WO2012002300A1 - 電子部品実装装置及び電子部品実装方法 - Google Patents
電子部品実装装置及び電子部品実装方法 Download PDFInfo
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- WO2012002300A1 WO2012002300A1 PCT/JP2011/064625 JP2011064625W WO2012002300A1 WO 2012002300 A1 WO2012002300 A1 WO 2012002300A1 JP 2011064625 W JP2011064625 W JP 2011064625W WO 2012002300 A1 WO2012002300 A1 WO 2012002300A1
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- Prior art keywords
- electronic component
- bonding tool
- substrate
- contact
- component mounting
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 12
- 238000001816 cooling Methods 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000000155 melt Substances 0.000 claims abstract 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 24
- 239000003507 refrigerant Substances 0.000 claims description 20
- 238000000926 separation method Methods 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 14
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- 238000013459 approach Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 abstract description 32
- 229910000679 solder Inorganic materials 0.000 description 60
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 38
- 239000010931 gold Substances 0.000 description 38
- 229910052737 gold Inorganic materials 0.000 description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 229910052802 copper Inorganic materials 0.000 description 15
- 239000010949 copper Substances 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 14
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- 239000011347 resin Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
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- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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Definitions
- the present invention relates to a structure of an electronic component mounting apparatus and an electronic component mounting method using the electronic component mounting apparatus.
- solder bumps are formed on the electrodes
- a method of mounting electronic components with solder bumps on a substrate by thermocompression bonding, or forming gold bumps on the electrodes of electronic components A thin solder film is provided on the surface, and gold solder fusion bonding, in which gold and solder of gold bumps are bonded by heat fusion, or connection using a resin adhesive such as thermoplastic resin or anisotropic conductive film (AFC) The method is used.
- the electronic component is heated and the solder or adhesive on the electrode is melted, and then the electronic component is pressed against the substrate by a crimping tool, and then the solder or adhesive is cooled and fixed.
- the electronic component is bonded to the substrate.
- the electronic component mounting apparatus used for such joining includes a heater for heating the solder to a molten state or heating the adhesive to a softened state, and a cooling means for cooling the solder and adhesive after connection, It has been proposed to shorten the heating and cooling time.
- Patent Document 1 a tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating material for preventing heat generated from the ceramic heater from being transferred to other than the tool,
- a contact heating device constituted by a holder that integrates these members and is coupled to other members, a passage for a cooling medium is provided in the heat insulating material and / or the holder, and the heater or the heat insulating material or the holder is cooled, It has been proposed that the adhesive can be rapidly heated to a temperature at which the adhesive is softened or the solder is melted and that thermal deformation of the apparatus is suppressed when the temperature is rapidly decreased.
- Patent Document 2 discloses a mounting tool that holds and holds a semiconductor chip, a heater that heats a suction portion of the mounting tool, and a semiconductor chip that is heated by pressurizing and heating a semiconductor chip on a substrate.
- an electronic component mounting apparatus capable of reducing the tact time when mounting a semiconductor chip with a thermoplastic resin by providing a flow path for supplying a gas for cooling the thermoplastic resin.
- the object of the present invention is to shorten the cooling time when mounting electronic components.
- the electronic component mounting apparatus of the present invention is an electronic component mounting apparatus for bonding an electrode of an electronic component and an electrode of a substrate through a bonding metal that is thermally melted, and mounting the electronic component on the substrate, Formed on a base part that is driven in contact with and away from the substrate and incorporates a heater, a first surface that is in close contact with the surface of the base part, and a second surface opposite to the first surface A pedestal for adsorbing and holding the electronic component on the surface thereof, and a bonding tool that heats the electronic component adsorbed on the surface of the pedestal and is heated by the heater of the base unit to a substrate, and
- the bonding tool includes a cooling channel that communicates the first surface and the side surface of the pedestal.
- the cooling flow path of the bonding tool is preferably a flow path in which at least part of the cooling flow path flows a coolant in a direction along the surface of the pedestal.
- the base portion is provided on a side surface, and includes a refrigerant inlet into which a refrigerant flows, and a refrigerant supply port that is provided on a surface that tightly fixes the bonding tool and supplies the refrigerant that has flowed in from the refrigerant inlet to the cooling flow path of the bonding tool.
- the cooling flow path of the bonding tool is provided on the first surface, one end of which communicates with the refrigerant supply port, and the other end of which communicates with a refrigerant outlet provided on the side surface of the pedestal. It is also preferable that it is composed of a groove extending in a direction along the pedestal surface and a surface of the base portion covering the groove.
