WO2004031251A1 - 光導波路形成用感光性樹脂組成物および光導波路 - Google Patents
光導波路形成用感光性樹脂組成物および光導波路 Download PDFInfo
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- WO2004031251A1 WO2004031251A1 PCT/JP2003/012479 JP0312479W WO2004031251A1 WO 2004031251 A1 WO2004031251 A1 WO 2004031251A1 JP 0312479 W JP0312479 W JP 0312479W WO 2004031251 A1 WO2004031251 A1 WO 2004031251A1
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- optical waveguide
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/20—Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12069—Organic material
Definitions
- the present invention relates to a photosensitive resin composition for forming an optical waveguide for producing an optical circuit used in the field of optical communication and optical information processing, and an optical waveguide produced using the composition.
- optical waveguides are, for example, optical devices, optical integrated circuits (OEICs), and optical integrated circuits (OEICs) for realizing large-capacity information transmission such as movies and moving images and optical computers. IC) etc.
- OEICs optical integrated circuits
- OEICs optical integrated circuits
- a silica-based optical waveguide and a polymer-based optical waveguide are known as the optical waveguide.
- quartz-based optical waveguides have the advantage of low transmission loss, but have processing problems such as high processing temperature in the manufacturing process and difficulty in manufacturing large-area optical waveguides.
- polymer optical waveguides have advantages such as ease of processing and wide material design. Because of their advantages, those using polymer materials such as polymethyl methacrylate-polycarbonate have been studied. However, polymer-based optical waveguides generally have a problem of poor heat resistance. Therefore, recently, fluorinated polyimides having excellent heat resistance and transmission loss have been actively studied.
- the material of the conventional polymer optical waveguide has a relatively large waveguide loss in the wavelength range of 600 to 160 nm used in optical communication and the like, or has a low heat resistance.
- problems such as low cost, and none could satisfy all the characteristics required for optical waveguides.
- the present invention has been made in view of the above circumstances, and has a resin composition for an optical waveguide having excellent physical properties such as waveguide loss, refractive index, and heat resistance, and the composition. It is an object of the present invention to provide an optical waveguide made of a cured product of the above.
- the present inventors have conducted intensive studies in order to solve the above-mentioned problems, and as a result, have found that a photosensitive resin composition containing two different (meth) acrylates having an aromatic ring and a photoradical polymerization initiator as constituents is provided. They have found that they are extremely suitable as a resin for forming an optical waveguide, and have completed the present invention.
- R 1 is one (O CH 2 CH 2 ) m —, one (OCH (CH 3 ) CH 2 ) m one, or one O CH 2 CH (OH) CH 2 —;
- X is one C (CH 3 ) 2 _, one CH 2 _, one _, or one S ⁇ 2 —;
- Y represents a hydrogen atom or a halogen atom;
- m represents an integer of 0 to 4),
- R 2 is one (O CH 2 CH 2 ) p —, one (O CH (CH 3 ) CH 2 ) p —, or one CH 2 CH (OH) CH 2- ;
- Y is a hydrogen atom, A halogen atom, P h -C (CH 3 ) 2 —, P h — or an alkyl group having 1 to 20 carbon atoms;
- p Represents an integer of 0 to 4.
- Ph represents a phenyl group.
- the thus formed photosensitive resin composition for forming an optical waveguide has excellent buttering properties at the time of curing, and has a high refractive index, high heat resistance, and excellent transmission characteristics when an optical waveguide is formed. Since it has physical properties such as waveguide loss, it can be suitably used as a material for forming a core layer or the like of an optical waveguide.
- the resin composition of the present invention can be configured so that, for example, the weight ratio (A / B) of the component (A) to the component (B) is 0.3 to 5.0. By setting the weight ratio within this numerical range, physical properties such as heat resistance can be further improved.
- the resin composition of the present invention can be configured such that the weight ratio of the total amount of the component (A) and the component (B) in the composition is 30% by weight or more.
- the physical properties such as the refractive index and the loss of the waveguide can be further improved.
- the resin composition of the present invention may contain a (meth) acrylate having three or more (meth) atalyloyl groups in the molecule.
- the resin composition of the present invention may have a form of a cured body having a refractive index of 1.554 or more at 25 ° C. and 824 nm.
- the resin composition of the present invention may have a form of a cured product having a glass transition temperature (T g) of 80 ° C. or higher.
