WO2010090121A1 - はんだ供給装置、印刷装置、および印刷方法 - Google Patents
はんだ供給装置、印刷装置、および印刷方法 Download PDFInfo
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- WO2010090121A1 WO2010090121A1 PCT/JP2010/051116 JP2010051116W WO2010090121A1 WO 2010090121 A1 WO2010090121 A1 WO 2010090121A1 JP 2010051116 W JP2010051116 W JP 2010051116W WO 2010090121 A1 WO2010090121 A1 WO 2010090121A1
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- Prior art keywords
- solder
- pool
- printing
- squeegee
- mask
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/34—Screens, Frames; Holders therefor
- B41F15/36—Screens, Frames; Holders therefor flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/42—Inking units comprising squeegees or doctors
- B41F15/423—Driving means for reciprocating squeegees
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/44—Squeegees or doctors
- B41F15/46—Squeegees or doctors with two or more operative parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/02—Arrangements of indicating devices, e.g. counters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F33/00—Indicating, counting, warning, control or safety devices
- B41F33/04—Tripping devices or stop-motions
- B41F33/14—Automatic control of tripping devices by feelers, photoelectric devices, pneumatic devices, or other detectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/11—Registering devices
- B41P2215/112—Registering devices with means for displacing the frame
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
- B41P2215/11—Registering devices
- B41P2215/114—Registering devices with means for displacing the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1492—Periodical treatments, e.g. pulse plating of through-holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention relates to a printing technique for printing solder on a substrate superimposed on the back surface of a mask by sliding the squeegee on the mask surface while pressing the solder pool staying on the mask surface with a squeegee,
- the present invention relates to a technique for replenishing solder in a solder pool.
- a printing apparatus for applying (printing) is generally known.
- a solder pool is formed by retaining a sufficiently larger amount of solder than the amount of solder used for one board, and printing is performed using the solder pool, but printing is performed repeatedly. Solder is consumed in the meantime, and the remaining amount of solder in the solder pool decreases. Therefore, a technique has been proposed in which the remaining amount of solder in the solder pool is detected by a sensor, and solder is automatically replenished to the solder pool based on the detection result (see, for example, Patent Document 1).
- the printing apparatus described in Patent Document 1 moves a mask surface while pressing a solder pool by alternately using the pair of squeegees while reciprocating a pair of squeegees having different inclination directions along the mask surface. Yes. That is, while the pair of squeegees are moved forward, the solder pool is moved in the forward direction while pressing the solder pool with one squeegee, and while the pair of squeegees are moved backward, the solder pool is moved with the other squeegee. The solder pool is always moved back and forth between the pair of squeegees.
- a sensor is disposed in the vicinity of the forward-side squeegee.
- the sensor detects the solder pool and replenishes the solder based on the detection result. Therefore, it is necessary to set the movement range of the pair of squeegees in consideration of the following cases. In other words, in order to detect the remaining amount of solder in the solder pool after moving the return side squeegee in the return direction and performing the return pass printing process, the forward side squeegee and the return side squeegee are moved in the forward direction. It is necessary to return and bring the sensor close to the solder pool.
- the other squeegee moves to the opening side of the mask. If the solder drips from the other squeegee during or after the squeegee is moved, it may pass through the opening of the mask and adhere to the substrate. In this case, if the substrate is not aligned with the mask, the dripped solder may adhere to an inappropriate location on the substrate (that is, a location where solder is not planned to be applied). Therefore, in order to avoid such a problem, it is conceivable that the detection of the solder and the replenishment of the solder are executed after the positioning of the substrate. However, when such an operation sequence is employed, the start of the next printing is delayed by the amount of solder detection and replenishment, resulting in tact loss.
- the pair of squeegees are moved by a fixed distance in the return path direction even after the return path printing process, and the pair of squeegees are moved in the opposite directions after moving the solder pool to the non-opening side of the mask It is also conceivable to bring the sensor back into proximity with the solder pool. However, it is necessary to secure a region for moving the solder pool toward the non-opening side in the mask by overrunning the pair of squeegees in the return path direction, and the region where the opening is provided is narrow accordingly. turn into. That is, it is necessary to limit the substrate size, and the versatility of the apparatus is reduced.
- the present invention has been made in view of the above problems, and a solder supply device capable of optimizing the remaining amount of solder in a solder pool used for solder printing without causing a limitation on substrate size or tact loss,
- An object is to provide a printing apparatus and a printing method.
- the head is relatively moved along the mask surface in the forward direction while pressing the solder pool retained on the mask surface from the upstream side in the forward direction with a squeegee supported by the head.
- a forward printing process in which solder is printed onto the substrate superimposed on the back surface of the mask through the opening of the mask, and the solder pool is pressed from the upstream side in the backward direction with the squeegee in the backward direction.
- the head is relatively moved along the mask surface, and is provided in a printing apparatus that alternately performs a return path printing process in which solder is printed on the substrate through the opening of the mask.
- the head is moved in the forward direction along the mask surface while pressing the solder pool retained on the mask surface from the upstream side in the forward direction with a squeegee supported by the head.
- a forward printing process in which solder is printed on the substrate superimposed on the back surface of the mask through the opening of the mask, and the return path direction while pressing the solder pool from the upstream side in the backward direction with the squeegee
- a solder supply for supplying solder
- a printing means for alternately switching a return path printing process in which the head is relatively moved along the mask surface to print solder on the substrate through the opening of the mask.
- solder amount measuring means for measuring the solder amount of the solder pool and the replenishment of the solder in the solder pool based on the measurement result by the solder amount measuring means
- Solder replenishment necessity determining means for determining whether or not
- replenishment control means for controlling the solder supply means based on the determination result of the solder replenishment necessity determining means to replenish solder in the solder pool. It is a feature.
- the head is moved in the forward direction along the mask surface while pressing the solder pool retained on the mask surface by the squeegee supported by the head from the upstream side in the forward direction.
- a forward printing process in which solder is printed on the substrate superimposed on the back surface of the mask through the opening of the mask, and in the backward direction while pressing the solder pool from the upstream side in the backward direction with the squeegee.
