WO2006016603A1 - 錫－亜鉛合金電気めっき方法 - Google Patents
錫－亜鉛合金電気めっき方法 Download PDFInfo
- Publication number
- WO2006016603A1 WO2006016603A1 PCT/JP2005/014648 JP2005014648W WO2006016603A1 WO 2006016603 A1 WO2006016603 A1 WO 2006016603A1 JP 2005014648 W JP2005014648 W JP 2005014648W WO 2006016603 A1 WO2006016603 A1 WO 2006016603A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tin
- zinc alloy
- plating bath
- acid
- zinc
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 229910001297 Zn alloy Inorganic materials 0.000 title claims abstract description 30
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 238000009713 electroplating Methods 0.000 title claims abstract description 28
- 238000007747 plating Methods 0.000 claims abstract description 75
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 4
- -1 organic acid ester Chemical class 0.000 claims description 36
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 13
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 6
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 6
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 5
- 239000002280 amphoteric surfactant Substances 0.000 claims description 4
- 239000002736 nonionic surfactant Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 239000003093 cationic surfactant Substances 0.000 claims description 2
- 238000013019 agitation Methods 0.000 claims 1
- 238000003756 stirring Methods 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 abstract 2
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- 239000000243 solution Substances 0.000 description 18
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- 239000011701 zinc Substances 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 12
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 11
- 238000001556 precipitation Methods 0.000 description 11
- 229910052725 zinc Inorganic materials 0.000 description 11
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 10
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 7
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 description 5
- 229910052708 sodium Inorganic materials 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 description 4
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 4
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 4
- 235000011130 ammonium sulphate Nutrition 0.000 description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229940044654 phenolsulfonic acid Drugs 0.000 description 4
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 description 4
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 3
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 3
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical class OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 3
- 229910052808 lithium carbonate Inorganic materials 0.000 description 3
- 229910003002 lithium salt Inorganic materials 0.000 description 3
- 159000000002 lithium salts Chemical class 0.000 description 3
- 239000001630 malic acid Substances 0.000 description 3
- 235000011090 malic acid Nutrition 0.000 description 3
- 229940098779 methanesulfonic acid Drugs 0.000 description 3
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011975 tartaric acid Substances 0.000 description 3
- 235000002906 tartaric acid Nutrition 0.000 description 3
- 150000003751 zinc Chemical class 0.000 description 3
