KR20160125880A - Electronic component bonding head - Google Patents

Electronic component bonding head Download PDF

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Publication number
KR20160125880A
KR20160125880A KR1020160028108A KR20160028108A KR20160125880A KR 20160125880 A KR20160125880 A KR 20160125880A KR 1020160028108 A KR1020160028108 A KR 1020160028108A KR 20160028108 A KR20160028108 A KR 20160028108A KR 20160125880 A KR20160125880 A KR 20160125880A
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South Korea
Prior art keywords
electronic component
glass
cooling block
heating
bonding
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KR1020160028108A
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Korean (ko)
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KR101764055B1 (en
Inventor
히로시 에비하라
다카유키 히로세
Original Assignee
파나소닉 아이피 매니지먼트 가부시키가이샤
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Publication of KR20160125880A publication Critical patent/KR20160125880A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Wire Bonding (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

[PROBLEMS] To provide an electronic part bonding head capable of realizing miniaturization by reducing the thermal expansion fluctuation during the process of rapid heating and rapid cooling, and at the same time capable of greatly improving productivity.
The electronic component bonding head includes an electronic component bonding portion 51 having a glass tool portion 51 having a heating electrode portion 512 for heating the electronic component 8 and a cooling block portion 52 for cooling the glass tool portion, As the head, the glass tool portion has a first glass portion 513 for holding the electronic component with respect to the heating electrode portion, and a second glass portion 513 disposed on the opposite side of the heating electrode portion from the side for holding the electronic component, The thickness T1 of the first glass portion is 0.2 to 2 mm and the thickness T2 of the second glass portion is 1.2 to 25 times the thickness of the first glass portion.

Description

[0001] ELECTRONIC COMPONENT BONDING HEAD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component bonding head used for attaching and bonding electronic components to a circuit board.

BACKGROUND ART Conventionally, in an apparatus for mounting an electronic component on a circuit board such as a printed circuit board, various methods of bonding an electrode of an electronic component held in the component holding portion to an electrode of a circuit board have been used. As a method for bonding electronic components in a short time, there is known a method of melting and bonding a metal material typified by solder by using head heating.

In recent years, there has been a method of directly mounting an electrode pad surface of an electronic component typified by flip chip mounting onto a circuit board. Among such methods, the solder bonding can relieve the stress at the time of bonding and can reduce the cost, and therefore it is required to establish the bonding technique of the fine bumps corresponding to the narrow pitch. In the flip chip bonding method, the solder is melted by heating the pressed electronic component to the circuit board, and the electrode pad of the electronic component and the electrode pad of the circuit board are electrically connected to each other Lt; / RTI >

In order to maintain good bonding in this joining method, in order to suppress the oxidation of the brazing material, a process of rapidly heating to the melting point of the solder and rapidly cooling it is required.

For this reason, in an electronic component bonding head for performing heating, a mechanism for rapidly heating and cooling electronic components becomes indispensable.

As a method for realizing the conventional rapid heating and rapid cooling, there is a method of mounting using a ceramic heater (see, for example, Patent Document 1).

According to the Patent Document 1 shown in Fig. 10, the ceramic heater 92 is composed of the ceramic heater heating portion 93 and the ceramic heater wiring portion 94. The ceramic heater 92 having such a configuration is used to provide a mechanism for rapidly heating the ceramic heater heating section 93 to heat the electronic component 8 in a short time. In the case of rapidly cooling the ceramic heater 92, a ceramic heater 92 is provided and a mechanism for cooling water by flowing water inside the cooling block 91 is provided to establish the above process Structure.

(Prior art document)

(Patent Literature)

(Patent Document 1) Japanese Patent Laid-Open No. 2005-50835

However, the bonding head constructed in Patent Document 1 has a problem that it is difficult to downsize and the capacity of the ceramic heater portion becomes large. This factor will be described below.