- a solder amount measuring step for measuring the solder amount of the solder pool and replenishment of solder based on the measurement result of the solder amount measuring step
- a solder replenishment necessity determination step for determining necessity and a replenishment step for replenishing solder to the solder pool based on the determination result of the solder replenishment necessity determination step are provided.
- the forward printing process and the backward printing process are performed by one squeegee, and the squeegee is switched when the forward printing process and the backward printing process are switched.
- the solder adhering to the squeegee drips during the solder amount measurement the solder adheres to the non-opening of the mask, so the amount of solder in the solder pool can be reduced without adopting an operation sequence that causes tact loss. Can be measured. Further, it is not necessary to overrun the mask on the non-opening side. Therefore, the amount of solder in the solder pool can be measured in a short time even when performing solder printing using a relatively large mask as well as a mask having a relatively small area provided with an opening. Then, based on the amount of solder thus measured, it is determined whether or not solder replenishment is necessary, and solder is replenished to the solder pool as necessary to optimize the solder pool.
- the amount of solder in the solder pool can be measured at the time of switching when the squeegee passes through the solder pool at the non-opening portion of the mask, so that the solder adhered to the squeegee during the measurement of the solder pool. Can be prevented from dripping down to the opening side of the mask. Therefore, the amount of solder in the solder pool can be measured without employing an operation sequence in which tact loss occurs, and generation of tact loss can be prevented. Further, the amount of solder in the solder pool can be measured during the switching operation of the squeegee position with respect to the solder pool, the limitation on the board size that has occurred in the prior art can be eliminated, and versatility can be improved. And based on the amount of solder measured in this way, a solder pool can be optimized by replenishing a solder pool as needed.
- FIG. 1 is a perspective view showing a printing apparatus equipped with a first embodiment of a solder supply apparatus according to the present invention. It is a top view which shows schematic structure of the printing apparatus in the state which has not installed the mask. It is a side view which shows schematic structure of the printing apparatus in the state which installed the mask.
- FIG. 2 is a block diagram illustrating a main schematic configuration of a printing apparatus. It is a perspective view which shows the specific structure of the head for printing. It is a side view which shows the specific structure of the head for printing.
- FIG. 7A is a front view showing a solder supply unit.
- FIG. 7B is a cross-sectional view taken along the line BB of FIG. 7A.
- FIG. 5 is a diagram schematically showing the operation of the printing apparatus according to the present invention for each of steps (a) to (i).
- FIG. 6 is a timing chart showing a state in which the amount of solder is measured at a plurality of timings (a) to (c). It is a figure which shows the operation
- a printing apparatus includes a base 10 having a substantially square shape in plan view, and a substrate that is movable on the base 10 before and after the apparatus.
- the substrate transport mechanism 20 includes a conveyor unit 25 having a pair of main conveyors 251 a and 251 b that can drive the substrate 1 to the left and right of the printing apparatus on the base 10.
- the printing apparatus is provided on the right side surface of the base 10, and carries the untreated substrates 1 into the conveyor unit 25, and the conveyors 25, 31 are provided on the left side surface of the base 10.
- Unloading conveyors 32 and 32 that are unloaded from the conveyor unit 25 and a control unit 40 (see FIG. 4) that controls the entire printing apparatus are provided.
- the substrate transport mechanism 20, the carry-in conveyors 31 and 31, and the carry-out conveyors 32 and 32 are controlled to be interlocked with each other by the substrate transport mechanism control unit 43 of the control unit 40.
- the left-right direction of the printing apparatus is temporarily referred to as the X-axis direction
- the front-rear direction is referred to as the Y-axis direction
- the up-down direction is temporarily referred to as the Z-axis direction.
- the substrate transport mechanism 20 has a movable plate 21 having a rectangular shape in plan view.
- a drive unit group not shown
- the horizontal movement along the Y-axis direction, the up-and-down movement along the Z-axis direction, and the rotational movement around the Z-axis become possible. Yes.
- the conveyor unit 25, a substrate clamp unit 26 (see FIGS. 8 and 11), and a backup unit 27 are provided.
- the main conveyors 251a and 251b of the conveyor unit 25 are spaced apart along the Y-axis direction and extend in parallel along the X-axis direction.
- the front conveyor 251 a is supported by a front support member attached to the movable plate 21, while the rear conveyor 251 b is supported by a rear support member attached to the movable plate 21.
- plate-like clamp pieces 26a and 26b constituting the substrate clamp unit 26 are respectively attached to the front and rear support members described above. Then, the clamp pieces 26a and 26b are driven by the operation of an actuator such as a cylinder by the substrate transport mechanism control unit 43 to support the substrate 1 on the conveyors 251a and 251b from the side. Further, the side support of the substrate 1 by the clamp pieces 26a and 26b is released by driving the actuator in the reverse direction.
- the backup unit 27 is disposed on the movable plate 21 between the front and rear support members described above.
- the backup unit 27 is disposed between a backup plate 271 supported on the movable plate 21 so as to be movable up and down, a plurality of backup pins 272 erected on the backup plate 271, and the backup plate 271 and the movable plate 21.
- a lifting mechanism (not shown) for driving the backup plate 271 up and down.
- the backup pin 272 can support the lower surface of the substrate 1 from below by the tip of the backup pin 272. Then, the back-up plate 271 is moved upward by operating the lifting mechanism by the substrate transport mechanism controller 43, and the substrate 1 is lifted and positioned from the conveyors 251a and 251b.
- the backup plate 271 rises, the tip of the backup pin 272 comes into contact with the substrate 1 on the conveyors 251a and 251b.
- the backup pin 272 lifts the substrate 1 upward from the conveyors 251a and 251b while supporting the lower surface of the substrate 1 from the lower side so that the upper surface of the substrate 1 is flush with the upper surface of the clamp piece. (Backup).
- the backup plate 271 is lowered, the substrate 1 is returned from the backup pins 272 to the conveyors 251a and 251b, and then further lowered, the backup pins 272 are retracted below the substrate 1.
- the substrate transport mechanism controller 43 moves the movable plate 21 in the X axis direction, the Y axis direction, and the Z axis rotation direction so that the backup pin 272 can be used as described above. While being backed up, the substrate 1 held by the clamp piece is positioned with respect to the mask 51 of the mask clamp unit 50.
