JP6176542B2 - Electronic component bonding head - Google Patents

Description

  The present invention relates to an electronic component bonding head used when electronic components are mounted on a circuit board and bonded.

  2. Description of the Related Art Conventionally, in an apparatus for mounting an electronic component on a circuit board such as a printed circuit board, various methods for joining the electrode of the electronic component held by the component holding unit and the electrode of the circuit board are used. As one of the methods capable of joining electronic components in a short time, a method of melting and joining a metal material typified by solder using head heating is known.

  In recent years, there is a method of directly mounting an electrode pad surface of an electronic component typified by flip chip mounting on a circuit board. Among these methods, solder bonding can relieve stress at the time of bonding and lower costs can be expected. Therefore, establishment of a technique for bonding fine bumps corresponding to narrow pitch is required. In the flip chip bonding method, by heating the electronic component pressed against the circuit board, the solder is melted and the self-assembly characteristics of the solder itself are utilized to electrically connect the electrode pad of the electronic component and the electrode pad of the circuit board. It becomes possible to join to.

  In order to maintain good bonding by this bonding method, in order to suppress oxidation of the solder material, a process of rapidly heating to the solder melting point and rapidly cooling becomes necessary.

  Therefore, in an electronic component bonding head that performs heating, a mechanism for rapidly heating and cooling the electronic component is indispensable.

  As a method of realizing conventional rapid heating and rapid cooling, there is a method of mounting using a ceramic heater (see, for example, Patent Document 1).

  According to Patent Document 1 shown in FIG. 10, the ceramic heater 92 is configured by the ceramic heater heating section 93 and the ceramic heater wiring section 94. Using the ceramic heater 92 having such a configuration, a mechanism for rapidly heating the ceramic heater heating section 93 and heating the electronic component 8 in a short time is provided. In the case of rapidly cooling the ceramic heater 92, the structure is established by attaching the ceramic heater 92, flowing water into the adjacent cooling block portion 91, and providing a cooling mechanism. .

Japanese Patent Laid-Open No. 2005-50835

  However, the bonding head configured in Patent Document 1 has a problem that it is difficult to reduce the size and the capacity of the ceramic heater portion is increased. Hereinafter, this factor will be described.

  First, the factors mentioned are thermal expansion during rapid heating of the ceramic itself and heat transfer to the cooling block.

  During rapid heating, the thermal expansion of the ceramic heater 92 itself is alleviated, and the thermal expansion that occurs at the connecting portion between the configured ceramic heater heating section 93 and the wiring configured inside the ceramic heater wiring section 94 is repeated. In order to prevent breakage due to stress, it is necessary to take measures such as covering the ceramic heater wiring portion 94 with ceramics, and the shape of the ceramic heater 92 is increased.

  In addition, since the temperature of the cooling block portion 91 originally provided for improving the cooling performance is low temperature and has a heat capacity, if a ceramic having good thermal conductivity is used, the heat is supplied to the cooling block portion 91 at the time of heating and heating. Escape occurs. Therefore, in order to maintain the temperature rise characteristic, the ceramic heater 92 has to have a sufficient thickness.

  When the ceramic heater 92 has a sufficient thickness as described above, the capacity of the ceramic heater 92 is increased, thereby causing a large change in thermal expansion of the ceramic heater 92 during heating and cooling. In some cases, crushing occurred and it was difficult to achieve good bonding.

  In addition, the increase in the size of the head greatly impairs the operation performance of the equipment itself, and thus the productivity deteriorates. Also, in terms of maintenance, etc., since water or the like is used, the maintenance is poor when the head is broken, and this is also a factor that greatly deteriorates productivity.

  As described above, a bonding head capable of suppressing fluctuations in thermal expansion without impairing heating efficiency is essential.

  The object of the present invention has been made in view of the above-mentioned conventional problems, and it is possible to achieve downsizing by reducing fluctuations in thermal expansion during rapid heating and rapid cooling processes required for solder joints and the like. At the same time, an electronic component bonding head capable of greatly improving productivity is provided.

