WO2004071992A1 - 誘電体磁器組成物及び電子部品 - Google Patents
誘電体磁器組成物及び電子部品 Download PDFInfo
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- WO2004071992A1 WO2004071992A1 PCT/JP2004/001711 JP2004001711W WO2004071992A1 WO 2004071992 A1 WO2004071992 A1 WO 2004071992A1 JP 2004001711 W JP2004001711 W JP 2004001711W WO 2004071992 A1 WO2004071992 A1 WO 2004071992A1
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Classifications
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- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
- C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
- C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
- C04B2235/3454—Calcium silicates, e.g. wollastonite
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/36—Glass starting materials for making ceramics, e.g. silica glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
Definitions
- Patent Document 7 WO 02/00 5 6 8
- the third subcomponent containing Mn oxide has a third subcomponent containing Mn oxide, and the ratio of the third subcomponent to 100 mol of the main component is 0 mol ⁇ third subcomponent in terms of Mn element in the oxide. ⁇ 5 monoles.
- A1 a second subcomponent containing an oxide
- An electronic component such as a chip capacitor according to the present invention has a dielectric layer composed of the dielectric ceramic composition according to the present invention (preferably, the dielectric ceramic composition manufactured by the method of the present invention). Therefore, it has excellent capacitance-temperature characteristics, suppresses low-frequency induction dispersion, improves the accelerated life of insulation resistance (high-temperature load life), and as a result, significantly improves the reliability of electronic components .
- the internal electrode layer 3 is formed such that each end face is on the surface of the two opposite ends of the capacitor element body 10. It is laminated so that it is exposed alternately.
- the pair of external electrodes 4 are formed at both ends of the capacitor element body 10 and connected to the exposed end faces of the alternately arranged internal electrode layers 3 to form a capacitor circuit.
- part of the V oxide contained in the first subcomponent may be replaced with an oxide of a Group 5 element such as or Ta, or an oxide of a Group 6 element such as Cr, Mo, or W. Absent.
- the dielectric ceramic composition of the present invention further includes a third subcomponent containing Mn oxide.
- This third subcomponent has the effect of promoting sintering and the effect of improving the life, and also reduces the failure rate of the initial insulation resistance when the dielectric layer 2 is made thinner, for example, to about 4 ⁇ . It also has the effect of lowering.
- the fourth subcomponent includes a composition formula ⁇ (B a z, C a ⁇ ) ⁇ S i ⁇ composite oxide represented by 2 (hereinafter, sometimes also referred to as BCG).
- a composite oxide ⁇ (B a 2, C a ) O ⁇ S I_ ⁇ 2 has a low melting point, has good reactivity against the main component.
- Composition formula as a more preferred embodiment of the fourth subcomponent
- the dielectric layer 2 is composed of grains (dielectric particles) and a grain boundary phase.
- the average particle diameter of the grains of the dielectric layer 2 is not particularly limited in the present invention, but is preferably about 0.1 to 5 tm.
- the grain boundary phase of the dielectric layer 2 is usually mixed as an oxide of a material constituting the dielectric material or the internal electrode material, an oxidized material of a separately added material, or mixed as an impurity during the process. It is usually composed of glass or vitreous, with oxide of the material as a component.
- the multilayer ceramic capacitor 1 using the dielectric porcelain composition of the present invention is prepared by manufacturing a green chip by a normal printing method using a paste and a sheet method, firing the green chip, and then printing or transferring an external electrode. It is manufactured by firing.
- the manufacturing method will be specifically described.
- the dielectric ceramic composition raw material contained therein is prepared.
- the dielectric ceramic composition raw material includes a main component raw material and first to fourth subcomponent raw materials.
- the starting materials e.g. S r COs, C a COs, T etc. i 0 2, Z r 0 2
- the main ingredient material for producing the main ingredient material in addition to the at least a portion of the first byproduct content material to the final composition (e.g. V 2 0 5), second sub ingredient material (for example A 1 2 0 3), third sub ingredient material (for example, MnC0 3) and the fourth subcomponent material (e.g. (B a, C a) 2 S i A predetermined amount of O 2 + z ) is mixed and dried to prepare a raw material before calcining.
- the starting materials e.g. S r COs, C a COs, T etc. i 0 2, Z r 0 2
- the main ingredient material for producing the main ingredient material in addition to the at least a portion of the first byproduct content material to the final composition (e.g. V 2 0 5), second sub ingredient material (for example A 1 2 0 3), third sub ingredient
- the calcination conditions are not particularly limited, but are preferably performed under the following conditions.
- the rate of temperature rise is preferably 50 to 4 ° CZ hours, more preferably 100 to 300 ° CZ hours.
- the holding temperature is preferably from 1000 to 1300 ° C.
- the temperature holding time is preferably 0.5 to 6 hours, more preferably 1 to 3 hours.
- the treatment atmosphere may be any of air, nitrogen and reducing atmosphere.
- the dielectric layer paste and the internal electrode layer paste are laminated and printed on a substrate such as polyethylene terephthalate, cut into a predetermined shape, and then peeled off from the substrate. This is a green chip.