- the carry-in conveyor 31 is provided in order to convey in the X-axis direction while supporting the unprocessed substrate 1 on which the solder is to be printed.
- the transport conveyors 31 and 31 are driven.
- the substrate 1 before printing is fed into conveyors 251 a and 251 b provided in the substrate transport mechanism 20.
- the conveyors 251a and 251b When the conveyors 251a and 251b receive the unprocessed substrate 1 fed from the carry-in conveyors 31 and 31, the height of the movable plate 21 is adjusted, and the pair of conveyors 251a and 251b is brought into the carry-in conveyors 31 and 31 and the carry-out conveyor 32, The conveyors 251a and 251b are driven together with the carry-in conveyors 31 and 31 by positioning at the same height as 32 and centering along the X-axis direction.
- the unloading conveyor 32 is provided for unloading in the X-axis direction while supporting the processed substrate 1 on which the solder is printed.
- the conveyors 251 a and 251 b transport the printed substrate 1 that has received printing to the carry-out conveyors 32 and 32
- the conveyors 251 a and 251 b are driven together with the carry-out conveyors 32 and 32 from the state after the processing.
- the Y-axis direction interval between the carry-in conveyors 31 and 31 the Y-axis direction interval between the conveyers 251a and 251b, and the Y-axis direction interval between the carry-out conveyors 32 and 32 are independent conveyor widths (not shown). It is variable by the adjusting device, and is adjusted in accordance with the width of the substrate 1 in the setup process before starting printing.
- the mask clamp unit 50 detachably fixes the mask 51 to the frame member 11 fixed to the base 10.
- the mask 51 is obtained by attaching a thin plate-like stencil to the lower surface side of a mask frame (mask frame) 52 by an operation of an operator.
- the mask frame 52 is fixed to the frame member 11 by the mask clamp unit 50 above the substrate transport mechanism 20.
- the mask 51 is held above the substrate transport mechanism 20.
- An opening through which solder is passed is formed at the center of the mask 51, and at least the front and rear sides of the mask 51 are non-openings DM1 and DM2 on which the solder pool SP can be placed.
- a solder supply unit 60 and a squeegee unit 70 are disposed above the mask 51.
- each part of the solder supply unit 60 is operated in accordance with a control command from the solder supply control unit 44 of the control unit 40 so that solder is supplied onto the mask 51 to form a solder pool, Add solder to the reservoir.
- the squeegee unit 70 spreads the solder on the mask 51 on the mask 51 in response to a drive command from the squeegee control unit 45 (see FIG. 4) of the control unit 40.
- solder is printed on the upper surface of the substrate 1 through the opening provided in the mask 51.
- the solder supply unit 60 corresponds to the “solder supply device” and “solder supply means” of the present invention
- the squeegee unit 70 corresponds to the “printing means” of the present invention. Details of the configurations and operations of the solder supply unit 60 and the squeegee unit 70 will be described later.
- the substrate transport mechanism 20 is moved and positioned between the carry-in conveyors 31 and 31 and the carry-out conveyors 32 and 32 again. Then, after the processed substrate 1 is returned to the conveyors 251a and 251b by the operation opposite to the backup and substrate clamping operation, the conveyors 251a and 251b of the substrate transport mechanism 20 are driven by the substrate transport mechanism control unit 43 to perform printing. The processed substrate 1 that has been subjected to the transfer is conveyed to the carry-out conveyors 32 and 32. Thereafter, when the carry-out conveyors 32 and 32 are driven, the processed substrate 1 is carried out from the printing apparatus.
- a substrate camera 81 for imaging a plurality of fiducial marks and the like on the substrate 1 is attached so as to be movable in the X-axis direction along a beam 12 fixed to the frame member 11.
- the substrate transport mechanism 20 includes a mask camera 82.
- the mask camera 82 is moved in the X-axis direction in order to image a plurality of fiducial marks (not shown) on the lower surface of the mask 51 and identify the position, type, etc. of the mask 51. Since the substrate transport mechanism 20 is movable in the Y-axis direction, the substrate camera 81 and the mask camera 82 respectively capture a plurality of fiducial marks that are separated in the X-axis direction and the Y-axis direction, and their positions. Recognition becomes possible.
- a cleaner 90 is attached to the front side of the substrate transport mechanism 20 in the Y-axis direction, and the cleaner 90 moves in the Y-axis direction as the substrate transport mechanism 20 moves in the Y-axis direction.
- the cleaner 90 is an apparatus that cleans and removes solder or the like attached to the mask 51 by printing solder on the substrate 1.
- the control unit 40 includes an arithmetic processing unit 41, a program storage unit 42, a board transport mechanism control unit 43, a solder supply control unit 44, and a squeegee control unit 45.
- the arithmetic processing unit 41 is configured by a CPU or the like, and repeats printing by controlling each unit of the printing apparatus in accordance with a printing program stored in advance in the program storage unit 42.
- the substrate transport mechanism controller 43 controls actuators such as various motors and air cylinders incorporated in the substrate transport mechanism 20 to load and unload the substrate 1 by the conveyors 251a and 251b, position the substrate 1 with respect to the mask 51, and the like. I do.
- the solder supply control unit 44 controls the solder supply unit 60 described in detail below to supply solder to the mask 51. Further, the squeegee control unit 45 controls the operation of the squeegee 702.
- Reference numeral 46 in the figure denotes a display / operation unit for displaying a printing program, an error message, and the like, and for inputting information such as various data and commands to the control unit 40 by an operator.
- Reference numeral 47 denotes an input / output control unit that receives a detection result of a solder sensor or the like that detects solder on the mask 51 and supplies the detection result to the arithmetic processing unit 41.
- Reference numeral 48 denotes a data storage unit.
- the data storage unit 48 stores data necessary for the control of each unit described above, and forms a solder pool SP on the mask 51 in a limit solder amount that can ensure printing quality, and in a preparation step that will be described later. It is configured to store the initial solder discharge amount, the amount of decrease in solder consumed by one printing, the amount of solder measured in the solder amount measurement process, the remaining amount of solder calculated based on the solder amount, etc. ing.
- the squeegee unit 70 includes a squeegee 702 extending in the X-axis direction and a printing head 704 that pivotally supports the squeegee 702.
