JP4953619B2 - 電子部品の樹脂封止成形装置 - Google Patents

電子部品の樹脂封止成形装置 Download PDF

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Publication number
JP4953619B2
JP4953619B2 JP2005320280A JP2005320280A JP4953619B2 JP 4953619 B2 JP4953619 B2 JP 4953619B2 JP 2005320280 A JP2005320280 A JP 2005320280A JP 2005320280 A JP2005320280 A JP 2005320280A JP 4953619 B2 JP4953619 B2 JP 4953619B2
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JP
Japan
Prior art keywords
resin
resin material
cavity space
mold
required amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005320280A
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English (en)
Japanese (ja)
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JP2007125783A (ja
Inventor
守 中村
昌則 花崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005320280A priority Critical patent/JP4953619B2/ja
Application filed by Towa Corp filed Critical Towa Corp
Priority to EP06811894A priority patent/EP1950023A1/en
Priority to PCT/JP2006/320639 priority patent/WO2007052467A1/ja
Priority to CN2006800172567A priority patent/CN101180170B/zh
Priority to CN201310330229.7A priority patent/CN103395158B/zh
Priority to US11/918,231 priority patent/US20090068302A1/en
Priority to KR1020077023384A priority patent/KR100897654B1/ko
Priority to CN201310330206.6A priority patent/CN103395157B/zh
Priority to TW095138729A priority patent/TW200721331A/zh
Publication of JP2007125783A publication Critical patent/JP2007125783A/ja
Application granted granted Critical
Publication of JP4953619B2 publication Critical patent/JP4953619B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H10W74/017—Auxiliary layers for moulds, e.g. release layers or layers preventing residue
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2005320280A 2005-11-04 2005-11-04 電子部品の樹脂封止成形装置 Expired - Lifetime JP4953619B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2005320280A JP4953619B2 (ja) 2005-11-04 2005-11-04 電子部品の樹脂封止成形装置
PCT/JP2006/320639 WO2007052467A1 (ja) 2005-11-04 2006-10-17 電子部品の樹脂封止成形装置
CN2006800172567A CN101180170B (zh) 2005-11-04 2006-10-17 电子器件的树脂封固成形装置
CN201310330229.7A CN103395158B (zh) 2005-11-04 2006-10-17 电子器件的树脂封固成形装置
EP06811894A EP1950023A1 (en) 2005-11-04 2006-10-17 Molding apparatus for resin encapsulation of electronic part
US11/918,231 US20090068302A1 (en) 2005-11-04 2006-10-17 Resin Sealing and Molding Apparatus for Electronic Component
KR1020077023384A KR100897654B1 (ko) 2005-11-04 2006-10-17 전자 부품의 수지 밀봉 성형 장치
CN201310330206.6A CN103395157B (zh) 2005-11-04 2006-10-17 电子器件的树脂封固成形装置
TW095138729A TW200721331A (en) 2005-11-04 2006-10-20 Molding apparatus for resin encapsulation of electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005320280A JP4953619B2 (ja) 2005-11-04 2005-11-04 電子部品の樹脂封止成形装置

Publications (2)

Publication Number Publication Date
JP2007125783A JP2007125783A (ja) 2007-05-24
JP4953619B2 true JP4953619B2 (ja) 2012-06-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005320280A Expired - Lifetime JP4953619B2 (ja) 2005-11-04 2005-11-04 電子部品の樹脂封止成形装置

Country Status (7)

Country Link
US (1) US20090068302A1 (OSRAM)
EP (1) EP1950023A1 (OSRAM)
JP (1) JP4953619B2 (OSRAM)
KR (1) KR100897654B1 (OSRAM)
CN (3) CN101180170B (OSRAM)
TW (1) TW200721331A (OSRAM)
WO (1) WO2007052467A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190089711A (ko) * 2018-01-22 2019-07-31 토와 가부시기가이샤 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Families Citing this family (36)