- the present invention provides a core layer, and a cladding layer formed by laminating the core layer.
- An optical waveguide comprising: a cured product of the core layer and the Z layer or the cured resin composition.
- the optical waveguide thus configured has high refractive index, high heat resistance, excellent patterning properties, and low waveguide loss and other physical properties.
- the present invention provides a method for producing an optical waveguide, which comprises a step of irradiating the resin composition with radiation through a photomask and curing the resin composition.
- the resin composition of the present invention contains the following components (A) to (C) as constituent components.
- the resin composition of the present invention includes a liquid form before curing containing components (A) to (C) and a liquid composition containing components (A) to (C). Has the concept of including both cured forms.
- the component (A) constituting the resin composition of the present invention is a di (meth) acrylate which has a structure represented by the following formula (1).
- R 1 is one (O CH 2 CH 2 ) m —, — (OCH (CH 3 ) CH 2 ) one or one O CH 2 CH (OH) CH 2 —;
- X is one C (CH 3 ) 2 -, - CH 2 - , one O-, or a S 0 2 -;
- Y is a hydrogen atom or a halogen atom and m is an integer of 0-4).
- examples of the halogen atom represented by Y include chlorine, bromine, iodine, fluorine and the like. Among them, bromine is preferred.
- component (A) examples include, for example, ethylene oxide-added bisphenol A (meth) acrylate, ethylene oxide-added tetrabromobisphenol A (meth) acrylate, bis-propylene oxide Epoxy ring-opening reaction of phenol A (meth) acrylic acid ester and propylene oxide with tetrabromobisphenol A (meth) acrylic acid ester, bisphenol A diglycidyl ether and (meth) acrylic acid Bisphenol A epoxy (meth) acrylate obtained, tetrabromobisphenol A epoxy (meth) acrylate obtained by epoxy ring-opening reaction of tetrabromobisphenol A diglycidyl ether with (meth) acrylic acid Rate, bisphenol F diglycidyl ether and (meth) Bisphenol F epoxy (meth) ac Vrate obtained by epoxy ring-opening reaction with atalylic acid, obtained by epoxy ring-opening reaction of tetrabromobisphenol F digly
- Bisphenol A epoxy (meth) acrylate, tetrabromobisphenol A epoxy (meth) acrylate, etc. obtained by the epoxy ring-opening reaction of the above are particularly preferably used.
- A Commercially available components (A) include, for example, Viscoat # 700, # 540 (all manufactured by Osaka Organic Chemical Industry Co., Ltd.), Aronix M-208, M-210 (all manufactured by Toagosei Co., Ltd.) ), NK ester BPE-100, BPE-200, BP E-500, AB PE-4 (all manufactured by Shin-Nakamura Chemical Co., Ltd.) BP-4EA, BP-4PA, Epoxyester 300 M, 302 A, 300 M, 300 A (Kyoeisha Chemical Co., Ltd.), KA YARAD R-551, R-712 (all from Nippon Kayaku Co., Ltd.), BPE-4, BPE-10, BR-42M (all from Dai-ichi Kogyo Pharmaceutical Co., Ltd.), Lipo XY VR_77, VR_60, VR-90, SP-150, SP-150, SP-150, SP-156 (or more) And Neopol V779, Neopol V779,
- the component (B) constituting the resin composition of the present invention is a (meth) acrylate having a structure represented by the following formula (2).
- R 2 is one (O CH 2 CH 2 ) p —, one (O CH (CH 3 ) CH 2 ) p one, or one O CH 2 CH (OH) CH 2- ;
- Y is a hydrogen atom, A halogen atom, Ph—C (CH 3 ) 2—, Ph—, or an alkyl group having 1 to 20 carbon atoms, and p represents an integer of 0 to 4. However, Ph represents a phenyl group. Represents.),
- examples of the halogen atom represented by Y include chlorine, bromine, iodine, fluorine and the like. Among them, bromine is preferred.