First of all, factors that may be mentioned are the thermal expansion of the ceramic itself during rapid heating and the heat transfer to the cooling block.

The thermal expansion of the ceramic heater 92 itself is relieved and the thermal expansion occurring in the connecting portion of the wiring formed inside the ceramic heater wiring portion 94 and the ceramic heater heating portion 93 It is necessary to take measures such as covering the base of the ceramic heater wiring portion 94 with ceramics in order to prevent breakage due to the repeated stress and the shape of the ceramic heater 92 becomes large.

Since the cooling block 91 provided for enhancing the cooling performance inherently has a low temperature and a high heat capacity, if a ceramic having good thermal conductivity is used, the loss of heat to the cooling block 91 Lt; / RTI > Therefore, in order to maintain the temperature rise characteristic, the ceramic heater 92 must be made to have a sufficient thickness.

When the ceramic heater 92 has a sufficient thickness, the capacity of the ceramic heater 92 increases, thereby causing a large change in thermal expansion of the ceramic heater 92 at the time of heating and cooling, and the distortion of the fine solder bumps during the bonding process And it is difficult to perform good bonding in some cases.

In addition, since the size of the head largely deteriorates the operation performance of the equipment itself, the productivity is deteriorated. In addition, maintenance and the like also use water or the like, which deteriorates the maintainability of the head when the head is broken, and also causes a significant deterioration in productivity.

As described above, a bonding head capable of suppressing the thermal expansion fluctuation without deteriorating the heating efficiency becomes indispensable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to reduce the thermal expansion fluctuation during the rapid heating and rapid cooling processes required for solder bonding and the like, The present invention provides an electronic component bonding head which can greatly improve the reliability of the electronic component bonding head.

In order to achieve the above object, an electronic component bonding head according to one aspect of the present invention includes an electronic component bonding head having a glass tool portion having a heating electrode portion for heating an electronic component, and a cooling block portion for cooling the glass tool portion, Wherein the glass tool portion has a first glass portion for holding the electronic component with respect to the heating electrode portion and a second glass portion for holding the electronic component with respect to the heating electrode portion, Wherein the thickness of the first glass part is 0.2 to 2 mm and the thickness of the second glass part is 1.2 to 25 times the thickness of the first glass part.

As shown in the above embodiment of the present invention, by forming the glass tool part with the glass material having the low thermal conductivity and thermal expansion coefficient with respect to the heating electrode part and the first glass part and the second glass part having the above thickness, And the loss of heat to the cooling block can be suppressed. In other words, it is possible to reduce the thermal expansion fluctuation during the process of rapid heating and rapid cooling required for solder bonding and the like, thereby realizing miniaturization, and at the same time, productivity can be greatly improved.

Further, by using the bonding head of the embodiment of the present invention, it is possible to suppress bump distortion at the time of bonding electronic components, to provide good bonding, and at the same time to improve the productivity by reducing the weight of the bonding head .

1 is a front view showing a schematic structure of an electronic component mounting apparatus according to an embodiment of the present invention;
2 is an enlarged view of the vicinity of the bonding head in the present embodiment.
3 is a three-dimensional view of the vicinity of the glass tool portion in this embodiment.
4 is an enlarged view of the vicinity of the glass tool part in the present embodiment.
Fig. 5 is a three-dimensional configuration diagram showing the heating electrode wiring of the glass tool portion in this embodiment. Fig.
6 is a plan view of the contact of the heating electrode portion in this embodiment.
Fig. 7 is an assembled three-dimensional view of the bonding head front end portion in this embodiment. Fig.
8 is a three-dimensional view of the cooling flow path of the cooling block portion in this embodiment.
Fig. 9 is a three-dimensional view of an adsorption flow path for holding a glass tool portion according to the embodiment; Fig.
10 is a schematic three-dimensional view of a conventional bonding head and a ceramic heater.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

First, the configuration of an electronic component mounting apparatus 1 having an electronic component bonding head according to the present embodiment will be described with reference mainly to Fig.