- the print head 704 is supported so as to be movable in the Y-axis direction and the Z-axis direction, and is configured to be driven by a servo motor. That is, a pair of fixed rails 706 are provided on the top of the frame member 11 along the Y axis, and the head support member 708 is horizontally mounted on the fixed rails 706 so as to be movable in the Y axis direction.
- the head support member 708 moves in the Y-axis direction by operating the head Y-axis drive motor 710 in accordance with a control command from the squeegee control unit 45.
- a printing head 704 is connected to the head support member 708 so as to be movable in the Z-axis direction, and the head Z-axis drive motor 712 is operated in response to a control command from the squeegee control unit 45.
- the print head 704 moves in the Z-axis direction.
- a head having a single squeegee (single squeegee) as described in, for example, Japanese Patent Application Laid-Open No. 2007-136960 is used as the printing head 704. Specifically, it is as follows.
- the printing head 704 has a main frame 714 that is fixed to the head support member 708 via a stay 713.
- the main frame 714 is made of aluminum or the like, and a support plate 718 is connected to the lower side of the main frame 714 via a slide column 716 so as to be displaceable in the Z-axis direction.
- a load sensor 720 such as a load cell is interposed between the support plate 718 and the main frame 714.
- a subframe 722 disposed below the support plate 718 is supported so as to be swingable about an axis parallel to the Y axis.
- a pair of drooping portions 724 is provided at the lower portion (lower surface) of the support plate 718, and a first support shaft 726 penetrating these drooping portions 724 in the Y-axis direction is rotatable via a bearing or the like.
- a sub-frame 722 is attached to the first support shaft 726.
- the frame 722 is supported so as to be swingable about an axis parallel to the Y axis.
- a unit assembly portion 728 is rotatably supported, and a drive mechanism for driving the unit assembly portion 728 is mounted.
- the unit assembly portion 728 is a rectangular plate-like member that is elongated in the X-axis direction, and is rotatably supported by the subframe 722 via a pair of unit support portions 730 that project from the middle portion in the longitudinal direction. ing.
- the second support shaft 734 extending in the X-axis direction is rotatably supported by the subframe 722 via a bearing or the like, and the unit support portions 730 of the unit assembly portion 728 are respectively provided at both ends of the second support shaft 734. Is fixed.
- the unit assembly portion 728 is supported to be swingable about the X axis with respect to the subframe 722.
- a gear box 732 is integrally assembled with the subframe 722, and one end (the left end portion in FIG. 6) of the second support shaft 734 penetrates the gear box 732 and projects outward.
- each unit support portion 730 of the unit assembly portion 728 is fixed to the second support shaft 734 on both sides of the subframe 722 and the gear box 732.
- the surface of the lower mask 51 is located on the side surface of the subframe 722 at the right position in FIG.
- a solder sensor SC for detecting a solder pool staying in is attached. Then, a signal indicating the result of measurement of the solder pool by the solder sensor SC is input to the input / output control unit 47.
- the sensor SC functions as the “solder amount measuring means” of the present invention.
- a transmission gear (not shown) is fixed to a portion of the second support shaft 734 inserted in the gear box 732, and this transmission gear meshes with an idle gear (not shown) supported in the gear box 732. is doing.
- a squeegee rotation motor 736 as a drive source is fixed to a rear portion of the subframe 722 and a side surface portion of the gear box 732, and an output shaft of the squeegee rotation motor 736 is placed in the gear box 732.
- a drive gear (not shown) that is inserted and meshed with the idle gear is attached to the portion. Accordingly, when the squeegee rotating motor 736 is operated, the driving force is transmitted to the second support shaft 734 via each gear.
- the unit assembly portion 728 is configured to be rotationally driven around the second support shaft 734. That is, the squeegee rotation motor 736, the gears, the second support shaft 734, and the like constitute the drive mechanism of the unit assembly portion 728.
- a squeegee assembly 738 is detachably attached to the unit attaching portion 728.
- the squeegee assembly 738 includes a squeegee 702 and a squeegee holder 740 that holds the squeegee 702. Then, a pair of screw shafts (not shown) provided in the squeegee holder 740 are passed through guide grooves formed in the unit assembly portion 728, and the squeegee holder 740 is overlaid on the unit assembly portion 728, and A nut member 742 with a knob is screwed and attached to each screw shaft, thereby being fixed to the unit assembly portion 728.
- the squeegee 702 is a polymer material such as urethane rubber, polyacetal, polyethylene, polyester, etc., and is formed of a material having an appropriate elasticity (in this embodiment, urethane rubber is adopted). It is a plate-like member elongated in the axial direction. Similarly, one surface of the squeegee 702 is fixed to the squeegee holder 740 while being superposed on the squeegee holder 740 elongated in the X-axis direction. A work surface 702a for scraping off the solder is formed flat on the other surface of the squeegee 702.
- the squeegee rotation motor 736 is operated in accordance with a control command from the squeegee control unit 45, whereby the work surface of the squeegee 702 is selectively set to either the upstream side in the Y-axis direction or the downstream side in the Y-axis direction. Can be directed to. Thereby, the solder can be scraped off by using the same work surface 702a in both the forward printing process and the backward printing process described later.
- the squeegee control unit 45 sets the print load (the load that the squeegee 702 presses the substrate 1 and the clamp pieces 26a and 26b through the mask 51) as a target load detected by the load sensor 720.
- the head Z-axis drive motor 712 is feedback-controlled to match.
- a lateral leakage prevention plate 744 is rotatably attached to both ends of the squeegee holder 740, and the lateral leakage prevention plate 744 acts as a torsion spring (not shown) in a state where the printing head 704 is in the raised position.
- the horizontal leakage prevention plate 744 is held by the squeegee holder 740 so that the center line of the side leakage prevention plate 744 is at a position orthogonal to the work surface 702a.
- the print head 704 When the printing head 704 is lowered and the squeegee 702 is pressed against the substrate 1 and the clamp pieces 26a and 26b via the mask 51 at a predetermined attack angle, the print head 704 is moved from the substrate 1 and the clamp pieces 26a and 26b via the mask 51.
- the reaction force acting causes the side leakage prevention plate 70 to rotate against the elastic force of a torsion spring (not shown), and the end face 744 a or 744 b contacts the mask 51.