- the electronic component mounting apparatus detects a position of the bonding tool in the contact / separation direction with respect to the substrate and a drive unit that drives the base body in the contact / separation direction with the substrate.
- the control unit when heating the electronic component by the heater and the bonding tool approaches the substrate by a predetermined distance from a reference position, between the electrode of the electronic component and the electrode of the substrate Judging that the bonding metal has been melted by heat, and maintaining the position of the bonding tool in the contact / separation direction with respect to the substrate,
- the supplying the refrigerant in the cooling flow passage of the bonding tool having a bonding tool position holding cooling means for cooling the said bonding tool, it is also suitable as a.
- the electronic component has bumps formed on the electrodes, the substrate has a bonding metal film formed on the electrodes, and the control unit is further connected to the position detection unit.
- Contact detection means for determining contact between the bump and the film based on a signal, and the substrate of the bonding tool when the contact detection means determines that the bump and the film are in contact with each other.
- reference position setting means for setting a position relative to the reference position as the reference position.
- the control unit further sets the reference position by the reference position setting unit
- the distance in the contact / separation direction of the bonding tool with respect to the substrate changes from increase to decrease.
- a second reference position setting unit that sets a position of the bonding tool with respect to the substrate as a second reference position; and the bonding tool moves from the second reference position to a second predetermined position while heating the electronic component.
- the coolant is supplied to the cooling flow path of the bonding tool by opening the shut-off valve to cool the bonding tool. Having a bonding tool position holding the cooling means, It is also suitable.
- the electronic component mounting method of the present invention is an electronic component mounting method in which an electrode of an electronic component and an electrode of a substrate are bonded via a bonding metal that is thermally melted, and the electronic component is mounted on the substrate, Formed on a base part that is driven in contact with and away from the substrate and incorporates a heater, a first surface that is in close contact with the surface of the base part, and a second surface opposite to the first surface A pedestal for adsorbing and holding the electronic component on the surface thereof, and a cooling channel communicating the first surface and the side surface of the pedestal, and heated by the heater of the base portion, A bonding tool for thermocompression bonding the electronic component adsorbed on the surface of the substrate to the substrate, a drive unit for driving the base portion in the contact / separation direction with the substrate, and a position of the bonding tool in the contact / separation direction with respect to the substrate Position detecting unit and the bonding tool A step of preparing an electronic component mounting apparatus having a shut-off valve that opens and closes a cooling
- the present invention has an effect that it is possible to shorten the cooling time when the electronic component is mounted.
- an electronic component mounting apparatus 100 includes a base 10, a frame 11 extending upward from the base 10, an upper flange 12 protruding from the upper part of the frame 11, and side surfaces of the frame 11.
- a ceramic heater assembly 27 that is attached to the end and incorporates a ceramic heater therein, a bonding tool 28 that is attached to the lower end of the ceramic heater assembly 27 and sucks the electronic component 31, and a bonding stage 41 that sucks and fixes the substrate 42;
- the motor 13 and the voice coil motor 20 are drive units that drive the bonding tool 28 in the vertical direction (Z direction).
- the ceramic heater assembly 27 is obtained by attaching a thin ceramic heater 27h to the inside of a heater base 27a which is a base portion. Inside the heater base 27a, a first vacuum suction groove 95 for vacuum-sucking the bonding tool 28 to the lower surface of the heater base 27a, a first air suction path 94 for sucking air in the first vacuum suction groove 95, and a bonding A second air suction path 93 for sucking air in the second vacuum suction groove 98 provided on the lower surface 28e of the base 28c protruding from the lower surface 28b of the tool 28 is provided.
- the second air suction path 93 communicates with a vacuum groove 96 provided on the upper surface 28a of the bonding tool 28, and a second vacuum suction groove 98 that vacuum-sucks the electronic component 31 provided on the vacuum groove 96 and the lower surface 28e of the base 28c. Are communicated with each other by a third air suction passage 97. Therefore, the second air suction passage 93 can suck the air in the second vacuum suction groove 98 through the vacuum groove 96 and the third air suction passage 97.
- the upper surface 28a of the bonding tool 28 is the first surface recited in the claims
- the lower surface 28b of the bonding tool 28 is the second surface recited in the claims.
- FIG. 2B is a diagram showing an upper surface 28a that is a first surface that is in close contact with the heater base 27a of the bonding tool 28 as viewed from the direction of arrow B in FIG. 2A, and is a first surface provided on the lower surface of the heater base 27a.
