WO2009008297A1 - 酸化物焼結体とその製造方法、ターゲット、及びそれを用いて得られる透明導電膜ならびに透明導電性基材 - Google Patents

酸化物焼結体とその製造方法、ターゲット、及びそれを用いて得られる透明導電膜ならびに透明導電性基材 Download PDF

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WO2009008297A1
WO2009008297A1 PCT/JP2008/061957 JP2008061957W WO2009008297A1 WO 2009008297 A1 WO2009008297 A1 WO 2009008297A1 JP 2008061957 W JP2008061957 W JP 2008061957W WO 2009008297 A1 WO2009008297 A1 WO 2009008297A1
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target
phase
transparent conductive
oxide sinter
sinter
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PCT/JP2008/061957
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English (en)
French (fr)
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Tokuyuki Nakayama
Yoshiyuki Abe
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Sumitomo Metal Mining Co., Ltd.
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Application filed by Sumitomo Metal Mining Co., Ltd. filed Critical Sumitomo Metal Mining Co., Ltd.
Priority to US12/452,063 priority Critical patent/US8440115B2/en
Priority to KR1020157005168A priority patent/KR101596211B1/ko
Priority to KR1020157005160A priority patent/KR101646488B1/ko
Priority to JP2009522592A priority patent/JP5655306B2/ja
Priority to CN200880021217A priority patent/CN101679124A/zh
Priority to EP08777760.3A priority patent/EP2168933B1/en
Priority to TW097125208A priority patent/TWI453175B/zh
Publication of WO2009008297A1 publication Critical patent/WO2009008297A1/ja
Priority to US13/834,305 priority patent/US8801973B2/en

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Abstract

 高速成膜とノジュールレスを実現できるスパッタリング用ターゲット或いはイオンプレーティング用タブレット、それを得るのに最適な酸化物焼結体とその製造方法、それを用いて得られ青色光の吸収の少ない低抵抗の透明導電膜を提供する。  インジウムとガリウムを酸化物として含有する酸化物焼結体において、ビックスバイト型構造のIn2O3相が主たる結晶相となり、その中にβ-Ga2O3型構造のGaInO3相、又はGaInO3相と(Ga,In)2O3相が平均粒径5μm以下の結晶粒として微細に分散しており、ガリウムの含有量がGa/(In+Ga)原子数比で10原子%以上35原子%未満であることを特徴とする酸化物焼結体などにより提供する。
PCT/JP2008/061957 2007-07-06 2008-07-02 酸化物焼結体とその製造方法、ターゲット、及びそれを用いて得られる透明導電膜ならびに透明導電性基材 WO2009008297A1 (ja)

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US12/452,063 US8440115B2 (en) 2007-07-06 2008-07-02 Oxide sintered body and production method therefor, target, and transparent conductive film and transparent conductive substrate obtained by using the same
KR1020157005168A KR101596211B1 (ko) 2007-07-06 2008-07-02 산화물 소결물체와 그 제조 방법, 타겟, 및 그것을 이용해 얻어지는 투명 도전막 및 투명 도전성 기재
KR1020157005160A KR101646488B1 (ko) 2007-07-06 2008-07-02 산화물 소결물체와 그 제조 방법, 타겟, 및 그것을 이용해 얻어지는 투명 도전막 및 투명 도전성 기재
JP2009522592A JP5655306B2 (ja) 2007-07-06 2008-07-02 酸化物焼結体とその製造方法、ターゲット、及びそれを用いて得られる透明導電膜ならびに透明導電性基材
CN200880021217A CN101679124A (zh) 2007-07-06 2008-07-02 氧化物烧结体及其制造方法、靶、使用该靶得到的透明导电膜以及透明导电性基材
EP08777760.3A EP2168933B1 (en) 2007-07-06 2008-07-02 Oxide sintered body, process for producing the same, target and use
TW097125208A TWI453175B (zh) 2007-07-06 2008-07-04 氧化物燒結體及其製造方法、靶及使用其所得之透明導電膜以及透明導電性基材
US13/834,305 US8801973B2 (en) 2007-07-06 2013-03-15 Oxide sintered body and production method therefor, target, and transparent conductive film and transparent conductive substrate obtained by using the same

