WO2005008318A1 - 検査方法、半導体装置、及び表示装置 - Google Patents
検査方法、半導体装置、及び表示装置 Download PDFInfo
- Publication number
- WO2005008318A1 WO2005008318A1 PCT/JP2004/010552 JP2004010552W WO2005008318A1 WO 2005008318 A1 WO2005008318 A1 WO 2005008318A1 JP 2004010552 W JP2004010552 W JP 2004010552W WO 2005008318 A1 WO2005008318 A1 WO 2005008318A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pixel
- line
- data line
- data
- level
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3674—Details of drivers for scan electrodes
- G09G3/3677—Details of drivers for scan electrodes suitable for active matrices only
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
- G09G3/3611—Control of matrices with row and column drivers
- G09G3/3685—Details of drivers for data electrodes
- G09G3/3688—Details of drivers for data electrodes suitable for active matrices only
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/12—Test circuits or failure detection circuits included in a display system, as permanent part thereof
Definitions
- the present invention relates to an inspection method of a semiconductor substrate formed by arranging pixel driving cells in a bright matrix state, a semiconductor device comprising a semiconductor substrate corresponding to the inspection method, and a semiconductor device as described above. And a display device having the same. Background art
- Liquid crystal display devices employing the active matrix method are widely used, for example, in liquid crystal display devices and liquid crystal display devices.
- an active matrix type liquid crystal display device includes, for example, a pixel having, for example, a pixel switch using a MOS transistor and a pixel capacitor connected to the pixel switch with respect to a semiconductor substrate.
- the cell drive circuits are formed so as to be arranged in a matrix. That is, a plurality of scanning lines (gate lines) are arranged along the horizontal (row) direction, and a plurality of data lines are arranged along the vertical (column) direction. Then, a pixel cell driving circuit is connected to a position corresponding to the intersection between the gate line and the data line. Then, the opposing substrate on which the common electrode is formed is opposed to the semiconductor substrate, and liquid crystal is sealed between the semiconductor substrate and the opposing substrate.
- Such a structure constitutes a liquid crystal display device.
- a predetermined level of voltage is sequentially applied to the horizontal gut lines, for example, every horizontal scanning period.
- the gate lines are sequentially driven.
- a gate voltage is applied to the gates of a plurality of pixel switches (MOS transistors) connected to the gate line on which the scanning is performed, and these pixel switches are turned on.
- the data lines are driven within one horizontal scanning period. That is, a voltage corresponding to the data is applied to the data line.
- data lines are driven by a so-called point-sequential driving method in which data is sequentially applied to the data lines.
- the data applied in this manner is stored as charges in the pixel capacitance via the pixel switch in the ON state as described above. That is, data is written to the pixel cells for one horizontal line.
- a potential difference is generated between the charge accumulated in the pixel capacitor and the common voltage applied to the counter electrode, and the potential difference excites the liquid crystal sealed therebetween. Will be done. That is, the driving of the pixel cell is performed.
- the driving of the pixel cells corresponding to each gate line is executed each time the gate line is sequentially scanned, so that, for example, an image for one screen is displayed.
- the driving is usually performed so as to prevent the liquid crystal from being deteriorated by applying a DC voltage to the liquid crystal.
- a polarity inversion driving method in which pixel data is inverted to a positive electrode side and a negative electrode side with respect to a common voltage and driven is known.
- the timing of this polarity inversion drive Examples of the method include a frame inversion method of inverting each frame, a line inversion method of inverting each horizontal line, and a dot inversion method of inverting each pixel cell (dot).
- a defect may be formed in a circuit in a gate line or a data line.
- a gate line or a data line that does not operate normally due to a break in the gate line or the data line or a short circuit with some wiring in another semiconductor substrate.
- Such defects are also called line defects.
- a line-shaped non-display appears depending on the line defect, which causes a serious quality defect for a liquid crystal display device.
- Inspection of such a semiconductor substrate circuit for a line defect is performed, for example, as follows.
- pads electrically connected to the ends of the gate lines and data lines are provided on the semiconductor substrate circuit. Then, a voltage of a predetermined level is applied to a gate line and a data line to be inspected, and a needle of a probe is directly applied to the pad to observe a detected current. Since the level of the current detected at this time shows a change according to the state of the gate line and the data line such as the presence or absence of a line defect, the presence or absence of the line defect can be determined.
- Patent Document 1 Japanese Unexamined Patent Application Publication No. 2001-216175
- the ends of the data lines that are not connected to the drive circuit are commonly connected. Then, they are collectively connected to an input / output terminal, and a predetermined level of voltage is applied from the outside to between the input / output terminal and a terminal for supplying a video signal. Then, by observing the current level flowing to the terminal at this time, the defect of the line defect is determined.
- the measurement of the current level is based on an analog value.
- the current level measurement based on the analog value it is necessary to use the measurement value based on the analog value to accurately judge the line defect based on the measured current level. Errors must be considered. For this reason, the detection time for measuring the current level has become longer, and there has been a problem that it is difficult to proceed with the inspection work efficiently.
- the present invention provides a pixel cell driving circuit including a pixel switch and a pixel capacitor connected to the pixel switch and holding pixel data, and includes a data line and a pixel switch control line.
- the following configuration is adopted as a detection method for a semiconductor substrate formed in a matrix form corresponding to the position of the intersection.
- two or more data lines or two or more pixel switch control lines are selected according to the layout structure of wiring on the semiconductor substrate and / or inspection items, and each of the selected data lines or each of the pixel switch control lines is selected.
- An inspection drive step of applying a detection drive signal of a level corresponding to a required logical value, which is set according to the arithmetic expression of the logical operation performed by the logical operation step;
- a logical operation step of inputting a potential output generated in each of the data lines or each of the two or more pixel switch control lines as a logical value and performing a logical operation based on an arithmetic expression determined according to the layout structure and the inspection items. And so on.
- a pixel cell drive circuit which corresponds to the intersection of the data line and the pixel switch control line and includes a pixel switch and a pixel capacitor connected to the pixel switch and holding pixel data, is arranged in a matrix.
- the logical operation is performed on each of the image display area portion formed in a matrix and two or more data lines or two or more pixel switch control lines selected according to the layout structure of wiring on the semiconductor substrate and / or inspection items.
- Means for applying a detection drive signal at a level corresponding to a required logical value which is set according to the arithmetic expression of the logic operation performed by the means, and applying two or more data lines or Inputs the potential output generated on two or more pixel switch control lines as a logical value.
- a logical operation is performed by an arithmetic expression determined according to a layout structure and / or an inspection item, and a logical operation means for outputting a logical operation result is formed on a semiconductor substrate to configure a semiconductor device.
- the display device is configured as follows.
- the display device includes a semiconductor substrate, a counter substrate having a common electrode disposed to face the semiconductor substrate, and a liquid crystal layer interposed between the semiconductor substrate and the counter substrate. It shall be provided.
- the semiconductor substrate corresponds to the intersection of the data line and the pixel switch control line, and includes a pixel cell comprising a pixel switch and a pixel capacitor connected to the pixel switch and holding pixel data.
- An image display area formed by arranging drive circuits in a matrix form, and two or more data lines or two or more pixel switch control lines selected according to the wiring structure and / or inspection items on the semiconductor substrate.
- a driving means for applying a test drive signal of a level corresponding to a required logical value which is set according to an arithmetic expression of a logical operation performed by the logical operation means, and Note
- the potential output generated on two or more data lines or two or more pixel switch control lines is input as a logical value, and is applied to the arithmetic expression determined based on the layout structure and Z or the inspection item. That performs logical operations, and shall and logical operation means for outputting a logical operation result is formed.