In order to achieve the above object, an electronic component bonding head according to one aspect of the present invention includes a glass tool unit having a heating electrode unit for heating an electronic component,
An electronic component bonding head comprising a cooling block portion for cooling the glass tool portion,
The glass tool part is
A first glass portion on the side holding the electronic component with respect to the heating electrode portion;
With respect to the heating electrode part, a second glass part disposed on the side opposite to the side holding the electronic component and connected to the cooling block part,
The thickness of the first glass part is 0.2 to 2 mm,
The thickness of the second glass part is 1.2 to 25 times the thickness of the first glass part.

  As shown in the said aspect of this invention, a glass tool part is comprised by the 1st glass part and 2nd glass part of the said glass material which are heat conductivity and a low thermal expansion coefficient with respect to a heating electrode part. By doing so, it becomes possible to suppress the thermal expansion of the glass tool part and the escape of heat to the cooling block. That is, fluctuations in thermal expansion during the rapid heating and rapid cooling processes required for soldering and the like can be reduced, and downsizing can be realized. At the same time, productivity can be greatly improved.

  In addition, if the bonding head according to the above aspect of the present invention is used, it is possible to suppress bump crushing during bonding of electronic components and provide good bonding, and at the same time improve productivity by reducing the weight of the bonding head. It becomes possible to plan.

The front view which shows schematic structure of the electronic component mounting apparatus which concerns on embodiment of this invention Enlarged view of the vicinity of the bonding head in this embodiment Three-dimensional view of the vicinity of the glass tool part in this embodiment Enlarged view of the vicinity of the glass tool part in this embodiment Three-dimensional configuration diagram showing heating electrode wiring of the glass tool part in the present embodiment Contact plan view of the heating electrode part in this embodiment Assembly three-dimensional view of the tip of the bonding head in this embodiment Three-dimensional view of cooling flow path of cooling block portion in this embodiment Three-dimensional view of adsorption channel holding glass tool part in this embodiment Schematic three-dimensional view of conventional bonding head and ceramic heater

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

  First, a configuration of an electronic component mounting apparatus 1 having an electronic component bonding head 5 in the present embodiment will be described with reference mainly to FIG.

  FIG. 1 is a schematic front view of an electronic component mounting apparatus 1 having an electronic component bonding head 5 according to an embodiment of the present invention.

  The electronic component mounting apparatus 1 performs so-called electronic component mounting and bonding simultaneously on a circuit board 6 such as a printed circuit board, which is a fine electronic component used in a system LSI (Large Scale Integration) or the like. This is a flip chip mounting apparatus.

  The electronic component mounting apparatus 1 includes a substrate holding unit 2, a component mounting unit 3 having an electronic component bonding head 5, a component supply unit 4, and an imaging unit 11. Here, the XYZ directions are in a positional relationship orthogonal to each other.

  A component mounting unit 3 for mounting the electronic component 8 on the circuit board 6 held by the board holding unit 2 is provided on the (+ Z) direction side of the board holding unit 2, that is, on the upper side in FIG. A component supply unit 4 that supplies the electronic component 8 to the component mounting unit 3 is provided on the (−X) direction side of the substrate holding unit 2, that is, on the left side of FIG. An imaging unit 11 that captures an image of the electronic component 8 supplied to the component mounting unit 3 by the component supply unit 4 is provided between the substrate holding unit 2 and the component supply unit 4.

  The operation of the mechanism constituted by these units or units is controlled by the control unit 10, and the mounting operation is completed by mounting the electronic component 8 on the circuit board 6, thereby enabling modularization.

  Here, the configurations of the substrate holding unit 2, the component mounting unit 3, the component supply unit 4, and the imaging unit 11 will be described in detail in this order.

  First, the board holding unit 2 is a unit that holds the circuit board 6. The substrate holding unit 2 includes a stage 21 that holds the circuit board 6 on the upper surface, and a stage moving mechanism 22 that moves the stage 21 back and forth in the Y direction.

  Next, the component mounting unit 3 is a unit that mounts the electronic component 8 supplied to the component mounting unit 3 on the circuit board 6 held by the board holding unit 2. The component mounting unit 3 includes a lifting mechanism 33, a component mounting portion 31 having the electronic component bonding head 5, and a mounting portion moving mechanism 32 that moves the component mounting unit 3 forward and backward in the X direction.

