JP7044203B2 - 積層体、成形品、プリント配線板及び電磁波シールド - Google Patents
積層体、成形品、プリント配線板及び電磁波シールド Download PDFInfo
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- JP7044203B2 JP7044203B2 JP2021506342A JP2021506342A JP7044203B2 JP 7044203 B2 JP7044203 B2 JP 7044203B2 JP 2021506342 A JP2021506342 A JP 2021506342A JP 2021506342 A JP2021506342 A JP 2021506342A JP 7044203 B2 JP7044203 B2 JP 7044203B2
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
- C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- C—CHEMISTRY; METALLURGY
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
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- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/02—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers not modified by chemical after-treatment
- C09D123/10—Homopolymers or copolymers of propene
- C09D123/12—Polypropene
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- C09D123/00—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers
- C09D123/26—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers modified by chemical after-treatment
- C09D123/28—Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Coating compositions based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
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- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/06—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/002—Priming paints
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
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- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
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- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
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- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
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Description
ポリプロピレン樹脂(日本製紙株式会社製「アウローレン500S」、融点75℃)にメチルシクロヘキサンとメチルエチルケトンの混合溶媒(メチルシクロヘキサンとメチルエチルケトン=80/20(質量比))を加えて均一に混合して、不揮発分2質量%のプライマー樹脂組成物(1)を得た。
調製例1で用いたポリプロピレン樹脂に代えて、ポリプロピレン樹脂(日本製紙株式会社製「アウローレン150S」、融点120℃)を用いた以外は調整例1と同様に行い、不揮発分2質量%のプライマー樹脂組成物(2)を得た。
塩素化ポリプロピレン樹脂(日本製紙株式会社製「スーパークロン422S」、マレイン酸変性タイプ、融点75℃)にトルエンを加えて均一に混合して、不揮発分2質量%のプライマー樹脂組成物(3)を得た。
塩素化ポリプロピレン樹脂(日本製紙株式会社製「スーパークロン422S」、マレイン酸変性タイプ、融点75℃)の不揮発分2質量%トルエン溶液95質量部と、エポキシ架橋剤(ナガセケムテック製デナコールEX-201)の不揮発分2質量%のトルエン溶液5質量部を均一に混合して、不揮発分2質量%のプライマー樹脂組成物(4)を得た。
調製例3で用いた塩素化ポリプロピレン樹脂に代えて、塩素化ポリプロピレン樹脂(日本製紙株式会社製「スーパークロン930S」、マレイン酸変性タイプ、融点65℃)を用いた以外は、調製例3と同様に行い、不揮発分2質量%のプライマー樹脂組成物(5)を得た。
調製例3で用いた塩素化ポリプロピレン樹脂に代えて、塩素化ポリプロピレン樹脂(日本製紙株式会社製「スーパークロン415S」、マレイン酸変性タイプ、融点85℃)を用いた以外は、調製例3と同様に行い、不揮発分2質量%のプライマー樹脂組成物(6)を得た。
調製例3で用いた塩素化ポリプロピレン樹脂に代えて、塩素化ポリプロピレン樹脂(東洋紡株式会社製「ハードレンDX526P」、マレイン酸未変性タイプ、融点81℃)を用いた以外は、調製例3と同様に行い、不揮発分2質量%のプライマー樹脂組成物(7)を得た。
調製例3で用いた塩素化ポリプロピレン樹脂に代えて、塩素化ポリプロピレン変性アクリル樹脂(DIC株式会社製「アクリディックWML-350」)を用いた以外は、調製例3と同様に行い、不揮発分2質量%のプライマー樹脂組成物(8)を得た。
塩素化ポリプロピレン樹脂水分散体(日本製紙株式会社製「スーパークロンE-415」、マレイン酸変性タイプ)にイオン交換水を加えて均一に混合して、不揮発分2質量%のプライマー樹脂組成物(9)を得た。
特許第4573138号公報記載の実施例1にしたがって、銀ナノ粒子とカチオン性基(アミノ基)を有する有機化合物の複合体である灰緑色の金属光沢があるフレーク状の塊からなるカチオン性銀ナノ粒子を得た。その後、この銀ナノ粒子の粉末を、エチレングリコール45質量部と、イオン交換水55質量部との混合溶媒に分散させて、カチオン性銀ナノ粒子が5質量%の流動体(1)を調製した。
ポリプロピレン基材(株式会社エンジニアリングテストサービス製;150mm×70mm×厚さ1mm)の表面に、調製例1で得られたプライマー樹脂組成物(1)を、スピンコーターを用いて、その乾燥膜厚が0.1μmとなるように塗工した後、熱風乾燥機を用いて80℃で5分間乾燥することによって、ポリプロピレン基材上にプライマー層を形成した。
実施例1で用いたプライマー樹脂組成物(1)に代えて、調製例2~9で得られたプライマー樹脂組成物(2)~(9)を用いた以外は実施例1と同様に行い、積層体(2)~(9)を得た。
プライマー層を形成しなかった以外は実施例1と同様に行い、支持体(A)、金属層(C)、金属めっき層(D)を順次積層した積層体(R1)を得た。
前記で得た積層体のピール強度測定は、IPC-TM-650、NUMBER2.4.9に準拠した方法により行った。測定に用いるリード幅は5mm、そのピールの角度は90°とした。なお、ピール強度は、前記めっき層の厚みが厚くなるほど高い値を示す傾向にあるが、本発明でのピール強度の測定は、現在汎用されているめっき層15μmにおける測定値を基準として実施した。
前記で得た積層体を80℃に設定した乾燥機を用いて168時間促進試験を行った。前記乾燥後の積層体を用いること以外は、前記<ピール試験による評価>に記載した方法と同様の方法でピール強度を測定した。
上記で測定した加熱前後のピール強度値を用いて、加熱前後での保持率を算出し、下記の基準にしたがって耐熱性を評価した。
A:保持率が85%以上である。
B:保持率が70%以上85%未満である。
C:保持率が55%以上70%未満である。
D:保持率が55%未満である。
Claims (6)
- ポリオレフィン系樹脂(a)からなる支持体(A)の上に、ポリプロピレン、塩素化ポリプロピレン、塩素化ポリプロピレン変成アクリル樹脂及び水性塩素化ポリプロピレン樹脂からなる群から選ばれる少なくとも1種であるポリオレフィン系樹脂(b)を含有し、かつ膜厚が10nm~500nmであるプライマー層(B)、多孔質状の金属粒子層(C)及び金属めっき層(D)が順次積層されたことを特徴とする積層体。
- 前記プライマー層(B)が、さらに架橋剤を含有する層である請求項1記載の積層体。
- 前記金属めっき層(D)が、前記金属粒子層(C)の上に、無電解金属めっき層及び電解金属めっき層が順次積層されたものである請求項1または2記載の積層体。
- 請求項1~3のいずれか1項記載の積層体を有することを特徴とする成形品。
- 請求項1~3のいずれか1項記載の積層体を有することを特徴とするプリント配線板。
- 請求項1~3のいずれか1項記載の積層体を有することを特徴とする電磁波シールド。
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WO2017195621A1 (ja) | 2016-05-09 | 2017-11-16 | Dic株式会社 | フレキソ印刷用金属ナノ粒子インク及びそれを用いた積層体の製造方法 |
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