- two or more appropriate data lines or pixel switch control lines are arranged on the semiconductor substrate according to the layout structure and / or inspection items of the wiring on the semiconductor substrate.
- One of the data lines or two or more pixel switch control lines is selected.
- an inspection drive signal as a predetermined logical value is applied to the selected two or more data lines or the two or more pixel switch control lines according to the layout structure and / or inspection item.
- these C type of this logical operation is to perform a logic operation of the potential output of logic value to test drive signal is to occur in each of the applied data line or the pixel Suitsuchi control line also, the Reiau preparative structure and No. or the inspection item.
- the result of the logical operation changes according to the state of the data line or the pixel switch control line to which the inspection drive signal is applied, and this can be used as a determination element for inspection.
- the detection output as a judgment element for inspection is not a change in analog current level, for example, but is a binary value that takes one of 0, 1 (H, L). In other words, it is a digital value.
- a pixel cell driving circuit composed of a pixel switch and a pixel capacitor connected to the pixel switch and holding pixel data is connected to a matrix corresponding to the intersection of the data line and the pixel switch control line.
- the inspection method for semiconductor substrates formed in a matrix is also configured as follows. That is, a driving step of driving the data line or the pixel switch control line to be inspected by a detection driving signal of a required voltage level, and a data line or a pixel driven by the detection driving signal.
- the potential output level generated in the switch control line is compared with a reference level to which a predetermined level has been set, and a comparison step of outputting the comparison result as a logical value is performed.
- a pixel cell driving circuit composed of a pixel switch and a pixel capacitor connected to the pixel switch and holding pixel data, corresponding to the intersection of the data line and the pixel switch control line, has a matrix-like shape.
- Driving means for driving the data line or the pixel switch control line to be inspected by an inspection drive signal at a required voltage level;
- Data line or pixel switch control line A semiconductor device is formed by forming, on a semiconductor substrate, comparison means for comparing a potential output level generated at a predetermined level with a reference level to which a predetermined level is set, and outputting a comparison result as a logical value. It was decided to.
- the display device is configured as follows.
- a display device includes a semiconductor substrate, a counter substrate having a common electrode disposed to face the semiconductor substrate, and a liquid crystal layer interposed between the semiconductor substrate and the counter substrate.
- the semiconductor substrate includes: a driving unit that drives the data line or the pixel switch control line to be inspected by an inspection drive signal having a required voltage level; and a data line or a pixel line that is driven by the inspection drive signal. It is assumed that a comparison means is formed which compares a potential output level generated in the pixel switch control line with a reference level to which a predetermined level is set, and outputs a comparison result as a logical value.
- the detection drive signal of a required level is applied to the data line or the pixel switch control line, whereby the data line or the pixel switch control line has: A potential change occurs depending on the state. Then, the result obtained by comparing the potential obtained in this way with the reference level is output as a logical value. Therefore, the logical value output as a result of this comparison also indicates a change according to the state of the data line or the pixel switch control line, and can be used as a judgment factor for inspection.
- the detection output as the judgment element for the inspection is obtained as a digital value.
- FIG. 1 shows a liquid crystal display device common to the first and second embodiments of the present invention.
- FIG. 3 is a diagram showing a circuit configuration of FIG.
- FIG. 2 is a cross-sectional view schematically illustrating an example of a wiring layout structure of a semiconductor substrate included in the liquid crystal display device according to the embodiment.
- FIG. 3 is a diagram showing a circuit configuration of a liquid crystal display device according to the first embodiment (first example).
- FIG. 4A to FIG. 4D show the logical value of the inspection drive signal and the output (logical value) of the logical circuit according to the line defect state of the data line, corresponding to the first embodiment (first example).
- FIG. 4A to FIG. 4D show the logical value of the inspection drive signal and the output (logical value) of the logical circuit according to the line defect state of the data line, corresponding to the first embodiment (first example).
- FIG. 5 is a diagram showing a circuit configuration of a liquid crystal display device corresponding to the first embodiment (second example).
- FIG. 6A to FIG. 6D show the logical value of the inspection drive signal and the output (logical value) of the logical circuit according to the line defect state of the data line, corresponding to the first embodiment (second example).
- FIG. 6A to FIG. 6D show the logical value of the inspection drive signal and the output (logical value) of the logical circuit according to the line defect state of the data line, corresponding to the first embodiment (second example).
- FIG. 7 is a diagram illustrating a circuit configuration of a liquid crystal display device according to the first embodiment (third example).
- FIGS. 8A to 8L show the logical value of the inspection drive signal and the output (logical value) of the logic circuit according to the line defect state of the data line, corresponding to the first embodiment (third example).
- FIG. 8A to 8L show the logical value of the inspection drive signal and the output (logical value) of the logic circuit according to the line defect state of the data line, corresponding to the first embodiment (third example).
- FIG. 9 is a diagram illustrating a circuit configuration of a liquid crystal display device according to the first embodiment (fourth example).
- FIG. 10 is a diagram showing a circuit configuration of a liquid crystal display device according to the first embodiment (fifth example).
- FIG. 11 is a diagram showing a circuit configuration of a liquid crystal display device according to the second embodiment (first example).
- FIG. 12 is a diagram showing a circuit configuration of a liquid crystal display device according to the second embodiment (second example).
- FIG. 1 shows the first embodiment and the second embodiment.
- 9 shows a circuit configuration example of a liquid crystal display device which is common to the embodiments.
- As a basic structure of the liquid crystal display device 1 shown in this figure at least required circuits, such as pixel cell drive circuits arranged in a matrix, are formed on the semiconductor substrate. Then, a counter substrate on which a common electrode is formed is opposed to the semiconductor substrate, and a liquid crystal is sealed between the semiconductor substrate and the counter substrate.
- a silicon substrate made of a silicon (Si) material is used for the semiconductor substrate.
- the pixel cell drive circuits 5 are formed on the semiconductor substrate so as to be arranged in a matrix shape, and the gate line drive circuit 2, the data line drive circuit 3, and a small number as described later.
- a data line test circuit 11 and a gate line test circuit 10 which can be used for defect inspection of data lines and gut lines at least are formed.
- One pixel cell drive circuit 5 includes a pixel switch S mn, a pixel capacitance C mn, and a pixel electrode P 22 as shown in the figure.
- the pixel switch S mn has, for example, a structure as an FET (field effect transistor).
- the gate (G) of the pixel switch S m ⁇ is connected to the gate line Gm, and the drain (D) is connected to the data line Dn. Note that each gate line and data line are also formed on the semiconductor substrate.
- the source (S) of the pixel switch Smn is connected to one end of the pixel capacitor Cmn.
- the other end of the pixel capacitance Cmn is connected to the common electrode.
- the connection point between the source of the pixel switch and the pixel capacitance Cmn is connected to the pixel electrode P22.
- the pixel cell drive circuits 5 formed in this manner are arranged in a matrix and along the row direction and the column direction as shown in the figure. Further, the semiconductor substrate on which the pixel cell drive circuit 5 is formed in this manner is in a state where the pixel electrodes P of each pixel cell drive circuit 5 are arranged in a matrix and exposed.