- a vacuum suction groove 95 is indicated by a one-dot chain line.
- the first vacuum suction groove 95 is a square tubular groove.
- a first air suction path 94 that is circular and extends in the vertical (Z) direction of the heater base 27a communicates with a part of the first vacuum suction groove 95. As shown in FIG.
- FIG. 2C is a view of the lower surface 28e of the pedestal 28c as seen from the direction of arrow A in FIG. 2A.
- the second vacuum suction groove 98 is a cross-shaped groove.
- the first air suction path 94 communicates with a first air suction port 92 provided on the side surface 27b of the heater base 27a, and the first vacuum pipe 75 shown in FIG.
- the second air suction passage 93 communicates with a second air suction port 91 provided on the side surface 27b of the heater base 27a.
- the second air suction port 91 is connected to a second vacuum pipe 74 shown in FIG.
- the first and second vacuum pipes 75 and 74 are connected to a vacuum device 73, and electromagnetic valves 77 and 76 are provided in the middle of the first and second vacuum pipes 75 and 74, respectively. .
- a first cooling flow path 86 for flowing cooling air which is a refrigerant for cooling the heater base 27a
- a first air supply path 84 for supplying cooling air to the first cooling flow path 86
- a second air supply path 83 that is a refrigerant supply path for supplying cooling air for cooling the tool 28 to the bonding tool 28 is provided.
- the first cooling passage 86 extends in a direction along the lower surface of the heater base 27a between the ceramic heater 27h of the heater base 27a and the bonding tool 28, and is a first air outlet provided on the side surface 27b of the heater base 27a. 90.
- the first cooling flow path 86 is one or a plurality of flow paths extending from one side surface 27b of the heater base 27a toward the other side surface 27b.
- the shape of the first cooling flow channel 86 may be circular, square, or other shape. You may make it extend radially from the center of 27a toward each side surface 27b.
- the air flowing into the first air supply path 84 from the first air inlet 82 provided on the side surface 27b of the heater base 27a flows through the first cooling flow path 86 to cool the heater base 27a, and then from the first air outlet 90. It flows out to the outside.
- a second air supply path 83 communicating with the second air inlet 81 provided on the side surface 27b of the heater base 27a extends downward from the heater base 27a to the lower surface of the heater base 27a, and the upper surface 28a of the bonding tool 28.
- the lower surface end of the heater base 27 a of the second air supply path 83 serves as a refrigerant supply port for supplying cooling air to the bonding tool 28.
- a second cooling channel that extends in a direction along the lower surface 28e of the base 28c and communicates with the third air supply path 85 and a second air outlet 89 provided on the side surface 28d of the base 28c.
- the second cooling flow path 87 is a flow path that extends radially from the third air supply path 85 toward each side surface 28d of the pedestal 28c, and has a circular or square cross-sectional shape. Other shapes may be used.
- the second cooling flow path 87 may be a flow path that communicates with the third air supply path 85 and extends from one side surface 28d of the base 28c to the other side surface 28d.
- a first air pipe 72 shown in FIG. 1 is connected to the first air inlet 82, and a second air pipe 71 shown in FIG. 1 is connected to the second air inlet 81.
- throttle valves 68 and 67, flow meters 66 and 65, and electromagnetic valves 64 and 63 are provided in the first and second air pipes 72 and 71, respectively.
- the first and second air pipes 72 and 71 merge on the upstream side of the electromagnetic valves 64 and 63 to form an air supply pipe 69.
- the air supply pipe 69 is connected to a compressed air source 70, and a pressure reducing valve that reduces the air pressure supplied from the compressed air source 70 to a pressure supplied to the first and second air pipes 72 and 71.
- the electromagnetic valves 64 and 63 are respectively provided with first and second air pipes 72 and 71, and first, second and third air supply paths 84, 83 and 85 connected thereto, and first and second cooling flow paths 86 and 87, respectively. It is a shut-off valve that opens and closes.
- the voice coil motor 20 is a casing 21, a permanent magnet stator 22 fixed along the inner periphery of the casing 21, and a mover disposed on the inner periphery of the stator 22.
- the rod 26 is attached to the casing 21 via a leaf spring 25.
- the rod 26 is fixed with a linear scale 61 which is L-shaped and has a fine scale on the vertical portion.
- a linear scale head 62 that reads a scale provided on the linear scale 61 is attached to the outer surface of the casing 21 facing the linear scale 61.
- the linear scale 61 and the linear scale head 62 constitute a position detection unit that detects the position of the bonding tool 28 in the height direction, and the linear scale head 62 is connected to the control unit 50.
