WO2012160699A1 - ホットプレス装置 - Google Patents
ホットプレス装置 Download PDFInfo
- Publication number
- WO2012160699A1 WO2012160699A1 PCT/JP2011/062124 JP2011062124W WO2012160699A1 WO 2012160699 A1 WO2012160699 A1 WO 2012160699A1 JP 2011062124 W JP2011062124 W JP 2011062124W WO 2012160699 A1 WO2012160699 A1 WO 2012160699A1
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- WIPO (PCT)
- Prior art keywords
- gas introduction
- introduction holes
- gas
- upper mold
- mold
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/20—Deep-drawing
- B21D22/208—Deep-drawing by heating the blank or deep-drawing associated with heat treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/20—Deep-drawing
- B21D22/21—Deep-drawing without fixing the border of the blank
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D24/00—Special deep-drawing arrangements in, or in connection with, presses
- B21D24/16—Additional equipment in association with the tools, e.g. for shearing, for trimming
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
- C21D7/13—Modifying the physical properties of iron or steel by deformation by hot working
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/62—Quenching devices
- C21D1/673—Quenching devices for die quenching
Definitions
- the present invention relates to a hot press apparatus for performing cooling on a heated work and simultaneously cooling the work.
- Patent Document 1 a technique for cooling a mold by providing a water channel through which cooling water flows inside the mold and cooling the work well during quenching is known (for example, Patent Document 1). reference).
- An object of the present invention is to provide a hot press apparatus capable of quenching a workpiece at a sufficient cooling rate.
- the hot press apparatus of the present invention comprises a lower mold and an upper mold that are provided so that their molding surfaces face each other, The heated workpiece is sandwiched between the lower die and the upper die and pressed, and at the same time, the molding surface of the lower die and the molding surface of the upper die are held in contact with the surface of the workpiece.
- a hot press apparatus for performing hot press molding for cooling the workpiece wherein a cooling path through which a cooling medium flows and a plurality of gas flows through which a heat conduction gas flows are provided in the lower mold and / or the upper mold.
- the plurality of gas introduction holes penetrate the lower mold and / or the upper mold from the molding surface of the lower mold and / or the upper mold to a surface other than the molding surface.
- the heat transfer gas is formed between the lower mold and / or the upper mold and the workpiece from the plurality of gas introduction holes formed on the molding surface of the lower mold and / or the upper mold. Hot press molding while supplying Cormorant.
- the plurality of gas introduction holes are formed so as to pass in the vicinity of the cooling path.
- the plurality of gas introduction holes may include the lower mold and / or the upper mold in which the plurality of gas introduction holes are provided by deformation after the work is pressed. It is preferable that it is formed so as to open on the molding surface of the lower mold and / or the upper mold in accordance with the position of the gap generated between the lower mold and the upper mold.
- the workpiece can be quenched at a sufficient cooling rate, and the hardness of the workpiece can be prevented from being partially smaller than a desired value.
- the figure which shows the hot press apparatus which concerns on this invention The figure which shows the hot press apparatus before an upper mold
- the hot press apparatus 1 is an apparatus that performs hot press forming on the workpiece W.
- the workpiece W is a steel plate to be processed by the hot press apparatus 1 and is heated to a temperature equal to or higher than the temperature at which an austenite structure appears by energization heating or the like.
- the vertical direction in FIG. 1 is defined as the vertical direction of the hot press apparatus 1
- the horizontal direction in FIG. 1 is defined as the horizontal direction of the hot press apparatus 1.
- the front side of the paper surface in FIG. 1 is defined as the front side of the hot press apparatus 1 and the back side of the paper surface is defined as the rear side of the hot press apparatus 1.
- the hot press apparatus 1 includes a lower mold 10 and an upper mold 20, side gas supply apparatuses 30 and 30, a lower mold gas supply apparatus 40, and an upper mold gas supply apparatus 50. .
- the lower mold 10 and the upper mold 20 are arranged so that their molding surfaces face each other, and the upper mold 20 is moved to the bottom dead center so as to approach the lower mold 10 by a hydraulic cylinder or the like.
- the plate-like workpiece W disposed between the die 10 and the upper die 20 is sandwiched and pressed to form the workpiece W into a so-called hat shape, and at the same time, the lower die 10 is formed on the surface of the workpiece W.
- the workpiece W is cooled to produce the workpiece W as a product.
