WO2007116649A1 - ニッケルインク - Google Patents
ニッケルインク Download PDFInfo
- Publication number
- WO2007116649A1 WO2007116649A1 PCT/JP2007/055995 JP2007055995W WO2007116649A1 WO 2007116649 A1 WO2007116649 A1 WO 2007116649A1 JP 2007055995 W JP2007055995 W JP 2007055995W WO 2007116649 A1 WO2007116649 A1 WO 2007116649A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ink
- nickel
- particles
- dispersion medium
- conductor film
- Prior art date
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 141
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 70
- 239000002245 particle Substances 0.000 claims abstract description 41
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002612 dispersion medium Substances 0.000 claims abstract description 22
- 238000007641 inkjet printing Methods 0.000 claims abstract description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000009835 boiling Methods 0.000 claims abstract description 7
- 239000007822 coupling agent Substances 0.000 claims abstract description 6
- PKTOVQRKCNPVKY-UHFFFAOYSA-N dimethoxy(methyl)silicon Chemical compound CO[Si](C)OC PKTOVQRKCNPVKY-UHFFFAOYSA-N 0.000 claims abstract description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 20
- 238000000576 coating method Methods 0.000 claims description 18
- 238000010304 firing Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- -1 alkoxy ethanol Chemical compound 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 11
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000011164 primary particle Substances 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N EtOH Substances CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract description 5
- 150000002815 nickel Chemical class 0.000 abstract 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 17
- 239000006087 Silane Coupling Agent Substances 0.000 description 16
- 239000002904 solvent Substances 0.000 description 15
- 239000002002 slurry Substances 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- 239000003607 modifier Substances 0.000 description 7
- 239000003960 organic solvent Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000002082 metal nanoparticle Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000012300 argon atmosphere Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052614 beryl Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Definitions
- the present invention relates to a nickel ink.
- the present invention also relates to a conductor film formed by firing a coating film of the nickel ink and a method for producing the conductor film.
- the method of directly printing a conductive metal ink on a substrate by an ink jet method or the like has a smaller number of processes than a circuit pattern forming technique using a photolithography method that has been widely used conventionally.
- this conventional method for example, as a method of forming a circuit pattern on various substrates, there is a photolithography method disclosed in Patent Document 3.
- circuit formation technology using conductive ink by the ink jet printing method or dispenser coating method has not been widely spread. This is mainly because of the following reasons (i) to (ii).
- the formed conductor film lacks adhesion to various substrates, the basic characteristics as a circuit board cannot be satisfied in the first place!
- the formed conductor film has insufficient surface smoothness.
- a circuit is a laminated structure including a base material layer, the field of application is limited in various ways unless the surface of the conductor film is sufficiently smooth. For example, even if an attempt is made to form a heterogeneous component layer on the surface of a rough conductor film, the heterogeneous component layer may not be able to maintain good film thickness uniformity due to the influence of the roughness of the underlying conductor film surface. Arise.
- the above-mentioned problem (i) is greatly contributed by the characteristics of the dispersion medium side constituting the conductive ink.
- the reason for this is that the adhesion between the conductive film formed by heating and baking the printed ink and the substrate depends on the chemical reaction between the binder component contained in the dispersion medium and the substrate. That's it.
- the problem (ii) is thought to be due to the contribution of both the properties of the metal powder (metal particles) constituting the conductive ink and the dispersion medium. Specifically, it is clear that a conductive film having a smooth surface cannot be formed if the metal particles themselves are rough. In addition, the surface of the conductive film cannot be smoothed if the dispersion medium evaporates during firing of the printed ink and the generation of gas that diffuses from the inside of the conductive film becomes severe.
- Patent Document 4 discloses the use of a silane coupling agent having a mercapto group or an amino group.
- gold, silver, platinum, copper, and palladium are used as metal particles, and nickel is not used.
- the ink described in Patent Document 4 is a paste having a relatively high viscosity, so it is difficult to say that it is suitable for inkjet printing.
- Patent Document 1 Japanese Patent Laid-Open No. 2002-334618
- Patent Document 2 Japanese Patent Laid-Open No. 2002-324966
- Patent Document 3 Japanese Patent Laid-Open No. 9-246688
- Patent Document 4 JP-A-2004-179125
- An object of the present invention is to provide a nickel fine particle-containing ink that can eliminate the various drawbacks of the above-described prior art.
