WO2011096389A1 - 太陽電池素子封止用樹脂組成物及び太陽電池モジュール - Google Patents
太陽電池素子封止用樹脂組成物及び太陽電池モジュール Download PDFInfo
- Publication number
- WO2011096389A1 WO2011096389A1 PCT/JP2011/052017 JP2011052017W WO2011096389A1 WO 2011096389 A1 WO2011096389 A1 WO 2011096389A1 JP 2011052017 W JP2011052017 W JP 2011052017W WO 2011096389 A1 WO2011096389 A1 WO 2011096389A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- block copolymer
- resin composition
- sealing
- cell element
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 107
- 238000007789 sealing Methods 0.000 title claims abstract description 98
- 229920001400 block copolymer Polymers 0.000 claims abstract description 121
- 229920000642 polymer Polymers 0.000 claims abstract description 76
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 18
- -1 aromatic vinyl compound Chemical class 0.000 claims description 108
- 150000004678 hydrides Chemical class 0.000 claims description 87
- 239000003963 antioxidant agent Substances 0.000 claims description 24
- 230000003078 antioxidant effect Effects 0.000 claims description 18
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 18
- 239000003381 stabilizer Substances 0.000 claims description 17
- 150000001412 amines Chemical class 0.000 claims description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 7
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229920000428 triblock copolymer Polymers 0.000 claims description 3
- 150000001993 dienes Chemical class 0.000 abstract description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 166
- 239000008188 pellet Substances 0.000 description 48
- 238000000034 method Methods 0.000 description 44
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 35
- 238000005984 hydrogenation reaction Methods 0.000 description 35
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 28
- 239000011521 glass Substances 0.000 description 27
- 239000000178 monomer Substances 0.000 description 26
- 238000012360 testing method Methods 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 239000000203 mixture Substances 0.000 description 23
- 239000000758 substrate Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 238000006116 polymerization reaction Methods 0.000 description 20
- 238000011156 evaluation Methods 0.000 description 19
- 238000000465 moulding Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 16
- 230000007797 corrosion Effects 0.000 description 16
- 238000005260 corrosion Methods 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- 238000010521 absorption reaction Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 13
- 239000010949 copper Substances 0.000 description 13
- 238000009826 distribution Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000003566 sealing material Substances 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 150000001408 amides Chemical class 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 11
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 239000005038 ethylene vinyl acetate Substances 0.000 description 9
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- 239000006096 absorbing agent Substances 0.000 description 7
- 238000013329 compounding Methods 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 6
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- 150000003440 styrenes Chemical class 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000010538 cationic polymerization reaction Methods 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 239000004611 light stabiliser Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920001195 polyisoprene Polymers 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 229920005604 random copolymer Polymers 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000002879 Lewis base Substances 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 230000015271 coagulation Effects 0.000 description 3
- 238000005345 coagulation Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000012442 inert solvent Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- FDAKZQLBIFPGSV-UHFFFAOYSA-N n-butyl-2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CCCCNC1CC(C)(C)NC(C)(C)C1 FDAKZQLBIFPGSV-UHFFFAOYSA-N 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000004711 α-olefin Substances 0.000 description 3
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 150000001934 cyclohexanes Chemical class 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000004807 desolvation Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 239000002638 heterogeneous catalyst Substances 0.000 description 2
- 239000002815 homogeneous catalyst Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 150000002506 iron compounds Chemical class 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002736 metal compounds Chemical group 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methylcyclopentane Chemical compound CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 2
- UKJARPDLRWBRAX-UHFFFAOYSA-N n,n'-bis(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound C1C(C)(C)NC(C)(C)CC1NCCCCCCNC1CC(C)(C)NC(C)(C)C1 UKJARPDLRWBRAX-UHFFFAOYSA-N 0.000 description 2
- OJEVKMXXXGOFQA-UHFFFAOYSA-N n-(4-hydroxybutyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CC1(C)CC(N(CCCCO)C=O)CC(C)(C)N1 OJEVKMXXXGOFQA-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- ISYWECDDZWTKFF-UHFFFAOYSA-N nonadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)=O ISYWECDDZWTKFF-UHFFFAOYSA-N 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 235000019645 odor Nutrition 0.000 description 2
- 150000002900 organolithium compounds Chemical class 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229960004889 salicylic acid Drugs 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 description 1
- JPWVAWSCRCLFGS-ZETCQYMHSA-N (2S)-6-amino-2-(ethenylamino)hexanoic acid Chemical class C(=C)N[C@@H](CCCCN)C(=O)O JPWVAWSCRCLFGS-ZETCQYMHSA-N 0.000 description 1
- KFTHUBZIEMOORC-ARJAWSKDSA-N (z)-2-methylbut-2-enamide Chemical compound C\C=C(\C)C(N)=O KFTHUBZIEMOORC-ARJAWSKDSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical class C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- NWHNXXMYEICZAT-UHFFFAOYSA-N 1,2,2,6,6-pentamethylpiperidin-4-ol Chemical compound CN1C(C)(C)CC(O)CC1(C)C NWHNXXMYEICZAT-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- KGUHNPYZVOXLMM-UHFFFAOYSA-N 1-(2,2,6,6-tetramethylpiperidin-4-yl)hexane-1,6-diamine Chemical compound CC1(C)CC(C(N)CCCCCN)CC(C)(C)N1 KGUHNPYZVOXLMM-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- OUSXYCTXXLYBGJ-UHFFFAOYSA-N 1-ethenyl-2,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(C=C)C(C(C)C)=C1 OUSXYCTXXLYBGJ-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- JWVTWJNGILGLAT-UHFFFAOYSA-N 1-ethenyl-4-fluorobenzene Chemical compound FC1=CC=C(C=C)C=C1 JWVTWJNGILGLAT-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- CISIJYCKDJSTMX-UHFFFAOYSA-N 2,2-dichloroethenylbenzene Chemical compound ClC(Cl)=CC1=CC=CC=C1 CISIJYCKDJSTMX-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- WSOMHEOIWBKOPF-UHFFFAOYSA-N 2,6-ditert-butyl-4-[(6-oxobenzo[c][2,1]benzoxaphosphinin-6-yl)methyl]phenol Chemical class CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CP2(=O)C3=CC=CC=C3C3=CC=CC=C3O2)=C1 WSOMHEOIWBKOPF-UHFFFAOYSA-N 0.000 description 1
- BCIOQYMTCPEOKK-UHFFFAOYSA-N 2-(2,2,3,3-tetramethylpiperidin-1-yl)ethanol Chemical compound CC1(C)CCCN(CCO)C1(C)C BCIOQYMTCPEOKK-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- LHPPDQUVECZQSW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-ditert-butylphenol Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C1O LHPPDQUVECZQSW-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- MPFAYMDFVULHEW-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MPFAYMDFVULHEW-UHFFFAOYSA-N 0.000 description 1
- XRAVHQNVZHTMFN-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-5-octylphenol Chemical compound OC1=CC(CCCCCCCC)=CC=C1N1N=C2C=CC=CC2=N1 XRAVHQNVZHTMFN-UHFFFAOYSA-N 0.000 description 1
- SKMNWICOBCDSSQ-UHFFFAOYSA-N 2-[4-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2,6,6-tetramethylpiperidin-1-yl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCN2C(CC(CC2(C)C)OC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(C)C)=C1 SKMNWICOBCDSSQ-UHFFFAOYSA-N 0.000 description 1
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 1
- IFQVEYUAIINTRX-UHFFFAOYSA-N 2-methoxyethoxybenzene Chemical compound COCCOC1=CC=CC=C1 IFQVEYUAIINTRX-UHFFFAOYSA-N 0.000 description 1
- MYHNUQVKTSTVDI-UHFFFAOYSA-N 2-methyl-2-[(2-methylpropan-2-yl)oxy]propane;potassium Chemical compound [K].CC(C)(C)OC(C)(C)C MYHNUQVKTSTVDI-UHFFFAOYSA-N 0.000 description 1
- LPNSCOVIJFIXTJ-UHFFFAOYSA-N 2-methylidenebutanamide Chemical compound CCC(=C)C(N)=O LPNSCOVIJFIXTJ-UHFFFAOYSA-N 0.000 description 1
- BJBMWJBRLRPRMY-UHFFFAOYSA-N 3-(4-tert-butylphenyl)-2-hydroxybenzoic acid Chemical compound C1=CC(C(C)(C)C)=CC=C1C1=CC=CC(C(O)=O)=C1O BJBMWJBRLRPRMY-UHFFFAOYSA-N 0.000 description 1
- PKAUJJPTOIWMDM-UHFFFAOYSA-N 3h-dioxaphosphepine Chemical compound C=1C=CPOOC=1 PKAUJJPTOIWMDM-UHFFFAOYSA-N 0.000 description 1
- FSWNZCWHTXTQBY-UHFFFAOYSA-N 4,6-dimethylhept-1-ene Chemical compound CC(C)CC(C)CC=C FSWNZCWHTXTQBY-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- VSAWBBYYMBQKIK-UHFFFAOYSA-N 4-[[3,5-bis[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-2,4,6-trimethylphenyl]methyl]-2,6-ditert-butylphenol Chemical compound CC1=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C(CC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)C(C)=C1CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 VSAWBBYYMBQKIK-UHFFFAOYSA-N 0.000 description 1
- UTKZHEXXFWCYCH-UHFFFAOYSA-N 4-tert-butyl-2-ethenyl-1-methylbenzene Chemical compound CC1=CC=C(C(C)(C)C)C=C1C=C UTKZHEXXFWCYCH-UHFFFAOYSA-N 0.000 description 1
- YWLXLRUDGLRYDR-ZHPRIASZSA-N 5beta,20-epoxy-1,7beta,10beta,13alpha-tetrahydroxy-9-oxotax-11-ene-2alpha,4alpha-diyl 4-acetate 2-benzoate Chemical compound O([C@H]1[C@H]2[C@@](C([C@H](O)C3=C(C)[C@@H](O)C[C@]1(O)C3(C)C)=O)(C)[C@@H](O)C[C@H]1OC[C@]12OC(=O)C)C(=O)C1=CC=CC=C1 YWLXLRUDGLRYDR-ZHPRIASZSA-N 0.000 description 1
- ADRNSOYXKABLGT-UHFFFAOYSA-N 8-methylnonyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC(C)C)OC1=CC=CC=C1 ADRNSOYXKABLGT-UHFFFAOYSA-N 0.000 description 1
- KFTHUBZIEMOORC-UHFFFAOYSA-N Angelicasaeure-amid Natural products CC=C(C)C(N)=O KFTHUBZIEMOORC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- IRNOSDUUWLNAHE-UHFFFAOYSA-N C1(CCCCCCCCCCC1)N(C=O)C1CC(NC(C1)(C)C)(C)C.C(C)N(CC)CCN(C=O)C1CC(NC(C1)(C)C)(C)C Chemical compound C1(CCCCCCCCCCC1)N(C=O)C1CC(NC(C1)(C)C)(C)C.C(C)N(CC)CCN(C=O)C1CC(NC(C1)(C)C)(C)C IRNOSDUUWLNAHE-UHFFFAOYSA-N 0.000 description 1
- UUYAYHNVLUJRBN-UHFFFAOYSA-N CN1C(CC(CC1(C)C)OC(C(C(=O)OC1CC(N(C(C1)(C)C)C)(C)C)(CCCC)CC1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C)=O)(C)C.CC1(NC(CC(C1)NCCCC)(C)C)C Chemical compound CN1C(CC(CC1(C)C)OC(C(C(=O)OC1CC(N(C(C1)(C)C)C)(C)C)(CCCC)CC1=CC(=C(C(=C1)C(C)(C)C)O)C(C)(C)C)=O)(C)C.CC1(NC(CC(C1)NCCCC)(C)C)C UUYAYHNVLUJRBN-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 241001218102 Phytophthora alphaendornavirus 1 Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RSSGSPAYFRXVKG-UHFFFAOYSA-N Tridecanamide Chemical compound CCCCCCCCCCCCC(N)=O RSSGSPAYFRXVKG-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- IUHFWCGCSVTMPG-UHFFFAOYSA-N [C].[C] Chemical class [C].[C] IUHFWCGCSVTMPG-UHFFFAOYSA-N 0.000 description 1
- BZEZSORUWZUMNU-UHFFFAOYSA-N [Li]CCCC[Li] Chemical compound [Li]CCCC[Li] BZEZSORUWZUMNU-UHFFFAOYSA-N 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 125000005234 alkyl aluminium group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- SODJJEXAWOSSON-UHFFFAOYSA-N bis(2-hydroxy-4-methoxyphenyl)methanone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=C(OC)C=C1O SODJJEXAWOSSON-UHFFFAOYSA-N 0.000 description 1
- SIPUZPBQZHNSDW-UHFFFAOYSA-N bis(2-methylpropyl)aluminum Chemical compound CC(C)C[Al]CC(C)C SIPUZPBQZHNSDW-UHFFFAOYSA-N 0.000 description 1
- SXXILWLQSQDLDL-UHFFFAOYSA-N bis(8-methylnonyl) phenyl phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=CC=C1 SXXILWLQSQDLDL-UHFFFAOYSA-N 0.000 description 1
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- QOYPXNPNQLIEIL-UHFFFAOYSA-N buta-2,3-dienamide Chemical compound NC(=O)C=C=C QOYPXNPNQLIEIL-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000012668 chain scission Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000004696 coordination complex Chemical class 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- MGNCLNQXLYJVJD-UHFFFAOYSA-N cyanuric chloride Chemical compound ClC1=NC(Cl)=NC(Cl)=N1 MGNCLNQXLYJVJD-UHFFFAOYSA-N 0.000 description 1
- HOMQMIYUSVQSHM-UHFFFAOYSA-N cycloocta-1,3-diene;nickel Chemical compound [Ni].C1CCC=CC=CC1.C1CCC=CC=CC1 HOMQMIYUSVQSHM-UHFFFAOYSA-N 0.000 description 1
- KZPXREABEBSAQM-UHFFFAOYSA-N cyclopenta-1,3-diene;nickel(2+) Chemical compound [Ni+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KZPXREABEBSAQM-UHFFFAOYSA-N 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical class OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 description 1
- NZYMWGXNIUZYRC-UHFFFAOYSA-N hexadecyl 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NZYMWGXNIUZYRC-UHFFFAOYSA-N 0.000 description 1