- the lateral leakage prevention plate 744 prevents the solder from laterally leaking from the squeegee 702 outward in the X-axis direction during printing.
- the reaction force acting on the side leakage prevention plate 744 against the elastic force of the torsion spring is considerably smaller than the reaction force directly acting on the squeegee 702 and the clamp pieces 26a and 26b.
- the load detected by the load sensor 720 is regarded as the printing load as it is.
- the solder supply unit 60 includes a unit main body 602 that is movably attached to the squeegee unit 70 in the X-axis direction, and drives the unit main body 602 in the X-axis direction.
- An X-axis drive motor 604 (FIG. 4), and a solder supply controller 44 (FIG. 4) for controlling the operation of the X-axis drive motor 604.
- a container support member 606 is disposed on the front side (front side in the Y-axis direction) of the unit main body 602.
- a container 614 with an adapter is detachably attached to the container support member 606 from the front side of the printing apparatus (left hand side in FIG. 7B).
- the container 614 with an adapter is a unit in which the upper end portion 612 of the discharge adapter 610 is fitted into the solder storage container 608 and integrated.
- the solder storage container 608 is a cylindrical container having an opening at the lower end, and a concave internal space having a substantially circular cross section is formed therein. When supplied from the manufacturer, the solder is stored in this internal space in advance.
- the upper end portion 612 of the discharge adapter 610 is finished into an annular piston shape narrower than the inner diameter of the solder storage container 608 and can be fitted into the solder storage container 608.
- the solder storage container 608 and the discharge adapter 610 can be moved relative to each other with the upper end portion 612 along the inner wall surface of the solder storage container 608.
- the upper end portion 612 of the discharge adapter 610 when the upper end portion 612 of the discharge adapter 610 is fitted into the solder storage container 608, no gap is formed between the upper end portion 612 and the inner wall surface of the solder storage container 608.
- two annular grooves (not shown) are formed in the upper end portion 612, and seal portions 620 and 622 are attached to the respective annular grooves.
- the next seal portion 622 also comes into sliding contact with the inner wall surface of the solder storage container 608 in the same manner as the seal portion 620. As a result, the seal between the discharge adapter 610 and the solder container 608 is ensured by the seal portions 620 and 622.
- the adapter-equipped container 614 is set in the solder supply unit 60 as follows.
- a large-diameter portion 624 bulging with a tapered step is formed on the lower end of the outer peripheral surface of the solder storage container 608 of the container with adapter 614 as shown in FIGS. 7A and 7B.
- the large-diameter portion 624 is supported by being engaged with an engaging portion 626 formed on the container support member 606 when the adapter-equipped container 614 is attached to the container support member 606.
- the discharge adapter 610 is formed with a small-diameter duct portion 628 that is continuous with the upper end portion 612.
- the duct portion 628 engages with the holding plate 630 connected to the unit main body 602 when the adapter-equipped container 614 is attached to the container support member 606.
- the solder storage container 608 is engaged with the container support member 606, while the discharge adapter 610 is connected to the unit main body 602 through the restraining plate 630. Is done.
- the container support member 606 is movable up and down.
- a solder discharge motor 632 is attached to the unit main body 602, and a ball screw shaft 634 that rotates by receiving the rotational driving force of the solder discharge motor 632 is erected.
- the lower end of the ball screw shaft 634 is pivotally supported by the unit main body 602, while the container support member 606 is connected to the upper end via a ball screw bracket 636. Accordingly, when the solder discharge motor 632 is operated in accordance with an operation command from the solder supply control unit 44, the container support member 606 moves in the vertical direction, and the solder storage container 608 is raised or lowered relative to the discharge adapter 610. To do.
- the discharge adapter 610 is relatively moved along the inner wall surface of the solder storage container 608 by moving the solder storage container 608 up and down while the discharge adapter 610 is fixed to the unit main body 602. Therefore, when the solder storage container 608 is lowered and the distance between the inner bottom surface of the solder storage container 608 and the distal end surface of the discharge adapter 610 is reduced, an amount of solder corresponding to the moving distance is discharged from the solder storage container 608. It is pushed downward through the discharge hole 638 of 610.
- a guide block member 642 in which a guide channel 640 is formed is attached to the outlet side of the discharge hole 638 (the lower side in FIG. 7B).
- the solder discharged from the discharge hole 638 as described above is supplied from the supply port 644 of the guide block member 642 toward the mask 51 (FIG. 3) via the guide flow path 640.
- a shutter member 646 is disposed in the vicinity of the supply port 644.
- the shutter member 646 is movable between a closed position where the supply port 644 is closed and an open position where the supply port 644 is opened.
- the shutter member 646 is configured to be movable between both positions by a solder cut cylinder 648.
- the solder cut cylinder 648 is controlled when a drive command is given from the solder supply controller 44 to a solder cut valve (not shown) and a piston (not shown) of the solder cut cylinder 648 moves in a predetermined direction.
- the solder supply controller 44 prevents the shutter member 646 from being supplied from the supply port 644 with the shutter member 646 positioned at the closed position.
- the shutter member 646 is moved to the open position, and control is performed so that the solder supply is started.
- the solder supply control unit 44 controls the solder cut cylinder 648 so as to move the shutter member 646 to the closed position. By this shutter movement, the solder that has been continuously discharged from the supply port 644 is cut, and the supply of solder from the supply port 644 is stopped.
- the interval in the Y-axis direction is adjusted in accordance with the width of the substrate 1.
- the mask frame 52 on which a new mask 51 is pasted by the operator is fixedly arranged on the frame member 11 by the mask clamp unit 50.
- the squeegee holder 740 to which the desired squeegee 702 is assembled is assembled to the unit assembly portion 728.
- solder is supplied from the solder supply unit 60 based on the initial solder discharge amount stored in the data storage unit 48, and a solder pool SP is formed on the mask surface.
- the arithmetic processing unit 41 controls each part of the printing apparatus according to a printing program stored in advance in the program storage unit 42, and executes the forward path printing process and the backward path printing process alternately.
- the substrate 1 is replaced at the time of print switching, and the “solder amount measurement” step, the “solder replenishment necessity determination” step, and the “solder replenishment” step are executed for each print switching.