1 is a schematic front view of an electronic component mounting apparatus 1 having an electronic component bonding head according to an embodiment of the present invention.

The electronic component mounting apparatus 1 has a structure in which fine electronic components used in a system LSI (Large Scale Integration) or the like are mounted on a circuit board 6 such as a printed board as an object at the same time, Mounting device.

The electronic component mounting apparatus 1 includes a substrate holding section 2, a component mounting unit 3 having a bonding head 5, a component supply section 4, and an image pickup section 11. Here, the XYZ directions are orthogonal to each other.

A component mounting unit 3 for mounting the electronic component 8 on the circuit board 6 held on the substrate holding portion 2 is provided on the (+ Z) side of the substrate holding portion 2, ). On the (-X) direction side of the substrate holder 2, that is, on the left side in Fig. 1, a component supply unit 4 for supplying the electronic component 8 to the component mounting unit 3 is provided. Between the substrate holding section 2 and the component supply section 4 is provided an image pickup section 11 for picking up an electronic component 8 supplied to the component mounting unit 3 by the component supply section 4. [

The mechanisms constituted by these units or units are controlled by the control unit 10 and mounting of the electronic components 8 to the circuit board 6 is performed to complete the mounting operation and enable the module to be modularized.

Here, the configurations of the substrate holding unit 2, the component mounting unit 3, the component supplying unit 4, and the image pickup unit 11 will be described in detail in this order.

First, the substrate holding portion 2 is a unit for holding the circuit board 6. [ The substrate holding section 2 includes a stage 21 for holding the circuit board 6 on its upper surface and a stage moving mechanism 22 for moving the stage 21 in the Y direction.

Next, the component mounting unit 3 is a unit for mounting the electronic component 8 supplied to the component mounting unit 3 to the circuit board 6 held by the board holding portion 2. [ The component mounting unit 3 includes a component mounting portion 31 having a lifting mechanism 33 and a bonding head 5 and a mounting portion moving mechanism 32 for moving the component mounting unit 3 in the X direction have.

The lifting mechanism 33 is a unit that presses the electronic component 8 against the circuit board 6 with the bonding head 5 therebetween. The lifting mechanism 33 has a shaft 35 which is moved forward and backward in the Z direction by using a motor (not shown), and a head supporting portion 34 is fixed to the lower end thereof.

The configuration of the bonding head 5 will be described later in more detail.

Next, the component supply unit 4 is a unit for supplying the electronic component 8. [ The component supplying portion 4 includes a component placing portion 41 for placing a plurality of electronic components 8 at a predetermined position in the electronic component supplying tray 45 and a component placing portion 41 for holding the electronic component 8 from the component placing portion 41 A supply head moving mechanism 43 for moving the supply head 42 in the X direction to move back and forth and a rotating mechanism 44 for rotating and slightly moving the supply head 42 Respectively.

A plurality of electronic components 8 to be mounted on the circuit board 6 are mounted on the lower surface of the electronic component supply tray 45 in the post-mounting state, that is, And is mounted in a direction opposite to the direction in which the circuit board 6 is mounted.

The supply head 42 is provided with a supply collet 421. The supply collet 421 holds the electronic component 8 by suction using a suction port formed at the tip end and supplies the retained electronic component 8 to the bonding head 5.

The electronic component 8 may be a semiconductor light emitting device such as an LED (Light Emitting Diode) chip or a semiconductor laser, a packaged IC (Integrated Circuit), a semiconductor such as a resistor, a capacitor, ) Filter, or an electronic component other than a semiconductor such as a camera module. The electrode portion of the electronic component may have a protruding bump formed of gold (Au) on the electrode pattern of the electronic component, or may be a plating bump or the like, depending on the electronic component, or may be the electrode pattern itself. The solder material of the bonding material may be provided on either the electrode pattern of the electronic component 8 or the electrode pattern of the circuit board 6. [ The circuit board 6 may be a circuit board formed of resin, or a circuit board formed of a material other than resin such as glass and semiconductor, such as silicon or ceramic.

