WO2017220015A1 - 定焦摄像模组及其制造方法 - Google Patents

定焦摄像模组及其制造方法 Download PDF

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Publication number
WO2017220015A1
WO2017220015A1 PCT/CN2017/089749 CN2017089749W WO2017220015A1 WO 2017220015 A1 WO2017220015 A1 WO 2017220015A1 CN 2017089749 W CN2017089749 W CN 2017089749W WO 2017220015 A1 WO2017220015 A1 WO 2017220015A1
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WO
WIPO (PCT)
Prior art keywords
camera module
focus camera
fixed focus
optical lens
lens
Prior art date
Application number
PCT/CN2017/089749
Other languages
English (en)
French (fr)
Inventor
陈振宇
王明珠
苏小娟
赵波杰
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610487305.9A external-priority patent/CN107544195A/zh
Priority claimed from CN201620638177.9U external-priority patent/CN205809504U/zh
Priority claimed from CN201620650844.5U external-priority patent/CN205792938U/zh
Priority claimed from CN201610480992.1A external-priority patent/CN107547777B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to US16/311,894 priority Critical patent/US10827103B2/en
Priority to KR1020197002084A priority patent/KR102264461B1/ko
Priority to JP2018567073A priority patent/JP6953454B2/ja
Priority to KR1020217017507A priority patent/KR102376930B1/ko
Priority to EP17814753.4A priority patent/EP3477352B1/en
Publication of WO2017220015A1 publication Critical patent/WO2017220015A1/zh

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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00Diagnosis, testing or measuring for television systems or their details
    • H04N17/002Diagnosis, testing or measuring for television systems or their details for television cameras
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B13/00Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
    • G03B13/32Means for focusing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006Filter holders
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/022Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/28Systems for automatic generation of focusing signals
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies
    • G03B17/12Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B19/00Cameras
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/54Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/67Focus control based on electronic image sensor signals
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/44Receiver circuitry for the reception of television signals according to analogue transmission standards
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B2217/00Details of cameras or camera bodies; Accessories therefor
    • G03B2217/002Details of arrangement of components in or on camera body

Definitions

  • the invention relates to the field of optical imaging, in particular to a fixed focus camera module and a manufacturing method thereof.
  • portable electronic devices such as smart phones and tablet computers and related technologies have been rapidly developed.
  • camera modules for helping users to shoot images have become One of the standard configurations of portable electronic devices.
  • the portable electronic device is configured with a front camera module. Since the fixed focus camera module does not need to reserve a space for focusing after being configured in the portable electronic device, in order to control the size of the portable electronic device, the fixed focus camera module becomes the front camera mode of the portable electronic device. The preferred group.
  • portable electronic devices have become more and more intelligent, thin and light.
  • the development trend of portable electronic devices requires the addition of smart components to make portable electronic devices have more powerful functions.
  • it is required to reduce the size of various components of a portable electronic device to control the size of the portable electronic device.
  • This trend of portable electronic devices places particular demands on the size of the fixed focus camera module.
  • the fixed focus camera module does not need to reserve space for focusing after being configured in the portable electronic device, it still needs to be adjusted in the process of packaging the fixed focus camera module to ensure the fixed focus camera module. Imaging quality.
  • a prior art fixed focus camera module including a photosensitive element 10P, an optical lens 20P, and a base 3P, wherein the base 3P includes a base body 33P and a lens barrel 34P.
  • the lens barrel 34P integrally extends to the base body 33P, wherein the photosensitive element 10P is disposed on the base body 33P, and the optical lens 20P is disposed on the lens barrel 34P to make the optical lens 20P A photosensitive path of the photosensitive element 10P.
  • the optical lens 20P is fixed by the lens barrel 34P and the optical lens 20P is held at a position after focusing.
  • the arrangement of the lens barrel 34P limits the size of the fixed focus camera module, and even becomes a technical bottleneck restricting the development of the fixed focus camera module.
  • the optical lens 20P is mounted inside the lens barrel 34P, Therefore, in the process of mounting the optical lens 20P and the lens barrel 34P or adjusting the position of the optical lens 20P relative to the lens barrel 34P to achieve focusing of the fixed focus camera module, the optical lens
  • the outer surface of the 20P and the inner surface of the lens barrel 34P may cause some particles and the like on the outer surface of the optical lens 20P and the inner surface of the lens barrel 34P due to friction with each other, and the particles and the like may be contaminated.
  • An object of the present invention is to provide a fixed focus camera module and a manufacturing method thereof, wherein the size of the fixed focus camera module can be effectively reduced, so that the fixed focus camera module is particularly suitable for being pursued Thin and light electronic devices.
  • An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the optical lens of the fixed focus camera module is directly packaged in the lens holder, so that the fixed focus camera module does not need to provide a lens barrel for fixing
  • An object of the present invention is to provide a telephoto camera module and a manufacturing method thereof, wherein the optical lens is directly packaged in the lens holder to effectively reduce the height dimension of the camera module.
  • An object of the present invention is to provide a telephoto camera module and a manufacturing method thereof, wherein a glue layer is disposed or formed between the optical lens and the lens holder for encapsulating the optical lens in the mirror seat.
  • An object of the present invention is to provide a fixed focus camera module and a manufacturing method thereof, wherein the glue layer is used for closing a gap generated between the optical lens and the lens holder to prevent external light or contaminants from passing through the The slit enters the inside of the fixed focus camera module to ensure the imaging quality of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a method of manufacturing the same, wherein the glue layer improves the flatness of the optical lens and the lens holder such that a central axis of the optical lens and the photosensitive element The central axes coincide to ensure the imaging quality of the fixed focus camera module.
  • An object of the present invention is to provide a telephoto camera module and a manufacturing method thereof, wherein the optical lens is adjusted relative to the photosensitive element outside the fixed focus camera module during the process of packaging the fixed focus camera module The position of the solid particles or the like generated during the focusing of the fixed focus camera module does not enter the interior of the camera module to improve the imaging quality of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a manufacturing method thereof, wherein the glue layer disposed between or formed between the optical lens and the lens holder can block the fixed focus camera module Contaminants such as solid particles generated during focusing are introduced into the interior of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a method of manufacturing the same, wherein after the fixed focus camera module is packaged, the fixed focus camera can be attached to the fixed focus camera by cleaning the fixed focus camera module. Contaminants such as solid particles on the outside of the module are removed.
  • An object of the present invention is to provide a telephoto camera module and a manufacturing method thereof, wherein the fixed focus camera module does not need to provide a lens barrel, and in this way, the product raw material cost of the fixed focus camera module can be reduced. Technical difficulty to improve the competitiveness of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a method of manufacturing the same, wherein the lens holder provides an inner groove for accommodating a filter element, thereby reducing the height of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a method of manufacturing the same, wherein the lens holder provides an outer groove for encapsulating the optical lens, thereby reducing the height of the fixed focus camera module.
  • An object of the present invention is to provide a fixed focus camera module and a manufacturing method thereof, wherein the fixed focus camera module includes a photosensitive component and the lens, and the lens is directly mounted on the photosensitive component instead of passing through The lens barrel is mounted.
  • An object of the present invention is to provide a camera assembly and a manufacturing method thereof, wherein the photosensitive assembly includes an integral base and the circuit board, and the integrated base is integrally formed on the circuit board, and the lens is directly Grounded on the integral base.
  • An object of the present invention is to provide a fixed focus camera module and a method of manufacturing the same, wherein the integral base is integrally formed on the circuit board and the at least a portion of the photosensitive elements.
  • An object of the present invention is to provide a camera assembly and a method of manufacturing the same, wherein the photosensitive assembly includes a seat, the holder is disposed on the integral base, and the filter element is mounted on the support seat.
  • An object of the present invention is to provide a telephoto camera module and a method of fabricating the same, wherein the optical lens comprises at least two group units, at least one of which is directly disposed on the lens holder.
  • An object of the present invention is to provide a telephoto camera module and a method of fabricating the same, wherein at least one of the group units of the optical group unit is directly mounted to the integrated base.
  • An object of the present invention is to provide a telephoto camera module and a method of manufacturing the same, wherein each of the group units is exposed to the outside of the lens mount or the integrated base for convenient adjustment operation.
  • An object of the present invention is to provide a telephoto camera module and a manufacturing method thereof, wherein each of the group units is exposed outside the lens mount or the integrated base, so that the group unit can be adjusted.
  • the scope of the adjustment is broader, rather than being limited to adjusting the group unit at the top.
  • An object of the present invention is to provide a fixed focus camera module and a manufacturing method thereof, wherein a fixed focus camera module is adjusted by a plurality of group units to reduce lens accumulation error of the lens, and is suitable for manufacturing a multi-lens fixed focus camera module. .
  • a fixed focus camera module capable of achieving the foregoing and other objects and advantages includes:
  • a lens holder wherein the optical lens is packaged at a top end of the lens holder such that the optical lens protrudes outwardly from the lens holder, and the optical lens is held in a photosensitive path of the photosensitive member.
  • the present invention provides a method of manufacturing a fixed focus camera module, wherein the manufacturing method includes the steps of: packaging an optical lens on a top end of a lens holder to cause the optical lens to protrude outward And the optical lens is held in a photosensitive path of a photosensitive element mounted on a circuit board, thereby forming the fixed focus camera module.
  • the fixed focus camera module of the present invention comprises the photosensitive element, the optical lens and the lens holder, the photosensitive element is disposed on one side of the lens holder, and the optical lens is directly packaged in the The other side of the lens holder is described, and the optical lens is held in a photosensitive path of the photosensitive member.
  • Light reflected by the object can enter the interior of the fixed focus camera module from the optical lens to be received by the photosensitive element and to generate an image (eg, image or video) associated with the object after photoelectric conversion. That is, it is not necessary to provide any member around the optical lens of the fixed focus camera module of the present invention, so that the predetermined size can be reduced by reducing the size of the head of the fixed focus camera module.
  • the size of the focus camera module when the fixed focus camera module is applied to an electronic device, the size of the fixed focus camera module can leave more space for other components of the electronic device, Thereby enabling the electronic device to It is in line with the development trend of intelligent, thin and light.
  • a fixed focus camera module including:
  • optical lens wherein the optical lens is directly packaged in the photosensitive component to form the fixed focus camera module.
  • Figure 1 is an exploded perspective view of the prior art.
  • FIG. 2 is a perspective view of a fixed focus camera module in accordance with a preferred embodiment of the present invention.
  • FIG 3 is a cross-sectional view of a fixed focus camera module in accordance with the above preferred embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a modified embodiment of a fixed focus camera module according to the above preferred embodiment of the present invention.
  • FIG. 5A is a cross-sectional view showing another modified embodiment of the fixed focus camera module according to the above preferred embodiment of the present invention.
  • FIG. 5B is a cross-sectional view showing still another modified embodiment of the fixed focus camera module according to the above preferred embodiment of the present invention.
  • FIG. 6 is a block diagram showing a flow of a method for manufacturing a fixed focus camera module according to the above preferred embodiment of the present invention.
  • FIG. 7A is a cross-sectional view of a fixed focus camera module in accordance with a second preferred embodiment of the present invention.
  • FIG. 7B is a cross-sectional view showing a modified embodiment of a fixed focus camera module according to a second preferred embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing a first modified embodiment of a fixed focus camera module according to a second preferred embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing a second modified embodiment of a fixed focus camera module according to a second preferred embodiment of the present invention.
  • FIG. 10A is a cross-sectional view of a fixed focus camera module in accordance with a third preferred embodiment of the present invention.
  • FIG. 10A is a cross-sectional view of a fixed focus camera module in accordance with a third preferred embodiment of the present invention.
  • FIG. 10B is a schematic cross-sectional view showing a modified embodiment of a fixed focus camera module according to a third preferred embodiment of the present invention.
  • Figure 11 is a cross-sectional view showing a fixed focus camera module in accordance with a fourth preferred embodiment of the present invention.
  • FIG. 12 is a modified embodiment of a fixed focus camera module according to a fourth preferred embodiment of the present invention A schematic cross-sectional view.
  • Figure 13 is a cross-sectional view showing a fixed focus camera module in accordance with a fifth preferred embodiment of the present invention.
  • FIG. 14 is a schematic diagram of an upper group unit of a multi-group lens of a fixed focus camera module according to a fifth preferred embodiment of the present invention.
  • FIG. 15 is a schematic diagram of a lower group unit of a multi-group lens of a fixed focus camera module according to a fifth preferred embodiment of the present invention.
  • Fig. 16 is a partial enlarged view of Fig. 13;
  • Figure 17 is a cross-sectional view showing a fixed focus camera module in accordance with a sixth preferred embodiment of the present invention.
  • a fixed focus camera module according to a preferred embodiment of the present invention is illustrated, wherein the fixed focus camera module includes a photosensitive element 10 and an optical lens 20 And a lens holder 30, wherein the optical lens 20 is packaged at a top end 302 of the lens holder 30, a light-passing hole 301 is formed in the center of the lens holder 30, and the optical lens 20 is held by the photosensitive element 10.
  • Photosensitive path 20 Light reflected by the object can enter the interior of the fixed focus camera module from the optical lens 20 and be received and photoelectrically converted by the photosensitive element 10 to generate an image (eg, image or video) associated with the object. .
  • the type of the photosensitive element 10 and the type of the optical lens 20 are not limited.
  • the photosensitive element 10 may be a Charge Coupled Device (CCD), or the photosensitive element 10 may be a Metal Oxide Semiconductor (CMOS).
  • CMOS Metal Oxide Semiconductor
  • the photosensitive element 10 may be a silicon photonics chip. That is, in the fixed focus camera module of the present invention, the photosensitive element 10 refers to any optical element capable of photoelectric conversion after receiving light reflected by an object.
  • the optical lens 20 refers to any optical element capable of allowing light reflected by the object to enter the interior from the outside of the fixed focus camera module and improve the quality of the light.
  • the optical lens 20 is directly packaged at the top end 302 of the lens holder 30.
  • the fixed-focus camera module of the present invention does not need to provide the prior art lens barrel structure. In this manner, the volume of the fixed-focus camera module around the optical lens 20 can be reduced.
  • the fixed focus camera module can occupy the space of the electronic device as little as possible, thereby enabling the electronic device to leave more space. For the installation of other components.
  • a space of at least 0.2 mm can be saved in any direction around the optical lens 20, that is, the head of the fixed focus camera module (ie, the optical lens 20 and The surrounding area can save at least 0.4 mm of space, which is of great significance for the fixed focus camera module to be applied to the electronic device that is intelligent and thin.
  • the fixed focus camera module of the present invention does not need to provide the prior art lens barrel structure, but directly encapsulates the optical lens 20 in the lens holder 30. In this way, the use of raw materials can be reduced. In order to reduce the cost of the fixed focus camera module, the product competitiveness of the fixed focus camera module is improved.
  • the optical lens 20 is adjusted relative to the photosensitive element by means of a focusing mechanism that fixes the optical lens 20 outside the optical lens 20 10 position to improve the imaging quality of the fixed focus camera module. Therefore, in this process, even if the focusing mechanism causes the optical lens 20 to generate contaminants such as solid particles, the solid particles and the like do not enter the interior of the fixed focus camera module. The contaminants such as the solid particles are prevented from being contaminated, thereby ensuring the imaging quality of the fixed focus camera module. After the contaminants such as the solid particles are generated, the contaminants such as the solid particles adhere to at least the outer surface of the fixed focus camera module, and after the fixed focus camera module is packaged, the cleaning can be removed by cleaning. Contaminants such as solid particles attached to the outer surface of the fixed focus camera module to ensure the image quality of the fixed focus camera module during use in the electronic device.
  • the focusing mechanism may be a vertical focusing device or a plurality of focusing devices, such as active focusing devices in horizontal, vertical and oblique directions.
  • the fixed focus camera module includes a glue layer 40, wherein the glue layer 40 is located between the optical lens 20 and the lens holder 30 for using the optical lens 20 Directly encapsulated in the lens holder 30, correspondingly the glue layer 40 is annular, connecting the annular outer edge of the optical lens 20 to the lens holder 30, and preferably formed of an opaque material .
  • the glue layer 40 can not only connect the optical lens 20 and the lens holder 30, but also the glue layer 40. It can also be used for sealing at the junction of the optical lens 20 and the lens holder 30, thereby preventing contaminants such as solid particles or external contaminants or external light from passing through the optical lens 20 and the lens holder 30.
  • the connection enters the interior of the fixed focus camera module from the outside of the fixed focus camera module to ensure the image quality of the fixed focus camera module.
  • the glue layer 40 is formed at the junction of the optical lens 20 and the mirror holder 30. Specifically, selectively dispensing at a corresponding position of at least one of the optical lens 20 and the lens holder 30, after the dispensing operation is completed, mounting the lower end surface of the optical lens 20 to the The lens holder 30 is disposed between the optical lens 20 and the lens holder 30, and focuses the focusing camera module. When focusing, the lens can be fixed on the outside of the optical lens 20. In the manner of the optical mirror 20, after the focusing is completed, the glue is solidified to form the glue layer 40 between the optical lens 20 and the lens holder 30. Preferably, dispensing can be performed only at the corresponding position of the lens holder 30 to prevent glue from contaminating the optical lens 20.