- the gate line driving circuit 2 is formed, for example, with a shift register. In a normal display, the gate line driving circuit 2 runs the gate line in a vertical direction for each row (one horizontal line). Is provided. In other words, the gate line is driven by outputting a pulse-like scanning signal (scanning pulse) in the order of gate line Gm-1 ⁇ Gm ⁇ Gm + 1... ′ In each horizontal scanning period.
- a pulse-like scanning signal scanning pulse
- the gate line Gm is driven by the operation of the gate line driving circuit 2, the pixel switches (Smn_l, Smn, Smn + 1) of one row connected to the gate line Gm When a gate voltage is applied to the gate, these pixel switches (S mn-1, S mn, S mn +1) are turned on.
- the data line driving circuit 3 is also a circuit formed with a shift register and the like, and sequentially shifts data for each horizontal line input from the outside, so that each data line D n ⁇ 1, D n , D n + 1 in order along the horizontal direction Driving is performed so as to perform next scanning.
- the semiconductor substrate formed in this manner is arranged so that the opposing substrate on which the common electrode to which the common potential Vcom is applied is formed. Then, a liquid crystal is sealed between the semiconductor substrate and the counter substrate to form a liquid crystal layer 4.
- the liquid crystal display device 1 of the present embodiment is configured.
- the gate line driving circuit 2 scans the gate lines from the first row to the last row sequentially by shifting the output at the timing of each horizontal scanning period by the operation of the shift register. Go.
- a gate voltage is applied to the pixel switches S m-1 n-1, S m_ln, S m-1 n + 1 of the row connected to the gate line Gm-1.
- the pixel switches Sm_1n-1, Sm-ln, Sm-1n + 1 are turned off and the next gate line Gm
- the pixel switches S mn ⁇ 1, S mn, Smn + 1 of the row connected to are turned on. Thereafter, scanning for the remaining gate lines is performed in the same manner.
- driving the data line means outputting a voltage value corresponding to the pixel data from the data line driving circuit 3 to the data line.
- the driving of the data line D n ⁇ 1 is performed during the period of scanning the gate line Gm.
- the pixel switches S mn-1, S mn, and S mn +1 connected to the gate to the gate line Gm are turned on.
- the pixel capacitance Cm n _ 1 connected to the pixel switch S mn _ 1 at the intersection of the gate line Gm and the data line D n -1 On the other hand, a charge corresponding to the voltage value (data) applied to the data line D n-1 is accumulated through the drain ⁇ source of the pixel switch S mn-1.
- a potential corresponding to the accumulated charge is generated at both ends of the pixel capacitance Cmn-1.
- data has been written to the pixel capacitance Cmn-1.
- the potential generated in the pixel capacitance Cmn-1 by the data writing is also generated in the pixel electrode P 21 connected to the source of the same pixel switch Smn-1.
- the data written to the pixel capacitor Cmn-1 is retained, and then the next data line Dn is driven. Therefore, in this case, data is written to the pixel capacitance Cmn connected to the pixel switch Smn at the intersection of the gate line Gm and the data line Dn, and the potential is applied to the pixel electrode P22. Will occur.
- a common electrode to which the electric potential Vcom is applied is disposed so as to face the liquid crystal layer 4 therebetween.
- the data line driving circuit 3 sequentially drives the data lines during the scanning period of the gate line Gm, and it is assumed that the driving of one horizontal line pixel is completed. Then, the gate line driving circuit 2 terminates the scan of the gate line Gm and scans the next gate line Gm-1. So Then, during the running period of the gate line Gm_1, the data line driving circuit 3 sequentially drives the data lines, and similarly drives the pixels for one horizontal line.
- the data lines and the gate lines formed on the semiconductor substrate constituting the liquid crystal display device 1 are inspected for the presence or absence of so-called line defects.
- the line defect means that a data line or a gut line has a defect such as disconnection or short circuit.
- the configuration of the semiconductor substrate constituting the liquid crystal display device 1 shown in FIG. 1 above As can be understood from the image display operation, if a line defect occurs between the data line and the gate line, the defect is removed. This causes a serious defect that the generated line is not properly driven for display. Inspection of line defects is performed to eliminate such defective products.
- a data line test circuit is applied to a semiconductor substrate constituting the liquid crystal display device 1. 11 and the gate line test circuit 10 are provided.
- the data line test circuit 11 has a data line ( ⁇ Dn_l, Dn, Dn +) on the side opposite to the side connected to the data line drive circuit 3 side. 1 ⁇ ⁇ ⁇ ) are connected.
- the gate line test circuit 10 is connected to the Gout line (Gm-1, Gm, Gm + 1, Gm) on the side opposite to the side connected to the data line drive circuit 3 side. ⁇ )
- a logic circuit is configured in the data line test circuit 11 and the gate line test circuit 10 as a configuration for inspecting a line defect.
- the type of logical operation performed by the logic circuit and the data line or gate line to be connected to the logic circuit are determined according to the actual wiring layout on the semiconductor substrate. However, the determination should be made in consideration of making it possible to appropriately obtain the judgment result of the line defect inspection.
- FIG. 2 shows an example of a wiring layout structure in the semiconductor substrate as the liquid crystal display device 1 shown in FIG.
- the layout structure of the semiconductor substrate is shown in a sectional view.
- a wiring layout structure corresponding to the data line side of the data line and the gate line is shown. The specific description of the configuration for the subsequent inspection is made on the assumption that the wiring layout shown in this figure is used.
- FIG. 2 first, in the layout (arrangement) structure on the semiconductor substrate, two data lines Dn and Dn + 1 are arranged adjacent to each other. Shield wirings 20A and 20B are respectively arranged adjacent to both sides of these data lines Dn and Dn + 1. The shield wires 20A and 2OB are used to shield the data lines Dn and Dn + 1 in the same layer from other wires.
- the semiconductor substrate in this case is assumed to have a structure of a plurality of layers in this manner, but here, the data lines D n and D n + 1 and the shield wirings 20 A and 2
- the light-shielding wiring 21A is arranged in an upper layer at a position facing 0B. Also, for the lower layer, Line 21B is located.
- the light-shielding wiring has a wiring structure provided to prevent light from the upper layer from entering the lower layer.
- a fixed potential such as a power supply potential or a ground potential is applied to the above-mentioned shield wiring and light-shielding wiring.
- the drive is not driven beyond the disconnection point, so that a high impedance state is established.
- Some fixed potential is generated depending on the layout state of the surrounding wiring, such as the pull-up capacitance.
- a data line (or gate line) is short-circuited to some other wiring placed adjacent to it as a line defect. Depending on conditions such as the potential of the short-circuited wiring. A fixed potential will be generated.
- the potential generated on the data line (or gate line) is, for example, the voltage applied for inspection (inspection drive signal). If the level is determined, it can be said that the level is determined by the wiring layout structure of the semiconductor substrate around the data line (or gate line). Note that, as described above, the wiring layout structure here refers to the physical arrangement of the wiring including the condition of the potential applied to the wiring.
- the inspection is performed after the configuration.
- FIG. 3 shows a first example of the first embodiment, showing an example of an internal configuration of a data line test circuit 11 corresponding to a case where a disconnection of a data line is inspected as a line defect. I have.
- the potential generated at the end opposite to the data line drive circuit 3 is input as a logical value to the data lines Dn and Dn + 1. Then, a logical operation based on a logical product is performed on the input, and a logical value as the operation result is output from the inspection output terminal 17.
- the inspection output terminal 17 is connected to, for example, a detection input terminal of an inspection device or the like not shown here. Thereby, for example, the inspection operator can recognize the inspection result as the output of the AND gate 12 by monitoring the display of the inspection device.