The imaging section 11 is provided just below the moving path of the component mounting section 31, particularly the bonding head 5, which is moved by the mounting section moving mechanism 32. The imaging section 11 picks up an electronic component held by the bonding head 5 from the (-Z) direction side, and based on the sensed information, positions the electrode pattern arranged on the circuit board 6 with high precision It becomes possible to mount it.

Here, the bonding head 5 in the above embodiment of the present invention will be schematically described with reference to Fig. 2 as a whole.

2 is a schematic front view of the bonding head 5 in the embodiment related to the present invention.

A shaft 35 is positioned at the lowermost end of the lifting mechanism 33 and a head support 34 is fixed at the lower end of the shaft 35. [ The bonding head 5 is connected to the lower end of the head supporting portion 34. 2, the bonding head 5 is fixed to the lower portion of the head supporting portion 34 by the bolt 61, and is mounted to the upper mounting portion moving mechanism 32 through the lifting mechanism 33 . The bonding head 5 is constituted by a rectangular glass plate tool portion 51 having a heating electrode capable of absorbing and heating the electronic component 8 and a cooling plate portion 52 having a rectangular plate shape . The upper surface of the cooling block portion 52 is fixed to the lower portion of the head supporting portion 34, and the electronic component suction passage 521 penetrates in the vertical direction and is provided at the center portion. The electronic component suction path 521 is connected to a suction device (not shown). The glass tool portion 51 is fixed to the lower end surface of the cooling block portion 52 and communicates with the electronic component suction passage 521 and penetrates in the vertical direction to provide an electronic component suction hole 514 at the center.

As for the connection of the glass tool portion 51 and the cooling block portion 52, an adhesive layer or vacuum adsorption using the flatness of the glass tool portion 51 may be used.

The electronic component 8 is sucked by the electronic component sucking hole 514 of the glass tool portion 51 connected to the electronic component sucking path 521 of the cooling block portion 52 and the electronic component 8 are relatively lifted and lowered by the lifting mechanism 33 with respect to the circuit board 6. [

Fig. 3 shows a stereoscopic view of the glass tool part 51 and the cooling block part 52. Fig.

The cooling block portion 52 is provided with a cooling block cooling flow path 522 for cooling by flowing air in the lateral direction and a glass tool absorption path 523 along the up and down direction for adsorbing and holding the glass tool portion 51 And a plurality of mounting screw hole portions 524 are provided so as to be connectable to the head supporting portion 34 which is an upper unit.

The shape of the glass tool portion 51 and the electronic component suction path 521, the cooling block cooling path 522 and the glass tool suction path 523 provided in the cooling block portion 52 will be hereinafter referred to as the best Will be described in detail while exemplifying its shape.

Next, the glass tool portion 51 in the embodiment related to the present invention will be described in detail with reference to Fig.

The glass tool portion 51 includes a cooling block contact portion 511 disposed on the side opposite to the side where the electronic component 8 is held and in contact with the cooling block portion 52, a heating electrode portion 512, The electronic component contact portion 513 is formed by stacking from top to bottom. The heating electrode portion 512 is configured to be sandwiched between the cooling block contacting portion 511 and the electronic component contacting portion 513. [ On the lower surface of the electronic component contact portion 513, the electronic component 8 is held. The electronic component contact portion 513 functions as an example of the first glass portion and the cooling block contact portion 511 functions as an example of the second glass portion.

The thickness T1 of the electronic component contacting portion 513 and the thickness T2 of the cooling block contacting portion 511 will be described below while showing their characteristics.