  • the glue may be cured by irradiation of ultraviolet light (Ultraviolet Rays, UV light), that is, the glue layer 40 may use an ultraviolet light curing glue.
  • UV light Ultraviolet Rays, UV light
  • the glue layer 40 may use an ultraviolet light curing glue.
  • suitable glues can be used as well as curing the glue by other means such as thermal curing.
  • the glue may be semi-cured to prevent the glue from being glued in the process of encapsulating the optical lens 20 in the lens holder 30.
  • the optical lens 20 causes contamination.
  • the glue may be semi-cured to make the semi-cured glue have viscosity and plasticity under the optical lens 20.
  • the glue is cured to form the glue layer between the optical lens 20 and the lens holder 30.
  • the glue layer 40 maintains the optical lens 20 in a post-focusing position on the one hand, and the glue layer 40 closes the joint of the optical lens 20 and the lens holder 30 on the other hand.
  • the glue layer 40 can improve the alignment degree of the optical lens 20 and the lens holder 30, so that the central axis of the optical lens 20 can be It coincides with the central axis of the photosensitive element 10 to improve the imaging quality of the fixed focus camera module. That is, the glue layer 40 can compensate for the product error of the optical lens 20 and the product error of the lens holder 30 and the mounting error of the optical lens 20 and the lens holder 30, thereby improving the setting. Focus Image quality like a module.
  • the fixed focus camera module further includes a circuit board 50, wherein the photosensitive element 10 is mounted on the circuit board 50, and the circuit board 50 is connected to the lens holder 30.
  • the position of the optical lens 20 and the photosensitive element 10 are made to correspond to each other.
  • the circuit board 50 may be a printed circuit board (Printed Circuit Board), wherein the circuit board 50 can maintain the printed circuit board 10 after being mounted on the circuit board 50.
  • the circuit board 50 can also be any structure capable of connecting the photosensitive element 10 and other components of the electronic device, for example, the circuit board 50 can be an FPC circuit board.
  • the wiring board 50 implemented as an FPC wiring board may be attached to a reinforcing member (for example, a metal reinforcing member), and then the photosensitive member is attached 10 is attached to the reinforcing member, and the photosensitive member 10 is attached to the wiring board 50 to ensure the flatness of the photosensitive member 10 by the reinforcing member.
  • the lens holder 30 may be attached to the circuit board 50 or may be integrally packaged on the circuit board 50. That is, the mirror mount 30 can be implemented as the integral base 3000 that is subsequently proposed.
  • the photosensitive element 10 may be first fixed to the circuit board 50, and then the photosensitive element 10 and the circuit board may be formed by a process such as a wire bonding process. 50 are coupled together to mount the photosensitive member 10 to the wiring board 50. It can be understood that connecting the photosensitive element 10 and the wiring board 50 by way of gold wire is only an exemplary description. In other examples, the photosensitive element 10 can provide one or more chip bonding.
  • the circuit board 50 can provide one or more circuit board pads, and can also be realized by soldering the chip pads of the photosensitive element 10 and the circuit board pads of the circuit board 50 together. The mounting of the photosensitive element 10 and the wiring board 50 is described.
  • the photosensitive element 10 may be mounted on the circuit board 50 by a COB (Chip On Board) process, or may be assembled to the circuit board 50 by a Flip Chip flip-chip method.
  • COB Chip On Board
  • the fixed focus camera module further includes a filter element 60, wherein the filter element 60 is disposed between the photosensitive element 10 and the optical lens 20 for improving the fixed focus camera.
  • the imaging quality of the module Light reflected by the object enters the interior of the fixed focus camera module from the optical lens 20, and is further filtered by the photosensitive element 10 and photoelectrically converted after being filtered by the filter element 60 to generate an object. Associated image. That is, the filter element 60 can filter the stray light in the light reflected by the object from the optical lens 20 into the inside of the fixed focus camera module to improve the imaging of the fixed focus camera module. quality.
  • the type of the filter element 60 is not limited.
  • the filter element 60 may be an infrared cut filter to filter into the fixed focus camera mode. The infrared rays in the light reflected by the object inside the group.
  • the filter element 60 may also be a visible light cut filter.
  • the filter element 60 can also be adjusted.
  • the filter element 60 can be movably disposed on the lens holder 30 to make the fixed focus by changing the position of the filter element 60. Camera modules are used in different environments.
  • the filter element 60 is packaged inside the lens holder 30 such that the filter element 60 is held between the optical lens 20 and the photosensitive element 10.
  • the filter element 60 may be first packaged inside the lens holder 30, and then the circuit board 50 may be packaged in the lens holder 30.
  • the inside of the lens holder 30 is provided with an inner groove 31, wherein the filter element 60 is encapsulated in the inner groove 31 of the lens holder 30, in such a manner, can be effectively reduced
  • the height of the fixed focus camera module is such that the fixed focus camera module is particularly suitable for being applied to the electronic device that seeks to be thin and light.
  • an outer groove 32 is disposed on the outer surface of the lens holder 30.
  • the optical lens 20 is directly encapsulated in the outer groove 32 of the lens holder 30 through the glue layer 40.
  • only the glue layer 40 may be located in the outer groove 32 of the lens holder 30. In this way, the height of the fixed focus camera module can be further effectively reduced.
  • the described focus camera module is particularly suitable for use in the electronic device that seeks to be thin and light. That is, the outer side and the inner side of the top end 302 of the lens holder 30 respectively have the outer side groove 32 and the inner side groove 31 for respectively carrying the glue layer 40 and the filter element 60. It should be understood that, in another modified embodiment, the top end 302 of the lens holder 30 may also be a flat surface without the concave groove, and the glue layer 40 is respectively disposed on the lens holder. The opposite outer and inner surfaces of the top end 302 of 30.
  • the circuit board 50 and the photosensitive element 10 may be first fixed together, and the wire bonding process is used to conduct the The wiring board 50 and the photosensitive member 10 are electrically connected to the photosensitive member 10 and the wiring board 50.
  • the filter element 60 is packaged in the mirror mount 30.
  • the filter element 60 may be packaged in the mirror mount 30. Inside the inner groove 31. It can be understood by those skilled in the art that in the process of packaging the fixed focus camera module of the present invention, the first step and the second step may be in no particular order, or the step one and the step The second step can be carried out simultaneously.
  • step three the circuit board 50 is assembled with the lens holder 30 such that the filter element 60 corresponds to the photosensitive element 10 mounted on the wiring board 50.
  • step four dispensing is performed at a corresponding position of the lens holder 30.
  • the amount of glue can be provided as needed, for example, the amount of glue needs to be ensured to be in contact with the lower end surface of the optical lens 20. It is worth mentioning that the amount of glue depends on the glue performance and coating area.
  • Step 5 the optical lens 20 is mounted on the lens holder 30 such that glue is located between the optical lens 20 and the lens holder 30, and the optical lens 20 is ensured to be in the photosensitive element 10 path.
  • Step 6 Adjust the position of the optical lens 20 relative to the photosensitive element 10 to focus the fixed focus camera module.
  • the photosensitive element 10 is energized by the wiring board 50 to enable the photosensitive element 10 to output an image
  • the fixed focus camera module is focused according to the sharpness of the image.
  • the focusing of the fixed focus camera module may be performed by adjusting the position of the optical lens 20 relative to the photosensitive element 10 by clamping the outer surface of the optical lens 20,
  • the fixed focus camera module of the present invention realizes focusing of the fixed focus camera module outside the fixed focus camera module, so that even the focus mechanism causes the optical lens 20 to be outside
  • the solid particle contaminant is generated on the surface, and the solid particle contaminant does not enter the interior of the fixed focus camera module to improve the imaging quality of the fixed focus camera module.
  • the zoom camera module can be adjusted by adjusting the position of the optical lens 20 relative to the photosensitive element 10
  • the focal length in other examples, the position of the photosensitive element 10 relative to the optical lens 20 can also be adjusted by moving the lens holder 30 or the wiring board 50 or the photosensitive member as a whole.
  • step seven the glue is cured to form the glue layer 40 between the optical lens 20 and the lens holder 30.
  • the glue layer 40 can be used to connect the optical lens 20 and the lens holder 30 such that the optical lens 20 is held in the photosensitive path of the photosensitive element 10, on the other hand.
  • the glue layer 40 can prevent external contaminants from entering the interior from the outside of the zoom camera module through the connection of the optical lens 20 and the lens holder 30.
  • the glue layer 40 can block external light.
  • the connection between the optical lens 20 and the lens holder 30 enters the interior from the outside of the zoom camera module.
  • the glue layer 40 can also compensate for the product error of the optical lens 20 and the product error of the lens holder 30 and the mounting error of the optical lens 20 and the lens holder 30, The situation that the optical lens 20 and the photosensitive element 10 are relatively tilted is prevented, thereby facilitating the image quality of the fixed focus camera module.
  • the filter element 60 is packaged.
  • the filter element 60 is disposed on the circuit board 50, and the filter element 60 covers the photosensitive element 10 .
  • the filter element 60 and the photosensitive element 10 are directly attached together.
  • the lens holder 30 may integrally cover the filter element 60, the photosensitive element 10 and the wiring board 50, thereby forming an integral unitary structure.
  • 5A is another modified embodiment of the fixed focus camera module, wherein the fixed focus camera module of the embodiment of the present invention and the fixed focus camera module of the preferred embodiment are configured.
  • the difference is in the position at which the filter element 60 is packaged.
  • the filter element 60 is encapsulated in the outer groove 31 of the lens holder 30 to make the filter element 60 more
  • the filter element 60 adjacent to the optical lens 20 and packaged at the tip end 302 of the lens holder 30 can be held between the optical lens 20 and the photosensitive element 10. That is, the outer groove can be used to mount the filter element 60 and provide installation space for the glue layer 40.
  • portions of the optical lens 20 may be mounted to the filter element 60 and portions may be mounted to the mirror mount 30. That is, after the filter element 60 is mounted, glue may be disposed at the bottom end of the optical lens 20 or the filter element 60 and the top end of the lens holder 30, and then in the optical lens 20 The glue layer 40 is formed between the mirror holder 30 and the filter element 60.
  • FIG. 5B is still another modified embodiment of the fixed focus camera module.
  • the top surface of the lens holder 30 is a planar structure, that is, the lens holder 30 does not have the first groove 3003 and the second groove 3004.
  • the glue layer 40 is disposed between the top end of the unitary base 3000 and the optical lens 20.
  • the filter element 60 is disposed at a top end of the unitary base 3000. More specifically, the filter element 60 is located inside the optical lens 20.
  • the present invention also provides a method 600 of fabricating a camera assembly, wherein the method 600 includes the following steps:
  • Step 610 (a) mounting a photosensitive element 10 on a circuit board 50;
  • Step 620 (b) encapsulating the circuit board 50 on a lens holder 30;
  • Step 630 (c) encapsulating an optical lens 20 on the top end 302 of the lens holder 30 to cause the optical lens 20 to protrude outwardly from the lens holder 30, and to maintain the optical lens 20
  • the photosensitive path of the photosensitive element 10 is thereby made into the fixed focus camera module. It can be understood that there may be no order between the above steps.
  • the lens holder 30 may be first disposed on the circuit board 50, and then the photosensitive member 10 may be mounted on the circuit board 50.
  • the method further comprises the steps of:
  • the photosensitive member 10 and the wiring board 50 are electrically connected by wire bonding to mount the photosensitive member 10 on the wiring board 50.
  • the method before the step (b), further includes the steps of: encapsulating a filter element 60 in the mirror mount 30, and in the step (b), causing the filter element 60 to be Mounted on the wiring board 50 at a position corresponding to the photosensitive element 10.
  • the lens holder 30 has an inner groove 31, and the filter element 60 is encapsulated in the inner groove 31 of the lens holder 30 to reduce the height of the fixed focus camera module.
  • the method before the step (b), further includes the step of: packaging the filter element 60 on the circuit board 50, wherein the filter element 60 covers the photosensitive element 10 surface.
  • a glue layer 40 is disposed between the optical lens 20 and the lens holder 30 to make the glue layer 40 after performing a focusing operation on the fixed focus camera module. Cured.
  • the optical lens 20 and the lens holder 30 is dispensed to cure the glue after performing a focusing operation on the fixed focus camera module.
  • the glue layer 40 is formed between the optical lens 20 and the lens holder 30.
  • the lens holder 30 has an outer groove 32, and the glue layer 40 directly encapsulates the optical lens 20 on the outer groove 32 of the lens holder 30 to reduce the fixed focus imaging mode. The height of the group.
  • the present invention also provides a method of manufacturing a fixed focus camera module, wherein the manufacturing method includes the following steps:
  • the optical lens 20 is fixed to the outside of the lens holder 30 to adjust the position of the optical lens 20 with respect to the lens holder 30, wherein the focusing mechanism causes solids generated on the outer surface of the optical lens 20.
  • the particulate contaminant is blocked by the glue to prevent solid particle contaminants from entering the interior from the outside of the fixed focus camera module through the junction of the lens holder 30 and the optical lens 20 to form the fixed focus imaging mode. group.
  • the glue is solidified to form a glue layer 40 between the optical lens 20 and the lens holder 30.
  • the present invention also provides a method of manufacturing a fixed focus camera module, wherein the manufacturing method includes the following steps:
  • the relative position between the optical lens 20 and the lens holder 30, that is, the relative position between the optical lens 20 and the photosensitive element 10 can be firstly achieved by a suitable focusing mechanism and a fixed light shielding structure. After the determination, the glue is again dispensed and the glue is cured to fix the optical lens 20 to the top end of the lens holder 30.
  • FIG. 7A is a cross-sectional view of a fixed focus camera module according to a second preferred embodiment of the present invention.
  • the fixed focus camera module includes a photosensitive component 100 and an optical lens 20, wherein the optical lens 20 is packaged on a top end of the photosensitive component 100, the optical lens 20 is located in the photosensitive path of the photosensitive member 100.
  • the photosensitive assembly 100 includes a photosensitive element 10, a circuit board 50, and an integrated base 3000.
  • the photosensitive element 10 is electrically connected to the circuit board 50.
  • the integrated base 3000 is integrally formed on the circuit board 50.
  • the integrated base 3000 includes a molded body 3001 and has a light window 3002 integrally molded on the circuit board 50 in a molded manner, and the light window 3002 is formed in the middle portion.
  • the photosensitive element 10 provides a light path.
  • the optical lens 20 is directly packaged on top of the integral base 3000 such that the optical lens 20 is positioned in the photosensitive path of the photosensitive element 10 and constitutes the fixed focus Camera module.
  • the fixed-focus camera module of the present invention does not need to provide the prior art lens barrel structure. In this manner, the volume of the fixed-focus camera module around the optical lens 20 can be reduced.
  • the fixed focus camera module can occupy the space of the electronic device as little as possible, thereby enabling the electronic device to leave more space. For the installation of other components.
  • the fixed focus camera module of the present invention does not need to provide the prior art lens barrel structure, but directly encapsulates the optical lens 20 in the integrated base 3000. In this way, the use of raw materials can be reduced. In order to reduce the cost of the fixed focus camera module, the product competitiveness of the fixed focus camera module is improved.
  • the integrated base 3000 is integrally formed on the circuit board 50 by molding, and the integrated base 3000 has better surface flatness for the optical lens. 20 provides a flatter mounting surface.
  • the photosensitive member 100 includes a circuit component 51 electrically connected to the wiring board 50 for the photosensitive operation of the photosensitive component 10.
  • the circuit component 51 can be, for example but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, and the like.
  • the molded body 3001 can cover the circuit element 51 element inside, thus making the circuit component 51 not directly exposed to the space, more specifically, not exposed to The photosensitive element 10 is in a closed environment in which it communicates.
  • the circuit device in different conventional camera modules exists in such a manner that the resistive container member protrudes from the circuit board 50, thereby preventing dust and debris from staying in the circuit component 51 and contaminating the photosensitive member 10.
  • the circuit component 51 is illustrated as being exemplified by the circuit board 50. In other embodiments of the invention, the circuit component 51 is embedded in the circuit board.
  • circuit board 50 without protruding the circuit board 50, it will be understood by those skilled in the art that the structure, type and location of the circuit component 51 are not limiting of the present invention. It can be understood that in the conventional camera module, the circuit device protrudes from the circuit board 50, and the base can only be mounted on the outer side of the circuit component 51, so the circuit device and the bottom The seat requires a certain spatial position, so the size of the circuit board 50 in the lateral direction is relatively high.
  • the molding body 3001 is integrally packaged on the circuit board 50 and covers the circuit component 51, and thus the molding body 3001 and the circuit component
  • the spaces 51 overlap each other, thereby increasing the space in which the molding body 3001 can be disposed inward, reducing the external extension requirement of the circuit board 50, thereby reducing the lateral size of the camera module, so that Equipment that meets the needs of miniaturization.
  • the molding main body 3001 envelops the circuit component 51 has the advantage of protecting the circuit component 51 from being contaminated and being accidentally touched, and brings the corresponding camera module.