  The lifting mechanism 33 is a unit that presses the electronic component 8 against the circuit board 6 via the bonding head 5. The elevating mechanism 33 is moved forward and backward in the Z direction using a motor (not shown), and has a shaft 35 to which the head support portion 34 is fixed at the lower end thereof.

  The configuration of the bonding head 5 will be described in detail later.

  Next, the component supply unit 4 is a unit that supplies the electronic component 8. The component supply unit 4 includes a component arrangement unit 41 that arranges a large number of electronic components 8 at predetermined positions in the electronic component supply tray 45, and a supply head 42 that takes out and holds the electronic components 8 one by one from the component arrangement unit 41. A supply head moving mechanism 43 that moves the supply head 42 back and forth in the X direction, and a rotation mechanism 44 that rotates and slightly raises and lowers the supply head 42.

  The electronic component supply tray 45 has a large number of electronic components 8 to be mounted on the circuit board 6, and a lower surface in a state after mounting, that is, a bonding surface on which an electrode portion to be bonded to the circuit board 6 is formed. On the other hand, it is placed in the direction opposite to the direction of mounting on the circuit board 6.

  The supply head 42 includes a supply collet 421. The supply collet 421 holds the electronic component 8 by suction using a suction port formed at the tip, and supplies the held electronic component 8 to the bonding head 5.

  The electronic component 8 includes an LED (Light Emitting Diode) chip, a semiconductor light emitting element such as a semiconductor laser, a packaged IC (Integrated Circuit), a resistor, a capacitor, a semiconductor such as a fine semiconductor bare chip, and a SAW (Surface Acoustic Wave). Any of electronic components other than semiconductors, such as a filter or a camera module, may be sufficient. In addition, the electrode part of the electronic component may have a bump bump formed of gold (Au) on the electrode pattern of the electronic component, or may be a plating bump depending on the electronic component, or the electrode pattern itself. There may be. In addition, a solder material of a bonding material may be provided on either the electrode pattern of the electronic component 8 or the electrode pattern of the circuit board 6. The circuit board 6 may be any of a circuit board formed of a resin, or a circuit board formed of a silicon or ceramic material other than a resin such as glass and semiconductor.

  The imaging unit 11 is installed immediately below the movement path of the component mounting unit 31, particularly the bonding head 5, which is moved by the mounting unit moving mechanism 32. The imaging unit 11 captures an electronic component held by the bonding head 5 from the (−Z) direction side, and mounts it on the electrode pattern position arranged on the circuit board 6 with high accuracy based on the captured information. It becomes possible.

  Here, the overall configuration of the bonding head 5 in the embodiment of the present invention will be described with reference to FIG.

  FIG. 2 is a schematic front view of the bonding head 5 in the embodiment according to the present invention.

  A shaft 35 is located at the lowermost end of the head lifting mechanism 33, and a head support portion 34 is fixed to the lower end of the shaft 35. The bonding head 5 is connected to the lower end of the head support portion 34. As shown in FIG. 2, the bonding head 5 is fixed to the lower portion of the head support portion 34 by bolts 61, and is attached to the upper mounting portion moving mechanism 32 via the lifting mechanism 33. The bonding head 5 is composed of a rectangular plate-shaped glass tool part 51 having a heating electrode that can adsorb and heat the electronic component 8 and a rectangular cooling block part 52. The upper surface of the cooling block 52 is fixed to the lower part of the head support 34, and the electronic component adsorption flow path 521 is provided in the central portion so as to penetrate in the vertical direction. The electronic component suction channel 521 is connected to a suction device (not shown). The glass tool part 51 is fixed to the lower end surface of the cooling block part 52, communicates with the electronic part suction flow path 521 and penetrates in the vertical direction, and an electronic part suction hole 514 is provided in the central part.

  For the connection between the glass tool part 51 and the cooling block part 52, an adhesive layer may be used, or vacuum suction using the flatness of the glass tool part 51 may be used.

