WO2013136984A1 - 多結晶シリコンロッド - Google Patents
多結晶シリコンロッド Download PDFInfo
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- WO2013136984A1 WO2013136984A1 PCT/JP2013/055143 JP2013055143W WO2013136984A1 WO 2013136984 A1 WO2013136984 A1 WO 2013136984A1 JP 2013055143 W JP2013055143 W JP 2013055143W WO 2013136984 A1 WO2013136984 A1 WO 2013136984A1
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- polycrystalline silicon
- rod
- silicon
- silicon rod
- core wire
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
- C30B29/66—Crystals of complex geometrical shape, e.g. tubes, cylinders
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/02—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method without using solvents
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
Definitions
- the present invention relates to a polycrystalline silicon rod, and more particularly to a polycrystalline silicon rod preferably used as a raw material for producing a silicon single crystal by a Czochralski (CZ) method or a raw material for producing a silicon ingot by a casting method.
- CZ Czochralski
- a Siemens method is known as a method for producing polycrystalline silicon, which is a raw material for silicon single crystals.
- a silicon core wire disposed inside a bell jar type reactor is heated to a silicon deposition temperature by energization, and gas and hydrogen of a silane compound such as trichlorosilane (SiHCl 3 ) or monosilane (SiH 4 ) are supplied thereto.
- silane compound such as trichlorosilane (SiHCl 3 ) or monosilane (SiH 4 ) are supplied thereto.
- silane compound such as trichlorosilane (SiHCl 3 ) or monosilane (SiH 4 ) are supplied thereto.
- SiHCl 3 trichlorosilane
- SiH 4 monosilane
- a polycrystalline silicon rod is crushed to an appropriate size, put into a melting crucible and melted, and a single crystal ingot is pulled up using a seed crystal.
- the molten crucible is charged and melted, and the melt is cooled and solidified to form an ingot.
- the melting of the polycrystalline silicon rod is carried out by heating a melting crucible filled with broken pieces of the rod in an inert atmosphere.
- the present inventors have made various studies to improve the energy efficiency at the time of melting, but have found that the thermal energy required for melting may differ depending on the properties of the polycrystalline silicon rod used as a raw material.
- Patent Document 1 Japanese Patent Laid-Open No. 2008-285403
- Japanese Patent Laid-Open No. 2008-285403 Japanese Patent Laid-Open No. 2008-285403
- the content of acicular crystals is reduced, and the majority is composed of microcrystals.
- a polycrystalline silicon rod is disclosed.
- a polycrystalline silicon rod composed mainly of microcrystals as in Patent Document 1 has a long time required for melting and tends to increase the amount of energy. From this knowledge, it is estimated that the size of the crystal grains constituting the rod has an influence on the meltability of the polycrystalline silicon rod, and the present inventors have further studied, and the crystal grains constituting the rod are coarse. It has been found that the amount of energy required for melting tends to be reduced as the proportion of coarse crystals increases, and the present invention has been completed.
- the present invention has been made on the basis of the above knowledge, and requires a small amount of energy for melting, and contributes to energy cost reduction when used as a silicon single crystal production raw material or a casting method silicon ingot production raw material.
- An object of the present invention is to provide a polycrystalline silicon rod.
- the present invention for achieving the above object includes the following gist.
- the polycrystalline silicon rod according to any one of (1) to (4) which is used as a raw material for producing single crystal silicon by the Czochralski method or a raw material for producing silicon ingots by the casting method.
- the polycrystalline silicon rod of the present invention has a specific fine structure and high thermal conductivity. This means that the amount of energy required for melting is reduced compared to a polycrystalline silicon rod of the same weight. Therefore, the polycrystalline silicon rod of the present invention can contribute to energy cost reduction when used as a silicon single crystal production raw material or a casting method silicon ingot production raw material.
- FIG. 1 shows a schematic cross-sectional view of a polycrystalline silicon rod according to an embodiment of the present invention.
- FIG. 2 is a schematic view of an example of an apparatus for producing a polycrystalline silicon rod.
- FIG. 3 shows an example of a crystal photographing location in the embodiment.
- FIG. 4 is a crystal photograph image of the sample 2 on the rod cross section.
- FIG. 5 is a crystal photograph image of the rod cross section of the sample 4.
- FIG. 6 is a crystal photograph image of the rod cross section of the sample 6.
- the polycrystalline silicon rod 20 according to the present invention is formed by depositing polycrystalline silicon around the silicon core wire 10 as schematically shown in cross section in FIG.