  • the molded body 3001 is not limited to cladding the circuit component 51. That is, in other embodiments of the present invention, the molded body 3001 may be directly molded to the wiring board 50 of the circuit component 51 without protruding, or may be molded to the circuit component. 51 different positions on the outside, around, etc.
  • the molding body 3001 is convexly surrounding the outside of the photosensitive member 10, and in particular, the molding body 3001 is integrally closed and connected to have a good sealing property, so that when the optical lens 20 is mounted on the photosensitive path of the photosensitive member 10, the photosensitive member 10 is sealed inside to form a corresponding closed inner space.
  • the photosensitive element 10 is electrically connected to the wiring board 50 through at least one connecting wire 11.
  • the connecting wires 11 can be implemented as, for example but not limited to, gold wires, copper wires, aluminum wires, silver wires, pads, wires, pins.
  • a conventional wiring board 50 may be selected as the wiring board 50, and molding is performed on the surface of the wiring board 50.
  • the circuit board 50 after the SMT process may be integrally packaged by an insert molding process using a molding die, such as a molded package.
  • the molded body 3001 is formed, or the molded body 3001 is formed by a molding process commonly used in a semiconductor package.
  • each of the photosensitive elements 10 is attached to the wiring board 50, and then the photosensitive elements 10 are electrically connected to the wiring board 50, for example, by a gold wire.
  • the circuit board 50 can be selected, for example, but not limited to, a soft and hard bonding board, a ceramic substrate (without a soft board), a PCB hard board (without a soft board), and the like.
  • the manner in which the molded body 3001 is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like.
  • the material to be selected for the molding body 3001 is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), and an injection molding process.
  • PP Polypropylene, polypropylene
  • the molding process can use epoxy resin. It should be understood by those skilled in the art that the foregoing alternatives and the materials that can be selected are merely illustrative of the embodiments of the invention and are not intended to be limiting.
  • the process of manufacturing the photosensitive member 100 may be performed by performing an SMT process on the circuit board 50, and then mounting the photosensitive element 10 on the circuit board 50, and
  • the photosensitive element 10 is electrically connected to the circuit board 50, such as a gold wire electrical connection, and then the circuit board 50 is integrally packaged, such as a molded package, and the molded body is formed by insert molding. 3001, or the molded body 3001 is formed by a molding process commonly used in semiconductor packages. It will be understood by those skilled in the art that the order of manufacture of the photosensitive member 100 is not a limitation of the present invention.
  • the optical lens 20 is adjusted relative to the photosensitive element by means of a focusing mechanism that fixes the optical lens 20 outside the optical lens 20 a position of 10 to improve imaging quality of the fixed focus camera module, such as actively aligning the optical lens and/or the photosensitive member such that the optical lens 20 and the optical axis of the photosensitive member 100 Consistent. Therefore, in this process, even if the focusing mechanism causes the optical lens 20 to generate contaminants such as solid particles, the solid particles and the like do not enter the interior of the fixed focus camera module. The contaminants such as the solid particles are prevented from being contaminated, thereby ensuring the imaging quality of the fixed focus camera module.
  • the contaminants such as the solid particles adhere to at least the outer surface of the fixed focus camera module, and after the fixed focus camera module is packaged, the cleaning can be removed by cleaning.
  • the fixed focus camera module includes a glue layer 40, wherein the glue layer 40 is located between the optical lens 20 and the integrated base 3000 for using the optical lens 20 Directly packaged in the integral base 3000, correspondingly the glue layer 40 is annular, connecting the annular outer edge of the optical lens 20 with the integral base 3000, and preferably formed of an opaque material .
  • the glue layer 40 can not only connect the optical lens 20 and the integrated base 3000, but also the glue layer 40 can be used for sealing from the optical lens 20 and the integrated base 3000.
  • the inside of the module is beneficial to ensure the imaging quality of the fixed focus camera module.
  • the glue layer 40 is formed at a joint of the optical lens 20 and the integrated base 3000. Specifically, selectively dispensing at a corresponding position of at least one of the optical lens 20 and the integrated base 3000, after the dispensing operation is completed, mounting the lower end surface of the optical lens 20 to the The base 3000 is integrated so that the glue is between the optical lens 20 and the integrated base 3000, and the fixed focus camera module is subjected to focusing, and the focus can be fixed on the outside of the optical lens 20 by focusing In the manner of the optical lens 20, after the focusing is completed, the glue is solidified to form the glue layer 40 between the optical lens 20 and the integrated base 3000.
  • dispensing may be performed only at the corresponding position of the unitary base 3000 to prevent glue from contaminating the optical lens 20.
  • the glue may be cured by irradiation of ultraviolet light (Ultraviolet Rays, UV light), that is, the glue layer 40 may use an ultraviolet light curing glue.
  • UV light Ultraviolet Rays, UV light
  • the glue layer 40 may use an ultraviolet light curing glue.
  • suitable glues can be used as well as curing the glue by other means such as thermal curing.
  • the glue may be semi-cured to prevent the glue from being glued in the process of encapsulating the optical lens 20 in the integrated base 3000.
  • the optical lens 20 causes contamination.
  • the glue may be semi-cured to make the semi-cured glue have viscosity and plasticity under the optical lens 20.
  • the glue is solidified to form the glue layer between the optical lens 20 and the integrated base 3000. 40.
  • the glue layer 40 keeps the optical lens 20 in a position after focusing, and on the other hand, the glue layer 40 closes the joint of the optical lens 20 and the integrated base 3000.
  • the glue layer 40 can improve the flatness of the optical lens 20 and the integrated base 3000, so that the central axis of the optical lens 20 can be The central axes of the photosensitive elements 10 are coincident to improve the imaging quality of the fixed focus camera module. That is, the glue layer 40 can compensate for the product error of the optical lens 20 and the product error of the integrated base 3000 and the mounting error of the optical lens 20 and the integrated base 3000, thereby improving the setting. The imaging quality of the focal camera module.
  • the filter element 60 is disposed between the photosensitive element 10 and the optical lens 20 for improving the imaging quality of the fixed focus camera module.
  • Light reflected by the object enters the interior of the fixed focus camera module from the optical lens 20, and is subjected to the filter element 60. After filtering, it is further received by the photosensitive element 10 and photoelectrically converted to generate an image associated with the object. That is, the filter element 60 can filter the stray light in the light reflected by the object from the optical lens 20 into the inside of the fixed focus camera module to improve the imaging of the fixed focus camera module. quality.
  • the filter element 60 is disposed on the integrated base 3000.
  • the integrated base 3000 has a first recess 3003 and a second recess 3004.
  • the first recess 3003 and the second recess 3004 are in communication with the optical window 3002 for installation.
  • the filter element 60 and the optical lens 20 are in communication with the optical window 3002 for installation.
  • the height of the fixed focus camera module can be effectively reduced, so that the fixed focus camera module is particularly suitable for being applied to the electronic device that is intended to be thin and light.
  • the filter element 60 is mounted to the first recess 3003, and the optical lens 20 is mounted to the second recess 3004.
  • the integral base 3000 is formed by molding in one piece, and has good surface flatness, so the first groove 3003 and the second concave The inner sides of the grooves 3004 are relatively flat, providing a flat mounting surface for the filter element 60 and the optical lens 20.
  • a medium such as glue may be applied to the integral base 3000 and the second recess 3004 or the bottom of the optical lens 20, so that the optical lens 20 is
  • the glue layer 40 is formed between the inner surface of the second groove 3004, so that the optical lens 20 is stably mounted on the integrated base 3000 to form a fixed focus camera module.
  • the camera module needs to be adjusted by the focusing mechanism to adjust the relative positions of the optical lens 20 and the photosensitive component 100, so as to improve the fixed focus.
  • the imaging quality of the camera module is possible.
  • the circuit board 50 and the photosensitive element 10 may be first fixed together, and the line is turned on by a wire bonding process.
  • the plate 50 and the photosensitive member 10 are electrically connected to the photosensitive member 10 and the wiring board 50.
  • Step 2 the filter element 60 is packaged in the integrated base 3000.
  • the filter element 60 may be packaged in the unit of the integrated base 3000.
  • the first groove 3003 is described.
  • the circuit board 50 is assembled with the integrated base 3000 such that the filter element 60 corresponds to the photosensitive element 10 mounted on the wiring board 50.
  • step four dispensing is performed at a corresponding position of the integrated base 3000.
  • the amount of glue can be provided as needed, for example, the amount of glue needs to ensure access to the optical lens 20 Lower end face. It is worth mentioning that the amount of glue depends on the glue performance and coating area.
  • Step 5 the optical lens 20 is mounted on the integrated base 3000 such that glue is located between the optical lens 20 and the integrated base 3000, and the optical lens 20 is ensured to be in the photosensitive element 10 path.
  • Step 6 Adjust the position of the optical lens 20 relative to the photosensitive element 10 to focus the fixed focus camera module.
  • the photosensitive element 10 is energized by the wiring board 50 to enable the photosensitive element 10 to output an image
  • the fixed focus camera module is focused according to the sharpness of the image.
  • the focusing of the fixed focus camera module may be performed by adjusting the position of the optical lens 20 relative to the photosensitive element 10 by clamping the outer surface of the optical lens 20,
  • the fixed focus camera module of the present invention realizes focusing of the fixed focus camera module outside the fixed focus camera module, so that even the focus mechanism causes the optical lens 20 to be outside
  • the solid particle contaminant is generated on the surface, and the solid particle contaminant does not enter the interior of the fixed focus camera module to improve the imaging quality of the fixed focus camera module.
  • the zoom camera module can be adjusted by adjusting the position of the optical lens 20 relative to the photosensitive element 10
  • the focal length in other examples, the position of the photosensitive element 10 relative to the optical lens 20 can also be adjusted by moving the integral base 3000, that is, moving the photosensitive member 100 as a whole.
  • step seven the glue is cured to form the glue layer 40 between the optical lens 20 and the integral base 3000.
  • the glue layer 40 can be used to connect the optical lens 20 and the integrated base 3000 such that the optical lens 20 is held in the photosensitive path of the photosensitive element 10, on the other hand.
  • the glue layer 40 can prevent external contaminants from entering the interior from the outside of the zoom camera module through the connection of the optical lens 20 and the integrated base 3000.
  • the glue layer 40 can block external light.
  • the connection between the optical lens 20 and the integrated base 3000 enters the interior from the outside of the zoom camera module.
  • the glue layer 40 can also compensate for the product error of the optical lens 20 and the product error of the integrated base 3000 and the mounting error of the optical lens 20 and the integrated base 3000 to prevent the optical lens 20 from being damaged.
  • the photosensitive element 10 is relatively inclined, thereby facilitating the image quality of the fixed focus camera module.
  • the top surface of the unitary base 3000 is a planar structure, that is, the unitary base 3000 does not have the first groove 3003 and the second groove 3004.
  • the glue layer 40 is disposed between the top end of the unitary base 3000 and the optical lens 20.
  • the filter element 60 is disposed at a top end of the unitary base 3000. More specifically, the filter element 60 is located inside the optical lens 20.
  • FIG 8 is a first modified embodiment of a second preferred embodiment of the present invention.
  • the filter element 60 covers the photosensitive element 10.
  • the manner in which the filter element 10 is covered is exemplified by, but not limited to, being covered by the photosensitive element 10 by adhesive bonding, such as by being composited on the photosensitive element 10, such as by attaching it to the device.
  • the photosensitive member 10 is described.
  • the filter element 60 is held between the optical lens 20 and the photosensitive element 10.
  • the integrated base 3000 has the second recess 3004 for mounting the optical lens 20, that is, in this embodiment of the invention, the integrated base 3000 does not have the The first groove 3003 of the filter element 60.
  • Figure 9 is a second modified embodiment of a second preferred embodiment of the present invention.
  • the integral base 3000 has a second recess 3004, and the filter element and the optical lens are mounted to the second recess 3004.
  • the filter element 60 is encapsulated in the second recess 3004 of the integral base 3000 such that the filter element 60 is further adjacent to the optical lens 20 and is packaged in the integrated base 3000
  • the filter element 60 can be held between the optical lens 20 and the photosensitive element 10. That is, the second groove 3004 can be used to mount the filter element 60 and provide an installation space for the glue layer 40.
  • the glue layer 40 is disposed between the optical lens and the filter element.
  • the fixed focus camera module of this embodiment of the present invention may be formed by integrally forming the integrated base 3000 on the circuit board 50, and electrically connecting the photosensitive element 10 on the circuit board 50. Forming the photosensitive member 100; then mounting the filter element 60 in the second recess 3004 of the unitary base 3000, and then providing glue at the edge position of the filter element 60 or Glue is disposed at a bottom end of the optical lens 20; then the optical lens 20 is mounted to the filter element 60 such that glue is located between the filter element 60 and the optical lens 20, and the optical lens 20 is caused a photosensitive path of the photosensitive element 60; further, adjusting a position of the optical lens 20 relative to the photosensitive element 10 to focus the fixed focus camera module; further, curing the glue to form a location The glue layer between the optical lens 20 and the filter element 60 40.
  • FIG. 10A is a schematic diagram of a fixed focus camera module according to a third preferred embodiment of the present invention.
  • the integrated base 3000 has a first recess 3003 and a second recess 3004, and the fixed focus camera module includes a seat 61, the support 61 is used to mount the filter element 60, and the holder 61 is mounted to the first groove 3003.
  • the glue layer 40 is disposed between the integral base 3000 and the optical lens 20. More specifically, the glue layer 40 is disposed on the second groove 3004. That is, the optical lens 20 is mounted to the second groove 3004 through the glue layer 40.
  • the filter element 60 when assembling the fixed focus camera module, the filter element 60 may be mounted to the holder 61, and then the holder 61 is mounted to the first groove 3003, and then The predetermined position of the surface of the support 61 or the end of the optical lens 20 is provided with glue, and the optical lens 20 is further pre-mounted on the integrated base 3000 such that glue is located at the integrated base 3000 and the optical Between the lenses 20, and the optical lens 20 is located in the photosensitive path of the photosensitive element 10; further, adjusting the position of the optical lens 20 relative to the photosensitive element 10 to perform the fixed focus camera module Focusing; further, the glue is cured to form the glue layer 40 between the optical lens 20 and the integral base 3000.
  • FIG. 10B is a schematic view showing a modified embodiment of a fixed focus camera module according to a third preferred embodiment of the present invention.
  • the integrated base 3000 has a second recess 3004, and the fixed focus camera module includes a seat 61 for mounting the filter element. 60.
  • the support 61 is mounted to the second recess 3004.
  • the glue layer 40 is disposed between the holder 61 and the optical lens 20.
  • the filter element 60 when assembling the fixed focus camera module, the filter element 60 may be mounted to the holder 61, and then the holder 61 is mounted to the second groove 3004, and then A predetermined position of the surface of the holder 61 or the end of the optical lens 20 is provided with glue to further pre-mount the optical lens 20 to the holder 61 such that glue is located at the holder 61 and the optical Between the lenses 20, and the optical lens 20 is located in the photosensitive path of the photosensitive element 10; further, adjusting the position of the optical lens 20 relative to the photosensitive element 10 to perform the fixed focus camera module Focusing; further, the glue is cured to form the glue layer 40 between the optical lens 20 and the holder 61. As shown in FIG.
  • the unitary base 3000 integrally encloses the circuit board and at least a portion of the photosensitive element 10.
  • the integral base covers the connecting wire 11 . That is, in this embodiment of the invention, the unitary base 3000 extends inwardly to the edge of the photosensitive element 10.
  • the optical lens 20 is directly disposed on the integrated base 3000.
  • the photosensitive element 10 can be fixed to the circuit board 50 by integrally encapsulating the circuit board 50 and at least a part of the photosensitive element 10 by the integrated base 3000, so that it can be fixed without being separately fixed.
  • the photosensitive element 10 and the wiring board 50 simultaneously expand the encapsulation range of the integrated base 3000 inward, thereby reducing an outer area of the photosensitive assembly 100.
  • FIG. 12 is a modified embodiment of a fixed focus camera module according to a fourth embodiment of the present invention.
  • the filter element 60 covers the photosensitive element 10, the integral base 3000 integrally encapsulating the circuit board 50, at least a portion of the photosensitive element 10, and at least a portion of the filter Element 60.
  • the integral base 3000 fixes the photosensitive element 10 and the filter element 60, so that a separate fixing manner is not required.
  • the integrated base 3000 has the second recess 3004 for mounting the optical lens 20, that is, in this embodiment of the invention, the integrated base 3000 does not have the The first groove 3003 of the filter element 60.
  • 13 to 16 are a fixed focus camera module and a multi-group lens thereof according to a fifth preferred embodiment of the present invention.
  • the fixed focus camera module includes a multi-group lens 90 that is directly mounted to the lens mount 30. That is, in this embodiment of the invention, the optical lens 20 is the multi-group lens 90.
  • the multi-group lens 90 is directly mounted to the lens holder 30 through the glue layer 40.
  • the multi-group lens 90 is exposed outside the lens holder 30.
  • the multi-group lens 90 includes a plurality of group units 9010, and two adjacent group units 9010 are assembled with each other.