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Publication number Priority date Publication date Assignee Title
WO2010032422A1 (ja) * 2008-09-19 2010-03-25 出光興産株式会社 酸化物焼結体及びスパッタリングターゲット
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WO2011016387A1 (ja) * 2009-08-05 2011-02-10 住友金属鉱山株式会社 イオンプレーティング用タブレットとその製造方法、および透明導電膜
CN102051587A (zh) * 2009-10-30 2011-05-11 三星康宁精密素材株式会社 氧化铟锡溅射靶和使用该溅射靶制备的透明导电膜
EP2336386A1 (en) * 2009-11-30 2011-06-22 Sumitomo Metal Mining Co., Ltd. Oxide evaporation material, transparent conducting film, and solar cell
WO2011086940A1 (ja) * 2010-01-15 2011-07-21 出光興産株式会社 In-Ga-O系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法
CN102134700A (zh) * 2009-12-22 2011-07-27 住友金属矿山株式会社 氧化物蒸镀材料和高折射率透明膜
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JP2015124145A (ja) * 2013-12-27 2015-07-06 住友金属鉱山株式会社 酸化インジウム系酸化物焼結体およびその製造方法
WO2015137275A1 (ja) * 2014-03-14 2015-09-17 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
WO2015178430A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
JP5928657B2 (ja) * 2013-07-16 2016-06-01 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
JPWO2016017690A1 (ja) * 2014-07-29 2017-05-25 凸版印刷株式会社 積層体及びその製造方法、並びにガスバリアフィルム及びその製造方法
WO2019244945A1 (ja) * 2018-06-21 2019-12-26 株式会社アルバック 酸化物半導体薄膜、薄膜トランジスタおよびその製造方法、ならびにスパッタリングターゲット

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816116B2 (ja) * 2006-02-08 2011-11-16 住友金属鉱山株式会社 スパッタリングターゲット用酸化物焼結体および、それを用いて得られる酸化物膜、それを含む透明基材
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DE102011012034A1 (de) * 2011-02-22 2012-08-23 Heraeus Materials Technology Gmbh & Co. Kg Rohrförmiges Sputtertarget
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US9224820B2 (en) * 2012-05-31 2015-12-29 Samsung Corning Advanced Glass, Llc Oxide semiconductor sputtering target, method of manufacturing thin-film transistors using the same, and thin film transistor manufactured using the same
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JP6724057B2 (ja) * 2018-03-30 2020-07-15 Jx金属株式会社 スパッタリングターゲット部材
KR102492876B1 (ko) * 2018-12-28 2023-01-27 이데미쓰 고산 가부시키가이샤 소결체
US20220307124A1 (en) * 2019-06-28 2022-09-29 Ulvac, Inc. Sputtering target and method of producing sputtering target

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07182924A (ja) 1993-10-27 1995-07-21 At & T Corp ガリウム−インジウム酸化物を含む透明導電体
JPH0950711A (ja) 1995-08-03 1997-02-18 Kobe Steel Ltd 透明導電膜
JPH09259640A (ja) 1996-03-25 1997-10-03 Uchitsugu Minami 透明導電膜
WO2003014409A1 (fr) * 2001-08-02 2003-02-20 Idemitsu Kosan Co., Ltd. Cible de pulverisation, film conducteur transparent et leur procede de fabrication
JP2005347215A (ja) 2004-06-07 2005-12-15 Sumitomo Metal Mining Co Ltd 透明導電膜、透明導電膜製造用焼結体ターゲット、透明導電性基材及びそれを用いた表示デバイス
JP2007113026A (ja) * 2005-10-18 2007-05-10 Sumitomo Metal Mining Co Ltd 透明導電膜及びそれを含む透明導電性基材