- the lower mold 10 is a lower mold corresponding to the upper mold 20, and a convex portion 11 protruding upward is formed on the molding surface (upper surface).
- the convex part 11 is a part formed so that the molding surface of the lower mold 10 protrudes upward, and is continuous along the front-rear direction in the middle part (substantially central part) in the left-right direction of the molding surface of the lower mold 10. Is formed.
- a top surface 10a extending along the left-right direction at the top of the convex portion 11, side surfaces 10b, 10b extending downward from both ends in the left-right direction of the top surface 10a, and side surfaces 10b, Base end surfaces 10c and 10c extending outward in the left-right direction from the lower end of 10b are formed as so-called hat-shaped molding surfaces.
- a cooling path 12 In the lower mold 10, a cooling path 12, a plurality of gas introduction holes 13, 13..., A plurality of gas introduction holes 14, 14, and a plurality of gas introduction holes 15, 15. It has been.
- the cooling path 12 is a passage through which a cooling medium such as water flows, and is provided inside the lower mold 10 in order to cool the molding surface of the lower mold 10.
- the cooling medium flows into the lower mold 10 from the lower surface in the right part of the lower mold 10, flows in the front-rear direction and the left-right direction, and then flows from the lower surface in the left part of the lower mold 10 to the outside of the lower mold 10. (See the white arrow in FIG. 1).
- the flow of the cooling medium inside the lower mold 10 is achieved by a predetermined pump (not shown).
- the cooling medium cools the molding surface of the lower mold 10 and flows out of the lower mold 10. Then, the cooling medium is cooled and flows into the lower mold 10 again, and always circulates in the lower mold 10. .
- the gas introduction hole 13, the gas introduction hole 14, and the gas introduction hole 15 are passages through which helium, which is a high inert gas (hereinafter referred to as “thermal conduction gas”) having a thermal conductivity much higher than that of air, flows. is there.
- the gas introduction hole 13, the gas introduction hole 14, and the gas introduction hole 15 are formed so as to penetrate the lower mold 10 in the vertical direction from the molding surface to the lower surface of the lower mold 10 and pass through the vicinity of the cooling path 12. These are arranged so as to open in the center in the left-right direction of the top surface 10a, in the vicinity of the left side surface 10b in the left base end surface 10c, and in the vicinity of the right side surface 10b in the right base end surface 10c.
- a plurality of gas introduction holes 13, gas introduction holes 14, and gas introduction holes 15 are formed at predetermined intervals along the front-rear direction of the lower mold 10.
- a plurality of gas introduction holes 13, 13,... In a total of three locations near the central portion in the left-right direction of the top surface 10 a and the side surfaces 10 b, 10 b in the base end surfaces 10 c, 10 c, A plurality of gas introduction holes 14, 14 ... and a plurality of gas introduction holes 15, 15 ... are formed.
- a plurality of gas introduction holes 13, 13 ..., a plurality of gas introduction holes 14, 14 ..., and a plurality of gas introduction holes 15, 15 ... are formed.
- the opening formed in the molding surface of the lower mold 10 is set to have an inner diameter that does not adversely affect the press work of the work W (the work W can be pressed in the same manner as before).
- the upper die 20 is an upper die corresponding to the lower die 10, and a concave portion 21 is formed on the molding surface (lower surface) so as to be recessed upward in accordance with the shape of the convex portion 11.
- the concave portion 21 is a portion formed so that the molding surface of the upper mold 20 is recessed upward, and is continuously formed along the front-rear direction in a midway portion (substantially central portion) in the left-right direction of the molding surface of the upper mold 20. Has been.
- a bottom surface 20 a extending along the left-right direction at the uppermost portion of the recess 21, side surfaces 20 b, 20 b extending downward from both ends in the left-right direction of the bottom surface 20 a, and lower ends of the side surfaces 20 b, 20 b
- the base end surfaces 20c and 20c that extend outward in the left-right direction are formed as so-called hat-shaped molding surfaces.
- the cooling path 22 is a path through which a cooling medium such as water flows, and is provided inside the upper mold 20 in order to cool the molding surface of the upper mold 20.
- the cooling medium flows into the upper mold 20 from the upper surface at the right part of the upper mold 20 and flows in the front-rear direction and the left-right direction, and then from the upper surface at the left part of the upper mold 20 to the outside of the upper mold 20. (See the white arrow in FIG. 1).
- the flow of the cooling medium inside the upper mold 20 is achieved by a predetermined pump (not shown).