  • the lens is usually mounted in the lens barrel, and then the lens is adjusted by adjusting the lens barrel, and similarly, for the multi-group composed of a plurality of group units.
  • the lens needs to be mounted on the lens barrel and the like in the conventional fixed focus camera module, so that it is not possible to directly adjust each group unit 9010 directly, and the lens barrel member is not suitable for being clamped and adjusted, and
  • Each of the group units 9010 is directly exposed to the outside of the lens holder 30. Therefore, when assembling the fixed focus camera module, each of the group units 9010 can be conveniently adjusted, or can be freely The group unit 9010 that needs to be adjusted is selected.
  • the multi-group lens 90 is configured by using the two group units 9010 as an example.
  • the multi-group The lens 90 may include more of the group units 9010, such as three or more, and the invention is not limited in this regard.
  • the multi-group lens 90 includes two of the group units 9010, which are an upper group unit 9011 and a lower group unit 9012, respectively.
  • the upper group unit 9011 and the lower group unit 9012 are assembled in cooperation with each other.
  • the upper group unit 9011 and the lower group unit 9012 are stacked, and the optical axis directions are the same.
  • the upper group unit 9011 includes at least one upper lens 90111 and an upper bearing member 90112, and the upper lens 9011 is sequentially disposed in the upper carrying member 90112 in a light path.
  • the number of the upper lenses 9011 is plural, such as 2, 3 or more.
  • the lower group unit 9012 includes at least a lower lens 90121 and a lower carrier member 90122, which are sequentially disposed in the lower carrier member 90122 in a light path.
  • the number of the lower lenses 90121 is plural, such as 2, 3 or more.
  • the upper carrier member 90112 of the upper group unit 9011 includes an upper carrier body 901121 and an extension wall 901122.
  • the upper carrier body 901121 is a hollow structure for accommodating, mounting, and arranging each of the lenses along a ray path.
  • each of the upper lenses 90111 of the upper group unit 9011 is mounted inside the upper carrier body 901121 to facilitate providing a light path.
  • the extension wall 901122 extends outward from the outside of the upper carrier body 901121 to facilitate overlapping with the upper carrier member 90112 of the lower group unit 9012.
  • the extension wall 901122 extends integrally outward from the exterior of the upper carrier body 901121.
  • the extension wall 901122 can be an annular extension wall extending outward from the upper carrier body 901121 to form an annular brim structure so as to be overlapped by the annular brim structure to the lower group.
  • the lower carrier member 90122 of unit 9012 provides stable support for the upper group unit 9011.
  • an adhesive medium 9013 such as UV glue or thermosetting glue
  • UV A thermosetting glue, an epoxy glue or the like is provided to stably fix the upper group unit 9011 and the lower group unit 9012.
  • the upper group unit 9011 and the lower group unit 9012 may be fixed by other means, such as heat welding, ultrasonic welding, laser welding, riveting, fastening, and snapping.
  • the bonding medium 9013 and the bonding layer 40 may be formed of the same material and process, or may be formed by different materials and processes.
  • the bonding medium 9013 may be selected from one or more of the group consisting of UV glue, thermosetting glue, UV thermosetting glue, epoxy resin glue, moisture curing glue, and pressure sensitive adhesive.
  • the lower group unit 9012 is mounted to the mirror mount 30 directly through the glue layer 40.
  • the upper carrier body 901121 of the upper carrier unit 90112 of the upper group unit 9011 has a lower sleeve end portion 9011211, which is located below the extension wall 901122, and the lower sleeve end portion 9011211 is sleeved in the The lower carrier member 90122 of the lower group unit 9012.
  • the extension wall 901122 of the upper carrier member 9112 of the upper group unit 9011 divides the upper carrier body 901121 into two parts, the upper portion and the lower portion, and the lower portion That is, the lower sleeve end portion 9011211.
  • the lower carrier member 90122 of the lower group unit 9012 includes a lower carrier body 901221 and an upper overlapping end portion 901222.
  • the lower carrier body 901221 is a hollow structure for accommodating and mounting each of the lower lenses 90121 and arranging them along a light path.
  • each of the lower lenses 90121 of the lower group unit 9012 is mounted inside the lower carrier body 901221 to facilitate providing a light path.
  • the upper overlapping end portion 901222 is integrally connected to the lower carrying body 901221 so as to fit the upper carrying member 90112 of the upper group unit 9011 such that the extending wall 901122 of the upper receiving member
  • the lower sleeve end portion 9011211 of the upper carrier member 90112 of the upper group unit 9011 extends into the lower carrier member
  • the upper overlapping end 901222 of 90122 such that the lower carrier member 90122 of the lower group unit 12 constrains the mounting position of the upper group unit 9011.
  • the extension wall 901122 and the upper overlapping end 901222 form an assembled structure to facilitate the assembly of the upper group unit 9011 and the lower group unit. 9012.
  • the upper overlapping end portion 901222 is a hollow structure extending inwardly to provide an overlapping support position for the upper group unit 9011 and for each of the lower lenses 90121 located in the lower carrier body 901221 Light path.
  • the lens optical axis consistency and assembly time are two important aspects in the actual production application of the camera module, and the fixed focus camera module formed by the multi-group lens 90 in the present invention can pass
  • the assembly is performed in a plurality of ways, and each of the group units 9010 can be conveniently and directly clamped, and each of the group units 9010 is adjusted to accurately, conveniently, and quickly assemble the fixed focus camera module.
  • the at least one lower group unit 9012 may be pre-assembled to the mirror base 30, and then the lower group unit 9012 is directly paired with the lower group by a focusing mechanism. Adjusting the unit, and then fixing the lower group unit to the lens holder 30 through the glue layer; then pre-assembling the upper group unit 9011 on the lower group unit 9020, and then passing the adjustment
  • the focusing mechanism directly adjusts the upper group unit, and then fixes the upper group unit to the lower group unit through the bonding medium 9013; in the foregoing manner, until all the groups are fixed Unit 9010.
  • the upper group unit 9011 and the lower group unit 9012 may be simultaneously pre-assembled in a photosensitive path of the photosensitive element 10; and then the focusing mechanism is used to The lower group unit and/or the upper group unit 9011 are directly adjusted such that the pre-assembled fixed focus camera module meets predetermined imaging requirements; the lower group unit 9012 is further passed through the glue layer 40 Fixed to the lens holder 30, the upper group unit 9011 is fixed to the lower group unit by the bonding medium 9013.
  • each of the group units 9010 can be assembled into a full-featured lens, that is, the multi-group lens 90 is assembled first, and then assembled to the lens holder 30 as a whole.
  • a plurality of group units 9010 are assembled to form an integral lens, so that the number of lenses in each group unit 9010 is small, and the assembly error of each unit is small, but each The multi-group lens 90 formed by the group unit 9010 has a large number of lenses, so that higher pixels can be provided and the cumulative error is small. And each of the group units 9010 can be adjusted and assembled by the focusing mechanism in the process of assembling the multi-group lens, so that the relative error between the group units 9010 is reduced, and the adjustment can also be adjusted. The manufacturing error of the lens itself is compensated, so that the multi-group lens 90 has better optical consistency.
