Classifications

• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
  • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
  • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
  • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
  • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
  • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
  • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
  • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
  • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
  • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
  • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
  • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
  • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
  • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• • G—PHYSICS
  • G06—COMPUTING OR CALCULATING; COUNTING
  • G06F—ELECTRIC DIGITAL DATA PROCESSING
  • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
  • G06F2203/048—Indexing scheme relating to G06F3/048
  • G06F2203/04809—Textured surface identifying touch areas, e.g. overlay structure for a virtual keyboard
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
  • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
  • Y10T428/24364—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.] with transparent or protective coating

Definitions

• Transparent conductive film Transparent conductive film, touch panel electrode plate, and touch panel
• the present invention relates to a transparent conductive film.
• the present invention also relates to an electrode plate for a touch panel using the transparent conductive film.
• the present invention relates to a touch panel using the electrode panel for the touch panel.
• Transparent and conductive thin films in the visible light region are used for the prevention of electrification of transparent articles and shielding of electromagnetic waves in addition to transparent electrodes such as new display systems such as liquid crystal displays and electoluminescence displays. It is used.
• a so-called conductive glass in which an indium oxide thin film is formed on glass is well known. Since the base material is glass, flexibility and workability are known. In some cases, it cannot be used depending on the application.
• the touch panel using the transparent conductive film has a problem that when the touch panel is pressed with a finger, etc., -utling occurs in a striped pattern.
• a filler having an average particle size of 1 to 4 ⁇ m is included between the transparent plastic and the transparent conductive layer thin film with a number average density of 500 to 3000 / mm 2.
• a transparent conductive film (Patent Document 1) provided with a coating layer with a thickness of 1 to 3 ⁇ m, or a transparent resin film with a 20 to 55 nm thick oxide silicon thin film layer and a transparent thin film electrode layer.
• the center line average roughness (Ra) is 0.05-2; ⁇ ⁇ , and its maximum height (R max) is 0.6-2.5 m. It has been proposed to use a transparent conductive film (Patent Document 2). In the touch panel using the transparent conductive film as an electrode plate for the touch panel, the occurrence of neutraling can be suppressed.
• the transparent conductive film is inferior in abrasion resistance and flex resistance of the conductive thin film, and is in use. As a result, the electrical resistance increases or the wire breaks.
• a pair of thin films facing each other via a spacer come into strong contact with each other at the pressing point from one panel plate side. It is desired to have good durability, that is, hitting point characteristics, particularly pen input durability.
• durability cannot be satisfied with a transparent conductive film in which the uneven shape of the transparent conductive layer thin film is controlled in order to prevent the occurrence of neutralization. Therefore, with regard to the transparent conductive film, if the occurrence of uttlering is suppressed, there is a problem that the life of the touch panel is shortened as a result of inferior durability.
• the transparent conductive film has a problem of poor transparency because the light reflectance on the surface of the thin film is large.
• the concavo-convex shape of the transparent conductive layer thin film is controlled as described above, the display characteristics such as glare and image clarity are not sufficiently satisfied.
• Patent Document 1 Japanese Patent Laid-Open No. 10-323931
• Patent Document 2 Japanese Patent Laid-Open No. 11-250764
• the present invention is a transparent conductive film in which a transparent conductive thin film is laminated on one surface of a transparent film substrate via a resin layer having fine irregularities,
• the purpose of the present invention is to provide a transparent conductive film that can suppress the occurrence of odor and satisfy the display characteristics such as durability, particularly pen input durability, and glare.
• Another object of the present invention is to provide a touch panel electrode plate using the conductive laminated film, and to provide a touch panel using the touch panel electrode plate.
• the present invention provides at least a fine uneven shape on one surface of a transparent film substrate.
• a transparent conductive film obtained by laminating a transparent conductive thin film through a resin layer having
• the surface of the transparent conductive thin film is
• Centerline average roughness (Ra) is from 0.11 to 0.18 ⁇ m
• the maximum height (Ry) is 0.9 to 1.6 m
• the average distance (S) between the local peaks is 0.05-5.11mm
• the surface of the transparent conductive thin film has a ten-point average surface roughness.
• the (Rz) force is preferably 0.6 to 1 m.
• the resin layer having a fine concavo-convex shape can form a fine concavo-convex shape with the fine particles by including fine particles.
• the fine particles have an average particle size of 2 ⁇ 0.4 ⁇ m and a standard deviation within 20% of the average particle size, and an average particle size of 3 ⁇ 0.4 m. And a mixture with fine particles having a standard deviation within 20% of the average particle diameter.
• the coating thickness power of the resin layer is 0.5 to 2 / zm.