- BNRNAKTVFSZAFA-UHFFFAOYSA-N hydrindane Chemical compound C1CCCC2CCCC21 BNRNAKTVFSZAFA-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- OOCSVLHOTKHEFZ-UHFFFAOYSA-N icosanamide Chemical compound CCCCCCCCCCCCCCCCCCCC(N)=O OOCSVLHOTKHEFZ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- RDEAEKMWLZIGAR-UHFFFAOYSA-N iron;triphenylphosphane Chemical compound [Fe].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RDEAEKMWLZIGAR-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 1
- WGOPGODQLGJZGL-UHFFFAOYSA-N lithium;butane Chemical compound [Li+].CC[CH-]C WGOPGODQLGJZGL-UHFFFAOYSA-N 0.000 description 1
- CETVQRFGPOGIQJ-UHFFFAOYSA-N lithium;hexane Chemical compound [Li+].CCCCC[CH2-] CETVQRFGPOGIQJ-UHFFFAOYSA-N 0.000 description 1
- 238000010551 living anionic polymerization reaction Methods 0.000 description 1
- 238000010550 living polymerization reaction Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 235000018977 lysine Nutrition 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- FRVPQJVZFCJNCO-UHFFFAOYSA-N morpholine;2,4,6-trichloro-1,3,5-triazine Chemical compound C1COCCN1.ClC1=NC(Cl)=NC(Cl)=N1 FRVPQJVZFCJNCO-UHFFFAOYSA-N 0.000 description 1
- QWHCOOADMRDEHJ-UHFFFAOYSA-N n-(1,2,2,6,6-pentamethyl-3h-pyridin-4-yl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CC1(C)N(C)C(C)(C)CC(N(C=O)C2CC(C)(C)NC(C)(C)C2)=C1 QWHCOOADMRDEHJ-UHFFFAOYSA-N 0.000 description 1
- HWIAFYLMWOUWTC-UHFFFAOYSA-N n-(1,2,2,6,6-pentamethyl-3h-pyridin-4-yl)-n-(2-phenylethyl)formamide Chemical compound CC1(C)N(C)C(C)(C)CC(N(CCC=2C=CC=CC=2)C=O)=C1 HWIAFYLMWOUWTC-UHFFFAOYSA-N 0.000 description 1
- MDFHCLFIJGBMQF-UHFFFAOYSA-N n-(1,2,2,6,6-pentamethylpiperidin-4-yl)-n-pentylformamide Chemical compound CCCCCN(C=O)C1CC(C)(C)N(C)C(C)(C)C1 MDFHCLFIJGBMQF-UHFFFAOYSA-N 0.000 description 1
- OOWMVAUGKWICMC-UHFFFAOYSA-N n-(1,3-diphenylpropan-2-yl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)C(CC=1C=CC=CC=1)CC1=CC=CC=C1 OOWMVAUGKWICMC-UHFFFAOYSA-N 0.000 description 1
- QZUPDTBUCMLDNK-UHFFFAOYSA-N n-(1-acetyl-2,2,6,6-tetramethylpiperidin-4-yl)-n-cyclohexylformamide Chemical compound C1C(C)(C)N(C(=O)C)C(C)(C)CC1N(C=O)C1CCCCC1 QZUPDTBUCMLDNK-UHFFFAOYSA-N 0.000 description 1
- FZOXVSDDLTUBRR-UHFFFAOYSA-N n-(1-phenylpropan-2-yl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)C(C)CC1=CC=CC=C1 FZOXVSDDLTUBRR-UHFFFAOYSA-N 0.000 description 1
- QZXXIBHWMSDLOS-UHFFFAOYSA-N n-(2,2,6,6-tetramethyl-1,3-dihydropyridin-4-yl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)C1=CC(C)(C)NC(C)(C)C1 QZXXIBHWMSDLOS-UHFFFAOYSA-N 0.000 description 1
- CEIJBSAKFKLTCP-UHFFFAOYSA-N n-(2,2,6,6-tetramethylpiperidin-4-yl)-n-[(2,4,6-trimethylphenyl)methyl]formamide Chemical compound CC1=CC(C)=CC(C)=C1CN(C=O)C1CC(C)(C)NC(C)(C)C1 CEIJBSAKFKLTCP-UHFFFAOYSA-N 0.000 description 1
- KKAKGATZLWUOMA-UHFFFAOYSA-N n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CC1(C)CC(NC=O)CC(C)(C)N1 KKAKGATZLWUOMA-UHFFFAOYSA-N 0.000 description 1
- KLNWUTVTYIVMPZ-UHFFFAOYSA-N n-(2-ethoxyethyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCOCCN(C=O)C1CC(C)(C)NC(C)(C)C1 KLNWUTVTYIVMPZ-UHFFFAOYSA-N 0.000 description 1
- LSOPGJSPENDTTK-UHFFFAOYSA-N n-(2-morpholin-4-ylethyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CCN1CCOCC1 LSOPGJSPENDTTK-UHFFFAOYSA-N 0.000 description 1
- DSDMHUYTTJORQL-UHFFFAOYSA-N n-(2-phenylethyl)-n-(2,2,6,6-tetramethyl-1,3-dihydropyridin-4-yl)formamide Chemical compound CC1(C)NC(C)(C)CC(N(CCC=2C=CC=CC=2)C=O)=C1 DSDMHUYTTJORQL-UHFFFAOYSA-N 0.000 description 1
- MUBJJTWZKLWANR-UHFFFAOYSA-N n-(2-pyrrolidin-1-ylethyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CCN1CCCC1 MUBJJTWZKLWANR-UHFFFAOYSA-N 0.000 description 1
- LNEMJWKDNMUIEG-UHFFFAOYSA-N n-(4-bicyclo[2.2.1]heptanyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)C1(C2)CCC2CC1 LNEMJWKDNMUIEG-UHFFFAOYSA-N 0.000 description 1
- XXIXHPUQDFZFDD-UHFFFAOYSA-N n-(pyridin-2-ylmethyl)-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CC1=CC=CC=N1 XXIXHPUQDFZFDD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- GDPCOBUKQYGRLT-UHFFFAOYSA-N n-[2-[di(propan-2-yl)amino]ethyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CC(C)N(C(C)C)CCN(C=O)C1CC(C)(C)NC(C)(C)C1 GDPCOBUKQYGRLT-UHFFFAOYSA-N 0.000 description 1
- UQTZIMIVDFDCMU-UHFFFAOYSA-N n-[2-[formyl-(2,2,6,6-tetramethylpiperidin-4-yl)amino]ethyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CCN(C=O)C1CC(C)(C)NC(C)(C)C1 UQTZIMIVDFDCMU-UHFFFAOYSA-N 0.000 description 1
- UZYLMXILFBMWCD-UHFFFAOYSA-N n-[3-(2-ethylhexoxy)propyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCCCC(CC)COCCCN(C=O)C1CC(C)(C)NC(C)(C)C1 UZYLMXILFBMWCD-UHFFFAOYSA-N 0.000 description 1
- RSYRIBKNFBQEHX-UHFFFAOYSA-N n-[3-(dimethylamino)propyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CN(C)CCCN(C=O)C1CC(C)(C)NC(C)(C)C1 RSYRIBKNFBQEHX-UHFFFAOYSA-N 0.000 description 1
- WAUFJNDIEZQEGL-UHFFFAOYSA-N n-[3-[formyl-(2,2,6,6-tetramethylpiperidin-4-yl)amino]propyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CCCN(C=O)C1CC(C)(C)NC(C)(C)C1 WAUFJNDIEZQEGL-UHFFFAOYSA-N 0.000 description 1
- QPKKOVVTHUKWLE-UHFFFAOYSA-N n-[[4-[[formyl-(2,2,6,6-tetramethylpiperidin-4-yl)amino]methyl]phenyl]methyl]-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)CC(C=C1)=CC=C1CN(C=O)C1CC(C)(C)NC(C)(C)C1 QPKKOVVTHUKWLE-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- GVCQDTUESOCHEX-UHFFFAOYSA-N n-butyl-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)formamide Chemical compound CCCCN(C=O)C1CC(C)(C)N(C)C(C)(C)C1 GVCQDTUESOCHEX-UHFFFAOYSA-N 0.000 description 1
- TZJUUFKSLXWZFJ-UHFFFAOYSA-N n-chloro-2-phenyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)acetamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(Cl)C(=O)CC1=CC=CC=C1 TZJUUFKSLXWZFJ-UHFFFAOYSA-N 0.000 description 1
- CJWVDCJXOKKDCF-UHFFFAOYSA-N n-cyclohexyl-n-(1,2,2,6,6-pentamethyl-3h-pyridin-4-yl)formamide Chemical compound CC1(C)N(C)C(C)(C)CC(N(C=O)C2CCCCC2)=C1 CJWVDCJXOKKDCF-UHFFFAOYSA-N 0.000 description 1
- MOVMWAODDWMUMF-UHFFFAOYSA-N n-cyclohexyl-n-(2,2,6,6-tetramethyl-1,3-dihydropyridin-4-yl)formamide Chemical compound CC1(C)NC(C)(C)CC(N(C=O)C2CCCCC2)=C1 MOVMWAODDWMUMF-UHFFFAOYSA-N 0.000 description 1
- JUIUJRPOVSPFOA-UHFFFAOYSA-N n-cyclopentyl-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)N(C)C(C)(C)CC1N(C=O)C1CCCC1 JUIUJRPOVSPFOA-UHFFFAOYSA-N 0.000 description 1
- NLVBUGNTIXOLLF-UHFFFAOYSA-N n-cyclopentyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(C=O)C1CCCC1 NLVBUGNTIXOLLF-UHFFFAOYSA-N 0.000 description 1
- VAWWVTMEVDIDLF-UHFFFAOYSA-N n-ethyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)heptanamide Chemical compound CCCCCCC(=O)N(CC)C1CC(C)(C)NC(C)(C)C1 VAWWVTMEVDIDLF-UHFFFAOYSA-N 0.000 description 1
- KQPFCLXCHZVZBR-UHFFFAOYSA-N n-fluoro-2-phenyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)acetamide Chemical compound C1C(C)(C)NC(C)(C)CC1N(F)C(=O)CC1=CC=CC=C1 KQPFCLXCHZVZBR-UHFFFAOYSA-N 0.000 description 1
- YLDJOUWCUUHYKA-UHFFFAOYSA-N n-hexyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCCCCCN(C=O)C1CC(C)(C)NC(C)(C)C1 YLDJOUWCUUHYKA-UHFFFAOYSA-N 0.000 description 1
- VPIXUBIOGNTAIH-UHFFFAOYSA-N n-methoxy-2-phenyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)acetamide Chemical compound C=1C=CC=CC=1CC(=O)N(OC)C1CC(C)(C)NC(C)(C)C1 VPIXUBIOGNTAIH-UHFFFAOYSA-N 0.000 description 1
- XNAPVQLONIGSIP-UHFFFAOYSA-N n-methyl-2-phenyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)acetamide Chemical compound C=1C=CC=CC=1CC(=O)N(C)C1CC(C)(C)NC(C)(C)C1 XNAPVQLONIGSIP-UHFFFAOYSA-N 0.000 description 1
- ACVLBYOUBWKIEB-UHFFFAOYSA-N n-methyl-n-(2,2,6,6-tetramethyl-1,3-dihydropyridin-4-yl)cyclohexanecarboxamide Chemical compound C=1C(C)(C)NC(C)(C)CC=1N(C)C(=O)C1CCCCC1 ACVLBYOUBWKIEB-UHFFFAOYSA-N 0.000 description 1
- OBLNDCZPFRFPLV-UHFFFAOYSA-N n-octadecyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCCCCCCCCCCCCCCCCCN(C=O)C1CC(C)(C)NC(C)(C)C1 OBLNDCZPFRFPLV-UHFFFAOYSA-N 0.000 description 1
- WMYCJRDTVMSXPC-UHFFFAOYSA-N n-octyl-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)formamide Chemical compound CCCCCCCCN(C=O)C1CC(C)(C)N(C)C(C)(C)C1 WMYCJRDTVMSXPC-UHFFFAOYSA-N 0.000 description 1
- RLKVDNCNPGSFDO-UHFFFAOYSA-N n-octyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCCCCCCCN(C=O)C1CC(C)(C)NC(C)(C)C1 RLKVDNCNPGSFDO-UHFFFAOYSA-N 0.000 description 1
- OYWPFFVCNQQMLE-UHFFFAOYSA-N n-pentyl-n-(2,2,6,6-tetramethylpiperidin-4-yl)formamide Chemical compound CCCCCN(C=O)C1CC(C)(C)NC(C)(C)C1 OYWPFFVCNQQMLE-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- GHLZUHZBBNDWHW-UHFFFAOYSA-N nonanamide Chemical compound CCCCCCCCC(N)=O GHLZUHZBBNDWHW-UHFFFAOYSA-N 0.000 description 1
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- PSBKYMODPYHLAW-UHFFFAOYSA-N octan-4-amine Chemical compound CCCCC(N)CCC PSBKYMODPYHLAW-UHFFFAOYSA-N 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 1
- HDBWAWNLGGMZRQ-UHFFFAOYSA-N p-Vinylbiphenyl Chemical compound C1=CC(C=C)=CC=C1C1=CC=CC=C1 HDBWAWNLGGMZRQ-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- LGOPTUPXVVNJFH-UHFFFAOYSA-N pentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCCC(O)=S LGOPTUPXVVNJFH-UHFFFAOYSA-N 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- PTMHPRAIXMAOOB-UHFFFAOYSA-N phosphoramidic acid Chemical compound NP(O)(O)=O PTMHPRAIXMAOOB-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 1
- 229920001485 poly(butyl acrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920002338 polyhydroxyethylmethacrylate Polymers 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- ZRLVQFQTCMUIRM-UHFFFAOYSA-N potassium;2-methylbutan-2-olate Chemical compound [K+].CCC(C)(C)[O-] ZRLVQFQTCMUIRM-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- BFPFOLJFUVTHEP-UHFFFAOYSA-N ruthenium;triphenylphosphane Chemical compound [Ru].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 BFPFOLJFUVTHEP-UHFFFAOYSA-N 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- WRSPWQHUHVRNFV-UHFFFAOYSA-N tris[3,5-di(nonyl)phenyl] phosphite Chemical compound CCCCCCCCCC1=CC(CCCCCCCCC)=CC(OP(OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)=C1 WRSPWQHUHVRNFV-UHFFFAOYSA-N 0.000 description 1
- YRIDFQASBDRMBJ-UHFFFAOYSA-N undec-10-enamide Chemical compound NC(=O)CCCCCCCCC=C YRIDFQASBDRMBJ-UHFFFAOYSA-N 0.000 description 1
- FKVMWDZRDMCIAJ-UHFFFAOYSA-N undecanamide Chemical compound CCCCCCCCCCC(N)=O FKVMWDZRDMCIAJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J153/02—Vinyl aromatic monomers and conjugated dienes
- C09J153/025—Vinyl aromatic monomers and conjugated dienes modified
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell element sealing resin composition for sealing a solar cell element, and a solar cell module in which the solar cell element is sealed with the solar cell element sealing resin composition.
- the mainstream is one using a single crystal or polycrystalline type crystalline silicon element, one using a thin film amorphous silicon element, and the like.
- the transparent front substrate 1 made of a glass substrate or the like, the solar cell element 2, and the sealing for sealing the solar cell element from the sunlight incident surface side.
- a material having the material 3, the wiring 4 connected to the solar cell element, and the back surface protection sheet 5 is representative.
- an ethylene-vinyl acetate copolymer (EVA) is crosslinked and cured using a crosslinking agent such as an organic peroxide.
- EVA ethylene-vinyl acetate copolymer
- EVA used for the sealing material contains a structural unit derived from vinyl acetate, it is easily hydrolyzed over time by moisture or water permeated from the outside, and acetic acid is easily generated. In some cases, the generated acetic acid promotes the occurrence of corrosion due to contact with the wiring and electrodes inside the battery.
- a sealing resin that does not generate acid by hydrolysis instead of EVA such as an ethylene / ⁇ -olefin copolymer and A method using a sealing resin composition using a crosslinking agent (for example, Patent Documents 6 and 7), a method using a propylene-based polymer and a specific propylene-based copolymer (for example, Patent Document 8), etc.
- Patent Documents 6 and 7 A method using a sealing resin composition using a crosslinking agent
- Patent Document 8 a method using a propylene-based polymer and a specific propylene-based copolymer
- the method using an ethylene / ⁇ -olefin copolymer instead of EVA is considered to reduce the influence of acid generation, but the ethylene / ⁇ -olefin copolymer has both heat resistance and flexibility.
- the method of using a propylene polymer and a specific propylene copolymer is also considered to have a sufficiently high heat resistance, although the influence of acid generation is reduced and the heat resistance is sufficiently high. It is insufficient as an element sealing material. Therefore, in order to prevent the corrosion of the solar cell module and to greatly improve the durability, a sealing material that has low hygroscopicity and does not generate acid by hydrolysis is required.
- the present invention has been made in view of such circumstances, and is excellent in low moisture absorption, non-hydrolyzability, weather resistance, transparency, adhesiveness, flexibility, and adhesion to glass, and without being subjected to special water shielding treatment.