- the data line test circuit 11 includes a plurality of logic circuits connected to data lines other than the data lines Dn and Dn + 1. is there.
- the AND gates 12 corresponding to the data lines D ⁇ and D n + 1 are shown.
- the following is known as the surrounding wiring layout structure. That is, drive is performed by applying an H level to the data line Dn. In this case, in a defect-free state with no disconnection, the device is driven as it is at the H level, and a potential corresponding to this H level is generated. On the other hand, when the data line Dn is disconnected, a low potential not corresponding to the H level is generated. This is the same for the data line D n +1.
- the data lines Dn and Dn + 1 are simultaneously set to the H level (logical value 1) from the data line drive circuit 3 for each of the data lines Dn and Dn + 1. Is applied.
- the data line driving circuit 3 When performing the inspection, the data line driving circuit 3 performs a signal applying operation different from that of the normal display as described above.
- the operation of applying the test drive signal of the data line drive circuit 3 corresponding to such a test is to be controlled by, for example, an external test device (not shown).
- FIG. 4A to 4D show the logical value pattern of the test drive signal, the state of data lines D n and D n + 1 (the presence or absence of disconnection), and the corresponding logical value input to AND gate 12
- the relationship between the pattern (gate input) and the logical product operation output (gate output: output from the test output terminal 17) is shown.
- FIG. 4A assuming that an H-level inspection drive signal is applied to the data lines D n and D n + 1, both the data lines D n and D n + 1 are not disconnected. Assuming that there is no defect, the potentials generated on these data lines D n and D n + 1 both correspond to the H level, so that the gate output as the inspection output terminal 17 is: It becomes H level.
- FIG. 4A shows that an H-level inspection drive signal is applied to the data lines D n and D n + 1, both the data lines D n and D n + 1 are not disconnected.
- the potentials generated on these data lines D n and D n + 1 both correspond
- both the data lines Dn and Dn + 1 are disconnected.
- the L level it can be determined that at least one of the data lines Dn and Dn + 1 is disconnected.
- the data lines Dn and Dn + 1 are affected by other wiring when the data lines Dn and Dn + 1 are disconnected, based on the physical wiring layout structure shown in FIG.
- the configuration for the test corresponding to the case where the potential of the surrounding wiring is set so that the potential corresponding to the H level is generated in Section 3 will be described.
- FIG. 5 shows a configuration example of the data line test circuit 11 corresponding to the above case.
- the same parts as those in FIG. 5 are identical to the same parts as those in FIG.
- NOR gate 13 is provided in place of the AND gate 12 corresponding to the data lines D n and D n + 1. Is done. In other words, the ends of the data lines Dn and Dn + 1 opposite to the data line drive circuit 3 are connected to the inputs of the NOR gate 13. In this case, the operation result of the NOR gate 13 is output from the inspection output terminal 17.
- the data line drive circuit 3 simultaneously applies a signal corresponding to the L level as a detection drive signal to the data lines Dn and Dn + 1.
- FIGS. 6A to 6D a detection output is obtained as shown in FIGS. 6A to 6D.
- FIG. 6A corresponds to a case where both the data lines D n and D n + 1 are in a non-defective state where they are not disconnected.
- the level test drive signal is applied to the data lines D n and D n +1. Both the data lines D n and D n +1 are not disconnected. If there are no defects, the potentials generated on these data lines Dn and Dn + 1 both correspond to the L level. Therefore, in this case, (L, L) is input to the NOR gate 13 and an H level is obtained as the operation output.
- both the data lines D n and D n + 1 are connected. If there is no disconnection and there is no defect, and if the L level is output, it is determined that at least one of the data lines Dn and Dn + 1 is disconnected. Can be.
- FIGS. 3 to 4D as a first example, or FIGS. 5 to 6D as a second example perform inspection for disconnection as the type of data line defect.
- FIGS. 3 to 4D as a first example, or FIGS. 5 to 6D as a second example perform inspection for disconnection as the type of data line defect.
- a description will be given of a configuration for checking whether or not there is a short circuit with another wiring as a type of line defect of the data line.
- an EXOR (Exclusive OR) gate 14 is provided in the data line test circuit 11, and the input of the EXOR gate 14 is connected to the ends of the data lines Dn and Dn + 1.
- the same parts as those in FIGS. 3 and 5 are denoted by the same reference numerals, and description thereof will be omitted.
- the data line drive circuit 3 applies a test drive signal corresponding to (H, L) to the data lines Dn and Dn + 1, respectively.
- the application drive level is switched so that the inspection drive signal by (L, H) is applied.
- 8A to 8I show the relationship between the inspection drive signal and the detection output in this case.
- FIGS. 8A to 8F show the case where a detection drive signal is applied to the data lines Dn and Dn + 1 by a combination pattern of (H, L).
- L shows the case where an inspection drive signal with a combination pattern of (L, H) is applied to the data lines D n and D n +1.
- FIG. 8A is FIG.8G
- FIG.8B is FIG.8H
- FIG.8C is FIG.81
- FIG.8D is FIG.8J
- FIG.8E is FIG.8K
- each set of FIG. 8L corresponds to the state of the same data line Dn, Dn + 1.
- test drive signals of (L, H) are applied to the data lines D n and D n + 1, respectively, by exchanging the pattern of the test drive signals.
- the data lines D n and D n + 1 are not connected under the condition that the data lines D n and D n + 1 are short-circuited. It is assumed that the combination patterns of the detection drive signals are exchanged and applied by the (L, H) pattern. At this time, as in the case of FIG. 8B, the data lines Dn and Dn + 1 are set to the H level or the L level, respectively. , A common potential corresponding to either of the above is generated, so that the calculation output of the EXOR gate 14 is L.
- the L level is applied to each pattern.
- the operation output of EXOR gate 14 is obtained.
- the data line D n is in a normal state in which it is not short-circuited, but the data line D n +1 is short-circuited with another wiring, and in this case, the H level becomes Suppose that an inspection drive signal with a combination pattern of (H, L) is applied to the data lines D n and D n +1 in the pulled state.
- the data lines D n and D n + 1 both generate an H-level potential. Therefore, in this case, the arithmetic output of the EXOR gate 14 is L.
- the data lines D n and D n + 1 are connected under the condition that the data lines D n and D n + 1 are short-circuited. It is assumed that the combination pattern of the detection drive signals is switched and applied by the (L, H) pattern.
- the data line Dn is driven by the L-level test drive signal to generate an L-level potential, but the data line Dn + 1 also has the test drive signal at this time. As a result, an H-level potential is generated. Therefore, in this case, even though the data line D n + 1 is short-circuited, the EXOR gate 14 is at the H level from the EXOR gate 14 as in the case where the data lines D n and D n + 1 are defect-free. Will be obtained.
- Inspection drive signal pattern is (H, L) Different values are set so that the level becomes L level at the time of, and H level at the time of (L, H).
- the data line D n is in a normal state without being short-circuited, but the data line D n + 1 is short-circuited with another wiring, and in this case, is pulled to the L level.
- a drive signal for detection with a combination pattern of (H, L) is applied to the data lines D n and D n +1 in the state in which they are set.
- the EXOR gate 14 provides an H-level operation output.
- the data line D n is defect-free, and the data line D n + 1 is short-circuited and pulled to the L level.
- an inspection drive signal of the combination pattern (L, H) is applied to the data lines Dn and Dn + 1, the potentials of the data lines Dn and Dn + 1 are both low.