- a green sheet is formed using a dielectric layer paste, an internal electrode layer paste is printed thereon, and these are laminated to form a green chip.
- the obtained fired capacitor body is polished by, for example, barrel polishing or sand blasting, and the external electrode paste is printed or transferred and baked to form the external electrode 4. Then, if necessary, a coating layer (pad layer) is formed on the surface of the external electrode 4 by plating or the like.
- a multilayer ceramic capacitor is illustrated as an electronic component according to the present invention.
- the material is not limited to a densifier, and any material having a dielectric layer composed of the dielectric ceramic composition having the above composition may be used.
- the starting materials for producing the main component materials and the first to fourth subcomponent materials are weighed and mixed such that the composition after firing has the mixing ratio shown in each sample in each table, and mixed.
- powder before calcining was prepared.
- the dielectric ceramic composition raw material thus obtained was mixed with an ataryl resin, ethyl acetate, mineral spirit and acetone by a ball mill to form a paste to obtain a dielectric layer paste.
- Ni particles having an average particle size of 0.1 to 0.8 ⁇ , an organic vehicle, and butyl carbitol were kneaded with three rolls to form a paste, thereby obtaining a paste for an internal electrode layer.
- a green sheet having a thickness of 6 ⁇ was formed on the PET film using the above-mentioned dielectric layer paste, and after printing the internal electrode layer paste on the green sheet, the green sheet was peeled off from the PET film.
- the external electrode paste is transferred to the end face, and fired at 800 ° C. for 10 minutes in a humidified N 2 + H 2 atmosphere, and the external electrode paste is baked.
- the electrodes were formed, and a sample of the multilayer ceramic capacitor having the configuration shown in Fig. 1 was obtained.
- the size of each sample obtained in this way is 3.2 mm X 1.6 mm X 0.6 mm, the number of dielectric layers sandwiched between the internal electrode layers is 10, the thickness is 4 ⁇ , The thickness of the internal electrode layer was 2 // m. The following characteristics were evaluated for each sample.
- the capacitance and dielectric loss (tan) of the capacitor sample were measured at a reference temperature of 25 ° C using a digital LCR meter (YHP 4274A) at a frequency of 1 MHz and an input signal level (measurement voltage) of lV rms. ⁇ , the unit is ./.). Regarding ta ⁇ ⁇ , all samples showed good values of 0.01% or less. Then, from the obtained capacitance, the electrode dimensions and the distance between the electrodes of the capacitor sample, the relative permittivity and the unit were calculated. The specific resistance ( ⁇ , unit: ⁇ cm) was measured after applying 50 V DC to the capacitor sample at 25 ° C using an insulation resistance tester (R 834 OA manufactured by Advantest) for 60 seconds.
- R 834 OA insulation resistance tester
- the relative dielectric constant ⁇ is an important characteristic for producing a small-sized and high-dielectric-constant capacitor.
- the specific resistance ⁇ was set to 1 ⁇ 10 12 ⁇ cm or more.
- Each of these values of the relative permittivity ⁇ , the specific resistance ⁇ , and the dielectric loss ta ⁇ ⁇ was obtained from the average value of the values measured using 10 capacitor samples ⁇ .
- the addition of the first subcomponent as shown in each table is the number of moles of v 2 o 5 terms, the added amount of the second subcomponent is the number of moles of A 1 2 Os terms, third subcomponent ⁇ (4)
- the number of moles of the fourth subcomponent is a number of moles in terms of oxide, and each is a number of moles relative to 100 moles of the final composition of the main component.
- " ⁇ + ⁇ " means "mX 10 + n ".
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
- Inorganic Insulating Materials (AREA)
Description
Claims
