TWI791287B - Packaging device and packaging method - Google Patents

Abstract

In the packaging device (10) for packaging the semiconductor chip (100) on the substrate (104), the control unit (50) includes: a packaging device for interposing the cover film (110) between the semiconductor chip (100) and the thermocompression bonding tool In the state between (16), pressing the semiconductor chip (100) on the substrate (104), and heating and cooling the thermocompression bonding tool (16), packaging the semiconductor chip (100) on the substrate (104); and The stripping device heats the thermocompression bonding tool (16) after the semiconductor chip (100) is packaged to lift the package head (17) to peel off the cover film (110).

Description

Packaging device and packaging method

The present invention relates to a structure of a packaging device and a packaging method. A semiconductor chip is packaged in a substrate or other semiconductor chip packaged body via an adhesive material.

Conventionally, the following flip chip bonder technology has been widely known, that is, a semiconductor chip is packaged in a packaged body that is a substrate or other semiconductor chips without using a wire. Flip chip bonding machine pre-coats an adhesive material containing thermosetting resin on the packaged body, heats up and presses the semiconductor chip with a thermocompression bonding tool, melts the solder on the electrode and hardens the adhesive material on the packaged body Thereafter, the thermocompression bonding tool is cooled to solidify the solder, and the semiconductor chip is bonded to the substrate. At this time, when the semiconductor chip is heated and pressurized by the thermocompression bonding tool, the adhesive material extruded by the semiconductor chip may spread upward and adhere to the packaging head.

In order to prevent such adhesion of the adhesive material to the thermocompression bonding tool, there is disclosed a packaging device that covers the bottom surface of the thermocompression bonding tool with a film member (cover film). For example, Patent Document 1 describes that a thermocompression bonding tool and a film member conveyance mechanism that sequentially feeds a film member are provided in a bonding head, and the film member is used to prevent an adhesive material from adhering to the thermocompression bonding tool. [Prior Art Literature] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open No. 2015-35493

[Problem to be Solved by the Invention]

In addition, in the packaging device described in Patent Document 1, if the semiconductor chip is heated and pressurized by a thermocompression bonding tool when the semiconductor chip is packaged in the packaged body, there may be a gap between the thermocompression bonding tool and the semiconductor chip. The cover film thermally expands, and then if the thermocompression bonding tool is cooled, the cover film shrinks due to cooling and sticks to the side or bottom surface of the thermocompression bonding tool. In this way, if the cover film is attached to the side surface or the bottom surface of the thermocompression bonding tool, the cover film may not come off from the thermocompression bonding tool.

Therefore, the object of the present invention is to make the cover film between the thermocompression bonding tool and the semiconductor chip and package the semiconductor chip in the packaging device of the packaged body through the adhesive material, and make the thermocompression bonding tool self-cover after packaging The film peeled off easily. [Means to solve the problem]

The packaging device of the present invention encapsulates the semiconductor chip into the packaged body via the adhesive material, and is characterized in that it includes: a packaging head, which holds the semiconductor chip, moves in a direction approaching or away from the packaged body, and is installed to press the semiconductor chip on the packaged body. The thermocompression bonding tool of the package, and the tool heating and cooling mechanism for heating and cooling the thermocompression bonding tool; the film arrangement mechanism moves the cover film, and arranges the cover film on the semiconductor chip pressed against the packaged body and thermocompression bonding Between the tools; and the control part, which controls the movement of the packaging head and the film arrangement mechanism, and controls the temperature of the thermocompression bonding tool through the tool heating and cooling mechanism. In the state between the crimping tools, the semiconductor chip is pressed on the packaged body, and the thermocompression bonding tool is heated and then cooled to package the semiconductor chip in the packaged body; and the peeling device, after the semiconductor chip is packaged, heats After the crimping tool is heated, the encapsulation head rises to peel off the cover film.

In this way, after the semiconductor chip is packaged, the temperature of the thermocompression bonding tool is raised to a predetermined temperature, so that the cover film attached to the side or bottom surface of the thermocompression bonding tool when packaging the semiconductor chip is thermally expanded to reduce the impact on the side or bottom surface of the thermocompression bonding tool. After the adhesive force is applied, the sealing head is raised, so that the thermocompression bonding tool can be easily peeled off from the cover film when the sealing head is raised.