- component (B) examples include, for example, phenoxyshetyl (meth) acrylate, phenoxy_2-methylethyl (meth) atalylate, phenoxhetoxime (meta) acrylate, and 3— Phenoxy_2-hydroxypropyl (meth) atalylate, 2-phenylphenoxyshetyl (meta) acrylate, 4_phenylphenoxyshetyl (meta) acrylate, 2-hydroxy-1--3-phenoxypropyl (meth) acrylate, p-cumylphenol ethylene oxide-modified (meth) acrylate, 2-bromophenoxethyl (meta) acrylate, 4-promophenoxy Cyl (meta) acrylate, 2,4-dibromophenoxicetyl (meth) atalylate, 2,6-dibromophenoxicetyl (meth) acrylate, 2,4, 6-tribromo Phenoxyshetyl (
- B Commercially available components include, for example, Aronix Ml13, Ml10, M101, M102, M570, TO- 1317 (or more, Toagosei) Co., Ltd.), VISCOAT # 192, # 193, # 220, 3BM (all manufactured by Osaka Organic Chemical Industry Co., Ltd.), NK ester AMP—10G, AMP-20 G (manufactured by Shin-Nakamura Chemical Co., Ltd.), Light Atarilate PO-A, P-200 A, Epoxyester M-600 A (manufactured by Kyoeisha Chemical Co., Ltd.), PHE, CEA, PHE_2, BR-30, BR-31, BR-31M, BR-32 (all manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.) and the like.
- the weight ratio of the total amount of component (A) and component (B) in the resin composition of the present invention is preferably 30% by weight or more, more preferably 40% by weight / 0 or more, and particularly preferably. Is 50% by weight or more.
- the weight ratio is 30% by weight or more, a higher refractive index and lower waveguide loss can be obtained when the resin composition of the present invention is used for a core portion of an optical waveguide.
- the weight ratio (A / B) of the component (A) to the component (B) is preferably from 0.3 to 5.0, more preferably from 0.4 to 4.0.
- the weight ratio is preferably from 0.3 to 5.0, more preferably from 0.4 to 4.0.
- the component (A) and the component (B) are preferably atarilate rather than metaatalilate. .
- the component (C) constituting the resin composition of the present invention is a photoradical polymerization initiator.
- Specific examples of the component (C) include, for example, acetophenone, acetophenone benzyl ketanol, 1-hydroxycyclohexylphenyl ketone, 2-penzinole 2-dimethinoreamino 1- (4-mo 1,2,2-Dimethoxy-2-pheninolease tophenone, xanthon, fluorenone, benzaldehyde, phnoolelen, anthraquinone, triphenylenoleamine, canolebazole, 3-methiglenacetophenone Black mouth benzophenone, 4,4'-dimethoxybenzophenone, 4,4'-diaminobenzophenone, michelaketone, benzoinpropinolate ether, benzoinethynoleether, penzinoresmethinole ketanore, 1-(4 isoprop
- C Commercially available components include, for example, Irgacure 184 and 36 9, 651, 550, 819, 907, 784, 295, CGI 179, CGI 175, CG I 185, CG 24— 6 1, Darocurlll 6, 1 1 7 3 (More than, Chipa Specialty 'Chemicals, Inc.), Lucirin LR 872 8 (from BASF), Ubecryl P 36 (from UCB) And the like.
- component (C) one type may be used alone, or two or more types may be used in combination for the purpose of improving the pattern Eisen property and the like.
- the weight ratio of the component (C) in the resin composition of the present invention is usually from 0.01 to 10% by weight, preferably from 0.1 to 7% by weight.
- the weight ratio is usually from 0.01 to 10% by weight, preferably from 0.1 to 7% by weight.
- a compound containing a (meth) atalyloyl group or a butyl group (hereinafter also referred to as an “unsaturated monomer”).
- component (A) and the same compound as component (B) are excluded).
- (meth) acrylates having three or more (meth) atalyl groups are preferably used.
- Examples of the (meth) acrylate having three or more (meth) acryloyl groups include (meth) acrylates of polyhydric alcohols having 3 or more valences.
- Specific examples of the (meth) acrylate include, for example, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, trimethylolpropane trioxethyl (meth) acrylate, Tris (2-Attached mouth) isocyanurate, pentaerythritol polyatalylate and the like. These can be used alone or in combination of two or more.
