CN100483655C - 数码相机模组的制程 - Google Patents

数码相机模组的制程 Download PDF

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CN100483655C
CN100483655C CNB200510037226XA CN200510037226A CN100483655C CN 100483655 C CN100483655 C CN 100483655C CN B200510037226X A CNB200510037226X A CN B200510037226XA CN 200510037226 A CN200510037226 A CN 200510037226A CN 100483655 C CN100483655 C CN 100483655C
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matrix
processing procedure
plate
camera mould
numerical camera
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CN1929103A (zh
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魏史文
吴英政
刘坤孝
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Yangxin Technology Co ltd
Hongfujin Precision Industry Shenzhen Co Ltd
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Abstract

本发明是关于一种数码相机模组的制程，包括如下步骤：提供一影像传感器的封装结构，将镜头模块封装在影像传感器的上面；该影像传感器的封装过程包括：提供一支架；将支架的一部分放入一模具的型腔内，并在型腔内注入塑胶材料，冷却后成型出若干包覆在该支架的导电片上的基体，导电片部分暴露在基体外，每一基体包括一容置腔；提供一影像感测芯片，将该影像感测芯片设置在基体的容置腔内；设置若干引线，使每一引线电连接影像感测芯片与导电片；提供一透光板，将该透光板设置在基体上，将容置腔盖住；将若干基体分割，形成单个封装体；将导电片包覆。