As the material constituting the glass tool portion 51, for example, quartz glass which can suppress the thermal expansion which occurs when the electronic component 8 is heated can be used. Since the thermal expansion coefficient of quartz glass is 0.65 x 10 < -6 > / K with respect to 8.0 x 10 < -6 > / K as compared with the alumina ceramics mainly used as ceramics, the coefficient of thermal expansion becomes 1/12, It is possible to minimize the influence of heat. Actually, when the ceramic heater 92 is used, since the thickness of the ceramic heater is increased by about 10 mu m when heated at 300 DEG C with respect to the thickness of 5 mm, the glass tool portion 51 having the same thickness is used, Can be suppressed.

On the other hand, however, since the heat conductivity is poor, there is a problem that the electronic part 8 must be heated by radiating the heat of the heating electrode part 512.

Therefore, an electronic component mounting apparatus according to an embodiment of the present invention solves the above problems by using the following structure.

Best mode for the thickness T1 of the electronic component contacting portion 513 and the thickness T2 of the cooling block contacting portion 511 will be described below using the constitution diagram shown in Fig.

The thickness T1 of the electronic component contacting portion 513 is the most important factor for the performance of the electronic component 8 when heated.

In the case of using a glass material, the heating electrode portion 512 must be designed so as not to significantly lose stress and heating characteristics at the time of thermal expansion due to heat generation. When the thickness T1 of the electronic component contacting portion 513 is calculated so as to prevent the electronic component contacting portion 513 from being damaged by the stress at the time of heating up to 300 deg. C in consideration of the Young's modulus of the glass, a thickness of 0.2 mm or more is required.

In addition, since the temperature rise property is greatly deteriorated by making the thickness T1 of the electronic component contact portion 513 too large, in the solder bonding according to the present embodiment, the temperature rise of about 300 deg. . As described above, by making the electronic part contacting portion 513 on the side of suctioning the electronic part 8 thin, it is possible to raise the temperature of the electronic part 8 at high speed with the radiant heat of the heating electrode part 512. [

The thickness T2 of the cooling block contact portion 511 is preferably 1.2 times or more of the thickness T1 of the electronic component contact portion 513. This is for the purpose of alleviating the stress that the electronic component abutting portion 513 heats during heating, and considering the case where the speed at which heat is taken by the upper cooling block portion 52 reaches the above-mentioned 1s to 300 占 폚, And the thermal shock resistance of the glass.

When the thickness T2 of the cooling block contact portion 511 is increased, sufficient strength can be secured against the stress of the electronic component contact portion 513. However, in order to maximize the cooling performance of the cooling block portion, The cooling performance of the cooling block contact portion 511 can be ensured if the thickness T1 of the electronic component contact portion 513 is 25 times or less than the thickness T1 of the electronic component contact portion 513 because the thermal conductivity is about 1.4 W /

Next, with reference to Fig. 5, the wiring pattern of the heating electrode unit 512 will be described entirely by using a three-dimensional view.

5, the wiring pattern of the heating electrode portion 512 constituting the glass tool portion 51 is provided with an electronic component suction hole 514 so that the electronic component 8 can be mounted while being heated, As shown in FIG. In other words, the glass tool portion 51 is a region different from the first region in which the electronic component sucking hole 514 for sucking the electronic component 8 is disposed and the first region in which the wiring of the heating electrode portion 512 And a second region in which a pattern is disposed. The first area corresponds to the area B of the glass block portion 5121 of the cooling block contact portion 511 and the electronic component contact portion 513 in Fig. The second region corresponds to the portion of the wiring electrode area A of the heating electrode portion 512 itself, that is, the heating electrode portion 512 in Fig. With such a configuration, it is preferable that a shape capable of securing a sufficient area so as to maintain the bonding strength of the frit materials of the electronic part contacting portion 513 and the cooling block contacting portion 511 is preferable.

Next, the relationship between the wiring area A of the heating electrode part 512 and the area B of the glass joint part 5121 of the cooling block abutment part 511 and the electronic part abutment part 513 will be described with reference to Fig.