• a film having a transparent dielectric thin film between the resin layer and the transparent conductive thin film can be used.
• a transparent substrate can be bonded to the surface of the transparent film base on which the transparent dielectric thin film is not provided via a transparent adhesive layer.
• a transparent substrate a laminated transparent substrate in which at least two transparent substrate films are laminated via a transparent adhesive layer can be used.
• the present invention also relates to an electrode plate for a touch panel using the transparent conductive film.
• the present invention provides a touch panel electrode plate on the touch side having a transparent conductive thin film and a touch panel electrode plate on the display side having a transparent conductive thin film, with the transparent conductive thin film facing each other. At least one of the touch panel electrode plates is formed from the touch panel electrode plate of the present invention.
• the present invention relates to a touch panel.
• the touch panel electrode plate of the present invention is preferably used for at least the display-side touch panel electrode plate in the touch panel.
• the transparent conductive film of the present invention is obtained by controlling the surface unevenness of the transparent conductive thin film by a resin layer having a fine unevenness, and the surface shape has a center line average roughness (Ra ), Maximum height (Ry), and average distance between local peaks (S).
• Ra center line average roughness
• Ry Maximum height
• S average distance between local peaks
• FIG. 1 is a cross-sectional view showing an example of a transparent conductive film of the present invention.
• FIG. 2 is a cross-sectional view showing an example of the transparent conductive film of the present invention.
• FIG. 3 is a cross-sectional view showing an example of the transparent conductive film of the present invention.
• FIG. 4 is a cross-sectional view showing an example of the transparent conductive film of the present invention.
• FIG. 5 is a cross-sectional view showing a touch panel using the transparent conductive film of the present invention.
• FIG. 6 is an explanatory diagram showing an outline of linearity measurement.
• FIG. 1 shows an example of the transparent conductive film of the present invention.
• a transparent conductive thin film 3 is provided on one surface of a transparent film substrate 1 via a resin layer 2 having fine irregularities. Are stacked.
• the fine particles 4 are contained in the resin layer 2, and a fine uneven shape is formed on the surface of the resin layer 2, whereby the fine uneven shape is also formed on the surface of the transparent conductive thin film 3. The shape is formed.
• the surface shape of the transparent conductive thin film has a center line average roughness (Ra) of 0.11 to 0.18 ⁇ m, a maximum height (Ry) of 0.9 to 1.6 / ⁇ ⁇ , and The average distance (S) between the local peaks is controlled to 0.05 to 0.11 mm.
• the Ra is a value controlled from the point of suppressing the occurrence of Neutling and the point of satisfying the durability, and the Ra is preferably 0.12-0.17 m. Furthermore, it is preferably 0.13 to 0.16 / zm.
• the Ry is a point-controlled value that suppresses the occurrence of Neutling and satisfies the durability, and the Ry is further 1 to 1.
• the S is a point-controlled value that suppresses glare, and the range is preferably 0.06 to 0.10 mm, and more preferably 0.0 to 0.10 mm. Is preferred.
• the surface shape of the transparent conductive thin film preferably has a ten-point average surface roughness (Rz) of 0.6 to Lm.
• the Rz is more preferably 0.7-1 / ⁇ ⁇ , and further preferably 0.8-1 m.
• the transparent conductive film of the present invention preferably has a haze value of 2.5% and more preferably 2% in terms of transparency.
• the transparent film substrate in the present invention can be used by appropriately selecting the material without any particular limitation.
• the thickness of these film base materials is not particularly limited, but is preferably in the range of 2 to 300 ⁇ m, and more preferably in the range of 10 to 130 / ⁇ ⁇ . If the thickness is less than that, the mechanical strength as a film base material may be insufficient, and it becomes difficult to continuously form a thin film such as a transparent conductive thin film by rolling the base material. On the other hand, if the thickness exceeds 300 m, there may be a problem in the winding property, and it may be difficult to carry out a simple rule of the transparent conductive thin film.
• Such a film base material is provided on the surface by performing etching treatment such as sputtering, corona discharge, flame, ultraviolet ray irradiation, electron beam irradiation, chemical conversion, oxidation, or undercoating on the surface in advance. You may make it improve the adhesiveness with respect to the film base material of the resin layer which has fine unevenness
• dust removal and cleaning may be performed by solvent cleaning or ultrasonic cleaning.
• a transparent conductive thin film is provided on one surface of the thus configured film substrate via a resin layer having a fine concavo-convex shape.
• the method of forming the resin layer having fine irregularities is not particularly limited, and an appropriate method can be adopted.
• the surface of the film used for forming the resin layer is preliminarily roughened by an appropriate method such as sandblasting, embossing roll, chemical etching, or the like, to give a fine uneven shape to the film surface.