- the output of the EXOR gate 14 of the L level is obtained.
- the operation output of the EXOR gate 14 is at the H level when the detection drive signal pattern for the data lines Dn and Dn + 1 is (H, L).
- (L, H) different values are taken so as to be at the L level.
- the operation output of EXOR gate 14 is at the H level when the test drive signal pattern for data lines Dn and Dn + 1 is (H, L). In the case of (L, H), different values are taken so as to be at the L level.
- the drive signal for detecting the combination pattern of (L, H) is applied to the data lines Dn and Dn + 1. If it is applied, the potential of the data line D n is shorted to the L level, and the potential of the data line D n + 1 is driven to the H level by the test drive signal. H level is output as the operation output.
- the operation output of the EXOR gate 14 becomes the L level when the detection drive signal pattern for the data lines Dn and Dn + 1 is (H, L). In the case of (L, H), different values are obtained by setting it to the H level.
- the data lines D n and D n By applying an inspection drive signal with a combination pattern of (H, L) / (H, L) to +1, and observing the logical value pattern of the operation output of EXOR gate 14 at that time, It becomes possible to grasp the defect state of the data lines Dn and Dn + 1 relating to the short circuit.
- both of the patterns (H, L) / (H, L) of the combination of the test drive signals for the data lines D n and D n + 1 are H Only when the operation output of the EXOR gate 14 at the level is obtained, it is shown that the data lines Dn and Dn + 1 are in a defect-free state in which no short circuit has occurred.
- the pattern of the operation output of the EXOR gate 14 is both If it does not become H level, that is, if it is LZL, HZL, or LZH, it indicates that a short circuit has occurred in at least one of the data lines Dn and Dn + 1. .
- the pattern of the operation output of the EXOR gate 14, which becomes LZL, changes when the data lines D n and D n + 1 are short-circuited as shown in Fig. 8B and Fig. 8H. If this pattern appears, it can be determined that a short circuit has occurred between the data lines Dn and Dn + 1.
- the gate line is selected based on the actual wiring layout structure of the semiconductor substrate, and for example, the configuration of the logic circuit inside the data line test circuit 11 as shown in FIGS. Formed inside test circuit 10. Then, a test drive signal of a predetermined H / L level is applied to a required gate line from the gate line drive circuit 2 and output from the logic circuit of the gate line test circuit 10. Obtain the logical operation result. Then, based on the result of the logical operation, a determination is made as to a line defect for the gate line.
- the first embodiment first, it is possible to inspect a semiconductor substrate for a line defect (disconnection, short circuit) based on a layout structure of a wiring including a data line (or a gate line). Select two or more data lines (and gate lines) to be detected in consideration of the above. Also, a logical operation in the data line test circuit 11 (or the gate line test circuit 10) for inputting the selected data line (or gate line) and outputting a detection result based on a logical value is performed. The circuit (logical operation expression) is also determined.
- the combination of the selection of the data line (or gate line) to be detected and the logical operation circuit (logical operation expression) is based on the wiring layout structure described above.
- the determination of the logical operation circuit (logical operation expression) in the first and second examples of the disconnection inspection, the AND gate 12 or the NOR gate 13 is used, whereas in the third example of the short-circuit inspection, As can be seen from the fact that the EXOR gate 14 is used, for example, it differs depending on the detection item. That is, in the first embodiment, Not only the wiring layout structure but also the inspection items are factors that determine the selection of data lines (or good lines) and the combination with logical operation circuits (logical operation expressions).
- a data line test circuit including a logical operation circuit as illustrated in FIGS. 1 1 (applicable to the gate line test circuit 10).
- the defect determination is performed based on the logical value as the result of the logical operation, but this is not a determination based on a change in the analog current level as in the related art.
- 1, 0 (H, L) means that the judgment is based on the digital value. This eliminates the need to consider analog current level errors and the like, as in the conventional case, and obtains an accurate determination result based on the determination according to the binary value. Accordingly, for example, the inspection work is simplified and the time is shortened, so that the work efficiency is improved.
- the layout structure of the wiring according to the present invention is a concept that also includes the state of potential setting in the wiring.
- what kind of potential is set for the potential set for the laid out wiring, such as the ground potential and power supply potential Is also included in the element.
- the wiring layout structure of the semiconductor substrate is used to take the above-described wiring potential setting into consideration, and Is formed, and the HZL level of the detection drive signal to be applied to the data line is determined corresponding to the logic circuit.
- the wiring to be fixed potential including the shield wiring, what kind of potential (specifically, whether to be the ground potential or the power supply potential) is determined at the time of designing the semiconductor substrate.
- the logic circuit configuration inside the data line test circuit 11 or the good line test circuit 10 should be determined so that a line defect can be detected in accordance with the wiring potential determined at the time of this design. That is good.
- this means that the potential of the wiring should be set at the stage of designing the semiconductor substrate so that a line defect can be detected.
- each configuration of the first, second, and third examples in the first embodiment can detect only a disconnection as a line defect of the data line (Dn, Dn + 1), or The configuration is such that only short circuits can be detected.
- FIG. 9 shows the basic configuration for checking the disconnection and short-circuit conditions of 1 respectively.
- FIG. 9 also assumes the wiring layout structure shown in FIG. 2, and shows a configuration example capable of detecting both disconnection and short-circuit states of the data lines Dn and Dn + 1. It is assumed that.
- the data line test circuit 11 includes an AND gate 12 and an EXOR gate 14 corresponding to the data lines Dn and Dn + 1.
- the data line test circuit 11 includes a detection output terminal 17 a for outputting the operation result of the AND gate 12 and a test output terminal 17 b for outputting the operation result of the EXOR gate 14. What is necessary is just to provide two detection output terminals. Then, the respective ends of the data lines Dn and Dn + 1 on the opposite side to the data line driving circuit 3 are branched into two, and input to the AND gate 12 and the EXOR gate 14, respectively.
- This configuration combines the configuration for disconnection inspection shown in Fig. 3 and the configuration for short-circuit inspection shown in Fig. 7.
- the disconnection state of the data lines Dn and Dn + 1 is a wiring layout in which a low potential that does not correspond to the H level is generated even when driven by the H level. It is assumed.
- the data line driving circuit 3 When the disconnection is inspected, as described with reference to FIGS. 4A to 4D, the data line driving circuit 3 outputs the data lines Dn and Dn + 1 for the H level detection. A drive signal is output. Then, the disconnection of the data lines Dn and Dn + 1 is inspected by monitoring the operation output of the AND gate 12 output to the detection output terminal 17a of the data line test circuit 11. Is to be.
- an inspection drive signal of a combination pattern of (H, L) with respect to the data lines Dn and Dn + 1, A drive signal for inspection of the combination pattern that becomes (L, H) is applied respectively.
- the output of the EXOR gate 14 is taken out from the test output terminal 17 b of the data line test circuit 11. Then, based on whether the operation result of the EXOR gate 14 obtained from the test output terminal 17 b when the test drive signal of the above two combination patterns is applied is H or L, Inspection of
- the data line test circuit 11 is configured as shown in FIG. It is also conceivable to configure it.
- switch circuits Sw (n) and Sw (n + 1) are formed corresponding to the data lines Dn and Dn + 1. I have to.
- the switching of the switch circuits S w (n) and S w (n + 1) is performed such that one of the terminals t 2 and t 3 is alternatively connected to the terminal t 1.
- These switch circuits S w (n) and S (n + 1) may be formed by a semiconductor switch formed on a semiconductor substrate, for example.
