201237720 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種觸控元件，特別是指一種薄型軟 性電容式觸控元件。 【先前技術】 觸碰感應技術（touch sensing technology)是慣用來對一 電子裝置提供一多樣的輸入信號，並已廣泛地被運用至行 動電子裝置的觸控面板（touch screen)。有關於觸碰感應的原 理，可參閱US 2010/0230181 A1所揭示之輸入裝置的技術 内容。 US 7,030,860 B1揭不·^種用於電子裝置之軟性透光觸 碰感應系統（flexible transparent touch sensing system for electronic devices)。該軟性透光觸碰感應系統具有一如圖 1、圖2及圖3所示之二維電容式感應器（tw〇_dimensi〇nal capacitive sensor)l。該二維電容式感應器！包含：一上電 極單元11、一下電極單元12、一夾置於該等電極單元u、 12之間並用以黏附該等電極單元丨1、i 2的絕緣層13，及一 選擇性亦可省略之不透光層14。 該上電極單元11具有一軟性透光基板m，及一形成 在該軟性透光基板Π 1之一下表面的γ軸電極丨丨2陣列。 該下電極單元12具有一軟性透光基板121，及一形成在該 軟性透光基板121之一上表面的X軸電極丨22陣列。該等 幸人性透光基板111、121是分別使用一聚醋薄膜（p〇iyester film)。 201237720 US 7,030,860 B1所揭示之二維電容式感應器i屬目前 此技術領域中較為常見的電容式觸控元件；該等軟性透光 基板111、121亦可使用厚度約18〇 的聚對苯二甲酸二 乙酯（polyethylene terephathalate，PET)薄膜來取代；而該絕 緣層13於此技術領域中一般是使用光學膠（〇pUcal cement adhesive ’ OCA)，且厚度約控制在5〇 μηι左右。 該二維電谷式感應器1 一般是透過兩分別鍵合卬⑽以吨) 於該等電極單元11、12之一側部上的軟性印刷電路 (flexible printed circuit board，FPCB，圖未示），來將其產 生的電谷變化傳送到電子裝置的一運算邏輯電路進行訊號 處理。就空間配置上來看，該二維電容式感應器丨所鍵合 的該兩FPCB —方面於二維空間上的平面位置佔用掉兩側的 使用空間；另一方面，該二維電容式感應器i的總厚度為 410 μηι，於三維空間上亦佔用使用空間；因此，不利於行 動電子裝置的輕薄短小化；再者，此種二維電容式感應器i 僅屬可彎曲式（bendable)者而非可捲曲式（rollable)者。 經上述說明可知’縮減電容式觸控元件的整體體積以 進一步地有利於電子裝置的輕薄短小化，並使觸控元件可 被應用於可捲曲式之觸控面板，是此技術領域者所需改進 的課題。 【發明内容】 因此，本發明之目的，即在提供一種薄型軟性電容式 觸控元件。 本發明之另一目的，即在提供另一種薄型軟性電容式 201237720 觸控元件。 本發明之再一目的，即在提供再另一種薄型軟性電容 式觸控元件。 本發明之又-目@，即I提供又另一種薄型軟性電容 式觸控元件。 於是，本發明一種薄型軟性電容式觸控元件，是用以 電連接兩分別連接於-電子裝置之一運算電路的軟性㈣ 電路板。該薄型軟性電容式觸控元件包含：一形成有一多 層膜並具有一厚度w第一軟性基板、一具有一厚度“ 第二軟性基板，及-夾置於該第一軟性基板之多層膜與該 第二軟性基板之間的光學膠層。該光學膠層具有一足以支 樓該第一、二軟性基板的厚度，τ心i，τ心卜且 該多層膜界定出複數個電容。該薄型軟性電容式觸控元件 ㈣厚度是小於35〇陣，該第—軟性基板之多層膜的並中 :電容在觸碰後所反應的電容變化，是經由該等軟性印刷 電路板被傳送至該電子裝㈣運算電路以進行處理。 本發明另一種薄型軟性電容式觸控元件，是用以電連 接兩分別連接於—電子裝置之一運算電路的軟性印刷電路 ^该溥型軟性電容式觸控元件包含：一形成 =列並具有-厚“㈣—軟性基板、—形 :極陣列並具有—厚度,2的第二軟性基板，及—爽上 極陳軟性基板之第—電極陣列與該第二軟性基板之第二電 -、二軟性基板π;:膠層具有一足以如 …予度ΤΊ，丁】〜。，且。該第— 201237720 電極陣列電連於其中一軟性印刷電路板，該第二電極陣列 電連於其中另一軟性印刷電路板，且每一第一電極與每— 第二電極互不平行。該薄型軟性電容式觸控元件的總厚产 是小於350卿’該等第一電極與該等第二電極的其中―： 錯位置在觸碰後所反應之電容變化，是經由該等軟性印刷 電路板被傳送至該電子裝置的運算電路以進行處理。 本發明再另一種薄型軟性電容式觸控元件，是用以電 連接-連接於一電子裝置之一運算電路的軟性印刷電路 板。該薄型軟性電容式觸控元件包含：一形成有一第一電 極陣列及-第二電極陣列的軟性基板，及一央置於該等電 極陣列之間的光學膠層。該軟性基板具有一第一區、一面 向該第-區的第二區、-連接該第一、二區的彎折區，及 -鄰近於該第一區及第二區其中一者的鍵合區。該鍵合區 具有相間隔設置的一第一佈線段及一第二佈線段。每一第 一電極具有一形成於該軟性基板之第一區的第一段及一 自其第一段延伸至該鍵合區之第一佈線段的第二段。每一 第二電極具有一形成於該軟性基板之第二區的第一段，及 一自其第一段延伸至該鍵合區之第二佈線段的第二段，且 每一第一電極的第一段與每一第二電極的第一段互不平 行。該薄型軟性電容式觸控元件的總厚度是小於35() ， 該軟性基板具有一厚度h，該光學膠層具有一足以支撐該軟 性基板的厚度Τζ，且。該等第一電極之第一段與該 等第二電極之第一段的其中一交錯位置在觸碰後所反應之 電谷變化疋經由鍵合於該鍵合區的軟性印刷電路板被傳 201237720 送至該電子裝置的運算電路以進行處理。 此外，本發明又另一種薄型軟性電容式觸控元件，是 用以電連接一連接於—雷；站$ 電子裝置之一運算電路的軟性印刷 電路板。該薄型軟性電容式觸控元件包含：—形成有一第 電極陣列及-第二電極陣列之軟性基板、一導電勝陣 列、-佈線陣列，及一炎置於該等電極陣列之間的光學膠 層。該軟性基板具有一第一區、一面向該第一區的第二 區、_連接該第一、二區的彎折區，及一鄰近於該第一區 及第一區其中一者的鍵合區。該鍵合區具有相間隔設置的 -第-佈線段及一第二佈線段。每一第一電極具有一形成 於該軟性基板之第一區的第一段，及一自其第一段延伸至 該鍵合區之第一佈線恐沾势_饥 牙忡骒奴的弟一段。每一第二電極具有一形 成於該軟性基板之第二區的第一段，且每一第一電極的第 -段與每-第二電極的第一段互不平行。該導電膠陣列是 形成於。亥权f生基板之第二區的一側部，且每一導電膠與其 對應之第—電極之第_段的—端部相連接。該佈線陣列形 成於該軟性基板之第_區的—側部，每—佈線具有一與其 對應之導電膠連接的導電膠段，及一自其導電膠段延伸至 該鍵合區之第二佈線段的佈線段。該薄型軟性電容式觸控 元件的總厚度是小力350 _，該軟性基板具有一厚度^， 該光學膠層具有-足以支#該軟性基板的厚度I，且从 21。邊等第一電極之第一段與該等第二電極之第一段的其 中一父錯位置在觸碰後所反應之電容變化，是經由鍵合於 該鍵合區的軟性印刷電路板被傳送至該電子裝置的運算電 201237720 路以進行處理。 本發明之功效在於：一方面可縮減電容式觸控元件的 整體體積以進一步地有利於電子裝置的輕薄短小化，另— 方面使其可被應用於可捲曲式之觸控面板。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之八個具體實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前’要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖4’本發明之薄型軟性電容式觸控元件的一第一 具體實施例，是用以電連接兩分別連接於一電子裝置之一 運算電路（圖未示）的軟性印刷電路板91(圖4僅顯示出一軟 性印刷電路板91) 〇本發明該第一具體實施例之薄型軟性電 容式觸控元件包含：一形成有一多層膜21並具有一厚度q 的第一軟性基板2、一形成有一塗層31並具有一厚度。的 第一軟性基板3,及一夾置於該第一軟性基板2之多層膜 21與該第二軟性基板3之間的光學膠層4。 適用於本發明該第一具體實施例之塗層31，是一電磁 遮蔽塗層（shade layer)、一光遮蔽塗層（Biack MatHx)、一抗 反射（anti-reflection，AR)塗層、一抗光亮（anti giare，ag) 塗層、一防污（anti_smudge , AS)塗層、一彩色濾光（c〇1〇r . CF)塗層、一偏光塗層，或一硬塗層（harcj coating ’ HC)。在本發明該第一具體實施例中，該塗層3丨是一形成 201237720 .在該第二軟性基板3之一下表面的金屬遮蔽層。 該多層膜21由下而上依序具有一第一電極2U陣列、 一第一介電層212—第二電極213陣列，及一第二介· 川，其t ’藉該多層@ 21之膜層結構界定出複數 容0 該光學膠層4具有一足以支撐第 、 _- -一- /W： ， 及該等軟性印刷電路板91之重量的厚度Τι，， 丁丨以1 ’且該薄型軟性電容式觸控元件的總厚度是小於 350 μηι。 該第-軟性基板2之多層膜21的其中—電容在觸碰後 所反應的電容變化，是經由該等軟性印刷電路板91被傳送 至該電子裝置的運算電路以進行處理。 較佳地°亥第一具體實施例之薄型軟性電容式觸控元 件的總厚度是介於30 μηι〜35〇 μηι之間，^ $Tl/t2$68 ;或者11與k介於5 μηι〜110 μηι之間，τ丨介 於20 μηι〜340 μηι之間；且該光學膠層4局部覆蓋該等軟 性印刷電路板91。 更佳地，本發明該第一具體實施例之薄型軟性電容式 觸控7G件更包含一大於25 mm之曲率半徑，該光學膠層4 經JIS K6253測得的硬度是介於D2〇〜D5〇之間；該薄型軟 性電容式觸控元件的總厚度是大於丨〇〇 ; 2 ^ TiZq $ Μ， 且 2ST丨/t2$68。