- Polycrystalline silicon is also called polysilicon, and is usually an aggregate of fine silicon crystals.
- polycrystalline silicon is mainly composed of coarse crystal particles 11.
- the average value of the area ratio of the coarse crystal particles 11 in an arbitrary field of view excluding the core wire 10 portion. Is 20% or more, preferably 25% or more, more preferably 35% or more.
- the area ratio of the coarse crystal particles 11 is 20% or more, preferably 25% or more, more preferably 35% or more, in any region excluding the portion of the core wire 10.
- the coarse crystal particle means a particle having a major axis of 50 ⁇ m or more observed on a cut surface substantially perpendicular to the axial direction of the rod.
- the shape observed on the cut surface of the coarse crystal particle 11 is not particularly limited, and varies depending on the appearance of the crystal particle on the cut surface.
- the major axis of the coarse crystal is, for example, the crystal length in the longitudinal direction on the observation surface in the case of atypical particles such as needles and substantially elliptical shapes, and corresponds to the diameter in the case of a substantially circular shape.
- the average value of the major axis of the coarse particles is preferably 50 to 1000 ⁇ m, more preferably 70 to 800 ⁇ m.
- the polycrystalline silicon rod 20 contains coarse crystal particles in the above-described area ratio, the polycrystalline silicon rod 20 is rapidly melted under melting conditions, and the energy cost in silicon single crystal production by the CZ method or silicon ingot production by the crucible casting method is reduced. sell.
- the reason why such an effect is achieved is not necessarily clear, but it is considered that the presence of a relatively large amount of coarse crystal grains reduces the grain boundaries that hinder heat transfer and increases the heat transfer efficiency.
- the area ratio of the coarse crystal and the crystal size can be obtained by computing the image of the rod cross section. Specifically, first, the polycrystalline silicon rod 20 is cut substantially perpendicular to the axial direction to obtain a disk-shaped silicon wafer. Next, the observation surface is polished to obtain a smooth surface. By performing an etching process as necessary following the polishing, the smoothness of the observation surface is further improved, and the contrast of the captured image on the observation surface becomes clear.
- the image may be taken by a camera connected to the computer, or image data taken separately may be input to the computer.
- a Image-kun (trade name) manufactured by Asahi Kasei Engineering Co., Ltd. is used, and particle analysis is performed by the method described in the examples described later.
- the major axis of the coarse crystal and the area ratio occupied by the coarse particles are obtained by particle analysis.
- the diameter of the polycrystalline silicon rod is preferably 90 mm to 180 mm, more preferably 110 mm to 160 mm.
- the thermal conductivity of the polycrystalline silicon rod is preferably 100 to 150 W / m ⁇ K, more preferably 110 to 140 W / m ⁇ K.
- thermal conductivity specific heat x thermal diffusivity x density
- the polycrystalline silicon rod 20 as described above takes advantage of the property of melting quickly under melting conditions, and silicon used when producing a silicon single crystal by the CZ method or by producing a silicon ingot by a crucible casting method. It is preferably used as a raw material for the melt.
- the polycrystalline silicon rod of the present invention can be obtained by the Siemens method with controlled polycrystalline silicon deposition conditions.
- a production apparatus including a reactor 2 generally called a bell jar as schematically shown in FIG. 2 is used.
- the reactor 2 in a typical production apparatus has a bell jar type cover 4 detachably connected to the bottom plate 6. At least a pair of electrodes 12 are mounted on the bottom plate 6. The number of electrodes 12 is determined in accordance with the number of silicon core wires 10 installed in the reactor 2.
- the silicon core wire 10 installed inside the reactor 2 is installed in an inverted U shape so as to connect the pair of electrodes 12 to each other, and can be energized through the electrodes 12.
- the electrode is made of carbon, SUS, Cu or the like.
- the core wire 10 is constituted by, for example, cutting a rod-shaped member from a separately manufactured polycrystalline silicon rod and connecting it so as to form an inverted U shape.
- the cross-sectional shape in the short direction of the core wire may be any of a circular shape, an elliptical shape, a substantially rectangular shape, or a polygonal shape.
- the length of one side is about 5 to 15 mm.
- the cover 4 may have a structure in which a ceiling part and a side part are integrated, or may be a structure in which the cover 4 is joined by a flange or welding.
- the cover 4 is preferably provided with at least one transparent and heat resistant window member 8 through which the inside of the reactor 2 can be observed.