  Using the above-described configuration, the bonding head 5 that sucks the electronic component 8 through the electronic component suction hole 514 of the glass tool unit 51 connected to the electronic component suction flow path 521 of the cooling block unit 52 and sucks the electronic component 8 is connected to the circuit board 6. Is moved up and down relatively by the lifting mechanism 33.

  FIG. 3 shows a three-dimensional view of the glass tool part 51 and the cooling block part 52.

  The cooling block unit 52 is provided with a cooling block cooling channel 522 that cools by flowing air in the lateral direction, and a glass tool adsorption channel 523 along the vertical direction for adsorbing and holding the glass tool unit 51. In addition, a plurality of thread mounting screw holes 524 are provided so as to be connectable to the head support 34 which is the upper unit.

  Regarding the shape of the glass tool 51 and the electronic component adsorption flow path 521, the cooling block cooling flow path 522, and the glass tool adsorption flow path 523 applied to the cooling block section 52, the best mode will be exemplified later. However, it will be described in detail.

  Next, the glass tool part 51 in the embodiment according to the present invention will be described in detail with reference to FIG.

  The glass tool unit 51 is disposed on the side opposite to the side that holds the electronic component 8 and is in contact with the cooling block unit 52, a heating block contact unit 511, a heating electrode unit 512, an electronic component contact unit 513, Are stacked from top to bottom. The heating electrode portion 512 is configured to be sandwiched between the cooling block contact portion 511 and the electronic component contact portion 513. The electronic component 8 is held on the lower surface of the electronic component contact portion 513. The electronic component contact part 513 functions as an example of a first glass part, and the cooling block contact part 511 functions as an example of a second glass part.

  Further, the thickness T1 of the electronic component contact portion 513 and the thickness T2 of the cooling block contact portion 511 will be described below while showing the characteristics.

As a material constituting the glass tool portion 51, for example, quartz glass that can suppress thermal expansion that occurs when the electronic component 8 is heated can be used. The coefficient of thermal expansion of quartz glass is 0.65 × 10 ⁻⁶ / K compared to 8.0 × 10 ⁻⁶ / K compared to the alumina-based ceramic mainly used in ceramics. The thermal effect can be minimized by 1/12. Actually, when the ceramic heater 92 is used, the thickness of the ceramic heater is about 10 μm when heated at 300 ° C. with respect to the thickness of 5 mm. Therefore, when the glass tool portion 51 having the same thickness is used, the fluctuation can be suppressed to 1 μm or less. It becomes possible.

  However, on the other hand, since the thermal conductivity is poor, there is a problem that the electronic component 8 must be heated by radiating the heat generated by the heating electrode portion 512.

  Therefore, the electronic component mounting apparatus according to the embodiment of the present invention solves the above problem by using the following structure.

  The best mode of the thickness T1 of the electronic component contact portion 513 and the thickness T2 of the cooling block contact portion 511 will be described below using the configuration diagram shown in FIG.

  The thickness T1 of the electronic component contact portion 513 is the most important factor for the performance of the electronic component 8 during heating.

  When a glass material is used, it must be designed so as not to greatly lose the stress and heating characteristics at the time of thermal expansion caused by the heating electrode portion 512 generating heat. Considering the Young's modulus of the glass, if the thickness T1 of the electronic component contact portion 513 is calculated so that the electronic component contact portion 513 is not damaged by the stress at the time of heating up to 300 ° C., a thickness of 0.2 mm or more is required. Become.

  Further, if the thickness T1 of the electronic component contact portion 513 is excessively increased, the temperature rise performance is greatly impaired. Therefore, in the solder joint according to the present embodiment, the temperature rise performance of about 300 ° C. is indispensable for 1 s or less. It is desirable to be configured as follows. As described above, the electronic component contact portion 513 on the suction side of the electronic component 8 is configured to be thin, so that the electronic component 8 can be rapidly heated by the radiant heat of the heating electrode portion 512.

  In addition, the thickness T2 of the cooling block contact portion 511 is desirably 1.2 times or more the thickness T1 of the electronic component contact portion 513. This is in order to relieve the stress that the electronic component contact part 513 receives during heating, considering the case where the rate at which heat is taken away by the upper cooling block part 52 reaches 300 ° C. in 1 s as described above, It can obtain | require in consideration of the thermal shock property of glass from a thermal expansion coefficient.