In the packaging device of the present invention, after the semiconductor chip is packaged in the packaged body, the peeling device can also make the package head up.

Thereby, a slight gap is formed between the thermocompression bonding tool and the cover film, which can reduce the temperature rise of the packaged semiconductor chip or the hardened bonding material when the thermocompression bonding tool is heated up, and can suppress the temperature rise of the packaged semiconductor chip. or ensuing deterioration or damage of the material.

In the packaging device of the present invention, the thermocompression bonding tool can also adsorb and hold the semiconductor chip, and the packaging equipment makes the thermocompression bonding tool adsorb and hold the semiconductor chip, lowers the packaging head, and temporarily crimps the semiconductor chip on the packaged body through the bonding material. , the cover film is interposed between the semiconductor wafer and the thermocompression bonding tool, and the temporarily crimped semiconductor wafer is pressed to package the semiconductor wafer in the packaged body.

Thereby, it is not possible to package the semiconductor chip by providing vent holes in the cover film as described in Patent Document 1, and the tact time can be shortened.

The packaging method of the present invention encapsulates the semiconductor chip in the packaged body via the adhesive material, and is characterized in that it includes: a preparation step, preparing a packaging device, the packaging device includes a packaging head, a tool heating and cooling mechanism, and a film configuration mechanism, and the packaging The head holds the semiconductor wafer and moves in the direction of approaching or moving away from the packaged body. A thermocompression bonding tool that presses the semiconductor wafer to the packaged body is installed on the top. The tool heating and cooling mechanism is installed on the packaging head to perform thermal bonding. Heating and cooling of the crimping tool, the film disposing mechanism disposes the cover film between the semiconductor wafer and the thermocompression bonding tool; the film disposing step, when the semiconductor chip is packaged in the packaged body, the cover film is arranged by the film disposing mechanism The film is interposed between the semiconductor wafer and the thermocompression bonding tool; the packaging step is to press the semiconductor chip on the packaged body with the cover film interposed between the semiconductor wafer and the thermocompression bonding tool, and heat the thermocompression bonding tool After cooling, the semiconductor chip is packaged in the packaged body; and in the peeling step, after the packaging step, the thermocompression bonding tool is heated to lift the packaging head to peel off the cover film. [Effect of the invention]

The present invention can intervene the cover film between the thermocompression bonding tool and the semiconductor chip and package the semiconductor chip in the packaging device through the adhesive material, and make the thermocompression bonding tool easily peel off from the cover film after packaging.

Hereinafter, the packaging device 10 of the embodiment will be described with reference to the drawings. As shown in FIG. 1 , a packaging device 10 is a device for manufacturing a semiconductor device by packaging a plurality of semiconductor wafers 100 on a substrate 104 as a packaged body. The semiconductor chip 100 is packaged on the substrate 104 by flip-chip bonding technology. Specifically, after forming a protrusion made of a conductive material called a bump 102 on the bottom surface of each semiconductor wafer 100, the semiconductor wafer 100 is turned over, and the bump 102 is bonded to the electrode 105 formed on the surface of the substrate 104, In this way, the semiconductor chip 100 is electrically connected to the substrate 104 .

As shown in FIG. 2 , on the substrate 104 , packaging blocks 106 for packaging the semiconductor chips 100 are defined in a two-dimensional array. In the illustrated example, 15 packaging blocks 106 are defined in 3 columns and 5 rows on one substrate 104 . A plurality of electrodes 105 electrically connected to the bumps 102 of the semiconductor chip 100 are formed on the surface of each packaging block 106 . In addition, an adhesive material 108 called a non-conductive paste (NCP) or a non-conductive film (NCF) is coated in advance on each package block 106 . Next, the material 108 contains an insulating and thermosetting thermosetting resin. By placing the semiconductor wafer 100 on the adhesive material 108 and pressing it against the substrate 104 and heating the semiconductor wafer 100 , the adhesive material 108 is hardened, and the semiconductor wafer 100 is mechanically bonded and fixed to the substrate 104 . Furthermore, such a method of pre-coating the adhesive material 108 on the substrate 104 is generally referred to as a "pre-coating method".

