the position of the reinforcing hole 301214D can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
- the structural strength of the circuit board main body 30121D is enhanced by the arrangement of the reinforcing holes 301214D, so that the thickness of the circuit board main body 30121D can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the integrated base assembly.
- the reinforcing hole 301214D is in the shape of a groove, so that when the integral base assembly is manufactured, the molding material of the base portion 3011 does not leak out from the reinforcing hole 301214D.
- Figure 36 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with a nineteenth preferred embodiment of the present invention.
- the circuit board main body 30121E has at least one reinforcing hole 301214E that extends into the reinforcing hole 301214E, thereby enhancing the structural strength of the circuit board main body 30121E.
- the position of the reinforcing hole 301214E can be selected according to needs, and is set according to the structural strength requirement of the circuit board, such as a symmetrical structure.
- the structural strength of the circuit board main body 30121E is enhanced by the arrangement of the reinforcing holes 301214E, so that the thickness of the circuit board main body 30121E can be reduced, the thickness of the camera module assembled thereby can be reduced, and the The heat dissipation performance of the integrated base assembly.
- the reinforcing hole 301214E is a through hole, that is, through the circuit board main
- the body 30121E is connected to both sides of the circuit board main body 30121E, so that when the integrated base assembly is manufactured, the molding material of the base portion 3011 is sufficiently combined with the circuit board main body 30121E to form a stronger body.
- the composite structure, and the perforations are easier to manufacture relative to the groove-like structure.
- Figure 37 is a cross-sectional view of a camera module and an integrated base assembly thereof in accordance with a twentieth preferred embodiment of the present invention.
- the base portion 3011F includes a covering portion 30114F, a filter mounting portion 30115F and a lens mounting portion 30116F, the filter mounting portion 30115F and the lens mounting portion.
- the 30116F is integrally molded and coupled to the cladding section 30114F, and the cladding section 30114F is molded and coupled to the wiring board body 30121 for covering the circuit component 30122 and the connection line 3031.
- the filter mounting section 30115F is used to mount the filter 3040, that is, when the integrated base component is used to assemble the camera module, the filter 3040 of the camera module It is mounted to the filter mounting section 30115F such that the filter 3040 is located on the photosensitive path of the photosensitive chip 3030 without the need to provide an additional filter 3040 mounting bracket. That is, the base portion 3011F has the function of a conventional bracket here, but based on the advantages of the integrated packaging process, the top of the filter mounting portion 30115F can be well flattened by means of a mold-forming process. This makes the filter 3040 mounted flat, which is also superior to the conventional camera module.
- the lens mounting section 30116F is used to mount the lens 3050, that is, when the integrated base assembly is used to assemble the camera module, the lens 3050 is mounted on the base portion 3011F.
- the inside of the lens mounting section 113F is provided to provide a stable mounting position for the lens 3050.
- the filter mounting portion 30115F has a mounting slot 30113F, and the mounting slot 30113F communicates with the corresponding through hole 301100F to provide sufficient installation space for each of the filters 3040.
- the filter 3040 is stably mounted.
- the lens mounting section 30116F has a lens mounting slot 301131F, and each of the lens mounting slots 301131F communicates with the corresponding through hole 301100F to provide sufficient mounting space for each of the lenses 3050.
- the filter mounting section 30115F and the lens mounting section 30116F extend integrally upwardly, and a stepped structure is formed inside to provide a support fixing position for the filter 3040 and the lens 3050, respectively.
- the base portion 3011 has two mounting slots, one of which is located at a lower position, and one of the mounting slots 30113F is located at a higher position to form a two-step stepped structure.
- the mounting slot 30113F in the lower position is used to mount the filter 3040, and the mounting slot 301113F in the upper position is used to mount the lens 3050.
- the lens mounting section 30116F has two lens inner walls 301161F, and each of the lens inner walls 301161F has a closed annular shape, which is suitable for providing a mounting space for the lens 3050. It is worth mentioning that each of the lens inner walls 301161F of the lens mounting section 301162F has a flat surface, so as to be suitable for mounting the unthreaded lens 3050 to form a fixed focus module. In particular, the lens 3050 can be fixed to the lens mounting segment 30116F by bonding.
- the integral base assembly 3010 includes a shield layer 30124 that wraps the circuit board body 30121 and the base portion 3011 to enhance the circuit board body While the structural strength of 30121 is increased, the electromagnetic interference resistance of the integrated base assembly 3010 is enhanced.
- the camera module includes at least one seat 3070G for mounting each of the filters 3040, each of the lenses 3050 or each of the motors 3060.
- the holder 3070 is mounted to the base portion 3011, and each of the filters 3040 is mounted to the holder 3070, and each of the motors 3060 is mounted to the holder Block 3070.
- the specific shape of the support 3070 can be set as needed, such as a boss is provided to facilitate the mounting of each of the filters.
- the holder 3070G has a first holder groove 3071G and a second holder groove 3072G, and the first holder groove 3071G is used to mount the filter 3040.
- the surface of the filter 3040 does not protrude from the top end of the holder 3070.
- the second seat groove 3072G is mounted to the base portion 3011 such that the base portion 3011 extends upward along the support 3070G, and the position of the filter 3040 is downward. Thereby reducing the back focus of the camera module.
- the holder 3070G extends into the through hole 301100 and extends downward to support the filter 3040 over the photosensitive chip 3030, and utilizes the space in the through hole 301100.
- the filter 3040 When the filter 3040 is stably mounted, the filter 3040 does not occupy an external space.
- the distance inward of the holder 3070G is outside the photosensitive area of the photosensitive chip 3030, that is, the holder 3070G does not block the photosensitive area of the photosensitive chip 3030.
- the size of the holder 3070G can be designed according to specific needs.
- a moving focus module is described as an example.
- the lens 3050 is press-fitted to the motor 3060, and the motor 3060 is mounted to the holder 3070G. That is, the holder 3070G provides a mounting position for the filter 3040 and the motor 3060.
- the camera module may also be a fixed focus module.
- the lens 3050 is mounted to the holder 3070G, that is, the holder 3070G provides a mounting position for the filter 3040 and the lens 3050, as will be understood by those skilled in the art.
- the specific structure of the support 3070 and the type of the camera module are not limitations of the present invention.
- the camera module includes a seat 3070H for mounting the filter 3040.
- the holder 3070H is attached to the base portion 3011, the filter 3040 is attached to the base portion 3011, and the motor 3060 or the lens 3050 is attached to the base portion 3011.
- the support 3070H is mounted on the mounting groove 30113 of the base portion 3011, and the height of the mounting groove 30113 is greater than the mounting height of the support 3070H, so that the support 3070H does not Projecting from the top end of the base portion 3011.
- the holder 3070H has a first holder groove 3071H and a second holder groove 3072H, and the first holder groove 3071H is used for mounting the filter 3040.
- the surface of the filter 3040 does not protrude from the top end of the holder 3070H.