- the present invention is a nickel ink in which nickel particles are dispersed in a dispersion medium and containing a methyldimethoxysilane coupling agent, and the dispersion medium has a boiling point of 300 ° C or less at room temperature.
- Glycol, C3-C10 alkoxyethanol and C2-C8 ether The present invention provides a nickel ink containing selenium.
- the present invention is a conductor film formed by firing the above-mentioned nickel ink coating film, having an average surface roughness Ra force SlOnm or less and a maximum surface roughness Rmax 200 nm or less. Is to provide.
- the present invention provides a method for producing a conductor film, characterized in that a coating film formed by applying the above nickel ink on a substrate is baked at 150 to 950 ° C.
- the ink of the present invention is a conductive ink containing nickel fine particles, that is, a nickel ink.
- a conductor film formed using nickel ink has been required to have an average surface roughness Ra force SlOnm or less and a maximum surface roughness Rmax 200 nm or less from the field of application. Therefore, in the present invention, on the premise that nano nickel particles are used, the composition of the nickel ink is made specific so that the conductor film formed using the ink can be adhered to various substrates. It was possible to increase. This conductor film exhibits low electrical resistance and excellent surface smoothness.
- the nickel ink of the present invention is obtained by dispersing nickel particles in a dispersion medium.
- the ink contains a silane coupling agent having a specific structure.
- the nickel particles contained in the ink preferably have an average primary particle size of 3 to 150 nm, and particularly preferably 3 to 30 nm.
- the average surface roughness Ra and the maximum surface roughness Rmax of the conductor film formed in this way can be reduced. Further, when the ink of the present invention is used in an ink jet printing method or the like, the nozzle clogging force S is prevented. Furthermore, it is possible to reduce the film thickness of the wiring and electrode made of the conductor film formed using the ink of the present invention, and it is possible to easily form the fine wiring and the fine electrode.
- fine nickel particles for example, NN-20 (trade name), which is a nano nickel particle commercially available by the present applicant, can be used.
- the average primary particle diameter of the nickel particles is obtained by measuring the particle diameters of at least 200 particles contained in one field of view through observation with a scanning electron microscope, and integrating and averaging them. .
- the average primary particle size of the nickel particles is small means that the particles are fine. It becomes the basis. However, even when the particles are fine particles, aggregation of the particles proceeds in the ink, and when the particle size as the secondary structure increases, the smoothness of the surface of the conductor film decreases. In addition, when the ink of the present invention is used in an ink jet printing method, nozzle clogging may occur. From these viewpoints, it is preferable that the maximum particle diameter of the aggregated particles as the secondary structure of nickel particles in the ink is 0.45 m or less.
- the shape of the nickel particles is not particularly limited. Nickel particles are generally spherical. In addition, unless the ink changes over time, the sintering characteristics deteriorate, or the resistance of the formed conductor film increases, the surface of the nickel particles is treated with oleic acid or stearic acid. You can also handle it!
- the amount of nickel particles in the ink is preferably 3 to 70% by weight, more preferably 5 to 70% by weight, more preferably 5 to 65% by weight, particularly preferably 5 to 60% by weight, and most preferably. 5-30% by weight.
- the ink of the present invention is characterized in that it contains a silane coupling agent having a specific structure, that is, a methyldimethoxysilane coupling agent.
- a silane coupling agent having a specific structure that is, a methyldimethoxysilane coupling agent.
- the methyldimethoxysilane coupling agent has a linear structure with respect to the arrangement of methoxy groups when considered centered on Si, and therefore shrinkage during firing mainly occurs in the two-dimensional direction. .
- the degree of contraction of the coating film is reduced as compared with the case of contracting in three dimensions, and the surface smoothness of the coating film is inherited by the conductor film.
- the only group leaving during firing is the methyl group in the two methoxy groups, the amount of gas generated during firing is reduced, which makes the coating film less susceptible to damage. This also inherits the surface smoothness of the coating film to the conductor film.