- (meth) acrylate having three or more (meth) atalyloyl groups include, for example, Aronix M305, M309, M310, and M315. , M320, M350, M360, M408 (or more, manufactured by Toagosei Co., Ltd., Viscote # 295, # 300, # 360, GPT, 3PA, # 400 (manufactured by Osaka Organic Chemical Industry Co., Ltd.), NK ester TMP T, A-TM ⁇ ⁇ , ⁇ — ⁇ — 3, A— TMM— 3 L, ⁇ — ⁇ (above, Shin-Nakamura Chemical (Manufactured by Kyoeisha Chemical Co., Ltd.) ⁇ ⁇ AYARAD PET (manufactured by Kyoeisha Chemical Co., Ltd.) — 30, GPO—303, TMP TA, TPA—320, DP HA, D—310, DP CA—20, DP CA—60 (all manufactured by
- unsaturated monomers include, for example, vinyl monomers such as N-vinylpyrrolidone, N-vinylcaprolatatam, vurymidazole, and vulpyridine; isoborninole (meta) acrylate, borneol (Meth) acrylate, tricyclodecanyl (meth) atalylate, dicyclopentanyl (meth) atalylate, dicyclopentenyl (meth) atalylate, cyclin hexinole (meta) acrylate, benzinole (Meth) acrylate, 4-butylcyclohexyl (meth) atalylate, atalyloylmorpholine, 2-hydroxyshethyl (meth) atalylate, 2-hydroxypropyl (meth) atalylate, 2-Hydroxybutyl (meth) acrylate, methyl (meth) acrylate , Ethyl (meta) acrylate,
- R 3 is a hydrogen atom or a methyl group
- R 4 is an alkylene group having 2 to 8 carbon atoms; s is an integer of 1 to 8)
- R 5 and R 7 are each independently a hydrogen atom or a methyl group; R 6 is an alkylene group having 2 to 8 carbon atoms; and t is an integer of 1 to 8.
- the unsaturated monomer having two (meth) atalyloyl groups or two vinyl groups in a molecule include, for example, 1,4-butanediol diatalylate, 1,61-hexanediolone Alkynolediol diacrylates such as resin acrylate, 1,9-nonanediol diacrylate, ethylene glycol di (meth) acrylate, tetraethylene glycol diacrylate, Polyalkylene glycol diacrylate such as tripropylene glycol diacrylate, neopentyl alcohol glycol (meth) acrylate, and tricyclopentane decane methanol diacrylate.
- 1,4-butanediol diatalylate 1,61-hexanediolone
- Alkynolediol diacrylates such as resin acrylate, 1,9-nonanediol diacrylate, ethylene glycol di (meth) acrylate, tetra
- the resin composition of the present invention may further contain oligomers or polymers such as polyurethane (meth) acrylate, polyester (meth) acrylate, and polyepoxy (meth) acrylate.
- the resin composition of the present invention may further contain a photosensitizer.
- the photosensitizer include, for example, triethylamine, getylamine, N-methinoresiethananolamine, ethanolenoamine, 4-dimethinorea aminobenzoic acid, methyl 4-dimethylaminobenzoate, and 4-dimethylaminobenzoic acid. And ethyl dimethylaminobenzoate.
- Specific examples of commercially available photosensitizers include, for example, Ubecryl P102, 103, 104, and 105 (all manufactured by UCB).
- additives other than the above-mentioned components include, for example, antioxidants, ultraviolet absorbers, light stabilizers, silane coupling agents, coating surface improvers, thermal polymerization inhibitors, leveling agents, and interface agents.
- Activators, colorants, storage stabilizers, plasticizers, lubricants, solvents, fillers, antioxidants, wetting improvers, mold release agents, etc. can be added as necessary.
- antioxidants include, for example, Irgano X1010, 1035, 10776, and 1222 (above, Ciba ⁇ Specialty ⁇ Chemicals Co., Ltd.) And Antigen P, 3C, FR, GA-80 (manufactured by Sumitomo Chemical Co., Ltd.).
- UV absorbers include, for example, Tinuvin P, 234, 32, 32, 32, 32, 32, 32, 29, 13 (or more, Ciba's Specialty Chemicals Co., Ltd.), Seesorbl 02, 103, 1 10, 501, 202, 712, 704 (all manufactured by Cipro Kasei Co., Ltd.) and the like.
- Light stabilizers include, for example, Tinu Vin 292, 144, 622 LD (above, Ciba ⁇ Specialty ⁇ Chemicals, Inc.), Sanoh Nore LS770 (Sankyo Corporation) )), And Sumisorb TM-061 (manufactured by Sumitomo Chemical Co., Ltd.).
- silane coupling agent examples include ⁇ -aminopropyltriethoxysilane, ⁇ -mercaptoprovirtrimethoxysilane, y-methacryloxypropyltrimethoxysilane, and the like.
