WO2005022615A1 - 液体回収装置、露光装置、露光方法及びデバイス製造方法 - Google Patents
液体回収装置、露光装置、露光方法及びデバイス製造方法 Download PDFInfo
- Publication number
- WO2005022615A1 WO2005022615A1 PCT/JP2004/012787 JP2004012787W WO2005022615A1 WO 2005022615 A1 WO2005022615 A1 WO 2005022615A1 JP 2004012787 W JP2004012787 W JP 2004012787W WO 2005022615 A1 WO2005022615 A1 WO 2005022615A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- supply
- substrate
- exposure apparatus
- power supply
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70533—Controlling abnormal operating mode, e.g. taking account of waiting time, decision to rework or rework flow
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
Abstract
Description
Claims
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005513548A JP4492538B2 (ja) | 2003-08-29 | 2004-08-27 | 露光装置 |
KR1020117028493A KR101477850B1 (ko) | 2003-08-29 | 2004-08-27 | 액체회수장치, 노광장치, 노광방법 및 디바이스 제조방법 |
KR1020167008491A KR101874724B1 (ko) | 2003-08-29 | 2004-08-27 | 액체회수장치, 노광장치, 노광방법 및 디바이스 제조방법 |
KR1020117021162A KR101321657B1 (ko) | 2003-08-29 | 2004-08-27 | 액체회수장치, 노광장치, 노광방법 및 디바이스 제조방법 |
EP16183984.0A EP3163375B1 (en) | 2003-08-29 | 2004-08-27 | Exposure apparatus and exposure method |
KR1020147017361A KR101609964B1 (ko) | 2003-08-29 | 2004-08-27 | 액체회수장치, 노광장치, 노광방법 및 디바이스 제조방법 |
KR1020187018319A KR20180077311A (ko) | 2003-08-29 | 2004-08-27 | 액체회수장치, 노광장치, 노광방법 및 디바이스 제조방법 |
EP04772736A EP1659620A4 (en) | 2003-08-29 | 2004-08-27 | LIQUID RECOVERY DEVICE, EXPOSURE DEVICE, EXPOSURE METHOD, AND CORRESPONDING PRODUCTION DEVICE |
US11/171,243 US7847916B2 (en) | 2003-08-29 | 2005-07-01 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US11/606,935 US7826031B2 (en) | 2003-08-29 | 2006-12-01 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US12/318,574 US9041901B2 (en) | 2003-08-29 | 2008-12-31 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US12/923,568 US8854599B2 (en) | 2003-08-29 | 2010-09-28 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US13/751,469 US8867017B2 (en) | 2003-08-29 | 2013-01-28 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US14/703,020 US10012909B2 (en) | 2003-08-29 | 2015-05-04 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
US16/013,519 US20180299789A1 (en) | 2003-08-29 | 2018-06-20 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-307771 | 2003-08-29 | ||
JP2003307771 | 2003-08-29 | ||
JP2004150353 | 2004-05-20 | ||
JP2004-150353 | 2004-05-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/171,243 Continuation-In-Part US7847916B2 (en) | 2003-08-29 | 2005-07-01 | Liquid recovery apparatus, exposure apparatus, exposure method, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005022615A1 true WO2005022615A1 (ja) | 2005-03-10 |
Family
ID=34277666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/012787 WO2005022615A1 (ja) | 2003-08-29 | 2004-08-27 | 液体回収装置、露光装置、露光方法及びデバイス製造方法 |
Country Status (8)
Country | Link |
---|---|
US (7) | US7847916B2 (ja) |
EP (3) | EP3163375B1 (ja) |
JP (13) | JP4492538B2 (ja) |
KR (6) | KR101874724B1 (ja) |
HK (1) | HK1205281A1 (ja) |
SG (4) | SG10201607457PA (ja) |
TW (7) | TWI475596B (ja) |
WO (1) | WO2005022615A1 (ja) |
Cited By (37)
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WO2005122218A1 (ja) * | 2004-06-09 | 2005-12-22 | Nikon Corporation | 露光装置及びデバイス製造方法 |
JP2006179761A (ja) * | 2004-12-24 | 2006-07-06 | Nikon Corp | 露光装置及びデバイス製造方法 |
JP2006278795A (ja) * | 2005-03-30 | 2006-10-12 | Nikon Corp | 検出装置及び露光装置、並びにデバイス製造方法 |
US20060250593A1 (en) * | 2004-06-10 | 2006-11-09 | Nikon Corporation | Exposure apparatus and device fabricating method |
JP2006319242A (ja) * | 2005-05-16 | 2006-11-24 | Nikon Corp | 露光装置 |
JP2007005525A (ja) * | 2005-06-23 | 2007-01-11 | Nikon Corp | 露光装置及びデバイス製造方法 |
US7365828B2 (en) | 2004-09-03 | 2008-04-29 | Canon Kabushiki Kaisha | Exposure apparatus, exposure method, and device manufacturing method |
JP2008219020A (ja) * | 2003-12-23 | 2008-09-18 | Asml Netherlands Bv | リソグラフィ装置 |
JP2009033201A (ja) * | 2004-04-14 | 2009-02-12 | Asml Netherlands Bv | リソグラフィック装置及びデバイス製造方法 |
JP2009111349A (ja) * | 2007-09-13 | 2009-05-21 | Asml Netherlands Bv | リソグラフィ装置およびデバイス製造方法 |
JP2009540564A (ja) * | 2006-06-06 | 2009-11-19 | 株式会社ニコン | 基板を浸漬するための液浸流体閉じ込めプレートを有する液浸リソグラフィシステム及び方法 |
JP2010093300A (ja) * | 2010-01-25 | 2010-04-22 | Nikon Corp | 流路形成部材、露光装置及びデバイス製造方法 |
US7990518B2 (en) | 2007-10-05 | 2011-08-02 | Canon Kabushiki Kaisha | Immersion exposure apparatus and device manufacturing method |
US8035799B2 (en) | 2004-12-09 | 2011-10-11 | Nikon Corporation | Exposure apparatus, exposure method, and device producing method |
US8072576B2 (en) | 2003-05-23 | 2011-12-06 | Nikon Corporation | Exposure apparatus and method for producing device |
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US8085381B2 (en) | 2003-04-11 | 2011-12-27 | Nikon Corporation | Cleanup method for optics in immersion lithography using sonic device |
JP2012134557A (ja) * | 2005-04-28 | 2012-07-12 | Nikon Corp | 露光方法及び露光装置、並びにデバイス製造方法 |
US8379187B2 (en) | 2007-10-24 | 2013-02-19 | Nikon Corporation | Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method |
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