- ALRHLSYJTWAHJZ-UHFFFAOYSA-N 3-hydroxypropionic acid Chemical compound OCCC(O)=O ALRHLSYJTWAHJZ-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 235000004279 alanine Nutrition 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 235000001014 amino acid Nutrition 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229960003237 betaine Drugs 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- RUDATBOHQWOJDD-BSWAIDMHSA-N chenodeoxycholic acid Chemical compound C([C@H]1C[C@H]2O)[C@H](O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H]([C@@H](CCC(O)=O)C)[C@@]2(C)CC1 RUDATBOHQWOJDD-BSWAIDMHSA-N 0.000 description 2
- 229960001091 chenodeoxycholic acid Drugs 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- YSEKNCXYRGKTBJ-UHFFFAOYSA-N dimethyl 2-hydroxybutanedioate Chemical compound COC(=O)CC(O)C(=O)OC YSEKNCXYRGKTBJ-UHFFFAOYSA-N 0.000 description 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- SUMDYPCJJOFFON-UHFFFAOYSA-N isethionic acid Chemical compound OCCS(O)(=O)=O SUMDYPCJJOFFON-UHFFFAOYSA-N 0.000 description 2
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 2
- 229960001763 zinc sulfate Drugs 0.000 description 2
- 229910000368 zinc sulfate Inorganic materials 0.000 description 2
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- QPNXDYIIMODUQF-UHFFFAOYSA-N 1,3-dichloropropane-1,2,3-triol Chemical compound OC(Cl)C(O)C(O)Cl QPNXDYIIMODUQF-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- HQNBJNDMPLEUDS-UHFFFAOYSA-N 1,5-dimethylimidazole Chemical compound CC1=CN=CN1C HQNBJNDMPLEUDS-UHFFFAOYSA-N 0.000 description 1
- NYYVCPHBKQYINK-UHFFFAOYSA-N 1-ethyl-2-methylimidazole Chemical compound CCN1C=CN=C1C NYYVCPHBKQYINK-UHFFFAOYSA-N 0.000 description 1
- IWDFHWZHHOSSGR-UHFFFAOYSA-N 1-ethylimidazole Chemical compound CCN1C=CN=C1 IWDFHWZHHOSSGR-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- WXHLLJAMBQLULT-UHFFFAOYSA-N 2-[[6-[4-(2-hydroxyethyl)piperazin-1-yl]-2-methylpyrimidin-4-yl]amino]-n-(2-methyl-6-sulfanylphenyl)-1,3-thiazole-5-carboxamide;hydrate Chemical compound O.C=1C(N2CCN(CCO)CC2)=NC(C)=NC=1NC(S1)=NC=C1C(=O)NC1=C(C)C=CC=C1S WXHLLJAMBQLULT-UHFFFAOYSA-N 0.000 description 1
- NSRGOAGKXKNHQX-UHFFFAOYSA-N 2-hydroxybutane-1-sulfonic acid Chemical compound CCC(O)CS(O)(=O)=O NSRGOAGKXKNHQX-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- RXFCIXRFAJRBSG-UHFFFAOYSA-N 3,2,3-tetramine Chemical compound NCCCNCCNCCCN RXFCIXRFAJRBSG-UHFFFAOYSA-N 0.000 description 1
- BWDPPMPQZZILAG-UHFFFAOYSA-N 3-(chloromethyl)aniline Chemical compound NC1=CC=CC(CCl)=C1 BWDPPMPQZZILAG-UHFFFAOYSA-N 0.000 description 1
- SSZWWUDQMAHNAQ-UHFFFAOYSA-N 3-chloropropane-1,2-diol Chemical compound OCC(O)CCl SSZWWUDQMAHNAQ-UHFFFAOYSA-N 0.000 description 1
- BZOVBIIWPDQIHF-UHFFFAOYSA-N 3-hydroxy-2-methylbenzenesulfonic acid Chemical compound CC1=C(O)C=CC=C1S(O)(=O)=O BZOVBIIWPDQIHF-UHFFFAOYSA-N 0.000 description 1
- WQPMYSHJKXVTME-UHFFFAOYSA-N 3-hydroxypropane-1-sulfonic acid Chemical compound OCCCS(O)(=O)=O WQPMYSHJKXVTME-UHFFFAOYSA-N 0.000 description 1
- XYUINKARGUCCQJ-UHFFFAOYSA-N 3-imino-n-propylpropan-1-amine Chemical compound CCCNCCC=N XYUINKARGUCCQJ-UHFFFAOYSA-N 0.000 description 1
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 description 1
- XGIPGWJHNHEEAL-UHFFFAOYSA-N 4-hexadecoxy-4-oxobutanoic acid Chemical compound CCCCCCCCCCCCCCCCOC(=O)CCC(O)=O XGIPGWJHNHEEAL-UHFFFAOYSA-N 0.000 description 1
- BWHOZHOGCMHOBV-UHFFFAOYSA-N Benzalacetone Natural products CC(=O)C=CC1=CC=CC=C1 BWHOZHOGCMHOBV-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-L Malonate Chemical compound [O-]C(=O)CC([O-])=O OFOBLEOULBTSOW-UHFFFAOYSA-L 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 235000014443 Pyrus communis Nutrition 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000003934 aromatic aldehydes Chemical class 0.000 description 1
- 150000001500 aryl chlorides Chemical class 0.000 description 1