- the object is to provide a solar cell element sealing resin composition capable of sealing an element, and a solar cell module in which the solar cell element is sealed with the solar cell element sealing resin composition.
- JP-T-2002-531598 discloses a hard block having at least three blocks and having a structural unit derived from an aromatic vinyl monomer as a main component and a soft block having a structural unit derived from a conjugated diene as a main component.
- the block copolymer obtained by hydrogenating the carbon-carbon double bond of the prepolymer has high heat distortion resistance, good mechanical properties, high transparency, especially low water absorption, and is mechanically damaged. It is described that it can be used for covers for protection of facile systems (for example in the field of solar cells).
- the inventors of the present invention have studied to apply the block copolymer for sealing solar cell elements.
- the block copolymer specifically shown in the above literature the flexibility and adhesion to glass have been studied. Therefore, when this was used to seal the solar cell element, there was a problem that the durability of the solar cell module was lowered. Accordingly, as a result of further studies to eliminate this problem, the present inventors have determined that a resin composition containing a hydride of a block copolymer obtained by hydrogenating a carbon-carbon unsaturated bond of a specific block copolymer. Is excellent in low hygroscopicity, non-hydrolyzability, weather resistance, transparency, adhesiveness, flexibility and adhesion to glass, and seals solar cell elements without special water shielding treatment As a result, the present invention has been completed.
- the following solar cell element sealing resin compositions (1) to (6) are provided.
- the weight fraction is wB
- the main chain and side chain carbon-carbon unsaturated bonds of the block copolymer having a ratio of wA to wB (wA: wB) of 20:80 to 60:40 Containing a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds, which is the sum of carbon-carbon unsaturated bonds of an aromatic ring, and having a tensile modulus at 23 ° C
- the following solar cell module (7) is provided.
- the solar cell element sealing resin composition of the present invention is excellent in low hygroscopicity, non-hydrolyzability, weather resistance, transparency, flexibility, and adhesion to glass, and can be used without any special water shielding treatment. It is possible to seal the battery element. Moreover, since the resin composition for sealing a solar cell element of the present invention has sufficient heat resistance even if it is not cross-linked and cured using a cross-linking agent such as an organic peroxide, the cross-linking step is performed in the solar cell manufacturing process. Can be omitted.
- the solar cell module of the present invention is excellent in durability.
- FIG. 1 is a schematic cross-sectional view showing an outline of a crystalline silicon-based solar cell module.
- Resin composition for sealing solar cell elements of the present invention is a carbon of a specific block copolymer.
- -It contains a block copolymer hydride in which carbon unsaturated bonds are hydrogenated.
- Block Copolymer The block copolymer used in the present invention has at least two polymer blocks [A] and at least one polymer block [B].
- the polymer block [A] has a repeating unit (structural unit) derived from an aromatic vinyl compound as a main component.
- the content of the structural unit derived from the aromatic vinyl compound in the polymer block [A] is usually 90% by weight or more, preferably 95% by weight or more, more preferably 99% by weight or more.
- Examples of the component other than the structural unit derived from the aromatic vinyl compound in the polymer block [A] include a structural unit derived from a chain conjugated diene compound and / or a structural unit derived from another vinyl compound.
- the content of these components in the polymer block [A] is usually 10% by weight or less, preferably 5% by weight or less, more preferably 1% by weight or less.
- the plurality of polymer blocks [A] may be the same as or different from each other.
- the polymer block [B] has a repeating unit (structural unit) derived from a chain conjugated diene compound as a main component.
- the content of the structural unit derived from the chain conjugated diene compound in the polymer block [B] is usually 50% by weight or more, preferably 70% by weight or more, more preferably 90% by weight or more.
- the structural unit derived from the chain conjugated diene compound is in the above range, the resin composition of the present invention has an excellent balance of flexibility, adhesiveness, and solar cell element sealing properties.
- Examples of the component other than the structural unit derived from the chain conjugated diene compound in the polymer block [B] include a structural unit derived from an aromatic vinyl compound and / or a structural unit derived from another vinyl compound.
- the content of these components in the polymer block [B] is usually 30% by weight or less, preferably 10% by weight or less.
- the transparency of the resin composition of the present invention is improved. There exists a possibility that the softness
- the block copolymer has a plurality of polymer blocks [B]
- the plurality of polymer blocks [B] may be the same as or different from each other.
- the number of polymer blocks [A] in the block copolymer used in the present invention is usually 5 or less, preferably 4 or less, more preferably 3 or less.
- the weight average molecular weight of the polymer block having the maximum and minimum weight average molecular weight in the polymer block [A] is expressed as Mw (A1 ) And Mw (A2), and when the weight average molecular weight of the polymer block having the largest and smallest weight average molecular weight in the polymer block [B] is Mw (B1) and Mw (B2), respectively, the Mw ( The ratio between A1) and Mw (A2) (Mw (A1) / Mw (A2)) and the ratio between Mw (B1) and Mw (B2) (Mw (B1) / Mw (B2)) Each is 2.0 or less, preferably 1.5 or less, more preferably 1.2 or less.
- the form of the block copolymer block used in the present invention may be a chain type block or a radial type block, but a chain type block is preferred because of excellent mechanical strength.
- the triblock copolymer in which the polymer block [A] is bonded to both ends of the polymer block [B], and the polymer block [B] is bonded to both ends of the polymer block [A] A pentablock copolymer in which the polymer block [A] is bonded to the other end of both polymer blocks [B] is more preferable, and a triblock in which the polymer block [A] is bonded to both ends of the polymer block [B].
- a block copolymer is particularly preferred.
- the weight fraction of the entire polymer block [A] in the entire block copolymer is wA
- the weight fraction of the entire polymer block [B] in the entire block copolymer is 20:80 to 60:40, preferably 25:75 to 55:45, more preferably 30:70 to 50:50. is there.
- wA is too high, the heat resistance of the resin composition of the present invention is increased, but the flexibility is low, the adhesiveness and the solar cell element sealing property are inferior, and when wA is too low, the heat resistance is inferior.
- the molecular weight of the block copolymer used in the present invention is a polystyrene-reduced weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent, and is usually 30,000 to 200,000. , Preferably 40,000 to 150,000, more preferably 50,000 to 100,000. Further, the molecular weight distribution (Mw / Mn) of the block copolymer is preferably 3 or less, more preferably 2 or less, and particularly preferably 1.5 or less.
- a block copolymer having three polymer blocks includes a first step of polymerizing a monomer mixture (a1) containing an aromatic vinyl compound as a monomer component for forming a polymer block [A], and a polymer.
- a second step of polymerizing a monomer mixture (b1) containing a chain conjugated diene compound as a monomer component for forming the block [B], and an aromatic vinyl compound as a monomer component for forming the polymer block [A] It can manufacture by passing through the 3rd process which polymerizes the monomer mixture (a2) (However, a monomer mixture (a1) and a monomer mixture (a2) may be the same or different.).
- the block copolymer having five polymer blocks is a monomer mixture (a3) containing an aromatic vinyl compound as a monomer component for forming the polymer block [A] following the third step (provided that The monomer mixture (a3) can be produced through a fourth step of polymerizing the monomer mixture (a1) and / or the monomer mixture (a2).
- Examples of the aromatic vinyl compound used for forming the polymer blocks [A] and [B] include styrene; styrenes having a substituent on a vinyl group such as ⁇ -methylstyrene; 2-methylstyrene, 3-methylstyrene, 4 -Methylstyrene, 2,4-diisopropylstyrene, 2,4-dimethylstyrene, 4-t-butylstyrene, 5-t-butyl-2-methylstyrene, 4-monochlorostyrene, dichlorostyrene, 4-monofluorostyrene, Examples thereof include styrenes having a substituent on the benzene ring such as 4-phenylstyrene; vinyl lysines such as 4-vinylpyricin; Examples of the substituent include alkyl groups such as methyl group, ethyl group, isopropyl group, and t-butyl group
- styrene styrenes having a substituent on a vinyl group, and styrenes having an alkyl group as a substituent on a benzene ring are preferable, and styrene is particularly preferable. .
- the chain conjugated diene compound used is preferably one containing no polar group from the viewpoint of obtaining a low hygroscopic resin composition.
- Specific examples include 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, and 1,3-butadiene and isoprene are particularly preferable.
- Examples of other vinyl compounds used for forming the polymer blocks [A] and [B] include chain vinyl compounds and cyclic vinyl compounds. These compounds may have a nitrile group, an alkoxycarbonyl group, a hydroxycarbonyl group, or a halogen group as a substituent, and may be an unsaturated cyclic acid anhydride or an unsaturated imide compound.
- any of radical polymerization, anionic polymerization, cationic polymerization, coordinated anionic polymerization, coordinated cationic polymerization and the like may be used.
- radical polymerization, anionic polymerization, cationic polymerization, etc. are used in living polymerization, especially living anion polymerization, the polymerization operation and the hydrogenation reaction in the subsequent process are facilitated, and the resulting block copolymer is transparent. Will improve.
- the polymerization is carried out in the presence of a polymerization initiator in the temperature range of usually 0 ° C. to 100 ° C., preferably 10 ° C. to 80 ° C., particularly preferably 20 ° C. to 70 ° C.
- the polymerization initiator is not particularly limited, and known polymerization initiators (radical polymerization initiators, anionic polymerization initiators, cationic polymerization initiators, etc.) can be used.
- monoorganolithium such as n-butyllithium, sec-butyllithium, t-butyllithium, hexyllithium, phenyllithium; dilithiomethane, 1,4-dilithiobutane, 1, Polyfunctional organolithium compounds such as 4-dilithio-2-ethylcyclohexane, etc.
- monoorganolithium such as n-butyllithium, sec-butyllithium, t-butyllithium, hexyllithium, phenyllithium
- dilithiomethane 1,4-dilithiobutane
- Polyfunctional organolithium compounds such as 4-dilithio-2-ethylcyclohexane, etc.
- the polymerization reaction form may be any of solution polymerization, slurry polymerization, and the like, but if solution polymerization is used, the reaction heat can be easily removed. In this case, an inert solvent in which the polymer obtained in each step is dissolved is used as the solvent.
- Usable inert solvents include aliphatic hydrocarbons such as n-butane, n-pentane, isopentane, n-hexane, n-heptane, and isooctane; cyclopentane, cyclohexane, methylcyclopentane, methylcyclohexane, decalin, And alicyclic hydrocarbons such as bicyclo [4.3.0] nonane and tricyclo [4.3.0.1 2,5 ] decane; aromatic hydrocarbons such as benzene and toluene; Among these, alicyclic hydrocarbons are preferable because they can be used as they are as an inert solvent in the hydrogenation reaction described later, and the solubility of the block copolymer is good. These solvents may be used alone or in combination of two or more. The amount of the solvent used is usually 200 to 2000 parts by weight with respect to 100 parts by weight of all the monomers used.
- a randomizer or the like can be used in order to prevent only one component chain from becoming long.
- a Lewis base compound it is preferable to use a Lewis base compound as a randomizer.
- Lewis base compounds include ether compounds such as dimethyl ether, diethyl ether, diisopropyl ether, dibutyl ether, tetrahydrofuran, diphenyl ether, ethylene glycol diethyl ether, ethylene glycol methyl phenyl ether; tetramethylethylenediamine, trimethylamine, triethylamine, pyridine And the like; tertiary metal compounds such as potassium-t-amyl oxide and potassium-t-butyl oxide; phosphine compounds such as triphenylphosphine; and the like. These Lewis base compounds may be used alone or in combination of two or more.
- Block copolymer hydride The block copolymer hydride used in the present invention is a hydrogenated carbon-carbon unsaturated bond in the main chain and side chain of the block copolymer and a carbon-carbon unsaturated bond in the aromatic ring.
- the hydrogenation rate is 90% or more, preferably 97% or more, more preferably 99% or more. The higher the hydrogenation rate, the better the transparency, weather resistance, and heat resistance of the resin composition of the present invention.
- the hydrogenation rate of the block copolymer hydride used in the present invention can be determined by 1 H-NMR measurement.
- the hydrogenation method of the unsaturated bond is not particularly limited, and a known method may be used. However, a hydrogenation method that can increase the hydrogenation rate and has little polymer chain cleavage reaction is preferable. As such a preferable hydrogenation method, hydrogenation is performed with hydrogen gas in the presence of a hydrogenation catalyst containing at least one metal selected from nickel, cobalt, iron, titanium, rhodium, palladium, platinum, ruthenium, rhenium and the like. The method of performing reaction is mentioned.
- a hydrogenation catalyst either a heterogeneous catalyst or a homogeneous catalyst can be used, and the hydrogenation reaction is preferably carried out in an organic solvent.
- the heterogeneous catalyst for example, a catalyst made of a metal or a metal compound or a supported catalyst supported on an appropriate carrier can be used.
- the carrier include activated carbon, silica, alumina, calcium carbonate, titania, magnesia, zirconia, diatomaceous earth, silicon carbide, calcium fluoride and the like.
- the supported amount of the catalyst is usually in the range of 0.1 to 60% by weight, preferably 1 to 50% by weight, based on the total amount of the catalyst and the carrier.
- a catalyst having a specific surface area of 100 to 500 m 2 / g and an average pore diameter of 100 to 1000 mm, preferably 200 to 500 mm is preferable.
- the value of the specific surface area is a value calculated by measuring the nitrogen adsorption amount and using the BET equation, and the value of the average pore diameter is a value measured by a mercury intrusion method.
- homogeneous catalysts include catalysts in which nickel, cobalt, titanium or iron compounds are combined with organometallic compounds (for example, organoaluminum compounds, organolithium compounds); organics such as rhodium, palladium, platinum, ruthenium and rhenium. Metal complex catalyst; etc. can be used.
- organometallic compounds for example, organoaluminum compounds, organolithium compounds
- organics such as rhodium, palladium, platinum, ruthenium and rhenium.
- Metal complex catalyst; etc. can be used.
- nickel, cobalt, titanium, or iron compound examples include acetylacetonate compounds, carboxylates, and cyclopentadienyl compounds of various metals (nickel, cobalt, titanium, or iron).
- organic aluminum compound examples include alkylaluminums such as triethylaluminum and triisobutylaluminum; aluminum halides such as diethylaluminum chloride and ethylaluminum dichloride; alkylaluminum hydrides such as diisobutylaluminum hydride; and the like.
- organometallic complex catalysts include transition metal complexes such as dihydrido-tetrakis (triphenylphosphine) ruthenium, dihydrido-tetrakis (triphenylphosphine) iron, bis (cyclooctadiene) nickel, and bis (cyclopentadienyl) nickel. It is done.
- These hydrogenation catalysts may be used alone or in combination of two or more.
- the amount of the hydrogenation catalyst used is usually 0.01 to 100 parts by weight, preferably 0.05 to 50 parts by weight, more preferably 0.1 to 30 parts by weight with respect to 100 parts by weight of the polymer.
- the hydrogenation reaction temperature is usually 10 ° C to 250 ° C, preferably 50 ° C to 200 ° C, more preferably 80 ° C to 180 ° C. In such a temperature range, the hydrogenation rate increases and molecular cleavage also decreases.
- the hydrogen pressure in the hydrogenation reaction is usually 0.1 MPa to 30 MPa, preferably 1 MPa to 20 MPa, more preferably 2 MPa to 10 MPa. At such a hydrogen pressure, the hydrogenation rate increases, molecular chain scission decreases, and operability is excellent.
- the hydrogenation catalyst and / or polymerization catalyst is removed from the reaction solution containing the block copolymer hydride by a method such as filtration or centrifugation, and then the target block is obtained from the obtained solution.
- Copolymer hydride can be recovered.