• an appropriate method such as sandblasting, embossing roll, chemical etching, or the like
• a method for forming the surface of the material for forming the resin layer into a fine concavo-convex shape there is a method in which a resin layer is separately applied on the resin layer, and the surface of the resin layer is given a fine uneven shape by a transfer method using a mold or the like. Further, as shown in FIG.
• fine concavo-convex shape forming methods may be formed as a layer in which two or more methods are combined to combine fine concavo-convex shape surfaces in different states.
• a method of providing a resin layer containing fine particles in a dispersed manner is preferable from the viewpoint of the formability of the fine uneven surface.
• the oil Fine particles can be dispersed as the resin forming the layer, and a transparent film having sufficient strength as a film after the resin layer is formed can be used without particular limitation.
• the resin include a thermosetting resin, a thermoplastic resin, an ultraviolet curable resin, an electron beam curable resin, a two-component mixed resin, and the like.
• An ultraviolet curable resin that can efficiently form a light diffusion layer by a simple processing operation in the curing treatment is preferable.
• Examples of the ultraviolet curable resin include polyesters, acrylics, urethanes, amides, silicones, epoxies, and the like, and ultraviolet curable monomers, oligomers, polymers, and the like. included.
• the UV curable resin preferably used has, for example, one having an ultraviolet polymerizable functional group, and in particular, one containing an acrylic monomer or oligomer component having two or more, particularly 3 to 6 such functional groups. Can be given.
• an ultraviolet polymerization initiator is blended in the ultraviolet curable resin.
• additives such as a leveling agent, a thixotropic agent, and an antistatic agent can be used as the material for forming the resin layer.
• a thixotropic agent is advantageous for the formation of protruding particles on the surface of fine irregularities.
• thixotropic agents include silica of 0.1 m or less, My strength, and the like.
• the content of these additives is usually about 15 parts by weight or less, preferably 0.1 to 15 parts by weight with respect to 100 parts by weight of the ultraviolet curable resin.
• the fine particles those having transparency such as various metal oxides, glass, and plastics can be used without particular limitation.
• inorganic fine particles such as silica, alumina, titania, zirconia, calcium carbonate, polymethyl methacrylate, polystyrene, polyurethane, acrylic resin, acrylic monostyrene copolymer, benzoguanamine, melamine, polycarbonate, etc.
• examples include crosslinked or uncrosslinked organic fine particles having various polymer strengths, and silicone fine particles.
• One kind or two or more kinds of fine particles can be appropriately selected and used, but organic fine particles are preferred.
• acrylic resin is preferable from the viewpoint of refractive index.
• the average particle diameter of the fine particles is not particularly limited as long as it can form the surface of the fine irregularities such as Ra, Ry, S and the like, and is usually about 1 to: about LO / zm, preferably 1 to 4 / zm range What has a surrounding can be used. Further, fine particles having different particle diameters can be used in combination. In particular, it is preferable to use a combination of monodispersed fine particles having a standard deviation within 20% of the average particle size. In the present invention, in particular, as fine particles, fine particles having an average particle diameter of 2 ⁇ 0. And a standard deviation within 20% of the average particle diameter, and an average particle diameter of 3 ⁇ 0. It is preferable to use a mixture of fine particles within 20% of the diameter in combination.
• the fine particles having an average particle diameter of 2 ⁇ 0. Preferably have a force S having an average particle diameter of 2 ⁇ 0.3 m, more preferably 2 ⁇ 0.2 m, and further 2 ⁇ 0.1 m.
• the fine particles having an average particle size of 3 ⁇ 0.4 / zm preferably have an average particle size of 3 ⁇ 0.3 m, more preferably 3 ⁇ 0.2 ⁇ , and more preferably 3 ⁇ 0.: M.
• the standard deviation is preferably within 15% of the average particle diameter, and more preferably within 10% of the average particle diameter.
• the method for forming the resin layer containing fine particles is not particularly limited, and an appropriate method can be adopted.
• a resin containing fine particles for example, an ultraviolet curable resin: a coating solution
• the coating solution is applied by an appropriate method such as phanten, die coater, casting, spin coating, phanten metalling, and gravure.
• the proportion of the fine particles contained in the coating solution is not particularly limited, but is 0.1 to 20 parts by weight, further 0.1 to part by weight of LO with respect to 100 parts by weight of the resin. This is preferable for forming a surface with fine irregularities such as Ra, Ry, S, etc.
• the thickness of the resin layer is not particularly limited, but it is preferably about 0.5 to 7 / zm, particularly 0.5 to 2 / zm, in terms of cracking and curl characteristics.
• the thickness of the resin layer is a value calculated from the material used for forming the resin layer and the coating area.
