Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment
  • H10W74/016—Manufacture or treatment using moulds
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
  • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
  • B29C43/32—Component parts, details or accessories; Auxiliary operations
  • B29C43/34—Feeding the material to the mould or the compression means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/01—Manufacture or treatment
  • H10W74/016—Manufacture or treatment using moulds
  • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
  • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
  • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Definitions

• the present invention relates to an apparatus for sealing and molding an electronic component such as a semiconductor chip including an IC (Integration Circuit) mounted on a substrate with a resin.
• an electronic component is sealed and molded while being immersed in a molten resin material in a mold assembly. More specifically, the present invention relates to a mechanism for supplying a resin material into the aforementioned apparatus.
• a mold assembly for resin seal molding of electronic parts has been used.
• This mold assembly has an upper mold and a lower mold.
• a board on which electronic components are mounted is mounted at a predetermined position on the upper mold.
• the resin material is supplied to the cavity formed in the lower mold by the resin supply mechanism. Thereafter, the resin material is heated and melted in the mold assembly.
• the mold assembly is closed, the electronic components are crushed in the molten grease material.
• the molten resin material is hardened. As a result, a molded product having electronic components encapsulated in the resin material on the substrate is completed.
• tension is applied to the release film 104 by the lower mold 101 and the intermediate mold 102. Further, the release film 104 covers the entire surface of the cavity including the lower cavity surface 103 of the lower mold 101 and the cavity surface 106 of the cavity member 105. Further, a cavity space 107 is formed by the upper mold, the intermediate mold 102, and the lower mold 101. However, in FIG. 9 and FIG. 10, the upper mold is not drawn for ease of explanation.
• FIG. 10 shows a diagram in which the cavity space 107 is also seen as an oblique upward force and a diagram in which the fat tray 109 described later is also seen as an oblique downward force, so that the correspondence between them can be easily understood. It is shown in the figure.
• FIG. 9 and FIG. 10 show a resin material unit 100 as a resin supply mechanism.
• the resin material unit 100 includes a storage unit and an adjustment unit, and supplies the required amount of the resin material 108 to the cavity space unit 107.
• the resin material unit 100 will be described in detail.
• a powdered resin material 108 is stored in the storage portion of the resin material unit 100. Further, the adjustment unit measures the resin material 108 stored in the storage unit. This weighing is performed in the weighing feeder, and the amount of the grease material 108 is adjusted to a preset value.
• a predetermined amount of the resin material 108 also drops the resin guide mechanism force into the resin tray 109. At this time, if all the resin materials 108 are dropped into the space in the opening member 110 of the resin tray 109, they are not uniformly distributed over the entire area of the cavity space 107. Therefore, the resin material 108 is weighed and guided into the opening member 110 in a plurality of times (in this case, four times). Thereafter, as shown in FIGS. 9 and 10, the shutter 111 provided on the resin tray 109 is opened. As a result, the resin material 108 guided into the opening member 110 is supplied into the cavity space 107.
• Patent Document 1 Japanese Patent Laid-Open No. 2005-225133 (Page 5, Figure 4)
• the resin material 108 on the shutter 111 falls. However, a part of the resin material 108 moves in the direction in which the shutter 111 opens (horizontal direction) while being placed on the shutter 111. Thereafter, the resin material 108 moving in the horizontal direction collides with both inner side surfaces of the resin tray 109 and then falls into the cavity space 107. Therefore, the amount of the resin material 108 that falls in the vicinity of the outer periphery of the cavity space 108 becomes larger than the amount of the grease material 108 that falls into the center of the cavity space 108. As a result, the resin material 108 in the cavity space 107 has a raised portion in the vicinity of the outer periphery of the cavity space 107.
• the molten resin material 108 is uniformly distributed over the entire area from the outer periphery to the center of the cavity space 107. The tendency to not be allocated to becomes stronger. Also in this case, the electronic component is immersed in the melted resin material 108 in a state where the vicinity of the outer periphery of the melted resin material 108 is raised and sealed. As a result, for the reasons described above, molding defects such as flash, wire flow, and unfilled (void) occur.
• Powder or particles having a very small diameter are likely to be scattered, and thus melt before being supplied into the cavity space 107. For this reason, the powdered greaves adhere to each other. If such a mass of fixed resin is formed in the resin material unit 100, clogging or stagnation may occur. As a result, the resin material 108 cannot be smoothly supplied into the cavity space 107. As a result, the efficiency of supplying the fat is reduced.