- a non-contact thermometer 38 such as an infrared temperature sensor may be installed outside the window member 8. The thermometer 38 is capable of measuring the surface temperature of the rod 20 arranged inside the reactor 2, and the measured temperature signal is inputted to the control device 32 arranged outside the reactor 2. You may come to be.
- a source gas flow rate controller for adjusting the flow rate of the gas supplied from the source gas supply port 14 into the reactor 2 is mounted. is there.
- a plurality of source gas supply ports 14 and source gas discharge ports 16 may be provided in a single reactor 2.
- the cover 4 and the bottom plate 6 are made of a heat-resistant member such as stainless metal and have a double structure composed of an inner surface and an outer surface.
- a cooling passage is formed inside the double structure of each of the cover 4 and the bottom plate 6, and the cover 4 is cooled by a cooling passage that supplies the refrigerant from the refrigerant supply port 15a and discharges the refrigerant from the refrigerant discharge port 17a.
- the bottom plate 6 is cooled by another cooling passage that supplies the refrigerant from the refrigerant supply port 15b and discharges the refrigerant from the refrigerant discharge port 17b.
- refrigerant flow rate control units 42a and 42b for adjusting the flow rate of the refrigerant supplied from the refrigerant supply ports 15a and 15b to the inside of the reactor 2 are mounted. It is.
- the refrigerant flow rate control units 42a and 42b are controlled by the control device 32 and are configured by, for example, electromagnetic valves.
- temperature detectors 50a and 50b for detecting the temperature of the refrigerant supplied from the refrigerant supply ports 15a and 15b to the inside of the reactor 2 are mounted. It is preferable. In addition, it is preferable that the temperature detection parts 52a and 52b are also attached to the discharge line through which the refrigerant discharged from the refrigerant discharge ports 17a and 17b passes, and the refrigerant discharged from the reactor 2 to the refrigerant discharge ports 17a and 17b. The temperature can be detected. The amount of heat removal can be calculated based on the temperature difference and refrigerant flow rate detected from these.
- the detected temperature signal is input to the control device 32 arranged outside the reactor 2.
- the refrigerant discharged from the refrigerant discharge ports 17a and 17b is recooled by a heat exchanger (not shown), adjusted in temperature, and returned to the refrigerant supply ports 15a and 15b.
- the heated refrigerant may be used for other purposes.
- a power supply means 30 is connected to the electrode 12 connected to the core wire 10.
- the power supply means 30 is controlled by the control device 32.
- Manufacturing the rod 20 made of polycrystalline silicon using the above-described apparatus is performed as follows. That is, energization to the core wire 10 is started via the electrode 12, and the temperature of the core wire 10 is heated to the silicon deposition temperature or higher by energization heating.
- the deposition temperature of silicon is about 600 ° C. or higher.
- the silicon core wire 10 is generally energized so as to be maintained at a temperature of about 900 to 1100 ° C. Heated.
- silane gas and reducing gas are supplied from the supply port 14 into the reactor 2 as source gases. Silicon is generated by the reaction of the source gas (reduction reaction of silane).
- a gas of a silane compound such as monosilane, trichlorosilane, silicon tetrachloride, monochlorosilane, dichlorosilane or the like is used, and generally, trichlorosilane gas is preferably used. . Further, hydrogen gas is usually used as the reducing gas.
- the silicon produced by the above reaction is deposited on the core wire 10, and by continuing this reaction, the silicon on the core wire 10 grows radially and finally the rod 20 made of polycrystalline silicon is obtained. .
- the polycrystalline silicon rod of the present invention can be obtained by appropriately setting the polycrystalline silicon deposition conditions.
- coarse crystals are easily formed by relatively increasing the deposition rate of polycrystalline silicon.
- the polycrystalline silicon rod is obtained by radially growing silicon around the core wire 10 as described above.
- the growth rate at this time is defined by the increasing rate of the rod diameter, it is set to 1.1 mm / hour or more, preferably 1.2 to 3.0 mm / hour, more preferably 1.3 to 2.5 mm / hour.
- the rod growth rate is mainly determined by the surface temperature of the rod and the supply amount of the source gas. The higher the surface temperature, the faster the growth rate. Also, the higher the source gas concentration in the reactor, the faster the rod growth rate. However, changing the source gas supply rate, source gas composition ratio, source gas supply temperature, reactor internal pressure, etc., decreases the temperature in the reactor, decreases the rod growth rate, or crystal growth A large number of nuclei may be generated, which may hinder the growth of coarse crystals.