再更佳地’ 10$Τι/ίι$68，且 1〇$Ti/t2$ 68 〇 適用於本發明該等軟性基板2、3可以是由聚醯亞胺 201237720 (polyimide，PI)、聚對苯二曱酸二乙酯（PET)、聚萘二曱酸 乙二醇酿（polyethylene naphthalate，PEN)、三乙醯基纖維素 (triacyl cellulose，TAC)、聚碳酸醋（polycarbonate，PC)、 聚對苯二甲酸丙二醇醋（polytrimethylene terephthalate， PTT)、 聚對苯二曱酸丁二醇酉旨 (polybutylene terephthalate ， PBT)， 或聚甲基丙烯酸甲酉旨 (polymethylmethacrylic，PMMA)所構成；適用於本發明該 光學膠層4可以是由壓克力系（acrylic-based resin)的膠材、 樹脂（epoxy)膠材、石夕氧院類（siloxane)膠材，或聚氨基曱酸 乙酉旨（polyurethane，PU)膠材所構成。 在本發明該第一具體實施例中，該等軟性印刷電路板 91的重量（含FPC及1C重量）約0.7 g ;該等軟性基板2、3 分別是一聚醯亞胺（PI)膜，且ti與t2約為10 μιη ;該光學膠 層4是一固化後硬度為JIS Κ6253 D34之壓克力系的膠材’ 乃約為280 μιη ;即，TVh與TVt2趨近28。 本發明是基於「薄型」的概念’其第一具體實施例之 整體強度是仰賴於該光學膠層4的厚度丁1來支樓。在滿足 該第一具體實施例之整體強度的條件下，相對調低該等軟 性基板2、3的厚度t,、t2，於三維空間上，本發明該薄型 軟性電容式觸控元件的整體厚度相對該二維電容式感應器1 的整體厚度低。此外，本發明該第一具體實施例之薄型軟 性電容式觸控元件的一最小曲率半徑，可趨近25 mm ;據 此，該第一具體實施例為可彎曲式’且該配合使用之電子 裝置是可彎曲式的觸控面板。201237720 VI. Description of the Invention: [Technical Field] The present invention relates to a touch element, and more particularly to a thin flexible capacitive touch element. [Prior Art] Touch sensing technology is conventionally used to provide a variety of input signals to an electronic device, and has been widely applied to touch screens of mobile electronic devices. For the principle of touch sensing, reference is made to the technical content of the input device disclosed in US 2010/0230181 A1. US 7,030,860 B1 discloses a flexible transparent touch sensing system for electronic devices. The flexible translucent touch sensing system has a two-dimensional capacitive sensor (tw〇_dimensi〇nal capacitive sensor) as shown in FIGS. 1, 2 and 3. The two-dimensional capacitive sensor! The present invention comprises: an upper electrode unit 11, a lower electrode unit 12, an insulating layer 13 interposed between the electrode units u, 12 for adhering the electrode units 丨1, i2, and a selectivity may also be omitted The opaque layer 14 is opaque. The upper electrode unit 11 has a flexible transparent substrate m and an array of γ-axis electrodes 形成 2 formed on a lower surface of the flexible transparent substrate Π 1 . The lower electrode unit 12 has a flexible transparent substrate 121 and an array of X-axis electrodes 22 formed on one surface of the flexible transparent substrate 121. The above-mentioned fortunate transparent substrates 111 and 121 are each made of a polyester film. The two-dimensional capacitive sensor disclosed in 201237720 US 7,030,860 B1 is a capacitive touch element which is relatively common in the prior art; the flexible transparent substrates 111 and 121 can also be used with poly(p-benzoene) having a thickness of about 18 〇. The polyethylene terephathalate (PET) film is substituted; and the insulating layer 13 is generally made of 〇pUcal cement adhesive ' OCA, and the thickness is controlled to about 5 〇 μηι. The two-dimensional electric valley sensor 1 is generally a flexible printed circuit board (FPCB, not shown) which is respectively bonded to one side of the electrode units 11, 12 by two 卬 (10). To transmit the generated electricity valley change to an arithmetic logic circuit of the electronic device for signal processing. In terms of spatial configuration, the two FPCBs that are bonded by the two-dimensional capacitive sensor occupy the use space on both sides in a planar position on the two-dimensional space; on the other hand, the two-dimensional capacitive sensor The total thickness of i is 410 μηι, which also occupies space in three dimensions; therefore, it is not conducive to the thinness and thinness of mobile electronic devices; furthermore, such two-dimensional capacitive sensor i is only bendable. Not a rollable. It can be seen from the above description that the overall volume of the capacitive touch element can be reduced to further facilitate the thinning and thinning of the electronic device, and the touch element can be applied to the rollable touch panel, which is required by the technical field. Improved topics. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a thin flexible capacitive touch element. Another object of the present invention is to provide another thin flexible capacitive type 201237720 touch element. Still another object of the present invention is to provide yet another thin flexible capacitive touch element. In addition, the present invention provides another thin flexible capacitive touch element. Therefore, a thin flexible capacitive touch element of the present invention is used for electrically connecting two soft (four) circuit boards respectively connected to one of the operational circuits of the electronic device. The thin flexible capacitive touch element comprises: a first flexible substrate formed with a multilayer