- the switching control of these switch circuits S w (n) and S w (n + 1) is performed, for example, by drawing out a line for the switching control as shown in FIG. Connected to the switched input terminals Tm1 and Tm2. Then, for example, an external inspection device (not shown) is connected to the switching input terminals Tml and Tm2, and a control signal for switching the switch is output from the inspection device to the switching input terminals Tm1 and Tm2. You can make it happen.
- the switch circuits S w (n) and S w (n + 1) As will be understood from the following description, since the switching states are interlocked, for example, the switching input terminals Tm l and Tm 2 are made common to one, and this common switching input terminal A control signal may be input to the switch circuit and the switch circuits S w (n) and S w (n + 1) may be switched in conjunction with each other.
- the ends of the data lines D n and D n + 1 are connected to the terminals t 1 of the switch circuits Sw (n) and Sw (n + 1), respectively. Also, the terminals t 2 of the switch circuits S w (n) and S w (n + 1) are input to the AND gate 12 respectively, and the switch circuits S w (n) and S w (n + 1) Input terminal t3 to EXOR gate 14 respectively.
- the terminal t1 when performing a disconnection inspection, first, for example, as described above, the terminal t1 is connected to the terminal t2 for the switching input terminals Tm1 and Tm2 from the inspection device or the like. Output a control signal for the Thereby, both ends of the data lines D n and D n + 1 are connected to the AND gate 12. Then, as described with reference to FIGS. 4A to 4D, the H-level inspection drive signal is output to both the data lines D n and D n + 1, and output from the inspection output terminal 17. By monitoring the output of the AND gates 12, the presence or absence of a disconnection defect can be determined.
- a control signal for connecting the terminal t1 to the terminal t2 is output from an inspection device or the like to the switching input terminals Tml and Tm2.
- the ends of the data lines D n and D n + 1 are both connected to the EXOR gate 14.
- a plurality of logical operation circuits that perform a specific logical operation are connected in a required connection mode, for example, even for checking only a disconnection or only a short circuit.
- a defect is determined based on the final operation result output from these circuits.
- the logic circuit (AND gate 12, NOR gate 13 and EXOR gate 14) has two inputs, but this is the wiring layout shown in Fig. 2. Due to the structure, the data lines are detected on the adjacent data lines Dn and Dn + 1. Therefore, depending on the actual wiring layout structure, the logic circuit may have three or more inputs.
- line defects on the data line and the gate line can be inspected by the detection output as a logical value.
- the circuits formed in the data line test circuit 11 and the gate line test circuit 10 for inspection are also a set of logic operation circuits according to the wiring layout structure. When connecting multiple logic operation circuits Even if it does, it will not be complicated, and it can be relatively simple and simple.
- a data line (or a gate line) is sequentially applied to a required number of sets by applying an inspection drive signal. If driving is performed, it becomes possible to specify the position of the line defect in which data line (or gate line) or in which area the line defect has occurred, and to determine the subsequent position of the defect. This can be useful for analysis and the like.
- all of the data lines (or gate lines) are simultaneously driven by the test drive signal. You may.
- one of the required H / L levels is set according to the position of that line, and the inspection drive signal is set. Should be applied. If a large number of data line groups (or gate line groups) are simultaneously driven in this way, inspection of line defects in these data line groups (or gate line groups) can be performed simultaneously and collectively. In this case, the detection time can be shortened accordingly.
- the data line test circuit 11 (or the end of the data line group (or the gate line group) may be combined into one as necessary. It is conceivable to adopt a configuration in which an input is made to the logical operation circuit in the gate line test circuit 10).
- defect detection is performed by combining the ends of the data line group (or the gate line group) into one as described above.
- the level change according to the defect was slight. It is very difficult to judge a defect by the method.
- the test output is obtained as a logical value to the last, and the determination is made by binary. In other words, defect determination is much easier than before.
- the data line is inspected for line defects as described above, so that the data line is driven by applying the inspection drive signal to the data line and, at the same time, one or more to be inspected.
- the detection procedure is also conceivable if the gut line is driven.
- the gate line driving circuit 2 is used for driving the gate lines.
- the driven gate line for example,
- the pixel switch connected to this pixel switch (for example, ' ⁇ S mn-1, Smn, S mn + 1 ⁇ ⁇ ⁇ ) turns on, and the pixel capacitance (for example, '' Cmn-l Cmn, C mn + 1 ⁇ ) normally accumulates electric charge, and a potential corresponding to the state of data writing is generated. However, if a short circuit occurs as a defect in the pixel capacitance, such a potential will not be generated.
- FIG. 11 shows a circuit configuration example of a liquid crystal display device as a first example of the second embodiment of the present invention.
- the basic structure of the liquid crystal display device 1 shown in this figure is the same as each example of the first embodiment previously shown in FIG. However, if it is determined that the data line is defective, the data line test circuit 11 has a different configuration as described below.
- the end of the data line Dn is connected to the non-inverting input of the comparator 15.
- the reference level VREF is input to the inverting input.
- the output of the comparator 15 is amplified by the buffer amplifier 16 and output from the detection output terminal 17.
- a buffer amplifier may be connected to the output of the logic circuit as shown in FIGS. 3, 5, and 7 as the first embodiment.
- a comparison circuit for comparing the potential generated at the end of the data line with the reference level VREF of a predetermined potential. Note that, in this figure, only a comparison circuit for checking the data line Dn is shown, but actually, for example, a comparison circuit or the like may be provided for other data lines. .
- the test drive signals VH / VL having different levels are respectively applied. In the test drive signal VH, when there is no line defect (disconnection, short circuit) in the normal state of the data line Dn, a potential higher than the reference level VREF is applied to the end of the data line Dn.
- the output of the comparator 15 (the output of the test output terminal 17) becomes L level while the test drive signal VH is applied, or the test drive signal VL is applied.
- a state such as an H level is obtained.
- the data line Dn has a line defect.
- the level (logical value) of the test drive signal and the comparator 15 From the combination of the logical values of the outputs, it is possible to determine whether the line defect is a disconnection or a short circuit.
- FIG. 12 shows a second example as the second embodiment.
- the same parts as those in FIG. 11 are denoted by the same reference numerals, and description thereof will be omitted.
- a comparison circuit in which a comparator 15 and a buffer amplifier 16 are connected in the same manner as in FIG. 11 is shown.
- the signal applied from the data line drive circuit 3 to the data line Dn as the test drive signal is the test drive signal VD at a certain fixed level.
- the reference level input to the inverting input of the comparator 15 is switched between VREF-H and VREF-L.
- the reference level VREF-H is higher than the potential generated on the non-defective data line by the application of the inspection drive signal VD.
- the reference level VREF-H is applied by the application of the inspection drive signal VD.
- the potential is lower than the potential generated in the data line which is not defective.
- the reference level VREF of the comparator 15 is fixed, and the level of the detection drive signal is switched.
- the level of the detection drive signal is fixed, and the reference level of the comparator 15 is switched.
- the reference levels VREF-H and VREF-L are switched from outside the data line test circuit 11 to the reference levels VREF-H and VREF-L from the outside via the input terminal 18. This is done by outputting a voltage level.
- an inspection device (not shown) may be connected to the input terminal 18 so as to output a voltage from the inspection device to the input terminal 18.
- a level switching circuit is formed inside the data line test circuit 11 so that the level switching circuit can be operated using, for example, a power supply. It is conceivable that the level switching operation in the above can be performed by a switching control signal from an external inspection device, for example.
