WO2007125861A1 - ソルダペースト - Google Patents
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- WO2007125861A1 WO2007125861A1 PCT/JP2007/058728 JP2007058728W WO2007125861A1 WO 2007125861 A1 WO2007125861 A1 WO 2007125861A1 JP 2007058728 W JP2007058728 W JP 2007058728W WO 2007125861 A1 WO2007125861 A1 WO 2007125861A1
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- Prior art keywords
- powder
- solder
- temperature
- mass
- solder paste
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/09—Mixtures of metallic powders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Definitions
- the present invention relates to a solder paste in which a solder powder that is excellent in heat resistance used for connecting electronic devices and can obtain high reliability in a high temperature state and a soldering flux are mixed.
- An electronic device is a device in which electronic components are arranged on a circuit such as a printed circuit board and have a specific function.
- the electronic component and circuit such as a printed circuit board can be bonded at a low temperature. Since soldering reliability is high, solder has been used for a long time.
- electronic components used in electronic equipment require terminals to be bonded to printed circuit boards, such as component leads, where the component elements that perform the original function of the component and terminals such as component leads are to be bonded inside the electronic component. Even solder is used.
- solder alloys of Sn and Pb used for soldering electronic devices solder alloys having a low melting temperature and Sn near 60% are used.
- the composition of Sn63-Pb37 has the same solidus temperature and liquidus temperature of 183 ° C, so there are few cracks during solder cooling. The lowest melting temperature among Sn and Pb solder alloys. For this reason, electronic components are less widely damaged by heat, and generally speaking, Sn63_Pb37 solder alloy is widely used to describe solder.
- solder alloy when Sn63-Pb37 solder alloy is used for internal joining of electronic components, the solder melts and shorts inside the electronic components due to heating for manufacturing electronic devices, The lead may come off and function as an electronic component may not be performed. For this reason, solder with a higher melting temperature than Sn63-Pb37 solder alloy is used as the solder for internal joining of electronic components.
- solder alloys are called high-temperature solders because they have a higher melting temperature than solders such as Sn63-Pb37 used for soldering printed boards.
- the composition of high-temperature solder used for internal bonding of electronic components is Pb—lOSn (solidus temperature). 268 ° C, liquidus temperature 302 ° C), Pb_ 5Sn (solidus temperature 307 ° C, liquidus temperature 313 ° C), Pb_2Ag_8Sn (solidus temperature 275 ° C, liquidus temperature 346 ° C), Pb_ 5Ag (solidus temperature 304 ° C, liquidus temperature 365 ° C), etc., mainly Pb.
- soldering temperature using Sn63_Pb37 eutectic solder used for soldering printed circuit boards is slightly higher at 230 ° C, Pb_lOSn etc.
- the soldered parts inside electronic components soldered with high-temperature solders do not melt when soldering printed circuit boards.
- soldering used for internal joining of electronic components is performed by reflow soldering that enables fine soldering because the joint portion is fine.
- There are several methods for attaching the solder paste to the soldering part such as a method of printing and coating, a method of discharging the solder paste using a dispenser, and a method of transferring the solder paste on a transfer pin.
- the solder paste used for reflow soldering is a mixture of solder powder and soldering flux. As the electronic components become smaller, the solder powder used in the solder paste is finer. It has become to. These fine solder powders require a clean solder powder whose surface is easily oxidized.
- Pb-free solder is a combination of two or more elements such as Sn, Ag, Sb, Cu, Zn, Bi, h, Ni, Cr, Fe, P, Ge, and Ga.
- Binary Pb-free solders include Sn-3.5Ag (eutectic temperature 221 ° C), Sn-5Sb (eutectic temperature 240.C), Sn-0.75Cu (eutectic temperature 227 ° C), Sn-58Bi (eutectic temperature 139 ° C), Sn-52In (eutectic temperature 117 ° C), etc.
- Pb-free solders that are widely used are Sn-3Ag-0-5 Cu (solidus temperature 217 ° C, liquidus temperature 220 ° C), Sn-8Zn-3Bi (solidus temperature 190 ° C, liquidus temperature 197 ° C), Sn-2, 5Ag- 0.5Cu-IBi (solidus temperature 214 ° C, liquidus temperature 221 ° C). These lead-free solders have a higher melting temperature of the solder alloy near 40 ° C than the conventional Sn63-Pb37 solder alloy.
- high-temperature solder for internal joining of electronic components high-temperature solder in which Sn and In are added to Zn, Al, and Ge and high-temperature solder in which Sn and In are added to Zn, Al, Ge, and Mg are also disclosed. Yes.