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1006248A (en) 1911-07-13 1911-10-17 Frank P Martin Pipe-mold.
US5473456A (en) * 1993-10-27 1995-12-05 At&T Corp. Method for growing transparent conductive gallium-indium-oxide films by sputtering
JPH1025567A (ja) * 1996-07-11 1998-01-27 Sumitomo Bakelite Co Ltd 複合ターゲット
JP3364488B1 (ja) * 2001-07-05 2003-01-08 東京エレクトロン株式会社 反応容器のクリーニング方法及び成膜装置
US20040222089A1 (en) * 2001-09-27 2004-11-11 Kazuyoshi Inoue Sputtering target and transparent electroconductive film
JP2006022373A (ja) * 2004-07-07 2006-01-26 Sumitomo Metal Mining Co Ltd 透明導電性薄膜作製用スパッタリングターゲットの製造方法
JP4888119B2 (ja) * 2004-09-13 2012-02-29 住友金属鉱山株式会社 透明導電膜及びその製造方法、並びに透明導電性基材、発光デバイス
JP4475209B2 (ja) * 2005-09-22 2010-06-09 住友金属鉱山株式会社 蒸着用酸化物燒結体タブレット
WO2007037313A1 (ja) * 2005-09-28 2007-04-05 Nec Corporation 窓ガラスおよびウインドウフィルム
JP4816116B2 (ja) * 2006-02-08 2011-11-16 住友金属鉱山株式会社 スパッタリングターゲット用酸化物焼結体および、それを用いて得られる酸化物膜、それを含む透明基材
JP4816137B2 (ja) * 2006-02-24 2011-11-16 住友金属鉱山株式会社 透明導電膜及び透明導電性基材
EP2942337A1 (en) * 2007-07-06 2015-11-11 Sumitomo Metal Mining Co., Ltd. Oxide sintered body and production method therefor, target, and transparent conductive film and transparent conductive substrate obtained by using the same
JP5397369B2 (ja) * 2008-03-06 2014-01-22 住友金属鉱山株式会社 半導体発光素子、該半導体発光素子の製造方法および該半導体発光素子を用いたランプ
WO2009128424A1 (ja) * 2008-04-16 2009-10-22 住友金属鉱山株式会社 薄膜トランジスタ型基板、薄膜トランジスタ型液晶表示装置および薄膜トランジスタ型基板の製造方法
CN103233204A (zh) * 2008-06-06 2013-08-07 出光兴产株式会社 氧化物薄膜用溅射靶及其制造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07182924A (ja) 1993-10-27 1995-07-21 At & T Corp ガリウム−インジウム酸化物を含む透明導電体
JPH0950711A (ja) 1995-08-03 1997-02-18 Kobe Steel Ltd 透明導電膜
JPH09259640A (ja) 1996-03-25 1997-10-03 Uchitsugu Minami 透明導電膜
WO2003014409A1 (fr) * 2001-08-02 2003-02-20 Idemitsu Kosan Co., Ltd. Cible de pulverisation, film conducteur transparent et leur procede de fabrication
JP2005347215A (ja) 2004-06-07 2005-12-15 Sumitomo Metal Mining Co Ltd 透明導電膜、透明導電膜製造用焼結体ターゲット、透明導電性基材及びそれを用いた表示デバイス
JP2007113026A (ja) * 2005-10-18 2007-05-10 Sumitomo Metal Mining Co Ltd 透明導電膜及びそれを含む透明導電性基材

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"Technology of a transparent conductive film (the second Revised version)", 20 June 1220, OHMSHA, LTD., pages: 238 - 239
"Tomei Dodenmaku no Gijutsu. revised 2nd edition, 1st print", 20 December 2006, OHMSHA, LTD, pages: 207-210 - 243-250 *
See also references of EP2168933A4

