WO2009072531A1 - キャビティー部を有する多層配線基板 - Google Patents

キャビティー部を有する多層配線基板 Download PDF

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Publication number
WO2009072531A1
WO2009072531A1 PCT/JP2008/071985 JP2008071985W WO2009072531A1 WO 2009072531 A1 WO2009072531 A1 WO 2009072531A1 JP 2008071985 W JP2008071985 W JP 2008071985W WO 2009072531 A1 WO2009072531 A1 WO 2009072531A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
multilayer wiring
cavity section
cavity
multilayer
Prior art date
Application number
PCT/JP2008/071985
Other languages
English (en)
French (fr)
Inventor
Jun Matsui
Shingetsu Yamada
Original Assignee
Mitsubishi Plastics, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Plastics, Inc. filed Critical Mitsubishi Plastics, Inc.
Priority to JP2009544697A priority Critical patent/JP4881445B2/ja
Priority to US12/745,651 priority patent/US20110042124A1/en
Priority to DE112008003252T priority patent/DE112008003252T5/de
Priority to CN2008801187342A priority patent/CN101884257B/zh
Priority to KR1020107012104A priority patent/KR101153766B1/ko
Publication of WO2009072531A1 publication Critical patent/WO2009072531A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Led Device Packages (AREA)

Abstract

　複数の配線基板を積層してなるキャビティー部を有する多層配線基板であって、多層配線基板とした際に前記キャビティー部底面に配置される配線基板１、及び配線基板１より上層側に配置される配線基板２からなり、前記配線基板１及び／又は配線基板２が、所定の性質を有する絶縁基材からなり、前記配線基板２は、さらにキャビティー用穴が形成されている、キャビティー部を有する多層配線基板により、キャビティー部を有し、リフレクター機能をも備えた多層配線基板を提供する。
PCT/JP2008/071985 2007-12-05 2008-12-03 キャビティー部を有する多層配線基板 WO2009072531A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009544697A JP4881445B2 (ja) 2007-12-05 2008-12-03 キャビティー部を有する多層配線基板
US12/745,651 US20110042124A1 (en) 2007-12-05 2008-12-03 Multilayer wiring substrate having cavity portion
DE112008003252T DE112008003252T5 (de) 2007-12-05 2008-12-03 Vielschichtiges Leitungssubstrat mit einem Hohlraumbereich
CN2008801187342A CN101884257B (zh) 2007-12-05 2008-12-03 具有腔部的多层布线基板
KR1020107012104A KR101153766B1 (ko) 2007-12-05 2008-12-03 캐비티부를 갖는 다층 배선 기판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-314619 2007-12-05
JP2007314619 2007-12-05

Publications (1)

Publication Number Publication Date
WO2009072531A1 true WO2009072531A1 (ja) 2009-06-11

Family

ID=40717710

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071985 WO2009072531A1 (ja) 2007-12-05 2008-12-03 キャビティー部を有する多層配線基板

Country Status (7)

Country Link
US (1) US20110042124A1 (ja)
JP (1) JP4881445B2 (ja)
KR (1) KR101153766B1 (ja)
CN (1) CN101884257B (ja)
DE (1) DE112008003252T5 (ja)
TW (1) TW200934349A (ja)
WO (1) WO2009072531A1 (ja)

Cited By (6)

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JP2011049476A (ja) * 2009-08-28 2011-03-10 Taiyo Holdings Co Ltd ソルダーレジスト層及びプリント配線板
CN102093593A (zh) * 2010-12-30 2011-06-15 中国人民解放军国防科学技术大学 树脂基复合材料用添加型阻燃剂、阻燃复合材料及其制备方法
JP2012119549A (ja) * 2010-12-02 2012-06-21 Sumitomo Bakelite Co Ltd バンプ形成用導電性樹脂組成物
JP2012186451A (ja) * 2011-02-14 2012-09-27 Murata Mfg Co Ltd 多層配線板の製造方法および多層配線板
WO2017187939A1 (ja) * 2016-04-26 2017-11-02 株式会社村田製作所 樹脂多層基板の製造方法
JPWO2020162473A1 (ja) * 2019-02-05 2021-12-02 株式会社村田製作所 樹脂多層基板および樹脂多層基板の製造方法

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JP5340763B2 (ja) * 2009-02-25 2013-11-13 ローム株式会社 Ｌｅｄランプ
WO2011058938A1 (ja) * 2009-11-10 2011-05-19 株式会社村田製作所 多層基板およびその製造方法
US20110147069A1 (en) * 2009-12-18 2011-06-23 International Business Machines Corporation Multi-tiered Circuit Board and Method of Manufacture
JP5684511B2 (ja) * 2010-08-11 2015-03-11 三菱樹脂株式会社 金属箔積層体、ｌｅｄ搭載用基板及び光源装置
DE102011054818A1 (de) * 2011-10-26 2013-05-02 Hella Kgaa Hueck & Co. Elektronische Schaltung
CN103200775B (zh) * 2013-03-25 2016-03-23 乐健科技（珠海）有限公司 用于led安装的陶瓷基印刷电路板的制备方法
WO2014185218A1 (ja) * 2013-05-16 2014-11-20 株式会社村田製作所 樹脂多層基板の製造方法
US9006901B2 (en) * 2013-07-19 2015-04-14 Alpha & Omega Semiconductor, Inc. Thin power device and preparation method thereof
JP5874697B2 (ja) * 2013-08-28 2016-03-02 株式会社デンソー 多層プリント基板およびその製造方法
TWI572267B (zh) * 2014-09-29 2017-02-21 旭德科技股份有限公司 具有凹槽的多層線路板與其製作方法
CN104282632B (zh) * 2014-10-24 2017-04-19 无锡中微高科电子有限公司 基于lcp基板的封装外壳及制备方法
US10643981B2 (en) * 2014-10-31 2020-05-05 eLux, Inc. Emissive display substrate for surface mount micro-LED fluidic assembly
KR20160112116A (ko) * 2015-03-18 2016-09-28 엘지이노텍 주식회사 발광소자 어레이와 이를 포함하는 조명시스템
WO2018052045A1 (ja) * 2016-09-16 2018-03-22 東京応化工業株式会社 基板接着方法及び積層体の製造方法
US9997442B1 (en) * 2016-12-14 2018-06-12 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
US10845282B2 (en) * 2017-02-22 2020-11-24 The Boeing Company Test coupons having node bonds, methods for testing node bonds, and related apparatuses
US11277924B2 (en) * 2017-08-04 2022-03-15 Fujikura Ltd. Method for manufacturing multilayer printed wiring board and multilayer printed wiring board
US10895372B2 (en) * 2018-05-31 2021-01-19 Darfon Electronics Corp. Light source board, manufacturing method thereof, and luminous keyboard using the same
US10692663B2 (en) 2018-05-31 2020-06-23 Darfon Electronics Corp. Light source board, manufacturing method thereof, and luminous keyboard using the same
TWI661759B (zh) * 2018-07-19 2019-06-01 欣興電子股份有限公司 基板結構及其製造方法
US10720289B1 (en) * 2019-02-20 2020-07-21 Darfon Electronics Corp. Light emitting keyboard and lighting board thereof
CN111462651B (zh) * 2019-05-08 2021-12-10 伊乐视有限公司 用于表面贴装微型led流体组装的发光显示基板及制备方法
KR20210047204A (ko) * 2019-10-21 2021-04-29 삼성전자주식회사 직하형 백라이트장치 및 이를 구비한 디스플레이장치
CN114258192A (zh) * 2020-09-23 2022-03-29 庆鼎精密电子（淮安）有限公司 具有高反射率的电路板及其制作方法

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