JP2014022629A - ボンディング装置用ヒータ及びその冷却方法 - Google Patents
ボンディング装置用ヒータ及びその冷却方法 Download PDFInfo
- Publication number
- JP2014022629A JP2014022629A JP2012161304A JP2012161304A JP2014022629A JP 2014022629 A JP2014022629 A JP 2014022629A JP 2012161304 A JP2012161304 A JP 2012161304A JP 2012161304 A JP2012161304 A JP 2012161304A JP 2014022629 A JP2014022629 A JP 2014022629A
- Authority
- JP
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- Prior art keywords
- capillary
- heater
- cooling
- bonding apparatus
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims description 8
- 239000011810 insulating material Substances 0.000 claims abstract description 33
- 230000013011 mating Effects 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/085—Cooling, heat sink or heat shielding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/755—Cooling means
- H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Wire Bonding (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Resistance Heating (AREA)
Abstract
【解決手段】ボンディングツール40が取り付けられる下面31bと、断熱材20が取り付けられる上面31aとを有する平板形のボンディング装置用ヒータ30であって、上面31aに多数の毛細スリット35が設けられ、多数の毛細スリット35と上面31aに取り付けられる断熱材20の合わせ面21とは、キャビティ36から側面33に延びる多数の毛細冷却流路37を形成する。
【選択図】図1
Description
=毛細スリット35の両側面35aの面積=H1×L1×2×毛細冷却流路37の数
=H1×L1×504
となる。
全流路断面積
=W1×H1×毛細冷却流路37の数=W1×H1×504
となる。
Claims (5)
- ボンディングツールが取り付けられる第一の面と、前記第一の面と反対側で断熱材が取り付けられる第二の面とを有する平板形のボンディング装置用ヒータであって、
前記第二の面に設けられる多数の毛細スリットと、を備え、
多数の前記毛細スリットと前記第二の面に取り付けられる前記断熱材の合わせ面とは、多数の毛細冷却流路を形成すること、
を特徴とするボンディング装置用ヒータ。 - 請求項1に記載のボンディング装置用ヒータであって、
前記毛細スリットは、前記第二の面に沿った方向の幅が前記第二の面に垂直方向の深さよりも小さいこと、
を特徴とするボンディング装置用ヒータ。 - 請求項1または2に記載のボンディング装置用ヒータであって、
前記第二の面は、中央近傍に窪みが設けられ、
前記窪みと前記第二の面に取り付けられる前記断熱材の合わせ面とは、冷却空気が流入するキャビティを形成し、
多数の前記毛細スリットは、前記キャビティから側面に延びること、
を特徴とするボンディング装置用ヒータ。 - 請求項1または2に記載のボンディング装置用ヒータであって、
前記断熱材は、前記合わせ面の中央近傍に第二の窪みが設けられ、
前記第二の窪みと前記第二の面とは、冷却空気が流入するキャビティを形成し、
多数の前記毛細スリットは、前記キャビティに連通し、対向する各側面の間に延びること、
を特徴とするボンディング装置用ヒータ。 - ボンディングツールが取り付けられる第一の面と、前記第一の面と反対側で断熱材が取り付けられる第二の面とを有する平板形状で、前記第二の面に設けられる多数の毛細スリットと、を備え、多数の前記毛細スリットと前記第二の面に取り付けられる前記断熱材の合わせ面とは、多数の毛細冷却流路を形成するボンディング装置用ヒータの冷却方法であって、
冷却空気流量は、前記毛細冷却流路出口の毛細スリット中央の冷却空気温度が前記毛細スリットの表面温度よりも所定の閾値だけ低い温度となる流量であること、
を特徴とする冷却方法。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012161304A JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
TW104117385A TW201535635A (zh) | 2012-07-20 | 2013-02-25 | 接合裝置用加熱器及其冷卻方法 |
TW102106499A TWI489598B (zh) | 2012-07-20 | 2013-02-25 | A heater for a bonding device and a cooling method thereof |
SG11201500238RA SG11201500238RA (en) | 2012-07-20 | 2013-04-11 | Heater for bonding apparatus and method of cooling the same |
KR1020147024142A KR101559741B1 (ko) | 2012-07-20 | 2013-04-11 | 본딩 장치용 히터 및 그 냉각 방법 |
CN201380014787.0A CN104520980B (zh) | 2012-07-20 | 2013-04-11 | 接合装置用加热器及其冷却方法 |
KR1020157017088A KR20150082673A (ko) | 2012-07-20 | 2013-04-11 | 본딩 장치용 히터 및 그 냉각 방법 |
PCT/JP2013/060908 WO2014013764A1 (ja) | 2012-07-20 | 2013-04-11 | ボンディング装置用ヒータ及びその冷却方法 |
US14/597,635 US10350692B2 (en) | 2012-07-20 | 2015-01-15 | Heater for bonding apparatus and method of cooling the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012161304A JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015050779A Division JP2015109485A (ja) | 2015-03-13 | 2015-03-13 | ボンディング装置用ヒータ及びその冷却方法 |
JP2015127628A Division JP6149241B2 (ja) | 2015-06-25 | 2015-06-25 | ボンディング装置用ヒータ及びその冷却方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2014022629A true JP2014022629A (ja) | 2014-02-03 |
JP2014022629A5 JP2014022629A5 (ja) | 2014-10-23 |
JP5793473B2 JP5793473B2 (ja) | 2015-10-14 |