- the output of the comparator 15 is at the reference level VREF-H.
- the H level is obtained, or the reference level is VREF-L but the L level is obtained.
- the level of the inspection drive signal (Logical value) and the logical value of the output of the comparator 15 can be used to determine whether the line defect is a disconnection or a short circuit.
- the detection output from the data line test circuit 11 is obtained as a logical value of H / L.
- the inspection work can be made simpler and shorter.
- the circuit configuration as a comparator (comparison circuit) is adopted, the circuit configuration to be formed in the data line test circuit 11 can be simplified without becoming complicated.
- the circuit configuration based on the above and the operation of applying the inspection drive signal are performed by the gate line test circuit 10 and By applying the present invention to the gate line driving circuit 2, it is possible to perform detection of a line defect on the gate line as in the case of the data line described above.
- the data lines (or gate lines) to be inspected are set for each required number of pairs in the same manner as in the respective examples of the first embodiment. If drive is performed by sequentially applying inspection drive signals to the sensor, the position of a line defect can be specified, which is effective for analysis and the like. In addition, all the data lines (or gate lines) (or a large number of data line groups (or gate line groups) in a certain area) can be simultaneously driven by a test drive signal for testing. is there.
- an advantage common to the first embodiment and the second embodiment is that an inspection can be performed in both steps before and after liquid crystal encapsulation. No.
- the degree of freedom in which step the inspection process should be performed is given, and the production efficiency can be improved.
- the inspection of the semiconductor substrate as it was before the liquid crystal was sealed was made possible, it was possible to avoid the work of enclosing and incorporating the liquid crystal into a defective product.
- manufacturing efficiency is improved, and furthermore, wasteful liquid crystals are not consumed, and manufacturing costs can be effectively reduced.
- the present invention is also applicable to, for example, inspection of a so-called bit line or word line of a memory element for defects.
- Industrial applicability As described above, according to the present invention, it is possible to obtain a determination result of an inspection for a defect such as a data line or a pixel switch control line according to the detection output as a digital value. In other words, the decision is made based on the binary value change of 0, 1 (H, L) instead of the subtle analog current level change, so that the effects of measurement errors can be almost completely eliminated. As a result, a more accurate judgment result can be obtained than before, and the inspection time can be shortened accordingly. As a result, the inspection work efficiency is improved accordingly.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/565,177 US20060192752A1 (en) | 2003-07-22 | 2004-07-16 | Inspection method semiconductor device and display device |
EP04747915A EP1655631A1 (en) | 2003-07-22 | 2004-07-16 | Inspection method, semiconductor device, and display device |
US11/809,458 US20070236244A1 (en) | 2003-07-22 | 2007-06-01 | Test method, semiconductor device, and display |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-277603 | 2003-07-22 | ||
JP2003277603A JP2005043661A (ja) | 2003-07-22 | 2003-07-22 | 検査方法、半導体装置、及び表示装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/809,458 Division US20070236244A1 (en) | 2003-07-22 | 2007-06-01 | Test method, semiconductor device, and display |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005008318A1 true WO2005008318A1 (ja) | 2005-01-27 |
Family
ID=34074650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/010552 WO2005008318A1 (ja) | 2003-07-22 | 2004-07-16 | 検査方法、半導体装置、及び表示装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060192752A1 (ja) |
EP (1) | EP1655631A1 (ja) |
JP (1) | JP2005043661A (ja) |
KR (1) | KR20060037365A (ja) |
CN (1) | CN1853133A (ja) |
WO (1) | WO2005008318A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103259618A (zh) * | 2012-02-21 | 2013-08-21 | 汤姆森特许公司 | 评估无线电传输信道质量的方法及使用该方法的住宅网关 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007333823A (ja) * | 2006-06-13 | 2007-12-27 | Sony Corp | 液晶表示装置および液晶表示装置の検査方法 |
US8125237B2 (en) * | 2006-07-17 | 2012-02-28 | Scanimetrics Inc. | Thin film transistor array having test circuitry |
JP2008083529A (ja) * | 2006-09-28 | 2008-04-10 | Seiko Epson Corp | アクティブマトリクス基板、アクティブマトリクス基板の検査方法および電気光学装置 |
JP2008185624A (ja) | 2007-01-26 | 2008-08-14 | Sony Corp | 駆動装置および駆動方法、並びに表示装置 |
KR101340510B1 (ko) * | 2007-12-27 | 2013-12-12 | 삼성전자주식회사 | 테스트 장치 및 반도체 집적 회로 장치 |
US9122361B2 (en) * | 2011-05-19 | 2015-09-01 | Qualcomm Technologies, Inc. | Touch panel testing using mutual capacitor measurements |
CN102654658B (zh) * | 2011-08-03 | 2015-07-29 | 北京京东方光电科技有限公司 | 一种tft阵列基板检测方法及检测装置 |
US9030221B2 (en) * | 2011-09-20 | 2015-05-12 | United Microelectronics Corporation | Circuit structure of test-key and test method thereof |
KR20140042484A (ko) * | 2012-09-28 | 2014-04-07 | 삼성디스플레이 주식회사 | 표시 장치 |
CN103986927B (zh) * | 2013-02-08 | 2016-04-06 | 豪威科技股份有限公司 | 用于传感器故障检测的系统及方法 |
KR101452097B1 (ko) * | 2013-03-28 | 2014-10-16 | 삼성전기주식회사 | 터치스크린 장치 |
JP2016085269A (ja) * | 2014-10-23 | 2016-05-19 | セイコーエプソン株式会社 | 電気光学基板、電気光学装置及び電子機器 |
CN104793365A (zh) * | 2015-04-23 | 2015-07-22 | 深圳市华星光电技术有限公司 | 显示面板线路的检测装置及检测方法 |
KR102457760B1 (ko) * | 2016-01-21 | 2022-10-24 | 삼성디스플레이 주식회사 | 표시 패널 및 이를 포함하는 표시 장치 |
JP6653593B2 (ja) * | 2016-02-29 | 2020-02-26 | パナソニック液晶ディスプレイ株式会社 | 表示装置及び表示装置の検査方法 |
US9998700B1 (en) | 2016-12-05 | 2018-06-12 | Omnivision Technologies, Inc. | Image sensor failure detection |
CN106782244B (zh) * | 2017-01-03 | 2020-11-13 | 京东方科技集团股份有限公司 | 触摸显示屏的测试方法和测试装置 |
US10551953B2 (en) | 2017-02-03 | 2020-02-04 | Japan Display Inc. | Display apparatus |