film and having a thickness w, a second flexible substrate having a thickness, and a multilayer film sandwiched between the first flexible substrate and the An optical adhesive layer between the second flexible substrates. The optical adhesive layer has a thickness sufficient to support the first and second flexible substrates, and the multilayer film defines a plurality of capacitors. The thin flexible The thickness of the capacitive touch element (4) is less than 35 〇 array, and the multilayer film of the first flexible substrate is: the capacitance change reflected by the capacitor after the touch is transmitted to the electronic device via the flexible printed circuit board. (4) an arithmetic circuit for processing. Another thin flexible capacitive touch element of the present invention is for electrically connecting two flexible printed circuits respectively connected to an arithmetic circuit of an electronic device. The flexible capacitive touch element comprises : a formation = column and having - thick "(four) - a flexible substrate, a shape: a pole array and having a thickness, a second flexible substrate of 2, and a first electrode array of a soft substrate of the upper electrode and the first A second flexible substrate of electrically -, two π ;: flexible substrate layer has a degree sufficient to as ... ΤΊ, butoxy} ~. And. The No. 201237720 electrode array is electrically connected to one of the flexible printed circuit boards, the second electrode array is electrically connected to the other of the flexible printed circuit boards, and each of the first electrodes and each of the second electrodes are not parallel to each other. The total thickness of the thin flexible capacitive touch element is less than 350 ' 'the first electrode and the second electrode ― the capacitance change reflected by the wrong position after the touch is through the soft printing The circuit board is transferred to an arithmetic circuit of the electronic device for processing. Still another thin flexible capacitive touch element of the present invention is a flexible printed circuit board for electrically connecting-connecting to an arithmetic circuit of an electronic device. The thin flexible capacitive touch element comprises: a flexible substrate formed with a first electrode array and a second electrode array, and an optical adhesive layer disposed between the arrays of the electrodes. The flexible substrate has a first region, a second region facing the first region, a bending region connecting the first and second regions, and a key adjacent to one of the first region and the second region Concord. The bonding region has a first wiring segment and a second wiring segment which are spaced apart from each other. Each of the first electrodes has a first segment formed in the first region of the flexible substrate and a second segment extending from the first segment to the first wiring segment of the bonding region. Each of the second electrodes has a first segment formed in the second region of the flexible substrate, and a second segment extending from the first segment to the second wiring segment of the bonding region, and each of the first electrodes The first segment is not parallel to the first segment of each second electrode. The thin flexible capacitive touch element has a total thickness of less than 35 (), the flexible substrate has a thickness h, and the optical adhesive layer has a thickness 足以 sufficient to support the flexible substrate. The change in the valley of the first segment of the first electrode and the interlaced position of the first segment of the second electrode after the touch is transmitted via a flexible printed circuit board bonded to the bonding region 201237720 The arithmetic circuit sent to the electronic device for processing. In addition, another thin flexible capacitive touch element of the present invention is a flexible printed circuit board for electrically connecting a computing circuit connected to the electronic device of the station. The thin flexible capacitive touch element comprises: a flexible substrate formed with a first electrode array and a second electrode array, a conductive array, a wiring array, and an optical adhesive layer disposed between the electrode arrays . The flexible substrate has a first area, a second area facing the first area, a bending area connecting the first and second areas, and a key adjacent to one of the first area and the first area Concord. The