- the second seat groove 3072H is for mounting on the base portion 3011 such that the base portion 3011 extends upward along the support 3070H, and the position of the filter 3040 is downward. Thereby reducing the back focus of the camera module.
- the holder 3070H extends into the through hole 301100 and extends downward to support the filter 3040 over the photosensitive chip 3030, and utilizes the space in the through hole 301100.
- the filter 3040 When the filter 3040 is stably mounted, the filter 3040 does not occupy an external space.
- the distance inwardly extending from the holder 3070H is outside the photosensitive area of the photosensitive chip 3030, that is, the holder 3070H does not block the photosensitive chip 3030 to avoid affecting the object.
- the photosensitive process of the photosensitive chip 3030, the size of the support 3070C can be designed according to specific needs.
- the second seating groove 3072H and the mounting groove 30113 of the package cooperate with each other to form a matching snap-fit structure, so that the support 3070H can be stably installed in the seat. It is described in the installation groove 30113.
- the filter 3040 in this embodiment is smaller than the photosensitive chip 3030, and the camera module having a smaller back focus can be obtained.
- a moving focus module is described as an example.
- the lens 3050 is press-fitted to the motor 3060, and the motor 3060 is mounted to the holder 3070H. That is, the holder 3070H provides a mounting position for the filter 3040 and the motor 3060.
- the camera module may also be a fixed focus module.
- the lens 3050 is mounted to the holder 3070H, that is, the holder 3070H provides a mounting position for the filter 3040 and the lens 3050, as will be understood by those skilled in the art.
- the specific structure of the support 3070H and the type of the camera module are not limitations of the present invention.
- FIG. 41 is a schematic diagram showing the structural strength comparison between an imaging and a conventional camera module based on an integrated packaging process according to the above preferred embodiment of the present invention.
- the left side of FIG. 42 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention.
- the thickness of the holder 3P of the conventional image pickup module is indicated by a1, and the thickness of the base portion 3011 of the image pickup module of the present invention is indicated by a2.
- the bracket 3P is used to mount the filter 4P, the motor 5P or the lens 6P, and the bracket 3P is usually a plastic component formed by injection molding.
- the bracket 3P is generally mounted on the outer side of the circuit device 11P, so that the installation space reserved for the bracket 3P is limited without increasing the lateral dimension of the circuit board body.
- the thickness a1 of the bracket 3P can only be limited to a small range, such as 0.3 mm. At this time, the mutual bonding area of the bracket 3P and the circuit board 1P is small, so the connection stability is poor, That is, the bracket 3P is easily separated from the wiring board 1P or cracked when it is used for a long period of time or has a strong external force.
- the base portion 3011 is integrally packaged in the circuit board main body 30121, and is packaged in the circuit board main body by molding. And covering the circuit component 30122, so the base portion 3011 is opposite to the
- the bracket 3P has a larger configurable space and extends toward the inside of the board main body 30121, so that the outer size of the board main body is not expanded.
- the base portion 3011 can reach a greater thickness a2, such as 0.6 mm.
- the base portion 3011 has better support stability, and the base portion 3011 is more firmly connected to the circuit board main body 30121 by means of integral packaging, so that the camera module is in use. More stable and reliable.
- the base portion 3011 is integrally packaged in the circuit board main body 30121, and the structural strength of the circuit board main body 30121 at the connection portion is increased, and the base portion 3011 serves to protect the circuit board main body.
- the role of 30121 is provided.
- FIG. 42 is a schematic diagram showing the horizontal dimension comparison of a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention.
- the left side of FIG. 43 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention.
- the lateral cross-sectional dimension of the conventional camera module is indicated by b1
- the transverse cross-sectional dimension of the camera module based on the integrated packaging process of the present invention is indicated by b2.
- the bracket 3P is mounted on the outer side of the circuit device 11P, and the bracket 3P and the circuit device 11P are independent of each other in the installation space, and all need to occupy a certain space, and The circuit device 11P needs to reserve a certain safety distance around the circuit device 11P, for example, a safety distance of 0.35 mm is reserved.
- the base portion 3011 is encapsulated in the circuit board main body 30121, and the base portion 3011 covers the circuit component 30122, so the base The portion 3011 satisfies the requirement of the basic strength, and only needs to cover the circuit component 30122 with a small size, such as 0.15 mm, and the base portion 3011 and the circuit component 30122 overlap each other to make full use of the installation space. Therefore, the lateral dimension B2 of the camera module is reduced.
- the lateral dimension b2 of the camera module based on the integrated packaging process can be 0.2 mm smaller than the lateral dimension b1 of the conventional camera module.
- FIG. 43 is a schematic diagram showing the height comparison between the camera module and the conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.
- the left side of FIG. 44 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention.
- the height of the conventional camera module is represented by c1
- the height of the camera module based on the integrated package process of the present invention is represented by c2
- the thickness of the circuit board 1P of the conventional camera module is represented by d1
- the basis of the present invention is represented by d2.
- the bracket 3P of the conventional camera module is bonded to the circuit board 1P, and in order to meet the AA adjustment requirement, the glue amount is large, the glue layer is thick, and the circuit device 11P also needs to be installed above. The distance thus makes the height c1 of the camera module large.
- the bracket 3P is located outside the circuit device 11P and has a large lateral span. Therefore, the circuit board 1P is required to have a high strength to ensure the shape of the camera module, thereby requiring the circuit board 1P.
- the thickness d1 is large, which also makes the overall height d1 of the camera module large.
- the camera module based on the integrated packaging process according to the present invention wherein the pedestal 11 is integrally packaged in the circuit board main body 30121, does not require a glue bonding space, and does not need to reserve an AA adjustment space. There is no need to reserve a safe distance for the circuit component 30122, so the height c2 of the camera module based on the molding process is reduced.
- the base portion 3011 covers the circuit component 30122 such that the base portion 3011 can extend inwardly, reducing the lateral span of the middle portion of the base portion 3011, and the shape of the same circuit board is more variable.
- the base portion 3011 can enhance the structural strength of the circuit board main body 30121, so that the thickness d2 of the circuit board main body 30121 can be reduced. Therefore, the overall height c1 of the camera module based on the integrated packaging process is further reduced.
- Figure 44 is a schematic illustration of the flatness of a camera module based on an integrated packaging process in accordance with the above-described preferred embodiment of the present invention.
- the bracket 3P of the conventional camera module is manufactured by injection molding, and is assembled to the camera module by bonding. Therefore, the camera module is prone to tilting, eccentricity, and the like. Moreover, the surface flatness of the bracket 3P is poor, and it is not possible to provide flat mounting conditions for components such as filters, motors, or lenses.