• the film thickness of a resin layer is calculated
• the transparent conductive thin film is formed on the resin layer.
• Transparent conductive thin film can be formed by, for example, vacuum deposition, sputtering, ion plating, spray pyrolysis
• Various thin film forming methods such as a method, a chemical plating method, an electrical plating method, or a combination thereof can be appropriately selected. From the viewpoint of the formation rate of the transparent conductive thin film, the formation of a large area film, the productivity, etc., it is preferable to employ a vacuum deposition method or a sputtering method as the thin film formation method.
• a material capable of forming a transparent conductive film is appropriately selected and used.
• gold, silver, platinum, noradium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys such as alloys thereof, indium oxide, tin oxide, titanium oxide
• metal oxides composed of cadmium oxide and mixtures thereof, and other metal compounds composed of copper iodide and the like are used.
• indium oxide containing tin oxide, tin oxide containing antimony, and the like are preferably used.
• indium oxide containing tin oxide is preferable.
• the thickness of the transparent conductive thin film can be appropriately determined according to the purpose of use.
• the thickness is usually 10 to 300 nm, preferably 10 to 200 nm. If the thickness is less than lOnm, it will be difficult to form a continuous film with good electrical conductivity with a surface electrical resistance of 10 3 ⁇ or less. If it is too thick, the transparency will deteriorate.
• the transparent conductive thin film 3 is laminated on at least one surface of the transparent film substrate 1 via the resin layer 2 having a fine irregular shape.
• the resin layer 2 having a fine irregular shape.
• it can have other layers.
• at least one transparent dielectric thin film (transparent dielectric layer) 5 can be used between the resin layer 2 and the transparent conductive thin film 3.
• the transparent film base 1 the side where the resin layer 2 and the transparent conductive thin film 3 are not provided is provided with an antiglare treatment layer or an antireflection layer for the purpose of improving the visibility of the hard coat layer. Can do.
• the formation of the transparent dielectric thin film improves the adhesion between the resin layer and the transparent conductive thin film, and at the same time improves the scratch resistance and the flex resistance of the transparent conductive thin film. It is effective for improving the hit point characteristics.
• the refractive index of each transparent dielectric thin film can be controlled to further improve the characteristics.
• the transparent dielectric thin film is formed of an inorganic material, an organic material, or a mixture of an inorganic material and an organic material. can do.
• inorganic materials include NaF (l. 3), Na A1F (1. 35), LiF (
• Inorganic substances such as 2 3 [the numerical values in parentheses for the above materials are the refractive index of light] are preferably used.
• the organic substance include organic substances such as acrylic resin, urethane resin, melamine resin, alkyd resin, and siloxane polymer.
• the organic material it is desirable to use a thermosetting resin that is a mixture of melamine resin, alkyd resin, and organic silane condensate.
• the transparent dielectric thin film can be formed using the above-mentioned materials by a vacuum deposition method, a sputtering method, an ion plating method, a coating method, or the like.
• the thickness of each layer of the transparent dielectric thin film can be appropriately set. Usually, it is about 10 to 200 nm, preferably 15 to: L00 nm, preferably 20 to 60 nm! / ⁇ .
• the following first transparent dielectric thin film and second transparent dielectric thin film are preferably formed in this order from the resin layer side.
• the first transparent dielectric thin film is formed by vacuum deposition, sputtering, or ion plating, and the first transparent dielectric thin film contains 0 to 100 parts by weight of indium oxide.
• n3 ⁇ 20 parts by weight, composed of complex oxides containing 10-40 parts by weight of cerium oxide, n1 for the refractive index of the first transparent dielectric thin film, n2 for the refractive index of the second transparent dielectric thin film, transparent conductive
• the refractive index of the conductive thin film is n3
• those satisfying the relation of n2 and n3 ⁇ nl are preferable.
• the first transparent dielectric thin film is formed of a composite oxide containing a specific amount of tin oxide and cerium oxide with respect to indium oxide.
• the composite oxide is a transparent conductive material, in which a composite of indium oxide and tin oxide is further added with cerium oxide, thereby providing a high refractive index higher than the refractive index of the transparent conductive thin film.
• the difference in refractive index between the first transparent dielectric thin film and the second transparent dielectric thin film becomes large, optical adjustment can be easily performed, and transparent conductive material having good optical characteristics such as transparency. Can be obtained.
• the first transparent dielectric thin film formed of the composite oxide is controlled to have a high resistance value that does not affect the conductivity of the transparent conductive thin film having a high surface resistance value.