  Further, when the thickness T2 of the cooling block contact portion 511 is increased, a sufficient strength can be secured against the stress of the electronic component contact portion 513, but in order to maximize the cooling performance of the cooling block portion, Since the thermal conductivity of the glass itself is about 1.4 W / (m · K), the cooling performance of the cooling block contact portion 511 can be ensured if the thickness T1 of the electronic component contact portion 513 is 25 times or less. Become.

  Next, the whole wiring pattern of the heating electrode portion 512 will be described with reference to FIG.

  As for the wiring pattern of the heating electrode portion 512 constituting the glass tool portion 51, as shown in FIG. 5, the electronic component suction hole 514 is avoided so that the electronic component 8 can be mounted while being sucked during heating. It is configured. In other words, the glass tool unit 51 includes a first region in which the suction holes 514 for sucking the electronic component 8 are disposed, and a second region in which the wiring pattern of the heating electrode unit 512 is disposed in a region different from the first region. And having a region. The first region corresponds to the area B of the glass bonding portion 5121 of the cooling block contact portion 511 and the electronic component contact portion 513 in FIG. The second region corresponds to the heating electrode portion 512 itself of FIG. 6, that is, the portion of the wiring area A of the heating electrode portion 512. If comprised in this way, the shape which can ensure a sufficient area is desirable so that the joining strength of the glass materials of the electronic component contact part 513 and the cooling block contact part 511 can be maintained.

  Next, the relationship between the wiring area A of the heating electrode portion 512 and the area B of the glass joint portion 5121 between the cooling block contact portion 511 and the electronic component contact portion 513 will be described with reference to FIG.

  In order to keep the thermal shock resistance strong, the wiring area A of the heating electrode part 512 is less than the cross-sectional area B of the glass joint part 5121 where the electronic component contact part 513 and the cooling block contact part 511 are joined by sintering. It is desirable to configure so as to be designed. That is, it is desirable that the area A ≦ the area B.

  The heating electrode portion 512 extends in the longitudinal direction of the wiring pattern during heating. In order to relieve the stress on the glass tool portion 51 against this elongation, it is desirable to take into account the area as described above in order to adopt a structure in which the electrode extends in one direction and perform sufficient stress relaxation. Therefore, by adopting the above-described structure, breakage due to heating is greatly suppressed, and it becomes possible to dramatically improve thermal shock resistance.

  Moreover, it is desirable that the glass joint portion 5121 between the cooling block contact portion 511 and the electronic component contact portion 513 has a sintered structure that is joined by heat sintering performed under vacuum. This is because the same kind of material can be bonded with high strength and it is difficult to leave a residual stress for the shape processing.

  Hereinafter, the most effective shape and detailed structure of the bonding head 5 in the embodiment of the present invention will be described with reference to FIGS.

  FIG. 7 shows the above-described three-dimensional view. The glass tool part 51 has, for example, a male fitting part 515 that is tapered upward in the upper part. The cooling block portion 52 is formed with a female fitting portion 525 corresponding to the shape of the male fitting portion 515 at the lower portion thereof. That is, the male fitting portion 515 is provided with a fitting convex portion 515a protruding in the + Z direction (upward) at the center portion in the X direction so as to extend along the Y direction. Is provided with a fitting recess 525a recessed in the + Z direction (upward) at the center in the X direction so as to extend along the Y direction. The fitting convex portion 515a can be fitted into the fitting concave portion 525a and can move along the Z direction and the Y direction in the fitted state, but cannot move along the X direction. The male fitting part 515 is vacuum-sucked by a suction groove 526 (see FIG. 9 described later) provided in the female fitting part 525 and fixed to the female fitting part 525. Further, the connection between the male fitting portion 515 and the female fitting portion 525 may be a structure using an adhesive layer or the like instead of vacuum suction.

  By adopting such a shape, even if a difference in thermal expansion occurs in the glass tool part 51, the glass thickness T2 of the cooling block contact part 511 located above the heating electrode part 512 is thick, so that the thermal expansion is reduced as much as possible. Furthermore, since it is possible to escape in the Z direction (up and down direction), even if the heating temperature is set to a high temperature against the stress in the Z direction due to the thermal expansion of the glass tool part 51 itself, a structure that does not break is provided. can do.