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US10/545,586 US7265072B2 (en) | 2003-02-17 | 2004-02-17 | Dielectric ceramic composition and electronic device |
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JP2003038778A JP4403705B2 (ja) | 2003-02-17 | 2003-02-17 | 誘電体磁器組成物および電子部品 |
JP2003-038778 | 2003-02-17 |
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US (1) | US7265072B2 (ja) |
JP (1) | JP4403705B2 (ja) |
KR (1) | KR100673916B1 (ja) |
CN (1) | CN100371295C (ja) |
TW (1) | TWI233623B (ja) |
WO (1) | WO2004071992A1 (ja) |
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JP4572628B2 (ja) * | 2004-08-30 | 2010-11-04 | Tdk株式会社 | 誘電体磁器組成物及び電子部品 |
JP4513981B2 (ja) * | 2005-03-31 | 2010-07-28 | Tdk株式会社 | 積層セラミック電子部品及びその製造方法 |
JP4951896B2 (ja) * | 2005-08-23 | 2012-06-13 | Tdk株式会社 | 誘電体磁器組成物および電子部品 |
US8178456B2 (en) * | 2008-07-08 | 2012-05-15 | Ian Burn Consulting, Inc. | Sintered dielectric ceramic, composition for making, and use thereof in multilayer capacitor and energy storage device |
CN101607819B (zh) * | 2009-07-17 | 2012-01-25 | 苏州达方电子有限公司 | 介电陶瓷组合物及其所制成的积层陶瓷电容器 |
CN101607820B (zh) * | 2009-07-23 | 2012-05-09 | 苏州达方电子有限公司 | 陶瓷粉体组合物、陶瓷材料及其所制成的积层陶瓷电容器 |
CN101786866B (zh) * | 2009-12-22 | 2012-12-05 | 广东风华高新科技股份有限公司 | 一种抗还原性铜内电极高频低温烧结陶瓷介质材料 |
JP5158113B2 (ja) * | 2010-03-17 | 2013-03-06 | 株式会社村田製作所 | 誘電体磁器組成物及び温度補償用積層コンデンサ |
KR101761940B1 (ko) * | 2012-05-04 | 2017-07-26 | 삼성전기주식회사 | 적층형 전자 부품 및 이의 제조방법 |
KR102183423B1 (ko) * | 2014-12-08 | 2020-11-26 | 삼성전기주식회사 | 유전체 자기 조성물 및 이를 포함하는 적층 세라믹 커패시터 |
CN105174947B (zh) * | 2015-09-08 | 2020-03-06 | 山东国瓷功能材料股份有限公司 | 一种低温烧结薄介质多层陶瓷电容器用cog质陶瓷材料 |
JP2017098445A (ja) * | 2015-11-26 | 2017-06-01 | 太陽誘電株式会社 | セラミック電子部品及びセラミック電子部品の製造方法 |
CN109071355B (zh) * | 2016-03-24 | 2022-01-04 | Tdk株式会社 | 电介质组合物、电介质元件、电子部件及层叠电子部件 |
JP7176494B2 (ja) * | 2019-08-28 | 2022-11-22 | 株式会社村田製作所 | 積層型電子部品 |
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JP2000311828A (ja) * | 1999-02-26 | 2000-11-07 | Tdk Corp | 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法 |
JP2001294481A (ja) * | 2000-02-09 | 2001-10-23 | Matsushita Electric Ind Co Ltd | 誘電体磁器組成物とこれを用いた積層セラミックコンデンサ |
JP2002338343A (ja) * | 2001-05-17 | 2002-11-27 | Tdk Corp | 誘電体磁器組成物の製造方法および電子部品の製造方法 |
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JPS604032B2 (ja) | 1980-08-14 | 1985-02-01 | 株式会社昭和製作所 | 二輪車等のフロントフオ−ク |
JPS60131708A (ja) | 1983-12-19 | 1985-07-13 | 株式会社村田製作所 | 非還元性温度補償用誘電体磁器組成物 |
JPH0831284B2 (ja) | 1986-11-14 | 1996-03-27 | 株式会社村田製作所 | 非還元性温度補償用誘電体磁器組成物 |
JP2997236B2 (ja) | 1997-03-31 | 2000-01-11 | ティーディーケイ株式会社 | 非還元性誘電体磁器材料 |
JP3323801B2 (ja) | 1998-02-05 | 2002-09-09 | 太陽誘電株式会社 | 磁器コンデンサ |
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US6485672B1 (en) * | 1999-02-26 | 2002-11-26 | Tdk Corporation | Method of manufacturing dielectric ceramic composition and electronic device containing dielectric layer |
JP3520053B2 (ja) | 2000-02-09 | 2004-04-19 | Tdk株式会社 | 誘電体磁器組成物、電子部品および電子部品の製造方法 |
JP2001220229A (ja) | 2000-02-09 | 2001-08-14 | Tdk Corp | 誘電体磁器組成物、電子部品および電子部品の製造方法 |
TW492017B (en) | 2000-06-29 | 2002-06-21 | Tdk Corp | Dielectrics porcelain composition and electronic parts |
KR100444230B1 (ko) | 2001-12-27 | 2004-08-16 | 삼성전기주식회사 | 내환원성 유전체 자기 조성물 |
KR100444229B1 (ko) | 2001-12-27 | 2004-08-16 | 삼성전기주식회사 | 내환원성 유전체 자기 조성물 |
JP3908723B2 (ja) * | 2003-11-28 | 2007-04-25 | Tdk株式会社 | 誘電体磁器組成物の製造方法 |
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JP2000311828A (ja) * | 1999-02-26 | 2000-11-07 | Tdk Corp | 誘電体磁器組成物の製造方法と誘電体層含有電子部品の製造方法 |
JP2001294481A (ja) * | 2000-02-09 | 2001-10-23 | Matsushita Electric Ind Co Ltd | 誘電体磁器組成物とこれを用いた積層セラミックコンデンサ |
JP2002338343A (ja) * | 2001-05-17 | 2002-11-27 | Tdk Corp | 誘電体磁器組成物の製造方法および電子部品の製造方法 |
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KR100673916B1 (ko) | 2007-01-25 |
JP4403705B2 (ja) | 2010-01-27 |
TW200503014A (en) | 2005-01-16 |
US7265072B2 (en) | 2007-09-04 |
KR20050106439A (ko) | 2005-11-09 |
CN100371295C (zh) | 2008-02-27 |
US20060234854A1 (en) | 2006-10-19 |
TWI233623B (en) | 2005-06-01 |
JP2004262680A (ja) | 2004-09-24 |
CN1774406A (zh) | 2006-05-17 |
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