- the control unit 40 functions as “solder amount measuring means”, “determination means”, and “replenishment control means” of the present invention, as will be described later.
- the printing operation and the solder related operation in the first embodiment will be described with reference to FIGS. 8 to 10.
- FIG. 8 is a diagram schematically showing the operation of the printing apparatus according to the present invention.
- FIG. 9 is a diagram showing a method for measuring the amount of solder.
- FIG. 10 is a figure which shows the operation
- the “outward printing process” in each embodiment means that the head 704 is moved from the rear side to the front side in the Y-axis direction, thereby staying in the non-opening portion DM1 on the rear side in the Y-axis direction on the surface of the mask 51. It means a printing operation performed by moving the solder pool SP forward to the front non-opening portion DM2 in the Y-axis direction.
- the head 704 is moved from the front side to the rear side in the Y-axis direction, so that the solder pool SP staying in the non-opening portion DM2 on the front side in the Y-axis direction on the surface of the mask 51 is changed to Y.
- broken arrows indicate the calculation basis (relationship) of the solder to be replenished.
- the head 704 starts to move in the forward direction, and the squeegee 702 slides on the surface of the non-opening portion DM1 by the forward travel distance, and then prints solder on the substrate 1 through the opening. Further, the movement of the head 704 is stopped by sliding on the surface of the non-opening portion DM2 by the forward travel end distance from the time when it passes through the most downstream opening in the forward direction.
- the control unit 40 replaces the substrate, that is, unloads the processed substrate 1 and removes the unprocessed substrate 1 as shown in the column “First Embodiment” of FIG. Carry in.
- a “front side solder amount measurement” step is executed.
- This “front-side solder amount measurement” step is an operation of measuring the remaining amount of solder in the solder pool SP staying in the front non-opening portion DM2.
- the head 704 is raised to retract the squeegee 702 above the solder pool SP (timing (a) in FIG. 9). Then, the squeegee 702 is rotated clockwise on the paper surface of FIG. 8 and FIG.
- timing (b) in FIG. 9 the head 704 is moved in the forward direction by a distance slightly longer than the maximum setting width of the solder pool SP in the Y-axis direction, and a signal (sensor output) output from the solder sensor SC during the movement is an input / output control unit. 47 to the arithmetic processing unit 41.
- the arithmetic processing unit 41 measures the time during which the sensor SC passes above the solder pool SP and the sensor is OFF (timing (c) in FIG. 9).
- the sensing method is not limited to the above-described light reflection method.
- a sensor of a type that detects the height from the sensor to the detection location may be used, and the amount of solder in the solder pool SP can be measured. Any sensor may be used.
- the arithmetic processing unit 41 determines whether or not the solder needs to be replenished.
- the arithmetic processing unit 41 performs a “solder replenishment on the front side” step (step in FIG. 8).
- the squeegee 702 is moved to the position to start the return pass printing process by rotating the squeegee 702 counterclockwise, moving the printing head 704 forward in the Y-axis direction, and lowering the head 704. (Step (d) in FIG. 8).
- the arithmetic processing unit 41 performs the “refilling solder on the front side” step.
- This “front-side solder replenishment” step is an operation of replenishing the solder pool SP staying in the front non-opening portion DM2 using the solder supply unit 60, and is performed as follows.
- the squeegee 702 is further rotated clockwise on the paper surface of FIG. 8 to switch to the vertical posture to prevent interference with the solder supply unit 60 moving in the X-axis direction. Then, the head 704 is moved in the backward direction with this vertical posture, and the supply port 644 of the solder supply unit 60 is positioned at a position directly above the solder pool SP. Thereafter, while the shutter 646 is opened and the solder is continuously discharged from the supply port 644, the solder supply unit 60 is moved in the X-axis direction while the supply port 644 maintains the upper position of the front non-opening portion DM2. Then, the solder pool SP is uniformly replenished with solder.
- the shutter 646 is closed.
- the squeegee 702 is moved to the position where the return pass printing process is started by replacing the substrate and rotating the squeegee 702 counterclockwise, moving the print head 704 forward in the Y-axis direction, and lowering the print head 704 (see FIG. Step (d) 8), the head 704 is lowered, and the squeegee 702 is brought into contact with the solder pool SP staying in the non-opening portion DM2 on the front side from the upstream side in the backward direction (front side in the Y-axis direction). .
- the solder remaining amount of the solder pool SP is always kept at a predetermined amount or more. Be drunk.
- the return pass printing step is executed (step (e) in FIG. 8).
- the head 704 moves in the backward direction while the squeegee 702 is in contact with the solder pool SP later, and the squeegee 702 slides on the surface of the non-opening portion DM2 by the backward running distance. After that, solder is printed on the substrate 1 through the opening. Furthermore, the movement of the head 704 is stopped by sliding on the surface of the non-opening portion DM1 for the return path end distance from the time when it passes through the most downstream opening in the return path direction.
- the control unit 40 When the return pass printing process is completed, the control unit 40 performs substrate replacement in the same way as the forward pass printing process. Simultaneously with this board replacement, the control unit 40 executes a “rear solder amount measurement” step and a “rear solder replenishment necessity determination” step (step (f) in FIG. 8).
- This “rear solder amount measurement” step is an operation of measuring the remaining solder amount of the solder pool SP staying in the rear non-opening portion DM1, and basically “front solder amount measurement”. It is done in the same way. That is, after the head 704 is raised to retract the squeegee 702 above the solder pool SP, the squeegee 702 is rotated counterclockwise on the paper surface of FIG.
- the squeegee 702 is located on the downstream side in the backward direction (the rear side in the Y-axis direction) with respect to the solder pool SP, that is, on the opposite side to the opening of the mask 51.
- the head 704 is moved in the backward direction by a distance slightly longer than the maximum set width of the solder pool SP in the Y-axis direction, and arithmetic processing is performed based on a signal (sensor output) output from the solder sensor SC during the movement.
- the unit 41 measures the sensor OFF time.
- the control unit 40 calculates the width W of the solder pool SP in the rear non-opening portion DM1 based on the moving speed of the head 704, and uses this as an index value indicating the amount of solder in the solder pool SP.