- the silane coupling agent used in the present invention may have one reactive functional group bonded to Si in addition to one methyl group and two methoxy groups.
- the present invention The silane coupling agent used in the past has the reactive functional group! / When speaking, there is no particular limitation on the type of the reactive functional group.
- an alkyl group, amino group, epoxy group, beryl group, styryl group, attaryloxy group, methacryloxy group, and the like can be used.
- Examples of the alkyl group include those having 1 to 16, particularly 1 to 8 carbon atoms.
- Examples of the amino group include 3-aminopropyl group, N-2 (aminoethyl) 3-aminopropyl group, N-phenyl-3-aminopropyl group, and the like.
- Examples of the epoxy group include a 3-glycidoxypropyl group and a 2- (3,4-epoxycyclohexyl) ethyl group.
- the amount of the silane coupling agent used in the present invention is determined in relation to the amount of nickel particles contained in the ink. Specifically, it is preferable that the silane coupling agent is blended so that the weight ratio of the silane coupling agent CKKENORE particles is 0.1 to 0.5, particularly 0.2 to 0.4. By setting the blending amount of the silane coupling agent within this range, the adhesion between the conductor film formed by firing the ink of the present invention and the substrate is sufficiently high, and the surface smoothness of the conductor film is improved. High enough. In addition, the conductivity of the conductor film is sufficiently high.
- the weight ratio of the silane coupling agent to the nickel particles is as described above, but the concentration of the silane coupling agent itself in the ink is 0.4 to 40% by weight, provided that the above weight ratio is satisfied. In particular, it is preferably 1 to 40% by weight, particularly 1 to 25% by weight.
- the ink of the present invention is obtained by dispersing the above-described nickel particles in a dispersion medium.
- a dispersion medium one or more organic solvents can be used.
- the main solvent in the dispersion medium Daricols having a boiling point of 300 ° C or less at normal pressure (1 atm) are used. If a material having a boiling point exceeding 300 ° C is used, when the ink coating film is baked, the dispersion medium may be gasified with the baking, and this gas may cause minute cracks or voids in the film. As a result, it is not easy to increase the adhesion strength with various substrates that are difficult to form a dense conductor film. Also, the electrical resistance of the conductor film tends to increase.
- the main solvent does not necessarily mean the organic solvent having the highest ratio when the dispersion medium is composed of two or more organic solvents.
- the ink of the present invention for the purpose of smoothly proceeding the hydrolysis of the silane coupling agent described above, It is preferable that a small amount of water is contained.
- glycols include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene dallicol, propylene glycol, trimethylene glycol, dipropylene glycol, tripropylene glycol, 1,2-butylene glycol, 1, 3 -Butylene glycolol, 1,4-butylene glycolol, pentamethylene glycol, hexylendanol, and the like. These can be used alone or in combination of two or more. Of these, those having a viscosity at room temperature (20 ° C) of lOOmPa'sec or less are preferable. This is because when the viscosity is too high, it is difficult to adjust the viscosity suitable for inkjet. It is particularly preferable to use ethylene glycol, diethylene glycol, propylene glycol, or 1,4-butylene glycol as the darikols, and it is particularly preferable to use ethylene glycol.
- the main solvent is preferably blended in the ink of the present invention in an amount of 10 to 80% by weight, more preferably 35 to 80% by weight, and still more preferably 35 to 70% by weight.
- the ink of the present invention contains, as a dispersion medium, another organic solvent in addition to the main solvent described above.
- Other organic solvents mainly function as surface tension modifiers and viscosity modifiers.
- an organic solvent that functions as a surface tension adjusting agent or a viscosity adjusting agent By including in the ink an organic solvent that functions as a surface tension adjusting agent or a viscosity adjusting agent, the surface tension and viscosity of the ink of the present invention are in an appropriate range for the S inkjet printing method.
- the organic solvent used as a surface tension modifier or viscosity modifier is preferably compatible with the main solvent.
- a surface tension adjusting agent having a surface tension of 15 to 50 mN it is preferable to use one having a boiling point of 100 to 300 ° C. at normal pressure.
- alkoxyethanol having 3 to 10 carbon atoms is used as the surface tension adjusting agent.