  • Each of the group units 9010 is assembled to each other by an assembly structure, so that each group unit 9010 is stably assembled to form the multi-group lens 90, and the manner of cooperation can block external stray light from entering the multi-group. Inside the lens 90, it is avoided to interfere with the optical system of the multi-group lens 90. And in some embodiments, between the group units 9010 Fixing by rapid prototyping adhesive medium 9013, such as UV thermosetting glue, and the mating structure can provide sufficient ultraviolet light irradiation area for the bonding medium, so that each of the group units can be assembled and fixed quickly and stably. Thereby improving production efficiency.
  • rapid prototyping adhesive medium 9013 such as UV thermosetting glue
  • FIG. 17 is a cross-sectional view showing a fixed focus camera module according to a sixth preferred embodiment of the present invention.
  • the multi-group lens 90 is directly mounted to the integrated base 3000. More specifically, the multi-group lens 90 is directly fixed to the unitary base 3000 by the glue layer 40. That is, the glue layer 40 is disposed between the multi-group lens 90 and the integrated base 3000.
  • the multi-group lens 90 is directly mounted on the integrated base 3000. Or one of the group units 9010 such that the multi-group lens 90 is directly mounted without the need to provide a separate barrel component.
  • the integral base 3000 is formed by integral molding, and has a flat surface, which can directly provide a flatter mounting plane for the multi-group lens 90. It is beneficial to improve the imaging quality of the fixed focus camera module.
  • the multi-group lens 90 can be assembled to the integral base 3000 in a plurality of ways to form the fixed-focus camera module of the molding type.
  • the lower group unit 9012 may be pre-assembled to the integrated base 3000, and then the lower group unit 9012 is directly paired with the lower group unit by a focusing mechanism. Adjusting, and then fixing the lower group unit to the integrated base 3000 through the glue layer; then pre-assembling the upper group unit 9011 on the lower group unit 9012, and then passing the focusing The mechanism directly adjusts the upper group unit, and then fixes the upper group unit 9011 to the lower group unit 9012 through the bonding medium 9013; in a sequential manner until all the groups are fixed Group unit 9010.
  • the upper group unit 9011 and the lower group unit 9012 may be simultaneously pre-assembled in a photosensitive path of the photosensitive element 10; and then the focusing mechanism is used to The lower group unit and/or the upper group unit 9011 are directly adjusted such that the pre-assembled fixed focus camera module meets predetermined imaging requirements; the lower group unit 9012 is further passed through the glue layer 40 The upper group unit 9011 is fixed to the lower group unit 9012 by the bonding medium 9013.
  • a plurality of the upper group unit 9011 and the lower group unit 9012 may be assembled into a complete multi-group lens, and the plurality of groups are connected by the bonding medium 9013.
  • the group lens is fixed to the lower group unit 9012; then the multi-group lens 90 is directly adjusted by the focusing mechanism, so that the pre-assembled fixed focus camera module meets predetermined imaging requirements;
  • the glue layer 40 fixes the multi-group lens to the integrated base 3000.

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Abstract

本发明提供一定焦摄像模组及其制造方法,其中所述定焦摄像模组包括一感光芯片,一光学镜头以及一镜座,其中所述光学镜头被直接封装于所述镜座,并且所述光学镜头被保持在所述感光芯片的感光路径,通过这样的方式能够有效地降低所述定焦摄像模组的尺寸和制造成本,以提高所述定焦摄像模组的产品竞争力。

Description

定焦摄像模组及其制造方法 技术领域
本发明涉及光学成像领域,特别涉及一定焦摄像模组及其制造方法。
背景技术
随着科学技术的突飞猛进式的发展和人们经济水平的不断提高,智能手机、平板电脑等便携式电子设备及其相关技术得到了快速的发展,其中用于帮助使用者拍摄影像的摄像模组已经成为了便携式电子设备的标准配置之一。通常情况下,为了便于使用者通过便携式电子设备自拍或者视频通话,便携式电子设备被配置一个前置摄像模组。由于定焦摄像模组一旦被配置于便携式电子设备后就不需要预留供其调焦的空间,从而为了控制便携式电子设备的尺寸,定焦摄像模组成为了便携式电子设备的前置摄像模组的首选。
近年来,便携式电子设备越来越呈现出智能化、轻薄化的发展趋势,便携式电子设备的这种发展趋势,一方面要求通过增加智能部件来使便携式电子设备拥有更多更强大的功能,另一方面要求降低便携式电子设备的各个部件的尺寸来控制便携式电子设备的尺寸,便携式电子设备的这种发展趋势尤其对定焦摄像模组的尺寸提出了苛刻的要求。尽管定焦摄像模组在被配置于便携式电子设备后不需要预留供其调焦的空间,但是在封装定焦摄像模组的过程中仍然需要对其进行调焦以保证定焦摄像模组的成像品质。
参考图1是现有技术的定焦摄像模组,其包括一感光元件10P、一光学镜头20P以及一基座3P,其中所述基座3P包括一基座主体33P以及一镜筒34P,所述镜筒34P一体地延伸于所述基座主体33P,其中所述感光元件10P设置于所述基座主体33P,所述光学镜头20P设置于所述镜筒34P,以使所述光学镜头20P位于所述感光元件10P的感光路径。在现有技术的定焦摄像模组中,通过所述镜筒34P固定所述光学镜头20P和使所述光学镜头20P被保持在调焦后的位置。所述镜筒34P的设置限制了定焦摄像模组的尺寸,甚至成为了限制定焦摄像模组发展的技术瓶颈。另外,由于所述光学镜头20P被安装于所述镜筒34P的内部, 从而在安装所述光学镜头20P和所述镜筒34P或者在调整所述光学镜头20P相对于所述镜筒34P的位置以实现对定焦摄像模组的调焦的过程中,所述光学镜头20P的外表面和所述镜筒34P的内表面会因为相互摩擦而导致所述光学镜头20P的外表面和所述镜筒34P的内表面产生一些颗粒等污染物,这些颗粒等污染物会被保留在定焦摄像模组的内部,即便是在定焦摄像模组被封装完成后,也不能够将这些颗粒等污染物取出来,随着时间的推移和定焦摄像模组受到的外界的冲击,一部分颗粒等污染物会进入所述光学镜头20P的光路中,并可以在所述感光元件10P上成像,以至于造成污坏点的情况的出行,导致定焦摄像模组的成像品质降低。
发明内容
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述定焦摄像模组的尺寸能够被有效地减小,以使所述定焦摄像模组特别适于被应用于追求轻薄化的电子设备。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述定焦摄像模组的光学镜头被直接封装于镜座,从而所述定焦摄像模组不需要提供镜筒来固定所述光学镜头和所述镜座,即,所述光学镜头的周围不需要设置镜筒,从而能够减小所述定焦摄像模组的头部尺寸。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述光学镜头被直接封装于所述镜座,以能够有效地降低所述摄像模组的高度尺寸。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中在所述光学镜头和所述镜座之间设置或者形成一胶合层,以用于将所述光学镜头封装于所述镜座。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述胶合层用于封闭产生于所述光学镜头和所述镜座之间的缝隙,以防止外部光线或者污染物通过该缝隙进入所述定焦摄像模组的内部,以保证所述定焦摄像模组的成像质量。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述胶合层改善所述光学镜头和所述镜座的平整度,使所述光学镜头的中心轴线和所述感光元件的中心轴线重合,以保证所述定焦摄像模组的成像质量。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中在封装所述定焦摄像模组的过程中,在所述定焦摄像模组的外部调整所述光学镜头相对于感光元件的位置,从而在对所述定焦摄像模组进行调焦时产生的固体颗粒等污染物不会进入所述摄像模组的内部,以改善所述定焦摄像模组的成像质量。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中设置在或者形成在所述光学镜头和所述镜座之间的所述胶合层能够阻止在对所述定焦摄像模组进行调焦时产生的固体颗粒等污染物进入所述定焦摄像模组的内部。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中在所述定焦摄像模组被封装后,能够通过清洗所述定焦摄像模组的方式使附着在所述定焦摄像模组的外部的固体颗粒等污染物去除。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述定焦摄像模组不需要提供镜筒,通过这样的方式,能够降低所述定焦摄像模组的产品原料成本和技术难度,以提高所述定焦摄像模组的产品竞争力。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述镜座提供一内侧凹槽,以供容纳一滤光元件,从而降低所述定焦摄像模组的高度。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述镜座提供一外侧凹槽,以供被封装所述光学镜头,从而降低所述定焦摄像模组的高度。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述定焦摄像模组包括一感光组件和所述镜头,所述镜头被直接地安装于所述感光组件,而不是通过镜筒安装。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述感光组件包括一一体底座和所述线路板,所述一体底座一体成型于所述线路板,所述镜头被直接地设置于所述一体底座。
本发明一个目的在于提供一定焦摄像模组及其制造方法,其中所述一体底座一体成型于所述线路板和所述至少部分所述感光元件。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述感光组件包括一支座,所述支座被设置于所述一体底座,所述滤光元件被安装于所述支座。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述光学镜头包括至少两群组单元,其中至少一所述群组单元被直接地设置于所述镜座。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中所述光学群组单元中的至少一所述群组单元被直接地安装于所述一体底座。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中各所述群组单元裸露于所述镜座或所述一体底座外部,方便被调整操作。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中各所述群组单元都裸露于所述镜座或所述一体底座外部,使得所述群组单元都可以被调整,可调整的范围更广,而不是限于调整最上方的所述群组单元。
本发明的一个目的在于提供一定焦摄像模组及其制造方法,其中通过多个群组单元调整构成定焦摄像模组,降低镜头的镜片累积误差,适于制造多镜片的定焦摄像模组。
依本发明,能够实现前述目的和其他目的以及优势的定焦摄像模组包括:
一感光元件;
一光学镜头;以及
一镜座,其中所述光学镜头被封装于所述镜座的顶端以使所述光学镜头向外凸出于所述镜座,并且所述光学镜头被保持在所述感光元件的感光路径。
根据本发明的另外一方面,本发明提供一定焦摄像模组的制造方法,其中所述制造方法包括如下步骤:将一光学镜头封装于一镜座的顶端以使所述光学镜头向外凸出于所述镜座,并且使所述光学镜头被保持在被贴装于一线路板的一感光元件的感光路径,从而制成所述定焦摄像模组。
本发明的所述定焦摄像模组包括所述感光元件、所述光学镜头以及所述镜座,所述感光元件被设置于所述镜座的一侧,所述光学镜头被直接封装于所述镜座的另一侧,并且所述光学镜头被保持在所述感光元件的感光路径。被物体反射的光线能够自所述光学镜头进入所述定焦摄像模组的内部,以被所述感光元件接收和在进行光电转化后生成与物体相关联的影像(例如图像或者视频)。也就是说,在本发明的所述定焦摄像模组的所述光学镜头的周围不需要设置任何的构件,从而能够通过减少所述定焦摄像模组的头部尺寸的方式减少所述定焦摄像模组的尺寸,当所述定焦摄像模组被应用于电子设备时,由于所述定焦摄像模组尺寸的减少能够给所述电子设备的其他元器件留出更多的空间,从而使所述电子设备能 够符合智能化、轻薄化的发展趋势。
本发明的另一方面提供一定焦摄像模组,其包括:
一感光组件;和
一光学镜头;其中所述光学镜头被直接地封装于所述感光组件,从而形成所述定焦摄像模组。
附图说明
图1是现有技术的分解示意图。
图2是根据本发明的一较佳实施例的定焦摄像模组的立体示意图。
图3是根据本发明的上述较佳实施例的定焦摄像模组的剖视示意图。
图4是根据本发明的上述较佳实施例的定焦摄像模组的一个变形实施方式的剖视示意图。
图5A是根据本发明的上述较佳实施例的定焦摄像模组的另一个变形实施方式的剖视示意图。
图5B是根据本发明的上述较佳实施例的定焦摄像模组的又一变形实施方式剖视示意图。
图6是根据本发明的上述较佳实施例的定焦摄像模组的制造方法流程框图示意图。
图7A是根据本发明的第二个较佳实施例的定焦摄像模组剖视示意图。
图7B是根据本发明的第二个较佳实施例的定焦摄像模组的一变形实施方式剖视示意图。
图8是根据本发明的第二个较佳实施例的定焦摄像模组的第一个变形实施方式剖视示意图。
图9是根据本发明的第二个较佳实施例的定焦摄像模组第二个变形实施方式剖视示意图。
图10A是根据本发明的第三个较佳实施例的定焦摄像模组的剖视示意图。
图10B是根据本发明的第三个较佳实施例的定焦摄像模组的变形实施例方式剖视示意图。
图11是根据本发明的第四个较佳实施例的定焦摄像模组剖视示意图。
图12是根据本发明的第四个较佳实施例的定焦摄像模组的一变形实施方式 剖视示意图。
图13是根据本发明的第五个较佳实施例的定焦摄像模组剖视示意图。
图14是根据本发明的第五个较佳实施例的定焦摄像模组的多群组镜头的上群组单元示意图。
图15是根据本发明的第五个较佳实施例的定焦摄像模组的多群组镜头的下群组单元示意图。
图16是图13的局部放大图。
图17是根据本发明的第六个较佳实施例的定焦摄像模组剖视示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
参考本发明的说明书附图之图2和图3,依本发明的一较佳实施例的定焦摄像模组被阐明,其中所述定焦摄像模组包括一感光元件10、一光学镜头20以及一镜座30,其中所述光学镜头20被封装于所述镜座30的顶端302,所述镜座30中央形成通光孔301,并且所述光学镜头20被保持在所述感光元件10的感光路径20。被物体反射的光线能够自所述光学镜头20进入所述定焦摄像模组的内部,并且被所述感光元件10接收和进行光电转化,以生成与物体相关联的影像(例如图像或者视频)。
值得一提的是,在本发明的所述定焦摄像模组中,所述感光元件10的类型和所述光学镜头20的类型均不受限制。例如在一个示例性的说明中,所述感光元件10可以是电荷耦合元件(Charge Coupled Device,CCD),或者所述感光元件10可以是金属氧化物半导体元件(Complementary Metal-Oxide Semiconductor,CMOS),或者所述感光元件10可以是硅光子学芯片。也就是说,在本发明的所述定焦摄像模组中,所述感光元件10是指任何能够在接收被物体反射的光线后实现光电转化的光学元件。相应地,所述光学镜头20是指任何能够允许被物体反射的光线自所述定焦摄像模组的外部进入内部并改善该光线质量的光学元件。