• the surface resistance value of the first transparent dielectric thin film is preferably insulative (high resistance value) so as not to affect the conductivity of the transparent conductive thin film 1 ⁇ 10 6 ( ⁇ / ⁇ ) More preferably, it is preferably 1 ⁇ 10 8 ( ⁇ ⁇ ) or more.
• the first transparent dielectric thin film is made of a composite oxide having a high refractive index and a high resistance value containing a specific component at a specific ratio, and the first transparent dielectric thin film is formed by a dry process. Therefore, coloring of transmitted light can be suppressed, and optical adjustment with high productivity can be easily performed.
• the refractive index ⁇ 3 of the light of the conductive thin film 3 preferably satisfies the relationship n2 ⁇ n3 ⁇ nl.
• the light refractive index ⁇ 3 of the transparent conductive thin film 3 is about 2 (usually 1.9-1.2-1).
• the light refractive index nl of the first transparent dielectric thin film is The refractive index n2 of the light of the second transparent dielectric thin film, which is preferably about 1.9 to 2.3, more preferably 2.0 to 2.2, is usually 1.3 to 1. It is preferably about 7 and more preferably 1.4 to 1.6.
• the first transparent dielectric thin film is formed of a complex oxide containing a specific amount of acid tin and acid cerium with respect to 100 parts by weight of indium oxide.
• a forming material it is preferable to use a sintered body of a mixture of each oxide component.
• the proportion of acid tin is 0 to 20 parts by weight with respect to 100 parts by weight of indium oxide from the viewpoint of optical properties. Furthermore, it is preferably 3 to 15 parts by weight.
• the proportion of tin oxide exceeds 20 parts by weight, when a sintered body is used as a forming material, the sintered density is lowered, so that it is difficult to maintain a stable discharge during film formation (the discharge stability is poor). ).
• the ratio of cerium oxide is 10 to 40 parts by weight with respect to 100 parts by weight of indium oxide from the viewpoint of high resistance (insulating properties) and optical characteristics. Furthermore, 15 to 30 parts by weight is preferable. If the ratio of cerium oxide is less than 10 parts by weight, the surface resistance value of the first transparent dielectric thin film becomes low and becomes conductive. On the other hand, if the ratio of cerium oxide exceeds 40 parts by weight, productivity (film-forming sputter rate) decreases. [0055]
• the thickness of the first transparent dielectric thin film is not particularly limited, but is preferably 10 to 200 nm. Furthermore, it is preferably 15 to 60 nm. If it is less than 10 nm, it is difficult to form a continuous film. On the other hand, a force of 200 nm or less is preferable from the viewpoint of optical adjustment.
• Examples of the material of the second transparent dielectric thin film include inorganic materials exemplified in the above-described transparent dielectric thin film, acrylic resin having a refractive index of light of about 1.4 to 1.6, Organic substances such as urethane resin, siloxane polymer, alkyd resin, and melamine resin can be used. A material is appropriately selected or combined from these materials to form a second transparent dielectric thin film satisfying the refractive index n2.
• the thickness of the second transparent dielectric thin film is not particularly limited, but it is preferable to use a continuous film and to have transparency of 1Onm or more in order to improve the killing resistance.
• the thickness is preferably 10 to 200 nm, particularly preferably 20 to 120 nm. Note that if the total thickness of the thickness of the first transparent dielectric thin film and the thickness of the second transparent dielectric thin film is too large, improvement in transparency cannot be expected, and cracks may occur.
• the total thickness is preferably 300 nm or less, more preferably 200 nm or less.
• Examples of the method for forming the first transparent dielectric thin film include a vacuum vapor deposition method, a sputtering method, an ion plating method, and the like.
• the first transparent dielectric thin film is appropriately selected depending on the type of material and the required film thickness.
• the force that can be employed is the sputtering method.
• a coating method or the like can be employed as a method for forming the second transparent dielectric thin film.
• the hard coat layer is obtained by performing a hard coat treatment on one surface of the film substrate.
• the hard coat treatment can be performed, for example, by a method of applying a hard resin such as an acrylic urethane resin or a siloxane resin and performing a curing process.
• a hard resin such as an acrylic urethane resin or a siloxane resin
• the hard coat treatment when the surface is roughened by blending a silicone resin or the like with a hard resin such as acrylic urethane-based resin or siloxane-based resin, it is used as a touch panel or the like.
• a non-glare surface that can prevent reflection due to mirroring can be formed simultaneously.
• the thickness of the hard coat layer is too thin, the hardness may be insufficient, whereas if it is too thick, cracks may occur. Further, considering the anti-curling property and the like, the preferable thickness of the hard coat layer is about 0.1 to 30 / ⁇ ⁇ .
• a transparent substrate 6 different from the film substrate 1 is attached to one side of the film substrate 1 on the side where the transparent conductive thin film 3 is not provided. Can be laminated through layer 7.