- the use of strong alkoxyethanol is advantageous because the ink quality can be maintained over a long period of time.
- alkoxyethanol include 2-methoxyethanol, 2-ethoxyethanol, 2-propoxy réellenol, 2-n-butoxyethanol and the like.
- 2-n-butoxyethanol is preferable because the dispersibility of nickel particles becomes very good.
- the main solvent described above may also serve as the surface tension modifier. There is a case. In such a case, it is not necessary to add a surface tension adjusting agent separately from the main solvent.
- a viscosity modifier having a boiling point of 100 ° C to 300 ° C at normal pressure.
- the viscosity modifier preferably has a viscosity of 0.6 to 60 mPa ′ sec at 25 ° C.
- ether having 2 to 8 carbon atoms is used. Examples of such ethers include 1,4 dioxane, ⁇ -butyrolatatone, di- ⁇ -butyl ether and the like.
- the use of ⁇ -petit-latterone is preferable because the dispersibility of nickel particles becomes very good.
- the main solvent described above may also serve as the viscosity modifier. In such cases, it is not necessary to add a viscosity modifier separately from the main solvent.
- the amount of the surface tension adjusting agent and the viscosity adjusting agent are determined in relation to the amount of the main solvent.
- the surface tension adjusting agent is preferably blended so that the weight ratio of the surface tension adjusting agent to the main solvent is 0.3 to 1.2, particularly 0.7 to 1.2.
- the viscosity modifier is preferably blended so that the weight ratio of the viscosity modifier to the main solvent is 0.1 to 0.5, particularly 0.1 to 0.3.
- the weight ratio of the surface tension modifier to the main solvent is as described above.
- the concentration of the surface tension modifier itself in the ink is preferably 5 to 5 on condition that the weight ratio is satisfied. 60% by weight, more preferably 5 to 50% by weight, and still more preferably 20 to 50% by weight.
- the concentration of the viscosity modifier itself in the ink is preferably 1 to 50% by weight, more preferably 4 to 50% by weight, more preferably 4 to 30% by weight, provided that the above weight ratio is satisfied. %.
- the total amount of the dispersion medium including the main solvent, the surface tension adjusting agent and the viscosity adjusting agent described above is preferably 30 to 95% by weight, more preferably 70 to 95% by weight, based on the entire ink. .
- the ink of the present invention has a surface tension of 15 to 50 mNZm, particularly 20 to 40 mNZm, due to the blending of the above-described surface tension modifier and viscosity modifier, which is a kind of dispersion medium.
- Viscosity at 25 ° C is 0.6 to 60111? &'56 ( : Especially, 2-40111? &' 56 ( : It is necessary to have a surface tension and viscosity suitable for inkjet printing. I also like power.
- the ink of the present invention can be prepared, for example, by the following method. First, nickel particles and a dispersion medium are mixed to prepare a mother nickel slurry. Disperse the mother nickel slurry using a disperser. Next, after removing nickel agglomerated particles using a filter medium such as a membrane filter, the concentration of nickel particles is adjusted using a centrifuge. The nickel slurry thus obtained is mixed with a silane coupling agent and, if necessary, a surface tension adjusting agent and a viscosity adjusting agent, and mixed thoroughly. In this way, the desired nickel ink is obtained.
- the ink thus obtained is applied to various substrates such as glass, indium stannate (ITO), silver, copper, and silicon by an ink jet printing method or a dispenser coating method. Apply.
- the coating film formed by coating is preferably baked at 150 to 950 ° C, more preferably 200 to 400 ° C.
- firing atmosphere is preferably performed in a nitrogen atmosphere, an argon atmosphere, a hydrogen-nitrogen mixed atmosphere, or the like.
- Hydrogen When firing in a nitrogen-mixed atmosphere, the hydrogen concentration is preferably about 1 to 4% by volume. Whatever atmosphere is used, the firing time is preferably about 0.5 to 2 hours.
- the film obtained by firing has conductivity.
- This conductor film is smooth with an average surface roughness Ra of lOnm or less and a maximum surface roughness Rmax of 200 nm or less.
