CN103903991A - 一种光电传感器芯片的封装方法 - Google Patents
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Abstract
本发明公开了一种光电传感器芯片的封装方法,属于传感器技术领域。该包括以下步骤,将芯片通过粘合剂粘贴在金属框架上;通过金线将芯片上的电路和金属框架上的引脚电连接;使用透明胶在芯片感应区上粘贴玻璃片;对芯片除感应区上方的其它部分进行注塑外壳。本发明通过改变加工工艺改变了光电传感器芯片封装的外形,缩短了产品加工周期,降低了加工成本;采用玻璃片盖住芯片后注塑,取代原有带透光孔的盖子,有效的防止灰尘等粒子通过透光孔进入产品内部,造成鼠标性能上的异常;另外也提高了产品的密封性能。
Description
技术领域
本发明涉及传感器技术领域,特别涉及一种光电传感器芯片的封装方法。
背景技术
光电传感器也叫做光学芯片,是光电鼠标的核心,光电感应器主要由CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)感光块和DSP(Digital Signal Processing,数字信号处理)组成。CMOS感光块负责采集、接收由鼠标底部光学透镜传递过来的光线并同步成像,然后CMOS感光块会将生成的图像交由其内部的DSP进行运算和比较,通过图像的比较,便可实现鼠标所在位置的定位工作。
如图1所示,为一种现有的封装方法形成的光电传感器芯片。先将金属框架2进行产品外壳4及盖子1的LCP(Liquid Crystal Polymer,液晶高分子聚合物)材料注塑;然后用粘接剂将芯片3固定在电路板的金属框架2上;通过金线5将芯片3上的电路和金属框架2上的引脚电连接;在芯片3上方及四周喷涂覆盖保护胶6,最后盖好注塑好的盖子1,并在透光孔7上面粘贴临时封孔膜8。
现有的光电传感器芯片的封装方法存在以下问题,工序流程比较复杂、繁琐,加工成本较高,加工周期较长,密封性能不佳,另外透光孔将导致光电鼠标在组装完成后会有灰尘粒子通过透光孔进入到产品内部,造成产品的性能不良。
发明内容
为了解决目前的光电传感器芯片的封装方法工序流程复杂,加工成本高,密封性不好以及设计透光孔将导致光电鼠标在组装完成后会有灰尘粒子通过透光孔进入到产品内部,造成产品的性能不良的问题,现提供了一种光电传感器芯片的封装方法。具体技术方案如下:
一种光电传感器芯片的封装方法,包括以下步骤,
将芯片通过粘合剂粘贴在金属框架上;
通过金线将芯片上的电路和金属框架上的引脚电连接;
使用透明胶在芯片感应区上粘贴玻璃片;
对芯片除感应区上方的其它部分进行注塑外壳。
进一步的,所述注塑材料为环氧树脂。
与现有技术相比,上述技术方案提供的光电传感器芯片的封装方法具有以下优点:通过改变加工工艺改变了光电传感器芯片封装的外形,缩短了产品加工周期,降低了加工成本;采用玻璃片盖住芯片后注塑,取代原有带透光孔的盖子,有效的防止灰尘等粒子通过透光孔进入产品内部,造成鼠标性能上的异常;另外也提高了产品的密封性能。
附图说明
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是现有技术提供的光电传感器芯片的封装示意图;
图2是本发明实施例中提供的光电传感器芯片的部分封装示意图;
图3是本发明实施例中提供的光电传感器芯片的总体封装示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明实施方式作进一步地详细描述。
如图2和图3所示,本发明实施例提供了一种光电传感器芯片的封装方法,包括以下步骤,
将芯片3通过粘合剂10粘贴在金属框架2上;
通过金线5将芯片3上的电路和金属框架2上的引脚电连接;
使用透明胶在芯片3感应区上粘贴玻璃片9;
对芯片3除感应区上方的其它部分进行注塑外壳11。直接采用环氧树脂11进行注塑,玻璃片9区域上方不填充。采用环氧树脂材料代替LCP材料,可以较好的解决与引脚的结合度。通过改变注塑模具,不再使用透光孔,使注塑后的产品达到所需的更好性能。
本发明实施例公开的光电传感器芯片的封装方法通过改变外壳的材料来解决因产品外壳不良的密封性,提高产品在后续组装加工过程中的合格率;采用玻璃片盖住芯片后注塑,取代原有带透光孔的盖子,有效的防治灰尘等粒子通过透光孔进入产品内部,造成鼠标性能上的异常;另外通过更改及减少产品的加工工艺流程,可以缩短产品的加工周期,降低加工成本。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (2)
1.一种光电传感器芯片的封装方法,其特征在于,包括以下步骤,
将芯片通过粘合剂粘贴在金属框架上;
通过金线将芯片上的电路和金属框架上的引脚电连接;
使用透明胶在芯片感应区上粘贴玻璃片;
对芯片除感应区上方的其它部分进行注塑外壳。
2.根据权利要求1所述的光电传感器芯片的封装方法,其特征在于,所述注塑材料为环氧树脂。
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Cited By (7)
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CN105224846A (zh) * | 2015-09-17 | 2016-01-06 | 联想(北京)有限公司 | 电子设备及指纹识别装置 |
CN105721754A (zh) * | 2016-04-01 | 2016-06-29 | 宁波舜宇光电信息有限公司 | 基于一体封装工艺的摄像模组 |
US9710082B2 (en) | 2014-08-27 | 2017-07-18 | Boe Technology Group Co., Ltd. | Wearable display device, belt buckle and belt |
CN107093589A (zh) * | 2017-05-11 | 2017-08-25 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装结构 |
CN107240553A (zh) * | 2017-05-11 | 2017-10-10 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装工艺 |
US11877044B2 (en) | 2016-02-18 | 2024-01-16 | Ningbo Sunny Opotech Co., Ltd. | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
US12021097B2 (en) | 2016-03-12 | 2024-06-25 | Ningbo Sunny Opotech Co., Ltd. | Camera module, and photosensitive component thereof and manufacturing method therefor |
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US9710082B2 (en) | 2014-08-27 | 2017-07-18 | Boe Technology Group Co., Ltd. | Wearable display device, belt buckle and belt |
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US11877044B2 (en) | 2016-02-18 | 2024-01-16 | Ningbo Sunny Opotech Co., Ltd. | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
US12021097B2 (en) | 2016-03-12 | 2024-06-25 | Ningbo Sunny Opotech Co., Ltd. | Camera module, and photosensitive component thereof and manufacturing method therefor |
CN105721754A (zh) * | 2016-04-01 | 2016-06-29 | 宁波舜宇光电信息有限公司 | 基于一体封装工艺的摄像模组 |
CN105721754B (zh) * | 2016-04-01 | 2020-04-28 | 宁波舜宇光电信息有限公司 | 基于一体封装工艺的摄像模组 |
CN107093589A (zh) * | 2017-05-11 | 2017-08-25 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装结构 |
CN107240553A (zh) * | 2017-05-11 | 2017-10-10 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装工艺 |
CN107093589B (zh) * | 2017-05-11 | 2019-11-12 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装结构 |
CN107240553B (zh) * | 2017-05-11 | 2019-11-12 | 江苏钜芯集成电路技术股份有限公司 | 高密度光电鼠标芯片封装工艺 |
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