- the method for recovering the block copolymer hydride from the reaction solution include a steam coagulation method in which the solvent is removed by steam stripping from a solution in which the block copolymer hydride is dissolved, and the solvent is removed under reduced pressure heating.
- Known methods such as a direct desolvation method and a coagulation method in which a solution is poured into a poor solvent of a block copolymer hydride to precipitate and solidify.
- the form of the recovered block copolymer hydride is not limited, but it is usually in the form of a pellet so that it can be easily molded after that.
- Examples of the method of forming into a pellet include known methods such as a direct solvent removal method and a coagulation method.
- the direct desolvation method for example, the molten block copolymer hydride can be extruded from a die into a strand shape, cooled, and then cut with a pelletizer into pellets for various moldings.
- the solidification method for example, after drying the obtained solidified product, it is extruded in a molten state by an extruder, and can be formed into a pellet in the same manner as described above and used for a solar cell element sealing material.
- shape molding and processing to a pellet form, you may add compounding components (after-mentioned), such as antioxidant, to a block copolymer hydride.
- the molecular weight of the block copolymer hydride used in the present invention is a weight average molecular weight (Mw) in terms of polystyrene measured by GPC using THF as a solvent, and is usually 30,000 to 200,000, preferably 40,000. To 150,000, more preferably 50,000 to 100,000.
- Mw weight average molecular weight
- the Mw of the block copolymer hydride is in this range, the mechanical strength and heat resistance of the resulting resin composition are improved.
- the molecular weight distribution (Mw / Mn) of the block copolymer hydride is preferably 3 or less, more preferably 2 or less, and particularly preferably 1.5 or less. When Mw / Mn is within the above range, the mechanical strength and heat resistance of the resulting resin composition are improved.
- Resin composition for sealing solar cell elements of the present invention contains the block copolymer hydride and has a tensile modulus of 1.0 to 500 MPa, preferably 2 to 300 MPa. It is characterized by being. If the tensile elastic modulus is too low, the solar cell element cannot be held and the solar cell module is likely to be deformed. If the tensile elastic modulus is too high, the solar cell element is likely to be damaged such as cracks. If the wA of the block copolymer is increased, the tensile elastic modulus can be increased, and if the wA is decreased, the tensile elastic modulus can be decreased.
- the content of the block copolymer hydride in the resin composition for sealing a solar cell element of the present invention is usually 60% by weight or more, preferably 75% by weight, based on the total resin composition for sealing a solar cell element. As mentioned above, More preferably, it is 90 weight% or more.
- the resin composition for sealing a solar cell element of the present invention can contain a desired compounding component in order to improve the performance of the resin composition for sealing a solar cell element.
- a compounding component a polymer other than the block copolymer hydride for improving resin properties; an antioxidant, a light stabilizer, an ultraviolet absorber for improving weather resistance, heat resistance, etc .; adhesiveness Coupling agents, lubricants, surfactants, inorganic fillers, etc. for improving sealing properties and sealing properties.
- the compounding components may be used alone or in combination of two or more. Of these, the use of an antioxidant, a light-resistant stabilizer, and an ultraviolet absorber is preferred, and the use of a combination of an antioxidant, a light-resistant stabilizer and / or an ultraviolet absorber is more preferred.
- Polymers other than block copolymer hydrides examples include olefin polymers such as ethylene / propylene copolymer, propylene / ethylene / 1-butene copolymer; polyisobutylene, isobutylene / isoprene copolymer hydride, etc.
- petroleum resins are preferred for the purpose of improving the transparency and
- an antioxidant in order to improve thermal stability, an antioxidant can be blended in the resin composition of the present invention.
- the antioxidant to be used include phosphorus antioxidants, phenol antioxidants, sulfur antioxidants and the like, and phosphorus antioxidants with less coloring are preferable.
- Phosphorous antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, tris (dinonylphenyl) phosphite, tris (2,4-di-t -Butylphenyl) phosphite, monophosphite such as 10- (3,5-di-t-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide
- phenolic antioxidants include pentaerythrityl tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 2,2-thio-diethylenebis [3- (3 , 5-di-t-butyl-4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, 3,9-bis ⁇ 2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) proonyloxy] -1,1-dimethylethyl ⁇ -2,4,8,10-tetraoxaspiro [5,5] undecane, 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene and the like.
- sulfur-based antioxidants examples include dilauryl-3,3′-thiodipropionate, dimyristyl 3,3′-thiodipropionate, distearyl-3,3′-thiodipropionate, laurylstearyl-3,3.
- '-Thiodipropionate pentaerythritol-tetrakis- ( ⁇ -lauryl-thio-propionate, 3,9-bis (2-dodecylthioethyl) -2,4,8,10-tetraoxaspiro [5,5] An undecane etc. are mentioned.
- the blending amount of the antioxidant is usually 0.01 to 1 part by weight, preferably 0.05 to 0.5 part by weight, more preferably 0.1 to 0 part per 100 parts by weight of the block copolymer hydride. .3 parts by weight. .
- a hindered amine light resistance stabilizer is preferable, and 3,5-di-t-butyl-4-hydroxyphenyl group, 2,2,6,6-tetramethylpiperidyl group, or 1, Examples thereof include compounds having a 2,2,6,6-pentamethyl-4-piperidyl group and the like.
- N, N′-bis (2,2,6,6-tetramethyl-4-N-methylpiperidyl) -N, N′-diformyl-alkylenediamines N, N′-bis (2,2,6,6-tetramethyl-4-N-methylpiperidyl), N, N, N′-bis (2,2,6,6-tetramethyl-4-piperidyl) -N, N′-diformylalkylenediamine, N, N′-bis (2,2,6,6-tetramethyl- 4-piperidyl) -N, N′-bisalkylene fatty acid amides, poly [ ⁇ 6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl ⁇ ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ hexamethylene ⁇ (2,2,6,6-tetramethyl-4-piperidyl) imino ⁇ ] is preferred,
- the amount of the hindered amine light-resistant stabilizer is usually 0.1 to 10 parts by weight, preferably 0.5 to 7 parts by weight, more preferably 1 to 5 parts by weight, based on 100 parts by weight of the block copolymer hydride. It is. When the amount of the hindered amine light-resistant stabilizer is less than this, the effect of improving the weather resistance of the resin composition for sealing a solar cell element is not necessarily sufficient. At the time of the melt molding process for molding the resin composition into a sheet, the dirt on the T-die and the cooling roll of the extruder becomes severe and the processability is remarkably inferior, which is not industrial.
- the hindered amine light resistance stabilizer can further improve the light resistance when used in combination with the above-mentioned antioxidant, particularly a phosphorus antioxidant.
- the resin composition of the present invention may contain an ultraviolet absorber.
- the ultraviolet absorber include benzophenone ultraviolet absorbers, salicylic acid ultraviolet absorbers, and benzotriazole ultraviolet absorbers.
- benzophenone ultraviolet absorbers examples include 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid trihydrate, 2-hydroxy-4-octyloxy Benzophenone, 4-dodecaloxy-2-hydroxybenzophenone, 4-benzyloxy-2-hydroxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, etc.
- the salicylic acid-based UV absorbers include phenylsulcylate, 4-t-butylphenyl-2-hydroxybenzoate, phenyl-2-hydroxybenzoate, 2,4-di-t-butylphenyl-3,5-di- t-Butyl-4-hydroxybe Zoate, hexadecyl-3,5-di-t-butyl-4-hydroxybenzoate, etc .; benzotriazole ultraviolet absorbers include 2- (2-hydroxy-5-methylphenyl) 2H-benzotriazole, 2- (3 -T-butyl-2-hydroxy-5-methylphenyl) -5-chloro-2H-benzotriazole, 2- (3,5-di-t-butyl-2-hydroxyphenyl) -5-chloro-2H-benzo Triazole, 2- (3,5-di-t-butyl-2-hydroxyphenyl) -2H-benzotriazole, 5-chloro-2- (3,5-di-
- the blending amount of the ultraviolet absorber is usually 0.01 to 1 part by weight, preferably 0.05 to 0.5 part by weight, more preferably 0.1 to 0 part by weight based on 100 parts by weight of the block copolymer hydride. .3 parts by weight.
- the ultraviolet absorber can further improve the light resistance when used in combination with the above-mentioned hindered amine light-resistant stabilizer, but no further improvement is observed even if it is added excessively beyond the above range.
- the resin composition of the present invention contains a blending component in addition to the block copolymer hydride
- the resin composition of the present invention uniformly disperses the blending component in the block copolymer hydride.
- the compounding component is dissolved in a suitable solvent and added to the block copolymer hydride solution, and then the solvent is removed and the compounding component is removed.
- a method of recovering a hydride of a block copolymer containing a mixture a method of kneading a blended component by melting the hydride of a block copolymer with a twin-screw kneader, a roll, a Brabender, an extruder, etc. It is done.
- the resin composition for sealing solar cell elements of the present invention is suitable for sealing electric and electronic devices and the like because of its low hygroscopicity, non-hydrolyzability, weather resistance, transparency, flexibility and adhesion to glass. It is particularly suitable for a solar cell element sealing material.
- Solar cell module The solar cell module of the present invention is obtained by sealing a solar cell element with the resin composition for sealing a solar cell element of the present invention.
- the resin composition for sealing a solar cell element of the present invention is usually formed into a sheet shape, subjected to a process for producing a solar cell module, and used as a solar cell element sealing material.
- the thickness of the sheet is not particularly limited, but is preferably in the range of 0.1 to 1 mm.
- the sheet thickness of the solar cell element sealing resin composition is preferably 0.3. ⁇ 0.5 mm.
- the sheet thickness is smaller than 0.1 mm, glass and solar cell elements are likely to be damaged in the heating lamination process in the production of the solar cell module.
- the sheet thickness is larger than 1 mm, the light transmittance of the sheet is lowered, The amount of the resin composition for sealing a solar cell element is increased and the economic efficiency is lowered.
- the sheet molding method is not particularly limited, and known melt extrusion molding (cast molding, extrusion molding, sheet molding, inflation molding, etc.), compression molding, calendar molding, and the like can be applied.
- Sheet molding conditions are appropriately selected depending on the molding method.
- the resin temperature is appropriately selected in the range of usually 180 to 280 ° C., preferably 200 to 260 ° C., more preferably 220 to 250 ° C. If the resin temperature is too low, the fluidity deteriorates and the molded sheet is liable to be damaged, such as the skin and die lines, and if the resin temperature is too high, the silver streaks due to thermal decomposition of the block copolymer hydride. It is not preferable because it tends to cause defects such as the occurrence of odors and the decrease in molecular weight and mechanical strength. Since the resin composition for encapsulating a solar cell element of the present invention does not require the blending of an organic peroxide for imparting thermal crosslinkability, the selection range of the melt molding temperature is wide.
- the shape of the sheet includes a flat shape and a shape with embossing. Further, in order to prevent blocking between sheets, a release film can be stacked on one side of the sheet and stored.
- the embossed sheet has a cushioning property against the glass and solar cell element at the time of lamination in the solar cell module manufacturing process, and is preferable in terms of preventing these damages.
- seat using the resin composition for solar cell element sealing of this invention is laminated
- a surface protective layer is laminated on the surface and used for solar cells.
- the transparent front substrate consisting of a glass substrate etc.
- seat (The sheet
- a method of laminating a solar cell element and wiring connected to the solar cell element, a sheet using the solar cell element sealing resin composition of the present invention, a back surface protective sheet in this order, and then heat laminating by vacuum suction or the like. is there.
- the transparent front substrate a solar cell element and a layer composed of a sheet using the resin composition for sealing a solar cell element of the present invention can be protected, and the performance as a solar cell is not impaired.
- a substrate made of glass, polymethyl methacrylate resin, cyclic polyolefin resin, fluorine resin, polyethylene terephthalate resin, corn resin, polycarbonate resin, or the like can be used. Since the sheet using the solar cell element sealing resin composition of the present invention has low moisture permeability and low hygroscopicity, the transparent front substrate does not necessarily have to have moisture barrier properties, and is a lightweight transparent resin. It is also possible to use a sheet.
- the back surface protection sheet is not essential as a water shielding layer, and may be applied for the purpose of mitigating mechanical impact.
- a polyethylene terephthalate resin sheet or a polycarbonate resin sheet that is inexpensive and excellent in mechanical strength can be used.
- the back surface protective sheet may have a light shielding property and / or a light reflecting property.
- the back surface protective sheet may be one containing a light-shielding pigment such as an ultraviolet absorber or titanium oxide.
- a layer made of a known adhesive or adhesive resin may be provided.
- Weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn) The molecular weights of the block copolymer and the hydride of the block copolymer were measured at 38 ° C. as standard polystyrene equivalent values by GPC using THF as an eluent. As the measuring device, HLC8020GPC manufactured by Tosoh Corporation was used.
- Hydrogenation rate The hydrogenation rate of the main chain, side chain and aromatic ring of the block copolymer hydride was calculated by measuring the 1 H-NMR spectrum of the block copolymer hydride.
- the glass surface is the light source side, and a white PET film (Lumirror (registered trademark) E20, thickness 125 ⁇ m, manufactured by Toray Industries, Inc.) is overlaid on the back surface, and a sunshine weather meter (WEL-SUN-HC B, manufactured by Suga Test Instruments Co., Ltd.), exposed to 1000 hours under conditions of a sunshine carbon arc lamp, a black panel temperature of 63 ° C., and a relative humidity of 50%. The light transmittance of the test piece on which the extruded sheet was bonded was measured.
- a white PET film Limirror (registered trademark) E20, thickness 125 ⁇ m, manufactured by Toray Industries, Inc.
- WEL-SUN-HC B sunshine weather meter
- the polymerization conversion rate at this point was 99.5% (measured by gas chromatography, the same applies hereinafter).
- 50.0 parts of dehydrated isoprene was added, and stirring was continued at the same temperature for 30 minutes. At this time, the polymerization conversion rate was 99%.
- 25.0 parts of dehydrated styrene was further added and stirred at the same temperature for 60 minutes. The polymerization conversion rate at this point was almost 100%.
- 0.5 part of isopropyl alcohol was added to the reaction solution to stop the reaction, and a solution (polymer solution) containing the block copolymer (a) was obtained.
- the obtained block copolymer (a) had a weight average molecular weight (Mw) of 81,400 and a molecular weight distribution (Mw / Mn) of 1.05.
- the polymer solution was transferred to a pressure-resistant reactor equipped with a stirrer, and silica-alumina supported nickel catalyst (E22U, nickel supported amount 60%; manufactured by JGC Chemical Industry Co., Ltd.) 4.0 parts as a hydrogenation catalyst. And 100 parts of dehydrated cyclohexane were added and mixed. The inside of the reactor was replaced with hydrogen gas, and hydrogen was supplied while stirring the solution. A hydrogenation reaction was performed at a temperature of 170 ° C. and a pressure of 4.5 MPa for 6 hours. The weight average molecular weight (Mw) of the block copolymer hydride (A) after the hydrogenation reaction was 86,200, and the molecular weight distribution (Mw / Mn) was 1.06.
- Mw weight average molecular weight
- reaction solution is filtered to remove the hydrogenation catalyst, and then phosphorous antioxidant 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetrakis-t-butyldibenzo [d, f] [1.3.2] dioxaphosphepine (Sumilyzer (registered trademark) GP, manufactured by Sumitomo Chemical Co., Ltd. It is referred to as “agent A”.)) 1.0 part of xylene solution in which 0.1 part was dissolved was added and dissolved.
- block copolymer hydride [A] pellets A 85 parts of pellets (block copolymer hydride [A] pellets) were obtained.
- the resulting block copolymer hydride [A] had a weight average molecular weight (Mw) of 85,300 and a molecular weight distribution (Mw / Mn) of 1.11. The hydrogenation rate was almost 100%.