- the base portion 3011 is connected to the circuit board main body 30121 by integral packaging, and is, for example, moldedly connected to the circuit board main body 30121. Further, in manufacturing the integral base assembly, the base portion is formed by a molding die 1, and the surface flatness of the base portion 3011 is ensured by the molding die 1, and the base is made The top surface 30112 of the seat portion 3011 coincides with the surface of the attachment area 301216 of the photosensitive chip, and the filter 3040, the lens 3050 or the motor 3060 is subjected to flat mounting conditions, and the photosensitive chip 3030 is caused.
- the optical axes of the filter 3040, the lens 3050, and the motor 3060 are identical.
- FIG. 45 is a schematic diagram showing the comparison of imaging quality of a camera module based on an integrated packaging process and a conventional camera module according to the above preferred embodiment of the present invention.
- the left side of FIG. 46 is a conventional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention.
- the circuit device 11P of the conventional camera module is exposed to a closed environment in which the photosensitive chip 2P communicates with each other, and when the camera module is assembled, dust is usually attached to the circuit device 11P, such as in soldering. a solder resist at the time of the motor, and the dust is hard to remove, and remains on the surface of the circuit device 11P. After the camera module is packaged, the dust moves freely, and when dust falls on the sensor chip, especially When the photosensitive area of the photosensitive chip is used, the camera module may appear black spots, thus making the imaging quality of the camera module poor.
- the circuit component 30122 is covered by the base portion and is not exposed to the same environment as the sensor chip 3030, so even in the circuit component 11P has residual dust, such as solder resist, and does not fall into the photosensitive chip after the camera module is packaged, so that the stability of the imaging quality of the camera module can be ensured, and no black spots appear after the package. .
- 46A and 46B are schematic diagrams showing a comparison of a manufacturing process of a camera module and a conventional camera module based on the integrated packaging process according to the above preferred embodiment of the present invention.
- the assembly and manufacturing process of the conventional camera module is generally: manufacturing the bracket 3P by injection molding; cutting the entire circuit board, bonding the bracket 3P to the separate circuit board 1P; and then attaching the chip
- components such as the filter 4P, the lens 6P or the motor 5P are mounted on the bracket 3P to be assembled into a fixed focus module or a moving focus module.
- the bracket 3P is completed by injection molding, and only a small amount, such as 4 to 8, can be manufactured at a time, and then the separate brackets 3P are respectively bonded to the independent circuit boards 1P, which makes the camera module
- the manufacturing efficiency of the group is low, and the consistency between the modules is difficult to control.
- the assembly and manufacturing process of the camera module based on the integrated packaging process according to the present invention is generally: integrally molding a plurality of the base portions 3011 on the imposition circuit board 2 by molding; and then dividing the imposition Separating the imposition into a plurality of separate integral base assemblies; further mounting the photosensitive chip 3030 on the integrated base assembly, and then the filter 3040, the lens 3050 or the
- the motor 3060 mounts the base portion to be assembled into a moving focus module or a fixed focus module.
- This process is different from the traditional assembly method, the production mode of the camera module is greatly improved, and the consistency between the plurality of modules is more easily ensured.
- 90 of the integral base assemblies can be formed at one time.
- the molding process generally has injection molding and molding from the standpoint of the equipment. Injection molding can also be divided into injection molding and die casting.
- Injection molding machine referred to as injection machine or injection molding machine
- injection machine is the main molding equipment for making thermoplastic or thermosetting materials into plastic products of various shapes by using plastic molding die. Injection molding is realized by injection molding machine and mold. Molding is the abbreviation of compression molding, also known as compression molding.
- a molding material such as a plastic or rubber compound is molded into an article by heating and pressurization in a closed cavity. Molding in the molding process is used in the present invention, but it will be understood by those skilled in the art that the present invention is not limited to the molding process, and other packaging processes, and the present invention is not limited thereto.
- FIG. 47 shows a twenty-third preferred embodiment of a camera module based on an integrated packaging process according to the present invention, which adopts an MOB process.
- the camera module based on the integrated packaging process includes a package photosensitive component 4010, a filter 4040, a lens 4050, and a motor 4060.
- the motor 4060 may not be present in other embodiments, such as a fixed focus (FF) module, and the invention is not so limited. That is, this preferred embodiment of the present invention is exemplified by an autofocus (AF) module.
- the package photosensitive unit 4010 includes a package portion 4011 and a photosensitive member 4012.
- the photosensitive module 4012 further includes a photosensitive chip 4030, and a wiring board 40121, which is provided with a set of electronic components 40122 (for example, resistors, capacitors, drivers, etc., hereinafter referred to as ICs) and a set of leads 4031.
- the lead wire 4031 is connected to connect the photosensitive chip 4030 and the circuit board 40121.
- the photosensitive chip 4030 and the circuit board 40121 may have other conduction modes.
- the lead 4031 can be implemented as a gold wire.
- the encapsulation portion 4011 serves as a support for carrying the filter 4040.
- the encapsulation portion 4011 may have electrical properties, such as an electrically engraved line electrically connected to the motor 4060 and the photosensitive member 4012, which can replace the conventional motor bonding wire. , reducing the traditional process.
- the motor 4060 and the circuit board 40121 can also be turned on by conventional soldering.
- the package portion 4011 encapsulates the circuit board 40121.
- the package portion 4011 encapsulates the circuit board 40121 with the photo sensor 4030 and the A region other than the contact of the lead 4031 is described.
- the encapsulation portion 4011 not only encapsulates the top surface 401215 of the circuit board 40121, but the package portion 4011 further The package encloses at least one side 401216 of the circuit board 40121. It can be understood that the encapsulation portion 4011 can also integrally package the electronic component 40122 during the packaging process.
- the motor 4060 is electrically connected to the circuit board 40121 through at least one motor pin.
- FIG. 49E A molding forming module in the comparative art is shown in Figs. 49A to 49E.
- the portion on the left side of the package portion 4011P in FIG. 50A is flush with the wiring board 40121P, and the design of the side surface of the wiring board 40121P flush with the side surface of the package portion 4011P is also generally adopted by the comparative technology. Therefore, in order to achieve the above design requirements, as shown in FIG. 49B, the structure in the figure needs to be achieved before the module is assembled.
- the circuit board 40121P is processed as shown in FIG. 49B, that is, two or more pieces are used.
- the circuit boards 40121P are connected together, molded, and finally machine cut in the middle portion of Fig. 49B, but new cutting equipment is required.
- the edge of the circuit board 40121P may not be flush with the package portion 4011P, so it can usually only be designed as As shown in Fig. 49C, the circuit board 40121P in the figure needs to protrude a section for mold pressing, and the length of the wiring board 40121P is usually 0.1 mm to 1 mm in value.
- the camera module based on the integrated package process of the present invention retracts the circuit board 40121 so that the side of the package portion 4011 covers the circuit board 40121.
- the side surface 401216 so that the side surface of the encapsulation portion 4011 and the circuit board 40121 still reserve a certain misalignment space, and the side surface is not protruded after the molding, the cutting process is reduced, and the product is improved. quality.