- the arithmetic processing unit 41 determines whether or not solder replenishment is necessary. When the amount of decrease in the width W of the solder pool SP is less than a predetermined value and sufficient solder remains in the solder pool SP, the arithmetic processing unit 41 performs a “solder replenishment process” in FIG. Without executing step (h)), the squeegee 702 is moved to the position where the forward printing process is started by rotating the squeegee 702 clockwise, moving the printing head 704 forward in the Y-axis direction, and lowering the head 704. (Step (i) in FIG. 8).
- This “rear-side solder replenishment” step is an operation of replenishing the solder pool SP staying in the rear non-opening portion DM1 using the solder supply unit 60. More specifically, the printing head 704 is moved in the backward direction from the state of step (f) in FIG. 8, and the supply port 644 of the solder supply unit 60 is positioned at a position directly above the solder pool SP.
- the solder supply unit 60 is moved in the X-axis direction while the supply port 644 maintains the upper position of the front non-opening portion DM1. Then, the solder pool SP is uniformly replenished with solder. After refilling the solder, the shutter 646 is closed. Simultaneously, the squeegee 702 is moved to the position where the forward printing process is started by rotating the squeegee 702 clockwise, moving the printing head 704 forward in the Y-axis direction, and lowering the printing head 704 (step (i in FIG. 8)). )).
- the remaining amount of solder in the solder pool SP is always obtained by executing the “rear solder amount measurement” step, the “rear solder replenishment necessity determination” step, and the “rear solder replenishment determination” step. It is kept above a predetermined amount.
- the forward printing process is executed. Thereafter, the series of operations described above is repeated until the next mask exchange.
- the forward printing process and the backward printing process are performed by one squeegee 702, and during the switching from the forward printing process to the backward printing process and from the backward printing process to the forward printing process.
- the amount of solder is measured during switching to.
- soldering is performed while the squeegee 702 is positioned in the movement direction before switching, that is, on the downstream side in the forward direction (the squeegee 702 is opposite to the opening of the mask 51).
- the amount of solder in the accumulated SP is measured.
- the squeegee 702 is positioned on the downstream side in the movement direction before switching, that is, in the return pass direction (the squeegee 702 is opposite to the opening of the mask 51).
- the amount of solder in the solder pool SP is measured. Therefore, even if the solder adhering to the squeegee 702 drips during the measurement of the solder amount, the solder adheres to the non-opening portions DM1 and DM2 of the mask 51, so that the operation sequence in which tact loss occurs is not adopted.
- the amount of solder in the pool SP can be measured.
- solder amount of the solder pool SP can be reduced for a short time. Can be measured. Then, based on the amount of solder measured in this manner, the solder supply SP 60 replenishes the solder pool SP with solder as necessary, so that the remaining solder amount in the solder pool SP is always optimized. As a result, automatic solder printing can be performed continuously and satisfactorily.
- the solder amount measuring means has a plurality of sensors attached to the head, and the solder replenishment necessity determining means is measured by a sensor farthest from the squeegee among the plurality of sensors. Based on the result, the necessity of replenishment of the solder is determined.
- the solder amount measuring means measures the width of the solder pool in the relative displacement direction, and the solder replenishment necessity determining means obtains the width of the solder pool, so that the replenishment requirement of the solder is required. It is to determine whether or not.
- the present invention is not limited to the first embodiment described above, and various modifications other than those described above can be made without departing from the spirit of the present invention.
- the “solder amount measurement” is performed every time the forward printing process and the backward printing process are switched, and the “solder amount measurement” is performed based on the result obtained by the “solder amount measurement”.
- the execution timing of “solder amount measurement” and “solder replenishment” is not limited to this.
- the “solder amount measurement” step and the “solder replenishment” step may be executed only during switching from the return pass printing step to the forward pass printing step.
- the solder supply unit 60 since the solder supply unit 60 is disposed on the front side in the Y-axis direction of the printing head 704 (left hand side in FIG. 8), the “solder replenishment on the front side” step is performed on the “rear side”.
- the number of operations must be greater than the “solder replenishment” process. Therefore, as shown in the second embodiment, the operation and drive control can be simplified by limiting the process to the “reple solder replenishment” step.
- the “solder replenishment” step is executed as needed based on the measurement result immediately after the “solder amount measurement” step is performed, but the measurement result of the “solder amount measurement” step is stored in the memory. (Not shown) may be stored, and after performing the printing operation one or more times without performing the “solder replenishment” step, the “solder replenishment” step may be performed at the stage of switching to the next printing operation. For example, as shown in the column “Third Embodiment” in FIG. 10, the “solder amount measurement” process is performed during the switching from the forward printing process to the backward printing process, and the measurement result is acquired and stored in the memory.
- the measurement result may be read from the memory, and the “solder replenishment” process may be performed as necessary.
- the remaining amount of solder discharged in a certain solder replenishment process (or preparation process) is determined for each number of printings.
- the “solder amount measurement” step and the “solder replenishment” step may be executed for each number of printed sheets until the remaining amount of solder approaches the limit remaining amount of solder.
- the solder decrease amount per printing is calculated from the number of printed sheets from one “solder amount measurement” step to the next “solder amount measurement” step, and the solder decrease amount stored in the data storage unit 48 is calculated.
- the amount may be updated.
- the initial solder discharge amount stored in the data storage unit 48 is set as a target value, and the replenished solder pool SP becomes the initial solder discharge amount before the reduced solder amount reaches the limit solder amount. May be replenished.
- the “solder amount measurement” step and the “solder replenishment” step may be executed every time printing is performed on a predetermined number of substrates 1. As a result, the time required for the “solder amount measurement” process and the “solder replenishment” process can be saved, and the printing efficiency can be improved.
- solder amount of the solder pool SP is measured by one solder sensor SC attached to the side surface of the subframe 722 opposite to the gear box 732.
- the type, number, and location of sensors are not limited to this.
- solder sensors SC1 and SC2 may be attached to the Y axis direction rear side and front side of the printing head 704, respectively, and the output signals from the sensors SC1 and SC2 may be used properly in accordance with the solder amount measurement timing. .
- the squeegee 702 is positioned downstream of the solder pool SP in the forward direction (front side in the Y-axis direction). In this case, however, the sensor SC1 is farther from the squeegee 702 than the sensor SC2. For this reason, even if the rotation amount of the squeegee 702 to the downstream side in the forward direction (front side in the Y-axis direction) is set small, interference with the sensor SC1 can be prevented.