- the cooling medium cools the molding surface of the upper mold 20 and flows out of the upper mold 20, and then is cooled and flows into the upper mold 20 again.
- the cooling medium always circulates in the upper mold 20. .
- the gas introduction hole 23, the gas introduction hole 24, the gas introduction hole 25, and the gas introduction hole 26 are passages through which helium, which is a heat conduction gas, flows.
- the gas introduction hole 23, the gas introduction hole 24, the gas introduction hole 25, and the gas introduction hole 26 penetrate the upper mold 20 along the vertical direction from the molding surface to the upper surface of the upper mold 20, and pass through the vicinity of the cooling path 22.
- a plurality of gas introduction holes 23, gas introduction holes 24, gas introduction holes 25, and gas introduction holes 26 are formed at predetermined intervals along the front-rear direction of the upper mold 20, respectively. ing.
- a plurality of gas introduction holes 23, 23 ..., a plurality of gas introduction holes 24, 24 ..., a plurality of gas introduction holes 25, 25 ..., and a plurality of gas introduction holes The openings formed on the molding surface of the upper mold 20 by forming 26, 26... Do not adversely affect the press work of the work W (the work W can be pressed as before).
- the inner diameter is set.
- the side gas supply device 30 supplies helium, which is a heat conduction gas, between the lower mold 10 and the upper mold 20 (between the workpiece W and the lower mold 10 and between the workpiece W and the upper mold 20).
- Helium a heat conduction gas stored in a predetermined container (not shown), is released between the lower mold 10 and the upper mold 20.
- the side gas supply device 30 supplies helium, which is a heat conduction gas, to the gap between the lower mold 10 and the upper mold 20 from the outside of the lower mold 10 and the upper mold 20.
- the discharge port of helium which is heat conduction gas in each side gas supply apparatus 30 is provided with two or more predetermined intervals along the front-back direction.
- the lower mold gas supply device 40 is a device that supplies helium, which is a heat conduction gas, between the workpiece W and the lower mold 10.
- the lower mold gas supply device 40 includes a plurality of gas introduction holes 13, 13,... Formed in the lower mold 10 using helium, which is a heat conduction gas stored in a predetermined container (not shown).
- the gas is introduced into the plurality of gas introduction holes 14, 14... And the gas introduction holes 15, 15, respectively, from the opening on the lower surface of the lower mold 10, and is discharged from the opening on the molding surface of the lower mold 10.
- the upper mold gas supply device 50 is a device that supplies helium, which is a heat conduction gas, between the workpiece W and the upper mold 20.
- the upper mold gas supply apparatus 50 includes a plurality of gas introduction holes 23, 23,... Formed in the upper mold 20 by using helium, which is a heat conduction gas stored in a predetermined container (not shown).
- the side gas supply devices 30 and 30 are in a stage before the upper die 20 approaches the lower die 10 and reaches the bottom dead center.
- Helium which is a heat conduction gas
- helium which is a heat conduction gas
- the mold gas supply device 50 supplies helium, which is a heat conduction gas, between the workpiece W and the upper mold 20.
- the black arrow in FIG. 2 has shown the discharge
- helium In addition to helium, hydrogen having the same thermal conductivity as that of helium can be considered as the heat conduction gas used in the present invention. However, since a chemical reaction easily occurs, helium which is an inert gas is employed. It is preferable. In addition, as the inert gas, nitrogen, argon, or the like can be considered, but it is excluded because it has a thermal conductivity similar to that of air.
- the plurality of gas introduction holes 13, 13, the plurality of gas introduction holes 14, 14, and the plurality of gas introduction holes 15, 15, are formed inside the lower mold 10. ..., a plurality of gas introduction holes 24, 24 ..., a plurality of gas introduction holes 25, 25 ..., and a plurality of gas introduction holes 26, 26 ... Is formed inside the upper mold 20.
- the helium which is the heat conduction gas discharged from the lower mold gas supply device 40, has a plurality of gas introduction holes 13, 13..., A plurality of gas introduction holes 14, 14.
- Helium When flowing through the holes 15, 15..., Helium is cooled by the lower mold 10 cooled by the cooling path 12, and helium, which is a heat conduction gas discharged from the upper mold gas supply device 50, is a plurality of gases.
- helium which is a heat conduction gas discharged from the upper mold gas supply device 50
- the upper mold 20 cooled by the cooling path 22 is cooled. Therefore, it is possible to cool the helium, which is the heat conduction gas, without using a separate device for cooling the helium, which is the heat conduction gas.
