WO2010044213A1 - セラミック積層部品とその製造方法 - Google Patents
セラミック積層部品とその製造方法 Download PDFInfo
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- WO2010044213A1 WO2010044213A1 PCT/JP2009/005140 JP2009005140W WO2010044213A1 WO 2010044213 A1 WO2010044213 A1 WO 2010044213A1 JP 2009005140 W JP2009005140 W JP 2009005140W WO 2010044213 A1 WO2010044213 A1 WO 2010044213A1
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- Prior art keywords
- glass
- ceramic
- glass ceramic
- green sheet
- laminated
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- 239000000919 ceramic Substances 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 66
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 35
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 23
- 229910052709 silver Inorganic materials 0.000 claims abstract description 23
- 239000004332 silver Substances 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 26
- 239000000843 powder Substances 0.000 claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 10
- 235000012239 silicon dioxide Nutrition 0.000 claims description 10
- 229910002706 AlOOH Inorganic materials 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 230000007547 defect Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000002904 solvent Substances 0.000 description 9
- 239000011230 binding agent Substances 0.000 description 7
- 239000011812 mixed powder Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000010344 co-firing Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 4
- 239000004327 boric acid Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000005012 migration Effects 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000007606 doctor blade method Methods 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 229910007565 Zn—Cu Inorganic materials 0.000 description 1
- 229920005822 acrylic binder Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/16—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silicates other than clay
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
- H01F1/342—Oxides
- H01F1/344—Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3), e.g. magnetite Fe3O4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
- H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/08—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Definitions
- the present invention relates to a ceramic laminated part used in various electronic devices, and particularly relates to a ceramic laminated part that can be sintered at a low temperature.
- ceramic multilayer components mounted on electronic devices are required to support higher frequencies.
- it is effective to reduce the stray capacitance of the circuit pattern inside the ceramic multilayer component.
- the insulating material used for the ceramic laminated parts has a low dielectric constant.
- silver having a high conductivity is often used as a material for a circuit pattern wiring formed inside thereof in order to reduce the electric resistance in the circuit. Therefore, an insulating material having a low dielectric constant needs to be sintered and densified at around 900 ° C. which is lower than the melting point of silver.
- a borosilicate glass material to which fillers such as silica, alumina, forsterite, cordierite and the like are added is well known.
- a glass ceramic in which a filler is mixed with borosilicate glass is often used for ceramic laminated parts corresponding to high frequencies.
- ferrite which is a magnetic material
- crystalline silica is often used as a filler in order to adjust the thermal expansion coefficient.
- Such a low-temperature sintered glass is disclosed in Patent Document 1, for example.
- the present invention is a highly reliable ceramic laminated part in which silver migration is suppressed.
- the ceramic multilayer component of the present invention includes a ferrite magnetic layer and a glass ceramic layer that is mainly composed of borosilicate glass, is laminated with the ferrite magnetic layer, and has a silver inner conductor embedded therein. In the glass ceramic layer, minute regions in which aluminum and silver coexist are dispersed.
- Such a ceramic laminated part is manufactured by the following procedure. First, a glass ceramic green sheet formed by mixing borosilicate glass powder, crystalline silica, and alumina hydrate powder is prepared. At this time, the amount of alumina hydrate in the glass ceramic green sheet is 0.5 wt% or more and 4.5 wt% or less. Next, a silver inner conductor is formed in the glass ceramic green sheet. Subsequently, a ferrite green sheet and a glass ceramic green sheet are laminated to form a laminate, and this laminate is fired at a melting point of silver or lower.
- silver does not diffuse over a wide range in the glass ceramic layer, but is fixed together with aluminum in a fine dispersion region of alumina hydrate mixed with borosilicate glass. Therefore, silver migration is suppressed even in the presence of H 2 O in an electric field.
- FIG. 1 is an internal cross-sectional view of a ceramic laminated part according to an embodiment of the present invention.
- 2 is an exploded perspective view of the ceramic laminated component shown in FIG.
- FIG. 3 is an external view of the ceramic laminated component shown in FIG.