Description

数码相机模组的制程
【技术领域】
本发明是关于一种电子元器件的制程，尤其是关于一种数码相机模组的制程。
【背景技术】
目前，数码相机及带数码相机的移动电话越来越普及，数码相机不可缺少的核心组件影像感测芯片封装的需求也随之与日俱增。同时，消费者也希望数码相机更加朝小型化、高品质、低价格方向发展，然而，除数码相机模组本身设计对其性能的影响外，数码相机模组的制造也对数码相机模组的品质起到至关重要的作用。
请参阅图1，一种现有数码相机模组的影像传感器封装方法，如中国专利申请第03100661.2号所揭示，其包括以下步骤：首先提供若干个ㄈ状截面的导电片130；射出成型部分包覆于各导电片130的第一成型体146，该第一成型体146使导电片130的部分露出；射出成型于第一成型体146上形成第二成型体148，该第二成型体148与第一成型体146共同形成凹槽150；将设有若干焊垫154的影像感测芯片152设置于凹槽150内；通过若干条引线156使影像感测芯片152的焊垫154与导电片130电连接；将透光板158设置在第二成型体148上，以包覆住影像感测芯片152。
上述数码相机模组的影像传感器封装方法缺点在于：虽然该封装方法可大量生产，然而仅可单颗制造，导致生产效率降低；利用该影像感测芯片封装方法得到的影像感测芯片封装结构易受粉尘污染，从而影响整体的生产良率；此外，由于上述影像感测芯片152及若干引线156皆容置在凹槽150内，且为方便打线器操作，故使得凹槽150较大，因此，封装后的凹槽150存在较多粉尘，且在封装过程及影像感测芯片封装安装在镜头及镜头调焦过程中不可避免的震动均会使凹槽150周壁上的粉尘等杂质掉落在影像感测芯片152上，污染影像感测芯片152的感测区，导致品质不良。
【发明内容】
鉴于以上的缺点，有必要提供一种生产效率较高、影像感测品质好的数码相机模组的制程。
一种数码相机模组的制程包括以下步骤：
提供一影像传感器封装，该影像传感器封装制程包括如下步骤：
提供一支架，该支架是将一导电板通过冲压成型方式而成，该支架包括至少一料带及若干形成于与料带连接的导电片；
将支架的一部分放入一模具的型腔内，并于型腔内注入塑胶材料，冷却后成型出若干包覆该支架的导电片的基体，导电片部分暴露于基体外，每一基体包括一容置腔；
提供一包括一感测区的影像感测芯片，将该影像感测芯片设置于基体的容置腔内；
设置若干引线，使每一引线电连接影像感测芯片与导电片；
提供一透光板，将该透光板设置于基体上，将容置腔盖住；
将若干基体分割，形成单个封装体；
将导电片包覆；
提供一镜头模块，将该镜头模块装于影像传感器的上面。
相较现有技术，所述数码相机模组制程的影像感测芯片的感测区包覆于粘胶形成的较小空腔内，因此其极难被污染，从而使该影像感测芯片保持良好品质；该影像感测芯片封装的引线被粘胶包覆，故外界的杂质较难损及引线，从而保证了讯号的良好传递；导电片被基体包覆其中，可降低湿气等的影响进而提高产品可靠度；该制程可同时生产多个影像感测芯片的封装，极大地提高了数码相机模组生产效率。该数码相机模组因影像感测区被包覆，可避免镜头模块调焦时，所产生的粉尘对影像感测芯片的影响，提高了数码相机模组的成像质量。
【附图说明】
图1是现有数码相机模组的影像感测芯片的封装结构图；
图2是本发明较佳实施方式的数码相机模组的结构图；
图3是本发明较佳实施方式的支架结构图；
图4是图3沿IV-IV向剖视图；
图5是本发明较佳实施方式支架与基体成型示意图；
图6是本发明较佳实施方式的影像传感器封装部分组装图；
图7是本发明较佳实施方式影像传感器封装打线粘胶后的结构图；
图8是本发明较佳实施方式影像传感器封装加透光板的结构图；
图9是本发明较佳实施方式影像传感器封装熔接的结构图；
图10是本发明较佳实施方式镜头模块未装于影像传感器上的结构图。
【具体实施方式】
请参阅图2，本发明较佳实施方式数码相机模组的结构包括影像感测芯片的封装结构及镜头模块结构，该影像感测芯片的封装结构包括一载具(图未标)、一影像感测芯片22、若干引线26及一透光板28。该载具包括若干导电片20及一基体24，该若干导电片20相互间隔平行排列嵌卡于该基体24上；该影像感测芯片22具一位于其顶部中央的感测区222；每一引线26的一端连接至一导电片20上，另一端连接至影像感测芯片22上，且每一引线26均被粘胶34包覆；该透光板28设置于基体24上，将影像感测芯片22覆盖。包覆引线26的粘胶34进一步粘附于透光板28上，且于影像感测芯片22的感测区222周缘形成一整圈，从而将影像感测芯片22的感测区222包覆于该粘胶34与透光板28形成的空腔32内。
该镜头模块包括一镜筒10及一镜座21，该镜头模块与影像传感器封装结构组装一体，从而形成数码相机模组。
该镜筒10为中空圆筒状，其内设置有若干镜片12，其外圆周设置外螺纹102。镜筒10一端设有盖板14，该盖板14为一平板玻璃，即可使光线通过，也可阻挡灰尘等杂质进入而污染镜片12。
镜座21为中空圆台状，该镜座21包括一容置部212及一凸缘部214。该容置部212为中空圆柱体，该凸缘部214为一立方体，一端为矩形开槽2042，其与容置部212相贯通。容置部212的外径小于凸缘部214的边长，而于两者相接处形成台阶，而镜座21的凸缘部214的矩形开槽2042边长大于容置部212的内径。镜座21的容置部212内圆周设置有内螺纹201，其与镜筒10的外螺纹102相配合。
本发明影像感测芯片封装方法包括以下步骤：
请参阅图3及图4，提供一支架40。该支架40包括二相互间隔平行的料带42、连接二料带42的若干横梁44及若干形成于横梁44上的导电片20。该若干横梁44均匀分布于该二料带42之间并垂直于料带42，每一导电片20均平行于料带42，且每一横梁44上设有均匀分布的若干导电片20，除两端的二横梁44仅一侧设有导电片20外，其余横梁44两侧均设有导电片20。该导电片20包括一与横梁44相连的第一板462、一位于导电片20端部的第二板463及一连接第一板462与第二板463的第三板464，该第一板462与第二板463相互平行且间隔错开一定距离，该第三板464相对第一板462及第二板463倾斜一定角度。制造该支架40时，先选一导电板(如金属板)，通过冲压成型法将该导电板形成所述的支架40结构。
请参阅图5，以嵌入成型法(insert-molding)一体成型方式射出成型若干所述基体24在该支架40上，即将支架40放入一模具的型腔内，向该型腔内注入熔融状态的塑胶材料，从而形成所述载具，其结构请一并参阅图6。该基体24形成于支架40的周缘及上下表面，其为长方体形，且由塑胶材料制成。该基体24包括四侧壁240及一底部243，该四侧壁240与底部243共同围成一容置腔30。该侧壁240包括一上部241及一下部242，二相对侧壁240的下部242邻近容置腔30的一侧是一斜面244，该导电片20的第一板462嵌卡于该下部242与上部241连接处并伸出基体24外，第二板463嵌卡于该底部243，该第三板464倚靠设于基体24下部242的斜面244上。支架40的料带42及横梁44均位于于基体24外。
请参阅图6，提供若干影像感测芯片22。于每一基体24的底部243上涂布粘胶，将该若干影像感测芯片22分别放置于该粘胶上，从而固定于基体24的容置腔30内。所述影像感测芯片22顶面中央的感测区222的周缘布设有多个芯片焊垫224。
请参阅图7，用打线机打出若干引线26，每一引线26的一端电连接于影像感测芯片22的芯片焊垫224，另一端电连接于导电片20的第一板462上，以使影像感测芯片22的讯号得以传递至若干导电片20。该若干引线26的材料为导电性较好的黄金等金属。然后于影像感测芯片22顶面中央的感测区222的周缘涂布粘胶34，以将每一引线26包覆。
请参阅图8，提供一透光板28。于基体24顶部涂布粘胶，将该透光板28盖于基体24的上部241上，从而将基体24的容置腔30盖住，同时使粘胶34紧靠并粘附透光板28，从而将影像感测芯片22的感测区222包覆于一空腔32内。
请再次参阅图5，将该若干基体24沿其边缘切割，使支架40的料带42被切断，同时使所述导电片20的第一板462被割断，同一横梁44两侧的导电片20分别位于两个预封装体2内，形成单个的预封装体2，此时，导电片20的端部露出于基体24而暴露于空气中。通常情况下，因导电片20与塑胶基体24收缩率不同，若干基体24被切开后，该导电片20会缩进塑胶本体20内。
请参阅图9，提供一熔接技术(如超声波熔接、激光熔接、热熔接等)熔接于基体24的边缘，将导电片20包覆于基体24内从而将其与空气隔绝，从而完成影像传感器的封装过程。
请结合参阅图10，组装该镜头模块于影像传感器封装结构的上，提供一镜筒10及一镜座21，该镜筒10通过其外螺纹102与镜座21的内螺纹201的配合而螺纹连接于镜座21上，再将组装有镜筒10的镜座21固定于影像传感器封装结构上，即使透光板28嵌卡于矩形开槽2042内，之后以粘胶或热熔接等方式将镜座21与基体24连接在一起；之后，进行调焦，通过调整镜筒10的外螺纹102与镜座21的内螺纹201的连接，以微调镜筒10与影像感测芯片21之间距使所述数码相机模组处于一最佳影像摄取状态，最后通过点胶将镜筒10固定于镜座21上，由此形成一数码相机模组。
可以理解，分割各个基体24的制程可提前至基体24成型与粘贴影像感测芯片22制程之间；粘胶34的形成与透光板28的覆盖可同时进行，由此粘胶34可紧紧地粘附于透光板28上，从而保证空腔32的密封，减少粉尘等。