bonding region has a -first wiring segment and a second wiring segment spaced apart. Each of the first electrodes has a first segment formed in the first region of the flexible substrate, and a first segment extending from the first segment to the bonding region . Each of the second electrodes has a first segment formed in the second region of the flexible substrate, and the first segment of each of the first electrodes and the first segment of each of the second electrodes are not parallel to each other. The conductive paste array is formed. One side of the second region of the substrate is formed, and each of the conductive pastes is connected to the end of the corresponding first electrode of the first electrode. The wiring array is formed on a side portion of the first region of the flexible substrate, each of the wires has a conductive adhesive segment connected to the corresponding conductive paste, and a second wiring extending from the conductive adhesive segment to the bonding region The segment of the segment. The thin flexible capacitive touch element has a total thickness of 350 Å, and the flexible substrate has a thickness ^, and the optical adhesive layer has a thickness I sufficient to support the flexible substrate, and from 21. The change in capacitance of the first segment of the first electrode and the first segment of the first segment of the second electrode after the touch is changed via a flexible printed circuit board bonded to the bonding region The computing power 201237720 transmitted to the electronic device is processed. The effect of the invention is that the overall volume of the capacitive touch element can be reduced to further facilitate the thinning and thinning of the electronic device, and the touch can be applied to the rollable touch panel. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments of the accompanying drawings. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 4, a first embodiment of the thin flexible capacitive touch device of the present invention is used for electrically connecting two flexible printed circuit boards 91 respectively connected to an arithmetic circuit (not shown) of an electronic device ( 4 shows only a flexible printed circuit board 91). The thin flexible capacitive touch element of the first embodiment of the present invention comprises: a first flexible substrate 2 having a multilayer film 21 and having a thickness q; A coating 31 is formed and has a thickness. The first flexible substrate 3 and an optical adhesive layer 4 sandwiched between the multilayer film 21 of the first flexible substrate 2 and the second flexible substrate 3. The coating 31 suitable for use in the first embodiment of the present invention is an electromagnetic shielding layer, a light shielding coating (Biack MatHx), an anti-reflection (AR) coating, and a coating layer 31. Anti giare (ag) coating, anti-smudge (AS) coating, a color filter (c〇1〇r. CF) coating, a polarizing coating, or a hard coating (harcj) Coating ' HC). In the first embodiment of the present invention, the coating 3 is a metal shielding layer forming a lower surface of one of the second flexible substrates 3 of 201237720. The multilayer film 21 has an array of first electrodes 2U, a first dielectric layer 212 - an array of second electrodes 213, and a second dielectric layer, which is t' by the film of the multilayer @ 21, from bottom to top. The layer structure defines a complex volume. The optical adhesive layer 4 has a thickness Τι, which is sufficient to support the first, _----/W:, and the weight of the flexible printed circuit board 91, and the thin layer is 1' and the thin type The total thickness of the flexible capacitive touch element is less than 350 μη. The change in capacitance of the multilayer film 21 of the first flexible substrate 2, which is reacted after the touch, is transmitted to the arithmetic circuit of the electronic device via the flexible printed circuit board 91 for processing. Preferably, the total thickness of the thin flexible capacitive touch element of the first embodiment is between 30 μηι and 35 〇μηι, ^ $Tl/t2$68; or 11 and k between 5 μηι and 110 Between ηηι, τ丨 is between 20 μηι and 340 μηι; and the optical adhesive layer 4 partially covers the flexible printed circuit boards 91. More preferably, the thin flexible capacitive touch 7G device of the first embodiment of the present invention further comprises a radius of curvature greater than 25 mm, and the hardness