- pellets containing the block copolymer hydride [C] and the antioxidant A were obtained in the same manner as in Reference Example 1.
- the resulting block copolymer hydride [C] had a weight average molecular weight (Mw) of 141,000 and a molecular weight distribution (Mw / Mn) of 1.15.
- the hydrogenation rate was almost 100%.
- Example 1 Manufacturing of resin composition for sealing solar cell element [A1] (pellet of block copolymer hydride [A] obtained in Reference Example 1) 100 parts, A polymer of N′-bis (2,2,6,6-tetramethyl-4-piperidinyl) -1,6-hexanediamine and 2,4,6-trichloro-1,3,5-triazine; -2.0 parts of a reaction product of butyl-1-butanamine and N-butyl-2,2,6,6-tetramethyl-4-piperidineamine (CHIMASSORB (registered trademark) 2020, manufactured by Ciba Japan) This mixture was kneaded at a resin temperature of 250 ° C.
- CHIMASSORB registered trademark
- Example 2 (Extruded sheet) Resin with a 40 mm ⁇ screw after the pellets of the solar cell element sealing resin composition [A1] were heated at 50 ° C. for 4 hours using a hot air dryer in which air was circulated to remove dissolved air.
- a T-die film melt extrusion molding machine (T-die width 500 mm) having a melt-kneader, thickness 400 ⁇ m, width under molding conditions of molten resin temperature 210 ° C., T-die temperature 210 ° C., roll temperature 50 ° C.
- a 500 mm sheet was extruded to obtain an extruded sheet [SA1].
- a polyethylene release film was laminated on the obtained extruded sheet [SA1], and was wound up and collected.
- a pellet of the resin composition [A1] for sealing a solar cell element is subjected to a test piece having a thickness of 3 mm and a test having a thickness of 1 mm using a press molding machine under molding conditions of a resin temperature of 180 ° C. and a pressure of 1.1 MPa. Each piece [PA1] was produced.
- Example 2 Resin composition for sealing solar cell elements [A2]) (Pellets of block copolymer hydride [A] obtained in Reference Example 1) 100 parts of the same hindered amine light-resistant stabilizer as in Example 1 and 2-benzotriazole UV absorber 2- 0.2 part of (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol (TINUVIN (registered trademark) 329, manufactured by Ciba Japan) was added. This mixture was kneaded in the same manner as in Example 1 to obtain 95 parts of a pellet of the resin composition for sealing a solar cell element [A2].
- TINUVIN registered trademark
- Example 3 (Resin composition for sealing solar cell element [B]) To 100 parts of (block copolymer hydride [B] pellets obtained in Reference Example 2), a light stabilizer and an ultraviolet absorber were added in the same manner as in Example 2. This mixture was kneaded in the same manner as in Example 1 to obtain 93 parts of pellets of the resin composition for solar cell element sealing [B]. In addition, using the pellet of the resin composition for sealing a solar cell element [B], an extrusion-molded sheet [SB] and a press-molded test piece [PB] are prepared in the same manner as in Example 1 to transmit light. Rate, water absorption rate, tensile strength, tensile elongation, volume resistivity, adhesion to glass substrate, corrosion resistance and weather resistance of the encapsulated copper plate, and durability evaluation of the solar cell module. The results are shown in Table 1.
- Example 4 (Resin composition for sealing solar cell element [C])
- a light-resistant stabilizer and an ultraviolet absorber were added to 100 parts of (block copolymer hydride [C] pellets obtained in Reference Example 3).
- This mixture was kneaded in the same manner as in Example 1 to obtain 95 parts of pellets of the solar cell element sealing resin composition [C].
- an extruded sheet [SC] and a press-molded test piece [PC] were prepared in the same manner as in Example 1 to transmit light. Rate, water absorption rate, tensile strength, tensile elongation, volume resistivity, adhesion to glass substrate, corrosion resistance and weather resistance of the encapsulated copper plate, and durability evaluation of the solar cell module. The results are shown in Table 1.
- Example 5 (Resin composition for sealing solar cell elements [D]) A light-resistant stabilizer and an ultraviolet absorber were added to 100 parts of the block copolymer hydride [D] pellets obtained in Reference Example 4 in the same manner as in Example 2. This mixture was kneaded in the same manner as in Example 1 to obtain 95 parts of a pellet of the resin composition for sealing a solar cell element [D]. Further, using the pellet of the resin composition for sealing a solar cell element [D], an extruded sheet [SD] and a press-molded test piece [PD] were prepared in the same manner as in Example 1 to transmit light. Rate, water absorption rate, tensile strength, tensile elongation, volume resistivity, adhesion to glass substrate, corrosion resistance and weather resistance of the encapsulated copper plate, and durability evaluation of the solar cell module. The results are shown in Table 1.
- Example 6 (Resin composition for sealing solar cell elements [A3]) 10 parts of alicyclic saturated hydrocarbon resin having a hydroxyl group (Arcon (registered trademark) KR1842, manufactured by Arakawa Chemical Co., Ltd.) with respect to 100 parts of the block copolymer hydride [A] obtained in Reference Example 1 The same light-resistant stabilizer and ultraviolet absorber as in Example 2 were added. This mixture was kneaded in the same manner as in Example 1 to obtain 106 parts of pellets of a resin composition for sealing a solar cell element [A3].
- Arcon registered trademark
- KR1842 manufactured by Arakawa Chemical Co., Ltd.
- Example 2 The same light-resistant stabilizer and ultraviolet absorber as in Example 2 were added to 100 parts of the same ethylene / vinyl acetate copolymer used in Comparative Example 1. Further, 0.1 part of 2,5-dimethyl-2,5-di (t-butylperoxy) hexane (Perhexa (registered trademark) 25B, manufactured by NOF Corporation) as an organic peroxide and triallyl as a crosslinking aid 0.5 parts of isocyanurate (M-60, manufactured by Nippon Kasei Co., Ltd.) was added, and kneaded at a resin temperature of 110 ° C.
- Perhexa registered trademark
- isocyanurate M-60, manufactured by Nippon Kasei Co., Ltd.
- Table 1 shows the following.
- the resin composition for sealing a solar cell element of the present invention is excellent in light transmittance, water absorption, mechanical strength, flexibility, adhesion to glass, and weather resistance, and the solar cell element is sealed with the resin composition.
- the obtained solar cell module is excellent in durability (Examples 1 to 6).
- a sealing material made of ethylene / vinyl acetate copolymer (EVA) is used, there is a concern that the internal wiring may be corroded when kept for a long time in a high temperature and high humidity environment (Comparative Examples 1 and 2).
- the resin composition for sealing a solar cell element of the present invention is useful for sealing a solar cell element.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
従って、太陽電池モジュールの腐食を防止して耐久性を格段に向上させるためには、吸湿性が低く、加水分解によって酸を発生させない封止材が求められている。
そこで、本発明者らは、この不具合を解消すべく更に検討した結果、特定のブロック共重合体の炭素-炭素不飽和結合を水素化して得られるブロック共重合体水素化物を含有する樹脂組成物は、低吸湿性、非加水分解性、耐候性、透明性、接着性、柔軟性及びガラスとの接着性のすべてに優れ、特別な遮水処理を施すことなく太陽電池素子を封止することが可能であることを見出し、本発明を完成させるに至った。
(1)少なくとも2つの、芳香族ビニル化合物由来の繰り返し単位を主成分とする重合体ブロック[A]と、少なくとも1つの、鎖状共役ジエン化合物由来の繰り返し単位を主成分とする重合体ブロック[B]とを有するブロック共重合体であって、ブロック共重合体全体に占める全重合体ブロック[A]の重量分率をwAとし、ブロック共重合体全体に占める全重合体ブロック[B]の重量分率をwBとしたときに、wAとwBとの比(wA:wB)が20:80~60:40であるブロック共重合体の、主鎖及び側鎖の炭素-炭素不飽和結合と、芳香環の炭素-炭素不飽和結合との合計である全不飽和結合の90%以上を水素化して得られるブロック共重合体水素化物を含有し、23℃における引張り弾性率が1.0~500MPaであることを特徴とする太陽電池素子封止用樹脂組成物。
(3)ブロック共重合体が、前記重合体ブロック[B]の両端に、前記重合体ブロック[A]が結合したトリブロック共重合体である(1)又は(2)に記載の太陽電池素子封止用樹脂組成物。
(5)さらに、ブロック共重合体水素化物100重量部に対して、ヒンダードアミン系耐光安定剤を0.1~10重量部含有することを特徴とする(4)に記載の太陽電池素子封止用樹脂組成物。
(6)さらに、ブロック共重合体水素化物100重量部に対して、紫外線吸収剤を0.01~1重量部含有することを特徴とする(5)に記載の太陽電池素子封止用樹脂組成物。
(7)太陽電池素子が、(1)~(6)のいずれかに記載の太陽電池素子封止用樹脂組成物により封止されてなる太陽電池モジュール。
本発明の太陽電池モジュールは耐久性に優れる。
1)太陽電池素子封止用樹脂組成物
本発明の太陽電池素子封止用樹脂組成物(以下、「本発明の樹脂組成物」ということがある。)は、特定のブロック共重合体の炭素-炭素不飽和結合を水素化したブロック共重合体水素化物を含有する。
本発明で用いるブロック共重合体は、少なくとも2つの重合体ブロック[A]と少なくとも1つの重合体ブロック[B]とを有する。
複数の重合体ブロック[A]は、互いに同一であっても、相異なっていてもよい。
ブロック共重合体が重合体ブロック[B]を複数有する場合、複数の重合体ブロック[B]は、互いに同一であっても、相異なっていてもよい。
なかでも、重合体ブロック[B]の両端に重合体ブロック[A]が結合したトリブロック共重合体、及び、重合体ブロック[A]の両端に重合体ブロック[B]が結合し、更に、該両重合体ブロック[B]の他端にそれぞれ重合体ブロック[A]が結合したペンタブロック共重合体がより好ましく、重合体ブロック[B]の両端に重合体ブロック[A]が結合したトリブロック共重合体が特に好ましい。
また、5つの重合体ブロックを有するブロック共重合体は、前記第3工程に引き続いて、重合体ブロック[A]を形成させるモノマー成分として、芳香族ビニル化合物を含有するモノマー混合物(a3)(ただし、モノマー混合物(a3)は、モノマー混合物(a1)及び/又はモノマー混合物(a2)と同一でも相異なっていてもよい。)を重合させる第4工程を経ることにより製造することができる。
重合開始剤としては、特に制限されず、公知の重合開始剤(ラジカル重合開始剤、アニオン重合開始剤、カチオン重合開始剤等)が使用できる。
例えば、リビングアニオン重合の場合は、重合開始剤として、n-ブチルリチウム、sec-ブチルリチウム、t-ブチルリチウム、ヘキシルリチウム、フェニルリチウム等のモノ有機リチウム;ジリチオメタン、1,4-ジリチオブタン、1,4-ジリチオ-2-エチルシクロヘキサン等の多官能性有機リチウム化合物;等が使用可能である。
これらの溶媒は、それぞれ単独で用いてもよいし、あるいは2種類以上を組み合わせて使用することもできる。
溶媒の使用量は、全使用モノマー100重量部に対して、通常200~2000重量部である。
本発明で用いるブロック共重合体水素化物は、上記のブロック共重合体の主鎖及び側鎖の炭素-炭素不飽和結合、並びに芳香環の炭素-炭素不飽和結合を水素化したものであり、その水素化率は90%以上、好ましくは97%以上、より好ましくは99%以上である。水素化率が高いほど、本発明の樹脂組成物の透明性、耐候性、耐熱性が良好である。本発明で用いられるブロック共重合体水素化物の水素化率は、1H-NMR測定により求めることができる。
担持型触媒としては、例えば、比表面積が100~500m2/g、平均細孔径が100~1000Å、好ましくは200~500Åであるものが好ましい。上記の比表面積の値は窒素吸着量を測定し、BET式を用いて算出した値であり、平均細孔径の値は水銀圧入法により測定した値である。
水素化触媒の使用量は、重合体100重量部に対して、通常0.01~100重量部、好ましくは0.05~50重量部、より好ましくは0.1~30重量部である。
