WO2009022681A1 - ポジ型レジスト組成物、該組成物を用いたパターン形成方法及び該組成物に用いられる化合物 - Google Patents
ポジ型レジスト組成物、該組成物を用いたパターン形成方法及び該組成物に用いられる化合物 Download PDFInfo
- Publication number
- WO2009022681A1 WO2009022681A1 PCT/JP2008/064419 JP2008064419W WO2009022681A1 WO 2009022681 A1 WO2009022681 A1 WO 2009022681A1 JP 2008064419 W JP2008064419 W JP 2008064419W WO 2009022681 A1 WO2009022681 A1 WO 2009022681A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- positive resist
- resist composition
- forming method
- acid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/63—Esters of sulfonic acids
- C07C309/72—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/63—Esters of sulfonic acids
- C07C309/64—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to acyclic carbon atoms
- C07C309/65—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to acyclic carbon atoms of a saturated carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/63—Esters of sulfonic acids
- C07C309/72—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
- C07C309/74—Esters of sulfonic acids having sulfur atoms of esterified sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton to carbon atoms of six-membered aromatic rings being part of condensed ring systems
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C311/00—Amides of sulfonic acids, i.e. compounds having singly-bound oxygen atoms of sulfo groups replaced by nitrogen atoms, not being part of nitro or nitroso groups
- C07C311/48—Amides of sulfonic acids, i.e. compounds having singly-bound oxygen atoms of sulfo groups replaced by nitrogen atoms, not being part of nitro or nitroso groups having nitrogen atoms of sulfonamide groups further bound to another hetero atom
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C317/00—Sulfones; Sulfoxides
- C07C317/44—Sulfones; Sulfoxides having sulfone or sulfoxide groups and carboxyl groups bound to the same carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C317/00—Sulfones; Sulfoxides
- C07C317/44—Sulfones; Sulfoxides having sulfone or sulfoxide groups and carboxyl groups bound to the same carbon skeleton
- C07C317/46—Sulfones; Sulfoxides having sulfone or sulfoxide groups and carboxyl groups bound to the same carbon skeleton the carbon skeleton being further substituted by singly-bound oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C323/00—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups
- C07C323/10—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton
- C07C323/18—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton
- C07C323/20—Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and singly-bound oxygen atoms bound to the same carbon skeleton having the sulfur atom of at least one of the thio groups bound to a carbon atom of a six-membered aromatic ring of the carbon skeleton with singly-bound oxygen atoms bound to carbon atoms of the same non-condensed six-membered aromatic ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
- C07C69/67—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of saturated acids
- C07C69/716—Esters of keto-carboxylic acids or aldehydo-carboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2602/00—Systems containing two condensed rings
- C07C2602/02—Systems containing two condensed rings the rings having only two atoms in common
- C07C2602/04—One of the condensed rings being a six-membered aromatic ring