- the bonding stage 41 includes a stage heater 48 for heating the substrate 42 that is attracted and fixed to the bonding stage 41.
- the bonding stage 41 is configured to be movable in the XY directions by a driving mechanism (not shown).
- the control unit 50 is a computer that includes a CPU 51 that performs signal processing and a memory 52 therein.
- the memory 52 includes a bonding program 53 that controls bonding, control data 58, and a reference position setting program 54.
- the motor 13 is connected to the control unit 50, and is configured to control the rotation direction and rotation angle according to a command from the control unit 50.
- the power source 19 is connected to the control unit 50 and outputs to the coil 23 according to a command from the control unit 50.
- the ceramic heater assembly 27 and the stage heater 48 are connected to the control unit 50, and the heat generation state is controlled by a command from the control unit 50.
- the electromagnetic valves 64 and 63 provided in the first and second air pipes 72 and 71 and the electromagnetic valves 77 and 76 provided in the first and second vacuum pipes 75 and 74 are connected to the control unit 50 and are connected to the control unit. It is configured to open and close by 50 commands.
- the electronic component 31 that is vertically inverted and attracted to the tip of the bonding tool 28 has a plurality of electrodes 32 on the surface, and each gold bump 33 is formed on each electrode 32.
- the gold bump 33 has a disc-shaped base 34 on the electrode 32 side and a protrusion 35 protruding in a conical shape from the base.
- a copper electrode 43 is formed on the surface of the substrate 42 that is adsorbed and fixed to the bonding stage 41, and a solder film 44 is formed on the surface of the copper electrode 43.
- the solder film 44 is very thin and is about 10 to 30 ⁇ m.
- the electrode 32, the gold bump 33, and the copper electrode 43 of the substrate are arranged to face each other.
- the linear scale 61 has a scale 61b provided at a very fine pitch L on the linear scale body 61a.
- the linear scale head 62 includes a light source that irradiates the scale 61b of the linear scale 61 therein, a grating that transmits light from the light source, a light receiving device that detects light reflected by the scale 61b of the linear scale 61, and an input from the light receiving device. And a signal processing unit for processing the processed signals.
- the light emitted from the light source passes through the grating and is reflected by the scale 61b of the linear scale 61 to generate interference fringes on the light receiving device such as a photodiode.
- the linear scale head 62 When the linear scale 61 moves relative to the linear scale head 62 in the longitudinal direction of the scale 61b, the interference fringes move, and the pitch L of the scale 61b from the light receiving device or a sine with a period of 1/2 of the pitch L.
- a wave signal is output.
- the sine wave signal is a two-phase sine wave whose phase is shifted by 90 degrees.
- the linear scale head 62 outputs a relative movement amount between the linear scale 61 and the linear scale head 62 based on the output difference of the two-phase sine wave in the signal processing unit.
- the detection system of the movement amount is about 1 nm when the pitch L of the scale 61b is, for example, several ⁇ m.
- the electronic component 31 includes a semiconductor chip, a transistor, a diode, and the like.
- the controller 50 opens the electromagnetic valve 77 and sucks out air from the first air suction path 94 shown in FIG. 2 provided inside the ceramic heater assembly 27 through the first vacuum pipe 75 and passes through the inside of the first vacuum suction groove 95.
- the bonding tool 28 is vacuum-adsorbed on the lower surface of the ceramic heater assembly 27.
- control unit 50 opens the electromagnetic valve 76 from the second air suction path 93, the vacuum groove 96, and the third air suction path 97 shown in FIG. Air is sucked out and the inside of the second vacuum suction groove 98 of the bonding tool 28 is evacuated to vacuum-suck the electronic component 31 to the lower surface 28e of the base 28c of the bonding tool 28.
- the controller 50 moves the bonding stage 41 in the XY directions to align the electrode 32 of the electronic component 31 and the copper electrode 43 of the substrate 42 as shown in FIG. In the initial state, the electromagnetic valves 63 and 64 shown in FIG. 1 are closed, so that the cooling air does not flow into the ceramic heater assembly 27.
- control unit 50 step S101 in FIG. 5, as shown in t 2 from time t 1 in FIG. 6, starts to decrease operation of lowering the bonding tool from the initial height H 0.
- the lowering operation is performed by rotating the motor 13 shown in FIG. 1 to rotate the feed screw 18 and moving the lifting block 15 to which the nut 17 into which the feed screw 18 is screwed is fixed downward.