- Commercially available products include SH6602, 6003 (all manufactured by Toray Dow Koeng Silicone Co., Ltd.), BE903, 603, 400 (all Shin-Etsu Chemical) Industrial Co., Ltd.).
- Examples of the coating surface improver include silicone additives such as dimethylsiloxane polyether.
- silicone additives such as dimethylsiloxane polyether.
- Commercially available products are DC-57, DC-190 (both manufactured by Dow Corning), SH-28PA, SH-29PA, SH-30PA, SH- 190 (Toray 'Dow Kojung' Silicone Co., Ltd.), KF351, KF352, KF355, KF354 (Shin-Etsu Chemical Co., Ltd.) , L-700, L-700, L-750, FK-024-90 (all manufactured by Nippon Tunicer Co., Ltd.) and the like.
- release agents include Plysurf A208F (manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.).
- the resin composition of the present invention can be produced by mixing the above-mentioned components by a conventional method.
- the viscosity of the resin composition of the present invention thus prepared is usually from 100 to 200,000 cp / 25 ° C., preferably from 300 to 100,000 c. p / 25 ° C, more preferably 400 to 5,000 cp / 25 ° C. If the viscosity is too high, application unevenness or undulation may occur when the resin composition is applied to the substrate, or when the core layer is formed, the patterning property deteriorates and the desired shape cannot be obtained. Conversely, if the viscosity is too low, it is difficult to obtain the target film thickness, and the puttering property may deteriorate.
- the cured product of the resin composition of the present invention obtained by curing with radiation preferably has the following physical properties.
- the cured product of the resin composition of the present invention When used as a core layer of an optical waveguide, it preferably has a refractive index of 1.54 or more at 25 ° C. and a wavelength of 824 nm. It is more preferably 1.55 or more. If the refractive index is less than 1.54, good transmission loss may not be obtained when a waveguide is formed using the resin composition of the present invention for the core layer.
- the cured product of the resin composition of the present invention preferably has a glass transition temperature of 80 ° C or higher, more preferably 90 ° C or higher. If the temperature is lower than 80 ° C, the heat resistance of the optical waveguide may not be sufficiently secured.
- the “glass transition temperature” is defined as a temperature at which a loss tangent at a vibration frequency of 10 Hz is a maximum value in a resonance type dynamic viscoelasticity measuring apparatus.
- the refractive index at 824 nm was measured by the following method. First, a resin composition layer is formed by applying a liquid curable composition to a thickness of 4 ⁇ m on a 4-inch silicon wafer substrate while adjusting the rotation speed and time using a spin coater. After that, under a nitrogen atmosphere, ultraviolet rays of 1.0 JZ cm 2 were irradiated to the resin composition layer from a mask liner to obtain a cured film. Next, the refractive index (824 ⁇ m, 25 ° C) of this cured film was measured using a prism coupler manufactured by Nippon Metricon.
- the resin composition While adjusting the rotation speed and time using a spin coater, the resin composition is applied to a thickness of 50 ⁇ m on a 4-inch silicon wafer substrate to form a resin composition layer. Under the atmosphere, an ultraviolet ray of 1. O j Z cm 2 was irradiated from the mask aligner to the resin composition layer through a photomask having a 50 ⁇ m width and a straight line shape without branching. Next, the resin composition layer was developed for 3 minutes using acetone, and then the substrate was heated in an oven set at 70 ° C. for 10 minutes.
- the substrate was heated for 10 minutes in an oven set at 70 ° C. Further, ELC 2500 (Clear) was applied again on the substrate so as to have a thickness of 50 ⁇ m, and then the substrate was irradiated with ultraviolet rays to obtain a channel waveguide.
- ELC 2500 (Clear) was applied again on the substrate so as to have a thickness of 50 ⁇ m, and then the substrate was irradiated with ultraviolet rays to obtain a channel waveguide.
- Table 1 shows the obtained results.
- the components in Table 1 are as follows.
- Neopol V7779 (manufactured by Nippon Upika Co., Ltd.)
- V 779 MA Neopole V 779 MA (manufactured by Nippon Upika Co., Ltd.) (Compound name: Tetrabromobisphenol A epoxy methacrylate)
- BR—31 New Frontier BR—31 (Daiichi Kogyo Seiyaku Co., Ltd.)