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KR100889261B1 (ko) * 2007-08-20 2009-03-17 세크론 주식회사 분말 ｅｍｃ 트레이 및 이를 갖는 분말 ｅｍｃ 공급 장치
JP4990830B2 (ja) * 2008-03-27 2012-08-01 住友重機械工業株式会社 樹脂供給機構
KR100988629B1 (ko) 2008-07-28 2010-10-18 세크론 주식회사 에폭시 몰딩 혼합물 트레이
KR101042689B1 (ko) 2008-10-24 2011-06-20 세크론 주식회사 에폭시 몰딩 컴파운드를 공급하기 위한 트레이
JP5776092B2 (ja) * 2011-01-11 2015-09-09 アピックヤマダ株式会社 圧縮成形方法及び圧縮成形装置並びに樹脂供給ハンドラ
JP5682033B2 (ja) * 2011-03-14 2015-03-11 アピックヤマダ株式会社 樹脂封止装置
JP2013021199A (ja) * 2011-07-13 2013-01-31 Apic Yamada Corp 樹脂吸着搬送方法及び樹脂吸着搬送装置並びに樹脂封止方法
JP5953600B2 (ja) * 2011-08-12 2016-07-20 アピックヤマダ株式会社 樹脂供給装置、樹脂モールド装置および樹脂供給方法
KR101950894B1 (ko) * 2011-11-08 2019-04-22 아피쿠 야마다 가부시키가이샤 수지 밀봉 장치
JP6071869B2 (ja) * 2013-12-27 2017-02-01 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6017492B2 (ja) 2014-04-24 2016-11-02 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、及び樹脂封止電子部品
JP5944445B2 (ja) 2014-07-18 2016-07-05 Ｔｏｗａ株式会社 樹脂封止電子部品の製造方法、突起電極付き板状部材、樹脂封止電子部品、及び突起電極付き板状部材の製造方法
JP6282564B2 (ja) * 2014-09-16 2018-02-21 東芝メモリ株式会社 半導体装置の製造方法
JP6491508B2 (ja) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂成形品の製造方法
JP6333761B2 (ja) * 2015-03-31 2018-05-30 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置並びに圧縮成形方法及び圧縮成形装置
CN104875313A (zh) * 2015-04-23 2015-09-02 昆山群悦精密模具有限公司 脱气式电子封装模具
JP6017634B1 (ja) 2015-06-10 2016-11-02 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法
JP6039750B1 (ja) 2015-06-10 2016-12-07 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び圧縮成形装置
JP6080907B2 (ja) 2015-06-25 2017-02-15 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、圧縮成形装置、並びに樹脂成形品製造方法
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6672103B2 (ja) 2016-08-01 2020-03-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6212609B1 (ja) 2016-08-19 2017-10-11 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品製造方法
JP6279047B1 (ja) 2016-10-11 2018-02-14 Ｔｏｗａ株式会社 樹脂材料供給装置、樹脂材料供給方法、樹脂成形装置、及び樹脂成形品製造方法
JP6654994B2 (ja) * 2016-10-31 2020-02-26 Ｔｏｗａ株式会社 回路部品の製造方法
JP6349376B2 (ja) * 2016-12-07 2018-06-27 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給装置及び方法、並びに圧縮成形装置及び樹脂成形品製造方法
JP6774865B2 (ja) * 2016-12-13 2020-10-28 アピックヤマダ株式会社 枠体治具、樹脂供給治具及びその計量方法、モールド樹脂の計量装置及び方法、樹脂供給装置、樹脂供給計量装置及び方法、並びに樹脂モールド装置及び方法
JP6723177B2 (ja) 2017-02-24 2020-07-15 Ｔｏｗａ株式会社 樹脂成形装置、樹脂成形方法、及び樹脂成形品の製造方法
JP7042813B2 (ja) 2017-05-16 2022-03-28 株式会社ブリヂストン 発泡成形型、および発泡成形体の製造方法
JP6416996B1 (ja) * 2017-07-24 2018-10-31 アサヒ・エンジニアリング株式会社 樹脂封止装置用の封止型
CN109935536A (zh) * 2017-12-19 2019-06-25 均华精密工业股份有限公司 布胶装置及其方法
KR102337659B1 (ko) * 2018-02-21 2021-12-09 삼성전자주식회사 금형 검사 장치 및 금형 검사 방법
CN109049461B (zh) * 2018-08-09 2023-09-01 深圳鼎晶科技有限公司 一种全自动精密模压封装线
CN110815686A (zh) * 2019-11-27 2020-02-21 苏州均华精密机械有限公司 载板热压模封设备及其方法
JP7470983B2 (ja) * 2020-11-17 2024-04-19 アピックヤマダ株式会社 樹脂供給装置、樹脂封止装置、及び樹脂封止品の製造方法
TWI790808B (zh) * 2021-11-04 2023-01-21 日月光半導體製造股份有限公司 模封治具
WO2026063009A1 (ja) * 2024-09-18 2026-03-26 株式会社村田製作所 電子部品の製造方法および製造装置

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20190089711A (ko) * 2018-01-22 2019-07-31 토와 가부시기가이샤 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법
KR102192243B1 (ko) 2018-01-22 2020-12-16 토와 가부시기가이샤 성형 다이, 수지 성형 장치 및 수지 성형품의 제조 방법

Also Published As

Publication number Publication date
CN101180170A (zh) 2008-05-14
TW200721331A (en) 2007-06-01
EP1950023A1 (en) 2008-07-30
CN103395158A (zh) 2013-11-20
CN103395157B (zh) 2015-09-02
KR20070121741A (ko) 2007-12-27
CN101180170B (zh) 2013-08-07
TWI323492B (OSRAM) 2010-04-11
JP2007125783A (ja) 2007-05-24
WO2007052467A1 (ja) 2007-05-10
US20090068302A1 (en) 2009-03-12
KR100897654B1 (ko) 2009-05-14
CN103395158B (zh) 2015-10-07
CN103395157A (zh) 2013-11-20

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