- Control unit 50 detects the lowered position by the rotation angle of the motor 13, it is determined whether or not lowered to a predetermined height H 1 of FIG. 6, as shown in step S102 of FIG.
- the gold bump 33 and the solder film 44, although the copper electrode 43 are very close as shown in FIG.
- the search operation is an operation of gradually lowering the height of the bonding tool 28 until the tip of the protrusion 35 of the gold bump 33 contacts the surface of the solder film 44. .
- This operation is performed, for example, by changing the energization current to the coil 23 of the voice coil motor 20 as follows.
- the power source 19 energizes the coil 23 of the voice coil motor 20 based on the command value for the descent position. Then, the coil 23 moves downward, and its tip 24 comes into contact with the upper end of the rod 26. Since the rod 26 is attached to the casing 21 by the leaf spring 25, the current flowing through the coil 23 increases, the tip 24 of the coil 23 pushes down the rod 26, and the leaf spring 25 bends according to the pushing force. 26 moves downward and the tip of the bonding tool 28 gradually descends. As the rod 26 moves downward, the relative height between the linear scale 61 fixed to the rod 26 and the casing 21 of the voice coil motor 20 becomes different. The amount of movement is detected.
- the control unit 50 acquires the lowered position of the bonding tool 28 based on the change in the signal detected by the linear scale head 62, and adjusts the current output from the power source by applying feedback to the command value of the lowered position. Then, it is possible to perform a search operation in which the current flowing through the coil 23 is increased little by little and the tip of the bonding tool 28 is gradually lowered.
- the controller 50 monitors whether or not the tip of the protrusion 35 of the gold bump 33 is in contact with the surface of the solder film 44 by the contact detection means, as shown in step S104 of FIG. Yes.
- the tip of the protrusion 35 of the gold bump 33 comes into contact with the solder film 44, the downward movement of the coil 23 is stopped, and the lowering position detected by the linear scale head 62 and the lowering position command value during the search operation are stopped. There is a difference between When the difference between the command value of the lowering position and the lowering position detected by the linear scale head 62 exceeds a predetermined threshold, the control unit 50 makes the tip of the protrusion 35 of the gold bump 33 contact the solder film 44.
- the vertical position of the linear scale 61 is adjusted so that the center in the longitudinal direction of the scale 61 b comes to the front of the linear scale head 62 when the tip of the protrusion 35 of the gold bump 33 comes into contact with the solder film 44. Therefore, the linear scale head 62 can measure the amount of movement in the vertical direction around the position where the tip of the protrusion 35 of the gold bump 33 contacts the solder film 44.
- FIG. 7B shows a state where the tip of the protrusion 35 of the gold bump 33 is in contact with the solder film 44.
- the control unit 50 After setting the reference scale, the control unit 50 performs a constant load operation in which the pressing load for the bonding tool 28 to press down the substrate 42 is constant as shown in step S106 of FIG.
- This operation may be, for example, such that the value of the current applied to the coil 23 of the voice coil motor 20 is substantially constant so that the force with which the tip 24 of the coil 23 pushes down the rod 26 is constant.
- a load sensor for detecting a pressing load for the bonding tool 28 to push down the substrate 42 is provided, and the current of the coil 23 is changed so that the pressing load detected by the load sensor is constant. You may control. As shown in step S107 of FIG.
- the control unit 50 the tip of the projecting portion 35 of the linear scale head movement amount in the height direction detected by 62 and the reference taking the difference between the height H 2 gold bump 33
- the distance approaching the substrate 42 from the height H 2 (reference height) of the bonding tool 28 when contacting the solder coating 44, that is, the downward movement distance from the reference height H 2 is calculated as the sinking amount D.
- the control unit 50 starts monitoring whether the sinking amount D exceeds a predetermined threshold as shown in step S108 of FIG.
- the temperature of the solder coating 44 of the substrate 42 by the stage heater 48 shown in FIG. 1 It has the same temperature T 0 and temperature.
- the electronic component 31 is heated to a higher temperature by a ceramic heater 27 h arranged on the upper part of the bonding tool 28. Therefore, when in contact with the film 44 whose tip solder projections 35 of the gold bump 33 in the time t 3 in FIG. 6, the heat starts to be transmitted to the solder film 44 from the tip of the projecting portion 35 of the gold bump 33. Then, at time t 4 in FIG. 6, the temperature of the solder film 44 starts to rise.
- the solder film 44 is present in a thickness of several ⁇ m between the tip of the protrusion 35 of the gold bump 33 and the copper electrode 43 of the substrate 42.