- the growth rate of the rod can be controlled to an appropriate range and the growth of the coarse crystal can be promoted.
- the polycrystalline silicon rod of the present invention can be obtained.
- the rod surface temperature is 1050 to 1200 ° C., preferably 1080 ° C. to 1150 ° C.
- the raw material gas composition ratio ratio of chlorosilane to the total amount of hydrogen and chlorosilane
- the gas supply amount is 0.01 to 0.1 mol / It is preferable that the raw material gas supply temperature is controlled within a range of 30 ° C. to 200 ° C. with a cm 2 ⁇ h, preferably 0.03 to 0.07 mol / cm 2 ⁇ h.
- the reaction is terminated, the energization to the core wire 10 is stopped, and unreacted silane gas, hydrogen gas and by-product tetrachloride are generated from the reactor 2. After exhausting silicon, hydrogen chloride, etc., the bell jar type cover 4 is opened and the rod 20 is taken out.
- Crystal observation and crystal imaging of the cut surface are performed at six locations as shown in FIG. 3 with respect to an arbitrary straight line passing through the silicon rod skin and the silicon core wire.
- the observation area is photographed under an optical microscope connected to a computer with a visual field range of 3.5 mm ⁇ 2.5 mm to obtain image data.
- the obtained image data is analyzed by image analysis software to obtain particle analysis data.
- image analysis software A image-kun made by Asahi Kasei Engineering Co., Ltd. is used.
- contrast setting an image is divided into 256 shades of gray, 160 shades of density are determined as threshold values for binarization, and portions brighter than the threshold values are determined as particles.
- the region of less than 50 ⁇ m is excluded, and the remaining region is subjected to particle size analysis with coarse particles.
- the major axis of the coarse particles and the area ratio occupied by the coarse particles are determined by particle size analysis.
- thermophysical property measuring device (device manufacturer: LFA-502 manufactured by Kyoto Electronics Industry Co., Ltd.) is used.
- the polycrystalline silicon rod 20 is pierced substantially perpendicularly to the crystal growth direction, and then cut substantially perpendicularly to obtain a small disk-shaped silicon sample.
- the cut surface is polished to make a smooth surface, and a measurement sample is obtained.
- the sample surface was irradiated with laser pulse light. As the irradiation light diffuses in the thickness direction of the sample as heat, the entire sample rises to a uniform temperature ( ⁇ m). Thereby, specific heat can be obtained.
- thermal diffusivity can be obtained from the time required for the sample temperature to reach ⁇ m / 2.
- the thermal conductivity can be obtained from the following equation.
- the obtained thermal conductivity is the thermal conductivity in the longitudinal direction (axial direction) of the rod.
- Thermal conductivity specific heat x thermal diffusivity x density
- energizing the silicon core wire 10 heating the rod surface to a predetermined temperature, and after reaching the predetermined temperature, a silicon deposition source gas (mixed gas of trichlorosilane and hydrogen) is supplied to the reactor 2,
- a silicon deposition source gas mixed gas of trichlorosilane and hydrogen
- the energization amount, the raw material gas supply amount, and the refrigerant flow rate were controlled, and polycrystalline silicon was deposited at a rod average growth rate shown in Table 1 until the rod diameter reached 120 mm. .
- FIG. 4 shows a crystal photographed image at the rod cross section of sample 2
- FIGS. 5 and 6 show crystal photographed images at the rod cross sections of sample 4 and sample 6, respectively.
- samples 1 to 3 correspond to comparative examples of the present invention
- samples 4 to 6 correspond to examples.
- the polycrystalline silicon rod of the present invention has a specific fine structure and high thermal conductivity. This means that the amount of energy required for melting is reduced compared to a polycrystalline silicon rod of the same weight. Therefore, the polycrystalline silicon rod of the present invention can contribute to energy cost reduction when used as a silicon single crystal production raw material or a casting method silicon ingot production raw material.