- the mother nickel slurry is measured with zircon beads (manufactured by Nitsukato Co., Ltd., 0.1 mm ⁇ ). Dispersion treatment was performed for 30 minutes using a paint shaker (manufactured by Asada Steel Corporation). Next, a dispersion treatment was performed with TK Fillmix (made by Tokushu Kika Kogyo Co., Ltd.), which is a high-speed emulsification dispersing machine, to obtain a nickel slurry in which nickel particles were dispersed.
- TK Fillmix made by Tokushu Kika Kogyo Co., Ltd.
- Aggregated particles contained in the resulting slurry were removed by passing through a membrane filter (Advantech Toyo Co., Ltd., pore size 0.45 m) to obtain a nickel slurry containing no coarse particles.
- the nickel slurry was adjusted to a nickel concentration of 21.0% by weight with a centrifuge. Next, the dispersion was further treated with T. K. Fillmix (manufactured by Tokushu Kika Kogyo Co., Ltd.) to obtain a nickel slurry having a concentration adjusted.
- T. K. Fillmix manufactured by Tokushu Kika Kogyo Co., Ltd.
- the concentration of the nickel particles in the ink is 10.5 wt 0/0, the concentration of the silane coupling agent is 2.6%, the concentration of 2-n-butoxyethanol 39.5%, the concentration of ⁇ Petit port Rataton 7 9%.
- the concentration of the dispersion medium was 39.5%.
- the viscosity of the obtained nickel ink was measured with a viscosity measuring device (VM-100A manufactured by Yamaichi Denki Co., Ltd.) and found to be 24 mPa ′ sec.
- the surface tension of the nickel ink was measured with a surface tension measuring device (DCW-100W manufactured by A & D Co.) and found to be 35 mNZm.
- a wiring pattern (line & space 100 ⁇ m, length 2 cm) on an alkali-free glass substrate (OA-10, manufactured by Nippon Electric Glass Co., Ltd.) ) was printed, the ink did not clog the nozzle.
- continuous printing 100 times and intermittent printing after leaving for a while are possible Met. When the wiring pattern was observed with an optical microscope, no disconnection or ink scattering was confirmed in the wiring pattern, and the wiring pattern was satisfactory.
- a nickel ink was formed on an alkali-free glass substrate (OA-10, manufactured by Nippon Electric Glass Co., Ltd.) using a spin coater (manufactured by MIKASA) under the condition of lOOOrpm for 10 seconds. Next, it was heated and dried at 100 ° C for 10 minutes in the atmosphere, and further heated and fired at 300 ° C for 1 hour in a hydrogen-nitrogen mixed atmosphere with a hydrogen content of 1% by volume to obtain a conductor film. .
- the film When the cross section of the conductor film was observed with a scanning electron microscope (FE-SEM, manufactured by FEI COMPANY), the film had a thickness of 00 nm.
- the measured resistivity of the conductive film at four-probe resistance measuring instrument Mitsubishii ⁇ Co. Loresta GP
- a flashing at 3. 8 X 10- 3 ⁇ 'cm .
- a nickel ink was obtained in the same manner as in Example 1 except that tetraethoxysilane (KBE-04 (trade name) manufactured by Shin-Etsu Silicone) was used as the silane coupling agent.
- the concentration of each component was the same as in Example 1.
- the nickel ink of the present invention is suitable for forming accurate and fine wiring and electrodes using a dispenser coating method and an ink jet printing method.
- Conductor films formed using ruink ink have excellent adhesion to various substrates and circuits formed from different elements.
- the conductor film formed using the nickel ink of the present invention is excellent in surface smoothness. Therefore, the nickel ink of the present invention is suitable for applications in which electrodes and wiring are formed on various substrates such as glass, indium tin oxide (ITO), silver, copper, and silicon.