It is preferable that the wiring area A of the heating electrode portion 512 is set to be equal to or smaller than the cross sectional area B of the glass bonding portion 5121 bonded by sintering the electronic component contact portion 513 and the cooling block contact portion 511 It is desirable to design it so that it is designed. That is, it is preferable that the area A ≤

The heating electrode portion 512 extends in the longitudinal direction of the wiring pattern at the time of heating. In order to relieve the stress to the glass tool portion 51 with respect to the elongation, it is preferable to adopt a structure in which the electrodes extend in one direction and consider the area as described above in order to sufficiently relax the stress. Therefore, by adopting the above structure, breakage due to heating can be greatly suppressed, and thermal shock resistance can be dramatically improved.

It is preferable that the cooling block contacting portion 511 and the glass bonding portion 5121 of the electronic component contacting portion 513 are made of a sintered structure which is bonded by heat sintering under vacuum. This is because homogeneous materials can be bonded with high strength, and it is difficult to leave a residual stress in comparison with the shape processing.

Hereinafter, the shape and detailed structure of the bonding head 5 most effective in the embodiment of the present invention will be described with reference to Figs. 7 to 9. Fig.

7 is the stereoscopic view described above. The glass tool portion 51 has, for example, a convex engagement portion 515 which is tapered toward the upper side. In the cooling block portion 52, a concave engaging portion 525 corresponding to the shape of the convex engaging portion 515 is formed at a lower portion thereof. That is, the convex engagement portion 515 is provided by extending the engaging convex portion 515a projecting in the + Z direction (upward direction) along the Y direction at the central portion in the X direction, while the concave engaging portion 525, An engaging concave portion 525a concaved in the + Z direction (upward direction) is provided along the Y direction at the central portion in the X direction. The engaging convex portion 515a is engageable with the engaging concave portion 525a and is movable along the Z direction and the Y direction in the engaged state, but is not movable along the X direction. The convex engagement portion 515 is vacuum-sucked by the suction groove 526 (see FIG. 9 described later) provided in the concave engagement portion 525 and is fixed to the concave engagement portion 525. The convex engagement portion 515 and the concave engagement portion 525 may be connected by a structure using an adhesive layer or the like instead of vacuum adsorption.

By adopting such a shape, even if a difference in thermal expansion occurs in the glass tool portion 51, since the glass thickness T2 of the cooling block abutting portion 511 located at the upper portion of the heating electrode portion 512 is thick, the thermal expansion is considerably small It is possible to avoid the stress in the Z direction (up and down direction), thereby providing a structure that is not damaged even if the heating temperature is set to a high temperature in the Z direction stress due to the thermal expansion of the glass tool portion 51 itself .

7, it is movable along the Y direction in the engaged state of the engaging convex portion 515a and the engaging concave portion 525a, but is not movable along the X direction. With this configuration, if the long direction of the wiring pattern of the heating electrode portion 512 is set as the Y direction, the cooling block portion 52 can be prevented from being restricted in the Y direction. Therefore, it is possible to make it difficult for stress to stretch the glass tool portion 51 which is caught in the Y direction during heating, and the glass tool portion 51 is not damaged.

8, the cooling block cooling flow path 522 and the electronic component suction flow path 521 formed in the cooling block portion 52 are three-dimensionally shown. The electronic component suction path 521 is connected to the electronic component suction hole 514 of the glass tool part 51 by a flow path.

As shown in Fig. 8, the cooling block cooling flow path 522 is arranged in a C-shape in the lateral direction so as to surround three surfaces of the electronic part suction path 521 at the center. With this structure, the internal volume of the cooling block portion 52 can be reduced and the cooling block cooling flow path 522 can be secured long, so that the cooling block portion 52 can be entirely cooled, The cooling can be efficiently performed. By adopting the above-described structure, it is possible to make the cooling block portion 52 smaller in size.