- C07C2602/08—One of the condensed rings being a six-membered aromatic ring the other ring being five-membered, e.g. indane
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2602/00—Systems containing two condensed rings
- C07C2602/02—Systems containing two condensed rings the rings having only two atoms in common
- C07C2602/04—One of the condensed rings being a six-membered aromatic ring
- C07C2602/10—One of the condensed rings being a six-membered aromatic ring the other ring being six-membered, e.g. tetraline
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2602/00—Systems containing two condensed rings
- C07C2602/36—Systems containing two condensed rings the rings having more than two atoms in common
- C07C2602/42—Systems containing two condensed rings the rings having more than two atoms in common the bicyclo ring system containing seven carbon atoms
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020107003042A KR101524571B1 (ko) | 2007-08-10 | 2008-08-11 | 포지티브형 레지스트 조성물, 그 조성물을 사용한 패턴 형성 방법 및 그 조성물에 사용되는 화합물 |
EP08827323A EP2177506A4 (en) | 2007-08-10 | 2008-08-11 | POSITIVE RESIST COMPOSITION, PATTERN FORMATION METHOD USING THE COMPOSITION, AND COMPOUND USED IN THE COMPOSITION |
US12/673,096 US8507174B2 (en) | 2007-08-10 | 2008-08-11 | Positive resist composition, pattern forming method using the composition, and compound for use in the composition |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007209034 | 2007-08-10 | ||
JP2007-209034 | 2007-08-10 | ||
JP2007-245331 | 2007-09-21 | ||
JP2007245331A JP4966796B2 (ja) | 2007-09-21 | 2007-09-21 | ポジ型レジスト組成物、該ポジ型レジスト組成物を用いたパターン形成方法及び該ポジ型レジスト組成物に用いられる化合物 |
JP2008005705A JP2009063986A (ja) | 2007-08-10 | 2008-01-15 | ポジ型レジスト組成物、該ポジ型レジスト組成物を用いたパターン形成方法及び該ポジ型レジスト組成物に用いられる化合物 |
JP2008-005705 | 2008-01-15 | ||
JP2008-074740 | 2008-03-21 | ||
JP2008074740A JP5162293B2 (ja) | 2008-03-21 | 2008-03-21 | 電子線、x線又はeuv光用ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009022681A1 true WO2009022681A1 (ja) | 2009-02-19 |
Family
ID=42027968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/064419 WO2009022681A1 (ja) | 2007-08-10 | 2008-08-11 | ポジ型レジスト組成物、該組成物を用いたパターン形成方法及び該組成物に用いられる化合物 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8507174B2 (ja) |
EP (2) | EP2177506A4 (ja) |
KR (1) | KR101524571B1 (ja) |
TW (1) | TWI481961B (ja) |
WO (1) | WO2009022681A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010197689A (ja) * | 2009-02-25 | 2010-09-09 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びレジストパターン形成方法 |
JP2011033729A (ja) * | 2009-07-30 | 2011-02-17 | Fujifilm Corp | 感活性光線性または感放射線性樹脂組成物、及び該組成物を用いたパターン形成方法 |
JP2011079778A (ja) * | 2009-10-07 | 2011-04-21 | Tokyo Ohka Kogyo Co Ltd | レジスト組成物、レジストパターン形成方法、新規な化合物及び酸発生剤 |
US20110102528A1 (en) * | 2009-10-30 | 2011-05-05 | Fujifilm Corporation | Composition, resist film, pattern forming method, and inkjet recording method |
WO2013118851A1 (en) * | 2012-02-06 | 2013-08-15 | Fujifilm Corporation | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device |
US9223208B2 (en) | 2011-12-29 | 2015-12-29 | Fujifilm Corporation | Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition |
WO2018042956A1 (ja) * | 2016-08-30 | 2018-03-08 | 富士フイルム株式会社 | パターン形成方法、感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、及び、電子デバイスの製造方法 |