- the control unit 50 determines that the solder film 44 has been melted by heat as shown in step S109 of FIG. height ceramic heater while maintaining constant at a height H 4 of the time t 6 27h, starts bonding tool position holding the cooling operation for cooling the bonding tool 28.
- the amount of movement in the vertical direction detected by the linear scale head 62 with the height of the bonding tool 28 being the height H 4 is detected, and the difference from the reference height H 2 is a predetermined value.
- the control unit 50 turns off the ceramic heater 27h that is heating the bonding tool 28, and supplies cooling air to the ceramic heater assembly 27 and the bonding tool 28 to cool them.
- the bonding tool 28 and the electronic component 31 adsorbed on the bonding tool 28 are cooled together with the ceramic heater 27h.
- the control unit 50 opens the electromagnetic valves 63 and 64 shown in FIG. 1, and the first and second air pipes 72 and 71 through the first air inlet 82 and the second air inlet 81 through the first and second air pipes 82 and 71 shown in FIG. Cooling air is caused to flow into the air supply paths 84 and 83.
- the cooling air that has flowed into the first air supply path 84 flows in the horizontal direction in the first cooling flow path 86 provided below the ceramic heater 27 h, and the heater between the ceramic heater 27 h and the bonding tool 28.
- the portion of the base 27a is cooled.
- the air that has flowed through the first cooling flow path 86 and cooled the heater base 27 a is discharged to the outside from the first air outlet 90.
- the cooling air that has flowed into the second air supply path 83 flows from the second air supply path 83 to the third air supply path 85 and then enters the second cooling flow path 87 from the third air supply path 85, and is a pedestal. It flows horizontally in the direction along the lower surface 28e of 28c, and is discharged to the outside from the second air outlet 89 provided on the side surface 28d of the base 28c.
- the air flowing in from the first and second air inlets 82 and 81 cools the heater base 27a portion below the ceramic heater 27h and the bonding tool 28, and is adsorbed to the tip of the bonding tool 28.
- the electronic component 31 can be cooled more effectively.
- the gold bump 33 shown in FIG. 7C is also rapidly cooled along with the cooling of the electronic component 31, and the solder film 44 is formed between the tip of the protrusion 35 of the gold bump 33 and the copper electrode 43 of the substrate 42.
- the solder 45 around the protrusions 35 of the gold bumps 33 is cooled while maintaining the thickness of several ⁇ m. Then, as shown in the time t 7 in FIG.
- solder film 44 when the temperature of the solder film 44 is lowered to the freezing temperature T 3 of the solder, the solder solidifies, projections 35 of the gold bump 33 as shown in FIG. 7 (d)
- the solder 45 is solidified between the tip of the substrate and the copper electrode 43 of the substrate 42 in a state where the thickness of the solder film 44 is several ⁇ m, and becomes a bonding metal 46.
- step S110 of FIG. 5 the control unit 50, once a predetermined time has elapsed, it is determined that the cooling had been completed, the solenoid valve 63, 64 shown in FIG. 1 to the time t 7 in FIG. 6 as a closed Stop the flow of cooling air. Then, the control unit 50 closes the electromagnetic valve 76 to stop the suction of air from the second air suction path 93 to release the vacuum of the second vacuum suction groove 98, and to the lower surface 28 e of the base 28 c of the bonding tool 28. The suction of the electronic component 31 that has been sucked and fixed is released. Thereafter, the control unit 50 ends the bonding of the electronic component 31 to rotate the feed screw 18 by the motor 13 to increase the bonding tool 28 to the initial height H 0 as shown in step S111 of FIG.
- the electronic component mounting apparatus 100 of the present embodiment cools the portion of the heater base 27a below the ceramic heater 27h and the bonding tool 28, so that the electrons adsorbed on the tip of the bonding tool 28 are absorbed.
- the component 31 can be cooled more effectively, the solder can be solidified in a short time, and the bonding time can be shortened.
- the electronic component mounting apparatus 100 according to the present embodiment determines melting of the solder film 44 based on the sinking amount D of the bonding tool 28 and shifts from constant load control to bonding tool position holding control.
- the tip of the protrusion 35 of the gold bump 33 is positioned in the thickness of the thin solder film 44, and the protrusion 35 of the gold bump 33 is
- the electronic component 31 can be mounted by solidifying the solder in a state where the tip does not contact the copper electrode 43 of the substrate 42. And it can suppress that the protrusion 35 of the gold bump 33 and the copper electrode 43 contact, and the gold bump 33 deform
- FIG. 8 another embodiment of the present invention will be described. Components similar to those described with reference to FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof is omitted.