- Patent Document 1 Japanese Patent Laid-Open No. 2002-254194
- High-temperature solder having a higher melting temperature than solder alloys used for soldering printed circuit boards has been used for internal joining of electronic components.
- the force that has led to the regulation of the use of Pb on a global scale has not been developed.
- High-temperature solders that do not contain Pb have not been developed.
- High-temperature solders that contain Sn and In and high-temperature solders that contain Sn, In, and Zn, Al, Ge, and Mg are known.
- the main component is Zn. Since A1 and A1 are easily oxidized, a thick oxide film is formed on the surface of the solder powder, so that the wettability is very bad. Even when used as a solder paste mixed with flux, soldering defects will occur. Shimare, power that is not at a level that can be used at all.
- Patent Document 1 of a high-temperature solder characterized by having Sn balls and Cu balls as high-temperature solders that are joined by an intermetallic compound without melting into a single composition is also disclosed. Unlike general soldering, it does not completely melt the solder into a single component. By melting only Sn, which has a low melting temperature, an intermetallic compound of Cu and Cu6Sn5 is formed. The ball is to be joined with an intermetallic compound having a high melting temperature. In other words, with this soldering method, only Sn balls are melted, Cu is not melted, and only used as a dispersion.
- the high-temperature solder of Patent Document 1 has a problem that it has no self-alignment effect.
- Self-alignment effect is caused by reflow soldering, etc.Mounter accuracy is poor and chip parts etc. are mounted with misalignment.
- the solder melts and gets wet with lands and electronic components the chip component is pulled by the surface tension and returned to its original position.
- Such effects do not appear in conductive adhesives, which is why solder is widely used for joining electronic components.
- the problem to be solved by the present invention is that a high-temperature solder that is bonded by an intermetallic compound that has been established in theory but has not been put into practical use is used at a temperature of about 300 ° C or less, which is a heat resistant temperature of a chip component. It is to provide a solder paste that can be bonded with high strength without causing poor wetting even when used.
- the metal that inhibits diffusion to Sn on the surface of the Cu powder used in the present invention has a solid solution in Sn, a melting temperature higher than Sn, and a solid solution in Sn. For example, it does not hinder adhesiveness.
- metals include Sn, Sb, Au, Ag, Cu, Pt, Pd, Fe, Ni, and Co.
- a barrier effect is achieved by coating the Cu powder surface. In contrast to these metal coatings, organic coatings such as rosin and flux Then, it melts when heated and does not show an effect as a barrier.
- Ni is suitable as a metal that satisfies the conditions that the melting temperature is higher than Sn, the solid solution rate in Sn is slow, and the solderability when Sn is dissolved is good. .
- Ni has a melting point of 1453 ° C, and has a characteristic that it dissolves in Sn but has a slow solid solution rate. It is also a metal with excellent solderability that has been used for the base of Au plating. In addition, Ni has the effect of improving solderability when dissolved in Sn in the solder.
- Ni In a high-temperature solder paste using Sn powder and Cu powder according to the present invention, when a Ni coating is formed on the Cu powder, Ni gradually dissolves in the Sn melted by heating. Since the Ni coating dissolves in Sn and breaks, Sn and Cu come into contact with each other to form a Cu Sn metal compound
- the present invention prevents the formation of an intermetallic compound of Sn and Cu by providing a Ni coating barrier layer on the surface of Cu powder, and the time for Sn to sufficiently wet the printed circuit board lands and the terminals of electronic components. By ensuring this, it becomes possible to improve the wettability of the printed circuit board lands and electronic component terminals.
- Ni film used in the present invention is preferably formed by plating.
- Ni plating can be either electrolytic plating or electroless plating.
- Electroless plating is suitable as a fine powder plating method, but it is necessary to pay attention to the effect of electroless plating because it contains P. P improves wettability during soldering, but forms a hard alloy layer at the soldering interface. Therefore, it is necessary to prevent the P content from increasing abnormally. When the P content is less than 10% by mass, the effect of P on electroless plating is negligible.
- the Ni film is formed on the surface of the Cu powder, the Sn can be sufficiently wetted to the land of the printed circuit board and the terminal of the electronic component. Therefore, the Ni film formed on the surface of the Cu powder. If the film is too thin, the barrier effect will not appear, and if the Ni film is too thick, the Sn film will remain on the Cu surface even after Sn has sufficiently wetted the printed circuit board lands and the terminals of the electronic components. Interfering with the formation of intermetallic compounds.