- the heat removal of W can be promoted.
- the helium which is the heat conduction gas discharged from the lower mold gas supply device 40, has a plurality of gas introduction holes 13, 13..., A plurality of gas introduction holes 14, 14.
- Helium which is cooled by the cooling path 12 and discharged from the upper mold gas supply device 50, is a plurality of gas introduction holes 23.
- the plurality of gas introduction holes 23, 23,..., The plurality of gas introduction holes 24, 24..., The plurality of gas introduction holes 25, 25. .. Are formed so as to open to the molding surface of the upper mold 20.
- helium which is a heat conduction gas discharged from the lower mold gas supply device 40, is released from the opening of the molding surface of the lower mold 10 and is a heat conduction gas discharged from the upper mold gas supply device 50. Helium can be released from the opening of the molding surface of the upper mold 20.
- the workpiece W is not diffused into the atmosphere and between the workpiece W and the lower die 10 and between the workpiece W and the upper die 20. Can be supplied efficiently.
- a plurality of gas introduction holes 23, 23..., A plurality of gas introduction holes 24, 24. .. and a plurality of gas introduction holes 26, 26... are formed in the vicinity of the side surfaces 20b and 20b on the bottom surface 20a and in the vicinity of the side surfaces 20b and 20b on the base end surfaces 20c and 20c, respectively. That is, as shown in FIG. 3, the plurality of gas introduction holes 13, 13..., The plurality of gas introduction holes 14, 14.
- the holes 24 ⁇ 24 ⁇ , the plurality of gas introduction holes 25 ⁇ 25 ⁇ , and the plurality of gas introduction holes 26 ⁇ 26 ⁇ are generated between the workpiece W and the upper die 20 after press working. It is formed so as to open on the molding surface of the upper mold 20 in accordance with the position of the gap. Thereby, helium which is a heat conduction gas can be efficiently supplied between the workpiece W and the lower die 10 and between the workpiece W and the upper die 20, and a small amount of the workpiece W and the lower die 10 can be supplied.
- the space between the workpiece W and the upper mold 20 can be filled. Therefore, consumption of helium, which is a heat conduction gas, can be suppressed, and cost can be reduced.
- helium which is a heat conduction gas
- both the lower mold 10 and the upper mold 20 are provided with cooling paths and a plurality of gas introduction holes, respectively, but only one of the lower mold 10 and the upper mold 20 has cooling paths and a plurality of gas introduction holes. It is also possible to adopt a configuration in which a gas introduction hole is provided.