of the optical adhesive layer 4 measured by JIS K6253 is between D2〇~D5. Between the ;; the total thickness of the thin flexible capacitive touch element is greater than 丨〇〇; 2 ^ TiZq $ Μ, and 2ST 丨 / t2 $ 68. More preferably '10$Τι/ίι$68, and 1〇$Ti/t2$ 68 〇 Suitable for the flexible substrates 2, 3 of the present invention may be made of polyimine 201237720 (polyimide, PI), polyparaphenylene Diethyl phthalate (PET), polyethylene naphthalate (PEN), triacyl cellulose (TAC), polycarbonate (PC), poly pair Polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), or polymethylmethacrylic (PMMA); suitable for use in the present invention The optical adhesive layer 4 may be an acrylic-based resin, an epoxy adhesive, a siloxane adhesive, or a polyurethane. PU) is composed of rubber. In the first embodiment of the present invention, the weight of the flexible printed circuit board 91 (including FPC and 1C weight) is about 0.7 g; and the flexible substrates 2, 3 are respectively a polyimide film (PI) film. And ti and t2 are about 10 μm; the optical adhesive layer 4 is an acrylic resin having a hardness of JIS Κ 6253 D34 after curing, which is about 280 μm; that is, TVh and TVt2 are close to 28. The present invention is based on the concept of "thin". The overall strength of the first embodiment is based on the thickness of the optical adhesive layer 4 to the branch. Under the condition that the overall strength of the first embodiment is satisfied, the thicknesses t, t2 of the flexible substrates 2, 3 are relatively lowered, and the overall thickness of the thin flexible capacitive touch element of the present invention is in a three-dimensional space. The overall thickness of the two-dimensional capacitive sensor 1 is low. In addition, a minimum radius of curvature of the thin flexible capacitive touch element of the first embodiment of the present invention can approach 25 mm; accordingly, the first embodiment is a bendable type and the electronic used in combination The device is a flexible touch panel.
S 10 201237720 再參閱圖4，本發明之薄型軟性電容式觸控元件的一第 二具體實施例大致上是相同於該第一具體實施例，其不同 處疋在於，該第二具體實施例之薄型軟性電容式觸控元件 的一曲率半徑是介於3 mm〜25 mm之間，該光學膠層4經 JIS K6253測得的硬度是e以下、A20〜A90，或D20以S 10 201237720 Referring again to FIG. 4, a second embodiment of the thin flexible capacitive touch element of the present invention is substantially the same as the first embodiment, and the difference is that the second embodiment The radius of curvature of the thin flexible capacitive touch element is between 3 mm and 25 mm, and the hardness of the optical adhesive layer 4 measured by JIS K6253 is below e, A20 to A90, or D20.
上，该薄型軟性電容式觸控元件的總厚度是小於丨〇〇 J S Ti/t丨s 18，且1 S 丁丨八2$ 18。更明確地，E以下是被界定 為E10 ~ E90 ’ D20以上是被界定為〇20〜D50。 在本發明s亥第二具體實施例中，ti與t2約為丨〇 ;該 光學膠層4分別使用JIS K6253 E38、JIS K6253 a40與JIS K6253 D34荨低硬度、中硬度與高硬度三種壓克力系的膠 材，T!約為30 μπι ;即，Tl/tl與Τι^趨近3。有關於可捲 曲式的限制條件，此處需說明的是，為避免觸控元件於捲 曲過程中損傷到該光學膠層4,當所使用之光學膠的硬度越 低時，該光學膠層4的厚度Tl則相對地越小，當所使用之 光學膠的硬度越高時，該光學膠層4的厚度Τι則較不受此 限制在本發明該第一具體實施例中，該薄型軟性電容式 觸控元件的一最小曲率半徑，可趨近3 mm;據此，該第二 具體實施例可為可彎曲式，亦為可捲曲式，在整體強度的 考里下本發明該苐一具體貫施例，較適合應-用於可捲曲 式者，且該配合使用之電子裝置是可捲曲式的觸控面板。 參閱圖5,本發明之薄型軟性電容式觸控元件的—第二 具體實施例，大致上是相同於該第一具體實施例，其不同 處是在於，該等軟性基板2、3的細部結構。本發明該第三 201237720 具體實施例之第—軟性某 基板2形成有一電連於1 一 印刷電路板91之第一雷坧^ Α 、八中軟性 2陣列’該第二軟性美.3报 成有一電連於中另一釙从， 軟性基板3形 '、 人Ρ刷電路板91(圖未示）的第二電 極32陣列，且每一第 …弟一軍 〜 電極22與母-第二電極32互不平 仃以-電極22與該等第二電極32的其中一交錯位 置在受塵後所反應之電容變化，是經由該等軟性印刷電路 板91被傳送至該電子裝置的運算電路以進行處理。 再參閱圖5,本發明之薄型軟性電容式觸控元件的一第 四具體實施例’大致上是相同於該第三具體實施例，其不 同處是在於，該第四具體實施例之Τιϋ與該光學勝層 4的硬度是相同於該第二具體實施例。 參閱圖6及圖7’本發明之薄型軟性電容式觸控元件的 一第五具體實施例，是用以電連接一連接於一電子裝置之 一運算電路（圖未示）的軟性印刷電路板92。該第五具體實施 例之薄型軟性電容式觸控元件包含：一形成有一第一電極 56陣列及一第二電極57陣列的軟性基板5，及一夾置於該 等電極56、57陣列之間的光學膠層6。 a亥軟性基板5具有一第一區51、一面向該第一區51的 第二區52、一連接該第一、二區51、52的彎折區53，及 一鄰近於該第一區51及第二區52其中一者的鍵合區54。 該鍵合區54具有相間隔設置的一第一佈線段541及一第二 佈線段542。 每一第一電極56具有一形成於該軟性基板5之第一區 51的第一段561，及一自其第一段561延伸至該鍵合區54The total thickness of the thin flexible capacitive touch element is less than 丨〇〇 J S Ti/t丨s 18, and 1 S is 丨8 2 18 . More specifically, E below is defined as E10 ~ E90 ’ D20 is defined as 〇20~D50. In the second embodiment of the present invention, ti and t2 are about 丨〇; the optical adhesive layer 4 is made of JIS K6253 E38, JIS K6253 a40 and JIS K6253 D34, respectively, and has three hardnesses: low hardness, medium hardness and high hardness. For the glue of the system, T! is about 30 μπι; that is, Tl/tl and Τι^ are close to 3. Regarding the limitation of the curlable type, it should be noted that in order to prevent the touch component from being damaged to the optical adhesive