- the position of the second air suction path 93, the vacuum groove 96, the third air suction path 97 provided in the ceramic heater assembly 27 and the bonding tool 28, and the cooling provided in the bonding tool 28 As shown in FIG. 8, the position of the second air suction path 93, the vacuum groove 96, the third air suction path 97 provided in the ceramic heater assembly 27 and the bonding tool 28, and the cooling provided in the bonding tool 28.
- the shape of the air flow path is different, and the other configuration is the same as that of the embodiment described with reference to FIGS.
- a cross-shaped groove 101 having a square cross section is formed on the upper surface 28a of the bonding tool 28 when viewed from the direction of arrow B in FIG. 8A.
- the bonding tool 28 is adsorbed to the lower surface of the heater base 27a of the ceramic heater assembly 27 by the vacuum of the first vacuum adsorption groove 95, the upper surface of the groove 101 is covered with the lower surface of the heater base 27a, and the groove 101 is a bonding tool. It becomes a cooling channel with a square cross section from the center to the four directions.
- the second air supply path 83 is configured to communicate with the central portion of the groove 101.
- FIG. 8C is a diagram showing the lower surface 28e of the base 28c as viewed from the direction of arrow A in FIG. 8A.
- the pedestal 28c is provided with a third cooling flow path 103 that extends in the direction along the lower surface 28e of the pedestal 28c and communicates with each third air outlet 104 provided on the side surface 28d side. .
- a fourth air supply path 102 that extends from the groove 101 in the thickness direction of the bonding tool 28 and communicates with the third cooling flow path 103 is provided at the end of each side 28 d of the base 28 c of the groove 101. It has been.
- the third air suction path 97 is disposed at a position not in contact with the groove 101 described above, and the vacuum groove 96 and the second air suction path 93 are disposed in accordance with the position.
- the cooling air that has flowed in flows into the groove 101 from the second air supply path 83, flows in the groove 101 toward the four sides of the bonding tool 28, and cools the bonding tool 28. Then, it flows from the 4th air supply path 102 to the 3rd cooling flow path 103, the base 28c of the bonding tool 28 is cooled, and it discharge
- This embodiment has the same effect as the above-described embodiment.
- the groove 101 in which a part of the cooling flow path of the bonding tool 28 is provided on the upper surface 28 a of the bonding tool 28 is covered with the lower surface of the heater base 27 a of the ceramic heater assembly 27. Therefore, the cooling channel can be easily processed.
- the shape of the groove 101 is a cross shape, but the shape of the groove is not limited as long as a cooling flow path for cooling the bonding tool 28 can be formed by the groove and the lower surface of the heater base 27a. May be.
- the third air outlet 104 may not be provided on each side surface 28d of the pedestal 28c, and it is sufficient that at least one third air outlet 104 is provided on any side surface 28d.
- the first, second, and third cooling flow paths 86, 87, and 103 that cool the ceramic heater assembly 27 and the bonding tool 28 are opened and closed by opening and closing the electromagnetic valves 63 and 64.
- the electromagnetic valves 63 and 64 may be flow rate control valves capable of adjusting the flow rate, the opening degree thereof may be adjusted based on the cooling time, and the air flow rate may be changed according to the cooling time. Further, the air flow rate may be changed based on the temperature of the electronic component 31 or the like.