JP2019113710A (ja) * | 2017-12-25 | 2019-07-11 | 三菱電機株式会社 | 電気光学装置 |
KR102548615B1 (ko) * | 2018-07-23 | 2023-06-30 | 삼성전자주식회사 | 단락 감지 장치, 단락 감지 회로 및 이를 적용한 디스플레이 장치 |
US10997882B2 (en) * | 2018-07-23 | 2021-05-04 | Samsung Electronics Co., Ltd. | Short detection device, a short detection circuit and a display device using the same |
KR102097438B1 (ko) * | 2019-05-29 | 2020-04-06 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102147401B1 (ko) * | 2019-06-19 | 2020-08-24 | 주식회사 사피엔반도체 | 마이크로 표시장치 및 그의 검사 방법 |
CN110706629B (zh) * | 2019-09-27 | 2023-08-29 | 京东方科技集团股份有限公司 | 显示基板的检测方法和检测装置 |
JP7564748B2 (ja) | 2021-03-30 | 2024-10-09 | ラピステクノロジー株式会社 | 表示装置、表示ドライバ、及び故障検査方法 |
CN113345509B (zh) * | 2021-05-25 | 2022-05-13 | 长江存储科技有限责任公司 | 地址线的测试样品及其测试方法 |
TWI847504B (zh) * | 2023-01-17 | 2024-07-01 | 友達光電股份有限公司 | 顯示面板 |
CN116540059B (zh) * | 2023-07-07 | 2023-11-14 | 长鑫存储技术有限公司 | 半导体芯片测试方法、装置、设备及存储介质 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122922U (ja) * | 1984-01-26 | 1985-08-19 | セイコーインスツルメンツ株式会社 | 液晶表示装置 |
JPH0318891A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 画像表示装置の検査方法 |
JPH0320721A (ja) * | 1989-06-16 | 1991-01-29 | Matsushita Electron Corp | 画像表示装置 |
JP2000047255A (ja) * | 1998-07-27 | 2000-02-18 | Matsushita Electric Ind Co Ltd | 液晶表示パネル |
JP2001091920A (ja) * | 1999-09-21 | 2001-04-06 | Citizen Watch Co Ltd | 試験回路 |
JP2001318113A (ja) * | 2000-05-08 | 2001-11-16 | Seiko Epson Corp | 電気光学装置の検査装置及び検査方法 |
JP2003050551A (ja) * | 2001-08-07 | 2003-02-21 | Sharp Corp | 集合基板およびその検査方法ならびにその検査装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5113134A (en) * | 1991-02-28 | 1992-05-12 | Thomson, S.A. | Integrated test circuit for display devices such as LCD's |
US5377030A (en) * | 1992-03-30 | 1994-12-27 | Sony Corporation | Method for testing active matrix liquid crystal by measuring voltage due to charge in a supplemental capacitor |
KR100324914B1 (ko) * | 1998-09-25 | 2002-02-28 | 니시무로 타이죠 | 기판의 검사방법 |
US6437596B1 (en) * | 1999-01-28 | 2002-08-20 | International Business Machines Corporation | Integrated circuits for testing a display array |
JP3707404B2 (ja) * | 2001-08-03 | 2005-10-19 | ソニー株式会社 | 検査方法、半導体装置、及び表示装置 |
JP2003050380A (ja) * | 2001-08-07 | 2003-02-21 | Toshiba Corp | アレイ基板の検査方法 |
TW594655B (en) * | 2003-07-11 | 2004-06-21 | Toppoly Optoelectronics Corp | Testing circuit and method thereof for a flat panel display |
-
2003
- 2003-07-22 JP JP2003277603A patent/JP2005043661A/ja active Pending
-
2004
- 2004-07-16 EP EP04747915A patent/EP1655631A1/en not_active Withdrawn
- 2004-07-16 WO PCT/JP2004/010552 patent/WO2005008318A1/ja not_active Application Discontinuation
- 2004-07-16 US US10/565,177 patent/US20060192752A1/en not_active Abandoned
- 2004-07-16 CN CNA2004800266137A patent/CN1853133A/zh active Pending
- 2004-07-16 KR KR1020067001087A patent/KR20060037365A/ko not_active Application Discontinuation
-
2007
- 2007-06-01 US US11/809,458 patent/US20070236244A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122922U (ja) * | 1984-01-26 | 1985-08-19 | セイコーインスツルメンツ株式会社 | 液晶表示装置 |
JPH0318891A (ja) * | 1989-06-15 | 1991-01-28 | Matsushita Electron Corp | 画像表示装置の検査方法 |
JPH0320721A (ja) * | 1989-06-16 | 1991-01-29 | Matsushita Electron Corp | 画像表示装置 |
JP2000047255A (ja) * | 1998-07-27 | 2000-02-18 | Matsushita Electric Ind Co Ltd | 液晶表示パネル |
JP2001091920A (ja) * | 1999-09-21 | 2001-04-06 | Citizen Watch Co Ltd | 試験回路 |
JP2001318113A (ja) * | 2000-05-08 | 2001-11-16 | Seiko Epson Corp | 電気光学装置の検査装置及び検査方法 |
JP2003050551A (ja) * | 2001-08-07 | 2003-02-21 | Sharp Corp | 集合基板およびその検査方法ならびにその検査装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103259618A (zh) * | 2012-02-21 | 2013-08-21 | 汤姆森特许公司 | 评估无线电传输信道质量的方法及使用该方法的住宅网关 |
CN103259618B (zh) * | 2012-02-21 | 2018-10-19 | 汤姆森特许公司 | 评估无线电传输信道质量的方法及使用该方法的住宅网关 |
Also Published As
Publication number | Publication date |
---|---|
KR20060037365A (ko) | 2006-05-03 |
EP1655631A1 (en) | 2006-05-10 |
US20060192752A1 (en) | 2006-08-31 |
CN1853133A (zh) | 2006-10-25 |
JP2005043661A (ja) | 2005-02-17 |
US20070236244A1 (en) | 2007-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005008318A1 (ja) | 検査方法、半導体装置、及び表示装置 | |
JP2758103B2 (ja) | アクティブマトリクス基板及びその製造方法 | |
US6924875B2 (en) | Array substrate having diodes connected to signal lines, method of inspecting array substrate, and liquid crystal display | |
JP4281622B2 (ja) | 表示装置及び検査方法 | |
US7456647B2 (en) | Liquid crystal display panel and testing and manufacturing methods thereof | |
US5377030A (en) | Method for testing active matrix liquid crystal by measuring voltage due to charge in a supplemental capacitor | |
KR101376404B1 (ko) | 액정 표시 장치 및 액정 표시 장치의 검사 방법 | |
KR101385919B1 (ko) | 집적 게이트 드라이버 회로를 포함하는 플랫 패널 디스플레이의 시험 방법 및 시험 장치 | |
JP5709457B2 (ja) | 液晶表示装置および液晶表示装置の検査方法 | |
JP6257192B2 (ja) | アレイ基板およびその検査方法ならびに液晶表示装置 | |
JP4394660B2 (ja) | 能動素子配列基板、液晶表示パネル及びその検査方法 | |
KR20010070439A (ko) | 어레이기판 및 어레이기판의 검사방법 | |
JP3790684B2 (ja) | 検査用回路、検査方法および液晶セルの製造方法 | |
JP4473427B2 (ja) | アレイ基板の検査方法及び該検査装置 | |
US7053649B1 (en) | Image display device and method of testing the same | |
KR101649220B1 (ko) | 액정표시장치의 검사장치 | |
WO2004086070A1 (ja) | 半導体装置の検査回路、および検査方法 | |
JP4724249B2 (ja) | 液晶表示装置及びその検査方法 | |
JP2002116423A (ja) | 液晶表示装置とその検査方法 | |
JP3131585B2 (ja) | 半導体検査回路および半導体回路の検査方法 | |
JP4782956B2 (ja) | アレイ基板の検査方法 | |
JP2010256387A (ja) | 欠陥検査システム、表示装置および表示装置の製造方法 | |
TWI444712B (zh) | 測試探針 | |
JPH08313396A (ja) | 液晶パネルの検査方法 | |
JPH086047A (ja) | アクティブマトリクス基板の検査方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200480026613.7 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004747915 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020067001087 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006192752 Country of ref document: US Ref document number: 10565177 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067001087 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2004747915 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 10565177 Country of ref document: US |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2004747915 Country of ref document: EP |