WO2009001850A1 - 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔 - Google Patents

樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔 Download PDF

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Publication number
WO2009001850A1
WO2009001850A1 PCT/JP2008/061529 JP2008061529W WO2009001850A1 WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1 JP 2008061529 W JP2008061529 W JP 2008061529W WO 2009001850 A1 WO2009001850 A1 WO 2009001850A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
resin
resin composition
copper foil
disclosed
Prior art date
Application number
PCT/JP2008/061529
Other languages
English (en)
French (fr)
Inventor
Tetsuro Sato
Toshifumi Matsushima
Tetsuhiro Matsunaga
Original Assignee
Mitsui Mining & Smelting Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd. filed Critical Mitsui Mining & Smelting Co., Ltd.
Priority to CN2008800220983A priority Critical patent/CN101687981B/zh
Priority to KR1020097026807A priority patent/KR101249479B1/ko
Priority to JP2009520611A priority patent/JP5650908B2/ja
Publication of WO2009001850A1 publication Critical patent/WO2009001850A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

　プリント配線板製造用の銅箔との間での良好な密着性を備え、且つ、難燃性を備える絶縁樹脂層の形成が可能な樹脂組成物及び樹脂付銅箔等の提供を目的とする。この目的を達成するため、プリント配線板の絶縁層を形成する樹脂組成物として、Ａ成分としてエポキシ当量が２００以下で２５°Cで液状のビスフェノール系エポキシ樹脂、Ｂ成分として架橋可能な官能基を有する線状ポリマー、Ｃ成分として架橋剤、Ｄ成分として４，４’－ジアミノジフェニルスルホン又は２，２－ビス（４－（４－アミノフェノキシ）フェニル）プロパン、Ｅ成分として難燃性エポキシ樹脂、Ｆ成分として多官能エポキシ樹脂、これらの各成分を基本組成とすることを特徴とする樹脂組成物を採用する。
PCT/JP2008/061529 2007-06-25 2008-06-25 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔 WO2009001850A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800220983A CN101687981B (zh) 2007-06-25 2008-06-25 树脂组合物以及使用该树脂组合物得到的带树脂铜箔
KR1020097026807A KR101249479B1 (ko) 2007-06-25 2008-06-25 수지 조성물 및 그 수지 조성물을 이용하여 얻어진 수지부착 동박
JP2009520611A JP5650908B2 (ja) 2007-06-25 2008-06-25 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-166869 2007-06-25
JP2007166869 2007-06-25

Publications (1)

Publication Number Publication Date
WO2009001850A1 true WO2009001850A1 (ja) 2008-12-31

Family

ID=40185663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/061529 WO2009001850A1 (ja) 2007-06-25 2008-06-25 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔

Country Status (6)

Country Link
JP (1) JP5650908B2 (ja)
KR (1) KR101249479B1 (ja)
CN (1) CN101687981B (ja)
MY (1) MY150635A (ja)
TW (1) TW200916525A (ja)
WO (1) WO2009001850A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007091A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置
WO2012017909A1 (ja) * 2010-08-03 2012-02-09 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
CN102585440A (zh) * 2012-01-16 2012-07-18 广州宏仁电子工业有限公司 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
JPWO2014106955A1 (ja) * 2013-01-07 2017-01-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
WO2017161120A1 (en) * 2016-03-17 2017-09-21 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
CN118638145A (zh) * 2024-08-13 2024-09-13 上海赭滢宏新材料科技有限公司 一种阻燃聚乙烯电缆材料用偶联剂及其制备方法

Families Citing this family (10)

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KR101439496B1 (ko) * 2009-12-22 2014-09-12 에스케이이노베이션 주식회사 폴리아믹산 수지 조성물과 이의 제조방법 및 이를 이용한 폴리이미드 금속적층체
CN102504197B (zh) * 2011-10-10 2013-08-21 北京新福润达绝缘材料有限责任公司 具有高耐漏电起痕指数的无卤环氧树脂组合物及其应用
CN102585663B (zh) * 2012-02-06 2013-11-20 苏州太湖电工新材料股份有限公司 一种电机用无卤阻燃耐高温绝缘漆
KR102113190B1 (ko) * 2013-12-20 2020-05-20 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR102135414B1 (ko) * 2013-12-20 2020-07-17 엘지이노텍 주식회사 액정 고분자 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR102172298B1 (ko) * 2014-03-17 2020-10-30 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판
KR102172297B1 (ko) * 2014-04-17 2020-10-30 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄회로기판
JP7312931B2 (ja) * 2016-09-28 2023-07-24 東特塗料株式会社 電気絶縁電線
CN106564240B (zh) * 2016-11-07 2018-08-31 北京新福润达绝缘材料有限责任公司 一种高耐漏电起痕玻璃毡层压板的制备方法
US10899871B2 (en) * 2019-04-23 2021-01-26 Chang Chun Plastics Co., Ltd. Phosphorous containing epoxy resins and process for synthesis