9 shows a path of a rectangular suction groove 526 and a glass tool suction passage 523 for sucking the glass tool portion 51. An electronic component suction hole 514 provided in the glass tool portion 51, As shown in FIG. The rectangular suction groove 526 is provided on the lower end face of the concave engaging portion 525, that is, the bottom face of the engaging recess 525a, and is connected to a suction device (not shown) through the glass tool suction passage 523 have.

9, the glass tool portion 51 is formed as the upper surface of the engaging convex portion 515a which is in contact with the cooling block portion 52 so that the cooling block portion 52 and the glass tool portion 51 can be polished. This makes it possible to maintain the flatness of the surface (upper surface of the engaging convex portion 515a) 51a in contact with the cooling block portion 52 with high accuracy, A structure for improving the attraction force of the tool portion 51 becomes possible.

By providing the suction grooves 526 on the bottom surface of the engaging concave portion 525a opposite to the flat surface 51a with a narrow rectangular frame shape so that the holding force of the glass tool portion 51 .

In the case of the structure in which the suction groove 526 or the like is provided in the cooling block portion 52 and the cooling block portion 52 and the glass tool portion 51 are held by suction, It is possible to adopt a structure in which the size or the position or the number of the electronic component suction holes 514 is exchanged with the glass tool part 51 which is different from each other, so that the positioning and the like at the time of replacement can be simplified.

This completes the detailed configuration of the bonding head 5.

When all necessary electronic components 8, including the above mounting operation, are mounted on the circuit board 6, the mounting operation is ended.

In addition, the above-mentioned mathematical terms such as parallelism include cases in which they are substantially parallel, as long as they do not hinder the performance of their functions, in addition to strictly parallel.

Of course, the present invention is not limited to the above-described embodiment, and various modifications are possible.

According to the embodiment of the present invention, the glass tool portion 51 having the heating electrode portion 512 is provided at the tip of the bonding head 5 and the electronic component contact portion 513 on the side of suctioning the electronic component 8 It is possible to perform a rapid temperature rise by the radiant heat of the heating electrode unit 512. [ On the other hand, by making the thickness T2 of the cooling block contacting portion 511 having the surface connected to the cooling block portion 52 larger than the thickness T1 of the electronic component contacting portion 513 for attracting the electronic component 8, And a structure for improving thermal shock resistance of the glass.

With this configuration, thermal expansion of the glass tool portion 51 and loss of heat to the cooling block can be suppressed. In other words, it is possible to reduce the thermal expansion fluctuation during the process of rapid heating and rapid cooling required for solder bonding and the like, to stabilize the bonding, to realize miniaturization of the bonding head 5, Can be greatly improved.

In other words, with the above-described configuration, the thermal expansion of the tool tip can be suppressed, the thermal shock caused by the rapid heating and cooling can be improved, and the bonding head 5 can be miniaturized by simplifying the mechanism.

Further, by using the bonding head 5 having the above-described structure, it is possible to suppress bump distortion at the time of bonding of the electronic component 8 and to provide good bonding, and at the same time, Can be improved.

In other words, by providing the electronic component bonding head having the glass tool portion 51 having the above-described configuration using the heating electrode portion 512, it is possible to reduce the thermal expansion of the head heating at the time of bonding without depending on the size of the electronic component 8 Can be minimized, and stable bonding can be provided while maintaining quality for a very long time.

Therefore, the bonding head, the electronic component mounting apparatus, and the manufacturing method of the bonding head according to the embodiments of the present invention can perform bonding with higher quality and are useful, for example, for mounting electronic components on a circuit board.

It is to be noted that the effects of each of the above-described embodiments and modifications may be shown by appropriately combining any of the above-described embodiments or modifications. It should be understood that the present invention is not limited to these embodiments, and various combinations of the embodiments and embodiments may be possible.