JPWO2021187547A1 (ja) * | 2020-03-19 | 2021-09-23 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8507174B2 (en) | 2007-08-10 | 2013-08-13 | Fujifilm Corporation | Positive resist composition, pattern forming method using the composition, and compound for use in the composition |
US20120029223A1 (en) * | 2010-07-27 | 2012-02-02 | Gad Friedman | Method for production of substituted alkyl malonic esters and derivatives thereof |
JP5815254B2 (ja) * | 2011-03-14 | 2015-11-17 | 昭和電工株式会社 | 厚膜金属電極の形成方法、及び厚膜レジストの形成方法 |
JP2013083935A (ja) * | 2011-09-28 | 2013-05-09 | Jsr Corp | フォトレジスト組成物及びその製造方法、並びにレジストパターン形成方法 |
KR101812082B1 (ko) | 2012-03-27 | 2018-01-30 | 후지필름 가부시키가이샤 | 감활성 광선성 또는 감방사선성 조성물, 그것을 사용한 레지스트막, 레지스트 도포 마스크 블랭크스, 레지스트 패턴 형성 방법, 및 포토마스크 |
US9229319B2 (en) | 2013-12-19 | 2016-01-05 | Rohm And Haas Electronic Materials Llc | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device |
US9581901B2 (en) | 2013-12-19 | 2017-02-28 | Rohm And Haas Electronic Materials Llc | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0254853A2 (en) | 1986-07-28 | 1988-02-03 | International Business Machines Corporation | Lithographic method employing thermally stable photoresists with high sensitivity forming a hydogen-bonded network |
JPH0225850A (ja) | 1988-07-15 | 1990-01-29 | Hitachi Ltd | 放射線感応性組成物およびそれを用いたパターン形成法 |
JPH03223860A (ja) | 1990-01-30 | 1991-10-02 | Wako Pure Chem Ind Ltd | 新規レジスト材料 |
JPH04251259A (ja) | 1990-08-31 | 1992-09-07 | Wako Pure Chem Ind Ltd | 新規なレジスト材料及びパタ−ン形成方法 |
JPH08248561A (ja) * | 1995-03-09 | 1996-09-27 | Res Dev Corp Of Japan | 光反応性組成物、該光反応性組成物を含有した酸反応性高分子組成物及び酸反応性樹脂層 |
JPH0934106A (ja) * | 1995-07-20 | 1997-02-07 | Toppan Printing Co Ltd | 光重合性組成物及びその重合方法 |
JPH11158118A (ja) * | 1997-12-03 | 1999-06-15 | Sumitomo Chem Co Ltd | アセト酢酸誘導体、その製法及び用途 |
JP2000227659A (ja) * | 1999-02-08 | 2000-08-15 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8101200A (nl) * | 1981-03-12 | 1982-10-01 | Philips Nv | Werkwijze voor het aanbrengen van een resistmateriaal op een drager en resist-materiaal. |
JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JP2001206917A (ja) | 1995-04-12 | 2001-07-31 | Shin Etsu Chem Co Ltd | 高分子化合物及び化学増幅ポジ型レジスト材料 |
JP3173368B2 (ja) | 1995-04-12 | 2001-06-04 | 信越化学工業株式会社 | 高分子化合物及び化学増幅ポジ型レジスト材料 |
US6576392B1 (en) * | 1996-12-07 | 2003-06-10 | Fuji Photo Film Co., Ltd. | Positive photoresist composition |
JP2000035665A (ja) | 1998-05-11 | 2000-02-02 | Kunihiro Ichimura | 酸増殖剤及び感光性組成物 |
US6245492B1 (en) * | 1998-08-13 | 2001-06-12 | International Business Machines Corporation | Photoresist system and process for aerial image enhancement |
JP2000122291A (ja) | 1998-10-09 | 2000-04-28 | Mitsubishi Electric Corp | 化学増幅レジスト用材料、感光性樹脂組成物および該組成物を半導体装置の製造に使用する方法 |
TW527524B (en) * | 1999-04-01 | 2003-04-11 | Fuji Photo Film Co Ltd | Positive photoresist composition for far ultraviolet exposure |
JP4390233B2 (ja) | 1999-07-05 | 2009-12-24 | 大阪有機化学工業株式会社 | ArFポジ型光画像形成用組成物 |
JP3956078B2 (ja) | 1999-10-20 | 2007-08-08 | 信越化学工業株式会社 | レジスト組成物用ベースポリマー並びにレジスト材料及びパターン形成方法 |
JP4613364B2 (ja) | 2000-06-14 | 2011-01-19 | 学校法人東京電機大学 | レジストパタン形成方法 |
JP2002122986A (ja) * | 2000-10-16 | 2002-04-26 | Kansai Paint Co Ltd | ポジ型感光性樹脂組成物、ポジ型感光性ドライフィルム、その組成物を使用して得られる材料及びパターン形成方法 |
JP3992993B2 (ja) | 2001-02-21 | 2007-10-17 | 富士フイルム株式会社 | ポジ型電子線、x線又はeuv用レジスト組成物 |
TWI291953B (ja) * | 2001-10-23 | 2008-01-01 | Mitsubishi Rayon Co | |
JP4434762B2 (ja) | 2003-01-31 | 2010-03-17 | 東京応化工業株式会社 | レジスト組成物 |