- the encapsulation portion 4011 can encapsulate both sides of the circuit board 40121.
- the right side since there are other elements on the right side, such as flexible circuit board connections, only the left side of the circuit board 40121, i.e., the side 401216, is packaged.
- the package portion 4011 can not only encapsulate the side surface 401216 of the circuit board 40121, but in other embodiments, the circuit board 40121 can be packaged side by side at the same time.
- the present invention is not limited by the partial or total area of the two sides.
- FIG. 48 shows a twenty-fourth preferred embodiment of the camera module based on the integrated package process of the present invention, in order to ensure that the module after the molding process can be easily installed and positioned, and the flatness is improved
- the camera module based on the integrated package process includes a package photosensitive component 4010A, a filter 4040A, a lens 4050A, and a motor 4060A.
- the motor 4060A is disclosed, but in other FF modules, the motor 4060A may not be required, and the present invention is not limited thereto.
- the package photosensitive member 4010A includes a package portion 4011A and a photosensitive member 4012A.
- the photosensitive member 4012A further includes a photosensitive chip 4030A, and a wiring board 40121A configured with a set of electronic components 40122A and a set of leads 4031A.
- the encapsulation portion 4011A serves as a support for carrying the filter 4040A, and the engraving line of the module portion 11A is electrically connected to the motor 4060A and the photosensitive member 4012A.
- the circuit board 40121A and the electronic component 40122A are packaged, and the package covers the circuit board 40121A.
- the package portion 4011A also molds a bottom portion 401217A of the wiring board 40121A. From After the molding is completed, the camera module based on the integrated packaging process has the flatness of the overall side and the bottom, and is also convenient to be installed and positioned on other tooling.
- the encapsulation portion 4011A may encapsulate the entire bottom portion 401217A of the circuit board 40121A, or in other embodiments, package the circuit board 40121A according to different needs.
- a portion of the bottom 401217A is not limited by the present invention.
- the right side of the camera module can be connected to other components or other processing processes, the right side of the circuit board 40121A is The package is not encapsulated, but in other embodiments, the package portion 4011A can simultaneously package two or more sides of the circuit board 40121A, and simultaneously package the bottom 401217A of the circuit board 40121A.
- the present invention is not limited by this or all of the regions.
- the camera module 100 can be applied to various electronic devices 300, such as but not limited to smart phones, wearable devices, computer devices, televisions, vehicles, cameras, monitoring devices, and the like.
- the electronic device implements image acquisition and reproduction of a target object.
- the molded wiring board assembly 1010F of the camera module 100 is manufactured by a manufacturing apparatus 200.
- the molding portion 1011F has a first inner side surface 10117F, a second inner side surface 10118F, and an outer side surface 10119F, the first inner side surface 10117F and the second inner portion.
- the side faces 10118F are each closed to form the through hole 101100F to provide a light path for the photosensitive chip. That is, the molding portion 1011F forms a light window through the first inner side surface 10117F and the second inner side surface 10118F to provide a window for light entering the photosensitive chip, and a lower port of the light window
- the shape is determined by the surrounding shape of the first inner side surface 10117F.
- the first inner side surface 10117F surrounds the through hole 101100F or the lower end of the light window
- the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window.
- the first inner side surface 10117F extends upward in an inclined shape, and has a trapezoidal shape with a cross section gradually increasing from a lower to an upper opening. That is, the cross section of the through hole 101100F or the lower end of the light window has a trapezoidal shape that gradually increases from the bottom to the upper opening.
- the first inner side surface 10117F is surrounded and the inner diameter is gradually increased from bottom to top, that is, the lower end of the light window is gradually increased from the bottom to the inner diameter.
- the first inner side surface 10117F may also be surrounded by other trapezoidal structures.
- the surrounding shape of the first inner side 10117F is not a limitation of the present invention.
- the surrounding shape of the first inner side surface 10117F may be determined according to the shape of the lens 50, the photosensitive chip 30, or the filter 40.
- the cross-section pyramid is an approximate structure. In the actual manufacturing process, the corners of the pyramid are not sharp corners that meet straight lines, but are rounded corners.
- the first inclination angle ⁇ is greater than 0°, that is, the first inner side surface 10117F and the central optical axis Y direction are not in a parallel state. Since the central optical axis Y is vertical In the circuit board main body 10121, therefore, in the embodiment of the present invention, the positional relationship between the first inner side surface 10117F and the circuit board main body 10121 is not in a vertical relationship.
- the provision of the first angle of inclination a contributes to the forming of the molded part 1011F, which will be explained in connection with the subsequent manufacturing process for ease of understanding.
- the setting of the first inclination angle ⁇ that is, the inclination of the first inner side surface 10117F, causes the incident angle of the light reaching the first inner side surface 10117F to decrease, and the corresponding reflection angle decreases.
- the reflected light is moved away from the photosensitive chip 30, thereby reducing the influence of the reflected stray light of the molded portion 1011F on the image quality of the image pickup module.
- the through hole 101100F or the light window is formed in a trapezoidal structure in which the opening gradually increases in cross section, thereby increasing the light flux, thereby further improving the imaging quality of the camera module.
- the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window, that is, the shape of the upper end of the light window is determined by the surrounding shape of the second inner side surface 10118F.
- the second inner side surface 10118F extends obliquely upward, and the cross section forms a trapezoidal shape that gradually increases from the lower to the upper opening. That is, the cross section of the through hole 101100F or the upper end of the light window has a trapezoidal shape that gradually increases from bottom to top.
- the second inner side 10118F surrounds forming a headless vertebral structure that gradually increases from bottom to top. That is, the upper end of the light window has a headless vertebral structure that gradually increases from bottom to top.
- the second inner side surface 10118F may also be surrounded by other trapezoidal structures, such as a headless cone and a quadrangular pyramid. It will be understood by those skilled in the art that the surrounding shape of the second inner side 10118F is not a limitation of the present invention. The surrounding shape of the second inner side surface 10118F may be determined according to the shape of the lens, the photosensitive element, or the filter.
- the second inclination angle ⁇ is greater than 0°, that is, the second inner side surface 10118F is not parallel to the central optical axis direction. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the second inner side surface 10118F and the circuit board main body 10121 is not in a vertical relationship.
- the provision of the second inclination angle ⁇ facilitates the forming of the molded body, which will be explained in connection with the subsequent manufacturing process for ease of understanding.
- the molded body includes an outer side surface 10119F that surrounds the outside of the light window.
- the outer side surface 10119F extends upward from the circuit board main body 10121 in an inclined manner, and has a trapezoidal shape formed in a cross section which is gradually reduced from a bottom to an upper opening.
- Defining the outer side surface 10119F and the inclination angle as a third inclination angle ⁇ , that is, the angle between the outer side surface 10119F and the central optical axis Y direction of the molded camera module is a third inclination angle ⁇ .