在本发明的所述定焦摄像模组中,所述光学镜头20被直接封装于所述镜座30的顶端302。也就是说,本发明的所述定焦摄像模组不需要提供现有技术的镜筒结构,通过这样的方式,能够减少所述定焦摄像模组在所述光学镜头20的周围的体积,以在所述定焦摄像模组被安装于一电子设备时,所述定焦摄像模组能够尽可能少地占用所述电子设备的空间,从而使所述电子设备能够留出更多的空间以供安装其他的元器件。在一个具体的示例中,在所述光学镜头20的周围的任何一个方向都能够节省至少0.2mm的空间,也就是说,所述定焦摄像模组的头部(即所述光学镜头20及其周围)能够节省至少0.4mm的空间,这对于所述定焦摄像模组能够被应用于智能化、轻薄化的所述电子设备具有重要意义。
另外,本发明的所述定焦摄像模组不需要提供现有技术的镜筒结构,而是将所述光学镜头20直接封装于所述镜座30,通过这样的方式,能够减少原材料的使用以降低所述定焦摄像模组的成本,从而提高所述定焦摄像模组的产品竞争力。
在封装本发明的所述定焦摄像模组的过程中,通过一调焦机构在所述光学镜头20的外部固定所述光学镜头20的方式,调整所述光学镜头20相对于所述感光元件10的位置,以改善所述定焦摄像模组的成像品质。因此,在这一过程中,即便是所述调焦机构导致所述光学镜头20产生固体颗粒等污染物,该固体颗粒等污染物也不会进入到所述定焦摄像模组的内部,以防止该固体颗粒等污染物造成污坏点,从而确保所述定焦摄像模组的成像品质。在该固体颗粒等污染物产生之后,该固体颗粒等污染物至多会附着在所述定焦摄像模组的外表面,在所述定焦摄像模组被封装完成后,能够通过清洗的方式去除附着在所述定焦摄像模组的外表面的固体颗粒等污染物,以有利于保证所述定焦摄像模组在被配置于所述电子设备的使用过程中的成像品质。
值得一提的是,所述调焦机构可以是一垂直方向的调焦装置,也可以是多个方向的调焦装置,比如水平、垂直和倾斜方向的主动调焦装置。
进一步地,如图3,所述定焦摄像模组包括一胶合层40,其中所述胶合层40位于所述光学镜头20和所述镜座30之间,以用于将所述光学镜头20直接封装于所述镜座30,相应地所述胶合层40呈环状,将所述光学镜头20的环状外缘与所述镜座30相连接,并且优选地其由不透光材料形成。值得一提的是,所述胶合层40不仅能够连接所述光学镜头20和所述镜座30,而且所述胶合层40 还能够用于密封产生于所述光学镜头20和所述镜座30的连接处,从而阻止该固体颗粒等污染物或者外界污染物或者外部光线通过所述光学镜头20和所述镜座30的连接处自所述定焦摄像模组的外部进入所述定焦摄像模组的内部,以有利于保证所述定焦摄像模组的成像品质。
所述胶合层40形成在所述光学镜头20和所述镜座30的连接处。具体地说,选择性地在所述光学镜头20和所述镜座30的至少其中一个的相应位置进行点胶,在点胶操作完成后,将所述光学镜头20的下端面安装于所述镜座30,以使胶水处于所述光学镜头20和所述镜座30之间,并对所述定焦摄像模组进行调焦,调焦时可以通过在所述光学镜头20的外部固定所述光学镜20的方式进行,在调焦完成后,使胶水固化以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40。优选地,可以仅在所述镜座30的相应位置进行点胶,以防止胶水污染所述光学镜头20。更优选地,可以通过紫外光线(Ultraviolet Rays,UV光线)照射胶水的方式使胶水固化,即所述胶合层40可以使用紫外光固化胶。当然,本领域技术人员可以理解的是,也可以采用其他合适的胶水以及通过其他方式如热固化方式将胶水固化。
值得一提的是,在所述镜座30的相应位置完成点胶操作后,可以先使胶水半固化,以防止在将所述光学镜头20封装于所述镜座30的过程中胶水对所述光学镜头20造成污染。换句话说,胶水在通过点胶的方式被涂布于所述镜座30后,可以先使胶水呈半固化状态,以使半固化的胶水具有粘性和可塑性,在所述光学镜头20的下端面安装于所述镜座30并且完成对所述定焦摄像模组的调焦后,再使胶水完成固化,以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40,从而一方面所述胶合层40使所述光学镜头20被保持在调焦后的位置,另一方面所述胶合层40封闭所述光学镜头20和所述镜座30的连接处。当然,也可以不经过所述半固化状态,而在调焦操作以后直接将胶水固化以形成所述胶合层40。
在封装本发明的所述定焦摄像模组的过程中,所述胶合层40能够改善所述光学镜头20和所述镜座30的对准程度,以使所述光学镜头20的中心轴线能够与所述感光元件10的中心轴线重合,以改善所述定焦摄像模组的成像品质。也就是说,所述胶合层40能够弥补所述光学镜头20的产品误差和所述镜座30的产品误差以及所述光学镜头20和所述镜座30的贴装误差,从而改善所述定焦摄 像模组的成像品质。
参考图2和图3,所述定焦摄像模组进一步包括一线路板50,其中所述感光元件10被贴装于所述线路板50,所述线路板50与所述镜座30相连接,以使所述光学镜头20和所述感光元件10的位置相互对应。优选地,所述线路板50可以是PCB线路板(Printed Circuit Board,印刷线路板),以在所述感光元件10被贴装于所述线路板50后,所述线路板50能够保持所述感光元件10的平整度。尽管如此,本领域的技术人员可以理解的是,所述线路板50也可以任何能够连接所述感光元件10和所述电子设备的其他元件的结构,例如所述线路板50可以是FPC线路板(Flexible Printed Circuit,柔性线路板),具体地说,可以将被实施为FPC线路板的所述线路板50贴附在一个加强件(例如金属材质的加强件)上,然后将所述感光元件10贴附在所述加强件,并且将所述感光元件10连接于所述线路板50,以藉由所述加强件保证所述感光元件10的平整度。所述镜座30可以贴装于所述线路板50,或者可一体地封装于所述线路板50。也就是说,所述镜座30可以被实施为后续提出的所述一体底座3000。
在本发明的所述定焦摄像模组中,可以首先将所述感光元件10固定于所述线路板50,然后通过打引线如打金线的工艺使所述感光元件10与所述线路板50连接在一起,以将所述感光元件10贴装于所述线路板50。可以理解的是,通过打金线的方式连接所述感光元件10和所述线路板50仅为一个举例性的描述,在其他的示例中,所述感光元件10可以提供一个或者多个芯片焊盘,所述线路板50可以提供一个或者多个线路板焊盘,通过将所述感光元件10的芯片焊盘和所述线路板50的线路板焊盘焊接在一起的方式,也能够实现所述感光元件10和所述线路板50的贴装。所述感光元件10可以COB(Chip On Board)工艺贴装于所述线路板50,也可以采用FC(Flip Chip)倒装方式组装于所述线路板50。
另外,所述定焦摄像模组进一步包括一滤光元件60,其中所述滤光元件60被设置于所述感光元件10和所述光学镜头20之间,以用于改善所述定焦摄像模组的成像品质。被物体反射的光线自所述光学镜头20进入所述定焦摄像模组的内部,并在被所述滤光元件60过滤后进一步被所述感光元件10接收和进行光电转化,以生成与物体相关联的影像。也就是说,所述滤光元件60能够过滤自所述光学镜头20进入所述定焦摄像模组的内部的被物体反射的光线中的杂光,以改善所述定焦摄像模组的成像品质。
值得一提的是,所述滤光元件60的类型不受限制,例如在本发明的一个示例中,所述滤光元件60可以是红外截止滤光片,以过滤进入所述定焦摄像模组的内部的被物体反射的光线中的红外光线。在本发明的另一个示例中,所述滤光元件60也可以是可见光截止滤光片。另外,所述滤光元件60也可以被调整,例如所述滤光元件60可以被可移动地设置于所述镜座30,以通过改变所述滤光元件60的位置来使所述定焦摄像模组被应用于不同的使用环境。
参考图3,所述滤光元件60被封装于所述镜座30的内部,以使所述滤光元件60被保持在所述光学镜头20和所述感光元件10之间。例如可以先将所述滤光元件60封装于所述镜座30的内部,然后再将所述线路板50封装于所述镜座30。在另外的变形实施方式中,也有可能将所述滤光元件60组装于所述光学镜头20。
参考图3,所述镜座30的内部设有一内侧凹槽31,其中所述滤光元件60被封装于所述镜座30的所述内侧凹槽31,通过这样的方式,能够有效地降低所述定焦摄像模组的高度,以使所述定焦摄像模组特别适于被应用于追求轻薄化的所述电子设备。另外,所述镜座30的外部设有一外侧凹槽32,其中在一个示例中,所述光学镜头20被通过所述胶合层40直接封装于所述镜座30的所述外侧凹槽32,在另一个示例中,可以仅所述胶合层40位于所述镜座30的所述外侧凹槽32,通过这样的方式,能够进一步有效地降低所述定焦摄像模组的高度,以使所述定焦摄像模组特别适于被应用于追求轻薄化的所述电子设备。即所述镜座30的顶端302的外侧和内侧分别具有所述外侧凹槽32和所述内侧凹槽31,用于分别承载所述胶合层40和所述滤光元件60。当然可以理解的是,在另外的变形实施方式中,所述镜座30的顶端302也可以是平整的表面,而没有上述内凹的凹槽,所述胶合层40分别设置于所述镜座30的顶端302的相反的外表面和内表面。
在封装本发明的这个实施例的所述定焦摄像模组的过程中,步骤一,可以先将所述线路板50和所述感光元件10固定在一起,并且通过打线工艺导通所述线路板50和所述感光元件10,以将所述感光元件10与所述线路板50相导通。
步骤二,将所述滤光元件60封装于所述镜座30,例如在本发明的附图3示出的这个示例中,所述滤光元件60可以被封装于所述镜座30的所述内侧凹槽31内。本领域的技术人员可以理解的是,在封装本发明的所述定焦摄像模组的过程中,所述步骤一和所述步骤二可以不分先后顺序,或者所述步骤一和所述步 骤二可以同时进行。
步骤三,将所述线路板50与所述镜座30相组装,以使所述滤光元件60对应于被贴装于所述线路板50的所述感光元件10。
步骤四,在所述镜座30的相应位置进行点胶。值得一提的是,胶水的量可以根据需要提供,例如胶水的量需要保证能够接触到所述光学镜头20的下端面。值得一提的是,胶水的量取决于胶水性能和涂布面积。
步骤五,将所述光学镜头20安装于所述镜座30,以使胶水位于所述光学镜头20和所述镜座30之间,并保证所述光学镜头20处于所述感光元件10的感光路径。
步骤六,调整所述光学镜头20相对于所述感光元件10的位置,以对所述定焦摄像模组进行调焦。具体地说,通过所述线路板50给所述感光元件10通电,以使所述感光元件10能够输出图像,根据图像的清晰度对所述定焦摄像模组进行调焦。对所述定焦摄像模组进行调焦的方式可以是所述调焦机构通过夹持所述光学镜头20的外表面的方式调整所述光学镜头20相对于所述感光元件10的位置,由于本发明的所述定焦摄像模组是在所述定焦摄像模组的外部实现对所述定焦摄像模组的调焦,从而即便是所述调焦机构导致所述光学镜头20的外表面产生了该固体颗粒污染物,该固体颗粒污染物也不会进入所述定焦摄像模组的内部,以改善所述定焦摄像模组的成像品质。值得一提的是,在对本发明的所述定焦摄像模组进行调焦操作的过程中,尽管通过调整所述光学镜头20相对于所述感光元件10的位置能够调整所述变焦摄像模组的焦距,在其他示例中,也可以通过移动所述镜座30或线路板50或感光组件整体的方式调整所述感光元件10相对于所述光学镜头20的位置。
步骤七,使胶水固化以形成位于所述光学镜头20和所述镜座30之间的所述胶合层40。可以理解的是,一方面所述胶合层40能够用于连接所述光学镜头20和所述镜座30,以使所述光学镜头20被保持在所述感光元件10的感光路径,另一方面所述胶合层40能够阻止外界污染物通过所述光学镜头20和所述镜座30的连接处自所述变焦摄像模组的外部进入内部,再一方面所述胶合层40能够阻止外部光线自通过所述光学镜头20和所述镜座30的连接处自所述变焦摄像模组的外部进入内部。另外所述胶合层40还能够弥补所述光学镜头20的产品误差和所述镜座30的产品误差以及所述光学镜头20和所述镜座30的贴装误差,以 防止所述光学镜头20和所述感光元件10出现相对倾斜的情况,从而有利于保证所述定焦摄像模组的成像品质。
参考图4是所述定焦摄像模组的一个变形实施方式,其中本发明的这个实施例的所述定焦摄像模组与上述较佳实施例的所述定焦摄像模组的结构的区别在于所述滤光元件60被封装的位置。具体地说,在本发明的这个实施例的所述定焦摄像模组中,所述滤光元件60被设置于所述线路板50,并且所述滤光元件60覆盖于所述感光元件10。优选地,所述滤光元件60与所述感光元件10被直接贴附在一起。当所述线路板50被封装于所述镜座30后,所述滤光元件60被保持在所述光学镜头20和所述感光元件10之间。在另外的变形实施方式中,如图12,所述镜座30可以一体地包覆于所述滤光元件60,所述感光元件10和所述线路板50,从而形成一体的整体结构。
参考图5A是所述定焦摄像模组的另一个变形实施方式,其中本发明的这个实施例的所述定焦摄像模组与上述较佳实施例的所述定焦摄像模组的结构的区别在于所述滤光元件60被封装的位置。具体地说,在本发明的这个实施例的所述定焦摄像模组中,所述滤光元件60被封装于所述镜座30的外侧凹槽31,以使所述滤光元件60更邻近所述光学镜头20,并且被封装于所述镜座30的顶端302的所述滤光元件60能够被保持在所述光学镜头20和所述感光元件10之间。即所述外部凹槽可以用于安装所述滤光元件60以及为所述胶合层40提供安装空间。
值得一提的是,在一些实施例中,所述光学镜头20的部分可以被安装于所述滤光元件60,部分可以被安装于所述镜座30。也就是说,在安装完所述滤光元件60后,可以在所述光学镜头20的底端或所述滤光元件60以及所述镜座30的顶端设置胶水,而后在所述光学镜头20、所述镜座30以及所述滤光元件60之间形成所述胶合层40。
图5B是所述定焦摄像模组的又一个变形实施方式。在这个实施方式中,所述镜座30顶面是平面结构,也就是说,所述镜座30不具有所述第一凹槽3003和所述第二凹槽3004。
所述胶合层40被设置于所述一体底座3000的顶端和所述光学镜头20之间。所述滤光元件60被设置于所述一体底座3000的顶端。更具体地,所述滤光元件60位于所述光学镜头20的内侧。
参考图6,根据本发明的一个方面,作为一个示例,本发明还提供一定焦摄像模组的制造方法600,其中所述制造方法600包括如下步骤:
步骤610,(a)贴装一感光元件10于一线路板50;
步骤620,(b)封装所述线路板50于一镜座30;以及
步骤630,(c)将一光学镜头20封装于所述镜座30的顶端302以使所述光学镜头20向外凸出于所述镜座30地设置,并使所述光学镜头20被保持在所述感光元件10的感光路径,从而制成所述定焦摄像模组。可以理解的是,上述步骤之间可以没有先后顺序。如可以先在所述线路板50上设置所述镜座30,然后再在所述线路板50上贴装所述感光元件10。
进一步地,在所述步骤(a)中进一步包括步骤:
(a.1)将所述感光元件10固定于所述线路板50;和
(a.2)通过打线的方式导通所述感光元件10和所述线路板50,以将所述感光元件10贴装于所述线路板50。
在一个实施例中,在所述步骤(b)之前进一步包括步骤:将一滤光元件60封装于所述镜座30,并且在所述步骤(b)中,使所述滤光元件60被贴装于所述线路板50的和所述感光元件10相对应位置。优选地,所述镜座30具有一内侧凹槽31,所述滤光元件60被封装于所述镜座30的所述内侧凹槽31,以降低所述定焦摄像模组的高度。
在另一个实施例中,在所述步骤(b)之前进一步包括步骤:将所述滤光元件60封装于所述线路板50,其中所述滤光元件60覆盖于所述感光元件10的感光面。
进一步地,在上述方法中,在所述光学镜头20和所述镜座30之间设置一胶合层40,以在对所述定焦摄像模组执行调焦操作后,使所述胶合层40固化。
进一步地,在上述方法中,在所述光学镜头20和所述镜座30中的至少一个进行点胶,以在对所述定焦摄像模组执行调焦操作后,使胶水固化以在所述光学镜头20和所述镜座30之间形成所述胶合层40。优选地,所述镜座30具有一外侧凹槽32,所述胶合层40将所述光学镜头20直接封装于所述镜座30的所述外侧凹槽32,以降低所述定焦摄像模组的高度。
根据本发明的另一个方面,本发明还提供一定焦摄像模组的制造方法,其中所述制造方法包括如下步骤:
在一镜座30和一光学镜头20之间点胶,以使得胶水封闭所述镜座30和所述光学镜头20的连接处;和
在所述镜座30的外部固定所述光学镜头20,以调整所述光学镜头20相对于所述镜座30的位置,其中所述调焦机构导致所述光学镜头20的外表面产生的固体颗粒污染物被胶水阻止,以防止固体颗粒污染物通过所述镜座30和所述光学镜头20的连接处自所述定焦摄像模组的外部进入内部,以制成所述定焦摄像模组。
进一步地,在上述方法中,在对所述定焦摄像模组执行调焦操作后,使胶水固化以在所述光学镜头20和所述镜座30之间形成一胶合层40。
根据本发明的另一个方面,本发明还提供一定焦摄像模组的制造方法,其中所述制造方法包括如下步骤:
在一镜座30的外部固定一光学镜头20,并调整所述光学镜头20相对于所述镜座30的位置;和
在所述镜座30和所述光学镜头20之间形成一胶合层40,以使得所述胶合层40封闭所述镜座30和所述光学镜头20的连接处,其中所述光学镜头20的外表面产生的固体颗粒污染物被所述胶合层40阻止,以防止固体颗粒污染物通过所述镜座30和所述光学镜头20的连接处自所述定焦摄像模组的外部进入内部,从而制成所述定焦摄像模组。
即可以通过合适的调焦机构和固定遮光结构,先将所述光学镜头20和所述镜座30之间的相对位置也即是所述光学镜头20和所述感光元件10之间的相对位置确定以后,再点胶并使胶水固化使所述光学镜头20固定于所述镜座30的顶端。
如图7A所示,是根据本发明的第二个较佳实施例的定焦摄像模组剖视示意图。
在本发明的这个实施例中,所述定焦摄像模组包括一感光组件100和一所述光学镜头20,其中所述光学镜头20被封装于所述感光组件100的顶端,所述光学镜头20位于所述感光组件100的感光路径。
所述感光组件100包括一感光元件10、一线路板50和一一体底座3000,所述感光元件10电连接于所述线路板50,所述一体底座3000一体成型于所述线路板50。
所述一体底座3000包括一模塑主体3001并且具有一光窗3002,所述模塑主体3001以模塑的方式一体成型于所述线路板50,并且在中部形成所述光窗3002,为所述感光元件10提供光线通路。
在本发明的这个实施例中,所述光学镜头20被直接地封装于所述一体底座3000的顶部,以使得所述光学镜头20位于所述感光元件10的感光路径,并且构成所述定焦摄像模组。也就是说,本发明的所述定焦摄像模组不需要提供现有技术的镜筒结构,通过这样的方式,能够减少所述定焦摄像模组在所述光学镜头20的周围的体积,以在所述定焦摄像模组被安装于一电子设备时,所述定焦摄像模组能够尽可能少地占用所述电子设备的空间,从而使所述电子设备能够留出更多的空间以供安装其他的元器件。
另外,本发明的所述定焦摄像模组不需要提供现有技术的镜筒结构,而是将所述光学镜头20直接封装于所述一体底座3000,通过这样的方式,能够减少原材料的使用以降低所述定焦摄像模组的成本,从而提高所述定焦摄像模组的产品竞争力。
更进一步,在本发明的这个实施例中,所述一体底座3000通过模塑一体成型的方式设置于所述线路板50,所述一体底座3000具有较好的表面平整性,为所述光学镜头20提供更加平整的安装面。
所述感光组件100包括一电路元件51,所述电路元件51电连接于所述线路板50,以供所述感光元件10的感光工作过程。所述电路元件51可以是,举例地但不限于,电阻、电容、二极管、三极管,电位器,继电器、驱动器等。
值得一提的是,所述模塑主体3001可以将所述电路元件51元件包覆于内部,因此使得所述电路元件51不会直接暴露于空间内,更具体地说,不会暴露于与所述感光元件10相连通的封闭环境中。不同传统的摄像模组中电路器件的存在方式,如阻容器件凸出于线路板50的方式,从而防止灰尘、杂物停留于所述电路元件51而污染所述感光元件10。在本发明的这个实施例中,以所述电路元件51凸出于所述线路板50为例进行说明,而在本发明的其他实施例中,所述电路元件51被埋设于所述线路板50内部,而不凸出所述线路板50,本领域的技术人员应当理解的是,所述电路元件51的结构、类型和被设置的位置并不是本发明的限制。可以理解的是,在传统的摄像模组中,电路器件凸出于所述线路板50,而底座只能被安装于所述电路元件51的外侧,因此所述电路器件和所述底 座都需要一定的空间位置,因此对线路板50在横向的尺寸要求较高。而对于本发明的基于一体封装工艺的摄像模组,所述模塑主体3001一体封装于所述线路板50,且包覆所述电路元件51,因此所述模塑主体3001和所述电路元件51在空间相互重叠,从而增加了所述模塑主体3001可以向内设置的空间,减小了对所述线路板50外部延伸需求,从而减小所述摄像模组的横向尺寸,使其可以满足小型化需求的设备。
