WO2009011144A1 - 無線ｉｃデバイス及び電子機器 - Google Patents

無線ｉｃデバイス及び電子機器 Download PDF

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Publication number
WO2009011144A1
WO2009011144A1 PCT/JP2008/052129 JP2008052129W WO2009011144A1 WO 2009011144 A1 WO2009011144 A1 WO 2009011144A1 JP 2008052129 W JP2008052129 W JP 2008052129W WO 2009011144 A1 WO2009011144 A1 WO 2009011144A1
Authority
WO
WIPO (PCT)
Prior art keywords
wireless
chip
circuit board
electrode
looped
Prior art date
Application number
PCT/JP2008/052129
Other languages
English (en)
French (fr)
Inventor
Takeshi Kataya
Noboru Kato
Satoshi Ishino
Nobuo Ikemoto
Ikuhei Kimura
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to PCT/JP2008/055962 priority Critical patent/WO2009011154A1/ja
Priority to CN201610654623.XA priority patent/CN106096705B/zh
Priority to CN201610655803.XA priority patent/CN106326969B/zh
Priority to EP08739091.0A priority patent/EP2056400B1/en
Priority to EP15164716.1A priority patent/EP2928015B1/en
Priority to KR1020087023808A priority patent/KR100981582B1/ko
Priority to CN200880000137.XA priority patent/CN101542830B/zh
Priority to JP2008536412A priority patent/JP4301346B2/ja
Priority to US12/235,753 priority patent/US20090021352A1/en
Publication of WO2009011144A1 publication Critical patent/WO2009011144A1/ja
Priority to JP2009020419A priority patent/JP4900399B2/ja
Priority to US12/959,454 priority patent/US8400307B2/en
Priority to JP2012000352A priority patent/JP5769637B2/ja
Priority to JP2014160148A priority patent/JP5783306B2/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/44—Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Abstract

　専用のアンテナを設けることなく、小型化を達成でき、インピーダンスの整合も容易な無線ＩＣデバイス及び電子機器を得る。 　送受信信号を処理する無線ＩＣチップ（５）と、該無線ＩＣチップ（５）を実装したプリント配線回路基板（２０）と、該回路基板（２０）に形成されたグランド電極（２１）と、無線ＩＣチップ（５）と電気的に導通されるとともにグランド電極（２１）と電磁界結合するように回路基板（２０）に形成されたループ状電極（２２）とを備えた無線ＩＣデバイス。グランド電極（２１）がループ状電極（２２）を介して無線ＩＣチップ（５）と結合し、高周波信号を送受信する。無線ＩＣチップ（５）とループ状電極（２２）との間に、共振回路及び／又は整合回路を含む給電回路基板が介在されていてもよい。
PCT/JP2008/052129 2007-07-18 2008-02-08 無線ｉｃデバイス及び電子機器 WO2009011144A1 (ja)

Priority Applications (13)

Application Number Priority Date Filing Date Title
KR1020087023808A KR100981582B1 (ko) 2007-07-18 2008-03-27 무선 ｉｃ 디바이스 및 전자기기
JP2008536412A JP4301346B2 (ja) 2007-07-18 2008-03-27 無線ｉｃデバイス及び電子機器
CN201610655803.XA CN106326969B (zh) 2007-07-18 2008-03-27 无线ic器件及电子设备
EP08739091.0A EP2056400B1 (en) 2007-07-18 2008-03-27 Wireless ic device and electronic device
EP15164716.1A EP2928015B1 (en) 2007-07-18 2008-03-27 Radio frequency ic device and electronic apparatus
PCT/JP2008/055962 WO2009011154A1 (ja) 2007-07-18 2008-03-27 無線ｉｃデバイス及び電子機器
CN200880000137.XA CN101542830B (zh) 2007-07-18 2008-03-27 无线ic器件及电子设备
CN201610654623.XA CN106096705B (zh) 2007-07-18 2008-03-27 无线ic器件及电子设备
US12/235,753 US20090021352A1 (en) 2007-07-18 2008-09-23 Radio frequency ic device and electronic apparatus
JP2009020419A JP4900399B2 (ja) 2007-07-18 2009-01-30 無線ｉｃデバイス及び電子機器
US12/959,454 US8400307B2 (en) 2007-07-18 2010-12-03 Radio frequency IC device and electronic apparatus
JP2012000352A JP5769637B2 (ja) 2007-07-18 2012-01-05 無線ｉｃチップ付きプリント配線基板及び電子機器
JP2014160148A JP5783306B2 (ja) 2007-07-18 2014-08-06 無線ｉｃチップ付きプリント配線基板及び電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-186392 2007-07-18
JP2007186392 2007-07-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055962 Continuation WO2009011154A1 (ja) 2007-07-18 2008-03-27 無線ｉｃデバイス及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/851,661 Continuation US7830311B2 (en) 2007-07-18 2007-09-07 Wireless IC device and electronic device

Publications (1)

Publication Number Publication Date
WO2009011144A1 true WO2009011144A1 (ja) 2009-01-22

Family

ID=40259490

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2008/052129 WO2009011144A1 (ja) 2007-07-18 2008-02-08 無線ｉｃデバイス及び電子機器
PCT/JP2008/055962 WO2009011154A1 (ja) 2007-07-18 2008-03-27 無線ｉｃデバイス及び電子機器

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055962 WO2009011154A1 (ja) 2007-07-18 2008-03-27 無線ｉｃデバイス及び電子機器

Country Status (6)

Country Link
US (1) US7830311B2 (ja)
EP (2) EP2928015B1 (ja)
JP (6) JP4301346B2 (ja)
KR (1) KR100981582B1 (ja)
CN (3) CN101542830B (ja)
WO (2) WO2009011144A1 (ja)

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JP2011015143A (ja) * 2009-07-01 2011-01-20 Fujitsu Ltd Ｒｆｉｄタグ
WO2012096365A1 (ja) * 2011-01-14 2012-07-19 株式会社村田製作所 Ｒｆｉｄチップパッケージ及びｒｆｉｄタグ
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