- the Ni content of the Ni plating formed on the surface of the Cu powder is preferably 0.2 to 2.0 mass% of the entire Cu powder.
- the content of Ni of the Ni plating is 1.0 to 2 of the entire Cu powder, it is when the 0 mass 0/0.
- the Sn powder or Sn-based lead-free solder powder used in the present invention must be wetted to the land of the printed circuit board or the terminal of the electronic component at the time of melting, and is melted at a heating temperature for generating an intermetallic compound. Is required. For this reason, Sn powder may be used, but it may be powdered as an alloy by mixing other metals as long as it is melted at the heating temperature for producing the metal compound.
- General lead-free solder is an alloy made by mixing a metal that dissolves in Sn into an alloy, and has better wettability to printed circuit board lands and terminals of electronic components than Sn alone. Ag, Cu, Sb, Bi, In, Zn, etc. are conceivable as metals that can be dissolved in Sn.
- Sn-free solder and alloys include Sn-Ag, Sn-Cu, Sn-Sb. Sn-Bi, Sn-In, and Sn-Zn solder alloys.
- Sn—In and Sn—Zn based solder alloys that are highly oxidized are suitable for the present invention.
- a strength additive element can be added to Sn powder or Sn-based lead-free solder powder within a range that melts at a heating temperature for producing a metal intermetallic compound.
- Strength addition elements suitable for the present invention include Ag, Cu, Sb, Bi, Zn, Al, Fe, Co, Ni, and Cr. These are dispersed in the Cu Sn metal compound formed by heating.
- the total amount of elements added with strength-added elements to improve soldering strength is 1.0% by mass or less.
- Fe, Co, Ni, Cr, etc. form an intermetallic compound with Sn, and if added in a large amount immediately, the strength is reduced.
- the same effect can be obtained even when Ag powder is used in addition to Cu powder as a high temperature powder that does not melt at the heating temperature.
- Ag is easier to dissolve in Sn than Cu, and the formation of intermetallic compounds is quicker after the noble layer begins to elute. Therefore, when using Ag powder as the high-temperature powder, it is necessary to make the barrier layer thicker than Cu.
- the Ni content of the Ni plating is good when it is 0.5 to 3.0% by mass of the whole Ag powder, and is most preferable when it is 2.0 to 3.0% by mass. .
- the Sn powder melts by heating and wets the land of the printed circuit board and the terminals of the electronic component, and the Ni plating coating dissolves in Sn. As a result, the Ag Sn intermetallic compound is formed and grows.
- the land of the printed circuit board and the terminal of the electronic component are wet.
- Sii powder but also Sn-based lead-free solder alloys such as Sn_Ag, Sn-Cu, Sn_Sb, Sn_Bi can be used as the melting point metal.
- these Sn-based lead-free solder alloys contain 1.0% by mass in total of one or more strength-enhancing elements selected from Ag, Cu, Sb, Bi, Zn, AI, Fe, Co, Ni, and Cr. You may add below.
- the ratio of Sn powder or Sn-based lead-free solder powder, which is a low melting point powder, and Ni plating Cu powder or Ni-plated Ag powder, which is a high melting point powder, is Sn powder or Sn-based lead-free solder powder.
- 60 to 80% by mass, and Ni plating Cu powder or Ni-plated Ag powder is preferably 20 to 40% by mass. More preferably, the Sn powder or Sn-based lead-free solder powder is 70 mass%, and the Ni plating Cu powder or Ni plating Ag powder is 30 mass%.
- Ni is the most preferable metal to be coated in the present invention, but the above-mentioned Sn, Sb, Au, Ag, Cu, Pt, Pd, Fe, Co, and the like can also be used.
- the feature of the present invention is that Cu, Ag, etc. are used in high-temperature solders that use low melting point metal powders such as Sn and Sn-based lead-free solder and In and high melting point metal powders such as Cu and Ag, and are joined by intermetallic compounds.
- By providing a barrier layer on the surface of the refractory metal powder it is possible to create a time difference in the formation of intermetallic compounds, and to make low melting point metals such as Sn and In easily wet the printed circuit board lands and electronic component terminals.
- the present invention relates to Sn powder or Sn-based lead-free solder powder and Cu and Ag powder by bonding with Cu and Ag powder, by coating the surface of Cu and Ag powder with Sn and Cu.