- type 20 in this embodiment were set as the shape for shape
- the present invention can also be applied to a hot press apparatus provided.
- the gas supply devices according to the present invention are the side gas supply devices 30 and 30, the lower mold gas supply device 40, and the upper mold gas supply device 50. It can also be configured as a supply device.
- the present invention can be used in a hot press apparatus that performs cooling on a heated workpiece and simultaneously performs cooling.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Mounting, Exchange, And Manufacturing Of Dies (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
Abstract
Description
加熱されたワークを前記下型及び前記上型によって挟み込んでプレス加工を行うと同時に、前記ワークの表面に前記下型の成形面及び前記上型の成形面を接触させた状態で保持することで前記ワークを冷却するホットプレス成形を行うホットプレス装置であって、前記下型及び/又は前記上型の内部には、冷却媒体が流動する冷却路と、熱伝導ガスが流動する複数のガス導入孔と、が設けられ、前記複数のガス導入孔は、前記下型及び/又は前記上型の成形面から当該成形面以外の面にかけて、前記下型及び/又は前記上型の内部を貫通するように形成され、前記下型及び/又は前記上型の成形面に開口する前記複数のガス導入孔から、前記下型及び/又は前記上型と、前記ワークとの間に前記熱伝導ガスを供給しつつ、ホットプレス成形を行う。
ホットプレス装置1は、ワークWに対してホットプレス成形を施す装置である。
ワークWは、ホットプレス装置1の加工対象となる鋼板であり、通電加熱等によりオーステナイト組織が現れる温度以上まで加熱されている。
なお、説明の便宜上、図1における上下方向をホットプレス装置1の上下方向と規定し、図1における左右方向をホットプレス装置1の左右方向と規定する。更に、図1における紙面手前側をホットプレス装置1の前方、同じく紙面奥側をホットプレス装置1の後方と規定する。
凸部11は、下型10の成形面が上方に突出するように形成された部位であり、下型10の成形面の左右方向における中途部(略中央部)において、前後方向に沿って連続的に形成されている。
なお、下型10の内部に複数のガス導入孔13・13・・・、複数のガス導入孔14・14・・・、及び複数のガス導入孔15・15・・・が形成されることによって下型10の成形面に形成される開口は、ワークWのプレス加工に悪影響が生じない程度(ワークWのプレス加工が従来と同様に行える程度)の内径に設定されている。
凹部21は、上型20の成形面が上方に窪むように形成された部位であり、上型20の成形面の左右方向における中途部(略中央部)において、前後方向に沿って連続的に形成されている。
なお、上型20の内部に複数のガス導入孔23・23・・・、複数のガス導入孔24・24・・・、複数のガス導入孔25・25・・・、及び複数のガス導入孔26・26・・・が形成されることによって上型20の成形面に形成される開口は、ワークWのプレス加工に悪影響が生じない程度(ワークWのプレス加工が従来と同様に行える程度)の内径に設定されている。
なお、図2における黒塗り矢印は、熱伝導ガスであるヘリウムの放出方向を示している。
なお、上型20が下死点に保持された状態で、ワークWと下型10との間、及びワークWと上型20との間を熱伝導ガスであるヘリウムで満たすことができれば良く、側方ガス供給装置30・30、下型用ガス供給装置40、及び上型用ガス供給装置50からの熱伝導ガスであるヘリウムの供給のタイミング等は限定しない。
しかしながら、ワークWが下型10及び上型20によって冷却される際には、空気よりも極めて高い熱伝導率を有するヘリウムがワークWと下型10との間、及びワークWと上型20との間に満たされているため、ワークWにおける下型10の成形面、又は上型20の成形面から離間する部分においても、充分な冷却速度(例えば、30[℃/sec]以上)で焼入れすることができる。
したがって、ワークWの硬度が部分的に所望の値よりも小さくなることを防止できる。
また、ヘリウムは、不活性ガスであるため、化学反応が起こり難く、下型10及び上型20の酸化を抑制することができる。
また、不活性ガスとしては、窒素、又はアルゴン等が考えられるが、空気と同程度の熱伝導率であるため、除外する。
これにより、下型用ガス供給装置40から排出された熱伝導ガスであるヘリウムが複数のガス導入孔13・13・・・、複数のガス導入孔14・14・・・、及び複数のガス導入孔15・15・・・を流動する際に、冷却路12によって冷却された下型10によって冷却されると共に、上型用ガス供給装置50から排出された熱伝導ガスであるヘリウムが複数のガス導入孔23・23・・・、複数のガス導入孔24・24・・・、複数のガス導入孔25・25・・・、及び複数のガス導入孔26・26・・・を流動する際に、冷却路22によって冷却された上型20によって冷却されることとなる。
したがって、別途、熱伝導ガスであるヘリウムを冷却するための機器を用いることなく、熱伝導ガスであるヘリウムを冷却することができ、ワークWの焼入れの際に、熱伝導ガスであるヘリウムによるワークWの抜熱を促進させることができる。
これにより、下型用ガス供給装置40から排出された熱伝導ガスであるヘリウムが複数のガス導入孔13・13・・・、複数のガス導入孔14・14・・・、及び複数のガス導入孔15・15・・・を流動する際に、冷却路12によって冷却されると共に、上型用ガス供給装置50から排出された熱伝導ガスであるヘリウムが複数のガス導入孔23・23・・・、複数のガス導入孔24・24・・・、複数のガス導入孔25・25・・・、及び複数のガス導入孔26・26・・・を流動する際に、冷却路22によって冷却されることとなる。