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Abstract
Description
(1)シリコン芯線を中心に放射状に多結晶シリコンを析出させた多結晶シリコンロッドであって、円柱状のロッドを軸方向に対して垂直に切断した切断面において、芯線部分を除いた面で観察される結晶のうち、長径が50μm以上である粗大結晶粒子の面積割合が20%以上であることを特徴とする、多結晶シリコンロッド。
本発明に係る多結晶シリコンロッド20は、図1に断面の概略を示したように、シリコン芯線10を中心に多結晶シリコンが析出されてなる。多結晶シリコンは、ポリシリコンとも呼ばれ、通常は微細なシリコン結晶の集合体である。本発明の多結晶シリコンロッドにおいては、多結晶シリコンが主として粗大結晶粒子11からなる。具体的には、多結晶シリコンロッド20の放射断面(軸方向に対して垂直な断面)を観察した際に、芯線10の部分を除いた任意の視野における粗大結晶粒子11の面積割合の平均値が20%以上であり、好ましくは25%以上、さらに好ましくは35%以上である。また、さらに好適な態様では、芯線10の部分を除いた、いずれの領域においても、粗大結晶粒子11の面積割合が20%以上であり、好ましくは25%以上、さらに好ましくは35%以上である。ここで、粗大結晶粒子とは、ロッドの軸方向に対して略垂直な切断面において観察される結晶粒子の長径が50μm以上の粒子をいう。
熱伝導率=比熱×熱拡散率×密度
切断面の結晶観察および結晶撮影はシリコンロッド外皮部とシリコン芯線を通る任意の直線に対し、図3に示した通りの6箇所について実施する。観察箇所をコンピュータに接続した光学顕微鏡下、視野範囲を3.5mm×2.5mmとして撮影し、画像データを得る。得られた画像データを画像解析ソフトにより解析し、粒子解析データを得る。画像解析ソフトには、旭化成エンジニアリング株式会社製 A像くんを使用する。コントラスト設定は、画像を濃淡256階調に分割し、濃度160階調を二値化の閾値に決定し、閾値より明るい部分を粒子と判定する。この粒子の領域より、ノイズ排除及び微細粒子排除のために、50μm未満の領域を除外し、残る領域を粗大粒子として粒度解析を実施する。粒度解析により、粗大粒子の長径、および粗大粒子の占める面積割合を求める。
熱伝導率の測定には、レーザーフラッシュ法熱物性値測定装置(装置メーカー:京都電子工業社製 LFA-502)を使用する。はじめに、多結晶シリコンロッド20を結晶成長方向に対して略垂直に刳り貫き、次いで、略垂直に切断し小円盤状のシリコンサンプルを得る。切断面を研磨し、平滑面とし、測定試料とする。10mmφ×3mmtの試験片を用い、試料表面へレーザーパルス光を照射した。照射光が熱として試料厚み方向へ拡散することで試料全体が均一な温度(θm)へ上昇する。これにより比熱を得ることが出来る。次に試料温度がθm/2に到達するまでに要した時間から熱拡散率を得ることができる。熱伝導率は以下の式から得ることができる。得られる熱伝導率は、ロッドの長手方向(軸方向)での熱伝導率である。
熱伝導率=比熱×熱拡散率×密度
棒状の多結晶シリコン芯線(短手断面:一辺8mmの方形)を連結して、高さ2000mmの逆U字型のシリコン芯線を、ロッド10本(逆U字型5対)立ての反応器2中に組み上げて、シリコン芯線10に通電し、ロッド表面を所定温度まで加熱し、所定温度に達した後シリコン析出用原料ガス(トリクロロシランと水素の混合ガス)を反応器2に供給し、所定のロッド表面温度が維持されるように、通電量、原料ガス供給量、冷媒流通量を制御し、表1記載のロッド平均成長速度にて、ロッド直径120mmとなるまで多結晶シリコンを析出させた。
また、図4に試料2のロッド断面における結晶撮影像を示し、図5および図6にそれぞれ試料4および試料6のロッド断面における結晶撮影像を示す。
なお、上記において、試料1~3は、本発明の比較例に相当し、試料4~6は実施例に相当する。
以上、申し述べたように、本発明の多結晶シリコンロッドは、特有の微細構造を有し、熱伝導率が高い。このことは、同重量の多結晶シリコンロッドと比較して、融解に要するエネルギー量が少なくなることを意味する。したがって、本発明の多結晶シリコンロッドは、シリコン単結晶製造原料またはキャスティング法シリコンインゴット製造原料として用いた際に、エネルギーコスト削減に寄与しうる。
4… カバー
6… 底板
8… 窓部材
9… 冷却通路
10… 芯線
11… 粗大結晶粒子
12… 電極
14… 原料ガス供給ポート
16… 原料ガス排出ポート
15a、15b… 冷媒供給ポート
17a、17b… 冷媒排出ポート
20… ロッド
30… 電力供給手段
32… 制御装置
38… 非接触式温度計
42a,42b… 冷媒流量制御部
50a,50b,52a,52b… 温度検出部
Claims (5)
- シリコン芯線を中心に放射状に多結晶シリコンを析出させた多結晶シリコンロッドであって、円柱状のロッドを軸方向に対して垂直に切断した切断面において、芯線部分を除いた面で観察される結晶のうち、長径が50μm以上である粗大結晶粒子の面積割合が20%以上であることを特徴とする、多結晶シリコンロッド。
- 粗大結晶が、50~1000μmの平均長径を有する、請求項1に記載の多結晶シリコンロッド。
- 直径が90~180mmである、請求項1または2に記載の多結晶シリコンロッド。
