CN100485893C - 影像感测芯片封装的制程和结构 - Google Patents
影像感测芯片封装的制程和结构 Download PDFInfo
- Publication number
- CN100485893C CN100485893C CNB2005100372043A CN200510037204A CN100485893C CN 100485893 C CN100485893 C CN 100485893C CN B2005100372043 A CNB2005100372043 A CN B2005100372043A CN 200510037204 A CN200510037204 A CN 200510037204A CN 100485893 C CN100485893 C CN 100485893C
- Authority
- CN
- China
- Prior art keywords
- image sensing
- sensing chip
- plate
- matrix
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims description 5
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims abstract description 3
- 239000011159 matrix material Substances 0.000 claims description 54
- 238000005538 encapsulation Methods 0.000 claims description 39
- 229920000297 Rayon Polymers 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 2
- 239000000306 component Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
Claims (15)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100372043A CN100485893C (zh) | 2005-09-09 | 2005-09-09 | 影像感测芯片封装的制程和结构 |
US11/453,456 US7592197B2 (en) | 2005-09-09 | 2006-06-14 | Image sensor chip package fabrication method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100372043A CN100485893C (zh) | 2005-09-09 | 2005-09-09 | 影像感测芯片封装的制程和结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1929102A CN1929102A (zh) | 2007-03-14 |
CN100485893C true CN100485893C (zh) | 2009-05-06 |
Family
ID=37854126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100372043A Active CN100485893C (zh) | 2005-09-09 | 2005-09-09 | 影像感测芯片封装的制程和结构 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7592197B2 (zh) |
CN (1) | CN100485893C (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG172749A1 (en) | 2009-03-06 | 2011-08-29 | Kaixin Inc | Leadless integrated circuit package having high density contacts |
KR101753416B1 (ko) | 2009-04-03 | 2017-07-19 | 카이씬, 인코포레이티드 | Ic 패키지용 리드프레임 및 제조방법 |
US9362138B2 (en) | 2009-09-02 | 2016-06-07 | Kaixin, Inc. | IC package and method for manufacturing the same |
CN108621525B (zh) * | 2012-08-27 | 2019-09-06 | 泉州台商投资区久协机械科技有限公司 | 一种压头 |
CN103247650B (zh) * | 2013-05-09 | 2016-09-07 | 格科微电子(上海)有限公司 | 一种板载芯片模组及其制造方法 |
CN103327730A (zh) * | 2013-05-23 | 2013-09-25 | 上海摩软通讯技术有限公司 | 具有感光功能的电子设备、柔性线路板及插座 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6420204B2 (en) * | 1999-06-03 | 2002-07-16 | Amkor Technology, Inc. | Method of making a plastic package for an optical integrated circuit device |
CN2543207Y (zh) * | 2002-04-11 | 2003-04-02 | 胜开科技股份有限公司 | 影像感测器 |
US6686588B1 (en) * | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
CN2653694Y (zh) * | 2003-06-17 | 2004-11-03 | 胜开科技股份有限公司 | 用于影像感测晶片封装的基板 |
CN1553512A (zh) * | 2003-06-03 | 2004-12-08 | 胜开科技股份有限公司 | 影像感测器模组及其制造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6531333B2 (en) * | 2000-04-05 | 2003-03-11 | Hong-Ming Lin | Chip photoelectric sensor assembly and method for making same |
DE10131698A1 (de) * | 2001-06-29 | 2003-01-30 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung |
JP3948650B2 (ja) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
-
2005
- 2005-09-09 CN CNB2005100372043A patent/CN100485893C/zh active Active
-
2006
- 2006-06-14 US US11/453,456 patent/US7592197B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6420204B2 (en) * | 1999-06-03 | 2002-07-16 | Amkor Technology, Inc. | Method of making a plastic package for an optical integrated circuit device |
US6686588B1 (en) * | 2001-01-16 | 2004-02-03 | Amkor Technology, Inc. | Optical module with lens integral holder |
CN2543207Y (zh) * | 2002-04-11 | 2003-04-02 | 胜开科技股份有限公司 | 影像感测器 |
CN1553512A (zh) * | 2003-06-03 | 2004-12-08 | 胜开科技股份有限公司 | 影像感测器模组及其制造方法 |
CN2653694Y (zh) * | 2003-06-17 | 2004-11-03 | 胜开科技股份有限公司 | 用于影像感测晶片封装的基板 |
Also Published As
Publication number | Publication date |
---|---|
US20070057149A1 (en) | 2007-03-15 |
US7592197B2 (en) | 2009-09-22 |
CN1929102A (zh) | 2007-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100468665C (zh) | 影像感测晶片封装制程 | |
CN100517738C (zh) | 影像感测芯片的封装结构 | |
CN100562068C (zh) | 数码相机模组制作方法 | |
CN100485893C (zh) | 影像感测芯片封装的制程和结构 | |
CN103325779B (zh) | 制造微电子封装的方法 | |
CN100483655C (zh) | 数码相机模组的制程 | |
CN1307698C (zh) | 具有树脂封壳的元件及其制作方法 | |
US7691678B2 (en) | Solid-state imaging device and method for manufacturing the same | |
US6965154B2 (en) | Semiconductor device | |
US7719585B2 (en) | Solid-state imaging device | |
CN100416815C (zh) | 包括无源器件的引线框架及其形成方法 | |
CN207845151U (zh) | 包含压力传感器电路的封装体和压力传感器封装体 | |
CN100555643C (zh) | 影像感测芯片封装结构及应用该结构的数码相机模组 | |
CN1595641B (zh) | 半导体装置及其制造方法 | |
CN205319149U (zh) | 半导体封装体 | |
CN1152429C (zh) | 封装影像感测芯片及其封装方法 | |
US20020177254A1 (en) | Semiconductor package and method for making the same | |
TWI357664B (en) | Process of making image sensor packages | |
US20040119862A1 (en) | Image sensor capable of radiating heat rapidly | |
JPS61285730A (ja) | 半導体装置の製造方法及びこれに用いる樹脂封止部材 | |
CN2461151Y (zh) | 封装影像感测晶片 | |
CN100355079C (zh) | 影像感测器及其封装方法 | |
CN1152427C (zh) | 封装集成电路基板及其制造方法 | |
CN115954430A (zh) | 一种小尺寸led灯珠制造方法 | |
US20040211815A1 (en) | Apparatus for removing an image sensor from a printed circuit board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HONGFUJIN PRECISE INDUSTRY CO., LTD. Free format text: FORMER OWNER: YANGXIN TECHNOLOGY CO., LTD. Effective date: 20130225 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130225 Address after: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee after: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee after: Hon Hai Precision Industry Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Yangxin Technology Co., Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170308 Address after: Room E2296, 1759 Mingxi Road, high tech Zone, Changchun, Jilin Patentee after: Changchun Optical Precision Instrument Group Co. Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Patentee before: Hon Hai Precision Industry Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210220 Address after: Room 0229, block B, incubation base, 77 Yingkou Road, Changchun Economic and Technological Development Zone, Jilin Province, 130000 Patentee after: Changchun Changguang Shiyuan Investment Co.,Ltd. Address before: 130102 room E2296, 1759 Mingxi Road, north new high tech, Changchun, Jilin. Patentee before: CHANGCHUN CHANGGUANG PRECISION INSTRUMENT GROUP Co.,Ltd. |
|
TR01 | Transfer of patent right |