- 159000000009 barium salts Chemical class 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VXIVSQZSERGHQP-UHFFFAOYSA-N chloroacetamide Chemical compound NC(=O)CCl VXIVSQZSERGHQP-UHFFFAOYSA-N 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- PVRATXCXJDHJJN-UHFFFAOYSA-N dimethyl 2,3-dihydroxybutanedioate Chemical compound COC(=O)C(O)C(O)C(=O)OC PVRATXCXJDHJJN-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ONEGZZNKSA-N dimethyl fumarate Chemical compound COC(=O)\C=C\C(=O)OC LDCRTTXIJACKKU-ONEGZZNKSA-N 0.000 description 1
- 229960004419 dimethyl fumarate Drugs 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- IUNMPGNGSSIWFP-UHFFFAOYSA-N dimethylaminopropylamine Chemical compound CN(C)CCCN IUNMPGNGSSIWFP-UHFFFAOYSA-N 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- RAHHITDKGXOSCO-UHFFFAOYSA-N ethene;hydrochloride Chemical compound Cl.C=C RAHHITDKGXOSCO-UHFFFAOYSA-N 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- FYAQQULBLMNGAH-UHFFFAOYSA-N hexane-1-sulfonic acid Chemical compound CCCCCCS(O)(=O)=O FYAQQULBLMNGAH-UHFFFAOYSA-N 0.000 description 1
- 150000003840 hydrochlorides Chemical class 0.000 description 1
- 229960002050 hydrofluoric acid Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- ROBFUDYVXSDBQM-UHFFFAOYSA-L hydroxymalonate(2-) Chemical compound [O-]C(=O)C(O)C([O-])=O ROBFUDYVXSDBQM-UHFFFAOYSA-L 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 description 1
- FIYXUOWXHWJDAM-UHFFFAOYSA-N methyl sulfamate Chemical compound COS(N)(=O)=O FIYXUOWXHWJDAM-UHFFFAOYSA-N 0.000 description 1
- RJQRCOMHVBLQIH-UHFFFAOYSA-M pentane-1-sulfonate Chemical compound CCCCCS([O-])(=O)=O RJQRCOMHVBLQIH-UHFFFAOYSA-M 0.000 description 1
- 229940044652 phenolsulfonate Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- QVLTXCYWHPZMCA-UHFFFAOYSA-N po4-po4 Chemical compound OP(O)(O)=O.OP(O)(O)=O QVLTXCYWHPZMCA-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- WWJZZUYNODNLMZ-UHFFFAOYSA-M potassium;2,3-dihydroxybenzenesulfonate Chemical compound [K+].OC1=CC=CC(S([O-])(=O)=O)=C1O WWJZZUYNODNLMZ-UHFFFAOYSA-M 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- HNDXKIMMSFCCFW-UHFFFAOYSA-N propane-2-sulphonic acid Chemical compound CC(C)S(O)(=O)=O HNDXKIMMSFCCFW-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 229940048084 pyrophosphate Drugs 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229920001059 synthetic polymer Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- BWHOZHOGCMHOBV-BQYQJAHWSA-N trans-benzylideneacetone Chemical compound CC(=O)\C=C\C1=CC=CC=C1 BWHOZHOGCMHOBV-BQYQJAHWSA-N 0.000 description 1
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 1
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 description 1
- 235000012141 vanillin Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- MKRZFOIRSLOYCE-UHFFFAOYSA-L zinc;methanesulfonate Chemical compound [Zn+2].CS([O-])(=O)=O.CS([O-])(=O)=O MKRZFOIRSLOYCE-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Definitions
- the present invention relates to a tin-zinc alloy electroplating method.
- tin-zinc alloy electroplating Since tin-zinc alloy electroplating is excellent in corrosion resistance, workability, and solderability, it has been attracting attention and widely used as an industrial plating for automobile parts and electronic parts.
- As the baths used for the tin-zinc alloy electroplating alkali cyan baths, phosphoric acid phosphate baths, borofluoride baths, sulfonic acid baths, carboxylic acid baths, etc. have been proposed and partially put into practical use. Has reached.
- An object of the present invention is to provide an electroplating method that enables processing in a short time, which has been difficult with conventional tin-zinc alloy electroplating.