JPWO2004077158A1 (ja) | 2003-02-25 | 2006-06-08 | 東京応化工業株式会社 | ホトレジスト組成物およびレジストパターンの形成方法 |
US20050147920A1 (en) * | 2003-12-30 | 2005-07-07 | Chia-Hui Lin | Method and system for immersion lithography |
JP2006096965A (ja) | 2004-02-20 | 2006-04-13 | Tokyo Ohka Kogyo Co Ltd | 高分子化合物、該高分子化合物を含有するフォトレジスト組成物、およびレジストパターン形成方法 |
EP1621927B1 (en) * | 2004-07-07 | 2018-05-23 | FUJIFILM Corporation | Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same |
JP4830442B2 (ja) | 2005-10-19 | 2011-12-07 | Jsr株式会社 | ポジ型感放射線性樹脂組成物 |
TWI443461B (zh) * | 2005-12-09 | 2014-07-01 | Fujifilm Corp | 正型光阻組成物、用於正型光阻組成物之樹脂、用於合成該樹脂之化合物及使用該正型光阻組成物之圖案形成方法 |
US8088550B2 (en) * | 2007-07-30 | 2012-01-03 | Fujifilm Corporation | Positive resist composition and pattern forming method |
US8507174B2 (en) | 2007-08-10 | 2013-08-13 | Fujifilm Corporation | Positive resist composition, pattern forming method using the composition, and compound for use in the composition |
JP4966796B2 (ja) | 2007-09-21 | 2012-07-04 | 富士フイルム株式会社 | ポジ型レジスト組成物、該ポジ型レジスト組成物を用いたパターン形成方法及び該ポジ型レジスト組成物に用いられる化合物 |
-
2008
- 2008-08-11 US US12/673,096 patent/US8507174B2/en active Active
- 2008-08-11 EP EP08827323A patent/EP2177506A4/en not_active Withdrawn
- 2008-08-11 KR KR1020107003042A patent/KR101524571B1/ko active IP Right Grant
- 2008-08-11 WO PCT/JP2008/064419 patent/WO2009022681A1/ja active Application Filing
- 2008-08-11 EP EP12153245A patent/EP2450746A1/en not_active Withdrawn
- 2008-08-11 TW TW097130529A patent/TWI481961B/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0254853A2 (en) | 1986-07-28 | 1988-02-03 | International Business Machines Corporation | Lithographic method employing thermally stable photoresists with high sensitivity forming a hydogen-bonded network |
JPH0225850A (ja) | 1988-07-15 | 1990-01-29 | Hitachi Ltd | 放射線感応性組成物およびそれを用いたパターン形成法 |
JPH03223860A (ja) | 1990-01-30 | 1991-10-02 | Wako Pure Chem Ind Ltd | 新規レジスト材料 |
JPH04251259A (ja) | 1990-08-31 | 1992-09-07 | Wako Pure Chem Ind Ltd | 新規なレジスト材料及びパタ−ン形成方法 |
JPH08248561A (ja) * | 1995-03-09 | 1996-09-27 | Res Dev Corp Of Japan | 光反応性組成物、該光反応性組成物を含有した酸反応性高分子組成物及び酸反応性樹脂層 |
JPH0934106A (ja) * | 1995-07-20 | 1997-02-07 | Toppan Printing Co Ltd | 光重合性組成物及びその重合方法 |
JPH11158118A (ja) * | 1997-12-03 | 1999-06-15 | Sumitomo Chem Co Ltd | アセト酢酸誘導体、その製法及び用途 |
JP2000227659A (ja) * | 1999-02-08 | 2000-08-15 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
Non-Patent Citations (3)
Title |
---|
ARIMITSU K. ET AL.: "Autocatalytic Fragmentation of Acetoacetate Derivatives as Acid Amplifiers to Proliferative Acid Molecules", JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, vol. 120, no. 1, 1998, pages 37 - 45, XP008129318 * |
FUKUCHI I. ET AL.: "Catalytic asymmetric aldol reactions of enolizable carbon pronucleophiles with formaldehyde and ethyl glyoxylate", ADVANCED SYNTHESIS & CATALYSIS, vol. 349, no. 4+5, 2007, pages 509 - 512, XP008129319 * |
See also references of EP2177506A4 * |
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Also Published As
Publication number | Publication date |
---|---|
EP2177506A4 (en) | 2011-06-22 |
KR20100037138A (ko) | 2010-04-08 |
EP2450746A1 (en) | 2012-05-09 |
KR101524571B1 (ko) | 2015-06-01 |
EP2177506A1 (en) | 2010-04-21 |
US8507174B2 (en) | 2013-08-13 |
TW200915002A (en) | 2009-04-01 |
US20110183258A1 (en) | 2011-07-28 |
TWI481961B (zh) | 2015-04-21 |
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