- this is a method for soldering electronic components in which the initial generation of an intermetallic compound of Sn and Ag is suppressed, and soldering is performed by sufficiently wetting the Sn and Sn-based lead-free solder and the object to be joined.
- the Sn or Sn-based lead-free solder continues to be melted until the plating film is dissolved in Sn on the surface of the Cu or Ag powder and the plating film is broken. Is in contact with For this reason, when the present invention is used, the contact time between the solder alloy and the land of the printed circuit board or the terminal of the electronic component becomes long, so that a rotational moment between the electronic component and the land is generated, which is a problem in Patent Document 1.
- the effect of correcting the misalignment of the electronic part crystal by the solder paste called the self-alignment effect, occurs.
- the invention's effect [0026]
- a high-temperature solder that is bonded by an intermetallic compound that has been established in theory but has not been put into practical use is used at a heat resistant temperature of about 300 ° C or less, which is the heat resistance temperature of chip components.
- a heat resistant temperature of about 300 ° C or less, which is the heat resistance temperature of chip components.
- FIG. L Sn- 3. 0 wt% eight ⁇ 0. 5 wt% 01 powder 70 wt% and Cu- 1. 0 wt% ⁇ DSC chart of the mixed powder powder powder 30 wt%
- solder paste of the present invention and the solder paste of the comparative example were produced by the following procedure.
- High melting point powder powder particle size 2 ⁇ : 15 ⁇ m, powder coating is all ⁇ 95 mass% P5 mass % Electroless plating
- the low melting point alloy powder and the high melting point powder are mixed as follows.
- Example 1 Sn powder + Cu—0.2 mass% ⁇ powder
- Example 2 Sn powder + Cu—2.0 mass% ⁇ powder
- Example 3 Sn-3.5 mass% 8 ⁇ powder + Cu—0.2 mass ° ⁇ 1 powder
- Example 4 Sn-3.5% by mass 8 ⁇ powder + Cu—1.0% by mass Ni powder
- Example 5 Sn-3.5% by mass 8 ⁇ powder + Cu—1.5% by mass Ni powder
- Example 6 Sn-3.5% by mass, 8 ⁇ powder + Cu—2.0% by mass Ni powder
- Example 7 Sn-0.7 mass% 01 powder + Cu—1.0 mass% Ni powder
- Example 8 311_5 mass% 31) powder + 01_1.0 mass% Ni powder
- Example 9 Sn—58 mass% 81 powder + Cu—1.0 mass% 1 ⁇ powder
- Example 10 Sn- 3.5 wt% eight ⁇ one 0.5 wt% Ji 1 powder + Cu4.0 wt% Ni powder
- Example 11 Sn- 58 wt% 81- 0, 8 wt% eight ⁇ powder + Cu- 1.0 mass % 1 ⁇ powder
- Example 12 Sn—0.7 mass% 01—0.3 mass% 31) Powder + Cu—1.0 mass% Ni powder
- Example 13 Sn—5 mass% 31) —0.05 mass Ni—0.1 mass ° / 0 powder + Cu4.0 mass% Ni powder
- Example 14 Sn powder + Ag—0.5 mass% Ni powder
- each mixed powder 1260g of low melting point alloy powder and 540g of high melting point powder are put into a stirrer and mixed for 5 minutes.
- the amount of intermetallic compound produced in the solder paste produced in Example 1 is measured by the amount of heat absorbed by DSC.
- the first solidus temperature, the first peak temperature, and the endothermic amount at the first peak temperature were measured with DSC (differential calorimeter). 2Measure the endotherm at the solidus temperature, second peak temperature, and second peak temperature.
- DSC was measured using a differential calorimeter manufactured by SII at a heating rate of 5 ° C / min.
- Table 1 shows the first solidus temperature, first peak temperature, second solidus temperature, second peak temperature, first heat quantity, and second heat quantity as a result of DSC measurement of the solder pastes of the examples and comparative examples. . Comparing Example 1 and Examples 3 to 6 with the corresponding Ni-plated composition, Comparative Example 1 and Comparative Example 3 show that Example 1 and Examples 3 to 6 are the first heat quantity, 2 The amount of heat is less than that of Comparative Example 1 and Comparative Example 3, and it can be seen that Sn, Sn—Ag and Cu react smoothly.
- Examples 1 and 3 to 6 and the corresponding Ni plating formation are thick compositions.
- the second calorific value is hardly detected. This indicates that in Comparative Example 2 and Comparative Example 4, the reaction of Sn and Sn_Ag with Cu almost progressed.