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Abstract
Description
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Claims (7)
- 電子部品を基板の上に実装する電子部品実装装置であって、
前記基板と接離方向に駆動され、ヒータを内蔵する基体部と、
前記基体部の表面に密着して固定される第1の面と、前記第1の面と反対側の第2の面に形成され、その表面に前記電子部品を吸着保持する台座とを有し、前記基体部の前記ヒータによって加熱され、前記台座の表面に吸着した電子部品を基板に熱圧着するボンディングツールと、を備え、
前記ボンディングツールは、前記第1の面と前記台座の側面とを連通する冷却流路を有し、
熱溶融する接合金属を介して前記電子部品の電極と前記基板の電極とを接合する電子部品実装装置。 - 請求項1に記載の電子部品実装装置であって、
前記ボンディングツールの前記冷却流路は、少なくともその一部が前記台座の表面に沿った方向に冷媒を流す流路である電子部品実装装置。 - 請求項2に記載の電子部品実装装置であって、
前記基体部は、側面に設けられ、冷媒が流入する冷媒入口と、ボンディングツールを密着固定する表面に設けられ、前記冷媒入口から流入した冷媒をボンディングツールの冷却流路に供給する冷媒供給口とを含む冷媒供給路を有し、
前記ボンディングツールの前記冷却流路は、その一端が前記冷媒供給口と連通し、他端が前記台座側面に設けられる冷媒出口と連通する前記第1の面に設けられる前記台座表面に沿った方向に延びる溝と、前記溝を覆う前記基体部の表面とで構成されている電子部品実装装置。 - 請求項1から3のいずれか1項に記載の電子部品実装装置であって、
前記電子部品実装装置は、
前記基体部を前記基板との接離方向に駆動する駆動部と、
前記ボンディングツールの前記基板との接離方向の位置を検出する位置検出部と、
前記ボンディングツールの冷却流路を開閉する遮断弁と、
前記駆動部によって前記ボンディングツールの前記基板との接離方向の位置を変化させるとともに前記遮断弁を開閉させる制御部と、を備え、
前記制御部は、
前記ヒータによって前記電子部品を加熱しながら前記ボンディングツールが基準位置から所定の距離だけ前記基板に近づいた場合、前記電子部品の電極と前記基板の電極との間の前記接合金属が熱溶融したと判断し、その際の前記ボンディングツールの前記基板に対する接離方向の位置を保持すると共に、前記遮断弁を開として前記ボンディングツールの冷却流路に冷媒を供給して前記ボンディングツールの冷却を行うボンディングツール位置保持冷却手段を有する電子部品実装装置。 - 請求項4に記載の電子部品実装装置であって、
前記電子部品は電極の上にバンプが形成され、
前記基板は電極に接合金属の皮膜が形成され、
前記制御部は、さらに、
前記位置検出部からの信号に基づいて前記バンプと前記皮膜との当接を判断する当接検出手段と、
前記当接検出手段によって前記バンプと前記皮膜とが当接したと判断した場合に、前記ボンディングツールの前記基板に対する位置を前記基準位置として設定する基準位置設定手段を有する電子部品実装装置。 - 請求項5に記載の電子部品実装装置であって、
前記制御部は、さらに、
前記基準位置設定手段によって前記基準位置を設定した後、前記ボンディングツールの前記基板との接離方向の距離が増加から減少に変化した場合、前記ボンディングツールの前記基板に対する位置を第2の基準位置として設定する第2の基準位置設定手段と、
前記電子部品を加熱しながら前記ボンディングツールが前記第2の基準位置から第2の所定の距離だけ前記基板に近づいた場合、前記電子部品の電極と前記基板の電極との間の前記接合金属が熱溶融したと判断し、その際の前記ボンディングツールの前記基板に対する接離方向の位置を保持すると共に、前記遮断弁を開として前記ボンディングツールの冷却流路に冷媒を供給して前記ボンディングツールの冷却を行う第2のボンディングツール位置保持冷却手段を有する電子部品実装装置。 - 電子部品を基板の上に実装する電子部品実装方法であって、
前記基板と接離方向に駆動され、ヒータを内蔵する基体部と、
前記基体部の表面に密着して固定される第1の面と、前記第1の面と反対側の第2の面に形成され、その表面に前記電子部品を吸着保持する台座と、前記第1の面と前記台座の側面とを連通する冷却流路と、を有し、前記基体部の前記ヒータによって加熱され、前記台座の表面に吸着した電子部品を基板に熱圧着するボンディングツールと、
前記基体部を前記基板との接離方向に駆動する駆動部と、
前記ボンディングツールの前記基板との接離方向の位置を検出する位置検出部と、
前記ボンディングツールの冷却流路を開閉する遮断弁と、
を有する電子部品実装装置を準備する工程と、
前記ヒータによって前記電子部品を加熱しながら前記ボンディングツールが基準位置から所定の距離だけ前記基板に近づいた場合、前記電子部品の電極と前記基板の電極との間の前記接合金属が熱溶融したと判断し、その際の前記ボンディングツールの前記基板に対する接離方向の位置を保持すると共に、前記遮断弁を開として前記ボンディングツールの冷却流路に冷媒を供給して前記ボンディングツールの冷却を行うボンディングツール位置保持冷却工程とを有し、
熱溶融する接合金属を介して電子部品の電極と基板の電極とを接合する電子部品実装方法。
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US20130181037A1 (en) | 2013-07-18 |
JP4808283B1 (ja) | 2011-11-02 |
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CN102959695B (zh) | 2016-03-02 |
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SG186485A1 (en) | 2013-02-28 |
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