The packaging device 10 temporarily press-bonds each semiconductor chip 100 and then packages it on the substrate 104 . Temporary crimping is to temporarily place the semiconductor die 100 on the corresponding package block 106 (followed by the material 108 ) in the substrate 104 . In addition, the packaging is to mechanically and electrically connect the semiconductor chip 100 to the substrate 104 by heating and pressurizing the temporarily crimped semiconductor chip 100 . During packaging, the semiconductor chip 100 is heated at a temperature above the hardening temperature of the bonding material 108 and above the melting temperature of the bumps 102 . In this example, after the temporary pressure bonding of the semiconductor wafers 100 is continuously performed in the plurality of packaging blocks 106 , the packaging of the plurality of temporarily pressure-bonded semiconductor wafers 100 is continuously performed.

The packaging device 10 is a device for packaging the semiconductor chip 100 on the substrate 104 in the order described. This packaging apparatus 10 includes a bonding stage 20, a packaging head 17, a base 21, a film arrangement mechanism 22, a control unit 50 for controlling the movement of these units, and the like.

The bonding stage 20 is a stage on which the substrate 104 is placed. The bonding stage 20 is provided with, for example, a suction hole (not shown) for sucking and holding the substrate 104 or a heater (not shown) for heating the substrate 104 . The bonding platform 20 is supported by a base 21 .

The encapsulation head 17 is arranged opposite to the bonding platform 20, including: a body 11; a thermal insulation block 12 installed on the lower side of the main body 11; a heater 14 installed on the lower side of the thermal insulation block 12; and a thermocompression bonding tool 16, Installed on the lower side of the heater 14 .

The main body 11 can move up and down relative to the substrate 104 adsorbed on the bonding platform 20 by means of an internal driving mechanism, and can also move horizontally relative to the substrate 104 .

The heat insulating block 12 is a ceramic plate-shaped member sandwiched between the main body 11 and the heater 14 to prevent the heat of the heater 14 from being transferred to the main body 11 . The heater 14 is formed by embedding a heating resistor made of platinum or tungsten in ceramics such as aluminum nitride.

Two cooling grooves 15 extending in a direction perpendicular to the paper surface of FIG. 1 are provided on the upper surface of the heater 14 . Furthermore, the heat insulating block 12 is provided with an air flow path 13 which extends in an L-shape from the side surface and communicates the side surface with the cooling groove 15 provided in the heater 14 . When electric power is input to the heater 14 from the control unit 50 , the heating resistor generates heat to increase its temperature, and heats the thermocompression bonding tool 16 attached below the heater 14 . In addition, when the air from the fan 19 flows through the air passage 13 of the heat insulating block 12 , the heater 14 is cooled, thereby cooling the thermocompression bonding tool 16 . Therefore, the heat insulating block 12 , the heater 14 , and the fan 19 constitute a tool heating and cooling mechanism for heating and cooling the thermocompression bonding tool 16 .

The thermocompression bonding tool 16 has an upper surface approximately the same size as the heater 14 , and a protrusion 16 a for sucking and pressing the semiconductor wafer 100 is provided on the lower side. The size of the protrusion 16 a is substantially the same as the size of the semiconductor wafer 100 . The thermocompression bonding tool 16 is made of ceramics. In the thermocompression bonding tool 16, a suction hole 18 for suction holding the semiconductor wafer 100 is formed. The suction hole 18 passes through the heater 14 and the heat insulating block 12, and communicates with a suction pump (not shown) from the main body 11. The negative pressure generated by the suction pump sucks and holds the semiconductor wafer 100 on the thermocompression bonder. The lower surface of the protrusion 16 a of the tool 16 .

On the base 21 of the packaging device 10, a film arrangement mechanism 22 is provided. When the film arrangement mechanism 22 packages the semiconductor chip 100, the cover film 110 is interposed between the temporarily crimped semiconductor chip 100 and the thermocompression bonding tool 16. . In this example, a strip-shaped cover film 110 that is long in one direction is used. As a material of the cover film 110 , a material having excellent heat resistance and high peelability of the adhesive material 108 is suitable. Therefore, as a material of the cover film 110 , for example, a fluororesin such as polytetrafluoroethylene (PTFE) or tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) can be used.