また水素化反応の水素圧力は、通常0.1MPa~30MPa、好ましくは1MPa~20MPa、より好ましくは2MPa~10MPaである。このような水素圧力であるときに水素化率が高くなり、分子鎖切断も減少し、操作性にも優れる。
ペレット状に成形加工する方法としては、直接脱溶媒法や凝固法等の公知の方法が挙げられる。直接脱溶媒法を用いる場合は、例えば、溶融状態のブロック共重合体水素化物をダイからストランド状に押し出し、冷却後、ペレタイザーでカッティングしてペレット状にして各種の成形に供することができる。凝固法を用いる場合は、例えば、得られた凝固物を乾燥した後、押出機により溶融状態で押し出し、上記と同様にペレット状にして太陽電池素子封止材用途に供することができる。
また、ペレット状に成形加工する場合、ブロック共重合体水素化物に酸化防止剤等の配合成分(後述)を添加してもよい。
また、ブロック共重合体水素化物の分子量分布(Mw/Mn)を、好ましくは3以下、より好ましくは2以下、特に好ましくは1.5以下にする。Mw/Mnを上記範囲となるようにすると、得られる樹脂組成物の機械強度や耐熱性が向上する。
本発明の太陽電池素子封止用樹脂組成物は、前記ブロック共重合体水素化物を含有し、その引張り弾性率は1.0~500MPa、好ましくは2~300MPaであることを特徴とする。引張り弾性率が低すぎると、太陽電池素子を保持できず太陽電池モジュールが変形し易く、引張り弾性率が高すぎると、太陽電池素子にクラック等の破損が生じ易い。尚、前記ブロック共重合体の、wAを高くすると引張り弾性率を高くすることができ、wAを低くすると引張り弾性率を低くすることができる。
配合成分としては、樹脂特性を向上させるための前記ブロック共重合体水素化物以外の重合体;耐候性や耐熱性等を向上させるための、酸化防止剤、耐光安定剤、紫外線吸収剤;接着性や封止性等を向上させるための、カップリング剤、滑剤、界面活性剤、無機フィラー;等が挙げられる。配合成分は、一種単独でも、或いは2種以上を併用してもよい。
なかでも、酸化防止剤、耐光安定剤、紫外線吸収剤の使用が好ましく、酸化防止剤と耐光安定剤及び/又は紫外線吸収剤を組み合わせての使用がより好ましい。
前記ブロック共重合体水素化物以外の重合体としては、エチレン・プロピレン共重合体、プロピレン・エチレン・1-ブテン共重合体等のオレフィン系重合体;ポリイソブチレン、イソブチレン・イソプレン共重合体水素化物等のイソブチレン系重合体;ポリイソプレン、イソプレン・ブタジエンランダム共重合体、ブタジエン・スチレンランダム共重合体、イソプレン・スチレンランダム共重合体、アクリロニトリル・ブタジエンランダム共重合体、アクリロニトリル・ブタジエン・スチレン共重合体、ブタジエン・スチレンブロック共重合体、イソプレン・スチレンブロック共重合体等のジエン系重合体の水素化物;ポリブチルアクリレート、ポリヒドロキシエチルメタクリレート等のアクリル系重合体;ポリエチレンオキシド、ポリプロピレンオキシド、エピクロルヒドリンゴム等のエポキシ系重合体;1,3-ペンタジエン系石油樹脂、シクロペンタジエン系石油樹脂、芳香族系石油樹脂等の石油樹脂及びその水素化物;等が挙げられる。これらの中でも、太陽電池素子封止用樹脂組成物の透明性及び接着性を向上させる目的においては、石油樹脂が好ましい。
本発明の樹脂組成物には、熱安定性を向上させるために、酸化防止剤を配合することができる。
用いる酸化防止剤としては、リン系酸化防止剤、フェノ-ル系酸化防止剤、硫黄系酸化防止剤等が挙げられ、着色がより少ないリン系酸化防止剤が好ましい。
耐光安定剤としては、ヒンダードアミン系耐光安定剤が好ましく、構造中に3,5-ジ-t-ブチル-4-ヒドロキシフェニル基、2,2,6,6-テトラメチルピペリジル基、あるいは、1,2,2,6,6-ペンタメチル-4-ピペリジル基等を有している化合物が挙げられる。
-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレンラウリン酸アミド、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレンリンデル酸アミド、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレン吉草酸アミド、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレン酢酸アミド、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレン抹香酸アミド、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)-N,N’-ビスヘキサメチレン酪酸アミド、コハク酸ジメチルと4-ヒドロキシ-2,2,6,6-テトラメチル-1-ピペリジンエタノールとの重合物、ジブチルアミンと1,3,5-トリアジンとN,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジル)ブチルアミンとの重縮合物、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジル)-2-(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-2-n-ブチルマロネート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、ポリ〔(6-モルフォリノ-s-トリアジン-2,4-ジイル)〔(2,2,6,6-テトラメチル-4-ピペリジル)イミノ〕-ヘキサメチレン〔(2,2,6,6-テトラメチル-4-ピペリジル)イミノ〕、ポリ〔{(1,1,3,3-テトラメチルブチル)アミノ-1,3,5-トリアジン-2,4-ジイル}{(2,2,6,6-テトラメチル-4-ピペリジル)イミノ}ヘキサメチレン{(2,2,6,6-テトラメチル-4-ピペリジル)イミノ}〕、ポリ〔{6-(1,1,3,3-テトラメチルブチル)アミノ-1,3,5-トリアジン-2,4-ジイル}{(2,2,6,6-テトラメチル-4-ピペリジル)イミノ}ヘキサメチレン{(2,2,6,6-テトラメチル-4-ピペリジル)イミノ}〕、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジニル)-1,6-ヘキサンジアミンと2,4,6-トリクロロ-1,3,5-トリアジンとの重合体とN-ブチル-1-ブタンアミンとN-ブチル-2,2,6,6-テトラメチル-4-ピペリジンアミンとの反応生成物等が挙げられる。
また、ヒンダードアミン系耐光安定剤は、上述した酸化防止剤、特にリン系酸化防止剤と併用することにより、更に耐光性を改善することができる。
本発明の樹脂組成物には、耐光安定性を向上させるために、紫外線吸収剤を配合することもできる。紫外線吸収剤としては、ベンゾフェノン系紫外線吸収剤、サリチル酸系紫外線吸収剤、ベンゾトリアゾール系紫外線吸収剤等が挙げられる。
ブロック共重合体水素化物に配合成分を均一に分散させる方法としては、例えば、配合成分を適当な溶剤に溶解してブロック共重合体水素化物の溶液に添加した後、溶媒を除去して配合成分を含むブロック共重合体水素化物を回収する方法;二軸混錬機、ロール、ブラベンダー、押出機等でブロック共重合体水素化物を溶融状態にして、配合成分を混練する方法;等が挙げられる。
本発明の太陽電池モジュールは、太陽電池素子が、本発明の太陽電池素子封止用樹脂組成物により封止されてなるものである。
本発明の太陽電池素子封止用樹脂組成物は、熱架橋性を付与するための有機過酸化物の配合を必要としないため、溶融成形温度の選択領域も広い。
本発明の太陽電池素子封止用樹脂組成物を用いたシートは透湿度が小さく、吸湿性も低いため、透明前面基板としては、必ずしもが水分のバリヤー性を有する必要は無く、軽量な透明樹脂シートを利用することも可能である。
また、裏面保護シートは、太陽電池モジュールの耐久性を更に高めるために、遮光性及び/又は光反射性を有していてもよい。この場合、裏面保護シートは紫外線吸収剤や酸化チタン等の遮光性顔料を含有したもの等が適用できる。
(1)重量平均分子量(Mw)及び分子量分布(Mw/Mn)
ブロック共重合体及びブロック共重合体水素化物の分子量は、THFを溶離液とするGPCによる標準ポリスチレン換算値として38℃において測定した。測定装置としては、東ソー社製、HLC8020GPCを用いた。
(2)水素化率
ブロック共重合体水素化物の主鎖、側鎖及び芳香環の水素化率は、ブロック共重合体水素化物の1H-NMRスペクトルを測定して算出した。
太陽電池素子封止用樹脂組成物の押出し成形シートを使用して、ASTM D-1003に従い測定した。但し、比較例2ではプレス成形シートを使用して測定した。
(4)吸水率
太陽電池素子封止用樹脂組成物をプレス成形して厚さ3mm、縦横50mmの試験片を作製し、ASTM D570に従って、23℃で24時間浸漬して測定した。
太陽電池素子封止用樹脂組成物の押出し成形シートで、テンシロン万能試験機(RTC-1125A、ORIENTIC社製)を用いて、JIS K 7127/5/200の方法で測定した。試験片はタイプ5、23℃の条件下、チャック間距離10cmで破断するまで引張り試験を行った。引張り弾性率はJIS K7161に準ずる方法で測定し、破断時の強度を引張り強度とし、破断時の伸びを引張り伸びとした。但し、比較例2ではプレス成形シートを使用して測定した。
(6)体積抵抗率
太陽電池素子封止用樹脂組成物の押出し成形シートを3枚重ねてプレス成形して1mm厚さの試験片を作製し、このものを使用して、JIS K 6911に従って、23℃で測定した。但し、比較例2では1mm厚さのプレス成形シートを使用した。
太陽電池素子封止用樹脂組成物の押出し成形シートを、シート端部に非接着部位を設けて厚さ2mmのソーダライムガラス基板と重ね合わせ、真空ラミネータ(MVLP、名機製作所社製)にて、180℃、5分加熱接着することにより、剥離試験用試験片を作製した。シート面を15mm幅に切り目を入れ、シートの非接着部位から、剥離速度50mm/分で、JIS K 6854-1に準じて90度剥離試験を行い、剥離強度を測定した。但し、比較例2ではプレス成形シートを使用した。剥離強度が低いほど、ガラスとの接着性が悪い。
(8)耐候性
ガラス基板との接着性評価用に、ガラスと太陽電池素子封止用樹脂組成物の押出し成形シートの張り合わせ試験片を作製した。そしてこのものを使用して、ガラス面を光源側にし、裏面に白色PETフィルム(ルミラー(登録商標)E20、厚さ125μm、東レ社製)を重ねて、サンシャインウェザーメーター(WEL-SUN-HC・B、スガ試験機社製)を用いて、サンシャインカーボンアーク灯、ブラックパネル温度63℃、相対湿度50%の条件にて、1000時間露光した後取り出し、ガラスと太陽電池素子封止用樹脂組成物の押出し成形シートを張り合わせた試験片の光線透過率を測定した。
太陽電池素子封止用樹脂組成物の押出し成形シート2枚の間に、酢酸水溶液にて表面をエッチングし、水洗することで酸化物を除去した厚さ0.3mmの銅板を挟み、真空ラミネータにて、180℃で5分加熱することにより、銅板を封止した耐腐食性評価用試験片を作製した。この封止試験片を、85℃、85%RHの環境に1ヶ月間暴露し、試験片の外観、臭気及び銅箔の変色を観察した。
(10)太陽電池モジュールの耐久性評価
透明基板(ソーダライムガラス)の上に、太陽電池素子封止用樹脂組成物の押出し成形シートを載せ、その上に多結晶シリコン太陽電池セルを載せた。太陽電池セルには銅箔からなる配線を接続した。この太陽電池セルの上に更に太陽電池素子封止用樹脂組成物の押出し成形シート、裏面保護シート(ポリエチレンテレフタレート製)の順でに載せ、積層体を得た。次に、この積層体を真空ラミネータにセットし、真空下で180℃で5分加温して封止し、太陽電池モジュールを作製した。
前記太陽電池モジュールを、-40℃で30分、90℃で30分を1サイクルとして500サイクル実施した後に、目視観察で太陽電池モジュールの変形の有無、及び、Cモード超音波走査型顕微鏡(SONIX社製)にて太陽電池セル5個を観察し、クラックの発生の有無を確認した。変形及びクラックが観察されないものを〇とした。
内部が充分に窒素置換された、攪拌装置を備えた反応器に、脱水シクロヘキサン550部、脱水スチレン25.0部、n-ジブチルエーテル0.475部を入れ、60℃で攪拌しながらn-ブチルリチウム(15%シクロヘキサン溶液)0.515部を加えて重合を開始させ、さらに、攪拌しながら60℃で60分反応させた。この時点での重合転化率は99.5%であった(ガスクロマトグラフィーにより測定、以下にて同じ。)。
次に、脱水イソプレン50.0部を加え、同温度で30分攪拌を続けた。この時点での重合転化率は99%であった。
その後、更に、脱水スチレンを25.0部加え、同温度で60分攪拌した。この時点での重合転化率はほぼ100%であった。次いで、反応液にイソプロピルアルコール0.5部を加えて反応を停止させて、ブロック共重合体(a)を含む溶液(重合体溶液)を得た。
得られたブロック共重合体(a)の重量平均分子量(Mw)は81,400、分子量分布(Mw/Mn)は1.05であった。
重合段階でモノマーとして、スチレン15.0部、n-ブチルリチウム(15%シクロヘキサン溶液)0.310部、イソプレン70.0部、及び、スチレン15.0部をこの順に反応系に添加して重合する以外は参考例1と同様にして、ブロック共重合体水素化物[B]及び酸化防止剤Aを含有するペレット(ブロック共重合体水素化物[B]のペレット)88部を得た。得られたブロック共重合体水素化物[B]の重量平均分子量(Mw)は139,000、分子量分布(Mw/Mn)は1.15であった。水素化率はほぼ100%であった。
重合段階でモノマーとして、スチレンとイソプレンの混合モノマー(混合比90:10)20.0部、スチレンとイソプレンの混合モノマー(混合比10:90)60.0部、及び、スチレンとイソプレンの混合モノマー(混合比90:10)20.0部をこの順に反応系に添加して重合する以外は参考例1と同様にして、ブロック共重合体水素化物[C]及び酸化防止剤Aを含有するペレット(ブロック共重合体水素化物[C]のペレット)87部を得た。得られたブロック共重合体水素化物[C]の重量平均分子量(Mw)は141,000、分子量分布(Mw/Mn)は1.15であった。水素化率はほぼ100%であった。
重合段階でモノマーとして、スチレン25.0部、イソプレンに変えて液化ブタジエン50.0部、及び、スチレン25.0部をこの順に反応系に添加して重合する以外は参考例1と同様にして、ブロック共重合体水素化物[D]及び酸化防止剤Aを含有するペレット(ブロック共重合体水素化物[D]のペレット)87部を得た。得られたブロック共重合体水素化物[D]の重量平均分子量(Mw)は84,500、分子量分布(Mw/Mn)は1.11であった。水素化率はほぼ100%であった。
重合段階でモノマーとして、スチレンを使用せず、イソプレン100部を単独で使用して重合する以外は参考例1と同様にして、水素化ポリイソプレンのペレット82部を得た。得られた水素化ポリイソプレンの重量平均分子量(Mw)は78,500、分子量分布(Mw/Mn)は1.07であった。水素化率はほぼ100%であった。
重合段階でモノマーとして、スチレン35.0部、イソプレン30.0部、及び、スチレン35.0部をこの順に反応系に添加して重合する以外は参考例1と同様にして、ブロック共重合体水素化物[E]及び酸化防止剤Aを含有するペレット(ブロック共重合体水素化物[E]のペレット)90部を得た。得られたブロック共重合体水素化物[E]の重量平均分子量(Mw)は86,900、分子量分布(Mw/Mn)は1.10であった。水素化率はほぼ100%であった。
重合段階でモノマーとして、スチレン5.0部、イソプレン90.0部、及び、スチレン5.0部をこの順に反応系に添加して重合する以外は参考例1と同様にして、ブロック共重合体水素化物[F]及び酸化防止剤Aを含有するペレット(ブロック共重合体水素化物[F]のペレット)90部を得た。得られたブロック共重合体水素化物[F]の重量平均分子量(Mw)は79700、分子量分布(Mw/Mn)は1.10であった。水素化率はほぼ100%であった。
(太陽電池素子封止用樹脂組成物[A1]の製造
(参考例1で得たブロック共重合体水素化物[A]のペレット)100部に対して、ヒンダードアミン系耐光安定剤である、N,N’-ビス(2,2,6,6-テトラメチル-4-ピペリジニル)-1,6-ヘキサンジアミンと2,4,6-トリクロロ-1,3,5-トリアジンとの重合体と、N-ブチル-1-ブタンアミンとN-ブチル-2,2,6,6-テトラメチル-4-ピペリジンアミンとの反応生成物(CHIMASSORB(登録商標)2020、チバ・ジャパン社製)2.0部を添加した。この混合物を、二軸押出機(TEM35B、東芝機械製)を用いて、樹脂温度250℃で混練し、ストランド状に押出し、水冷した後、ペレタイザーによりカッティングし、ブロック共重合体水素化物[A]を含む太陽電池素子封止用樹脂組成物[A1]のペレット95部を得た。
太陽電池素子封止用樹脂組成物[A1]のペレットを、空気を流通させた熱風乾燥器を用いて50℃で4時間加熱して、溶存空気を除去した後、40mmφのスクリューを備えた樹脂溶融混練機を有するTダイ式フィルム溶融押出し成形機(Tダイ幅500mm)を使用し、溶融樹脂温度210℃、Tダイ温度210℃、ロール温度50℃の成形条件にて、厚さ400μm、幅500mmのシートを押出し成形し、押出し成形シート[SA1]を得た。得られた押出し成形シート[SA1]に、ポリエチレン離形フィルムを積層してロールに巻き取り回収した。
太陽電池素子封止用樹脂組成物[A1]のペレットを、プレス成形機を使用し、樹脂温度180℃、圧力1.1MPaの成形条件にて、厚さ3mmの試験片及び厚さ1mmの試験片[PA1]をそれぞれ作製した。
押出し成形シート[SA1]及びプレス成形試験片[PA1]を用いて、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。
結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[A2])
(参考例1で得たブロック共重合体水素化物[A]のペレット)100部に対して、実施例1と同じヒンダードアミン系耐光安定剤2.0部及びベンゾトリアゾール系紫外線吸収剤である2-(2H-ベンゾトリアゾール-2-イル)-4-(1,1,3,3-テトラメチルブチル)フェノール(TINUVIN(登録商標)329、チバ・ジャパン社製)0.2部を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[A2]のペレット95部を得た。
また、太陽電池素子封止用樹脂組成物[A2]のペレットを使用して、実施例1と同様にして、押出し成形シート[SA2]及びプレス成形試験片[PA2]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[B])
(参考例2で得たブロック共重合体水素化物[B]のペレット)100部に対して、実施例2と同様に耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[B]のペレット93部を得た。
また、太陽電池素子封止用樹脂組成物[B]のペレットを使用して、実施例1と同様にして、押出し成形シート[SB]及びプレス成形試験片[PB]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[C])
(参考例3で得たブロック共重合体水素化物[C]のペレット)100部に対して、実施例2と同様に耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[C]のペレット95部を得た。
また、太陽電池素子封止用樹脂組成物[C]のペレットを使用して、実施例1と同様にして、押出し成形シート[SC]及びプレス成形試験片[PC]を作成して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[D])
(参考例4で得たブロック共重合体水素化物[D]のペレット)100部に対して、実施例2と同様に耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[D]のペレット95部を得た。
また、太陽電池素子封止用樹脂組成物[D]のペレットを使用して、実施例1と同様にして、押出し成形シート[SD]及びプレス成形試験片[PD]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[A3])
(参考例1で得たブロック共重合体水素化物[A]のペレット)100部に対して、水酸基を有する脂環族飽和炭化水素樹脂(アルコン(登録商標)KR1842、荒川化学社製)10部、実施例2と同様の耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[A3]のペレット106部を得た。
また、太陽電池素子封止用樹脂組成物[A3]のペレットを使用して、実施例1と同様にして、押出し成形シート[SA3]及びプレス成形試験片[PA3]を作成して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