- the “rear solder amount measurement” step is the opposite of the “front solder amount measurement” step. That is, as shown in step (f) of FIG. 11, the squeegee 702 is positioned downstream in the return path direction (rear side in the Y-axis direction) with respect to the solder pool SP, but in this case, the sensor SC2 is the sensor SC1. It is far from the squeegee 702 as compared to FIG.
- the rotation amount of the squeegee 702 to the downstream side in the return path direction (the rear side in the Y-axis direction) is set small, the interference with the sensor SC2 can be prevented. Therefore, by measuring the amount of solder in the solder pool SP by the sensor SC2, the amount of rotation, that is, the retracted amount of the squeegee 702 can be suppressed, and the tact time can be shortened.
- the remaining amount of solder in the solder pool SP is calculated based on the width W of the solder pool SP in the Y-axis direction, but the method for calculating the remaining solder amount is not limited to this.
- the solder sensor SC SC1, SC2
- the remaining solder amount may be obtained based on the cross-sectional area of the solder pool SP.
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Abstract
Description
この発明は、上記課題に鑑みなされたものであり、基板サイズの制限やタクトロスを発生させることなく、はんだ印刷に使用されるはんだ溜まりのはんだ残量を適正化することができる、はんだ供給装置、印刷装置および印刷方法を提供することを目的とする。
Claims (5)
- ヘッドに支持されたスキージでマスク表面上に滞留しているはんだ溜まりを往路方向の上流側から押圧しながら前記往路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記マスクの裏面に重ね合わされた基板にはんだを前記マスクの開口部を介して印刷する往路印刷工程と、前記スキージで前記はんだ溜まりを復路方向の上流側から押圧しながら前記復路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記基板にはんだを前記マスクの開口部を介して印刷する復路印刷工程とを交互に切り替えて実行する印刷装置に設けられ、前記はんだ溜まりにはんだを補充するはんだ供給装置であって、
はんだを供給するはんだ供給手段と、
前記ヘッドに取り付けられ、前記往路印刷工程および前記復路印刷工程のいずれか一方から他方へ切り替わる過程で前記スキージが切替前の移動方向下流側にはんだ溜まりを通過する際、当該はんだ溜まりのはんだ量を測定するはんだ量測定手段と、
前記はんだ量測定手段の測定したはんだ量に基づいてはんだの補充要否を判定するはんだ補充要否判定手段と、
前記はんだ補充要否判定手段の判定結果に基づき前記はんだ供給手段を制御して前記はんだ溜まりにはんだを補充する補充制御手段と
を備えていることを特徴とするはんだ供給装置。 - 請求項1記載のはんだ供給装置において、
前記はんだ量測定手段は、前記ヘッドに取り付けられた複数のセンサを有し、
前記はんだ補充要否判定手段は、前記複数のセンサのうち前記スキージから最も離れたセンサによる測定結果に基づき前記はんだの補充要否を判定する
ことを特徴とするはんだ供給装置。 - 請求項1または2記載のはんだ供給装置において、
前記はんだ量測定手段は、前記相対変位方向における前記はんだ溜まりの幅を計測するものであり、
前記はんだ補充要否判定手段は、前記はんだ溜まりの幅を求めることで前記はんだの補充要否を判定するものである
ことを特徴とするはんだ供給装置。 - ヘッドに支持されたスキージでマスク表面上に滞留しているはんだ溜まりを往路方向の上流側から押圧しながら前記往路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記マスクの裏面に重ね合わされた基板にはんだを前記マスクの開口部を介して印刷する往路印刷工程と、前記スキージで前記はんだ溜まりを復路方向の上流側から押圧しながら前記復路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記基板にはんだを前記マスクの開口部を介して印刷する復路印刷工程とを交互に切り替えて実行する印刷手段と、
はんだを供給するはんだ供給手段と、
前記ヘッドに取り付けられ、前記往路印刷工程および前記復路印刷工程のいずれか一方から他方へ切り替わる過程で前記スキージが切替前の移動方向下流側にはんだ溜まりを通過する際、当該はんだ溜まりのはんだ量を測定するはんだ量測定手段と、
前記はんだ量測定手段による測定結果に基づき前記はんだ溜まりのはんだの補充要否を判定するはんだ補充要否判定手段と、
前記はんだ補充要否判定手段の判定結果に基づき前記はんだ供給手段を制御して前記はんだ溜まりにはんだを補充する補充制御手段と
を備えていることを特徴とする印刷装置。 - ヘッドに支持されたスキージでマスク表面上に滞留しているはんだ溜まりを往路方向の上流側から押圧しながら前記往路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記マスクの裏面に重ね合わされた基板にはんだを前記マスクの開口部を介して印刷する往路印刷工程と、
前記スキージで前記はんだ溜まりを復路方向の上流側から押圧しながら復路方向に前記ヘッドを前記マスク表面に沿って相対移動させて前記基板にはんだを前記マスクの開口部を介して印刷する復路印刷工程と、
前記往路印刷工程と前記復路印刷工程を交互に切り替える際に前記はんだ溜まりに対する前記スキージ位置を切り替える切替工程と、
前記往路印刷工程および前記復路印刷工程のいずれか一方から他方へ切り替わる過程で前記スキージが切替前の移動方向下流側にはんだ溜まりを通過する際、当該はんだ溜まりのはんだ量を測定するはんだ量測定工程と、
前記はんだ量測定工程による測定結果に基づきはんだの補充要否を判定するはんだ補充要否判定工程と、
前記はんだ補充要否判定工程の判定結果に基づき前記はんだ溜まりにはんだを補充する補充工程と
を備えていることを特徴とする印刷方法。
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CN2010800038899A CN102271919B (zh) | 2009-02-09 | 2010-01-28 | 焊料供应装置、印刷装置以及印刷方法 |
KR1020117004076A KR101217575B1 (ko) | 2009-02-09 | 2010-01-28 | 땜납 공급 장치, 인쇄 장치, 및 인쇄 방법 |
US13/140,606 US8342381B2 (en) | 2009-02-09 | 2010-01-28 | Solder feeder, printer, and printing method |
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