JP5843123B2 - 導電性パターン、電子回路及び積層体の製造方法 - Google Patents
導電性パターン、電子回路及び積層体の製造方法 Download PDFInfo
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- JP5843123B2 JP5843123B2 JP2015530185A JP2015530185A JP5843123B2 JP 5843123 B2 JP5843123 B2 JP 5843123B2 JP 2015530185 A JP2015530185 A JP 2015530185A JP 2015530185 A JP2015530185 A JP 2015530185A JP 5843123 B2 JP5843123 B2 JP 5843123B2
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/046—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2266/00—Composition of foam
- B32B2266/04—Inorganic
- B32B2266/045—Metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Description
還流冷却器、温度計、撹拌機を備えた反応フラスコに、37質量%のホルムアルデヒドと7質量%のメタノールとを含むホルマリン600質量部(ホルムアルデヒド含量:222質量部(7.4mol)、メタノール含量:42質量部(1.31mol))に、水200質量部及びメタノール350質量部(10.92mol)を加えて均一にした溶液を仕込んだ。次いで、25質量%水酸化ナトリウム水溶液を加え、pH10に調整した後、メラミン310質量部(2.46mol)を加え、液温を85℃まで上げ、メチロール化反応を行った(反応時間:1時間)。
エチレングリコール45質量部と、イオン交換水55質量部との混合溶媒に、分散剤としてポリエチレンイミンにポリオキシエチレンが付加した化合物を用いて平均粒径30nmの銀粒子を分散させることによって、ナノサイズの金属粉及び分散剤を含有する流動体(1)を調製した。
上記で得られた流動体(1)に、イオン交換水及び界面活性剤を用いて、その粘度を10mPa・sに調整することによって、インクジェット印刷用の導電性インクである流動体(2)を調製した。
ポリイミドフィルム(東レ・デュポン株式会社製「Kapton200H」、厚さ50μm)からなる支持体の表面に、上記で調製したプライマーを、スピンコーターを用いて、その乾燥後の厚さが0.1μmとなるように塗布した。次いで、熱風乾燥機を用いて120℃で5分間乾燥することによって、ポリイミドフィルムの表面にプライマー層を形成した。
コロナ表面改質評価装置(春日電機株式会社製「TEC−4AX」)による処理の代わりに、電磁波照射処理(波長100μm)を行った以外は、実施例1と同様の方法で支持体(A)、プライマー層、金属層(B)、金属層(C)の順に各層が積層された積層体(2)を得た。得られた積層体(2)について、実施例1と同様に走査電子顕微鏡を用いて観察したところ、金属層(B)の空隙に金属層(C)を構成する金属である銅が、金属層(B)と支持体(A)との界面近傍まで充填されていることが確認できた。
コロナ表面改質評価装置(春日電機株式会社製「TEC−4AX」)による処理とICPクリーナーによる処理の代わりに、レーザー照射処理(出力6kW)を行った以外は、実施例1と同様の方法で前記支持体(A)とプライマー層と前記金属層(B)と前記金属層(C)に相当する層が積層された積層体(3)を得た。得られた積層体(3)について、実施例1と同様に走査電子顕微鏡を用いて観察したところ、金属層(B)の空隙に金属層(C)を構成する金属である銅が、金属層(B)と支持体(A)との界面近傍まで充填されていることが確認できた。
コロナ表面改質評価装置(春日電機株式会社製「TEC−4AX」)による処理の代わりに、硫酸(60ml/リットル)に5分間浸漬を行った以外は、実施例1と同様の方法で支持体(A)、プライマー層、金属層(B)、金属層(C)の順に各層が積層された積層体(4)を得た。得られた積層体(4)について、実施例1と同様に走査電子顕微鏡を用いて観察したところ、金属層(B)の空隙に金属層(C)を構成する金属である銅が、金属層(B)と支持体(A)との界面近傍まで充填されていることが確認できた。
ポリイミドフィルム(東レ・デュポン株式会社製「Kapton200H」、厚さ50μm)からなる支持体の表面に、上記で調製したプライマーを、スピンコーターを用いて、その乾燥後の厚さが0.1μmとなるように塗布した。次いで、熱風乾燥機を用いて120℃で5分間乾燥することによって、ポリイミドフィルムの表面にプライマー層を形成した。
IPC−TM−650、NUMBER2.4.9に準拠した方法により、ピール強度を測定した。測定に用いるリード幅は1mm、そのピールの角度は90°とした。なお、ピール強度は、前記めっき層の厚さが厚くなるほど高い値を示す傾向にあるが、本発明でのピール強度の測定は、現在汎用されているめっき層8μmにおける測定値を基準として実施した。
前記ピール強度の測定後の剥離面を目視で観察し、剥離した界面の位置を確認した。剥離した界面の位置は下記の1〜3として、剥離した界面の位置が2又は3の場合、金属層(B)と金属層(C)との密着性が良好であると判断した。
1:金属層(B)と金属層(C)との界面
2:プライマー層と金属層(B)と界面
3:プライマー層とポリイミドフィルム(支持体)との界面
Claims (8)
- 支持体(A)の上に多孔質状の金属層(B)が形成され、前記金属層(B)の上に金属層(C)が形成された積層体であって、前記金属層(B)中に存在する空隙に金属層(C)を構成する金属が充填されている積層体からなることを特徴とする導電性パターン。
- 前記支持体(A)と前記金属層(B)との界面近傍に存在する前記金属層(B)中の空隙まで、前記金属層(C)を構成する金属が充填されている請求項1記載の導電性パターン。
- 前記金属層(B)を構成する金属が銀であり、前記金属層(C)を構成する金属が銅である請求項1記載の導電性パターン。
