JP5629298B2 - 粘性材供給装置および粘性材印刷装置 - Google Patents
粘性材供給装置および粘性材印刷装置 Download PDFInfo
- Publication number
- JP5629298B2 JP5629298B2 JP2012236881A JP2012236881A JP5629298B2 JP 5629298 B2 JP5629298 B2 JP 5629298B2 JP 2012236881 A JP2012236881 A JP 2012236881A JP 2012236881 A JP2012236881 A JP 2012236881A JP 5629298 B2 JP5629298 B2 JP 5629298B2
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- JP
- Japan
- Prior art keywords
- viscous material
- nozzle
- supply path
- solder
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Screen Printers (AREA)
Description
32 スキージ
43 ノズル
44 供給機構(供給手段)
50 供給路
50a 入口部
50b 出口部
51 入口通路部(直線通路部)
52 傾斜通路部
54、55 屈曲部分
60 第1部材
61 境界面(平面)
62a、72a 上面(平坦面部)
63a〜63d、73a〜73d 貫通孔
70 第2部材
71 境界面(平面)
80 固定部材
81a〜81d ねじ孔
85 ねじ部材
100 印刷装置
110 ハンダ容器(収容部)
300 マスク
CA 中心軸線
RP 基準面
Claims (8)
- 粘性材を収容する収容部に収容された前記粘性材を吐出するためのノズルと、
前記収容部から前記ノズルへ前記粘性材を移送して前記ノズルから前記粘性材を吐出させる供給手段とを備え、
前記ノズルは、前記粘性材を前記収容部から前記ノズルの先端へ案内するための屈曲した供給路を有し、前記屈曲した供給路に沿って分割可能に構成されている、粘性材供給装置。 - 前記ノズルの屈曲した供給路の屈曲部分は、滑らかな曲線状に形成されている、請求項1に記載の粘性材供給装置。
- 前記ノズルの供給路は、入口部から連続する直線状の直線通路部と、前記直線通路部に対して傾斜した傾斜通路部とを含み、
前記直線通路部は、前記収容部から前記入口部に供給される前記粘性材の供給方向に沿って延びており、
前記傾斜通路部は、前記入口部に対して水平方向に離間した位置に配置された先端の出口部に向けて斜めの直線状に延びており、
前記直線通路部と前記傾斜通路部とは、滑らかな曲線状の前記屈曲部分により接続されている、請求項2に記載の粘性材供給装置。 - 前記ノズルは、前記供給路に沿って分割される第1部材および第2部材と、前記第1部材または前記第2部材の外側に配置され、分割された前記第1部材と前記第2部材とを組み付けるための固定部材とを含み、
前記第1部材および前記第2部材は、それぞれ、ねじ部材が挿入される貫通孔を有し、
前記固定部材は、前記第1部材および前記第2部材のそれぞれの前記貫通孔を通過した前記ねじ部材と螺合するねじ孔が形成されている、請求項1〜3のいずれか1項に記載の粘性材供給装置。 - 前記固定部材のねじ孔は、前記ねじ部材が前記供給路を挟んで両側に配置されるように、2つ1組で複数形成されている、請求項4に記載の粘性材供給装置。
- 前記第1部材と前記第2部材とは、それぞれ、組み付けられた状態で同一面内に配置される平坦面部を有し、
前記ノズルは、平坦な基準面に前記第1部材および前記第2部材の前記平坦面部をそれぞれ当てつけた状態で、分割された前記第1部材および前記第2部材を前記固定部材により組み付ける際の相互位置が決まるように構成されている、請求項4または5に記載の粘性材供給装置。 - 前記屈曲した供給路は、入口部から先端の出口部に至る前記供給路内を通る中心軸線が単一の平面内に配置されるように形成されており、
前記ノズルは、前記平面を境界として、前記供給路に沿って半分に分割可能に構成されている、請求項1〜6のいずれか1項に記載の粘性材供給装置。 - 粘性材を収容する収容部に収容された前記粘性材を吐出するためのノズルと、前記収容部から前記ノズルへ前記粘性材を移送して前記ノズルから前記粘性材を吐出させる供給手段とを含む粘性材供給部と、
前記粘性材供給部により供給された前記粘性材を掻き取るスキージとを備え、
前記粘性材供給部の前記ノズルは、前記粘性材を前記収容部から前記ノズルの先端へ案内するための屈曲した供給路を有し、前記屈曲した供給路に沿って分割可能に構成されている、粘性材印刷装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012236881A JP5629298B2 (ja) | 2012-10-26 | 2012-10-26 | 粘性材供給装置および粘性材印刷装置 |
US13/829,809 US9132497B2 (en) | 2012-10-26 | 2013-03-14 | Viscous material feeder and viscous material printer |
KR1020130037944A KR101507433B1 (ko) | 2012-10-26 | 2013-04-08 | 점성재 공급 장치 및 점성재 인쇄 장치 |
EP13001886.4A EP2727728B1 (en) | 2012-10-26 | 2013-04-11 | Viscous material feeder |
CN201310177714.5A CN103786425B (zh) | 2012-10-26 | 2013-05-14 | 粘性材料供给装置及粘性材料印刷装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012236881A JP5629298B2 (ja) | 2012-10-26 | 2012-10-26 | 粘性材供給装置および粘性材印刷装置 |
Publications (2)
Publication Number | Publication Date |
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JP2014086675A JP2014086675A (ja) | 2014-05-12 |
JP5629298B2 true JP5629298B2 (ja) | 2014-11-19 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012236881A Active JP5629298B2 (ja) | 2012-10-26 | 2012-10-26 | 粘性材供給装置および粘性材印刷装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9132497B2 (ja) |