- the present invention makes it possible to electroplat tin-zinc alloy in a short time by using a specific tin-zinc alloy plating bath with the plating bath temperature and plating solution stirring speed set to a predetermined level or higher. It was made based on the knowledge.
- the present invention provides a plating bath temperature of 30 to 90 ° C., and a plating solution stirring speed of 5 to 300 mZ.
- tin-zinc alloy can be electroplated in a short time by setting the plating bath temperature and the stirring speed of the plating solution to a predetermined level or more and using a specific tin-palladium alloy plating bath. Can be.
- the plating bath temperature is 30 to 90 ° C, preferably 40 to 60 ° C
- the stirring speed of the plating solution is 5 to 300 mZmin, preferably 10 to 100 mZmin.
- the stirring of the plating solution can be applied by a jet type plating device or a steel plate plating device in which the solution is circulated by a pump.
- the plating equipment is made of a heat-resistant and chemical-resistant material, metals such as stainless steel and titanium, salt vinyl, Teflon (registered trademark), and ABS resin can be used.
- an apparatus capable of obtaining a uniform plating solution stirring speed over the entire object to be plated is desirable.
- any plating bath known to those skilled in the art can be used.
- it contains a hydroxycarboxylic acid or a salt thereof. It is a bathing bath.
- hydroxycarboxylic acid a compound having 1 or 2 or more hydroxy groups and 1 or 2 or more carboxyl groups in one molecule is preferable! /.
- hydroxycarboxylic acids include citrate, tartaric acid, malic acid, glycolic acid, glyceric acid, lactic acid, ⁇ -hydroxypropionic acid and darconic acid.
- citrate, tartaric acid, malic acid and darconic acid are used.
- hydroxycarboxylates include alkali metal salts (sodium, potassium, lithium salts) of the above hydroxycarboxylic acids, alkaline earth metal salts (magnesium, calcium, barium salts, etc.), and divalent tin salts.
- Zinc salts, ammonium salts and organic amine salts (monomethylamine, dimethylamine, trimethylamine, ethylamine, isopropylamine, ethylenediamine, diethylenetriamine, etc.).
- These hydroxycarboxylic acids and salts thereof may be used alone or
- the concentration in the plating bath in which two or more kinds may be used in combination is 0.25 to 3 molZL, preferably 0.3 to 1.5 molZL.
- hydroxycarboxylic acid which is a counter ion of the metal ion, also constitutes a part of the above concentration.
- the pH of the bath containing hydroxycarboxylic acid or a salt thereof is preferably 2 to 10, more preferably 3 to 9.
- the pH of the plating bath can be adjusted using an alkaline compound such as a hydroxide or carbonate or an acidic compound such as an inorganic acid or an organic acid.
- alkaline compounds such as sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, lithium carbonate, aqueous ammonia, sulfuric acid, hydrochloric acid, sulfamic acid, methanesulfonic acid.
- acidic compounds such as phenolsulfonic acid.
- a group comprising a water-soluble compound obtained by reacting an aliphatic amine, an organic acid ester and phthalic anhydride, and an amphoteric surfactant. It is also possible to use a bath with one or more selected power. Specifically, for example, 0.2 to 3 mol of an organic acid ester is reacted at a temperature of 50 to 99 ° C. for 10 to 60 minutes per 1 mol of an aliphatic amine, and the reactive product 1 obtained by weight ratio is reacted.
- Examples thereof include water-soluble compounds obtained by reacting phthalic anhydride 0.1 to 1 at a temperature of 60 to 130 ° C for 30 to 180 minutes.
- Examples of amphoteric surfactants include imidazoline type, betaine type, alanine type, glycine type and amide type.
- Examples of the aliphatic amine used for the reaction of the water-soluble compound include ethylenediamine, triethylenetetramine, isoptylamine, 3-methoxypropylamine, iminobispropylamine, jetylamine, hexamethyltetramine, dimethylaminopropylamine and the like.