• the adhesive layer 7 may be provided on the transparent substrate 6, and the film base 1 may be bonded to the transparent base 6.
• the above-mentioned pressure-sensitive adhesive may be applied to the film base 1.
• the layer 7 may be provided, and the transparent substrate 6 may be bonded thereto. In the latter method, the pressure-sensitive adhesive layer 7 can be continuously formed with the film substrate 1 in a roll shape, which is more advantageous in terms of productivity.
• the pressure-sensitive adhesive layer is not particularly limited as long as it has transparency.
• an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, or the like is used.
• the pressure-sensitive adhesive layer has a function of improving the impact characteristics of the conductive thin film provided on one surface of the film base material for the touch panel after the adhesion of the transparent substrate. In order to perform this function better, it is desirable to set the elastic modulus of the pressure-sensitive adhesive layer in the range of 1 to 100 N / cm 2 , the thickness of 1 ⁇ m or more, and usually 5 to: LOO m.
• the pressure-sensitive adhesive layer becomes inelastic. Therefore, the pressure-sensitive adhesive layer is easily deformed by pressurization, causing irregularities in the film substrate and thus the conductive thin film. The adhesive sticks out of the cut surface, and the effect of improving the spot characteristics as a touch panel is reduced as soon as the conductive thin film is scratched. On the other hand, if it exceeds lOON / cm 2 , the pressure-sensitive adhesive layer becomes hard and the cushion effect cannot be expected, and the scratch resistance of the conductive thin film cannot be improved as a touch panel.
• the thickness of the pressure-sensitive adhesive layer is less than 1 ⁇ m, the cushioning effect cannot be expected, and therefore the scratch resistance of the conductive thin film cannot be improved as a touch panel.
• the pressure-sensitive adhesive layer is too thick, the transparency is impaired, and it is difficult to obtain good results in terms of formation of the pressure-sensitive adhesive layer, bonding workability of the transparent substrate, and cost.
• Such a transparent substrate bonded via the pressure-sensitive adhesive layer imparts good mechanical strength to the film substrate, and contributes particularly to the prevention of curling and the like.
• the transparent substrate 6 can have a single-layer structure, or a laminate having a composite structure in which two or more transparent substrate films are bonded together with a transparent adhesive layer. The overall mechanical strength can be further improved.
• two substrates are used as the transparent substrate 6.
• the transparent base films 61 and 62 are bonded together with a transparent adhesive layer 63.
• the transparent substrate 6 has a composite structure, durability against surface pressure can be improved.
• the transparent substrate is bonded to the one shown in FIG. 1. 1S
• the transparent substrate can also be bonded to the one shown in FIG.
• a transparent conductive film is required to be flexible even after a single-layer transparent substrate is bonded, a plastic film with a thickness of about 6 to 300 m is usually used. Yes.
• the thickness of the transparent substrate is usually 0.05 to: a glass plate or a film-like plastic having a thickness of about LOm m. Examples of the plastic material include the same materials as those described above.
• the thickness of the transparent substrate is the same as described above.
• the thickness of the transparent substrate having a plurality of structures is a total thickness obtained by bonding two or more transparent substrate films with a transparent adhesive layer. That is, when the transparent conductive film is required to be flexible even after the transparent substrates having a plurality of structures are bonded together, the thickness of the transparent substrate having a plurality of structures is usually about 6 to 300 m. is there.
• the plastic film similar to the film substrate is used as the two or more transparent base films.
• the thickness of the transparent substrate when flexibility is not particularly required is usually about 0.05 to about LO mm.
• a glass plate or a film-like glazed plate-like plastic is used as the two or more transparent base films. These can also be combined. Examples of the plastic material include the same materials as those described above.
• the transparent pressure-sensitive adhesive layer used for bonding two or more transparent substrate films is made of the same material as described in the bonding of the transparent substrate and the film substrate. Preferably used.
• an antiglare treatment layer or an antireflection layer for improving visibility is provided on the outer surface of the transparent substrate (the surface opposite to the pressure-sensitive adhesive layer).
• a hard coat layer may be provided for the purpose of protecting the surface.
• a cured film made of a curable resin such as melanin-based resin, urethane-based resin, alkyd-based resin, acrylic-based resin, or silicon-based resin is preferably used.
• the transparent conductive film of the present invention is used in the formation of various devices such as touch panels and liquid crystal displays. In particular, it can be preferably used as an electrode plate for a touch panel.
• the touch panel electrode plate on the touch side having the transparent conductive thin film and the touch panel electrode plate on the display side having the transparent conductive thin film are arranged so that the transparent conductive thin film faces each other.