Cited By (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9209257B2 (en) 2008-09-19 2015-12-08 Idemitsu Kosan Co., Ltd. Oxide sintered body and sputtering target
WO2010032422A1 (ja) * 2008-09-19 2010-03-25 出光興産株式会社 酸化物焼結体及びスパッタリングターゲット
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US8647537B2 (en) 2008-09-19 2014-02-11 Idemitsu Kosan Co., Ltd. Oxide sintered body and sputtering target
US20110180763A1 (en) * 2008-09-19 2011-07-28 Idemitsu Kosan Co., Ltd. Oxide sintered body and sputtering target
JPWO2010032422A1 (ja) * 2008-09-19 2012-02-02 出光興産株式会社 酸化物焼結体及びスパッタリングターゲット
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CN102348827A (zh) * 2009-03-13 2012-02-08 住友金属矿山株式会社 透明导电膜和透明导电膜层叠体及其制造方法、以及硅系薄膜太阳能电池
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US9005487B2 (en) 2009-08-05 2015-04-14 Sumitomo Metal Mining Co., Ltd. Tablet for ion plating, production method therefor and transparent conductive film
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WO2011016387A1 (ja) * 2009-08-05 2011-02-10 住友金属鉱山株式会社 イオンプレーティング用タブレットとその製造方法、および透明導電膜
CN102051587A (zh) * 2009-10-30 2011-05-11 三星康宁精密素材株式会社 氧化铟锡溅射靶和使用该溅射靶制备的透明导电膜
US8574464B2 (en) 2009-11-30 2013-11-05 Sumitomo Metal Mining Co., Ltd. Oxide evaporation material, transparent conducting film, and solar cell
US9099219B2 (en) 2009-11-30 2015-08-04 Sumitomo Metal Mining Co., Ltd. Oxide evaporation material, transparent conducting film, and solar cell
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JP2011132593A (ja) * 2009-11-30 2011-07-07 Sumitomo Metal Mining Co Ltd 酸化物蒸着材と透明導電膜および太陽電池
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CN102652119A (zh) * 2010-01-15 2012-08-29 出光兴产株式会社 In-Ga-O系氧化物烧结体、靶、氧化物半导体薄膜以及它们的制造方法
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EP2524905A4 (en) * 2010-01-15 2014-05-07 Idemitsu Kosan Co In-Ga-O-OXID SINTERED BODY, TARGET, OXID SEMICONDUCTOR THIN LAYER AND METHOD OF MANUFACTURING THEREOF
US20120292617A1 (en) * 2010-01-15 2012-11-22 Idemitsu Kosan Co., Ltd. In-Ga-O OXIDE SINTERED BODY, TARGET, OXIDE SEMICONDUCTOR THIN FILM, AND MANUFACTURING METHODS THEREFOR
WO2011086940A1 (ja) * 2010-01-15 2011-07-21 出光興産株式会社 In-Ga-O系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法
JP2011146571A (ja) * 2010-01-15 2011-07-28 Idemitsu Kosan Co Ltd In−Ga−O系酸化物焼結体、ターゲット、酸化物半導体薄膜及びこれらの製造方法
JP2011195409A (ja) * 2010-03-23 2011-10-06 Sumitomo Electric Ind Ltd In−Ga−Zn系複合酸化物焼結体およびその製造方法
JP5763064B2 (ja) * 2010-06-02 2015-08-12 出光興産株式会社 スパッタリングターゲット
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KR20140003509A (ko) * 2011-02-04 2014-01-09 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체 및 그것을 가공한 태블렛
KR101880783B1 (ko) * 2011-02-04 2018-07-20 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체 및 그것을 가공한 태블렛