- ITO indium tin oxide
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Non-Insulated Conductors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN2007800129792A CN101421363B (zh) | 2006-04-10 | 2007-03-23 | 含镍油墨 |
US12/296,449 US8012378B2 (en) | 2006-04-10 | 2007-03-23 | Nickel ink |
Applications Claiming Priority (2)
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JP2006107966A JP5065613B2 (ja) | 2006-04-10 | 2006-04-10 | ニッケルインク |
JP2006-107966 | 2006-04-10 |
Publications (1)
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WO2007116649A1 true WO2007116649A1 (ja) | 2007-10-18 |
Family
ID=38580948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2007/055995 WO2007116649A1 (ja) | 2006-04-10 | 2007-03-23 | ニッケルインク |
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US (1) | US8012378B2 (ja) |
JP (1) | JP5065613B2 (ja) |
CN (1) | CN101421363B (ja) |
TW (1) | TWI391451B (ja) |
WO (1) | WO2007116649A1 (ja) |
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JP2007332347A (ja) * | 2006-06-14 | 2007-12-27 | Samsung Electro-Mechanics Co Ltd | インクジェット用伝導性インク組成物 |
US9397341B2 (en) | 2012-10-10 | 2016-07-19 | Nthdegree Technologies Worldwide Inc. | Printed energy storage device |
US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
US9520598B2 (en) | 2012-10-10 | 2016-12-13 | Nthdegree Technologies Worldwide Inc. | Printed energy storage device |
US9786926B2 (en) | 2013-07-17 | 2017-10-10 | Printed Energy Pty Ltd | Printed silver oxide batteries |
US9825305B2 (en) | 2012-07-18 | 2017-11-21 | Printed Energy Pty Ltd | Diatomaceous energy storage devices |
US10221071B2 (en) | 2012-07-18 | 2019-03-05 | Printed Energy Pty Ltd | Diatomaceous energy storage devices |
US10396365B2 (en) | 2012-07-18 | 2019-08-27 | Printed Energy Pty Ltd | Diatomaceous energy storage devices |
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JP5548481B2 (ja) * | 2010-02-26 | 2014-07-16 | 新日鉄住金化学株式会社 | ニッケル微粒子含有インクジェット用組成物 |
CN101935480A (zh) * | 2010-09-29 | 2011-01-05 | 彩虹集团公司 | 一种导电油墨及其制备方法 |
JP5577229B2 (ja) * | 2010-12-16 | 2014-08-20 | 三井金属鉱業株式会社 | 粒子分散液 |
US8889471B2 (en) * | 2011-05-09 | 2014-11-18 | Sichuan Yinhe Chemical Co., Ltd. | Burnthrough formulations |
US9290671B1 (en) | 2012-01-03 | 2016-03-22 | Oceanit Laboratories, Inc. | Low cost semiconducting alloy nanoparticles ink and manufacturing process thereof |
US20150166810A1 (en) * | 2013-12-16 | 2015-06-18 | Nano And Advanced Materials Institute Limited | Metal Nanoparticle Synthesis and Conductive Ink Formulation |
JP6754852B2 (ja) * | 2019-01-11 | 2020-09-16 | Jx金属株式会社 | 導電性組成物 |
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JP2007332347A (ja) * | 2006-06-14 | 2007-12-27 | Samsung Electro-Mechanics Co Ltd | インクジェット用伝導性インク組成物 |
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US10961408B2 (en) | 2012-12-28 | 2021-03-30 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
US9416290B2 (en) | 2012-12-28 | 2016-08-16 | Nthdegree Technologies Worldwide Inc. | Nickel inks and oxidation resistant and conductive coatings |
US9815998B2 (en) | 2012-12-28 | 2017-11-14 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
US10329444B2 (en) | 2012-12-28 | 2019-06-25 | Printed Energy Pty Ltd | Nickel inks and oxidation resistant and conductive coatings |
US10673077B2 (en) | 2013-07-17 | 2020-06-02 | Printed Energy Pty Ltd | Printed silver oxide batteries |
US9786926B2 (en) | 2013-07-17 | 2017-10-10 | Printed Energy Pty Ltd | Printed silver oxide batteries |
Also Published As
Publication number | Publication date |
---|---|
US8012378B2 (en) | 2011-09-06 |
TWI391451B (zh) | 2013-04-01 |
JP2007281307A (ja) | 2007-10-25 |
CN101421363A (zh) | 2009-04-29 |
US20090053525A1 (en) | 2009-02-26 |
JP5065613B2 (ja) | 2012-11-07 |
TW200806760A (en) | 2008-02-01 |
CN101421363B (zh) | 2011-06-08 |
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