- FIG. 1 is a cross-sectional view of the ceramic multilayer component
- FIG. 2 is an exploded perspective view of the ceramic multilayer component
- FIG. 3 is an external view of the ceramic multilayer component.
- FIG. 1 shows a cross section taken along line 1-1 of FIG.
- the ceramic laminated component includes a glass ceramic layer 20 mainly composed of borosilicate glass, ferrite magnetic layers 21A and 21B, a ferrite via 22, and silver (Ag) planar coils 23A and 23B.
- a glass ceramic layer 20 mainly composed of borosilicate glass, ferrite magnetic layers 21A and 21B, a ferrite via 22, and silver (Ag) planar coils 23A and 23B.
- minute regions 10 in which aluminum (Al) and Ag coexist are dispersed.
- the ferrite magnetic layers 21A and 21B sandwich the glass ceramic layer 20.
- the planar coil 23A is formed on the layer 20D, and the lead conductor 25A is formed on the layer 20E.
- One end of the planar coil 23A is electrically connected to one of the external end face electrodes 26 shown in FIG. 3 from the Ag via electrode 24A via the lead conductor 25A.
- the planar coil 23B is formed on the layer 20C, and the lead conductor 25B is formed on the layer 20B.
- One end 232B of the planar coil 23B is electrically connected to the other one of the external end face electrodes 26 via an Ag via electrode 24B and a lead conductor 25B.
- the other ends 231A and 231B of the planar coils 23A and 23B are electrically connected to the remaining two of the external end face electrodes 26.
- Layers 20A-20E form glass ceramic layer 20.
- a mixed powder obtained by mixing a borosilicate glass powder, a crystalline silica powder, and an Al (OH) 3 powder as raw materials for the glass ceramic layer 20 is mixed with a binder and a solvent to prepare a ceramic slurry.
- the mixed powder is composed of, for example, 68.5 wt% borosilicate glass powder, 29 wt% crystalline silica powder, and 2.5 wt% Al (OH) 3 powder.
- the binder for example, an acrylic resin, and as the solvent, for example, toluene, ethyl acetate, butyl acetate, or the like is used.
- the prepared ceramic slurry is formed into a sheet having a thickness of, for example, about 25 ⁇ m by a doctor blade method to produce a glass ceramic green sheet used for the glass ceramic layer 20.
- Ni-Zn-Cu ferrite powder that can be fired at 900 ° C. or lower, a binder, and a solvent are mixed using a ball mill to produce a ceramic slurry.
- a binder for example, a butyral resin and a phthalic acid plasticizer are used
- the solvent for example, butyl acetate, butanol, or the like is used.
- a ferrite green sheet used for the ferrite magnetic layers 21A and 21B is produced from the prepared ceramic slurry by a doctor blade method so as to have a thickness of about 50 to 100 ⁇ m, for example.
- via electrodes for electrical connection between layers to be Ag via electrodes 24A and 24B are formed on the glass ceramic green sheets in the layers 20B and 20D using Ag paste.
- Ag planar coil conductors to be the planar coils 23A and 23B are formed on the layers 20C and 20D by using a printing method or a transfer method.
- the conductor portions to be the lead conductors 25A and 25B are formed on the layers 20B and 20E using Ag paste.
- two ferrite green sheets and each glass ceramic green sheet are sequentially laminated so as to obtain the configuration of FIG.
- the ferrite via 22 is formed by making a hole near the axis of the planar coil and filling the ferrite paste there.
- the produced laminated body is fired at 900 ° C. to produce a laminated fired body that is a laminated structure in which two planar coils 23 A and 23 B are embedded in the glass ceramic layer 20.
- An Ag metallized layer is formed by applying an Ag paste to the end surfaces of the lead wires 25A and 25B and the end portions 231A and 231B exposed on the outer side surface of the laminated fired body so as to be electrically connected. Further, Ni plating and Sn plating are performed to form the external end face electrode 26.