エチレン・酢酸ビニル共重合体(エバフレックス(登録商標)EV250、酢酸ビニル含有量:28重量%、三井・デュポンポリケミカル社製)100部に対して、実施例2と同様の耐光安定剤及び紫外線吸収剤を添加した。この混合物を、樹脂温度を220℃にする以外は実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[EV1]のペレット94部を得た。
また、太陽電池素子封止用樹脂組成物[EV1]のペレットを使用して、プレス成形温度を150℃及び押出し成形温度を190℃にする以外は実施例1と同様にして押出し成形シート[SEV1]及びプレス成形試験片[PEV1]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
比較例1で使用したのと同じエチレン・酢酸ビニル共重合体100部に対して、実施例2と同様の耐光安定剤及び紫外線吸収剤を添加した。更に、有機過酸化物として2,5-ジメチル-2,5-ジ(t-ブチルパーオキシ)ヘキサン(パーヘキサ(登録商標)25B、日油社製)0.1部及び架橋助剤としてトリアリルイソシアヌレート(M-60、日本化成社製)0.5部を添加し、ラボプラストミル(東洋精機製)を用いて、樹脂温度110℃で1分間混練して、太陽電池素子封止用樹脂組成物[EV2]90部を得た。
得られた太陽電池素子封止用樹脂組成物[EV2]を使用して、プレス成形温度を110℃にする以外は実施例1と同様にして厚さ3mm、1mmのプレス成形試験片[PEV2]及び厚さ400μmのプレス成形シート[PSEV2]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
(太陽電池素子封止用樹脂組成物[E])
参考例6で得たブロック共重合体水素化物[E]のペレット100部に対して、実施例2と同様に耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[E]のペレット93部を得た。また、太陽電池素子封止用樹脂組成物[E]を使用して、実施例1と同様にして、押出し成形シート[SE]及びプレス成形試験片[PE]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
[比較例4]
(太陽電池素子封止用樹脂組成物[F])
参考例7で得たブロック共重合体水素化物[F]のペレット100部に対して、実施例2と同様に耐光安定剤及び紫外線吸収剤を添加した。この混合物を、実施例1と同様にして、混練して太陽電池素子封止用樹脂組成物[F]のペレット93部を得た。また、太陽電池素子封止用樹脂組成物[F]を使用して、実施例1と同様にして、押出し成形シート[SF]及びプレス成形試験片[PF]を作製して、光線透過率、吸水率、引張り強度、引張り伸び、体積抵抗率、ガラス基板との接着性、封止銅板の耐腐食性及び耐候性の評価、並びに、太陽電池モジュールの耐久性評価を実施した。結果を表1に記載した。
本発明の太陽電池素子封止用樹脂組成物は、光線透過率、吸水性、機械的強度、柔軟性、ガラスとの接着性、耐候性に優れ、太陽電池素子が該樹脂組成物により封止されてなる太陽電池モジュールは耐久性に優れる(実施例1~6)。
一方、エチレン・酢酸ビニル共重合体(EVA)からなる封止材を用いると、高温高湿環境で長期間保持された場合に内部配線に腐食を生じる懸念がある(比較例1、2)。
芳香族ビニル化合物由来の繰り返し単位を主成分とする重合体ブロックの使用量が多いと、引張り弾性率が低く、樹脂組成物とガラスとの接着性が低く、太陽電池モジュールの耐久性が低い(比較例3)。
また、芳香族ビニル化合物由来の繰り返し単位を主成分とする重合体ブロックの使用量が少ないと、耐熱性が低く、太陽電池モジュールの耐久性が低い(比較例4)。
2・・・太陽電池素子
3・・・封止材
4・・・配線
5・・・裏面保護シート
Claims (7)
- 少なくとも2つの、芳香族ビニル化合物由来の繰り返し単位を主成分とする重合体ブロック[A]と、少なくとも1つの、鎖状共役ジエン化合物由来の繰り返し単位を主成分とする重合体ブロック[B]とを有するブロック共重合体であって、ブロック共重合体全体に占める全重合体ブロック[A]の重量分率をwAとし、ブロック共重合体全体に占める全重合体ブロック[B]の重量分率をwBとしたときに、wAとwBとの比(wA:wB)が20:80~60:40であるブロック共重合体の、主鎖及び側鎖の炭素-炭素不飽和結合と、芳香環の炭素-炭素不飽和結合との合計である全不飽和結合の90%以上を水素化して得られるブロック共重合体水素化物を含有し、
23℃における引張り弾性率が1.0~500MPaであることを特徴とする
太陽電池素子封止用樹脂組成物。 - ブロック共重合体水素化物の重量平均分子量が、30,000~200,000である請求項1に記載の太陽電池素子封止用樹脂組成物。
- ブロック共重合体が、前記重合体ブロック[B]の両端に、前記重合体ブロック[A]が結合したトリブロック共重合体である請求項1又は2に記載の太陽電池素子封止用樹脂組成物。
- ブロック共重合体水素化物100重量部に対して、リン系酸化防止剤を0.01~1重量部含有することを特徴とする請求項1~3のいずれかに記載の太陽電池素子封止用樹脂組成物。
- さらに、ブロック共重合体水素化物100重量部に対して、ヒンダードアミン系耐光安定剤を0.1~10重量部含有することを特徴とする請求項4に記載の太陽電池素子封止用樹脂組成物。
- さらに、ブロック共重合体水素化物100重量部に対して、紫外線吸収剤を0.01~1重量部含有することを特徴とする請求項5に記載の太陽電池素子封止用樹脂組成物。
- 太陽電池素子が、請求項1~6のいずれかに記載の太陽電池素子封止用樹脂組成物により封止されてなる太陽電池モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011552779A JP5765238B2 (ja) | 2010-02-02 | 2011-02-01 | 太陽電池素子封止用樹脂組成物及び太陽電池モジュール |
CN2011800081107A CN102884097A (zh) | 2010-02-02 | 2011-02-01 | 用于封装太阳能电池元件的树脂组合物和太阳能电池组件 |
US13/520,715 US20130008506A1 (en) | 2010-02-02 | 2011-02-01 | Resin composition for encapsulating solar cell and solar module |
EP11739737.2A EP2532692A4 (en) | 2010-02-02 | 2011-02-01 | RESIN COMPOSITION FOR SEALING A SOLAR CELL ELEMENT, AND SOLAR CELL MODULE |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010021043 | 2010-02-02 | ||
JP2010-021043 | 2010-02-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011096389A1 true WO2011096389A1 (ja) | 2011-08-11 |
Family
ID=44355387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/052017 WO2011096389A1 (ja) | 2010-02-02 | 2011-02-01 | 太陽電池素子封止用樹脂組成物及び太陽電池モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130008506A1 (ja) |
EP (1) | EP2532692A4 (ja) |
JP (1) | JP5765238B2 (ja) |
CN (1) | CN102884097A (ja) |
WO (1) | WO2011096389A1 (ja) |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012043708A1 (ja) * | 2010-09-29 | 2012-04-05 | 日本ゼオン株式会社 | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 |
JP2013048560A (ja) * | 2011-08-30 | 2013-03-14 | Nippon Zeon Co Ltd | 培養用容器 |
WO2013089047A1 (ja) * | 2011-12-12 | 2013-06-20 | シャープ株式会社 | 太陽電池モジュールおよび太陽光発電システム |
JP2013132755A (ja) * | 2011-12-26 | 2013-07-08 | Nippon Zeon Co Ltd | 多層シート及びその利用 |
CN103254815A (zh) * | 2012-02-15 | 2013-08-21 | 日东电工株式会社 | 表面保护片 |
WO2013176258A1 (ja) | 2012-05-25 | 2013-11-28 | 日本ゼオン株式会社 | 合わせガラス、及びブロック共重合体水素化物を合わせガラスの接着剤として使用する方法 |
WO2014077267A1 (ja) | 2012-11-15 | 2014-05-22 | 日本ゼオン株式会社 | 樹脂組成物およびそれからなる成形体 |
WO2014091941A1 (ja) * | 2012-12-10 | 2014-06-19 | 日本ゼオン株式会社 | 有機エレクトロニクスデバイス封止用樹脂組成物、及び有機エレクトロニクスデバイス |
JP2014133848A (ja) * | 2013-01-11 | 2014-07-24 | Nippon Zeon Co Ltd | 成形体の製造方法 |
JP2014144155A (ja) * | 2013-01-30 | 2014-08-14 | Nippon Zeon Co Ltd | 音響媒体 |
WO2014133003A1 (ja) | 2013-02-27 | 2014-09-04 | 日本ゼオン株式会社 | 太陽電池モジュール及びその製造方法 |
JP2014208799A (ja) * | 2013-03-27 | 2014-11-06 | 三菱化学株式会社 | 樹脂組成物及びそれを用いた接着性封止フィルム |
WO2015002020A1 (ja) | 2013-07-01 | 2015-01-08 | 日本ゼオン株式会社 | 光学用フィルム及びその製造方法 |
WO2015033876A1 (ja) | 2013-09-06 | 2015-03-12 | 日本ゼオン株式会社 | 滅菌済み医療用成形体の製造方法 |
JP2015104859A (ja) * | 2013-11-29 | 2015-06-08 | 日本ゼオン株式会社 | 薄膜ガラス積層体 |
WO2015105127A1 (ja) | 2014-01-09 | 2015-07-16 | 日本ゼオン株式会社 | 多層フィルム及びその製造方法 |
WO2015115397A1 (ja) | 2014-01-29 | 2015-08-06 | 日本ゼオン株式会社 | 透明粘着シート |
EP3225393A1 (en) | 2016-04-01 | 2017-10-04 | Asahi Glass Company, Limited | Laminated glass for vehicle |
KR20170139561A (ko) * | 2015-04-22 | 2017-12-19 | 니폰 제온 가부시키가이샤 | 합판 유리 |
WO2018097146A1 (ja) | 2016-11-24 | 2018-05-31 | 日本ゼオン株式会社 | 接着剤シート及び合わせガラス |
US10005924B2 (en) | 2014-02-28 | 2018-06-26 | Zeon Corporation | Transparent adhesive sheet |
WO2018116997A1 (ja) | 2016-12-22 | 2018-06-28 | 日本ゼオン株式会社 | 合わせガラス |
WO2018180427A1 (ja) | 2017-03-29 | 2018-10-04 | 日本ゼオン株式会社 | 樹脂組成物、並びに、成形体およびその製造方法 |
WO2019044108A1 (ja) | 2017-08-30 | 2019-03-07 | 日本ゼオン株式会社 | 積層体およびその製造方法 |
US10239966B2 (en) | 2014-10-15 | 2019-03-26 | Zeon Corporation | Block copolymer hydride and stretched film formed from same |
US10328674B2 (en) | 2014-07-09 | 2019-06-25 | Zeon Corporation | Laminated glass |
WO2020080202A1 (ja) | 2018-10-17 | 2020-04-23 | 日本ゼオン株式会社 | 共重合体水素化物およびその製造方法、共重合体水素化物含有組成物、合わせガラス用中間膜、合わせガラス用中間膜積層体、封止材、光学フィルム、医療用成形体およびその製造方法、接着剤、ならびに、接合体およびその製造方法 |
US10865302B2 (en) | 2016-01-29 | 2020-12-15 | Zeon Corporation | Resin composition and use thereof |
US11624010B2 (en) | 2018-05-22 | 2023-04-11 | Zeon Corporation | Method of producing adhesive resin |
US12049579B2 (en) | 2016-11-22 | 2024-07-30 | Zeon Corporation | Method of producing a roll-shaped body |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014189291A1 (ko) * | 2013-05-21 | 2014-11-27 | 주식회사 엘지화학 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
KR101589374B1 (ko) * | 2013-05-21 | 2016-01-28 | 주식회사 엘지화학 | 봉지 필름 및 이를 이용한 유기전자장치의 봉지 방법 |
ES2846726T3 (es) | 2014-05-30 | 2021-07-29 | Kuraray Co | Gránulos elastómeros termoplásticos y artículo moldeado conformado a partir de dichos gránulos |
EP3281981A4 (en) * | 2015-04-09 | 2018-12-26 | Zeon Corporation | Resin composition and use of same |
US20180337297A1 (en) * | 2015-11-25 | 2018-11-22 | Mitsui Chemicals Tohcello, Inc. | Solar cell module |
JP6780348B2 (ja) * | 2016-07-28 | 2020-11-04 | 日本ゼオン株式会社 | ブロック共重合体水素化物 |
PL3598528T3 (pl) * | 2017-03-17 | 2024-10-07 | Zeon Corporation | Kompozycja dla warstwy funkcjonalnej niewodnego akumulatora, warstwa funkcjonalna dla niewodnego akumulatora, niewodny akumulator i sposób wytwarzania niewodnego akumulatora |
TWI726562B (zh) * | 2019-12-31 | 2021-05-01 | 財團法人工業技術研究院 | 太陽能電池模組 |
US11695089B2 (en) | 2019-12-31 | 2023-07-04 | Industrial Technology Research Institute | Solar cell modules |
CN115135497A (zh) * | 2020-02-27 | 2022-09-30 | 株式会社可乐丽 | 层叠体、和其制造方法 |
CN116144277B (zh) * | 2023-04-14 | 2023-08-18 | 宁波长阳科技股份有限公司 | 一种防滑光伏胶膜 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126649A (ja) * | 1984-07-16 | 1986-02-05 | Denki Kagaku Kogyo Kk | スチレン−ジエン系ブロツク共重合体の組成物 |
JPH06299125A (ja) | 1993-04-14 | 1994-10-25 | Du Pont Mitsui Polychem Co Ltd | 太陽電池用接着シート |
JP2000091611A (ja) | 1998-09-17 | 2000-03-31 | Dainippon Printing Co Ltd | 太陽電池のカバーフィルムおよびその製造方法、およびそのカバーフィルムを用いた太陽電池モジュール |
JP2000091610A (ja) | 1998-09-17 | 2000-03-31 | Dainippon Printing Co Ltd | 太陽電池のカバーフィルムおよびその製造方法、およびそのカバーフィルムを用いた太陽電池モジュール |
JP2000106450A (ja) | 1998-09-29 | 2000-04-11 | Nippon Zeon Co Ltd | 太陽電池モジュール用保護シートおよびモジュール |
JP2001044481A (ja) | 1999-08-04 | 2001-02-16 | Dainippon Printing Co Ltd | 太陽電池モジュ−ル用保護シ−トおよびそれを使用した太陽電池モジュ−ル |
JP2002531598A (ja) | 1998-11-28 | 2002-09-24 | バイエル アクチェンゲゼルシャフト | ビニルシクロヘキサン系ブロックコポリマー |
JP2005029588A (ja) | 2003-07-07 | 2005-02-03 | Bridgestone Corp | 透明フィルム |
JP2006210905A (ja) * | 2004-12-28 | 2006-08-10 | Mitsui Chemical Fabro Inc | 太陽電池封止材 |
WO2008015984A1 (fr) | 2006-07-31 | 2008-02-07 | Mitsui Chemicals, Inc. | Composition de résine thermoplastique pour scellement de cellule solaire, feuille pour scellement de cellule solaire et cellule solaire |
JP2008163121A (ja) * | 2006-12-27 | 2008-07-17 | Nippon Shiima Kk | 樹脂組成物 |
JP2008291222A (ja) | 2007-04-09 | 2008-12-04 | Bridgestone Corp | 封止膜及びこれを用いた太陽電池 |
WO2009081877A1 (ja) * | 2007-12-20 | 2009-07-02 | Kuraray Co., Ltd. | 熱可塑性重合体組成物及びそれからなる成形品 |
WO2009151029A1 (ja) * | 2008-06-09 | 2009-12-17 | Jsr株式会社 | 封止材料およびそれを用いた太陽電池モジュール |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3333024A (en) * | 1963-04-25 | 1967-07-25 | Shell Oil Co | Block polymers, compositions containing them and process of their preparation |
ATE265497T1 (de) * | 1999-06-11 | 2004-05-15 | Dow Global Technologies Inc | Hydrierte blockcopolymerzusammensetzungen und verwendungen davon |