The film disposing mechanism 22 has a film sending mechanism 24 that sequentially sends the strip-shaped cover film 110 above the substrate 104 . The film delivery mechanism 24 has a delivery roller 28a and a take-up roller 28b provided on both sides with the bonding platform 20 interposed therebetween (hereinafter, when the delivery roller 28a/take-up roller 28b are not distinguished, they are simply referred to as "feed roller 28") . The cover film 110 is stretched between the pair of feed rollers 28 . New cover films 110 are sequentially sent out as the sending roller 28 a rotates in a predetermined sending direction (direction of arrow 29 in FIG. 1 ). Moreover, the used cover film 110 is wound up by the wind-up roller 28b and collect|recovered by the wind-up roller 28b and the send-out roller 28a rotating in the same direction as the send-out roller 28a. That is, the cover film 110 is fed by the pair of feed rollers 28 rotating in the same direction.

The film arrangement mechanism 22 further includes a film moving mechanism 30 for moving the cover film 110 in the horizontal direction together with the film delivery mechanism 24 . The film moving mechanism 30 has a pair of rails 32 extending in a first direction (the longitudinal direction of the rectangular substrate 104 in the illustrated example), and a moving block 34 sliding along the rails 32 . In addition, the film arrangement mechanism 22 includes a film lifting mechanism (not shown) that lifts the cover film 110 together with the film delivery mechanism 24 . The film raising and lowering mechanism is not particularly limited as long as the height of the feed roller 28 can be varied.

The control unit 50 is connected to the body 11 of the encapsulation head 17, the heater 14, the fan 19, the film arrangement mechanism 22, and the bonding platform 20, controls the movement of the encapsulation head 17 and the film arrangement mechanism 22, and uses the heater 14 and the fan 19 to The temperature of the thermocompression bonding tool 16 is controlled. The control unit 50 includes, for example, a central processing unit (Central Processing Unit, CPU) for performing various calculations, and a memory for storing various data and programs. Detection results of various sensors are input to the control unit 50, and the control unit 50 performs drive control and temperature control of each unit based on the detection results. For example, the control unit 50 performs movement control of the packaging head 17 , temperature control of the thermocompression bonding tool 16 and the bonding stage 20 , drive control of the suction mechanism, and the like. In addition, the control unit 50 also performs movement control of the film arrangement mechanism 22 in order to arrange the cover film 110 at an appropriate position.

Hereinafter, the operation of the packaging device 10 according to the embodiment will be described with reference to FIGS. 3 to 14 . When packaging the semiconductor chip 100 , the substrate 104 is placed on the bonding platform 20 . As shown in FIG. 2 , the bonding material 108 is pre-coated on the packaging block 106 of the substrate 104 , or the bonding material 108 is coated after being placed on the bonding platform 20 .

The control unit 50 temporarily press-bonds the semiconductor wafer 100 to each package block 106 of the substrate 104 . Specifically, the control unit 50 moves the packaging head 17 to a wafer supply source (not shown), and suction-holds the semiconductor wafer 100 on the protrusion 16 a of the thermocompression bonding tool 16 attached to the tip. Then, the control unit 50 drives the body 11 of the encapsulation head 17 to move the encapsulation head 17 directly above the corresponding encapsulation block 106 .

Then, as shown in FIG. 3 , the control unit 50 lowers the encapsulation head 17 toward the substrate 104 as indicated by an arrow 90, and presses the semiconductor wafer 100 sucked and held by the protrusion 16a of the thermocompression bonding tool 16 at the top to the corresponding encapsulation area. block 106 (or next to material 108). Thereby, the semiconductor wafer 100 is temporarily pressure-bonded on the substrate 104 and the bonding material 108 . After one semiconductor wafer 100 is temporarily pressure-bonded, the packaging head 17 releases the suction of the semiconductor wafer 100 and moves up. Then, the encapsulation head 17 gradually performs temporary pressure bonding of all the semiconductor wafers 100 in the same order.

During the temporary pressure bonding process, the control unit 50 drives the film moving mechanism 30 to move the cover film 110 to the withdrawn position. The retreat position is a position away from the packaging block 106 for temporarily pressing the semiconductor chip 100 in the horizontal direction.