- the third inclination angle ⁇ is greater than 0°, that is, the outer side surface 10119F is not parallel to the central optical axis direction. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the outer side surface 10119F and the circuit board main body 10121 is not in a vertical relationship.
- the provision of the third inclination angle ⁇ facilitates the forming of the molded body, which will be explained in connection with the subsequent manufacturing process for ease of understanding.
- the first angle of inclination a preferably ranges from 3[deg.] to 85[deg.].
- the second inclination angle ⁇ preferably ranges from 3° to 45°.
- the preferred range of the third inclination angle ⁇ is from 3° to 45°.
- the first tilt angle ⁇ ranges from 3° to 45°, and in some embodiments, it may be 3° to 15°, or 15° to 20°, or 20°. ⁇ 30° or 45° to 60°.
- the second angle of inclination ⁇ ranges from 3° to 45°, and in some embodiments, may range from 3° to 15°, or from 15° to 30°, or from 30° to 45°.
- the third angle of inclination ⁇ ranges from 3° to 45°, and in some embodiments, it may range from 3° to 15°, or from 15° to 20°, or from 20° to 30°.
- the first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface, and the outer side surface 10119F forms a two-stepped step structure for respectively mounting different components, and in other embodiments of the present invention, there may be fewer steps or more steps, such as only the first inner side 10117F, second
- the inner side surface 10118F and the outer side surface 10119F form a first step, or a top surface and an inner side surface are superposed to form a third step, as will be understood by those skilled in the art, the inner side surface, the top surface and the outer side surface 10119F
- the number and the number of steps formed are not a limitation of the present invention.
- first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface and the outer side surface 10119F are each in a closed structure, so as to facilitate Providing a closed interior environment for the molded camera module.
- a closed inner environment is formed for the photosensitive chip 1030 to isolate interference from external light.
- a molded wiring board assembly manufacturing apparatus and manufacturing process of a molded image pickup module according to a first preferred embodiment of the present invention.
- the manufacturing apparatus 200 is used to manufacture the molded wiring board assembly 1010F, and further, to manufacture the molded wiring board assembly 1010F by molding.
- the manufacturing apparatus 200 of the molded wiring board assembly 1010F includes a molding die 210 and a feeding mechanism 220.
- the feeding mechanism 220 is for supplying the molding material 400 to the molding die 210 so as to be molded by the molding die 210.
- the molding material 400 may be selected from the group consisting of nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, and the like.
- the molding die 210 includes a first die 211 and a second die 212, and the first die 211 and the second die 212 are capable of opening and clamping. That is, the molding die 210 includes two states of mold opening and mold clamping.
- the molding die 210 can control the opening and closing of the first mold 211 and the second mold 212 by a fixing device.
- a fixing device Referring to FIGS. 54A, 54B, when the molding die 210 is in the mold clamping state, the first die 211 and the second die 212 form a molding cavity 213 and a supply passage 214, and the supply passage 214 is connected.
- the molding chamber 213 is for accommodating the wiring board portion 1012F for conveying the molding material 400 into the molding cavity 213, and molding at a predetermined position on the wiring board portion 1012F.
- the wiring board portion 1012F is placed in the second mold 212 in a state in which the molding die 210 is opened, and then the molding die 210 is in a mold clamping state, by the action of the feeding structure.
- molding material 400 than The molding material 400 is transported into the molding cavity 213 through the supply passage 214 as a high pressure, and the remaining portion of the molding cavity 213 is filled by the molding material 400, thereby forming the molding portion 1011F. .
- the first mold 211 includes a light window forming block 2111 for blocking the molding material 400 such that the molding material 400 forms a hollow through hole along the light window forming block 2111. 101100F or the light window.
- the first mold 211 includes a plurality of molding faces respectively provided with the first inclination angle ⁇ , the second inclination angle ⁇ , and the third inclination angle ⁇ corresponding to the molding portion 1011F to facilitate formation.
- the light window forming block 2111 includes a pressing surface 21111.
- the pressing surface 21111 is pressed against the wiring board portion 1012F such that the position corresponding to the pressing surface 21111 on the wiring board portion 1012F is not filled with the molding material 400.
- the light window connected to the wiring board portion 1012F is formed.
- the molding cavity 213 includes a filling portion 2131 for filling the molding material 400, and a receiving portion 2132 for accommodating the wiring board main body 10121.
- the filling portion 2131 is disposed on the first mold 211, and the receiving portion 2132 is disposed in the second mold 212. That is, in the molding process, the circuit board main body 10121 is placed in the accommodating portion 2132 of the second mold 212, and is formed in the circuit board main body 10121 and the first mold 211.
- the filling portion 2131 is filled with the molding material 400 in a space, thereby molding the molding portion 1011F on the top surface of the wiring board portion 1012F.
- circuit board portion 1012F is provided with the circuit component 10122F, that is, when the circuit board main body 10121 is placed in the housing portion 2132 of the molding cavity 213, the circuit The element 10122F is housed in the filling portion 2131.
- the circuit component 10122F is covered by the molding material 400.
- the demolding that is, the first mold 211 and the second During the process of separating the mold 212, the friction between the molding portion 1011F and the first mold 211 is reduced, and the first mold 211 is more easily pulled out of the molding portion 1011F so that The molded portion 1011F is in a preferred molded state.
- the optical window forming block 2111 and the molding portion 1011F are relatively moved at the moment of demolding, and then the optical window forming block 2111 and the A gap is formed between the molding portions 1011F, so that during the subsequent movement, the optical window forming block 2111 and the molding portion 1011F are not in contact with each other to generate a frictional force, so that they can be smoothly pulled out.
- the photosensitive chip 1030 may be connected to the wiring board main body 10121F through the lead 1031 before the molding process, and
- the circuit board main body 10121F may be provided with an annular blocking member 1014G which is mounted or coated on the circuit board main body 10121 and has elasticity and is higher than the highest point of the lead 1031 so as to be in the molding process.
- the light window forming block 2111 is pressed against the blocking member 1014G to prevent the light window forming block 214 from being pressed against the circuit board main body 10121F.
- the body 10121F and the lead 1031 and the photosensitive chip 1030 are damaged.
- the barrier element 1014G is in the form of a square ring and is implemented as a step glue.
- the barrier element is at least partially encapsulated by the molding portion, spaced between at least a portion of the molding portion 1011F and the wiring board body 10121F
- the circuit board portion 1012F includes at least one circuit component 10122G, and the circuit component 10122G is disposed on the circuit board main body 10121.
- the circuit component 10122G protrudes from the wiring board main body 10121 and is located inside the molding portion 1011F.
- the circuit component 10122G is located within the via 101100F. That is, the circuit component 10122G is not molded by the molding portion 1011F.
- the light window forming block in the molding die has a groove inside, so that it is covered in the circuit component 10122G in the molding process, so that the formed molding portion 1011F can be not covered.
- circuit component 10122G The circuit component 10122G.