JP2012211065A (ja) * 2011-03-22 2012-11-01 Idemitsu Kosan Co Ltd スパッタリングターゲット、酸化物半導体薄膜及びそれらの製造方法
US9039944B2 (en) 2011-07-06 2015-05-26 Idemitsu Kosan Co., Ltd. Sputtering target
JPWO2013005400A1 (ja) * 2011-07-06 2015-02-23 出光興産株式会社 スパッタリングターゲット
CN103620084A (zh) * 2011-07-06 2014-03-05 出光兴产株式会社 溅射靶
WO2013005400A1 (ja) * 2011-07-06 2013-01-10 出光興産株式会社 スパッタリングターゲット
CN103620084B (zh) * 2011-07-06 2016-03-02 出光兴产株式会社 溅射靶
JP2013067855A (ja) * 2011-09-06 2013-04-18 Idemitsu Kosan Co Ltd スパッタリングターゲット
US9768316B2 (en) 2013-07-16 2017-09-19 Sumitomo Metal Mining Co., Ltd. Oxide semiconductor thin film and thin film transistor
JP5928657B2 (ja) * 2013-07-16 2016-06-01 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
JPWO2015008805A1 (ja) * 2013-07-16 2017-03-02 住友金属鉱山株式会社 酸化物半導体薄膜および薄膜トランジスタ
JP2015124145A (ja) * 2013-12-27 2015-07-06 住友金属鉱山株式会社 酸化インジウム系酸化物焼結体およびその製造方法
KR101861459B1 (ko) * 2014-03-14 2018-05-28 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체, 스퍼터링용 타겟 및 그것을 이용하여 얻어지는 산화물 반도체 박막
WO2015137275A1 (ja) * 2014-03-14 2015-09-17 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
CN106103379A (zh) * 2014-03-14 2016-11-09 住友金属矿山株式会社 氧化物烧结体、溅射靶以及使用该溅射靶而获得的氧化物半导体薄膜
WO2015137274A1 (ja) * 2014-03-14 2015-09-17 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
JPWO2015137275A1 (ja) * 2014-03-14 2017-04-06 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
JPWO2015137274A1 (ja) * 2014-03-14 2017-04-06 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
KR101861458B1 (ko) * 2014-03-14 2018-05-28 스미토모 긴조쿠 고잔 가부시키가이샤 산화물 소결체, 스퍼터링용 타겟 및 그것을 이용하여 얻어지는 산화물 반도체 박막
JPWO2015178430A1 (ja) * 2014-05-23 2017-04-27 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
WO2015178430A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
US9941415B2 (en) 2014-05-23 2018-04-10 Sumitomo Metal Mining Co., Ltd. Oxide sintered body, sputtering target, and oxide semiconductor thin film obtained using sputtering target
JPWO2015178429A1 (ja) * 2014-05-23 2017-04-20 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
WO2015178429A1 (ja) * 2014-05-23 2015-11-26 住友金属鉱山株式会社 酸化物焼結体、スパッタリング用ターゲット、及びそれを用いて得られる酸化物半導体薄膜
CN106103380A (zh) * 2014-05-23 2016-11-09 住友金属矿山株式会社 氧化物烧结体、溅射用靶及使用该靶得到的氧化物半导体薄膜
JPWO2016017690A1 (ja) * 2014-07-29 2017-05-25 凸版印刷株式会社 積層体及びその製造方法、並びにガスバリアフィルム及びその製造方法
WO2019244945A1 (ja) * 2018-06-21 2019-12-26 株式会社アルバック 酸化物半導体薄膜、薄膜トランジスタおよびその製造方法、ならびにスパッタリングターゲット
JPWO2019244945A1 (ja) * 2018-06-21 2020-06-25 株式会社アルバック 酸化物半導体薄膜、薄膜トランジスタおよびその製造方法、ならびにスパッタリングターゲット
US11335782B2 (en) 2018-06-21 2022-05-17 Ulvac, Inc. Oxide semiconductor thin film, thin film transistor, method producing the same, and sputtering target

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