WO2008143099A1 - 積層配線基板及びその製造方法 - Google Patents

積層配線基板及びその製造方法 Download PDF

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Publication number
WO2008143099A1
WO2008143099A1 PCT/JP2008/058867 JP2008058867W WO2008143099A1 WO 2008143099 A1 WO2008143099 A1 WO 2008143099A1 JP 2008058867 W JP2008058867 W JP 2008058867W WO 2008143099 A1 WO2008143099 A1 WO 2008143099A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
manufacturing
conductive
same
laminated wiring
Prior art date
Application number
PCT/JP2008/058867
Other languages
English (en)
French (fr)
Inventor
Takaharu Hondo
Original Assignee
Fujikura Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd. filed Critical Fujikura Ltd.
Priority to KR1020097026234A priority Critical patent/KR101116712B1/ko
Priority to EP08752738.8A priority patent/EP2157842B1/en
Priority to CN2008800164589A priority patent/CN101683007B/zh
Priority to JP2009515174A priority patent/JP4955763B2/ja
Priority to US12/600,444 priority patent/US8502086B2/en
Priority to TW097120005A priority patent/TW200941656A/zh
Publication of WO2008143099A1 publication Critical patent/WO2008143099A1/ja

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0346—Deburring, rounding, bevelling or smoothing conductor edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

　積層配線基板の製造方法は一方の面に導電層１ｂ～４ｂが設けられた絶縁基板１ａ～４ａ、前記絶縁基板に設けられ他方の面側から前記導電層に到達する貫通孔２ｅ～４ｅ及び前記貫通孔内に導電性ペーストを充填して前記導電層に接続させた導電ビア２ｄ～４ｄを有する配線基板基材２～４を、少なくとも一つ以上積層した積層配線基板の製造方法であって、前記導電性ペーストが貫通孔に充填される前に、前記導電層の貫通孔内における表面部分に平滑化処理を施して平滑面部２ｇを形成することを特徴とする。
PCT/JP2008/058867 2007-05-17 2008-05-14 積層配線基板及びその製造方法 WO2008143099A1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020097026234A KR101116712B1 (ko) 2007-05-17 2008-05-14 적층 배선 기판 및 그 제조 방법
EP08752738.8A EP2157842B1 (en) 2007-05-17 2008-05-14 Laminated wiring board and method for manufacturing the same
CN2008800164589A CN101683007B (zh) 2007-05-17 2008-05-14 层压配线基板及其制造方法
JP2009515174A JP4955763B2 (ja) 2007-05-17 2008-05-14 積層配線基板及びその製造方法
US12/600,444 US8502086B2 (en) 2007-05-17 2008-05-14 Laminated wiring board and method for manufacturing the same
TW097120005A TW200941656A (en) 2007-05-17 2008-05-30 Multilayer UV-curable adhesive film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007131324 2007-05-17
JP2007-131324 2007-05-17

Publications (1)

Publication Number Publication Date
WO2008143099A1 true WO2008143099A1 (ja) 2008-11-27

Family

ID=40031808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058867 WO2008143099A1 (ja) 2007-05-17 2008-05-14 積層配線基板及びその製造方法

Country Status (7)

Country Link
US (1) US8502086B2 (ja)
EP (1) EP2157842B1 (ja)
JP (1) JP4955763B2 (ja)
KR (1) KR101116712B1 (ja)
CN (1) CN101683007B (ja)
TW (2) TW200904291A (ja)
WO (1) WO2008143099A1 (ja)

Cited By (3)

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JP2011138862A (ja) * 2009-12-28 2011-07-14 Fujikura Ltd 多層配線板及びその製造方法
JP2014239258A (ja) * 2012-12-27 2014-12-18 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵印刷回路基板の製造方法
WO2017212934A1 (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法

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KR20110113980A (ko) * 2010-04-12 2011-10-19 삼성전자주식회사 필름을 포함한 다층 인쇄회로기판 및 그 제조 방법
KR101156854B1 (ko) * 2010-05-03 2012-06-20 삼성전기주식회사 반도체 패키지 기판 및 그 제조방법
KR20120009705A (ko) 2010-07-20 2012-02-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 수지의 제조방법 및 방향족 액정 폴리에스테르 수지 컴파운드의 제조방법
JP2012169486A (ja) * 2011-02-15 2012-09-06 Fujikura Ltd 基材、配線板、基材の製造方法及び配線板の製造方法
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JP6151724B2 (ja) * 2013-01-30 2017-06-21 京セラ株式会社 実装構造体の製造方法
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CN107709418B (zh) * 2015-05-08 2021-04-27 汉高知识产权控股有限责任公司 可烧结的膜和膏及其使用方法
CN106356355B (zh) * 2015-07-15 2020-06-26 恒劲科技股份有限公司 基板结构及其制作方法
JP2016105512A (ja) * 2016-03-01 2016-06-09 京セラサーキットソリューションズ株式会社 配線基板の製造方法
JP6700207B2 (ja) * 2017-02-08 2020-05-27 矢崎総業株式会社 印刷回路の電気接続方法
JP7075785B2 (ja) * 2018-03-08 2022-05-26 スタンレー電気株式会社 回路基板、電子回路装置、および、回路基板の製造方法
CN110798977B (zh) * 2018-08-01 2021-03-23 鹏鼎控股(深圳)股份有限公司 薄型天线电路板及其制作方法
CN112449514B (zh) * 2019-08-31 2022-12-20 鹏鼎控股(深圳)股份有限公司 多层线路板及其制作方法
JP7031955B2 (ja) * 2019-09-10 2022-03-08 Ｆｉｃｔ株式会社 回路基板の製造方法
CN115284696B (zh) * 2022-08-11 2023-07-25 业成科技（成都）有限公司 复合光学膜结构及其制造方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138862A (ja) * 2009-12-28 2011-07-14 Fujikura Ltd 多層配線板及びその製造方法
JP2014239258A (ja) * 2012-12-27 2014-12-18 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子部品内蔵印刷回路基板の製造方法
WO2017212934A1 (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法
JP2017220612A (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法

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TW200904291A (en) 2009-01-16
US20100147576A1 (en) 2010-06-17
JPWO2008143099A1 (ja) 2010-08-05
EP2157842B1 (en) 2018-03-14
CN101683007A (zh) 2010-03-24
KR101116712B1 (ko) 2012-03-13
CN101683007B (zh) 2011-12-28
US8502086B2 (en) 2013-08-06
EP2157842A1 (en) 2010-02-24
KR20100008005A (ko) 2010-01-22
TW200941656A (en) 2009-10-01
JP4955763B2 (ja) 2012-06-20

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