After the temporary pressure-bonding process is completed, the control unit 50 executes the film arrangement step. As shown in FIG. 4 , the control unit 50 drives the film moving mechanism 30 to move the cover film 110 in the horizontal direction until it is directly above the temporarily crimped semiconductor wafer 100 and between the semiconductor wafer 100 and the thermocompression bonding tool 16. s position. Next, the control unit 50 lowers the cover film 110 by using the film lift mechanism so that the cover film 110 is at substantially the same height as the upper surface of the semiconductor wafer 100 .

The control unit 50 starts the encapsulation step at time t0 in FIG. 14 . The control unit 50 lowers the body 11 of the encapsulation head 17 at time t0 in FIG. . Due to the pressing, the bonding material 108 seeps out around the semiconductor wafer 100 , and a part of the bonding material 108 spreads on the side of the semiconductor chip 100 and reaches the lower surface of the cover film 110 . In addition, due to the pressing, the bumps 102 formed on the semiconductor wafer 100 contact the electrodes 105 of the substrate 104 .

The control unit 50 starts supplying electric power to the heater 14 at time t1 shown in FIG. 12 , and the temperature of the thermocompression bonding tool 16 is raised by the heater 14 . When the temperature of the thermocompression bonding tool 16 rises, the semiconductor wafer 100 is heated by the heat, and the material 108 is softened accordingly. When the temperature is further increased to reach the melting temperature of the bumps 102 or higher, the bumps 102 of the semiconductor wafer 100 are melted. At this time, as shown in FIG. 14 , the control unit 50 controls the height of the packaging head 17 so that the height of the semiconductor wafer 100 from the substrate 104 becomes a constant height after packaging. In addition, when the temperature rises to the hardening temperature of the bonding material 108, the bonding material 108 starts thermal hardening. In this way, the control unit 50 heats the thermocompression bonding tool 16 to a temperature T1 that is not less than the hardening temperature of the adhesive material 108 and not less than the melting temperature of the bump 102 . The temperature T1 may be, for example, about 300°C.

During the heating process, the cover film 110 gradually thermally expands outward from the thermocompression bonding tool 16 as shown by the arrow 91 shown in FIGS. 5 and 6 due to the heating by the thermocompression bonding tool 16 . In addition, the cover film 110 is deformed to be slightly depressed downward by pressing. Therefore, as shown in FIG. 6 , the cover film 110 is deformed so as to extend obliquely upward from the corner of the bottom surface of the protrusion 16 a of the thermocompression bonding tool 16 .

The controller 50 activates the fan 19 at time t2 in FIG. 12 , and starts to flow cooling air through the air passage 13 of the heat insulating block 12 as shown by the arrow 92 in FIG. 7 . The cooling air flows through the cooling groove 15 of the heater 14 from the air flow path 13 , and flows out from the cooling groove 15 in a direction perpendicular to the paper surface of FIG. 7 . Accordingly, the temperature of the heater 14 is cooled down, and accordingly, the temperature of the thermocompression bonding tool 16 is also lowered, and the melted bump 102 is hardened, and the bonding with the electrode 105 of the substrate 104 is completed at time t3. In addition, the temperature of the thermally hardened adhesive material 108 also decreases. Thereby, the control unit 50 ends the encapsulation step.

If the temperature of the thermocompression bonding tool 16 gradually decreases due to the cooling of the thermocompression bonding tool 16 in the packaging step, the temperature of the cover film 110 also gradually decreases. Then, in FIG. 6 , the portion extending obliquely upward from the corner of the bottom surface of the protrusion 16a of the thermocompression bonding tool 16 is cooled, as shown by arrow 93 in FIGS. 7 and 8 , toward the protrusion of the thermocompression bonding tool 16. The sides of 16a taper gradually. And when it cools further, it sticks to the side surface or the bottom surface of the protrusion 16a of the thermocompression bonding tool 16. The sticking force f gradually increases from time t2 to time t3 in FIG. 13 , and at time t3, the sticking force f reaches f3. In this way, if the cover film 110 is attached to the side surface or the bottom surface of the protrusion 16 a of the thermocompression bonding tool 16 , the cover film 110 may not fall off from the thermocompression bonding tool 16 when the sealing head 17 is raised.