- organic acid ester examples include dimethyl malonate, cetyl succinate, methyl maleate, dimethyl fumarate, dimethyl tartrate, dimethyl malate, and jetyl tartronate. These water-soluble compounds and amphoteric surfactants may be used alone or in admixture of two or more.
- the content in the plating bath is 0.001 to 50 g ZL, preferably 0.01 to 30 g. / L.
- the pH of the bath containing one or more kinds selected from the group power consisting of a surfactant is preferably 2 to 10, more preferably 3 to 9.
- the pH of the plating bath can be adjusted by using an alkaline compound such as hydroxide or carbonate, or an acidic compound such as inorganic acid or organic acid.
- alkaline compounds such as sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, lithium carbonate, aqueous ammonia, sulfuric acid, hydrochloric acid, sulfamic acid, methanesulfonic acid, fluoric acid, And acidic compounds such as ⁇ -nolusulfonic acid.
- a bath containing one or more selected from the group consisting of tertiary amine compounds and quaternary amine compounds may be used. it can.
- tertiary amine compounds include imidazole compounds and aliphatic amine compounds.
- quaternary amine compounds include reaction products of tertiary amine compounds and alkyl halides.
- Specific examples of the tertiary amine compound include imidazole compounds such as imidazole, 1-methylimidazole, 1-ethylimidazole, 2-methylimidazole, 1-ethyl-2-methylimidazole.
- 1oxymethylimidazole, 1 bwisemidazole and 1,5 dimethylimidazole, and aliphatic amines include monoethanolamine, jetanolamine, triethanolamine, dimethylamine, ethylenediamine, diethylenetriamine, iminobispamine. Examples include oral pinoleamine, triethylenetetramine, tetraethylenepentamine, and N, N bis (3aminopropyl) ethylenediamine.
- halogenated alkyl to be reacted with the tertiary amine compound examples include monochloroacetic acid, benzyl chloride, chloracetamide, 3-aminobenzyl chloride, aryl chloride, dichloroethane, monochloropropane, dichloroglycerin, ethylene chlorohydride. Examples include phosphorus and epichlorohydrin. These tertiary amine compounds and quaternary amine compounds may be used alone or in admixture of two or more.
- the content of the plating bath is 0.1 to 30 g / L, preferably Is 0.2 ⁇ 20g / L
- a tertiary amine and a quaternary amine compound are also selected.
- the pH of the hot water bath containing one or more is preferably 10 to 14, more preferably 12 to 14.
- the pH of the bath can be adjusted using alkaline compounds such as hydroxides and carbonates. it can. Specific examples include sodium hydroxide, potassium hydroxide, lithium hydroxide, sodium carbonate, potassium carbonate, lithium carbonate, and aqueous ammonia.
- the tanning bath used in the electroplating method of the present invention further includes at least one surface activity selected from the group force consisting of a nonionic surfactant, a ionic surfactant and a cationic surfactant.
- An agent can also be contained. By containing these surfactants, precipitation at a high current density can be made dense, so that the electroplating method of the present invention can be smoothly carried out.
- the tin ion concentration of the plating bath used in the plating method of the present invention is 1 to 10 OgZL, preferably 5 to 80 gZL for divalent ions, and the zinc ion concentration is 0.2 to 80 gZL, preferably l. ⁇ 50gZL.
- these metal ion sources include hydroxide, oxide, sulfate, hydrochloride, sulfamate, pyrophosphate, hydroxycarboxylate, sulfonate, and amino acid salt of each metal. .
- Preferred are oxides, sulfates, hydrochlorides, and hydroxides of each metal.
- Specific examples of the hydroxycarboxylate include those exemplified above.
- the sulfonate include alkane sulfonate, alkane sulfonate, and phenol sulfonate.
- alkanesulfonic acid include methanesulfonic acid, ethanesulfonic acid, propanesulfonic acid, isopropanesulfonic acid, butanesulfonic acid, pentanesulfonic acid and hexanesulfonic acid.