Family
ID=49948601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012161304A Active JP5793473B2 (ja) | 2012-07-20 | 2012-07-20 | ボンディング装置用ヒータ及びその冷却方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10350692B2 (ja) |
JP (1) | JP5793473B2 (ja) |
KR (2) | KR101559741B1 (ja) |
CN (1) | CN104520980B (ja) |
SG (1) | SG11201500238RA (ja) |
TW (2) | TWI489598B (ja) |
WO (1) | WO2014013764A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016207832A (ja) * | 2015-04-22 | 2016-12-08 | パナソニックIpマネジメント株式会社 | 電子部品ボンディングヘッド |
JP2017050059A (ja) * | 2015-08-31 | 2017-03-09 | 株式会社イチネンジコー | ヒータ |
JP2017050306A (ja) * | 2015-08-31 | 2017-03-09 | 株式会社イチネンジコー | ヒータ |
WO2017065073A1 (ja) * | 2015-10-16 | 2017-04-20 | 東レエンジニアリング株式会社 | ボンディングヘッドおよび実装装置 |
JP2019153807A (ja) * | 2019-05-15 | 2019-09-12 | 株式会社イチネンジコー | ヒータ |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9093549B2 (en) * | 2013-07-02 | 2015-07-28 | Kulicke And Soffa Industries, Inc. | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same |
US9659902B2 (en) * | 2014-02-28 | 2017-05-23 | Kulicke And Soffa Industries, Inc. | Thermocompression bonding systems and methods of operating the same |
TWI662671B (zh) * | 2016-03-24 | 2019-06-11 | 日商新川股份有限公司 | 接合裝置 |
CN107825011A (zh) * | 2017-11-10 | 2018-03-23 | 普尔思(苏州)无线通讯产品有限公司 | 一种能够控制温度的焊接系统 |
TWI834007B (zh) * | 2019-11-19 | 2024-03-01 | 日商新川股份有限公司 | 半導體裝置的製造裝置及製造方法 |
TWI791287B (zh) * | 2021-09-16 | 2023-02-01 | 日商新川股份有限公司 | 封裝裝置以及封裝方法 |
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-
2012
- 2012-07-20 JP JP2012161304A patent/JP5793473B2/ja active Active
-
2013
- 2013-02-25 TW TW102106499A patent/TWI489598B/zh active
- 2013-02-25 TW TW104117385A patent/TW201535635A/zh unknown
- 2013-04-11 CN CN201380014787.0A patent/CN104520980B/zh active Active
- 2013-04-11 WO PCT/JP2013/060908 patent/WO2014013764A1/ja active Application Filing
- 2013-04-11 SG SG11201500238RA patent/SG11201500238RA/en unknown
- 2013-04-11 KR KR1020147024142A patent/KR101559741B1/ko active IP Right Grant
- 2013-04-11 KR KR1020157017088A patent/KR20150082673A/ko not_active Application Discontinuation
-
2015
- 2015-01-15 US US14/597,635 patent/US10350692B2/en active Active
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JPH10275833A (ja) * | 1997-03-31 | 1998-10-13 | Sumitomo Osaka Cement Co Ltd | パルスヒーター及び半導体チップ実装ボードの製法 |
JP2000277567A (ja) * | 1999-03-25 | 2000-10-06 | Ngk Insulators Ltd | ボンディング用ヒータ |
JP2004063947A (ja) * | 2002-07-31 | 2004-02-26 | Kyocera Corp | 加熱装置 |
JP2007165897A (ja) * | 2005-12-09 | 2007-06-28 | General Electric Co <Ge> | 電子デバイス冷却システムを製造する方法 |
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JP2016207832A (ja) * | 2015-04-22 | 2016-12-08 | パナソニックIpマネジメント株式会社 | 電子部品ボンディングヘッド |
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WO2017065073A1 (ja) * | 2015-10-16 | 2017-04-20 | 東レエンジニアリング株式会社 | ボンディングヘッドおよび実装装置 |
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JP2019153807A (ja) * | 2019-05-15 | 2019-09-12 | 株式会社イチネンジコー | ヒータ |
Also Published As
Publication number | Publication date |
---|---|
KR101559741B1 (ko) | 2015-10-13 |
CN104520980A (zh) | 2015-04-15 |
TW201535635A (zh) | 2015-09-16 |
WO2014013764A1 (ja) | 2014-01-23 |
KR20150082673A (ko) | 2015-07-15 |
US20150183040A1 (en) | 2015-07-02 |
SG11201500238RA (en) | 2015-03-30 |
TWI489598B (zh) | 2015-06-21 |
TW201405731A (zh) | 2014-02-01 |
JP5793473B2 (ja) | 2015-10-14 |
CN104520980B (zh) | 2017-07-07 |
KR20140128380A (ko) | 2014-11-05 |
US10350692B2 (en) | 2019-07-16 |
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