- a binder used for a glass ceramic green sheet and a ferrite green sheet a butyral resin-based binder and an acrylic binder whose lamination properties are controlled using an appropriate amount of a plasticizer can be used. That is, a commonly used binder may be used and is not particularly limited.
- ester solvent is, for example, ethyl acetate, butyl acetate
- ketone solvent is, for example, toluene, methyl ethyl ketone (MEK)
- alcohol solvent is, for example, isopropyl alcohol (IPA), butanol.
- the solvent is not particularly limited.
- the mixing method may be a generally known method such as a medium stirring mill in addition to the ball mill, and is not particularly limited.
- the sheet forming method may be a generally known method such as pressure sheet molding, and is not particularly limited.
- Ag constituting Ag via electrodes 24A and 24B and planar coils 23A and 23B does not diffuse over a wide range in glass ceramic layer 20 during sintering. Then, Ag is fixed together with Al in a fine dispersion region of alumina hydrate (Al (OH) 3 powder) mixed with borosilicate glass. As a result, the glass ceramic layer 20 of the ceramic laminated part has a structure in which the microregions 10 in which Al and Ag coexist are dispersed. Therefore, Ag migration is suppressed even in the presence of H 2 O in an electric field.
- a ceramic laminated part (sample A) as described above and confirming its effect will be described.
- a ceramic laminated part (sample B) using a glass ceramic green sheet to which no Al (OH) 3 powder is added is produced and evaluated.
- a ceramic laminated part (sample C) using a glass ceramic green sheet to which an equivalent amount of Al 2 O 3 powder is added instead of Al (OH) 3 powder is produced and evaluated.
- a ceramic laminated part (sample D) having a built-in planar coil is produced and evaluated using only the glass ceramic green sheet used in sample B without using a ferrite green sheet. This is for comparison with the case where co-firing with ferrite is not performed.
- PCBT test a reliability test by a pressure cooker bias test is performed on each of 100 ceramic laminated parts, and the result is shown as a defect rate.
- an applied voltage of 5 V is applied between the planar coils 23A and 23B, and left for 48 hours in an environment of 2 atm, humidity 85%, and temperature 125 ° C.
- the insulation resistance is reduced to 1 ⁇ 10 6 ⁇ or less, it is determined as defective.
- the borosilicate glass is a glass that is softened and melted at 900 ° C. or less with boron (B) added to SiO 2 as a skeleton.
- B boron
- a small amount of an alkali such as Al or K, an alkaline earth such as Ca, or the like may be added.
- the composition of B in the borosilicate glass is desirably 15% by weight or more and 28% by weight or less in terms of oxide. If the composition of B in the borosilicate glass is less than 15% by weight in terms of oxide, the softening point of the glass becomes high and a sufficiently dense fired body cannot be obtained. On the other hand, when the composition of B in the borosilicate glass exceeds 28% by weight in terms of oxide, it becomes difficult to stably produce the glass powder.
- the content of the crystalline silica powder is set to 20% by weight or more and 40% by weight or less. If it is less than 20% by weight, the difference in thermal expansion coefficient from ferrite becomes too large, and the possibility of cracking in the glass ceramic layer during co-firing increases. If it exceeds 40% by weight, sintering of the glass ceramic layer 20 does not proceed sufficiently, and a sufficiently dense glass ceramic layer 20 cannot be obtained.
- 20% by weight of crystalline silica powder is added, the thermal expansion coefficient of the glass ceramic is 54 ⁇ 10 ⁇ 7 / ° C., and if the thermal expansion coefficient is higher than that, the glass ceramic layer 20 is not cracked. Can be fired simultaneously with ferrite.
- alumina Al 2 O 3
- baking is performed at a temperature equal to or lower than the melting point of Ag, preferably around 900 ° C., for simultaneous firing with Ag. Therefore, the alumina hydrate in the glass ceramic layer 20 after firing is not alumina. Alumina was not detected in the analysis by X-ray diffraction.
- the addition of alumina hydrate in the present embodiment is completely different from the addition of alumina used as a filler for glass materials.