- Specific examples of the acid include 2-hydroxyethane sulfonic acid, 3-hydroxypropane sulfonic acid, and 2-hydroxybutane sulfonic acid.
- phenol sulfonic acid examples include phenol sulfonic acid, cresol sulfonic acid, and dimethyl phenol sulfonic acid.
- amino acids include glycine, glutamic acid, and alanine.
- sulfuric acid In the tanning bath used in the electroplating method of the present invention, sulfuric acid, hydrochloric acid, sulfamic acid, pyrophosphoric acid, sulfonic acid, hydroxide, carbon Alkali metal salts (sodium, potassium, lithium salts), alkaline earth metal salts (magnesium, calcium, norlium salts), ammonium salts, organic amine salts (monomethylamine, dimethylamine, trimethyl) Amin, ethylamine, isopropylamine, ethylenediamine, diethylenetriamine, etc.).
- the content of these salts is 10 to 300 gZL, preferably 50 to 200 gZL.
- the tanning bath used in the electroplating method of the present invention can also contain additives used as tin and zinc brighteners in addition to the above-mentioned components.
- additives used as tin and zinc brighteners for example, synthetic polymers (polyvinyl alcohol, polyvinyl pyrrolidone, polyethylene glycol, etc.), ketones (benzal acetone, acetophenone, etc.), aliphatic aldehydes (formalin, acetoaldehyde, crotonaldehyde, etc.), Aromatic aldehydes (vanillin, salicylaldehyde, olsochlorbenzaldehyde, etc.), reaction products of unsaturated aliphatic aldehydes and amine compounds, sulfur compounds (thiourea, mercaptobenzimidazole, etc.), Cu, Ni, Mn, Bi, In etc.
- additives contain 0.001 to 5 Og / preferably 0.005 to 30 g ZL.
- hydroxyphenol compounds such as catechol, pyrogallol, hydroquinone, sulfosalicylic acid, potassium dihydroxybenzenesulfonate, and salts thereof, L-corcorbic acid, sorbitol, and the like can also be used as antioxidants for tin.
- the object to be plated in the plating method of the present invention is a metal material of Fe, Ni, Cu, or an alloy based on these, and this is used as a cathode.
- a tin-zinc alloy or a Ti material in which Pt plating is applied, an insoluble electrode, a force-bonded electrode, or the like can be used.
- an insoluble anode the above-mentioned method of directly dissolving the tin and zinc metal salts in the sag solution or replenishing an aqueous solution in which the tin and zinc metal salts are dissolved at a high concentration is used.
- the metal concentration of the bath can be maintained.
- This high-concentration aqueous solution of the metal may contain the above hydroxycarboxylic acid or a salt thereof and a hydroxy-alkali compound.
- the cathode current density is 5 to 200 A / dm 2 , preferably 10 to 120 A / dm 2 , and the film thickness can be in a wide range, but is generally 0.5 to 500 ⁇ m, preferably 2 to 20 ⁇ m.
- tin-zinc alloy plating with a wide range of compositions can be applied.
- an electronic component can be tinned with a zinc content of 3 to 15%, which particularly enhances saltwater resistance and corrosion resistance.
- tin-zinc alloy plating with a zinc content of 15 to 45% can be applied.
- tin-zinc alloy plating with a zinc content of 50 to 90% can be applied.
- the object to be covered is subjected to a plating step after pretreatment by a conventional method.
- a pretreatment process at least one operation of immersion degreasing, pickling, electrolytic cleaning and activation is performed.
- the resulting film can be washed with water and dried, followed by conventional chromate treatment and chemical conversion treatment, or coating treatment with inorganic and organic substances.
- the present invention will be described by way of examples.
- the present invention is not limited thereto, and the plating solution temperature, the plating solution flow rate, and the composition of the bath used can be arbitrarily changed according to the purpose. it can.
- plating bath temperature 60 ° C.
- plating solution stirring speed 50 mZmin.