layer 4 during the curling process, the optical adhesive layer 4 is lower when the hardness of the optical adhesive used is lower. The thickness T1 is relatively small, and the thickness of the optical adhesive layer 4 is less limited when the hardness of the optical adhesive used is higher. In the first embodiment of the present invention, the thin flexible capacitor The minimum radius of curvature of the touch element can approach 3 mm; accordingly, the second embodiment can be bendable or curlable, and the present invention is specific to the overall strength. The embodiment is more suitable for use in a crimpable type, and the electronic device used in combination is a rollable touch panel. Referring to FIG. 5, a second embodiment of the thin flexible capacitive touch element of the present invention is substantially the same as the first embodiment, and the difference lies in the detailed structure of the flexible substrates 2, 3. . The third substrate of the third embodiment of the present invention is formed with a first substrate 1 electrically connected to a printed circuit board 91, and a soft array 2 in the eighth. There is an array of second electrodes 32 electrically connected to the other, from the flexible substrate 3', the human brush circuit board 91 (not shown), and each of the first ... the first arm ~ the electrode 22 and the mother - second electrode The change in capacitance of the inter-interlaced position of the electrode 22 and the second electrode 32 after being subjected to dust is transmitted to the arithmetic circuit of the electronic device via the flexible printed circuit board 91 for performing deal with. Referring to FIG. 5, a fourth embodiment of the thin flexible capacitive touch element of the present invention is substantially the same as the third embodiment, and the difference is that the fourth embodiment is different from the fourth embodiment. The hardness of the optical layer 4 is the same as that of the second embodiment. Referring to FIG. 6 and FIG. 7 , a fifth embodiment of the thin flexible capacitive touch device of the present invention is used for electrically connecting a flexible printed circuit board connected to an operation circuit (not shown) of an electronic device. 92. The thin flexible capacitive touch element of the fifth embodiment comprises: a flexible substrate 5 formed with an array of first electrodes 56 and an array of second electrodes 57, and a sandwich between the arrays of the electrodes 56, 57 Optical adhesive layer 6. The a soft substrate 5 has a first region 51, a second region 52 facing the first region 51, a bending region 53 connecting the first and second regions 51, 52, and a neighboring region The bonding area 54 of one of 51 and the second zone 52. The bonding region 54 has a first wiring segment 541 and a second wiring segment 542 spaced apart from each other. Each of the first electrodes 56 has a first segment 561 formed in the first region 51 of the flexible substrate 5, and a first segment 561 extending from the first segment 561 to the bonding region 54.
S 12 201237720 之第-佈線段541的第二段562。每一第二電極57具有一 形成於該軟性基板5之第二區52的第一段571，及—自其 第-段571延伸至該鍵合區54之第二佈線段542的第二段 572，且每一第一電極56的第-段561與每一第二電極57 的第一段571互不平行。 該薄型軟性電容式觸控元件的總厚度是小於35〇㈣， 該軟性基板5具有-厚度t3，該光學膠層6具有—足以支撲 該軟性基板5及該軟性印刷電路板％之重量的厚度^，且 T2/t3^i。該等第-電極56之第—段561與該等第二電極 57之第-段571的其中—交錯位置在觸碰後所反應之電容 變化，是經由鍵合於該鍵合區54的軟性印刷電路板％被 ，送至該電子裝置的運算電路以進行處理4處需說明的 疋，本發明该第五具體實施例之丁2、4與該光學膠層6的 硬度，大致上是分別相同於該第一具體實施例之Τι、η、b 與該光學膠層4的硬度。 在本發明該第五具體實施例中，該軟性基板5的鍵合 區54是鄰近於該第一區51 ;該第—電極％陣列之每一第 一電極56的第—段561是實質呈水平設置；該第二電極57 陣列之每一第二電極57的第一段571是實質垂直於每一第 一電極56的第—段561，且每一第二電極57的第二段572 疋自其第一段571依序延伸至該軟性基板5的彎折區53、 6玄軟性基板5之第一區51的一側部511，及該軟性基板5 之鍵合區54的第二佈線段542。 該光學膠層6更具有一第一區61、一第二區62，及一 13 201237720The second segment 562 of the first wiring segment 541 of S 12 201237720. Each of the second electrodes 57 has a first segment 571 formed in the second region 52 of the flexible substrate 5, and a second segment extending from the first segment 571 to the second wiring segment 542 of the bonding region 54. 