• the present invention has been made in view of the above-described problems, and an object of the present invention is to distribute the resin material uniformly over the entire region in the mold assembly (cavity space), thereby to flash, It is to prevent the occurrence of molding defects such as wire flow and unfilling.
• Another object of the present invention is to provide a very small diameter and easy to disperse V contained in the resin material V, and to dispose unnecessary powdery or granular resin in the resin supply mechanism. Is to remove.
• Still another object is to prevent powder or granular fats from adhering to each other in the grease supply mechanism.
• the resin seal molding apparatus for electronic parts of the present invention includes a mold assembly for resin seal molding.
• the mold assembly includes an upper mold on which a board on which electronic components are mounted can be mounted, and a lower mold having a cavity space for receiving electronic components.
• the apparatus when the upper mold and the lower mold are closed, the electronic component is immersed in the molten resin material in the cavity space.
• the apparatus also includes a resin supply mechanism that supplies a powdery or granular resin material to the cavity space.
• the resin supply mechanism unit includes a storage unit that stores the resin material, and a measuring unit that extracts only a required amount of the resin material by measuring the power of the resin material stored in the storage unit.
• the resin supply mechanism includes a guide unit that guides a required amount of the resin material to a resin tray including a slit member having a plurality of openings extending in parallel with each other.
• the device has a resin tray and a direction substantially perpendicular to the direction in which a plurality of openings extend directly under the resin tray. And a supply portion that supplies a required amount of the grease material to the cavity space when the shutter is opened.
• the guide section includes a guide slit member having a plurality of openings corresponding to the plurality of openings of the slit member, and the resin tray continuously moves corresponding to a required amount of the resin material. In this state, a required amount of the resin material is dropped from a plurality of opening forces of the guide slit member to a plurality of openings of the tray slit member.
• the measuring unit includes a removing unit that removes fine unnecessary resin contained in the resin material before the resin material reaches the guide unit.
• At least one of the storage unit, the weighing unit, the guide unit, and the supply unit is exposed to a temperature atmosphere in which the resin material has a temperature of 15 ° C or lower.
• the resin material can be uniformly distributed over the entire region in the mold assembly (cavity space), so that molding defects such as flash, wire flow, and unfilling can be prevented. Occurrence is prevented. Moreover, since the efficiency of supplying the resin is greatly increased, the productivity of the sealed substrate (molded product) can be significantly improved.
• FIG. 1 is a diagram schematically showing an overall configuration of a resin seal molding apparatus for electronic parts according to the present invention.
• FIG. 2 is a cross-sectional view schematically showing a supply part of the grease supply mechanism of the apparatus shown in FIG.
• FIG. 3 is a perspective view schematically showing a supply part of the grease supply mechanism of the apparatus shown in FIG. 1.
• FIG. 3 is a perspective view schematically showing a supply part of the grease supply mechanism of the apparatus shown in FIG. 1.
• FIG. 4 is a perspective view schematically showing a supply part of a resin supply mechanism of another example of the apparatus shown in FIG. 1.
• FIG. 4 is a perspective view schematically showing a supply part of a resin supply mechanism of another example of the apparatus shown in FIG. 1.
• FIG. 5 is a cross-sectional view schematically showing a guide portion of the grease supply mechanism of the apparatus shown in FIG.
• FIG. 6 is a perspective view schematically showing a guide part of the grease supply mechanism of the apparatus shown in FIG. 1.
• FIG. 6 is a perspective view schematically showing a guide part of the grease supply mechanism of the apparatus shown in FIG. 1.
• FIG. 7 is a side view schematically showing a removal portion of the grease supply mechanism of the apparatus shown in FIG. 1.
• FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 7 and shows the removal of the grease supply mechanism of the apparatus shown in FIG. It is sectional drawing which shows a leaving part roughly.
• FIG. 9 is a cross-sectional view schematically showing a state immediately after a resin material is supplied from a resin material unit to a mold assembly in a conventional resin seal molding apparatus.
• FIG. 10 is a perspective view schematically showing a state immediately after a resin material is supplied to a resin material unit mold assembly in a conventional resin seal molding apparatus.
• FIG. 1 schematically shows the entire configuration of a resin seal molding apparatus of the present invention.
• 2 to 8 are a cross-sectional view and a perspective view schematically showing a main part of the grease supply mechanism of the apparatus shown in FIG.
• a resin seal molding apparatus 50 for an electronic component according to the present embodiment includes a press mechanism 10.
• the press mechanism 10 has a die assembly having a three-type structure.
• the die assembly consists of upper die 1, lower die 2, and intermediate die 3.
• the apparatus 50 includes a film supply mechanism (not shown).