  In addition, as shown in FIG. 7, in the fitted state of the fitting convex portion 515a and the fitting concave portion 525a, it can move along the Y direction but cannot move along the X direction. Due to such a configuration, if the longitudinal direction of the wiring pattern of the heating electrode portion 512 is the Y direction, the cooling block portion 52 can be prevented from being restricted in the Y direction. Accordingly, it is possible to make it difficult for stress to the elongation of the glass tool part 51 in the Y direction to occur during heating, and the glass tool part 51 is not damaged.

  In FIG. 8, the cooling block cooling flow path 522 and the electronic component suction flow path 521 that are configured in the cooling block portion 52 are three-dimensionally illustrated. The electronic component suction channel 521 indicates that the electronic component suction channel 521 is connected to the electronic component suction hole 514 of the glass tool unit 51.

  As shown in FIG. 8, the cooling block cooling flow path 522 is disposed in a lateral direction in a C shape so as to surround three sides of the electronic component suction flow path 521 at the center. By configuring in this way, the internal volume of the cooling block portion 52 can be reduced and the cooling block cooling flow path 522 can be secured long, so that the cooling block portion 52 can be cooled as a whole and more efficiently cooled. become able to. By adopting the above-described structure, it is possible to make the cooling block 52 smaller.

  Further, in FIG. 9, a path between the rectangular suction groove 526 that sucks the glass tool part 51 and the glass tool suction flow path 523 is shown, and is relative to the electronic component suction hole 514 provided in the glass tool part 51. Indicates the position. The rectangular suction groove 526 is provided on the lower end surface of the female fitting portion 525, that is, the bottom surface of the fitting recess 525a, and is connected to a suction device (not shown) via the glass tool suction passage 523.

  As for the glass tool part 51, the surface where the cooling block part 52 and the glass tool part 51 are combined is polished by setting the surface 51a in contact with the cooling block part 52 as the upper surface of the fitting convex part 515a as shown in FIG. Can be processed. Due to such a configuration, it becomes possible to maintain the flatness of the surface (the upper surface of the fitting convex portion 515a) 51a in contact with the cooling block portion 52 with high accuracy, and the suction between the cooling block portion 52 and the glass tool portion 51. A structure that improves power is possible.

  The holding force of the glass tool part 51 can be maintained by providing the suction groove 526 in a thin and rectangular frame shape (b-shaped) on the bottom surface of the fitting recess 525a facing the flat surface 51a. Become.

  Further, in the case where the cooling block 52 is provided with a suction groove 526 and the like, and the cooling block 52 and the glass tool 51 are sucked and held, the size or the electronic component is selected according to the size or type of the electronic component 8. It becomes possible to make it the structure which replaces | exchanges with the glass tool part 51 from which the position or number of the suction holes 514 differ, and the position alignment at the time of replacement | exchange etc. can be simplified.

  The detailed configuration of the bonding head 5 has been described above.

  When all the necessary electronic components 8 including the mounting operation as described above are mounted on the circuit board 6, the mounting operation ends.

  It should be noted that the mathematical terms such as parallel include cases where the term is substantially parallel as long as there is no hindrance in achieving these functions, in addition to the case where the terms are strictly parallel.

  Of course, the present invention is not limited to the above-described embodiments, and various modifications are possible.

  According to the embodiment of the present invention, the glass electrode part 51 having the heating electrode part 512 is provided at the tip of the bonding head 5, and the electronic part contact part 513 on the side that sucks the electronic part 8 is configured to be thin. Fast heating can be performed by the radiant heat of the portion 512. On the other hand, by making the thickness T2 of the cooling block contact portion 511 having the surface connected to the cooling block portion 52 larger than the thickness T1 of the electronic component contact portion 513 that sucks the electronic component 8, the cooling performance and the thermal shock of the glass The structure which improves property can be provided.