EP (1) | EP2727728B1 (ja) |
JP (1) | JP5629298B2 (ja) |
KR (1) | KR101507433B1 (ja) |
CN (1) | CN103786425B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016049720A (ja) * | 2014-09-01 | 2016-04-11 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置およびスクリーン印刷方法 |
TWI558574B (zh) * | 2014-12-05 | 2016-11-21 | Metal Ind Res & Dev Ct | Slit Scraper Structure |
DE102015219611A1 (de) * | 2015-10-09 | 2017-04-13 | Ersa Gmbh | Lötmodul |
JP7152416B2 (ja) * | 2017-04-14 | 2022-10-12 | イリノイ トゥール ワークス インコーポレイティド | 残留はんだペーストを自動的に除去する装置 |
TWI760480B (zh) * | 2017-04-14 | 2022-04-11 | 美商伊利諾工具工程公司 | 用於提供錫膏的元件及其方法 |
CN108738247B (zh) * | 2017-04-14 | 2023-07-07 | 伊利诺斯工具制品有限公司 | 一种供锡组件 |
EP3482935B1 (de) * | 2017-11-10 | 2022-07-13 | Exentis Group AG | Siebeinheit für eine druckvorrichtung |
EP3482939B1 (de) | 2017-11-10 | 2020-05-20 | Exentis Group AG | Siebbereitstellungssystem |
KR102471125B1 (ko) * | 2021-10-05 | 2022-11-25 | 유명근 | 페이스트 디스펜서용 삽입 가압 모듈 |
CN115802637B (zh) * | 2023-02-08 | 2023-05-05 | 苏州康尼格电子科技股份有限公司 | Pcba封装设备 |
Family Cites Families (13)
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JP3344412B2 (ja) * | 1991-09-02 | 2002-11-11 | 松下電器産業株式会社 | 塗布装置 |
JP3374147B2 (ja) * | 1992-06-08 | 2003-02-04 | 谷電機工業株式会社 | スクリーン印刷システム |
US6423141B1 (en) * | 1994-12-27 | 2002-07-23 | Visteon Global Tech., Inc. | Method and apparatus for dispensing viscous material |
JP2896343B2 (ja) * | 1996-05-14 | 1999-05-31 | 谷電機工業株式会社 | 印刷用スキージー装置 |
JP2002307652A (ja) * | 2001-04-12 | 2002-10-23 | Matsushita Electric Ind Co Ltd | スクリーン印刷装置 |
US6813820B2 (en) * | 2001-12-19 | 2004-11-09 | 3M Innovative Properties Company | Method of improving coating uniformity |
US7344665B2 (en) | 2002-10-23 | 2008-03-18 | 3M Innovative Properties Company | Coating die with expansible chamber device |
JP2006266358A (ja) | 2005-03-23 | 2006-10-05 | Mitsubishi Heavy Ind Ltd | 固定絞りユニット及び固定絞りユニットを具備する静圧案内装置 |
CN1876371B (zh) * | 2005-06-09 | 2012-03-21 | 雅马哈发动机株式会社 | 网版印刷装置 |
JP2007044892A (ja) * | 2005-08-08 | 2007-02-22 | Genchi Kenkyusho:Kk | 粘体発熱組成物の積層装置 |
US8449232B2 (en) | 2007-01-15 | 2013-05-28 | Tsudakoma Kogyo Kabushiki Kaisha | Indexing device for machine tool |
JP4643719B2 (ja) | 2009-02-09 | 2011-03-02 | ヤマハ発動機株式会社 | はんだ供給装置、印刷装置および印刷方法 |
JP5635879B2 (ja) * | 2010-11-17 | 2014-12-03 | ヤマハ発動機株式会社 | 付着材料塗布装置 |
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2012
- 2012-10-26 JP JP2012236881A patent/JP5629298B2/ja active Active
-
2013
- 2013-03-14 US US13/829,809 patent/US9132497B2/en active Active
- 2013-04-08 KR KR1020130037944A patent/KR101507433B1/ko active IP Right Grant
- 2013-04-11 EP EP13001886.4A patent/EP2727728B1/en active Active
- 2013-05-14 CN CN201310177714.5A patent/CN103786425B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103786425A (zh) | 2014-05-14 |
EP2727728B1 (en) | 2018-02-28 |
JP2014086675A (ja) | 2014-05-12 |
US9132497B2 (en) | 2015-09-15 |
EP2727728A1 (en) | 2014-05-07 |
KR20140053759A (ko) | 2014-05-08 |
US20140117067A1 (en) | 2014-05-01 |
KR101507433B1 (ko) | 2015-03-31 |
CN103786425B (zh) | 2017-04-12 |
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