- the circuit component 10122F to be molded may also be provided, that is, a portion of the circuit component 10122F is molded while another portion of the circuit component 10122G is not molded. .
- the integrated base assembly 3010 includes a shielding layer 30124A surrounding the inner side of the base portion 3011, thereby enhancing the structural strength of the circuit board main body 30121. At the same time, the electromagnetic interference resistance of the integrated base assembly 3010 is enhanced.
- the shielding layer 30124A may be a metal mesh or a metal plate.
- the molded portion, the structure of the base portion and the package portion may be combined with various structures of the camera module in other embodiments.
- Features are arranged and combined.
- the various preferred embodiments described above are merely illustrative of different ways in which the present invention may be implemented.
- Various structural features in different embodiments may be combined in various arrangements to form a new embodiment.
- the present invention is not limited to the implementation shown in the drawings. The manner is not limited to a single embodiment.
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Abstract
Description
Claims (103)
- 一摄像模组,其特征在于,包括:至少一镜头;至少一感光芯片;至少一滤光片;至少一一体基座组件;和至少一支座;其中所述一体基座组件包括一基座部和一线路板部,所述基座部一体封装于所述线路板部,所述感光芯片被安装于所述线路板部,所述基座部形成至少一通孔,为所述感光芯片提供光线通路,所述镜头位于所述感光芯片的光线通路,所述支座被安装于所述基座部,所述滤光片被安装于所述支座,且位于所述感光芯片的光线通路。
- 根据权利要求1所述的摄像模组,其中所述支座在顶侧具有一第一支座槽,所述第一支座槽连通于所述通孔,所述滤光片被安装于所述第一支座槽。
- 根据权利要求2所述的摄像模组,其中所述支座在底侧具有一第二支座槽,以与所述基座部顶端接合。
- 根据权利要求2所述的摄像模组,其中所述基座部具有一安装槽,所述安装槽连通于所述通孔,所述支座被安装于所述安装槽。
- 根据权利要求3所述的摄像模组,其中所述基座部具有一安装槽,所述安装槽连通于所述通孔。
- 根据权利要求3所述的摄像模组,其中所述基座部形成一平台,所述支座被安装于所述平台。
- 根据权利要求4所述的摄像模组,其中所述安装槽具有至少一缺口,连通所述通孔与外部,所述支座包括至少一延伸边,所述延伸边适于搭接于所述缺口。
- 根据权利要求4所述的摄像模组,其中所述安装槽具有至少一缺口,形成一U型结构,所述支座部包括至少一延伸边,所述延伸边填充所述U型结构的开口。
- 根据权利要求1至8任一所述的摄像模组,其中所述一体基座组件包括 至少一电路元件,所述基座部包覆所述电路元件。
- 根据权利要求1至8任一所述的摄像模组,其中所述镜头至少部分被安装于所述支座。
- 根据权利要求1至8任一所述的摄像模组,其中所述摄像模组包括至少一马达,所述镜头被安装于所述马达,所述马达至少部分被安装于所述支座。
- 根据权利要求1至6任一所述的摄像模组,其中所述镜头被安装于所述基座部。
- 根据权利要求1至6任一所述的摄像模组,其中所述摄像模组包括至少一马达,所述镜头被安装于所述马达,所述马达被安装于所述基座部或被安装于所述支座。
- 根据权利要求1至8任一所述的摄像模组,其中所述一体封装的方式为模塑的一体封装方式。
- 根据权利要求1至8任一所述的摄像模组,其中所述一体基座组件包括一环形的阻隔元件,其被设置于所述线路板部,并且所述阻隔元件至少部分地被所述基座部一体封装。
- 根据权利要求1至8任一所述的摄像模组,其中所述基座部具有至少一第一内侧面,其一体地延伸于所述线路板部,环绕形成至少部分所述通孔,所述第一内侧面呈倾斜状地向上延伸。
- 根据权利要求16所述的摄像模组,其中所述第一内侧面与所述摄像模组的光轴之间具有一倾斜角α,其中α的大小范围是3°~85°。
- 根据权利要求16所述的摄像模组,其中所述第一内侧面环绕形成所述通孔的下端,所述通孔下端内径呈由下至上逐渐增大。
- 根据权利要求16所述的摄像模组,其中所述基座部具有一第二内侧面,所述第二侧面由所述第一内侧面弯折延伸而来,所述第二内侧面环绕形成所述通孔的上端,所述第二内侧面呈倾斜状地向上延伸。
- 根据权利要求19所述的摄像模组,其中所述第二内侧面与所述摄像模组的光轴之间具有一倾斜角β,其中β的大小范围是3°~45°。
- 根据权利要求16所述的摄像模组,其中所述基座部具有一外侧面,由所述线路板部一体地向上倾斜延伸,且与所述摄像模组的光轴之间具有一倾斜角γ,其中γ的大小范围是3°~45°。
- 一摄像模组,其特征在于,包括:至少一镜头;至少一感光芯片;和至少一一体基座组件;其中所述一体基座组件包括一基座部和一线路板部,所述基座部一体地连接于所述线路板部,所述感光芯片被安装于所述线路板部,所述基座部形成至少一通孔,为所述感光芯片提供光线通路,所述镜头位于所述感光芯片的光线通路,所述基座部具有至少一第一内侧面,环绕形成至少部分所述通孔,所述第一内侧面呈倾斜状地向上延伸。
- 根据权利要求22所述的摄像模组,其中所述第一内侧面与所述摄像模组的光轴之间具有一倾斜角α,其中α的大小范围是3°~85°。
- 根据权利要求23所述的摄像模组,其中所述倾斜角α的数值选自3°~30°、30°~45°、45°~60°或60~85°。