- Zinc oxide (as zinc) 5 g /
- electroplating was performed using the following plating bath under the conditions of plating bath temperature: 50 ° C. and plating solution stirring speed: 60 mZmin.
- Zinc methanesulfonate (Zinc and 15 g /
- the plating bath temperature of 23 ° C. and the plating solution stirring speed: 50 mZmin were applied using the plating bath of Example 1.
- the plating bath of Example 1 was used, and the plating bath temperature was 60 ° C., and the plating solution was stirred at a rate of 2 mZmin.
- the plating bath of Example 3 was used, and the plating bath temperature was 60 ° C., and the plating solution was stirred at a rate of 3 mZmin.
- Tables 1 and 2 show the precipitation states of Examples 1 to 5 and Comparative Examples 1 to 3, the alloy composition (% by weight) of the deposited film, the treatment time, and the film thickness.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES05770802.6T ES2526430T3 (es) | 2004-08-10 | 2005-08-10 | Método de galvanoplastia con una aleación de estaño y cinc |
| BRPI0514210A BRPI0514210B1 (pt) | 2004-08-10 | 2005-08-10 | método de eletrodeposição com uma liga de estanho-zinco |
| KR1020077002958A KR100929761B1 (ko) | 2004-08-10 | 2005-08-10 | 주석-아연 합금 전기 도금 방법 |
| CN2005800271252A CN101001982B (zh) | 2004-08-10 | 2005-08-10 | 锡-锌合金电镀方法 |
| EP05770802.6A EP1811063B1 (en) | 2004-08-10 | 2005-08-10 | Tin-zinc alloy electroplating method |
| US11/704,805 US20070199827A1 (en) | 2004-08-10 | 2007-02-09 | Method for electroplating with tin-zinc alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004-233633 | 2004-08-10 | ||
| JP2004233633A JP4594672B2 (ja) | 2004-08-10 | 2004-08-10 | 錫−亜鉛合金電気めっき方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/704,805 Continuation US20070199827A1 (en) | 2004-08-10 | 2007-02-09 | Method for electroplating with tin-zinc alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2006016603A1 true WO2006016603A1 (ja) | 2006-02-16 |
Family
ID=35839372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/014648 WO2006016603A1 (ja) | 2004-08-10 | 2005-08-10 | 錫－亜鉛合金電気めっき方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070199827A1 (ko) |
| EP (1) | EP1811063B1 (ko) |
| JP (1) | JP4594672B2 (ko) |
| KR (1) | KR100929761B1 (ko) |
| CN (1) | CN101001982B (ko) |
| BR (1) | BRPI0514210B1 (ko) |
| ES (1) | ES2526430T3 (ko) |
| WO (1) | WO2006016603A1 (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102634827B (zh) * | 2012-05-07 | 2015-04-08 | 东莞市闻誉实业有限公司 | 一种锡-锌合金电镀方法 |
| CN102690975B (zh) * | 2012-06-11 | 2014-12-03 | 东莞市闻誉实业有限公司 | 一种三元锡-锌合金及其电镀方法 |
| CN104213159A (zh) * | 2014-09-17 | 2014-12-17 | 朱忠良 | 电镀液及电镀方法 |
| CN104357884A (zh) * | 2014-11-14 | 2015-02-18 | 无锡伊佩克科技有限公司 | 一种钢铁材料镀锌锡合金方法 |
| CN105002526A (zh) * | 2015-06-30 | 2015-10-28 | 安徽飞达新材料科技股份有限公司 | 一种冷轧钢板光亮剂 |
| CN105350056B (zh) * | 2015-11-24 | 2017-12-01 | 安徽天思朴超精密模具股份有限公司 | 耐磨损电镀液材料组合物和耐磨损电镀液的制备方法及应用 |