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JPH11186724A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JPH11186723A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JPH11279258A (ja) * 1998-01-27 1999-10-12 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物
JP2001181593A (ja) * 1999-12-28 2001-07-03 Kashima Oil Co Ltd 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料
JP2002128867A (ja) * 2000-10-20 2002-05-09 Nikko Materials Co Ltd エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物
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JP2005213352A (ja) * 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd プリプレグ用樹脂組成物およびこれを用いたプリプレグ
JP2005314449A (ja) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd 樹脂用添加剤
JP2006328214A (ja) * 2005-05-26 2006-12-07 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよびフィルム付き製品
JP2007099956A (ja) * 2005-10-06 2007-04-19 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび構造体

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JPH11186724A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JPH11186723A (ja) * 1997-12-25 1999-07-09 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JPH11279258A (ja) * 1998-01-27 1999-10-12 Toto Kasei Co Ltd リン含有エポキシ樹脂組成物
JP2001181593A (ja) * 1999-12-28 2001-07-03 Kashima Oil Co Ltd 熱硬化性接着剤及びそれを用いたフレキシブルプリント配線板材料
JP2002128867A (ja) * 2000-10-20 2002-05-09 Nikko Materials Co Ltd エポキシ樹脂用フェノール系硬化剤及びそれを用いたエポキシ樹脂組成物
JP2005132925A (ja) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、それを用いたプリプレグ、金属箔張積層板、及び金属箔付き樹脂シート
JP2005213352A (ja) * 2004-01-29 2005-08-11 Arisawa Mfg Co Ltd プリプレグ用樹脂組成物およびこれを用いたプリプレグ
JP2005314449A (ja) * 2004-04-27 2005-11-10 Nikko Materials Co Ltd 樹脂用添加剤
JP2006328214A (ja) * 2005-05-26 2006-12-07 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよびフィルム付き製品
JP2007099956A (ja) * 2005-10-06 2007-04-19 Tamura Kaken Co Ltd 熱硬化性樹脂組成物、樹脂フィルムおよび構造体

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012007091A (ja) * 2010-06-25 2012-01-12 Panasonic Electric Works Co Ltd 半導体封止用エポキシ樹脂組成物とそれを用いた半導体装置
WO2012017909A1 (ja) * 2010-08-03 2012-02-09 三井金属鉱業株式会社 プリント配線板の製造方法及びプリント配線板
JP2012038772A (ja) * 2010-08-03 2012-02-23 Mitsui Mining & Smelting Co Ltd プリント配線板の製造方法及びプリント配線板
US9144157B2 (en) 2010-08-03 2015-09-22 Mitsui Mining & Smelting Co., Ltd. Manufacturing method of printed wiring board and printed wiring board
CN102585440A (zh) * 2012-01-16 2012-07-18 广州宏仁电子工业有限公司 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物
CN102585440B (zh) * 2012-01-16 2013-09-04 广州宏仁电子工业有限公司 用于覆铜箔基板的高cti值无卤阻燃型树脂组合物
JPWO2014106955A1 (ja) * 2013-01-07 2017-01-19 株式会社ニコン 組成物、積層体、積層体の製造方法、トランジスタおよびトランジスタの製造方法
US10510460B2 (en) 2013-01-07 2019-12-17 Nikon Corporation Composition, laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor
WO2015012327A1 (ja) 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
WO2015012376A1 (ja) 2013-07-24 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
EP3046400A2 (en) 2015-01-16 2016-07-20 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3048864A2 (en) 2015-01-21 2016-07-27 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
EP3054751A2 (en) 2015-02-06 2016-08-10 JX Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
US9839124B2 (en) 2015-02-06 2017-12-05 Jx Nippon Mining & Metals Corporation Copper foil provided with carrier, laminate, printed wiring board, electronic device and method for fabricating printed wiring board
WO2017161120A1 (en) * 2016-03-17 2017-09-21 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
US11008458B2 (en) 2016-03-17 2021-05-18 Qed Labs Inc. Articles with improved flame retardancy and/or melt dripping properties
EP3232747A1 (en) 2016-04-15 2017-10-18 JX Nippon Mining & Metals Corp. Copper foil, copper foil for high-frequency circuit, carrier-attached copper foil, carrier-attached copper foil for high-frequency circuit, laminate, method of manufacturing printed wiring board, and method of manufacturing electronic device
CN118638145A (zh) * 2024-08-13 2024-09-13 上海赭滢宏新材料科技有限公司 一种阻燃聚乙烯电缆材料用偶联剂及其制备方法

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MY150635A (en) 2014-02-14
KR101249479B1 (ko) 2013-03-29
JP5650908B2 (ja) 2015-01-07
TW200916525A (en) 2009-04-16
JPWO2009001850A1 (ja) 2010-08-26
TWI374909B (ja) 2012-10-21
CN101687981B (zh) 2012-04-04
KR20100024949A (ko) 2010-03-08
CN101687981A (zh) 2010-03-31

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