- Irgacure369 (Ciba's Specialty-Chemicals)
- I RG 907 Irgac ure 907 (Ciba Specialty 'Chemicals)
- the resin compositions of the present invention (Examples 1 to 7) have excellent patterning properties when forming a cured product, and have excellent refractive index, heat resistance, and transmission properties when forming an optical waveguide. (Low waveguide loss).
- Comparative Example 1 does not contain the component (A), and thus has poor heat resistance.
- Comparative Example 2 since the component (B) was not included, the patterning property was poor.
- Comparative Example 3 since the component (A) and the component (B) were not included, the patterning property and the transmission property were inferior.
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003266706A AU2003266706A1 (en) | 2002-10-07 | 2003-09-30 | Photosensitive resin composition for optical waveguide formation and optical waveguide |
DE60314897T DE60314897T2 (de) | 2002-10-07 | 2003-09-30 | Lichtempfindliche harzzusammensetzung für die lichtwellenleiterherstellung und lichtwellenleiter |
EP03799178A EP1553114B1 (en) | 2002-10-07 | 2003-09-30 | Photosensitive resin composition for optical waveguide formation and optical waveguide |
CA002498188A CA2498188A1 (en) | 2002-10-07 | 2003-09-30 | Photosensitive resin composition for optical waveguide formation and optical waveguide |
US10/527,547 US7376328B2 (en) | 2002-10-07 | 2003-09-30 | Photosensitive resin composition for optical waveguide formation and optical waveguide |
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JP2002-294148 | 2002-10-07 | ||
JP2002294148 | 2002-10-07 | ||
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JP2003007477 | 2003-01-15 | ||
JP2003-67039 | 2003-03-12 | ||
JP2003067039 | 2003-03-12 | ||
JP2003-175696 | 2003-06-20 | ||
JP2003175696A JP4222120B2 (ja) | 2002-10-07 | 2003-06-20 | 光導波路形成用感光性樹脂組成物および光導波路 |
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US (1) | US7376328B2 (ja) |
EP (1) | EP1553114B1 (ja) |
JP (1) | JP4222120B2 (ja) |
KR (1) | KR20050062595A (ja) |
CN (1) | CN1300199C (ja) |
AU (1) | AU2003266706A1 (ja) |
CA (1) | CA2498188A1 (ja) |
DE (1) | DE60314897T2 (ja) |
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JP2004175866A (ja) * | 2002-11-26 | 2004-06-24 | Nippon Kayaku Co Ltd | 光ディスク用接着剤組成物、硬化物および物品 |
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- 2003-09-30 KR KR1020057005902A patent/KR20050062595A/ko not_active Application Discontinuation
- 2003-09-30 CA CA002498188A patent/CA2498188A1/en not_active Abandoned
- 2003-09-30 DE DE60314897T patent/DE60314897T2/de not_active Expired - Lifetime
- 2003-09-30 CN CNB038088894A patent/CN1300199C/zh not_active Expired - Fee Related
- 2003-09-30 AU AU2003266706A patent/AU2003266706A1/en not_active Abandoned
- 2003-09-30 US US10/527,547 patent/US7376328B2/en not_active Expired - Fee Related
- 2003-09-30 WO PCT/JP2003/012479 patent/WO2004031251A1/ja active IP Right Grant
- 2003-09-30 EP EP03799178A patent/EP1553114B1/en not_active Expired - Fee Related
- 2003-10-06 TW TW092127694A patent/TW200422308A/zh unknown
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Also Published As
Publication number | Publication date |
---|---|
KR20050062595A (ko) | 2005-06-23 |
TW200422308A (en) | 2004-11-01 |
EP1553114B1 (en) | 2007-07-11 |
CA2498188A1 (en) | 2004-04-15 |
JP4222120B2 (ja) | 2009-02-12 |
EP1553114A1 (en) | 2005-07-13 |
US20060008222A1 (en) | 2006-01-12 |
CN1300199C (zh) | 2007-02-14 |
DE60314897D1 (de) | 2007-08-23 |
DE60314897T2 (de) | 2008-03-13 |
JP2004334152A (ja) | 2004-11-25 |
CN1646586A (zh) | 2005-07-27 |
US7376328B2 (en) | 2008-05-20 |
AU2003266706A1 (en) | 2004-04-23 |
EP1553114A4 (en) | 2005-10-12 |
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