• the touch panel electrode plate having the transparent conductive film force of the present invention can be used for both the touch panel electrode plate and the touch panel electrode plate.
• the touch panel electrode plate having a transparent conductive film strength according to the present invention has a touch panel electrode on the display side from the viewpoint of suppressing the occurrence of Neutling, satisfying durability and display characteristics, and reducing the thickness of the touch panel. It is preferable to use it as a plate.
• FIG. 5 shows an example of a touch panel when the touch panel electrode plate having the transparent conductive film force of the present invention shown in FIG. 1 is used as a touch panel electrode plate on the display side. That is, a pair of panel plates (touch panel electrode plates) Pl and P2 having transparent conductive thin films 3a and 3b are arranged so that the transparent conductive thin films 3a and 3b provided so as to be orthogonal to each other face each other.
• the transparent conductive film shown in FIG. 1 described above is used as the display-side (lower) panel plate P1.
• the fine particles 4 in the resin layer 2 of the transparent conductive film shown in FIG. 1 are omitted!
• this touch panel When this touch panel is pressed with an input pen from the panel board P2 side, the transparent conductive thin films 3a and 3b come into contact with each other, the electric circuit is turned on, and the above press is released. Then, it functions as a transparent switch that returns to the original OFF state. At that time, since the panel plate P 1 also has the above-mentioned transparent conductive film force, the occurrence of Neutling can be suppressed and the durability and display characteristics can be satisfied.
• the panel plate P2 is a transparent base 8 made of a plastic film, a glass plate, or the like, and the transparent conductive thin film 3b is provided, but the same as the panel plate P1 described above. Use the transparent conductive film shown in Figure 1.
• Monodisperse filler with an average particle size of 2.2 m as fine particles (Material: Cross-linked acrylic resin, standard deviation 0.22 ⁇ m, product grade manufactured by Soken Chemical Co., Ltd .: MX-type) 5 parts and monodisperse filler with an average particle diameter of 3 m (Material: Cross-linked acrylic resin, standard deviation 0.3 ⁇ m, product grade made by Soken Chemical Co., Ltd .: MX-type) 0.1 part Was used.
• UV curable resin acrylic urethane resin, trade name 17-806 manufactured by Dainippon Ink & Chemicals, Inc.
• photopolymerization initiator Ciba A product name Irgacure 184 manufactured by Sharti Chemicals Co., Ltd. was prepared by mixing 5 parts by weight and a solvent (toluene) weighed so that the solid content was 50% by weight.
• the above coating solution was applied to one side of a transparent film substrate made of a polyethylene terephthalate film with a thickness of 100 ⁇ m using a wire bar so that the coating thickness after drying was 1. Then, after drying at 100 ° C. for 3 minutes, the resin was cured by ultraviolet irradiation to form a fine concavo-convex surface resin layer.
• a sintered body of a mixture of indium oxide and tin oxide (97% by weight of indium oxide, 97 wt%, A transparent conductive thin film (ITO thin film: refractive index 2.0) with a composite oxide strength of 20nm thick tin oxide and tin oxide is formed by sputtering using 3% by weight of tin oxide).
• a transparent conductive film was prepared.
• Example 1 The coating solution prepared in Example 1 was used. In the formation of the resin layer of Example 1, a resin layer was formed in the same manner as in Example 1 except that the coating thickness of the resin layer was changed to 1.4 m. A transparent conductive film was prepared in the same manner as in Example 1.
• Example 3 The coating solution prepared in Example 1 was used. In the formation of the resin layer of Example 1, a resin layer was formed in the same manner as in Example 1 except that the coating thickness of the resin layer was changed to 1.8 m. A transparent conductive film was prepared in the same manner as in Example 1.
• Example 1 The coating solution prepared in Example 1 was used.
• a resin layer was formed in the same manner as in Example 1 except that in the formation of the resin layer of Example 1, the coating thickness of the resin layer was changed to 0.8 m.
• a transparent conductive film was prepared in the same manner as in Example 1.
• spoon indium 68 weight 0 I tin oxide 2 wt 0/0, by sputtering had use targets Sani ⁇ cerium 30 weight 0/0), of indium oxide and tin oxide and Sani ⁇ cerium thickness 23nm
• a high refractive index thin film (refractive index 2.2) made of a complex oxide was formed.
• silica sol (Colcoat P manufactured by Colcoat Co., Ltd.) diluted with ethanol to a solid content concentration of 2% is applied, dried and cured at 150 ° C for 2 minutes. Then, an SiO thin film (refractive index 1.45) having a thickness of about 50 nm was formed. The refractive index is measured by Atago Co., Ltd.