572, and the first segment 561 of each first electrode 56 and the first segment 571 of each second electrode 57 are not parallel to each other. The thin flexible capacitive touch element has a total thickness of less than 35 〇 (four), the flexible substrate 5 has a thickness t3, and the optical adhesive layer 6 has a weight sufficient to support the flexible substrate 5 and the flexible printed circuit board. Thickness ^, and T2/t3^i. The capacitance of the first segment 561 of the first electrode 56 and the first segment 571 of the second electrode 57 are changed after the touch, and the softness is bonded to the bonding region 54. The printed circuit board % is sent to the arithmetic circuit of the electronic device for processing. The hardness of the optical layer 6 of the fifth embodiment of the present invention is substantially different. The hardness of the optical layer 4 is the same as that of the first embodiment. In the fifth embodiment of the present invention, the bonding region 54 of the flexible substrate 5 is adjacent to the first region 51; the first segment 561 of each of the first electrodes 56 of the first electrode % array is substantially Horizontally disposed; the first segment 571 of each second electrode 57 of the array of second electrodes 57 is substantially perpendicular to the first segment 561 of each first electrode 56, and the second segment 572 of each second electrode 57 The first segment 571 extends in sequence to the bent portion 53 of the flexible substrate 5, the side portion 511 of the first region 51 of the flexible substrate 5, and the second wiring of the bonding region 54 of the flexible substrate 5. Segment 542. The optical adhesive layer 6 further has a first area 61, a second area 62, and a 13 201237720
632，延伸至該鍵合區54並局部覆蓋該軟性印刷電路板 本發明s亥第五具體實施例一方面因該等電極％、57陣 列之第二段562、572的配置關係，而得以將佈線整合在該 軟性基板5的單側鍵合區54，且僅需在該軟性基板$的鍵632, extending to the bonding region 54 and partially covering the flexible printed circuit board. The fifth embodiment of the present invention is capable of being configured on the one hand by the arrangement relationship of the second segments 562, 572 of the array of electrodes, 57 The wiring is integrated in the one-side bonding region 54 of the flexible substrate 5, and only the key of the flexible substrate $ is required
電路板92之薄型軟性電容式觸控元件之整體強度的條件 下，相對調低該軟性基板5的厚度ts;因此，於三維空間 上，本發明該薄型軟性電容式觸控元件的整體厚度相對該 一維電容式感應器1的整體厚度低。 再參閱圖6及圖7’本發明之薄型軟性電容式觸控元件 的-第六具體實施例’大致上是相同於該第五具體實施 2，其不同處是在於，該第六具體實施例之T2、t3與該光 子膠層6的硬度，大致上是分別相同於該第二具體實施例 之Ti、ti、t；2與該光學膠層4的硬度。 參閱圖8及圖9，本發明之薄型軟性電容式觸控元件的Under the condition of the overall strength of the thin flexible capacitive touch element of the circuit board 92, the thickness ts of the flexible substrate 5 is relatively lowered; therefore, the overall thickness of the thin flexible capacitive touch element of the present invention is relatively large in three dimensions. The one-dimensional capacitive sensor 1 has a low overall thickness. Referring to FIG. 6 and FIG. 7 respectively, the sixth embodiment of the thin flexible capacitive touch element of the present invention is substantially the same as the fifth embodiment 2, and the difference is that the sixth embodiment The hardness of T2, t3 and the photonic adhesive layer 6 is substantially the same as the hardness of Ti, ti, t; 2 and the optical adhesive layer 4 of the second embodiment. Referring to FIG. 8 and FIG. 9, the thin flexible capacitive touch element of the present invention
S 14 201237720 :第七具體實施例，大致上是相同於該第五具體， 其不同處是在於，該第七具體實施例之第二電極 結構，且該第七具體實施例更包含—導電# 7 =的 線8陣列。 —佈 每-第二電極57具有-形成於該軟性基板5 52的第一段573’且每一第一電極56的第—段561與：二 第二電極57的第一段573互不平行。 該導電膠7陣列是形成於該軟性基板5 _ ^ —區52的 -側部52i，且每—導電膠7與其對應之第二電極μ 一段573的一端部574相連接。 該佈線8陣列形成於該軟性基板5之第一區5ι的該側 部51卜每-佈線8具有—與其對應之導電膠7連接的^電 膠段81，及一自其導電膠段81延伸至該鍵合區54之第二 佈線段542的佈線段82。 再參閱圖8及圖9，本發明之薄型軟性電容式觸控元件 的-第八具體實施例，大致上是相同於該第七具體實施 例，其不同處是在於，該第八具體實施例之I、q與該光 學膠層6的硬度，大致上是分別相同於該第二具體實施例 之兄、t!、b與該光學膠層4的硬度。 綜上所述，本發明之薄型軟性電容式觸控元件一方面 可縮減電容式觸控元件的整體體積以進一步地有利於電子 裝置的輕薄短小化，另—方面可被應用於可捲曲式之觸控 面板，故確實能達成本發明之目的。 惟以上所述者，僅為本發明之具體實施例而已，當不 15 201237720 $以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一仰視示意圖，說明us 7,〇3〇,86〇 Bl所揭露之 一一維電容式感應器的一上電極單元； 圖2是一俯視示意圖，說明該二維電容式感應器的一 下電極單元； 圖3是一側視示意圖 體結構； 說明該二維電容式感應器的整 圖4是—正視示意圖’說明本發明薄型軟性電容式觸 控元件之一第一具體實施例； 圖1是一正視示意圖’說明本發明薄型軟性電容式觸 控元件之一第三具體實施例； -圖6是一俯視示意圖，說明本發明薄型軟性電容式觸 -笛第五具體實施例之—形成有"'第—電極陣列及 -極陣列的軟性基板處於尚未彎折的狀態； 圖7是本發明該薄型軟性電容式觸控元件之第五具體 實施例的一正視示意圖； 圖8疋—俯視示意圖，說明本發明薄型電容式觸控元 件之-第七具體實施例之—形成有該等電極陣列、 膠陣列及一佈線陣列的軟性基板處於尚未f折的狀態；及 圖^本發明該薄型電容式觸控元件之第七具 例的一正視示意圖。 