SG11201500238RA - Heater for bonding apparatus and method of cooling the same - Google Patents

Heater for bonding apparatus and method of cooling the same

Info

Publication number
SG11201500238RA
SG11201500238RA SG11201500238RA SG11201500238RA SG11201500238RA SG 11201500238R A SG11201500238R A SG 11201500238RA SG 11201500238R A SG11201500238R A SG 11201500238RA SG 11201500238R A SG11201500238R A SG 11201500238RA SG 11201500238R A SG11201500238R A SG 11201500238RA
Authority
SG
Singapore
Prior art keywords
heater
cooling
same
bonding apparatus
bonding
Prior art date
Application number
SG11201500238RA
Inventor
Kohei Seyama
Yasuhiro Chida
Osamu Kakutani
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11201500238RA publication Critical patent/SG11201500238RA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/755—Cooling means
    • H01L2224/75502—Cooling means in the upper part of the bonding apparatus, e.g. in the bonding head
SG11201500238RA 2012-07-20 2013-04-11 Heater for bonding apparatus and method of cooling the same SG11201500238RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012161304A JP5793473B2 (en) 2012-07-20 2012-07-20 Heater for bonding apparatus and cooling method thereof
PCT/JP2013/060908 WO2014013764A1 (en) 2012-07-20 2013-04-11 Heater for bonding device and method for cooling same

Publications (1)

Publication Number Publication Date
SG11201500238RA true SG11201500238RA (en) 2015-03-30

Family

ID=49948601

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201500238RA SG11201500238RA (en) 2012-07-20 2013-04-11 Heater for bonding apparatus and method of cooling the same

Country Status (7)

Country Link
US (1) US10350692B2 (en)
JP (1) JP5793473B2 (en)
KR (2) KR101559741B1 (en)
CN (1) CN104520980B (en)
SG (1) SG11201500238RA (en)
TW (2) TW201535635A (en)
WO (1) WO2014013764A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9093549B2 (en) * 2013-07-02 2015-07-28 Kulicke And Soffa Industries, Inc. Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US9659902B2 (en) * 2014-02-28 2017-05-23 Kulicke And Soffa Industries, Inc. Thermocompression bonding systems and methods of operating the same
JP6176542B2 (en) * 2015-04-22 2017-08-09 パナソニックＩｐマネジメント株式会社 Electronic component bonding head
JP6529865B2 (en) * 2015-08-31 2019-06-12 株式会社イチネンジコー heater
JP6457905B2 (en) * 2015-08-31 2019-01-23 株式会社イチネンジコー heater
JP6836317B2 (en) * 2015-10-16 2021-02-24 東レエンジニアリング株式会社 Bonding head and mounting device
CN109196629B (en) * 2016-03-24 2021-12-07 株式会社新川 Joining device
CN107825011A (en) * 2017-11-10 2018-03-23 普尔思（苏州）无线通讯产品有限公司 A kind of welding system that can control temperature
JP6680930B2 (en) * 2019-05-15 2020-04-15 株式会社イチネンジコー heater
TWI791287B (en) * 2021-09-16 2023-02-01 日商新川股份有限公司 Packaging device and packaging method

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US5592363A (en) 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
US5453641A (en) * 1992-12-16 1995-09-26 Sdl, Inc. Waste heat removal system
JP3255871B2 (en) * 1997-03-31 2002-02-12 住友大阪セメント株式会社 Manufacturing method of pulse heater and semiconductor chip mounting board
JPH11204994A (en) 1998-01-14 1999-07-30 Hitachi Ltd Element mounting device
JP2000277567A (en) * 1999-03-25 2000-10-06 Ngk Insulators Ltd Heater for bonding
JP2002016091A (en) 2000-06-29 2002-01-18 Kyocera Corp Contact heating device
US6414271B2 (en) 2000-05-25 2002-07-02 Kyocera Corporation Contact heating device
JP2002076102A (en) * 2000-08-31 2002-03-15 Ibiden Co Ltd Ceramic substrate
JP3801966B2 (en) * 2002-07-31 2006-07-26 京セラ株式会社 Heating device
US20070125526A1 (en) 2005-12-02 2007-06-07 Matsushita Electric Industrial Co., Ltd. Cooling device for electronic components
JP2007180505A (en) 2005-12-02 2007-07-12 Matsushita Electric Ind Co Ltd Cooling device for electronic component
US20070131659A1 (en) * 2005-12-09 2007-06-14 Durocher Kevin M Method of making an electronic device cooling system
JP4640170B2 (en) * 2005-12-28 2011-03-02 株式会社豊田自動織機 Soldering method, semiconductor module manufacturing method, and soldering apparatus
JP2007242724A (en) * 2006-03-06 2007-09-20 Seiko Epson Corp Micro-channel structure, its manufacturing method of micro-channel structure and electronic apparatus
JP2007329306A (en) * 2006-06-08 2007-12-20 Matsushita Electric Ind Co Ltd Thermocompression bonding apparatus
US8593812B2 (en) * 2009-05-11 2013-11-26 Toyota Jidosha Kabushiki Kaisha Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
JP4808283B1 (en) * 2010-06-30 2011-11-02 株式会社新川 Electronic component mounting apparatus and electronic component mounting method
US8633423B2 (en) * 2010-10-14 2014-01-21 Applied Materials, Inc. Methods and apparatus for controlling substrate temperature in a process chamber
WO2013095362A1 (en) * 2011-12-20 2013-06-27 Intel Corporation High performance transient uniform cooling solution for thermal compression bonding process

Also Published As

Publication number Publication date
JP2014022629A (en) 2014-02-03
KR20140128380A (en) 2014-11-05
KR20150082673A (en) 2015-07-15
WO2014013764A1 (en) 2014-01-23
US20150183040A1 (en) 2015-07-02
TW201405731A (en) 2014-02-01
CN104520980B (en) 2017-07-07
TWI489598B (en) 2015-06-21
CN104520980A (en) 2015-04-15
JP5793473B2 (en) 2015-10-14
KR101559741B1 (en) 2015-10-13
US10350692B2 (en) 2019-07-16
TW201535635A (en) 2015-09-16

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