- 根据权利要求22所述的摄像模组,其中所述第一内侧面环绕形成所述通孔的下端,使得所述通孔下端的内径由下至上逐渐增大。
- 根据权利要求22所述的摄像模组,其中所述基座部具有一第二内侧面,所述第二侧面由所述第一内侧面弯折延伸而来,所述第二内侧面环绕形成所述通孔的上端,所述第二内侧面呈倾斜状地向上延伸。
- 根据权利要求26所述的摄像模组,其中所述基座部具有一安装槽,连通于所述通孔,所述第一内侧面弯折延伸至所述第二内侧面形成所述安装槽。
- 根据权利要求23所述的摄像模组,其中所述第二内侧面与所述摄像模组的光轴之间具有一倾斜角β,其中β的大小范围是3°~45°。
- 根据权利要求28所述的摄像模组,其中β的数值选自3°~15°、15°~20°、20°~30°或30°~45°。
- 根据权利要求28所述的摄像模组,其中所述第一内侧面与所述摄像模组的光轴之间具有一倾斜角α,其中α的大小范围是3°~85°。
- 根据权利要求28所述的摄像模组,其中所述第一内侧面环绕形成所述通孔的下端,使得所述通孔下端的内径由下至上逐渐增大。
- 根据权利要求23所述的摄像模组,其中所述基座部具有一外侧面,所述外侧面由所述线路板部倾斜地向上延伸,且与所述摄像模组的光轴之间具有一 倾斜角γ,其中γ的大小范围是3°~45°。
- 根据权利要求32所述的摄像模组,其中γ的数值选自3°~15°、15°~30°或30°~45°。
- 根据权利要求22至32任一所述的摄像模组,其中所述一体基座组件包括至少一电路元件,所述基座部包覆所述电路元件。
- 一摄像模组,其特征在于,包括:至少一镜头;至少一感光芯片;和至少一一体基座组件;其中所述一一体基座组件包括一基座部和一线路板部,所述基座部模塑于所述线路板部,所述基座部形成至少一通孔,为所述感光芯片和所述镜头提供一光线通路。
- 根据权利要求35所述的摄像模组,其中所述基座部具有一顶表面,平面地延伸。
- 根据权利要求35所述的摄像模组,其中所述基座部具有一安装槽,所述安装槽连通于所述通孔,所基座部包括至少一凸起台阶,所述凸起台阶形成所述安装槽。
- 根据权利要求35所述的摄像模组,其中所述线路板部包括至少一侧面,所述基座包覆所述线路板部的至少一所述侧面。
- 根据权利要求35所述的摄像模组,其中所述基座部进一步地包覆所述线路板部的底部。
- 根据权利要求35所述的摄像模组,其中所述基座部沿所述摄像模组的光轴方向依次具有两安装槽,各所述安装槽连通于所述通孔,使得所述基座部内部形成台阶结构。
- 根据权利要求36所述的摄像模组,其中所述摄像模组包括至少一滤光片,所述滤光片被安装于所述顶表面,以使得所述滤光片被平整地安装。
- 根据权利要求41所述的摄像模组,其中所述镜头被安装于所述顶表面。
- 根据权利要求41所述的摄像模组,其中所述摄像模组包括至少一马达,所述镜头被安装于所述马达,所述马达被安装于所述基座部的所述顶表面。
- 根据权利要求37所述的摄像模组,其中所述摄像模组包括至少一滤光 片,所述滤光片被安装于所述安装槽。
- 根据权利要求44所述的摄像模组,其中所述镜头被安装于所述凸起台阶。
- 根据权利要求44所述的摄像模组,其中所述摄像模组包括至少一马达,所述镜头被安装于所述马达,所述马达被安装于所述凸起台阶。
- 根据权利要求38所述的摄像模组,其中所述摄像模组包括一滤光片,所述滤光片被安装于较低位置的所述安装槽。
- 根据权利要求47所述的摄像模组,其中所述镜头被安装于所述较高位置的所述安装槽。
- 根据权利要求48所述的摄像模组,其中所述基座部自较高位置的所述安装槽一体地向上延伸形成一镜头内壁。
- 根据权利要求49所述的摄像模组,其中所述镜头内壁表面平整,适于安装一无螺纹镜头。
- 根据权利要求35所述的摄像模组,还包括至少一镜头支架,其安装于所述基座部,所述镜头支架适于安装所述镜头。
- 根据权利要求37所述的摄像模组,其中所述摄像模组包括至少一支座和至少一滤光片,所述支座被安装于所述安装槽,所述滤光片被安装于所述支座。
- 根据权利要求52所述的摄像模组,其中所述镜头至少部分被安装于所述基座部。
- 根据权利要求52所述的摄像模组,其中所述镜头至少部分被安装于所述支座。
- 根据权利要求52所述的摄像模组,其中所述摄像模组包括一马达,所述镜头被安装于所述马达,所述马达至少部分地被安装于所述基座部。
- 根据权利要求52所述的摄像模组,其中所述摄像模组包括一马达,所述镜头被安装于所述马达,所述马达至少部分地被安装于所述支座。
- 根据权利要求35至40任一所述的摄像模组,其中所述线路板部具有一内凹槽,连通于所述通孔,所述感光芯片被容纳于所述内凹槽。
- 根据权利要求35至40任一所述的摄像模组,其中所述镜头包括一镜筒和至少一镜片,各所述镜片被安装于所述镜筒,所述滤光片被安装于所述镜筒,位于所述镜片的下方。
- 根据权利要求35至40任一所述的摄像模组,其中所述摄像模组包括至少一马达和至少一滤光片,所述滤光片被安装于所述马达,所述镜头被安装于所述马达,位于所述滤光片的上方。
- 根据权利要求35至40任一所述的摄像模组,其中所述一体基座组件包括至少一电路元件,所述基座部包覆所述电路元件。
- 根据权利要求60所述的摄像模组,其中所述电路元件选自组合:电阻、电容、二极管、三极管、电位器、继电器、驱动器、处理器、和存储器中的其中一种或多种。
- 根据权利要求35至40任一所述摄像模组,其中所述线路板部具有至少一通路,连通所述线路板部的两侧,所述感光芯片被安装于所述通路。
- 根据权利要求35至40任一所述的摄像模组,其中所述线路板部具有一加固孔,所述基座部延伸进入所述加固孔。
- 根据权利要求35至40任一所述的摄像模组,其中所述线路板部包括一加固层,叠层设置于所述线路板部底部。
- 权利要求35至40任一所述的摄像模组,其中所述线路板部包括一屏蔽层,包裹于所述摄像模组外部。
- 要求35至40任一所述的摄像模组,其中所述线路板部包括一屏蔽层,环绕于所述基座部内侧。
- 根据权利要求35至40任一所述的摄像模组,其中所述线路板部包括一线路板主体,所述线路板主体材质选自组合:软硬结合板、陶瓷基板和PCB硬板中的一种。
- 根据权利要求35至40任一所述的摄像模组,其中所述基座部材料选自组合::尼龙、LCP、PP和树脂中的一种或多种。
- 根据权利要求35至40任一所述的摄像模组,其中所述模塑部模塑工艺为嵌入成型或模压加工。
- 根据权利要求35至40任一所述的摄像模组,其中所述感光芯片通过至少一连接线电连接于所述线路板部。
- 一摄像模组,其特征在于,包括:至少一镜头;至少一感光芯片;至少一体基座组件;和至少一马达;其中所述一体基座组件包括一基座部和一线路板部,所述基座部一体封装于所述线路板部,所述感光芯片被安装于所述线路板部,所述镜头位于所述感光芯片的感光路径,所述基座部形成一通孔,为所述感光芯片提供光线通路;所述一体基座组件包括至少一马达连接结构,所述马达连接结构被预设于所述基座部,所述马达通过所述马达连接结构电连接于所述线路板部,所述镜头被安装于所述马达,以便于通过所述马达调节所述镜头。