- Fig. 2 shows a large second calorie peak
- Fig. 1 shows a gentle second calorie peak
- the second calorific value peak hardly appears.
- the appearance of the second calorific value peak indicates the formation of intermetallic compounds of Sn and Sn-Ag and Cu. Therefore, Fig. 2, which is a comparative example, shows a sharp intermetallicity between Sn and Sn-Ag and Cu.
- Fig. 3 shows no intermetallic compound of Sn and Sn-Ag and Cu
- Fig. 1 corresponding to Example 8 shows the relationship between Sn and Sn-Ag and Cu. It turns out that the intermetallic compound is produced
- the wettability of the solder paste is determined from the molten state of the solder pieces for each temperature and each heating time.
- solder pieces that are poorly wetted are not round, whereas when Cu powder and Ag powder are plated with Ni, 0.2% by mass But the solder pieces are rounded.
- solder composition of the low melting point powder varies, the solder pieces that are plated with 1.0 mass% Ni on the surface of the Cu powder and Ag powder are spherical.
- Omm 3216-size chip lands on a squeegee, intentionally tilted about 10 °, using a metal mask dedicated to cell alignment effects.
- Judgment criterion is that chip is completely returned.
- the tip has moved back but has moved ⁇
- the chip did not move X
- Table 1 shows the results of the self-alignment effect.
- the electronic device substrate is soldered with the solder paste manufactured in Example 1, and then the printed circuit board is reversed, and reflow is performed under the general reflow conditions of lead-free solder, and the electronic component falls. Find out. Measure the pull strength of soldering the board
- the board of the electronic device is soldered with the solder paste manufactured in Example 1, and the shear strength of the soldering is measured.
- Table 3 shows the measurement results. Generally, it is said that there is no problem if the bonding strength of electronic equipment is 50N or more. Therefore, the material using Cu powder coated with Ni had the same or better initial bonding strength than any other case.
- solder paste obtained by coating the refractory metal of the present invention with Ni has a self-alignment effect that has good wettability with respect to the electrodes of the printed circuit board lands and the electronic components. However, soldering with good joint strength can be obtained. This solder paste does not melt when used for step soldering, and can be used as a substitute for high-temperature solder.
- the metal layer covering the high melting point powder used in the solder paste of the present invention can be not only a single layer but also a plurality of layers.
- AuZNi plating and PdZNi plating can be considered. Since the adhesion of Au and Pd formed on these Ni has good wettability to Sn, Cu It is possible to improve the dispersion of high melting point powder of Ag and Ag into Sn.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200780023893XA CN101479073B (zh) | 2006-04-26 | 2007-04-23 | 焊膏 |
EP07742163.4A EP2017031B1 (en) | 2006-04-26 | 2007-04-23 | Solder paste |
JP2008513190A JP4826630B2 (ja) | 2006-04-26 | 2007-04-23 | ソルダペースト |
KR1020087028952A KR101233926B1 (ko) | 2006-04-26 | 2007-04-23 | 솔더 페이스트 |
US12/226,653 US8388724B2 (en) | 2006-04-26 | 2007-04-23 | Solder paste |
Applications Claiming Priority (2)
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JP2006121684 | 2006-04-26 | ||
JP2006-121684 | 2006-04-26 |
Publications (1)
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WO2007125861A1 true WO2007125861A1 (ja) | 2007-11-08 |
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PCT/JP2007/058728 WO2007125861A1 (ja) | 2006-04-26 | 2007-04-23 | ソルダペースト |
Country Status (6)
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---|---|
US (1) | US8388724B2 (ja) |
EP (1) | EP2017031B1 (ja) |
JP (1) | JP4826630B2 (ja) |
KR (1) | KR101233926B1 (ja) |
CN (1) | CN101479073B (ja) |
WO (1) | WO2007125861A1 (ja) |
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Also Published As
Publication number | Publication date |
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JP4826630B2 (ja) | 2011-11-30 |
EP2017031A1 (en) | 2009-01-21 |
US20090220812A1 (en) | 2009-09-03 |
CN101479073A (zh) | 2009-07-08 |
JPWO2007125861A1 (ja) | 2009-09-10 |
EP2017031B1 (en) | 2017-09-13 |
CN101479073B (zh) | 2013-09-18 |
KR101233926B1 (ko) | 2013-02-15 |
EP2017031A4 (en) | 2012-04-18 |
KR20090007770A (ko) | 2009-01-20 |
US8388724B2 (en) | 2013-03-05 |
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