值得一提的是,所述模塑主体3001包覆所述电路元件51具有保护所述电路元件51,使其免于被污染以及被误碰触的优势,同时对相应的摄像模组带来优势,但是本领域的技术人员应当理解的是,所述模塑主体3001不限于包覆所述电路元件51。也就是说,在本发明的其他实施例中,所述模塑主体3001可以直接模塑于没有凸出的所述电路元件51的所述线路板50,也可以是模塑于所述电路元件51的外侧、周围等不同位置。
在本发明这个实施例中,所述模塑主体3001凸起地围绕于所述感光元件10外侧,特别地,所述模塑主体3001一体地闭合连接,使其具有良好的密封性,从而当所述光学镜头20被安装于所述感光元件10的感光路径时,所述感光元件10被密封于内部,从而形成对应的封闭内空间。
所述感光元件10通过至少一连接线11电连接于所述线路板50。所述连接线11可以被实施为,举例地但不限于,金线、铜线、铝线、银线、焊盘、导线、引脚。
具体地,在制造所述感光组件100时,可以选择一传统的线路板50作为所述线路板50,在所述线路板50表面进行模塑。比如,在一实施例中,可以用模塑成型模具,通过嵌入成型(Insert Molding)工艺将进行SMT工艺(Surface Mount Technology表面贴装工艺)后的线路板50进行一体封装,比如模塑封装,形成所述模塑主体3001,或通过半导体封装中常用的模压工艺形成所述模塑主体3001。进一步,将各所述感光元件10贴装于所述线路板50,继而将各所述感光元件10与所述线路板50进行电连接,比如打金线电连接。所述线路板50可以选择为,举例地但不限于,软硬结合板、陶瓷基板(不带软板)、PCB硬板(不带软板)等。所述模塑主体3001形成的方式可以选择为,举例地但不限于,注塑工艺、模压工艺等。所述模塑主体3001可以选择的材料为,举例地但不限于,注塑工艺可以选择尼龙、LCP(Liquid Crystal Polymer,液晶高分子聚合物)、 PP(Polypropylene,聚丙烯)等,模压工艺可以采用环氧树脂。本领域技术人员应当理解的是,前述可以选择的制造方式以及可以选择的材料,仅作为举例说明本发明的可以实施的方式,并不是本发明的限制。
在本发明的其他实施例中,制造所述感光组件100的过程还可以是,先对所述线路板50进行SMT工艺,进而将所述感光元件10贴装于所述线路板50,并且将所述感光元件10与所述线路板50进行电连接,比如打金线电连接,继而将对所述线路板50进行一体封装,比如模塑封装,通过嵌入成型的方式形成所述模塑主体3001,或通过半导体封装中常用的模压工艺形成所述模塑主体3001。本领域的技术人员应当理解的是,所述感光组件100的制造顺序并不是本发明的限制。
在封装本发明的所述定焦摄像模组的过程中,通过一调焦机构在所述光学镜头20的外部固定所述光学镜头20的方式,调整所述光学镜头20相对于所述感光元件10的位置,以改善所述定焦摄像模组的成像品质,比如对所述光学镜头和/或所述感光组件进行主动校准,从而使得所述光学镜头20和所述感光组件100的光轴一致。因此,在这一过程中,即便是所述调焦机构导致所述光学镜头20产生固体颗粒等污染物,该固体颗粒等污染物也不会进入到所述定焦摄像模组的内部,以防止该固体颗粒等污染物造成污坏点,从而确保所述定焦摄像模组的成像品质。在该固体颗粒等污染物产生之后,该固体颗粒等污染物至多会附着在所述定焦摄像模组的外表面,在所述定焦摄像模组被封装完成后,能够通过清洗的方式去除附着在所述定焦摄像模组的外表面的固体颗粒等污染物,以有利于保证所述定焦摄像模组在被配置于所述电子设备的使用过程中的成像品质。
进一步地,如图7A,所述定焦摄像模组包括一胶合层40,其中所述胶合层40位于所述光学镜头20和所述一体底座3000之间,以用于将所述光学镜头20直接封装于所述一体底座3000,相应地所述胶合层40呈环状,将所述光学镜头20的环状外缘与所述一体底座3000相连接,并且优选地其由不透光材料形成。值得一提的是,所述胶合层40不仅能够连接所述光学镜头20和所述一体底座3000,而且所述胶合层40还能够用于密封产生于所述光学镜头20和所述一体底座3000的连接处,从而阻止该固体颗粒等污染物或者外界污染物或者外部光线通过所述光学镜头20和所述一体底座3000的连接处自所述定焦摄像模组的外部进入所述定焦摄像模组的内部,以有利于保证所述定焦摄像模组的成像品质。
所述胶合层40形成在所述光学镜头20和所述一体底座3000的连接处。具体地说,选择性地在所述光学镜头20和所述一体底座3000的至少其中一个的相应位置进行点胶,在点胶操作完成后,将所述光学镜头20的下端面安装于所述一体底座3000,以使胶水处于所述光学镜头20和所述一体底座3000之间,并对所述定焦摄像模组进行调焦,调焦时可以通过在所述光学镜头20的外部固定所述光学镜头20的方式进行,在调焦完成后,使胶水固化以形成位于所述光学镜头20和所述一体底座3000之间的所述胶合层40。优选地,可以仅在所述一体底座3000的相应位置进行点胶,以防止胶水污染所述光学镜头20。更优选地,可以通过紫外光线(Ultraviolet Rays,UV光线)照射胶水的方式使胶水固化,即所述胶合层40可以使用紫外光固化胶。当然,本领域技术人员可以理解的是,也可以采用其他合适的胶水以及通过其他方式如热固化方式将胶水固化。
值得一提的是,在所述一体底座3000的相应位置完成点胶操作后,可以先使胶水半固化,以防止在将所述光学镜头20封装于所述一体底座3000的过程中胶水对所述光学镜头20造成污染。换句话说,胶水在通过点胶的方式被涂布于所述一体底座3000后,可以先使胶水呈半固化状态,以使半固化的胶水具有粘性和可塑性,在所述光学镜头20的下端面安装于所述一体底座3000并且完成对所述定焦摄像模组的调焦后,再使胶水完成固化,以形成位于所述光学镜头20和所述一体底座3000之间的所述胶合层40,从而一方面所述胶合层40使所述光学镜头20被保持在调焦后的位置,另一方面所述胶合层40封闭所述光学镜头20和所述一体底座3000的连接处。当然,也可以不经过所述半固化状态,而在调焦操作以后直接将胶水固化以形成所述胶合层40。
在封装本发明的所述定焦摄像模组的过程中,所述胶合层40能够改善所述光学镜头20和所述一体底座3000的平整度,以使所述光学镜头20的中心轴线能够与所述感光元件10的中心轴线重合,以改善所述定焦摄像模组的成像品质。也就是说,所述胶合层40能够弥补所述光学镜头20的产品误差和所述一体底座3000的产品误差以及所述光学镜头20和所述一体底座3000的贴装误差,从而改善所述定焦摄像模组的成像品质。
在本发明的这个实施例中,所述滤光元件60被设置于所述感光元件10和所述光学镜头20之间,以用于改善所述定焦摄像模组的成像品质。被物体反射的光线自所述光学镜头20进入所述定焦摄像模组的内部,并在被所述滤光元件60 过滤后进一步被所述感光元件10接收和进行光电转化,以生成与物体相关联的影像。也就是说,所述滤光元件60能够过滤自所述光学镜头20进入所述定焦摄像模组的内部的被物体反射的光线中的杂光,以改善所述定焦摄像模组的成像品质。具体地,所述滤光元件60被设置于所述一体底座3000。
参照图7A,所述一体底座3000具有一第一凹槽3003和一第二凹槽3004,所述第一凹槽3003和所述第二凹槽3004连通于所述光窗3002,以便于安装所述滤光元件60和所述光学镜头20。通过这样的方式,能够有效地降低所述定焦摄像模组的高度,以使所述定焦摄像模组特别适于被应用于追求轻薄化的所述电子设备。
更具体地,所述滤光元件60被安装于所述第一凹槽3003,所述光学镜头20被安装于所述第二凹槽3004。值得一提的是,在本发明的这个实施例中,所述一体底座3000通过模塑一体成型的方式形成,具有良好的表面平整性,因此所述第一凹槽3003和所述第二凹槽3004的内侧面都比较平整,为所述滤光元件60和所述光学镜头20提供平整的安装面。
也就是说,在制造所述定焦摄像模组时,可以在所述一体底座3000和所述第二凹槽3004或所述光学镜头20的底部施加胶水等介质,从而在所述光学镜头20和所述第二凹槽3004的内表面之间形成所述胶合层40,从而将所述光学镜头20稳定地安装于所述一体底座3000,形成定焦摄像模组。当然,在固定所述光学镜头20之前,需要通过所述调焦机构对所述摄像模组进行调整,调整所述光学镜头20和所述感光组件100的相对位置,以便于改善所述定焦摄像模组的成像品质。
在本发明的这个实施方式的所述定焦摄像模组的过程中,步骤一,可以先将所述线路板50和所述感光元件10固定在一起,并且通过打线工艺导通所述线路板50和所述感光元件10,以将所述感光元件10与所述线路板50相导通。
步骤二,将所述滤光元件60封装于所述一体底座3000,例如在本发明的附图7示出的这个示例中,所述滤光元件60可以被封装于所述一体底座3000的所述第一凹槽3003内。步骤三,将所述线路板50与所述一体底座3000相组装,以使所述滤光元件60对应于被贴装于所述线路板50的所述感光元件10。
步骤四,在所述一体底座3000的相应位置进行点胶。值得一提的是,胶水的量可以根据需要提供,例如胶水的量需要保证能够接触到所述光学镜头20的 下端面。值得一提的是,胶水的量取决于胶水性能和涂布面积。
步骤五,将所述光学镜头20安装于所述一体底座3000,以使胶水位于所述光学镜头20和所述一体底座3000之间,并保证所述光学镜头20处于所述感光元件10的感光路径。
步骤六,调整所述光学镜头20相对于所述感光元件10的位置,以对所述定焦摄像模组进行调焦。具体地说,通过所述线路板50给所述感光元件10通电,以使所述感光元件10能够输出图像,根据图像的清晰度对所述定焦摄像模组进行调焦。对所述定焦摄像模组进行调焦的方式可以是所述调焦机构通过夹持所述光学镜头20的外表面的方式调整所述光学镜头20相对于所述感光元件10的位置,由于本发明的所述定焦摄像模组是在所述定焦摄像模组的外部实现对所述定焦摄像模组的调焦,从而即便是所述调焦机构导致所述光学镜头20的外表面产生了该固体颗粒污染物,该固体颗粒污染物也不会进入所述定焦摄像模组的内部,以改善所述定焦摄像模组的成像品质。值得一提的是,在对本发明的所述定焦摄像模组进行调焦操作的过程中,尽管通过调整所述光学镜头20相对于所述感光元件10的位置能够调整所述变焦摄像模组的焦距,在其他示例中,也可以通过移动所述一体底座3000即移动所述感光组件100整体的方式调整所述感光元件10相对于所述光学镜头20的位置。
步骤七,使胶水固化以形成位于所述光学镜头20和所述一体底座3000之间的所述胶合层40。可以理解的是,一方面所述胶合层40能够用于连接所述光学镜头20和所述一体底座3000,以使所述光学镜头20被保持在所述感光元件10的感光路径,另一方面所述胶合层40能够阻止外界污染物通过所述光学镜头20和所述一体底座3000的连接处自所述变焦摄像模组的外部进入内部,再一方面所述胶合层40能够阻止外部光线自通过所述光学镜头20和所述一体底座3000的连接处自所述变焦摄像模组的外部进入内部。另外所述胶合层40还能够弥补所述光学镜头20的产品误差和所述一体底座3000的产品误差以及所述光学镜头20和所述一体底座3000的贴装误差,以防止所述光学镜头20和所述感光元件10出现相对倾斜的情况,从而有利于保证所述定焦摄像模组的成像品质。
如图7B所示,是根据本发明的第二个较佳实施例的定焦摄像模组的一变形实施方式。在这个实施方式中,所述一体底座3000顶面是平面结构,也就是说,所述一体底座3000不具有所述第一凹槽3003和所述第二凹槽3004。
所述胶合层40被设置于所述一体底座3000的顶端和所述光学镜头20之间。所述滤光元件60被设置于所述一体底座3000的顶端。更具体地,所述滤光元件60位于所述光学镜头20的内侧。
图8是根据本发明的第二个较佳实施例的第一个变形实施方式。在本发明的这个实施方式中,所述滤光元件60覆盖于所述感光元件10。所述滤光元件10覆盖的方式举例地但不限于,通过粘接固定方式覆盖于所述感光元件10,比如通过复合的方式设置于所述感光元件10,比如通过贴附的方式覆盖于所述感光元件10。当所述光学镜头20被封装于感光组件100的所述一体底座3000时,所述滤光元件60被保持在所述光学镜头20和所述感光元件10之间。
进一步,所述一体底座3000具有所述第二凹槽3004,用于安装所述光学镜头20,也就是说,在本发明的这个实施例中,所述一体底座3000不具有用于安装所述滤光元件60的所述第一凹槽3003。
图9是根据本发明的第二个较佳实施例的第二个变形实施方式。在本发明的这个实施方式中,所述一体底座3000具有一所述第二凹槽3004,所述滤光元件和所述光学镜头被安装于所述第二凹槽3004。所述滤光元件60被封装于所述一体底座3000的所述第二凹槽3004,以使所述滤光元件60更邻近所述光学镜头20,并且被封装于所述的一体底座3000的所述滤光元件60能够被保持在所述光学镜头20和所述感光元件10之间。即所述第二凹槽3004可以用于安装所述滤光元件60以及为所述胶合层40提供安装空间。
更具体地,在本发明的这个实施方式中,所述胶合层40被设置于所述光学镜头和所述滤光元件之间。
本发明的这个实施方式的所述定焦摄像模组形成过程可以是,先在所述线路板50上一体成型所述一体底座3000,并且在所述线路板50上电连接所述感光元件10,从而形成所述感光组件100;而后在所述一体底座3000的所述第二凹槽3004内安装所述滤光元件60,而后在所述滤光元件60的边缘位置设置胶水或者在所述光学镜头20底端设置胶水;而后将所述光学镜头20安装于所述滤光元件60,以使得胶水位于所述滤光元件60和所述光学镜头20之间,并且使得所述光学镜头20位于所述感光元件60的感光路径;进一步,调整所述光学镜头20相对于所述感光元件10的位置,以对所述定焦摄像模组进行调焦;进一步,使胶水固化以形成位于所述光学镜头20和所述滤光元件60之间的所述胶合层 40。
图10A所示,是根据本发明的第三个较佳实施例的定焦摄像模组示意图。在本发明的这个实施例中,所述一体底座3000具有一所述第一凹槽3003和一所述第二凹槽3004,所述定焦摄像模组包括一支座61,所述支座61用于安装所述滤光元件60,所述支座61被安装于所述第一凹槽3003。
所述胶合层40被设置于所述一体底座3000和所述光学镜头20之间。更具体地,所述胶合层40被设置于所述第二凹槽3004。也就是说,所述光学镜头20通过所述胶合层40被安装于所述第二凹槽3004。
也就是说,在组装所述定焦摄像模组时,可以将所述滤光元件60安装于所述支座61,而后将所述支座61安装于所述第一凹槽3003,而后在所述支座61的表面的预定位置或所述光学镜头20端部设置胶水,进一步将所述光学镜头20预安装于所述一体底座3000,以使得胶水位于所述一体底座3000和所述光学镜头20之间,并且使得所述光学镜头20位于所述感光元件10的感光路径;进一步,调整所述光学镜头20相对于所述感光元件10的位置,以对所述定焦摄像模组进行调焦;进一步,使胶水固化以形成位于所述光学镜头20和所述一体底座3000之间的所述胶合层40。
如图10B所示,是根据本发明的第三个较佳实施例的定焦摄像模组的变形实施方式示意图。在本发明的这个实施例中,所述一体底座3000具有一所述第二凹槽3004,所述定焦摄像模组包括一支座61,所述支座61用于安装所述滤光元件60,所述支座61被安装于所述第二凹槽3004。
更具体地,在本发明的这个实施例中,所述胶合层40被设置于所述支座61和所述光学镜头20之间。
也就是说,在组装所述定焦摄像模组时,可以将所述滤光元件60安装于所述支座61,而后将所述支座61安装于所述第二凹槽3004,而后在所述支座61的表面的预定位置或所述光学镜头20端部设置胶水,进一步将所述光学镜头20预安装于所述支座61,以使得胶水位于所述支座61和所述光学镜头20之间,并且使得所述光学镜头20位于所述感光元件10的感光路径;进一步,调整所述光学镜头20相对于所述感光元件10的位置,以对所述定焦摄像模组进行调焦;进一步,使胶水固化以形成位于所述光学镜头20和所述支座61之间的所述胶合层40。如图11所示,是根据本发明的第四个较佳实施例的定焦摄像模组。在本 发明的这个实施例中,所述一体底座3000一体封装所述线路板和至少部分所述感光元件10。所述一体底座包覆所述连接线11。也就是说,在本发明的这个实施例中,所述一体底座3000向内延伸至所述感光元件10的边缘。所述光学镜头20被直接地设置于所述一体底座3000。
值得一提的是,通过所述一体底座3000一体封装所述线路板50和至少部分所述感光元件10的方式,可以将所述感光元件10固定于所述线路板50,从而可以不用单独固定所述感光元件10和所述线路板50,同时向内扩展所述一体底座3000可封装范围,从而减小所述感光组件100的外部区域。
如图12是根据本发明的第四个实施例的定焦摄像模组的一变形实施方式。在本发明的这个实施方式中,所述滤光元件60覆盖于所述感光元件10,所述一体底座3000一体封装所述线路板50、至少部分所述感光元件10和至少部分所述滤光元件60。
也就是说,在这种实施方式中,所述一体底座3000固定所述感光元件10和所述滤光元件60,从而不需要单独的固定方式
进一步,所述一体底座3000具有所述第二凹槽3004,用于安装所述光学镜头20,也就是说,在本发明的这个实施例中,所述一体底座3000不具有用于安装所述滤光元件60的所述第一凹槽3003。
如图13至16是根据本发明的第五个较佳实施例的定焦摄像模组及其多群组镜头。
所述定焦摄像模组包括一多群组镜头90,所述多群组镜头90被直接地安装于所述镜座30。也就是说,在本发明的这个实施例中,所述光学镜头20是所述多群组镜头90。
进一步,所述多群组镜头90通过所述胶合层40直接地安装于所述镜座30。所述多群组镜头90裸露于所述镜座30外部。
所述多群组镜头90包括多个群组单元9010,相邻两所述群组单元9010之间相互配合地组装。
值得一提的是,在传统的定焦摄像模组中,镜头通常被安装于镜筒中,而后通过调整镜筒来调整镜头,同样地,对于由多个群组单元组成的所述多群组镜头,在传统的定焦摄像模组中需要被安装于镜筒等部件,因此并不能直接地对每个群组单元9010进行直接地调整,且镜筒部件不适于被夹持调整,而在本发明中, 各所述群组单元9010直接地裸露于所述镜座30外部,因此在组装成所述定焦摄像模组时,可以方便地对每个所述群组单元9010进行调整,或者说可以自由地选择需要调整的所述群组单元9010。
为了便于说明,在本发明的这个实施例中,以两个所述群组单元9010构成所述多群组镜头90为例进行说明,当然在本发明的其他实施例中,所述多群组镜头90可以包括更多个所述群组单元9010,如三个或三个以上,本发明在这方面并不限制。
具体地,所述多群组镜头90包括两个所述群组单元9010,分别为一上群组单元9011和一下群组单元9012。所述上群组单元9011和所述下群组单元9012相互配合地组装。所述上群组单元9011和所述下群组单元9012叠层布置,光轴方向一致。
所述上群组单元9011包括至少一上镜片90111和一上承载部件90112,所述上镜片90111依次按光线路径布置于所述上承载部件90112内。优选地,所述上镜片90111的数量为多个,比如2、3或3以上。
所述下群组单元9012包括至少一下镜片90121和一下承载部件90122,所述下镜片90121依次按光线路径布置于所述下承载部件90122内。优选地,所述下镜片90121的数量为多个,比如2、3或3以上。
进一步,在本发明的这个实施例中,所述上群组单元9011的所述上承载部件90112包括一上承载主体901121和一延伸壁901122。所述上承载主体901121是一中空结构,以便于容纳、安装各所述镜片,并使其沿光线路径布置。换句话说,所述上群组单元9011的各所述上镜片90111被安装于所述上承载主体901121内部,以便于提供光线通路。所述延伸壁901122自所述上承载主体901121外部向外侧延伸,以便于搭接于所述下群组单元9012的所述上承载部件90112。