- 根据权利要求70所述的摄像模组,其中所述线路板部包括一线路板主体,所述基座部以模塑的方式一体成型于所述线路板主体。
- 根据权利要求71所述的摄像模组,其中所述马达连接结构包括至少一引线和至少一引脚槽,所述引线被设置于所述基座部,且电连接于所述线路板主体,所述引脚槽被设置于所述基座部上端部,所述引线包括一马达连接端,所述马达连接端显露于所述槽底壁,以便于所述马达的至少一马达引脚插接于所述引脚槽时电连接于所述马达连接端。
- 根据权利要求71所述的摄像模组,其中所述马达连接结构包括至少一引脚槽和至少一电路接点,所述电路接点电连接于所述线路板主体,所述引脚槽被设置于所述基座部,由所述线路板主体延伸至所述基座部的顶端,且所述电路接点显露于所述引脚槽,以便于所述马达的至少一马达引脚插接于所述引脚槽时电连接于所述电路接点。
- 根据权利要求71所述的摄像模组,其中所述马达连接结构包括至少一雕刻线路,所述雕刻线路设置于所述基座部,电连接于所述线路板主体,以便于电连接一马达引脚。
- 根据权利要求71至74任一所述的摄像模组,其中所述基座部的厚度范围为:0.3~1.2mm。
- 根据权利要求71至74任一所述的摄像模组,其中所述摄像模组的横向截面尺寸范围为:5~20mm。
- 根据权利要求71至74任一所述的摄像模组,其中所述摄像模组的高度范围为:3~6mm。
- 根据权利要求71至74任一所述的摄像模组,其中所述线路板部的厚 度范围为:0.15~0.5mm。
- 根据权利要求71至74任一所述的摄像模组,其中所述基座部比邻围绕于所述感光芯片外侧,从而扩展所述基座部厚度,使得所述基座部与所述线路板部具有更强的连接牢固性。
- 根据权利要求71至74任一所述的摄像模组,其中所述基座部以模塑的方式一体成型于所述线路板主体。
- 根据权利要求71至74任一所述的摄像模组,其中所述一体基座组件包括至少一电路元件,所述基座部包覆所述电路元件。
- 一体基座组件,应用一摄像模组,其特征在于,包括:一基座部;和一线路板部;所述基座部一体封装于所述线路板部,所述摄像模组的一感光芯片适于被安装于所述线路板部,所述基座部形成至少一通孔,为所述感光芯片提供光线通路,所述镜头位于所述感光芯片的光线通路。
- 根据权利要求83所述的一体基座组件,其中所述基座部具有一顶表面,平面地延伸。
- 根据权利要求83所述的一体基座组件,其中所述基座部具有一安装槽,所述安装槽连通于所述通孔,所基座部包括至少一凸起台阶,所述凸起台阶形成所述安装槽。
- 根据权利要求83所述的一体基座组件,其中所述基座部具有两安装槽,各所述安装槽连通于所述通孔,使得所述基座部内部形成台阶结构。
- 根据权利要求86所述的一体基座组件,其中较高位置的所述安装槽一体地向上延伸形成一镜头内壁。
- 根据权利要求87所述的一体基座组件,其中所述镜头内壁表面平整,适于安装一无螺纹镜头。
- 根据权利要求83所述的一体基座组件,其中所述线路板部包括至少一侧面,所述基座包覆所述线路板部的至少一所述侧面。
- 根据权利要求83所述的一体基座组件,其中所述基座部进一步地包覆所述线路板部的所述底部。
- 根据权利要求83至90任一所述的一体基座组件,其中所述一体基座 组件包括至少一电路元件,所述基座部包覆所述电路元件。
- 根据权利要求91所述的一体基座组件,其中所述电路元件选自组合:电阻、电容、二极管、三极管、电位器、继电器、驱动器、处理器、和存储器中的其中一种或多种
- 根据权利要求83至90任一所述一体基座组件,其中所述基座部具有至少一第一内侧面,环绕形成至少部分所述通孔,所述第一内侧面呈倾斜状地向上延伸于所述线路板部。
- 根据权利要求93所述的一体基座组件,其中所述第一内侧面与所述摄像模组的光轴之间具有一倾斜角α,其中α的大小范围是3°~85°。
- 根据权利要求94所述的一体基座组件,其中所述基座部具有一第二内侧面,所述第二侧面由所述第一内侧面弯折延伸而来,所述第二内侧面环绕形成所述通孔的上端,所述第二内侧面呈倾斜状地向上延伸。
- 根据权利要求95所述的一体基座组件,其中所述第二内侧面与所述摄像模组的光轴之间具有一倾斜角β,其中β的大小范围是3°~45°。
- 根据权利要求99任一所述的一体基座组件,其中所述基座部具有一外侧面,所述外侧面由所述线路板部倾斜地向上延伸,且与所述摄像模组的光轴之间具有一倾斜角γ,其中γ的大小范围是3°~45°。
- 根据权利要求83所述的一体基座组件,其中所述一体基座组件包括一马达连接结构,所述马达连接结构被预设于所述基座部,所述马达通过所述马达连接结构电连接于所述线路板部,所述摄像模组的一马达适于通过所述马达连接结构电连接于所述线路板部。
- 根据权利要求98所述的一体基座组件,其中所述马达连接结构包括至少一引线和至少一引脚槽,所述引线被设置于所述基座部,且电连接于所述线路板主体,所述引脚槽被设置于所述基座部上端部,所述引线包括一马达连接端,所述马达连接端显露于所述槽底壁,以便于所述马达的至少一马达引脚插接于所述引脚槽时电连接于所述马达连接端。
- 根据权利要求98所述的一体基座组件,其中所述马达连接结构包括至少一引脚槽和至少一电路接点,所述电路接点电连接于所述线路板主体,所述引脚槽被设置于所述基座部,由所述线路板部延伸至所述基座部的顶端,且所述电路接点显露于所述引脚槽,以便于所述马达的至少一马达引脚插接于所述引脚 槽时电连接于所述电路接点。
- 根据权利要求98所述的一体基座组件,其中所述马达连接结构包括至少一雕刻线路,所述雕刻线路设置于所述基座部,电连接于所述线路板部,以便于电连接所述马达的一马达引脚。
- 根据权利要求83至90任一所述的一体基座组件,其中所述一体基座组件包括至少一电路元件,所述基座部包覆所述电路元件。
- 根据权利要求83至90任一所述的一体基座组件,其中所述一体基座组件包括至少一电路元件,且所述电路元件位于所述基座部的内侧,所述基座部不包覆所述电路元件。
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US11877044B2 (en) | 2024-01-16 |
JP2019509512A (ja) | 2019-04-04 |
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US20210392251A1 (en) | 2021-12-16 |
JP2021073520A (ja) | 2021-05-13 |
JP6829259B2 (ja) | 2021-02-10 |
KR20210095227A (ko) | 2021-07-30 |
JP7508380B2 (ja) | 2024-07-01 |
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EP3419275A1 (en) | 2018-12-26 |
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