• Film supply mechanism The lower mold 2 is coated with the tensioned release film 6. More specifically, the cavity of the lower mold 2 is covered with the release film 6.
• the cavity is composed of a lower cavity surface 4 and a cavity surface 5.
• the device 50 includes a supply / withdrawing mechanism 20.
• the supply / extraction mechanism 20 has a function of supplying the pre-sealing substrate 31 and the required amount of the resin material 41 separately and almost simultaneously into the mold assembly.
• the supply / extraction mechanism 20 has a function of extracting the sealed substrate 32 from the mold assembly.
• the apparatus 50 includes a substrate storage mechanism 30.
• the substrate storage mechanism 30 has an in-magazine 33 for storing the pre-sealing substrate 31 before being transferred to the mold assembly by the supply / extraction mechanism 20.
• the substrate storage mechanism 30 has an out magazine 34 for storing the sealed substrate 32 (molded product) from which the mold assembly force has been extracted by the supply / extraction mechanism 20.
• the apparatus 50 includes a resin supply mechanism 40 for supplying a required amount of the resin material 41 into the mold assembly cavity.
• the resin supply mechanism 40 transfers the required amount of the resin material 41 guided in the resin tray 42 to the supply / extraction mechanism 20.
• the press mechanism 10 includes a press machine that closes and opens the upper mold 1 and the lower mold 2, and a press machine for the intermediate mold 3.
• a press machine for example, a device that uses fluid such as water pressure, hydraulic pressure, or gas, or an electric press machine is used. The two presses close or open the mold assembly in a single action or in conjunction.
• the upper mold 1 includes a substrate mounting portion 7 on which the pre-sealing substrate 31 or the sealed substrate 32 is mounted on the upper mold surface 1A.
• Each of the pre-sealing substrate 31 and the sealed substrate 32 includes a plurality of electronic components 35 (semiconductor chips) arranged in a matrix on the substrate 36, a plurality of electronic components 35, And a wire (not shown) for electrical connection.
• the sealed substrate 32 has a resin molded body 37 (package), a substrate outer peripheral portion 38, and a non-mounting surface 39.
• the resin molded body 37 (package) is obtained by enclosing a plurality of electronic components 35 and wires with a resin material 41.
• the substrate outer peripheral portion 38 is a region where the resin molded body 37 on the main surface on which the electronic component 35 is mounted is not formed.
• the non-mounting surface 39 is a main surface where the electronic component 35 that contacts the substrate mounting portion 7 is mounted.
• the above-described apparatus 50 of the present embodiment is for sealing and molding the wire-bonded electronic component 35 with grease.
• the resin-encapsulating and molding apparatus for electronic parts of the present invention is not limited to this, and a resin such as a flip-chip board on which an electronic part 35 to which wires are not connected is mounted, or a wafer level package or the like is applied. It may be sealed and molded.
• the resin material 41 is a granular resin (powdered granular resin), and covers a plurality of the resin molded bodies 37 on the substrate 36 in a lump. The necessary amount is supplied from the resin supply mechanism 40 to the cavity space 9.
• the cavity space portion 9 includes a lower mold cavity surface 4 and a cavity surface 5 in a state where tension is applied to the release film 6 by the lower mold 2 and the intermediate mold 3 fitted to each other. Is formed by covering the entire surface with a release film 6.
• FIG. 2 shows a state where the cavity space 9 is formed. This state corresponds to the state shown in FIG. 9 explained in the prior art!
• the upper mold 1 is not drawn for easy understanding of the invention. Also, in FIG. 3, in order to facilitate understanding of the state of supplying the grease shown in FIG. 2, both the upper surface of the cavity space 9 and the lower surface of the later-described grease tray 42 can be seen at the same time. Two kinds of perspective views are drawn in one figure.
• the mold assembly includes a plurality of heaters that heat and melt the resin material 41 supplied to the cavity space 9.
• the plurality of heaters are disposed almost directly below the lower mold cavity surface 4 and are, for example, cartridge heaters or flexible heaters for melting the resin material 41.
• the resin material 41 is melted by the heat applied from the heater, and is cured after a predetermined time. Thereby, a resin molded body 37 as a hardened resin is formed.
• the upper mold 1 and the intermediate mold 3 may also have heaters built in.
• the supply / extraction mechanism 20 moves in a substantially horizontal direction, and is a space between the upper mold 1 and the intermediate mold 3, in other words, a space between the upper mold surface 1A and the upper surface of the intermediate mold 3. And a transport mechanism (not shown) capable of entering and exiting the space.
• the transport mechanism is, for example, a mechanical chuck transport mechanism or a robot arm transport mechanism.