- 前記支持体(A)と前記金属層(B)とが、プライマー層を介して積層したものである請求項1記載の導電性パターン。
- 請求項1〜4のいずれか1項記載の導電性パターンを有することを特徴とする電子回路。
- 支持体(A)の上に、ナノサイズの金属粉及び分散剤を含有する流動体を塗布し焼成して金属層(B’)を形成した後、前記金属層(B’)中に存在する分散剤を含む有機化合物を除去して空隙を形成して多孔質状の金属層(B)とした後、電解又は無電解めっきにより金属層(C)を形成することを特徴とする積層体の製造方法。
- 前記ナノサイズの金属粉の形状が、粒子状又は繊維状である請求項6記載の積層体の製造方法。
- 前記ナノサイズの金属粉が銀であり、前記金属層(C)が電解銅めっきによって形成された銅めっき層である請求項6記載の積層体の製造方法。
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PCT/JP2014/073382 WO2015037511A1 (ja) | 2013-09-10 | 2014-09-04 | 積層体、導電性パターン、電子回路及び積層体の製造方法 |
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CN (1) | CN105517788A (ja) |
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JP6263146B2 (ja) * | 2015-04-06 | 2018-01-17 | 株式会社ノリタケカンパニーリミテド | 導電膜付基板、その製造方法、およびポリイミド基板用導電性ペースト |
WO2016208006A1 (ja) * | 2015-06-24 | 2016-12-29 | 株式会社メイコー | 立体配線基板の製造方法、立体配線基板、立体配線基板用基材 |
JP6014792B1 (ja) * | 2015-06-24 | 2016-10-25 | 株式会社メイコー | 立体配線基板の製造方法、立体配線基板、立体配線基板用基材 |
WO2018008125A1 (ja) * | 2016-07-07 | 2018-01-11 | 株式会社メイコー | 立体配線基板、立体配線基板の製造方法、立体配線基板用基材 |
WO2018030202A1 (ja) * | 2016-08-08 | 2018-02-15 | Dic株式会社 | 積層体、メタルメッシュ及びタッチパネル |
US11612933B2 (en) | 2017-07-06 | 2023-03-28 | Lg Chem, Ltd. | Preparation method for metal foam |
WO2019013039A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
WO2019013038A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
WO2019013040A1 (ja) * | 2017-07-10 | 2019-01-17 | Dic株式会社 | 積層体、それを用いたプリント配線板、フレキシブルプリント配線板及び成形品 |
TWI791769B (zh) * | 2018-02-27 | 2023-02-11 | 日商迪愛生股份有限公司 | 電子零件封裝及其製造方法 |
JP6849157B2 (ja) * | 2018-10-22 | 2021-03-24 | Dic株式会社 | 積層体、及び、積層体の製造方法 |
TWI710020B (zh) * | 2019-10-24 | 2020-11-11 | 嘉聯益科技股份有限公司 | 軟性電路板的製造方法、電鍍藥水及蝕刻藥水 |
CN112714554A (zh) * | 2019-10-24 | 2021-04-27 | 嘉联益电子(昆山)有限公司 | 软性电路板的制造方法、电镀药水及蚀刻药水 |
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JP2000059035A (ja) * | 1998-08-07 | 2000-02-25 | Mitsui Mining & Smelting Co Ltd | 複合箔、銅張り積層体、プリント配線板および多層プリント配線板、ならびに複合箔の製造方法 |
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JP3320478B2 (ja) | 1993-02-23 | 2002-09-03 | 住友スリーエム株式会社 | 粘弾性体を備えた積層体製品の製造方法及び制振材 |
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KR20100096499A (ko) * | 2009-02-24 | 2010-09-02 | 삼성테크윈 주식회사 | 다공성 회로 패턴층을 가지는 회로 기판과, 이의 제조 방법 |
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JP2006024808A (ja) * | 2004-07-09 | 2006-01-26 | Mitsubishi Paper Mills Ltd | 導電性組成物作製方法、層間接続方法、及び導電性膜または導電性画像作製方法 |
JP2011192755A (ja) * | 2010-03-12 | 2011-09-29 | Gunze Ltd | 透明導電性シート、その製造に用いる導電性ペーストの製造法、電磁波シールド材およびタッチセンサー |
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WO2015037511A1 (ja) | 2015-03-19 |
KR20160018843A (ko) | 2016-02-17 |
TW201522071A (zh) | 2015-06-16 |
JPWO2015037511A1 (ja) | 2017-03-02 |
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