The controller 50 cools the heater 14 by flowing the cooling air from the fan 19 in the air flow path 13 , thereby cooling the thermocompression bonding tool 16 . Then, after the temperature of the thermocompression bonding tool 16 drops to the temperature T3 at time t3 shown in FIG. 12 , the fan 19 is stopped, and the flow of cooling air into the air flow path 13 is stopped. Thereby, the packaging of the semiconductor wafer 100 is completed. For example, the temperature T3 may be set below the temperature at which the adhesive material 108 starts to soften. Thereby, it can be suppressed that when the protrusion 16a of the thermocompression bonding tool 16 absorbs and holds the semiconductor wafer 100 and temporarily press-bonds it on the bonding material 108, the bonding material 108 softens and the temporarily-bonded semiconductor wafer 100 position offset.

As shown in FIG. 14 , the control unit 50 controls the height of the mounting head 17 so that the height of the thermocompression bonding tool 16 becomes constant between the time t0 when the packaging starts and the time t3 when the packaging of the semiconductor wafer 100 ends. When the time t3 in FIG. 14 at which the sealing step is completed, the control unit 50 starts the peeling step. The control unit 50 drives the body 11 of the encapsulation head 17 at time t3 to slightly increase the height of the thermocompression bonding tool 16 by a height Δh and maintain the height.

As shown in FIG. 9, if the height of the thermocompression bonding tool 16 increases by Δh, the cover film 110 attached to the side or bottom surface of the protrusion 16a of the thermocompression bonding tool 16 remains attached to the protrusion of the thermocompression bonding tool 16. According to the state of the side surface or the bottom surface of the portion 16a, the thermocompression bonding tool 16 is raised slightly. Thus, a slight gap is formed between the cover film 110 and the upper surface of the packaged semiconductor wafer 100 .

The controller 50 supplies electric power to the heater 14 at time t3 in FIG. 12 while maintaining the height of the thermocompression bonding tool 16, and the heater 14 raises the temperature of the thermocompression bonding tool 16 to a predetermined temperature T2. Thereby, as shown in FIG. 8, the cover film 110 attached to the side or bottom surface of the protrusion 16a of the thermocompression bonding tool 16 thermally expands like the arrow 94 shown in FIGS. bottom surface. 12 and 13 from time t3 to time t4, as the temperature of the thermocompression bonding tool 16 rises, the adhesion force f of the cover film 110 to the thermocompression bonding tool 16 decreases. Moreover, if the temperature of the thermocompression bonding tool 16 rises to a predetermined temperature T2 at time t4, the adhesion force f of the cover film 110 decreases to f2.

When the temperature of the thermocompression bonding tool 16 reaches the predetermined temperature T2, the control unit 50 stops supplying power to the heater 14 at time t4, drives the body 11 of the encapsulation head 17, and raises the encapsulation head 17 as shown by the arrow 95 in FIG. 11 . . At this time, the cover film 110 erected between the pair of feed rollers 28 maintains its original position and does not rise. Since the adhesion force f to the thermocompression bonding tool 16 is reduced to f2, the thermocompression bonding tool 16 is self-covered. The film 110 peels off and rises together with the main body 11 . With this, the stripping step ends.

After the control unit 50 raises the encapsulation head 17, the fan 19 is turned on again to cool the heater 14 and the thermocompression bonding tool 16 to the temperature T3.

Here, the predetermined temperature T2 can be freely set as long as it is a temperature at which the adhesion force f of the cover film 110 can be reduced to the extent that the cover film 110 separates from the thermocompression bonding tool 16 when the sealing head 17 is raised. For example, the temperature may be set at about 50% of the temperature T1, or may be set at about 150°C to 200°C.

As described above, the packaging device 10 of the embodiment raises the temperature of the thermocompression bonding tool 16 to a predetermined temperature T2 after packaging the semiconductor chip 100, so that the cover attached to the side or bottom surface of the thermocompression bonding tool 16 when packaging the semiconductor chip 100 After the film 110 thermally expands and reduces the adhesive force f to the side or bottom surface of the thermocompression bonding tool 16, the encapsulation head 17 is raised, so the thermocompression bonding tool 16 can be easily removed from the cover film 110 when the encapsulation head 17 is raised. peel off.