16 1 201237720 【主要元件符號說明】 2 第一軟性基板 562 第二段 21 多層膜 57 第二電極 211 第一電極陣列 571 第一段 212 第一介電層 572 第二段 213 第二電極陣列 573 第一段 214 第二介電層 574 端部 22 第一電極陣列 6 光學膠層 3 第二軟性基板 61 第一區 31 塗層 62 第二區 32 第二電極陣列 63 間隔區 4 光學膠層 631 側部 5 軟性基板 632 另一側部 51 第一區 7 導電膠 511 側部 8 佈線 52 第二區 81 導電膠段 521 側部 82 佈線段 53 彎折區 91 軟性印刷電路板 530 空間 92 軟性印刷電路板 54 鍵合區 Τι 光學膠層的厚度 541 第一佈線段 τ2 光學膠層的厚度 542 第二佈線段 ti 第一軟性基板的厚度 56 第一電極 Ϊ2 第二軟性基板的厚度 561 第一段 Ϊ3 軟性基板的厚度 17S 14 201237720: The seventh embodiment is substantially the same as the fifth specific, and the difference lies in the second electrode structure of the seventh embodiment, and the seventh embodiment further includes - conductive # 7 = line 8 array. The cloth-to-second electrode 57 has a first segment 573' formed on the flexible substrate 552 and the first segment 561 of each first electrode 56 and the first segment 573 of the second electrode 57 are not parallel to each other . The conductive paste 7 array is formed on the side portion 52i of the flexible substrate 5_^-region 52, and each of the conductive paste 7 is connected to one end portion 574 of the corresponding second electrode μ segment 573. The wiring 8 array is formed on the side portion 51 of the first region 5 of the flexible substrate 5, and each of the wiring 8 has a solder gel segment 81 connected to the corresponding conductive paste 7, and an extension from the conductive paste segment 81 thereof. The wiring segment 82 to the second wiring segment 542 of the bonding region 54. Referring to FIG. 8 and FIG. 9 , the eighth embodiment of the thin flexible capacitive touch element of the present invention is substantially the same as the seventh embodiment, and the difference is that the eighth embodiment The hardness of I, q and the optical adhesive layer 6 is substantially the same as the hardness of the brother, t!, b of the second embodiment and the optical adhesive layer 4, respectively. In summary, the thin flexible capacitive touch element of the present invention can reduce the overall volume of the capacitive touch element on the one hand to further facilitate the thinning and thinning of the electronic device, and can be applied to the curlable type. The touch panel is indeed capable of achieving the object of the present invention. However, the above is only a specific embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent change of the scope of the invention and the description of the invention. Modifications are still within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a bottom view showing an upper electrode unit of a one-dimensional capacitive sensor disclosed by us 7, 〇 3 〇, 86 〇 Bl; FIG. 2 is a top plan view illustrating the second The lower electrode unit of the dimensional capacitive sensor; FIG. 3 is a side view of the schematic body structure; FIG. 4 is a schematic view of the two-dimensional capacitive sensor, illustrating a thin flexible capacitive touch element of the present invention. 1 is a front view showing a third embodiment of a thin flexible capacitive touch element of the present invention; FIG. 6 is a top plan view showing a thin flexible capacitive touch-flute of the present invention. In a specific embodiment, the flexible substrate formed with the "'th electrode array and the -pole array is in a state that has not been bent; FIG. 7 is a front view of the fifth embodiment of the thin flexible capacitive touch element of the present invention; Figure 8 is a top plan view showing a thin capacitive sensing element of the present invention - a seventh embodiment of the present invention - a flexible substrate formed with the electrode array, the glue array and a wiring array F in yet folded state; ^ the present invention and FIG seventh embodiment having the thin capacitive touch element is a front view of FIG. 16 1 201237720 [Description of main component symbols] 2 First flexible substrate 562 Second segment 21 Multi-layer film 57 Second electrode 211 First electrode array 571 First segment 212 First dielectric layer 572 Second segment 213 Second electrode array 573 First segment 214 second dielectric layer 574 end portion 22 first electrode array 6 optical adhesive layer 3 second flexible substrate 61 first region 31 coating 62 second region 32 second electrode array 63 spacer 4 optical adhesive layer 631 Side portion 5 Flexible substrate 632 Other side portion 51 First region 7 Conductive adhesive 511 Side portion 8 Wiring 52 Second region 81 Conductive rubber segment 521 Side portion 82 Wiring segment 53 Bending region 91 Flexible printed circuit board 530 Space 92 Soft printing The bonding area of the circuit board 54 is the thickness of the optical adhesive layer 541. The first wiring segment τ2 The thickness of the optical adhesive layer 542 The second wiring segment ti The thickness of the first flexible substrate 56 The first electrode Ϊ 2 The thickness of the second flexible substrate 561 The first segment Ϊ3 Thickness of flexible substrate 17