- シリコン芯線を中心に放射状に多結晶シリコンを析出させた多結晶シリコンロッドであって、その芯線を除く析出方向の断面において、断面方向の熱伝導率が、100~150W/m・Kである請求項1に記載の多結晶シリコンロッド。
- チョクラルスキー法による単結晶シリコンの製造原料またはキャスティング法によるシリコンインゴットの製造原料として用いられる請求項1~4の何れかに記載の多結晶シリコンロッド。
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CN201380014588.XA CN104203819B (zh) | 2012-03-16 | 2013-02-27 | 多晶硅棒 |
EP13760309.8A EP2826748B1 (en) | 2012-03-16 | 2013-02-27 | Polycrystalline silicon rod |
US14/383,577 US10900143B2 (en) | 2012-03-16 | 2013-02-27 | Polycrystalline silicon rod |
KR1020147025729A KR101985939B1 (ko) | 2012-03-16 | 2013-02-27 | 다결정 실리콘 로드 |
SG11201405773SA SG11201405773SA (en) | 2012-03-16 | 2013-02-27 | Polycrystalline silicon rod |
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JP (1) | JP5969230B2 (ja) |
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CN (1) | CN104203819B (ja) |
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JP2014028747A (ja) * | 2012-06-29 | 2014-02-13 | Mitsubishi Materials Corp | 多結晶シリコンロッド |
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JP6345108B2 (ja) * | 2014-12-25 | 2018-06-20 | 信越化学工業株式会社 | 多結晶シリコン棒、多結晶シリコン棒の加工方法、多結晶シリコン棒の結晶評価方法、および、fz単結晶シリコンの製造方法 |
JP6370232B2 (ja) * | 2015-01-28 | 2018-08-08 | 株式会社トクヤマ | 多結晶シリコンロッドの製造方法 |
JP6314097B2 (ja) | 2015-02-19 | 2018-04-18 | 信越化学工業株式会社 | 多結晶シリコン棒 |
JP2018065710A (ja) | 2016-10-18 | 2018-04-26 | 信越化学工業株式会社 | 多結晶シリコン塊、多結晶シリコン棒、および単結晶シリコンの製造方法 |
TWI791486B (zh) * | 2017-02-20 | 2023-02-11 | 日商德山股份有限公司 | 多晶矽的製造方法 |
JP6969917B2 (ja) | 2017-07-12 | 2021-11-24 | 信越化学工業株式会社 | 多結晶シリコン棒および多結晶シリコン棒の製造方法 |
JP7050581B2 (ja) | 2018-06-04 | 2022-04-08 | 信越化学工業株式会社 | 多結晶シリコンロッドの選別方法 |
JP2020125242A (ja) * | 2020-06-01 | 2020-08-20 | 信越化学工業株式会社 | 多結晶シリコン塊、多結晶シリコン棒、および単結晶シリコンの製造方法 |
JP2022003004A (ja) | 2020-06-23 | 2022-01-11 | 信越化学工業株式会社 | ポリシリコンロッド及びポリシリコンロッド製造方法 |
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JP5969230B2 (ja) | 2016-08-17 |
KR101985939B1 (ko) | 2019-06-04 |
EP2826748A4 (en) | 2016-03-16 |
TWI558863B (zh) | 2016-11-21 |
EP2826748A1 (en) | 2015-01-21 |
TW201339379A (zh) | 2013-10-01 |
JP2013193902A (ja) | 2013-09-30 |
US10900143B2 (en) | 2021-01-26 |
SG11201405773SA (en) | 2014-11-27 |
KR20140146069A (ko) | 2014-12-24 |
CN104203819A (zh) | 2014-12-10 |
MY166943A (en) | 2018-07-25 |
EP2826748B1 (en) | 2020-01-15 |
US20150107508A1 (en) | 2015-04-23 |
CN104203819B (zh) | 2016-08-24 |
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