Claims (14)

1.一种数码相机模组的制程，其特征在于：包括以下步骤：提供一影像传感器封装，该影像传感器封装制程包括如下步骤：
提供一支架，该支架是将一导电板通过冲压成型方式而成，该支架包括至少一料带及若干形成于与料带连接的导电片；
将支架的一部分放入一模具的型腔内，并于型腔内注入塑胶材料，冷却后成型出若干包覆该支架的导电片的基体，导电片部分暴露于基体外，每一基体包括一容置腔；
提供一包括一感测区的影像感测芯片，将该影像感测芯片设置于基体的容置腔内；
设置若干引线，使每一引线电连接影像感测芯片与导电片；
提供一透光板，将该透光板设置于基体上，将容置腔盖住；
将若干基体分割，形成单个封装体；
通过熔接技术将导电片包覆在基体内；提供一镜头模块，将该镜头模块装于影像传感器之上。
2.如权利要求1所述的数码相机模组的制程，其特征在于：在引线形成后及覆盖透光板前于影像感测芯片的感测区周缘涂布粘胶，使该粘胶包覆每一引线，且粘附于透光板上，该粘胶与透光板共同形成一空腔，从而将影像感测芯片的感测区包覆于该空腔内。
3.如权利要求1所述的数码相机模组的制程，其特征在于：该支架包括二相互平行的料带及若干连接二料带的横梁，该若干横梁均匀分布于二料带之间，所有导电片均平行于料带，且其设于横梁的侧边。
4.如权利要求3所述的数码相机模组的制程，其特征在于：该导电片包括一第一板、一第二板及一连接第一板与第二板的第三板，该第一板与第二板间隔错开一定距离。
5.如权利要求1所述的数码相机模组的制程，其特征在于：该基体通过嵌入成型法一体成型方式形成。
6.如权利要求4所述的数码相机模组的制程，其特征在于：该基体形成于支架的周缘及上下表面，其为长方体形，该基体包括四侧壁及一底部，该四侧壁与底部共同围成一容置腔，该侧壁包括一上部及一下部，二相对侧壁的下部邻近容置腔的一侧设有一斜面。
7.如权利要求6所述的数码相机模组的制程，其特征在于：该导电片的第一板嵌卡于该下部的与上部连接处，第二板嵌卡于该底部，该第三板倚靠设于基体下部的斜面上，支架的料带及横梁均位于于基体外。
8.如权利要求1所述的数码相机模组的制程，其特征在于：该引线的材料为导电金属。
9.如权利要求1所述的数码相机模组的制程，其特征在于：该透光板为透光玻璃，其通过粘胶固定至基体上。
10.如权利要求1所述的数码相机模组的制程，其特征在于：导电片是通过熔接技术将基体边缘熔接而被包覆。
11.如权利要求10所述的数码相机模组的制程，其特征在于：该熔接技术为超声波熔接、激光熔接、热熔接技术。
12.如权利要求1所述的数码相机模组的制程，其特征在于：该镜头模块包括一镜筒及一镜座，该镜筒通过螺纹连接于镜座上。
13.如权利要求12所述的数码相机模组的制程，其特征在于：镜头模块的镜座通过粘胶或热熔接方式固定于影像传感器之上。
14.如权利要求13所述的数码相机模组的制程，其特征在于：该镜筒与镜座调焦后，再通过粘胶使镜筒与镜座相对固定。
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