US20020061982A1 (en) * | 1999-06-11 | 2002-05-23 | Donald Robert J. | Compositions comprising hydrogenated block copolymers and end-use applications thereof |
JP2003502470A (ja) * | 1999-06-11 | 2003-01-21 | ザ ダウ ケミカル カンパニー | 水素添加ブロック共重合体からなる組成物及びその最終用途への利用 |
US20020061981A1 (en) * | 1999-06-11 | 2002-05-23 | Donald Robert J. | Compositions comprising hydrogenated block copolymers and end-use applications thereof |
US8581094B2 (en) * | 2006-09-20 | 2013-11-12 | Dow Global Technologies, Llc | Electronic device module comprising polyolefin copolymer |
US20110146758A1 (en) * | 2009-06-29 | 2011-06-23 | E. I. Du Pont De Nemours And Company | Reflecting multilayer encapsulant |
JP2013038089A (ja) * | 2009-12-04 | 2013-02-21 | Jsr Corp | 太陽電池モジュール用積層体 |
-
2011
- 2011-02-01 WO PCT/JP2011/052017 patent/WO2011096389A1/ja active Application Filing
- 2011-02-01 JP JP2011552779A patent/JP5765238B2/ja active Active
- 2011-02-01 US US13/520,715 patent/US20130008506A1/en not_active Abandoned
- 2011-02-01 CN CN2011800081107A patent/CN102884097A/zh active Pending
- 2011-02-01 EP EP11739737.2A patent/EP2532692A4/en not_active Ceased
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6126649A (ja) * | 1984-07-16 | 1986-02-05 | Denki Kagaku Kogyo Kk | スチレン−ジエン系ブロツク共重合体の組成物 |
JPH06299125A (ja) | 1993-04-14 | 1994-10-25 | Du Pont Mitsui Polychem Co Ltd | 太陽電池用接着シート |
JP2000091611A (ja) | 1998-09-17 | 2000-03-31 | Dainippon Printing Co Ltd | 太陽電池のカバーフィルムおよびその製造方法、およびそのカバーフィルムを用いた太陽電池モジュール |
JP2000091610A (ja) | 1998-09-17 | 2000-03-31 | Dainippon Printing Co Ltd | 太陽電池のカバーフィルムおよびその製造方法、およびそのカバーフィルムを用いた太陽電池モジュール |
JP2000106450A (ja) | 1998-09-29 | 2000-04-11 | Nippon Zeon Co Ltd | 太陽電池モジュール用保護シートおよびモジュール |
JP2002531598A (ja) | 1998-11-28 | 2002-09-24 | バイエル アクチェンゲゼルシャフト | ビニルシクロヘキサン系ブロックコポリマー |
JP2001044481A (ja) | 1999-08-04 | 2001-02-16 | Dainippon Printing Co Ltd | 太陽電池モジュ−ル用保護シ−トおよびそれを使用した太陽電池モジュ−ル |
JP2005029588A (ja) | 2003-07-07 | 2005-02-03 | Bridgestone Corp | 透明フィルム |
JP2006210905A (ja) * | 2004-12-28 | 2006-08-10 | Mitsui Chemical Fabro Inc | 太陽電池封止材 |
WO2008015984A1 (fr) | 2006-07-31 | 2008-02-07 | Mitsui Chemicals, Inc. | Composition de résine thermoplastique pour scellement de cellule solaire, feuille pour scellement de cellule solaire et cellule solaire |
JP2008163121A (ja) * | 2006-12-27 | 2008-07-17 | Nippon Shiima Kk | 樹脂組成物 |
JP2008291222A (ja) | 2007-04-09 | 2008-12-04 | Bridgestone Corp | 封止膜及びこれを用いた太陽電池 |
WO2009081877A1 (ja) * | 2007-12-20 | 2009-07-02 | Kuraray Co., Ltd. | 熱可塑性重合体組成物及びそれからなる成形品 |
WO2009151029A1 (ja) * | 2008-06-09 | 2009-12-17 | Jsr株式会社 | 封止材料およびそれを用いた太陽電池モジュール |
Non-Patent Citations (1)
Title |
---|
See also references of EP2532692A4 |
Cited By (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012043708A1 (ja) * | 2010-09-29 | 2012-04-05 | 日本ゼオン株式会社 | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 |
JP2013048560A (ja) * | 2011-08-30 | 2013-03-14 | Nippon Zeon Co Ltd | 培養用容器 |
WO2013089047A1 (ja) * | 2011-12-12 | 2013-06-20 | シャープ株式会社 | 太陽電池モジュールおよび太陽光発電システム |
JPWO2013089047A1 (ja) * | 2011-12-12 | 2015-04-27 | シャープ株式会社 | 太陽電池モジュールおよび太陽光発電システム |
JP2013132755A (ja) * | 2011-12-26 | 2013-07-08 | Nippon Zeon Co Ltd | 多層シート及びその利用 |
CN103254815A (zh) * | 2012-02-15 | 2013-08-21 | 日东电工株式会社 | 表面保护片 |
WO2013176258A1 (ja) | 2012-05-25 | 2013-11-28 | 日本ゼオン株式会社 | 合わせガラス、及びブロック共重合体水素化物を合わせガラスの接着剤として使用する方法 |
JP5510622B1 (ja) * | 2012-05-25 | 2014-06-04 | 日本ゼオン株式会社 | 合わせガラス、及びブロック共重合体水素化物を合わせガラスの接着剤として使用する方法 |
KR102078212B1 (ko) | 2012-05-25 | 2020-02-17 | 니폰 제온 가부시키가이샤 | 합판 유리, 및 블록 공중합체 수소화물을 합판 유리의 접착제로서 사용하는 방법 |
KR20150016567A (ko) | 2012-05-25 | 2015-02-12 | 니폰 제온 가부시키가이샤 | 합판 유리, 및 블록 공중합체 수소화물을 합판 유리의 접착제로서 사용하는 방법 |
WO2014077267A1 (ja) | 2012-11-15 | 2014-05-22 | 日本ゼオン株式会社 | 樹脂組成物およびそれからなる成形体 |
JPWO2014077267A1 (ja) * | 2012-11-15 | 2017-01-05 | 日本ゼオン株式会社 | 樹脂組成物およびそれからなる成形体 |
US9493688B2 (en) | 2012-11-15 | 2016-11-15 | Zeon Corporation | Resin composition and molded article comprising same |
CN104797653A (zh) * | 2012-11-15 | 2015-07-22 | 日本瑞翁株式会社 | 树脂组合物以及由其形成的成型体 |
CN104797653B (zh) * | 2012-11-15 | 2017-08-25 | 日本瑞翁株式会社 | 树脂组合物以及由其形成的成型体 |
TWI625356B (zh) * | 2012-11-15 | 2018-06-01 | Zeon Corp | Resin composition and formed body composed thereof |
JPWO2014091941A1 (ja) * | 2012-12-10 | 2017-01-05 | 日本ゼオン株式会社 | 有機エレクトロニクスデバイス封止用樹脂組成物、及び有機エレクトロニクスデバイス |
WO2014091941A1 (ja) * | 2012-12-10 | 2014-06-19 | 日本ゼオン株式会社 | 有機エレクトロニクスデバイス封止用樹脂組成物、及び有機エレクトロニクスデバイス |
KR102131330B1 (ko) * | 2012-12-10 | 2020-07-07 | 니폰 제온 가부시키가이샤 | 유기 일렉트로닉스 디바이스 봉지용 수지 조성물 및 유기 일렉트로닉스 디바이스 |
CN104854190A (zh) * | 2012-12-10 | 2015-08-19 | 日本瑞翁株式会社 | 有机电子器件密封用树脂组合物及有机电子器件 |
KR20150095639A (ko) * | 2012-12-10 | 2015-08-21 | 니폰 제온 가부시키가이샤 | 유기 일렉트로닉스 디바이스 봉지용 수지 조성물 및 유기 일렉트로닉스 디바이스 |
JP2014133848A (ja) * | 2013-01-11 | 2014-07-24 | Nippon Zeon Co Ltd | 成形体の製造方法 |
JP2014144155A (ja) * | 2013-01-30 | 2014-08-14 | Nippon Zeon Co Ltd | 音響媒体 |
WO2014133003A1 (ja) | 2013-02-27 | 2014-09-04 | 日本ゼオン株式会社 | 太陽電池モジュール及びその製造方法 |
JP2014208799A (ja) * | 2013-03-27 | 2014-11-06 | 三菱化学株式会社 | 樹脂組成物及びそれを用いた接着性封止フィルム |
US10088605B2 (en) | 2013-07-01 | 2018-10-02 | Zeon Corporation | Optical film and production method for same |
WO2015002020A1 (ja) | 2013-07-01 | 2015-01-08 | 日本ゼオン株式会社 | 光学用フィルム及びその製造方法 |
US9814792B2 (en) | 2013-09-06 | 2017-11-14 | Zeon Corporation | Method for producing sterilized medical formed article |
WO2015033876A1 (ja) | 2013-09-06 | 2015-03-12 | 日本ゼオン株式会社 | 滅菌済み医療用成形体の製造方法 |
JP2015104859A (ja) * | 2013-11-29 | 2015-06-08 | 日本ゼオン株式会社 | 薄膜ガラス積層体 |
WO2015105127A1 (ja) | 2014-01-09 | 2015-07-16 | 日本ゼオン株式会社 | 多層フィルム及びその製造方法 |
WO2015115397A1 (ja) | 2014-01-29 | 2015-08-06 | 日本ゼオン株式会社 | 透明粘着シート |
US10005924B2 (en) | 2014-02-28 | 2018-06-26 | Zeon Corporation | Transparent adhesive sheet |
US10328674B2 (en) | 2014-07-09 | 2019-06-25 | Zeon Corporation | Laminated glass |
US10239966B2 (en) | 2014-10-15 | 2019-03-26 | Zeon Corporation | Block copolymer hydride and stretched film formed from same |
KR20170139561A (ko) * | 2015-04-22 | 2017-12-19 | 니폰 제온 가부시키가이샤 | 합판 유리 |
KR102491476B1 (ko) | 2015-04-22 | 2023-01-20 | 니폰 제온 가부시키가이샤 | 합판 유리 |
US10889091B2 (en) | 2015-04-22 | 2021-01-12 | Zeon Corporation | Laminated glass |
US10865302B2 (en) | 2016-01-29 | 2020-12-15 | Zeon Corporation | Resin composition and use thereof |
EP3225393A1 (en) | 2016-04-01 | 2017-10-04 | Asahi Glass Company, Limited | Laminated glass for vehicle |
US12049579B2 (en) | 2016-11-22 | 2024-07-30 | Zeon Corporation | Method of producing a roll-shaped body |
WO2018097146A1 (ja) | 2016-11-24 | 2018-05-31 | 日本ゼオン株式会社 | 接着剤シート及び合わせガラス |
US11247538B2 (en) | 2016-12-22 | 2022-02-15 | Zeon Corporation | Laminated glass |
WO2018116997A1 (ja) | 2016-12-22 | 2018-06-28 | 日本ゼオン株式会社 | 合わせガラス |
WO2018180427A1 (ja) | 2017-03-29 | 2018-10-04 | 日本ゼオン株式会社 | 樹脂組成物、並びに、成形体およびその製造方法 |
JPWO2019044108A1 (ja) * | 2017-08-30 | 2020-08-13 | 日本ゼオン株式会社 | 積層体およびその製造方法 |
US11440303B2 (en) | 2017-08-30 | 2022-09-13 | Zeon Corporation | Laminate and method of manufacturing same |
JP7205477B2 (ja) | 2017-08-30 | 2023-01-17 | 日本ゼオン株式会社 | 積層体およびその製造方法 |
WO2019044108A1 (ja) | 2017-08-30 | 2019-03-07 | 日本ゼオン株式会社 | 積層体およびその製造方法 |
US11624010B2 (en) | 2018-05-22 | 2023-04-11 | Zeon Corporation | Method of producing adhesive resin |
US11773193B2 (en) | 2018-10-17 | 2023-10-03 | Zeon Corporation | Hydrogenated copolymer and method of producing the same, hydrogenated copolymer-containing composition, interlayer film for laminated glass, interlayer film laminate for laminated glass, sealing material, optical film, medical shaped article and method of producing the same, adhesive, and assembly and method of producing the same |
WO2020080202A1 (ja) | 2018-10-17 | 2020-04-23 | 日本ゼオン株式会社 | 共重合体水素化物およびその製造方法、共重合体水素化物含有組成物、合わせガラス用中間膜、合わせガラス用中間膜積層体、封止材、光学フィルム、医療用成形体およびその製造方法、接着剤、ならびに、接合体およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130008506A1 (en) | 2013-01-10 |
EP2532692A4 (en) | 2013-11-13 |
CN102884097A (zh) | 2013-01-16 |
JPWO2011096389A1 (ja) | 2013-06-10 |
EP2532692A1 (en) | 2012-12-12 |
JP5765238B2 (ja) | 2015-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5765238B2 (ja) | 太陽電池素子封止用樹脂組成物及び太陽電池モジュール | |
JP5807643B2 (ja) | アルコキシシリル基を有するブロック共重合体水素化物及びその利用 | |
EP2623526B1 (en) | Hydrogenated block copolymer having alkoxysilyl group, and use therefor | |
JP6295962B2 (ja) | 樹脂組成物およびそれからなる成形体 | |
CN103189996B (zh) | 太阳能电池密封材料及太阳能电池模块 | |
CN108638614B (zh) | 夹层玻璃的制造方法 | |
CN104105773B (zh) | 太阳能电池密封材和太阳能电池模块 | |
KR102049841B1 (ko) | 복합 가스 배리어 적층체 및 그의 제조 방법, 및 복합 전극 | |
JP2013132755A (ja) | 多層シート及びその利用 | |
JP7249926B2 (ja) | 合わせガラス | |
WO2013150730A1 (ja) | 太陽電池モジュール | |
JP6825557B2 (ja) | 発光装置の製造方法 | |
JP6073787B2 (ja) | 封止材及びその製造方法 | |
CN106715571A (zh) | 密封片、太阳能电池模块以及密封片的制造方法 | |
JP2016204217A (ja) | 複層ガラス | |
JP6229460B2 (ja) | 薄膜ガラス積層体 | |
CN111465878B (zh) | 偏振片保护膜、偏振片及显示装置 | |
WO2019044108A1 (ja) | 積層体およびその製造方法 | |
JP2014127544A (ja) | 太陽電池モジュール | |
WO2017026347A1 (ja) | 光架橋性エチレン系樹脂組成物 | |
JP2018002763A (ja) | アルコキシシリル基を有する変性ブロック共重合体水素化物及びその利用 | |
JP2018051956A (ja) | 透明フィルムの製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180008110.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11739737 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011552779 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2011739737 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011739737 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13520715 Country of ref document: US |