• a transparent conductive thin film (ITO thin film) is formed on the SiO thin film in the same manner as in Example 1.
• a transparent conductive film was prepared.
• Example 1 In the preparation of the coating liquid of Example 1, a coating liquid was prepared in the same manner as in Example 1 except that 0.6 part of a monodispersed filter having an average particle diameter of 3 m was used as fine particles. A resin layer was formed in the same manner as in Example 1 except that the coating solution was used, and a transparent conductive film was prepared in the same manner as in Example 1.
• Example 1 The coating solution prepared in Example 1 was used.
• the resin layer A resin layer was formed in the same manner as in Example 1 except that the coating thickness was changed to 2.1 ⁇ m.
• a transparent conductive film was prepared in the same manner as in Example 1.
• Example 1 As a fine particle, a monodispersed filler having an average particle diameter of 4 m (material: cross-linked acrylic resin, standard deviation 0.4 ⁇ , manufactured by Soken Chemical Co., Ltd.) (Commercial grade: MX-type) A coating solution was prepared in the same manner as in Example 1 except that 1 part was used. A resin layer was formed in the same manner as in Example 1 except that the coating solution was used, and a transparent conductive film was prepared in the same manner as in Example 1.
• Example 1 As a fine particle, a monodispersed filler having an average particle diameter of 4 m (material: cross-linked acrylic resin, standard deviation 0.4 ⁇ , manufactured by Soken Chemical Co., Ltd.) (Commercial grade: MX-type) A coating solution was prepared in the same manner as in Example 1 except that 1 part was used. Further, in the formation of the resin layer of Example 1, a resin layer was formed in the same manner as Example 1 except that the coating thickness of the resin layer was changed to 1.4 m. A transparent conductive film was prepared in the same manner as in Example 1.
• Example 1 As a fine particle, a monodispersed filler having an average particle diameter of 4 m (material: cross-linked acrylic resin, standard deviation 0.4 ⁇ , manufactured by Soken Chemical Co., Ltd.) (Product grade: MX-type) 0.1 part and monodisperse filler with an average particle size of 5 m (Material: Cross-linked acrylic resin, standard deviation 0. ⁇ ⁇ ⁇ , manufactured by KENKEN CO., LTD.) (Grade: MX-type) A coating solution was prepared in the same manner as in Example 1 except that 0.1 part was used. Further, in the formation of the resin layer of Example 1, the resin layer was formed in the same manner as in Example 1 except that the coating thickness of the resin layer was changed to 1.4 m. A transparent conductive film was prepared in the same manner as in Example 1.
• JIS1994-B0601 as a stylus type surface roughness measuring instrument, ET- manufactured by Kosaka Laboratory Ltd. Measured using 4000. The measurement was performed by scanning the uneven surface with a length of 3 mm in a certain direction via a measuring needle with a diameter of 1 mm, with a tip of diamond made of a pyramid with an apex of 55 degrees. From the recorded surface roughness curve, the centerline average surface roughness (Ra), the maximum height (Ry), the average interval between local peaks (S) and ten points are measured. Average surface roughness (Rz) was calculated.
• Visible light transmittance at a light wavelength of 550 nm was measured using a spectroscopic analyzer UV-240 manufactured by Shimadzu Corporation.
• the transparent conductive film of each example was used as one (display side) panel plate, and the other panel plate was formed by forming an ITO thin film with a thickness of 30 nm on a glass slope in the same manner as described above.
• a touch panel as a switch structure was manufactured by placing the two panels facing each other so that the gap between the two panel plates was 150 m through a spacer with a thickness of 20 m so that the ITO thin films would face each other.
• the ITO thin films on both panel plates were formed so as to be orthogonal to each other prior to the opposing placement.
• Linearity was measured by applying a voltage of 5 V to the transparent conductive laminate and measuring the output voltage between the terminal A (measurement start position) and terminal B (measurement end position) to which the voltage was applied in the transparent conductive laminate.
• the output voltage at start position A is E
• the output voltage at measurement end position B is
• the outline of linearity measurement is as shown in FIG.
• the position of the pen displayed on the screen is determined from the resistance value of the contact portion between the upper panel and the lower panel when pressed with the pen!
• the resistance value is determined as if the output voltage distribution on the upper and lower panel surfaces is like a theoretical line (ideal line)!
• the actual pen position and the pen position on the screen determined by the resistance value will not synchronize well.
• the deviation of the theoretical line force is linearity, and the larger the value, the greater the deviation between the actual pen position and the pen position on the screen.
• the transparent conductive film of the present invention is suitably used for an electrode plate for a touch panel.

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• 2006
  • 2006-08-30 KR KR1020087001402A patent/KR100954309B1/ko active Active
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