• Carrier machine The upper part of the structure can supply the pre-sealing substrate 31 and take out the sealed substrate 32.
• the lower part of the transport mechanism can supply the required amount of the resin material 41 together with the resin tray 42 to the mold assembly. That is, the transport mechanism has both a function for supplying and taking out the substrate and a function for supplying the resin material.
• the in magazine 33 and the out magazine 34 of the substrate storage mechanism 30 are different from each other in that the object to be stored is the pre-sealing substrate 31 or the sealed substrate 32. However, since all of them contain the substrate 36, their basic components are the same.
• the in-magazine 33 and the out-magazine 34 may be arranged side by side in the left-right direction.
• the displacement of the in magazine 33 and the out magazine 34 may be arranged on the upper side or the lower side!
• a slit-type magazine cassette (not shown) is used in which (31-32) is placed at a predetermined distance. Further, in the magazine cassette, the substrate 36 is accommodated with the electronic component 35 (the resin molded body 37) facing downward as in the state of the substrate 36 in the mold assembly.
• the resin supply mechanism 40 includes a storage unit 43, a measuring unit 44, a guide unit 45, and a supply unit 46.
• the storage unit 43 stores the resin material 41 supplied to the cavity space unit 9.
• the measuring unit 44 measures the resin material 41 in order to take out the resin material 41 stored in the storage unit 43 by a preset amount.
• the guide unit 45 guides the required amount of the resin material 41 after being measured in the measuring unit 44 to the resin tray 42 by the resin guide machine 45A.
• the resin tray 42 includes a shutter 42A, and opens the shutter 42A to supply a required amount of the resin material 41 that has fallen from the guide unit 45 to the cavity space 9.
• the supply unit 46 is a tray slit member 42B having a plurality of openings extending in a direction perpendicular to the opening direction of the shutter 42A in the resin tray 42. It has.
• the required amount of the resin material 41 is obtained by opening a plurality of tray slit members 42B. It is held in the mouth (in this case, three openings) and is supplied to the cavity space 9 almost simultaneously with the opening of the shutter 42A.
• the slit member 42B for the tray extends in parallel with each other along the longitudinal direction so that a required amount of the resin material 41 can be supplied to the cavity space 9. It has a plurality of linear openings.
• a matrix-type slit can be considered as shown in FIG.
• the slit member 42C for the tray is used to separately supply a required amount of the resin material 41 to each of the cavity spaces 9 (in this case, four) divided into a plurality of parts. Therefore, the tray slit member 42C is divided into four parts in the long side direction and into three parts in the short side direction, and has twelve openings. Even when the tray slit member 42C is used, the resin material 41 is uniformly distributed over the entire area in each of the plurality of cavity spaces 9 in the same manner as when the tray slit member 42B is used. Distributed.
• the upper mold 1 is not drawn for easy understanding of the invention.
• the resin material 41 is distributed extremely uniformly over the entire area of the cavity space 9. Therefore, when the resin material 41 is melted by heating, leakage of the resin to the outside of the cavity space 9 is prevented, and the flow of resin in the cavity space 9 is reduced. As a result, molding defects such as flash, wire flow, and unfilling are prevented.
• the guide portion 45 has a plurality of slit members 42B.
• a slit member 45B for the guide portion having a plurality of openings formed so as to correspond to the mouth is provided.
• the guide unit 45 is used for the tray from the plurality of openings of the guide slit member 45B in a state where the resin tray 42 is moved according to the amount of the resin material 41 guided to the resin tray 42. The resin material 41 is continuously dropped into the plurality of openings of the slit member 42B.
• the plurality of openings of the slit member 45B for guide shown in FIG. 6 correspond to the plurality of openings of the slit member 45B for tray corresponding to the plurality of openings of the slit member 45B for guide part. It is desirable to round the shape of the opening. As a result, the resin material 41 can be efficiently supplied from the plurality of openings of the guide slit member 45B to the plurality of openings of the tray slit member 42B.
• the resin material 41 As described with reference to Figs. 5 and 6, if the resin material 41 is continuously guided from the guide portion 45 to the resin tray 42, the resin is conventionally used. It is possible to prevent the material 41 from being supplied in the form of dense waves in the vertical direction. In addition, as shown in FIG. 2, the required amount of the resin material 41 is distributed extremely uniformly over the entire area of the cavity space 9.
• FIG. 6 in order to draw the grease guide state shown in FIG. 5 in a more easily understandable manner, a perspective view of the lower surface of the grease guide machine 45A (guide section 45) and a grease tray described later are used. A perspective view of the top surface of 42 (supply unit 4 6) is depicted in one figure.