  If comprised in this way, it will become possible to suppress the thermal expansion of the glass tool part 51, and the escape of the heat | fever to a cooling block. That is, it is possible to reduce fluctuations in thermal expansion during the rapid heating and rapid cooling processes required for solder bonding and the like, and it is possible to stabilize the bonding and to reduce the size of the bonding head 5. At the same time, productivity can be greatly improved.

  That is, with the above-described configuration, it is possible to suppress the thermal expansion of the tool tip, improve both thermal shock resistance by high-speed heating and cooling, and reduce the size of the bonding head 5 by simplifying the mechanism, and provide improved productivity. it can.

  In addition, if the bonding head 5 having the above-described configuration is used, it is possible to suppress bump crushing at the time of bonding the electronic component 8 and provide good bonding, and at the same time, increase the productivity by reducing the weight of the bonding head 5. It becomes possible to plan.

  In other words, by providing the electronic component bonding head 5 having the glass tool portion 51 having the above-described configuration using the heating electrode portion 512, the thermal expansion of the head heating at the time of bonding does not depend on the size of the electronic component 8 or the like. Can be minimized, and stable bonding can be provided while maintaining the quality for a very long time.

  Therefore, the bonding head, the electronic component mounting apparatus, and the bonding head manufacturing method according to the embodiment of the present invention can perform higher-quality bonding, and are useful, for example, for mounting an electronic component on a circuit board. It is.

  In addition, it can be made to show the effect which each has by combining arbitrary embodiment or modification of the said various embodiment or modification suitably. In addition, combinations of the embodiments, combinations of the examples, or combinations of the embodiments and examples are possible, and combinations of features in different embodiments or examples are also possible.

  The electronic component bonding head according to the present invention can achieve downsizing, and at the same time, can greatly improve productivity, and can produce semiconductor light emitting devices, other semiconductor bare chips, and other types of electronic components. 1 can be joined by melting solder, and can be used for an electronic component mounting apparatus mounted on a circuit board.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Board | substrate holding | maintenance part 21 Stage 22 Stage moving mechanism 3 Component mounting unit 31 Component mounting part 32 Mounting part moving mechanism 33 Lifting mechanism 34 Head support part 35 Shaft 4 Component supply part 41 Component arrangement part 42 Supply head 421 Supply Collet 43 Supply head moving mechanism 44 Rotating mechanism 45 Electronic component supply tray 5 Bonding head 51 Glass tool portion 51a Surface 511 in contact with cooling block portion Cooling block contact portion 512 Heating electrode portion 5121 Glass bonding portion 513 Electronic component contact portion 514 Electronic component Suction hole 515 Male fitting part 515a Fitting convex part 52 Cooling block part 521 Electronic component adsorption flow path 522 Cooling block cooling flow path 523 Glass tool adsorption flow path 524 Mounting screw hole part 525 Female mold fitting part 525a Fitting concave part 526 Suction groove 6 Circuit board 61 Bolt 8 Electronic component 91 Cooling block unit 92 Ceramic heater 93 Ceramic heater heating unit 94 Ceramic heater wiring unit 10 Control unit 11 Imaging unit

Claims (4)

A glass tool part having a heating electrode part for heating an electronic component;
An electronic component bonding head comprising a cooling block portion for cooling the glass tool portion,
The glass tool part is
A first glass portion on the side holding the electronic component with respect to the heating electrode portion;
With respect to the heating electrode part, a second glass part disposed on the side opposite to the side holding the electronic component and connected to the cooling block part,
The thickness of the first glass part is 0.2 to 2 mm,
The thickness of the second glass part is 1.2 to 25 times the thickness of the first glass part.
Electronic component bonding head. The wiring pattern of the heating electrode part configured in the glass tool part is arranged so as to avoid a suction hole that sucks the electronic component,
The electronic component bonding head according to claim 1.   3. The electronic component bonding head according to claim 1, wherein a wiring area of the heating electrode portion is equal to or less than an area of a bonding portion for sintering and bonding the first glass portion and the second glass portion.   The surface of the said glass tool part and the said cooling block part contacts is provided with the adsorption | suction groove | channel, and the surface of the said glass tool part is adsorb | sucked, and is fixed to the said cooling block part. The electronic component bonding head according to one.

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