更具体地,所述延伸壁901122自所述上承载主体901121外部一体向外延伸。在一些实施方式中,所述延伸壁901122可以是环形的延伸壁,自所述上承载主体901121向外延伸形成一环形帽檐结构,以便于通过所述环形帽檐结构搭接于所述下群组单元9012的所述下承载部件90122,为所述上群组单元9011提供稳定的支撑。
在所述上群组单元9011和所述下群组单元9012固定时,在所述上群组单元9011和所述下群组单元9012之间设置粘结介质9013,比如UV胶、热固胶、UV 热固胶、环氧树脂胶等,以便于将所述上群组单元9011和所述下群组单元9012稳定地固定。当然,在本发明的其他实施例中,所述上群组单元9011和所述下群组单元9012可以通过其他方式进行固定,比如热焊、超声波焊接、激光焊接、铆接、紧固、卡扣等方式,本发明在这方面并不限制。所述粘接介质9013和所述胶合层40可以是相同材质和工艺形成,也可以是不同材质和工艺形成。所述粘接介质9013可以选自组合:UV胶、热固胶、UV热固胶、环氧树脂胶、湿气固化胶、压敏胶中的其中一种或多种。
根据本发明的这个实施例,所述下群组单元9012被直接地通过所述胶合层40安装于所述镜座30。
所述上群组单元9011的所述上承载部件90112的所述上承载主体901121具有一下套接端部9011211,位于所述延伸壁901122下方,所述下套接端部9011211套接于所述下群组单元9012的所述下承载部件90122。换句话说,所述上群组单元9011的所述上承载部件9112的所述延伸壁901122将所述上承载主体901121划分为两部分,位于上方的部分和位于下方的部分,位于下方的部分即所述下套接端部9011211。当所述上群组单元9011的所述上承载部件90112的所述延伸壁901122搭接于所述下群组单元9012的所述下承载部件90122时,所述下套接端部9011211套接于所述下群组单元9012的所述下承载部件90122。
所述下群组单元9012的所述下承载部件90122包括一下承载主体901221和一上搭接端部901222。所述下承载主体901221为一中空结构,以便于容纳、安装各所述下镜片90121,并使其沿光线路径布置。换句话说,所述下群组单元9012的各所述下镜片90121被安装于所述下承载主体901221内部,以便于提供光线通路。所述上搭接端部901222一体地连接于所述下承载主体901221,以便于配合所述上群组单元9011的所述上承载部件90112,使得当所述上承部件的所述延伸壁901122搭接于所述下承载部件90122的所述上搭接端部901222时,所述上群组单元9011的所述上承载部件90112的所述下套接端部9011211延伸进入所述下承载部件90122的所述上搭接端部901222,从而使得所述下群组单元12的所述下承载部件90122约束所述上群组单元9011的安装位置。
换句话说,在本发明的这个实施例中,所述延伸壁901122和所述上搭接端部901222形成组装结构,以便于套接地组装所述上群组单元9011和所述下群组单元9012。
所述上搭接端部901222为向内延伸的中空结构,以便于为所述上群组单元9011提供搭接支撑位置,且为位于所述下承载主体901221内的各所述下镜片90121提供光线通路。
值得一提的是,镜头光轴一致性以及组装时间是摄像模组实际生产应用中的两个重要方面,而本发明中的所述多群组镜头90构成的定焦摄像模组,可以通过多种方式进行组装,且可以方便地、直接地夹持各所述群组单元9010,对各所述群组单元9010进行调整,从而准确、方便、快捷地组装所述定焦摄像模组。
举例地,在一种方式中,可以先将所述至少一下群组单元9012预组装于所述镜座30,而后通过调焦机构对所述下群组单元9012直接地对所述下群组单元进行调整,而后将所述下群组单元通过所述胶合层固定于所述镜座30;而后在所述下群组单元9020上预组装所述上群组单元9011,进而通过所述调焦机构对所述上群组单元直接地进行调整,而后通过所述粘接介质9013将所述上群组单元固定于所述下群组单元;按照前述方式直至固定完所有的所述群组单元9010。
举例地,在另一种方式中,可以将所述上群组单元9011和所述下群组单元9012同时预组装于所述感光元件10的感光路径;而后通过所述调焦机构对所述下群组单元和/或所述上群组单元9011直接的进行调整,使得预组装的所述定焦摄像模组符合预定成像要求;进一步通过所述胶合层40将所述下群组单元9012固定于所述镜座30,通过所述粘接介质9013将所述上群组单元9011固定于所述下群组单元。当然,也可以先将各所述群组单元9010组装为具备完整功能的镜头,即先组装得到所述多群组镜头90,再整体组装到所述镜座30上。
值得一提的是,本发明中,多个群组单元9010组装形成一个整体的镜头,从而使得每个群组单元9010中的镜片数量较少,每个单元的组装误差较小,但是由各所述群组单元9010构成的所述多群组镜头90的镜片总数较多,因此可以提供较高的像素,且累积误差较小。且各所述群组单元9010在组装形成所述多群组镜头的过程中,可以通过调焦机构进行调整组装,使得各所述群组单元9010之间的相对误差减小,还可以通过调整弥补镜头本身的制造误差,从而使得所述多群组镜头90具有较好的光学一致性。且各所述群组单元9010通过组装结构相互配合地组装,从而使得各群组单元9010稳定地组装形成所述多群组镜头90,且配合的方式可以遮挡外部杂光进入所述多群组镜头90内部,避免干扰所述多群组镜头90的光学系统。且在一些实施方式中,各所述群组单元9010之间可以 通过快速成型的粘结介质9013进行固定,比如UV热固胶,而所述配合结构可以为粘结介质提供充足的紫外光照射区域,使得各所述群组单元快速、稳定地进行组装固定,从而提高生产效率。
如图17所示,是根据本发明的第六个较佳实施例的定焦摄像模组剖视示意图。与上述实施例不同的是,所述多群组镜头90被直接地安装于所述一体底座3000。更具体地,所述多群组镜头90通过所述胶合层40直接地固定于所述一体底座3000。也就是说,所述胶合层40被设置于所述多群组镜头90和所述一体底座3000之间。
在制造所述定焦摄像模组时,在通过一体成型的方式形成带有所述一体底座3000的所述感光组件后,在所述一体底座3000上直接地安装所述多群组镜头90整体,或者其中一个所述群组单元9010,从而使得所述多群组镜头90被直接地安装,而不需要提供单独的镜筒部件。
值得一提的是,在本发明的这个实施例中,所述一体底座3000通过一体成型的方式形成,具有平整的表面,可以为所述多群组镜头90直接地提供更加平整的安装平面,有益于提高所述定焦摄像模组的成像品质。
所述多群组镜头90可以通过多种方式组装于所述一体底座3000形成模塑型的所述定焦摄像模组。
举例地,在一种方式中,可以先将所述下群组单元9012预组装于所述一体底座3000,而后通过调焦机构对所述下群组单元9012直接地对所述下群组单元进行调整,而后将所述下群组单元通过所述胶合层固定于所述一体底座3000;而后在所述下群组单元9012上预组装所述上群组单元9011,进而通过所述调焦机构对所述上群组单元直接地进行调整,而后通过所述粘接介质9013将所述上群组单元9011固定于所述下群组单元9012;依次方式,直至固定完所有的所述群组单元9010。
举例地,在另一种方式中,可以将所述上群组单元9011和所述下群组单元9012同时预组装于所述感光元件10的感光路径;而后通过所述调焦机构对所述下群组单元和/或所述上群组单元9011直接的进行调整,使得预组装的所述定焦摄像模组符合预定成像要求;进一步通过所述胶合层40将所述下群组单元9012固定于所述一体底座3000,通过所述粘接介质9013将所述上群组单元9011固定于所述下群组单元9012。
举例地,在另一种方式中,可以将多个所述上群组单元9011和所述下群组单元9012组装成完整的多群组镜头,通过所述粘接介质9013将所述多群组镜头固定于所述下群组单元9012;而后通过所述调焦机构对所述多群组镜头90直接的进行调整,使得预组装的所述定焦摄像模组符合预定成像要求;进一步通过所述胶合层40将所述多群组镜头固定于所述一体底座3000。
本领域技术人员应理解,上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。
本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。

Claims (64)

  1. 一定焦摄像模组,其特征在于,包括:
    一感光元件;
    一光学镜头;以及
    一镜座,其中所述光学镜头被封装于所述镜座的顶端以使所述光学镜头向外凸出于所述镜座,并且所述光学镜头被保持在所述感光元件的感光路径。
  2. 根据权利要求1所述的定焦摄像模组,进一步包括一胶合层,其中所述胶合层位于所述光学镜头和所述镜座之间,以藉由所述胶合层将所述光学镜头直接封装于所述镜座,并且所述胶合层用于封闭所述光学镜头和所述镜座的连接处。
  3. 根据权利要求2所述的定焦摄像模组,其中所述镜座的顶端具有一外侧凹槽,所述胶合层将所述光学镜头直接封装于所述镜座的所述外侧凹槽。
  4. 根据权利要求1至3中任一所述的定焦摄像模组,进一步包括一线路板,其中所述感光元件与所述线路板相导通地连接,所述镜座被设置于所述线路板。
  5. 根据权利要求4所述的定焦摄像模组,进一步包括一滤光元件,其中所述滤光元件被设置于所述感光元件,并且所述滤光元件被保持在所述光学镜头和所述感光元件之间。
  6. 根据权利要求1至3中任一所述的定焦摄像模组,进一步包括一滤光元件,其中所述滤光元件被设置于所述镜座,并且所述滤光元件被保持在所述光学镜头和所述感光元件之间。
  7. 根据权利要求6所述的定焦摄像模组,其中所述滤光元件被封装于所述镜座,并且所述滤光元件被保持在所述光学镜头和所述感光元件之间。
  8. 根据权利要求6所述的定焦摄像模组,其中所述镜座的顶端具有一内侧凹槽,所述滤光元件被封装于所述镜座的所述内侧凹槽。
  9. 根据权利要求7所述的定焦摄像模组,其中所述镜座的顶端具有一内侧凹槽,所述滤光元件被封装于所述镜座的所述内侧凹槽。
  10. 根据权利要求2所述的定焦摄像模组,其中所述镜座的顶端具有一外侧凹槽,所述定焦摄像模组还包括一滤光元件,其中所述滤光元件和所述胶合层被设置于所述外侧凹槽。
  11. 根据权利要求1所述的定焦摄像模组,其中所述光学镜头裸露在所述镜座的外部。
  12. 根据权利要求1至11任一所述的定焦摄像模组,其中所述光学镜头包括至少两群组单元,各所述群组单元相互配合的组装,光轴方向一致。
  13. 根据权利要求12所述的定焦摄像模组,其中各所述群组单元包括一承载部件和至少一镜片,所述镜片被安装于所述承载部件。
  14. 根据权利要求13所述的定焦摄像模组,其中至少两所群组单元为一上群组单元和一下群组单元,所述上群组单元套接于所述下群组单元。
  15. 根据权利要求14所述的定焦摄像模组,其中所述上群组单元包括一上承载主体和一延伸壁,所述下群组单元包括一下承载主体,所述延伸壁自所述上承载主体外部向外延伸,搭接于所述下群组单元的所述下承载主体。
  16. 根据权利要求15所述的定焦摄像模组,其中所述延伸壁形成环形帽檐结构。
  17. 根据权利要求15所述的定焦摄像模组,其中所述上承载主体具有一下套接端部,位于所述延伸壁下方,所述下套接端部套接于所述下承载主体。
  18. 根据权利要求15所述的定焦摄像模组,其中所述上承载主体和所述下承载主体是中空结构,多个所述镜片分别被安装于所述上承载主体和所述下承载主体。
  19. 根据权利要求12所述的定焦摄像模组,其中至少一所述群组单元通过一粘接介质相互固定。
  20. 根据权利要求19所述的定焦摄像模组,其中所述粘接介质选自组合:UV胶、热固胶、UV热固胶、环氧树脂胶、湿气固化胶、压敏胶中的其中一种或多种。
  21. 根据权利要求12所述的定焦摄像模组,其中各所述群组单元直接地裸露于所述镜座外部。
  22. 根据权利要求12所述的定焦摄像模组,其中至少一所述群组单元通过被直接地调整后固定。
  23. 一定焦摄像模组的制造方法,其特征在于,所述制造方法包括如下步骤:将一光学镜头封装于一镜座的顶端以使所述光学镜头向外凸出于所述镜座,并且使所述光学镜头被保持在被贴装于一线路板的一感光元件的感光路径,从而制成 所述定焦摄像模组。
  24. 根据权利要求23所述的制造方法,其中进一步包括步骤:
    将所述感光元件固定于所述线路板;和
    通过打线的方式将所述感光元件和所述线路板相导通。
  25. 根据权利要求23所述的制造方法,其中进一步包括步骤:
    将一滤光元件封装于所述镜座,并且使所述滤光元件和被贴装于所述线路板的所述感光元件的位置相对应。
  26. 根据权利要求23所述的制造方法,其中所述镜座的所述顶端具有一内侧凹槽,所述滤光元件被封装于所述镜座的所述内侧凹槽。
  27. 根据权利要求23至26中任一所述的制造方法,其中在上述方法中,在所述光学镜头和所述镜座之间的相对位置确定以后,在所述光学镜头和所述镜座之间形成连接于所述光学镜头和所述镜座的一胶合层。
  28. 根据权利要求23至26中任一所述的制造方法,其中在上述方法中,在所述光学镜头和所述镜座中的至少一个进行点胶,以在对所述定焦摄像模组执行调焦操作后,使胶水固化以在所述光学镜头和所述镜座之间形成一胶合层。
  29. 根据权利要求28所述的制造方法,其中所述镜座具有一外侧凹槽,所述胶合层位于所述镜座的所述外侧凹槽。
  30. 根据权利要求28所述的制造方法,其中在上述方法中进一步包括步骤:
    使通过点胶的方式被涂布在所述镜座的胶水半固化;
    将所述光学镜头的下端面贴装在所述镜座,以使半固化的胶水位于所述光学镜头和所述镜座之间;以及
    在对所述定焦摄像模组执行调焦操作后,使胶水完成固化以在所述光学镜头和所述镜座之间形成所述胶合层。
  31. 根据权利要求28所述的制造方法,其中所述制造方法还包括如下步骤:
    在一镜座和一光学镜头之间点胶,以使得胶水封闭所述镜座和所述光学镜头的连接处;和
    在所述镜座的外部调整所述光学镜头相对于所述镜座的位置,并且在所述光学镜头相对于所述镜座的位置确定后,使所述胶水固化以在所述光学镜头和所述镜座之间形成一胶合层。
  32. 根据权利要求23所述的制造方法,其中所述制造方法包括如下步骤: 将所述感光元件和所述线路板相固定和相导通并且将预先组装有一滤光元件的所述镜座安装于所述线路板,然后将所述光学镜头组装于所述镜座并调整和确定所述光学镜头的位置。
  33. 根据权利要求23所述的制造方法,其中所述制造方法包括如下步骤:所述镜座一体地封装于所述线路板,将滤光元件安装于镜座,然后将所述光学镜头组装于所述镜座并调整和确定所述光学镜头的位置。
  34. 一定焦摄像模组,其特征在于,包括:
    一感光组件;和
    一光学镜头;其中所述光学镜头被直接地封装于所述感光组件,从而形成所述定焦摄像模组。
  35. 根据权利要求34所述的定焦摄像模组,其中所述定焦摄像模组包括一胶合层,所述胶合层被设置于所述感光组件和所述光学镜头之间,以使得所述光学镜头被直接地固定。
  36. 根据权利要求35所述的定焦摄像模组,其中所述感光组件包括一感光元件、一线路板和一一体底座,所述感光元件电连接于所述线路板,所述一体底座一体成型于所述线路板,所述光学镜头通过所述胶合层安装于所述一体底座。
  37. 根据权利要求36所述的定焦摄像模组,其中所述一体底座包括一模塑主体,并且具有一光窗,所述模塑主体一体成型于所述线路板形成所述光窗为所述感光元件提供光线通路。
  38. 根据权利要求36所述的定焦摄像模组,其中所述定焦摄像模组包括一滤光元件,所述一体底座具有一第一凹槽和一第二凹槽,所述滤光元件被安装于所述第一凹槽,所述光学镜头通过所述胶合层安装于所述第二凹槽。
  39. 根据权利要求36所述的定焦摄像模组,其中所述定焦摄像模组包括一滤光元件,所述一体底座具有一第二凹槽,所述滤光元件被安装于所述第二凹槽,所述光学镜头通过胶合层安装于所述滤光元件。
  40. 根据权利要求36所述的定焦摄像模组,其中所述定焦摄像模组包括一滤光元件,所述一体底座具有一第二凹槽,所述滤光元件覆盖于所述感光元件,所述光学镜头通过所述胶合层安装于所述第二凹槽。
  41. 根据权利要求36所述的定焦摄像模组,其中所述定焦摄像模组包括一滤光元件和一支座,所述一体底座具有一第二凹槽,所述滤光元件被安装于所述 支座,所述支座被安装与所述第二凹槽,所述光学镜头通过所述胶合层安装于所述支座。
  42. 根据权利要求36所述的定焦摄像模组,其中所述定焦摄像模组包括一滤光元件和一支座,所述一体底座具有一第一凹槽和一第二凹槽,所述滤光元件被安装于所述支座,所述支座被安装于所述第一凹槽,所述光学镜头通过所述胶合层安装于所述第二凹槽。
  43. 根据权利要求36至42任一所述的定焦摄像模组,其中所述一体底座一体成型于至少部分所述感光元件,从而一体封装所述感光元件和所述线路板。
  44. 根据权利要求36至42任一所述的定焦摄像模组,其中所述感光组件包括至少一电路元件,所述电路元件被设置于所述线路板,所述一体底座包覆所述电路元件。
  45. 根据权利要求44所述的定焦摄像模组,其中所述电路元件选自组合:电阻、电容、二极管、三极管、电位器、继电器和驱动器中的一种或多种。
  46. 根据权利要求36至42任一所述的定焦摄像模组,其中所述感光组件包括至少一连接线,电连接所述感光元件和所述线路板。
  47. 根据权利要求46所述的定焦摄像模组,其中所述一体底座包覆所述连接线。
  48. 根据权利要求46所述的定焦摄像模组,其中所述连接线选自组合:金线、银线、铜线、铝线、焊盘、导线、引脚中的一种或多种。
  49. 根据权利要求34至42任一所述的定焦摄像模组,其中所述感光组件和所述光学镜头经过调焦后被固定。
  50. 根据权利要求36至42任一所述的定焦摄像模组,其中所述一体成型的方式是模塑成型。
  51. 根据权利要求35至42任一所述的定焦摄像模组,其中所述胶合层是胶水层。
  52. 根据权利要求36至42任一所述的定焦摄像模组,其中所述在制造所述定焦摄像模组时,在所述光学镜头底端设置胶水,而后安装于所述一体底座形成所述胶合层。
  53. 根据权利要求36至42任一所述的定焦摄像模组,其中在制造所述定焦摄像模组时,在所述一体底座设置胶水,而后将所述光学镜头安装于所述一体底 座形成所述胶合层。
  54. 根据权利要求34至42任一所述的定焦摄像模组,其中所述光学镜头包括至少两群组单元,各所述群组单元叠层布置,光轴方向一致。
  55. 根据权利要求54所述的定焦摄像模组,其中各所述群组单元包括一承载部件和至少一镜片,所述镜片被安装于所述承载部件。
  56. 根据权利要求55所述的定焦摄像模组,其中至少两所述群组单元为上群组单元和下群组单元,所述上群组单元套接于所述下群组单元。
  57. 根据权利要求56所述的定焦摄像模组,其中所述上群组单元包括一上承载主体和一延伸壁,所述下群组单元包括一下承载主体,所述延伸壁自所述上承载主体外部向外延伸,搭接于所述下群组单元的所述下承载主体。
  58. 根据权利要求57所述的定焦摄像模组,其中所述延伸壁形成环形帽檐结构。
  59. 根据权利要求56所述的定焦摄像模组,其中所述上承载主体具有一下套接端部,位于所述延伸壁下方,所述下套接端部套接于所述下承载主体。
  60. 根据权利要求56所述的定焦摄像模组,其中所述上承载主体和所述下承载主体是中空结构,至少一个所述镜片分别被安装于所述上承载主体和所述下承载主体。
  61. 根据权利要求54所述的定焦摄像模组,其中所述群组单元通过一粘接介质固定。
  62. 根据权利要求61所述的定焦摄像模组,其中所述粘接介质选自组合:UV胶、热固胶、UV热固胶、环氧树脂胶、湿气固化胶、压敏胶中的其中一种或多种。
  63. 根据权利要求61所述的定焦摄像模组,其中至少一所述群组单元通过被直接地调整后固定。
  64. 根据权利要求61所述的定焦摄像模组,其中各所述群组单元直接地裸露于所述一体底座外部。
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