- the defect rate is zero when the blending amount (addition amount) of Al (OH) 3 is 0.5 wt% or more and 4.5 wt% or less (Sample G to Sample N).
- the sample F having a blending amount of 0.1% by weight, Ag is detected in a wide range in the glass ceramic layer. This is presumably because the effect of alumina hydrate is insufficient because the blending amount of Al (OH) 3 is small.
- the sample P having a blending amount of 5% by weight a portion where the microregions where Al and Ag coexist is connected is observed. It is considered that such a phenomenon occurs when the blending amount of Al (OH) 3 is too large, and the defect rate increases.
- the blending amount of Al (OH) 3 in the ceramic component of the glass ceramic green sheet forming the glass ceramic layer 20 needs to be 0.5 wt% or more and 4.5 wt% or less. Although data is not shown, it has been confirmed that even when AlOOH is used, it is necessary to make this blending amount range in terms of molar fraction.
- a mixed powder is prepared in which a mixing ratio of borosilicate glass, crystalline silica, and Mg (OH) 2 to be blended with the green sheet for the glass ceramic layer is blended at a weight ratio of 69: 29: 2.
- a ceramic laminated part is manufactured through the same process as Sample A (Sample R).
- a PCBT test is performed using these samples. The results are shown in (Table 3).
- a green sheet using borosilicate glass tends to precipitate boric acid on the green sheet during storage.
- pores are formed on the laminated surface and the reliability deteriorates.
- it is particularly effective to add Mg (OH) 2 .
- the common mode noise filter has been described as an example of the ceramic multilayer component.
- the present invention is not limited to this.
- the present invention can be similarly applied to other ceramic laminated parts such as a ceramic filter or a ceramic multilayer substrate that incorporates a circuit that generates a potential difference in a circuit wiring pattern.
- the present invention is not limited to this. This is applicable when the glass ceramic layer and the ferrite magnetic layer are in contact with each other and sintered.
- the ceramic laminated component according to the present invention is composed of a ferrite magnetic layer and a glass ceramic layer mainly composed of borosilicate glass and containing an Ag inner conductor.
- alumina hydrate By blending alumina hydrate with the glass ceramic green sheet forming the glass ceramic layer, the glass ceramic layer is in a state where fine regions where Al and Ag coexist are dispersed.
Abstract
Description
20 ガラスセラミック層
20A,20B,20C,20D,20E 層
21A,21B フェライト磁性層
22 フェライトビア
23A,23B 平面コイル
24A,24B Agビア電極
25A,25B 引き出し導線
26 外部端面電極
231A,231B,232B 端部
Claims (4)
- フェライト磁性層と、
ほう珪酸ガラスを主成分とし、前記フェライト磁性層と積層され、銀の内部導体が埋設されたガラスセラミック層と、を備え、
前記ガラスセラミック層にはアルミニウムと銀とが共存している微小領域が分散して存在している、
セラミック積層部品。 - ほう珪酸ガラス粉末と結晶質シリカとアルミナ水和物粉末とを混合し成形したガラスセラミックグリーンシートを作製するステップと、
前記ガラスセラミックグリーンシート内に銀の内部導体を形成するステップと、
フェライトグリーンシートと前記ガラスセラミックグリーンシートとを積層し、積層体を形成するステップと、
前記積層体を銀の融点以下で焼成するステップとからなるセラミック積層部品の製造方法であって、
前記ガラスセラミックグリーンシートを作製するステップにおいて、前記ガラスセラミックグリーンシートにおいて前記アルミナ水和物 の配合量を0.5重量%以上、4.5重量%以下とする、
セラミック積層部品の製造方法。 - 前記アルミナ水和物粉末がAl(OH)3とAlOOHとの少なくともいずれかである、
請求項2記載のセラミック積層部品の製造方法。 - 前記ガラスセラミックグリーンシートを作製するステップにおいて、Mg(OH)2とCaCO3との少なくとも一方を添加する、
請求項2記載のセラミック積層部品の製造方法。
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