• the resin material 41 is a powdered resin (granular resin), it has a very small diameter and is easily scattered, and contains powdered or granular resin.
• the small-diameter rosin powder or particles melt before being supplied to the cavity space 9. As a result, the grains or powders stick together. Therefore, in the apparatus 50 of the present embodiment, as shown in FIGS. 7 and 8, in order to remove the powder or particles of the resin material 41 having an extremely small diameter, that is, unnecessary resin 41X, A removal unit 47 is provided in the weighing unit 44 of the supply mechanism 40.
• the removal unit 47 is provided closer to the storage unit 43 than the VIII-VIII cross-sectional line. According to this, the resin material 41 reaches the resin guide machine 45A in a state where the unnecessary resin 4 IX is removed.
• the removal portion 47 that is, the lower surface of the trough 44A is made into a mesh shape.
• the lower surface of the mesh trough 44A functions as a sieve. As a result, the unnecessary grease 41X force that is fine and easily scattered is dropped as shown by the arrows in FIGS. 7 and 8.
• the resin moving surface 44B of the trough 44A has a flat shape so that the resin material 41 can smoothly reach the guide section 45 in a state where the unnecessary resin 41X is removed. Yes.
• the fine particles of resin do not come into a fixed state.
• clogging or stagnation in the resin supply mechanism 40 is prevented.
• the resin material 41 is smoothly supplied from the resin supply mechanism 40 to the cavity space 9 with the unnecessary resin 41X removed, the efficiency of supplying the resin can be greatly improved. .
• the cause of the formation of a lump of resin as in the prior art is that, in addition to the fact that the resin material 41 is fine and contains unwanted resin 41X that is easily scattered, The whole mold assembly is heated to melt. More specifically, not only the press mechanism 10 but also the resin supply mechanism 40 is heated, which is a cause of generation of the unnecessary resin 41X.
• the heating of the heater in the device 50 causes the grease supply mechanism 40 (the storage unit 43, the measuring unit 44 including the removal unit 47, the guide unit 45, and the supply unit 46) to operate at a temperature outside the device 50. At the same power or higher, the temperature will be higher.
• the inventors of the present invention have the resin material 41 comprising a storage unit 43, a measuring unit 44 (including the removal unit 47), a guide unit 45, and a supply unit 46. It has been found that it is preferably used in an atmosphere having a temperature lower than the outside air temperature, preferably a temperature of 15 ° C. or less. However, when the resin material 41 is lower than 0 ° C., the fine powdery resin is fixed due to freezing due to the cooling action. Therefore, it is necessary to prevent the resin material 41 from becoming below 0 ° C.
• the apparatus 50 has a cooler capable of cooling all or selected one or more of the storage unit 43, the weighing unit 44 (including the removal unit 47), the guide unit 45, and the supply unit 46. It may be.
• a resin seal molding apparatus including a mold assembly having a three-type structure including an upper mold 1, a lower mold 2, and an intermediate mold 3 is described.
• the present invention can also be applied to a resin seal molding apparatus provided with a mold assembly having a two-mold structure consisting of an upper mold 1 and a lower mold 2.
• the cavity in the cavity 9 may be evacuated by forcibly exhausting the air in the mold assembly while the mold assembly is closed. In order to perform this evacuation reliably, it is desirable that the gaps between the upper die 1, the lower die 2, and the intermediate die 3 are closed by the sealing members provided in them.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Moulds For Moulding Plastics Or The Like (AREA)
• Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
• Injection Moulding Of Plastics Or The Like (AREA)
• Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Cited By (3)

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Citations (4)

Family Cites Families (7)

• 2005
  • 2005-11-04 JP JP2005320280A patent/JP4953619B2/ja not_active Expired - Lifetime
• 2006
  • 2006-10-17 WO PCT/JP2006/320639 patent/WO2007052467A1/ja not_active Ceased
  • 2006-10-17 EP EP06811894A patent/EP1950023A1/en not_active Withdrawn
  • 2006-10-17 CN CN2006800172567A patent/CN101180170B/zh active Active
  • 2006-10-17 KR KR1020077023384A patent/KR100897654B1/ko active Active
  • 2006-10-17 CN CN201310330206.6A patent/CN103395157B/zh active Active
  • 2006-10-17 CN CN201310330229.7A patent/CN103395158B/zh active Active
  • 2006-10-17 US US11/918,231 patent/US20090068302A1/en not_active Abandoned
  • 2006-10-20 TW TW095138729A patent/TW200721331A/zh unknown

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