In addition, in the packaging device 10 of the embodiment, after packaging the semiconductor chip 100, the packaging head 17 is raised slightly, and the temperature of the thermocompression bonding tool 16 is raised in a state where a slight gap is formed between the thermocompression bonding tool 16 and the cover film 110. Therefore, the temperature rise of the packaged semiconductor chip 100 or the hardened adhesive material 108 can be reduced when the temperature of the thermocompression bonding tool 16 is raised, and the deterioration or damage of the packaged semiconductor chip 100 or the adhesive material 108 can be suppressed. Furthermore, the heat of the heater 14 is not transferred to the semiconductor wafer 100 or the bonding material 108 , so the temperature of the thermocompression bonding tool 16 and the cover film 110 can be raised to a predetermined temperature T2 in a short time. Therefore, the thermocompression bonding tool 16 can be easily peeled off from the cover film 110 without increasing the takt time.

In addition, the packaging device 10 of the embodiment makes the thermocompression bonding tool 16 absorb and hold the semiconductor chip 100, temporarily press-bonds the semiconductor chip 100 on the adhesive material 108 on the substrate 104, and then puts the cover film 110 between them. between the semiconductor wafer 100 and the thermocompression bonding tool 16, the semiconductor wafer 100 is heated and pressed to package the semiconductor wafer 100 on the substrate 104, so there is no need to open the cover film 110 like the prior art packaging device described in Patent Document 1. The vent hole can further shorten the takt time compared with the packaging device of the prior art.

Furthermore, in the packaging device 10 , after the semiconductor chip 100 is packaged, the temperature of the thermocompression bonding tool 16 may be raised without raising the packaging head 17 . At this time, as described above, the thermal expansion of the cover film 110 can reduce the adhesion force f, so that the thermocompression bonding tool 16 can be easily peeled off from the cover film 110 . However, at this time, the predetermined temperature T2 can also be set slightly lower than the previous example, for example, about 100° C. to 150° C., so as to suppress thermal degradation of the packaged semiconductor chip 100 or the hardened adhesive material 108 .

In the above description, it has been described that the packaging device 10 packages the semiconductor chip 100 on the substrate 104 , but the invention is not limited thereto, and the semiconductor chip 100 can also be packaged on other semiconductor chips 100 . At this time, the other semiconductor wafer 100 constitutes a packaged body similarly to the substrate 104 .

10: Encapsulation device

11: Ontology

12: Insulation block

13: Air flow path

14: heater

15: cooling tank

16:Thermal crimping tool

16a: protrusion

17: Encapsulation header

18: suction hole

19: fan

20: Engaging Platform

21: Abutment

22: Membrane configuration mechanism

24: Film delivery mechanism

28: Feed roller

28a: Send out roller

28b: Take-up roller

29, 90, 91, 92, 93, 94, 95: Arrows

30: Membrane moving mechanism

32: track

34: Moving blocks

50: Control Department

100: semiconductor wafer

102: Bump

104: Substrate

105: electrode

106: Encapsulation block

108: Subsequent material

110: cover film

T: Thermal crimping tool temperature

T1, T3: temperature

T2: established temperature

f, f1, f2: Adhesion force

t0, t1, t2, t3, t4: time

Δh: height

FIG. 1 is a system diagram showing the configuration of a packaging device according to the embodiment. Fig. 2 is a schematic plan view of a packaging device according to the embodiment. Fig. 3 is a side view showing a temporary pressure-bonding operation of a semiconductor wafer. 4 is a side view showing a state in which a cover film is interposed between a temporarily pressure-bonded semiconductor wafer and a thermocompression bonding tool. Fig. 5 is a side view showing a temperature raising operation when packaging a semiconductor chip. Fig. 6 is a detailed side view showing part A of Fig. 5 . Fig. 7 is a side view showing a cooling operation when packaging a semiconductor chip. Fig. 8 is a detailed side view showing part B in Fig. 7 . Fig. 9 is a side view showing the temperature raising operation after packaging. Fig. 10 is a detailed side view showing part C shown in Fig. 9 . Fig. 11 is a side view showing a state in which the sealing head is raised after the temperature raising operation. Fig. 12 is a graph showing temperature changes of a thermocompression bonding tool. Fig. 13 is a graph showing changes in adhesion force of the cover film to the thermocompression bonding tool. Fig. 14 is a graph showing changes in the height of the thermocompression bonding tool.