(Industrial applicability)

INDUSTRIAL APPLICABILITY The electronic component bonding head according to the present invention can realize miniaturization, and at the same time, it is possible to greatly improve productivity, and in soldering a semiconductor light emitting element, another semiconductor bare chip and other kinds of electronic parts, It can be bonded to an electronic component mounting apparatus mounted on a circuit board.

1: Electronic component mounting device
2:
21: stage
22: stage moving mechanism
3: Component mounting unit
31:
32:
33: lifting mechanism
34: head support
35: Shaft
4:
41:
42: Feed head
421: Supply Collet
43: Feed head moving mechanism
44: Rotation mechanism
45: Electronic component supply tray
5: bonding head
51: Glass tool part
51a: cotton
511: cooling block contact
512: heating electrode part
5121: glass junction
513: Electronic component contact portion
514: Electronic component suction hole
515: convex engagement portion
515a: engaging convex portion
52: cooling block part
521: Electronic component adsorption flow path
522: cooling block cooling flow path
523: Glass tool adsorption flow path
524: Mounting screw hole part
525: concave engaging portion
525a: engaging concave portion
526: Adsorption groove
6: Circuit board
61: Bolt
8: Electronic parts
91: Cooling block part
92: Ceramic heater
93: Ceramic heater heating section
94: Ceramic heater wiring part
10:
11:

Claims (5)

A glass tool portion having a heating electrode portion for heating the electronic component,
A cooling block part for cooling the glass tool part
The electronic component bonding head comprising:
Wherein the glass tool portion comprises:
A first glass portion for holding the electronic component with respect to the heating electrode portion,
And a second glass part connected to the cooling block part by being disposed on the opposite side of the heating electrode part from the side holding the electronic part,
Lt; / RTI &
The thickness of the first glass part is 0.2 to 2 mm,
Wherein the thickness of the second glass portion is 1.2 to 25 times the thickness of the first glass portion
Electronic component bonding head.
The method according to claim 1,
Wherein the wiring pattern of the heating electrode portion formed in the glass tool portion is arranged so as to avoid a suction hole for sucking the electronic component.
3. The method according to claim 1 or 2,
Wherein a wiring area of the heating electrode portion is equal to or smaller than an area of a bonding portion for sintering-bonding the first glass portion and the second glass portion.
3. The method according to claim 1 or 2,
Wherein an adsorption groove is provided on a surface where the glass tool part and the cooling block part are in contact with each other and the surface of the glass tool part is adsorbed to the cooling block part.
The method of claim 3,
Wherein an adsorption groove is provided on a surface where the glass tool part and the cooling block part are in contact with each other and the surface of the glass tool part is adsorbed to the cooling block part.
KR1020160028108A 2015-04-22 2016-03-09 Electronic component bonding head KR101764055B1 (en)

Applications Claiming Priority (2)

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JP2015087801A JP6176542B2 (en) 2015-04-22 2015-04-22 Electronic component bonding head
JPJP-P-2015-087801 2015-04-22

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CN112997214B (en) 2018-11-13 2024-04-26 索尼公司 Information processing device, information processing method, and program
JP7368962B2 (en) * 2019-07-09 2023-10-25 芝浦メカトロニクス株式会社 mounting equipment
KR102498914B1 (en) * 2020-12-08 2023-02-13 주식회사 미코세라믹스 Bonding head and apparatus for bonding chips having the bonding head
CN115100973B (en) * 2022-08-24 2022-11-15 深圳市美丽加科技有限公司 High-strength display screen and electronic equipment

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JP2850895B2 (en) * 1997-02-25 1999-01-27 日本電気株式会社 Bonding head
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CN106068061A (en) 2016-11-02
JP6176542B2 (en) 2017-08-09
CN106068061B (en) 2018-11-20
JP2016207832A (en) 2016-12-08
KR101764055B1 (en) 2017-08-01
TW201640972A (en) 2016-11-16

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