| KR101678013B1 (ko) * | 2016-02-15 | 2016-11-21 | 주식회사 베프스 | 금속성분의 액중 농도 지시체를 포함하는 도금액 및 이를 이용한 도금 방법 |
| KR102621912B1 (ko) * | 2018-12-24 | 2024-01-05 | 현대자동차주식회사 | 휘스커 저항성이 우수한 전기전자부품용 아연 도금 방법 및 아연 도금 강판 |
| CN111188069A (zh) * | 2019-12-31 | 2020-05-22 | 大连长丰实业总公司 | 一种镀锡铋合金溶液及其制备方法 |
| CN111394734A (zh) * | 2020-05-06 | 2020-07-10 | 苏州清飙科技有限公司 | 压铸锌合金用脱膜抛光液及其制备方法 |
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| JPH02175894A (ja) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | スズ、スズ合金電気めっき方法及び同電気めっき装置 |
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| US5985106A (en) * | 1995-07-14 | 1999-11-16 | Velasquez; Geronimo Z. | Continuous rack plater |
| US6322686B1 (en) * | 2000-03-31 | 2001-11-27 | Shipley Company, L.L.C. | Tin electrolyte |
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- 2004-08-10 JP JP2004233633A patent/JP4594672B2/ja active Active
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2005
- 2005-08-10 BR BRPI0514210A patent/BRPI0514210B1/pt not_active IP Right Cessation
- 2005-08-10 EP EP05770802.6A patent/EP1811063B1/en active Active
- 2005-08-10 KR KR1020077002958A patent/KR100929761B1/ko active IP Right Grant
- 2005-08-10 ES ES05770802.6T patent/ES2526430T3/es active Active
- 2005-08-10 CN CN2005800271252A patent/CN101001982B/zh active Active
- 2005-08-10 WO PCT/JP2005/014648 patent/WO2006016603A1/ja active Application Filing
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2007
- 2007-02-09 US US11/704,805 patent/US20070199827A1/en not_active Abandoned
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| JPS5175633A (en) * | 1974-12-27 | 1976-06-30 | Dipsol Chem | Suzu aengokinmetsukyoku |
| JPH02175894A (ja) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | スズ、スズ合金電気めっき方法及び同電気めっき装置 |
| JPH06122991A (ja) * | 1992-09-25 | 1994-05-06 | Deitsupusoole Kk | 錫−亜鉛合金電気めっき浴 |
| JPH06228786A (ja) * | 1993-01-29 | 1994-08-16 | Deitsupusoole Kk | 錫−亜鉛合金めっき浴及びそれを使用するめっき方法 |
| JPH10168592A (ja) * | 1996-12-09 | 1998-06-23 | Daiwa Kasei Kenkyusho:Kk | 錫−亜鉛合金めっき浴 |
| JPH11181589A (ja) * | 1997-12-18 | 1999-07-06 | Japan Energy Corp | 錫合金電気めっき液およびめっき方法 |
| JP2000026991A (ja) * | 1998-07-10 | 2000-01-25 | Daiwa Kasei Kenkyusho:Kk | 錫及び錫合金メッキ浴 |
| JP2002275678A (ja) * | 2001-01-11 | 2002-09-25 | Nikko Materials Co Ltd | ウィスカーフリー錫及び錫合金めっき液、めっき被膜並びにめっき物 |
| WO2004065663A1 (ja) * | 2003-01-24 | 2004-08-05 | Ishihara Chemical Co., Ltd. | スズ含有メッキ浴 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4594672B2 (ja) | 2010-12-08 |
| EP1811063B1 (en) | 2014-12-03 |
| BRPI0514210A2 (pt) | 2009-04-28 |
| US20070199827A1 (en) | 2007-08-30 |
| EP1811063A1 (en) | 2007-07-25 |
| KR20070031442A (ko) | 2007-03-19 |
| ES2526430T3 (es) | 2015-01-12 |
| KR100929761B1 (ko) | 2009-12-03 |
| BRPI0514210B1 (pt) | 2016-05-03 |
| JP2006052431A (ja) | 2006-02-23 |
| CN101001982B (zh) | 2010-09-08 |
| EP1811063A4 (en) | 2009-03-04 |
| CN101001982A (zh) | 2007-07-18 |
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