10: Encapsulation device

11: Ontology

12: Insulation block

13: Air flow path

14: heater

15: cooling tank

16:Thermal crimping tool

16a: protrusion

17: Encapsulation header

18: suction hole

19: fan

20: Engaging Platform

21: Abutment

22: Membrane configuration mechanism

24: Film delivery mechanism

28a: Send out roller

28b: Take-up roller

29: Arrow

30: Membrane moving mechanism

32: track

34: Moving blocks

50: Control Department

100: semiconductor wafer

102: Bump

104: Substrate

105: electrode

108: Subsequent material

110: cover film

Claims (4)

A packaging device for packaging a semiconductor chip in a packaged body via an adhesive material, and is characterized in that it includes: a packaging head, holding the semiconductor chip, moving in a direction of approaching or moving away from the packaged body, and installing a The thermocompression bonding tool for pressing the semiconductor wafer on the packaged body, and the tool heating and cooling mechanism for heating and cooling the thermocompression bonding tool; the film arrangement mechanism moves the cover film, and arranges the cover film on the Pressed between the semiconductor wafer of the packaged body and the thermocompression bonding tool; and a control part that controls the movement of the encapsulation head and the film arrangement mechanism, and uses the tool heating and cooling mechanism to The temperature of the thermocompression bonding tool is controlled, and the control unit has a packaging device for pressing the semiconductor wafer on the thermocompression bonding tool in a state where the cover film is interposed between the semiconductor wafer and the thermocompression bonding tool. The object to be packaged, and the thermocompression bonding tool is heated and then cooled, and the semiconductor chip is packaged in the body to be packaged; After the tool is heated to reduce the adhesive force between the thermocompression bonding tool and the cover film, the encapsulation head is lifted to peel off from the cover film. The packaging device according to claim 1, wherein after the stripping device has packaged the semiconductor chip in the object to be packaged, in a state where the packaging head is raised slightly, the heating and cooling mechanism of the tool makes the After the temperature of the thermocompression bonding tool is raised to a predetermined temperature, the encapsulation head is raised. The packaging device according to claim 1 or claim 2, wherein the thermocompression bonding tool absorbs and holds the semiconductor wafer, and the packaging device makes the thermocompression bonding tool adsorb and hold the semiconductor wafer, so that the package The head is lowered, and the semiconductor wafer is temporarily crimped on the packaged body through the bonding material, and the cover film is interposed between the semiconductor wafer and the thermal compression bonding tool, and the press is temporarily pressed. The semiconductor chip is packaged in the packaged body by connecting the semiconductor chip. A packaging method, packaging a semiconductor chip into a packaged body via an adhesive material, and is characterized in that it includes: a preparation step, preparing a packaging device, the packaging device includes a packaging head, a tool heating and cooling mechanism, and a film configuration mechanism, the packaging head The semiconductor wafer is held and moved in the direction of approaching or moving away from the packaged body, and a thermocompression bonding tool that presses the semiconductor wafer to the packaged body is installed on the top, and the tool heating and cooling mechanism Installed on the encapsulation head to heat and cool the thermocompression bonding tool, the film disposition mechanism disposes the cover film between the semiconductor wafer and the thermocompression bonding tool; in the film disposition step, the When the semiconductor chip is packaged in the packaged body, the cover film is interposed between the semiconductor chip and the thermocompression bonding tool by the film arrangement mechanism; in the packaging step, when the cover film is interposed The semiconductor wafer and the thermocompression bonder In the state between the tools, press the semiconductor chip on the packaged body, and heat and cool the thermocompression bonding tool, and package the semiconductor chip in the packaged body; and the peeling step, After the encapsulation step, heating the thermocompression bonding tool to reduce the adhesive force between the thermocompression bonding tool and the cover film, and then lifting the encapsulation head to peel off the cover film .

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