したがって、ワークWの焼入れの際に、熱伝導ガスであるヘリウムによるワークWの抜熱を更に促進させることができる。
なお、ガス導入孔13、ガス導入孔14、及び複数のガス導入孔15においては、冷却路12に近接する部分が多ければ多い程良く、ガス導入孔23、ガス導入孔24、ガス導入孔25、及び複数のガス導入孔26においては、冷却路22に近接する部分が多ければ多い程良い。
これにより、下型用ガス供給装置40から排出された熱伝導ガスであるヘリウムを下型10の成形面の開口から放出すると共に、上型用ガス供給装置50から排出された熱伝導ガスであるヘリウムを上型20の成形面の開口から放出することが可能となる。
したがって、熱伝導ガスであるヘリウムをワークWの側方等から供給する場合と比較して、大気に拡散させることなく、ワークWと下型10との間、及びワークWと上型20との間に効率良く供給することができる。
これにより、ワークWと下型10との間、及びワークWと上型20との間に、熱伝導ガスであるヘリウムを効率良く供給することができ、少量でワークWと下型10との間、及びワークWと上型20との間の空間を満たすことができる。
したがって、熱伝導ガスであるヘリウムの消費量を抑制することができ、コストの削減を図ることができる。
なお、プレス加工後におけるワークWの変形特性は、実験等により得られるため、ワークWと下型10及び上型20との間に生じる空隙の位置は、予め把握可能である。
また、本実施形態における下型10及び上型20は、ワークWをハット型形状に成形するための形状としたが、当該形状に限定するものではなく、他の形状の下型及び上型を具備するホットプレス装置においても、本発明を適用可能である。
10 下型
12 冷却路
13、14、15 ガス導入孔
20 上型
22 冷却路
23、24、25、26 ガス導入孔
30 側方ガス供給装置
40 下型用ガス供給装置
50 上型用ガス供給装置
Claims (3)
- 互いの成形面が対向するように設けられた下型及び上型を具備し、
加熱されたワークを前記下型及び前記上型によって挟み込んでプレス加工を行うと同時に、前記ワークの表面に前記下型の成形面及び前記上型の成形面を接触させた状態で保持することで前記ワークを冷却するホットプレス成形を行うホットプレス装置であって、
前記下型及び/又は前記上型の内部には、
冷却媒体が流動する冷却路と、
熱伝導ガスが流動する複数のガス導入孔と、が設けられ、
前記複数のガス導入孔は、
前記下型及び/又は前記上型の成形面から当該成形面以外の面にかけて、前記下型及び/又は前記上型の内部を貫通するように形成され、
前記下型及び/又は前記上型の成形面に開口する前記複数のガス導入孔から、前記下型及び/又は前記上型と、前記ワークとの間に前記熱伝導ガスを供給しつつ、ホットプレス成形を行う、
ことを特徴とするホットプレス装置。 - 前記複数のガス導入孔は、前記冷却路の近傍を通るように形成される、
ことを特徴とする請求項1に記載のホットプレス装置。 - 前記複数のガス導入孔は、前記ワークのプレス加工後の変形によって、前記複数のガス導入孔が設けられた前記下型及び/又は前記上型と、前記ワークとの間に生じる空隙の位置に合わせて、前記下型及び/又は前記上型の成形面に開口するように形成される、
ことを特徴とする請求項1又は請求項2に記載のホットプレス装置。
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DE112011105284.7T DE112011105284B4 (de) | 2011-05-26 | 2011-05-26 | Heißpressvorrichtung |
CN201180071042.9A CN103547389B (zh) | 2011-05-26 | 2011-05-26 | 热压装置 |
US14/118,977 US20140137619A1 (en) | 2011-05-26 | 2011-05-26 | Hot-pressing apparatus |
JP2013516151A JP5783249B2 (ja) | 2011-05-26 | 2011-05-26 | ホットプレス装置 |
PCT/JP2011/062124 WO2012160699A1 (ja) | 2011-05-26 | 2011-05-26 | ホットプレス装置 |
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JP (1) | JP5783249B2 (ja) |
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KR101560926B1 (ko) * | 2013-12-20 | 2015-10-15 | 주식회사 포스코 | 성형소재 냉각장치 |
JP2016182642A (ja) * | 2015-03-26 | 2016-10-20 | ヴェーバ ヴェアクツォイクバウ ベトリープス ゲゼルシャフト ミット ベシュレンクテル ハフツングweba Werkzeugbau Betriebs GmbH | 部分的に硬化した成形品を製造する方法および装置 |
KR101969685B1 (ko) * | 2018-11-28 | 2019-04-16 | 박재현 | 자동차 부품 성형장치 |
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JPWO2012160699A1 (ja) | 2014-07-31 |
CN103547389A (zh) | 2014-01-29 |
DE112011105284T5 (de) | 2014-02-27 |
JP5783249B2 (ja) | 2015-09-24 |
CN103547389B (zh) | 2016-02-17 |
DE112011105284B4 (de) | 2022-08-25 |
US20140137619A1 (en) | 2014-05-22 |
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