WO2003100848A1 - Dispositif et procede de traitement de substrats - Google Patents

Dispositif et procede de traitement de substrats Download PDF

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Publication number
WO2003100848A1
WO2003100848A1 PCT/JP2003/006454 JP0306454W WO03100848A1 WO 2003100848 A1 WO2003100848 A1 WO 2003100848A1 JP 0306454 W JP0306454 W JP 0306454W WO 03100848 A1 WO03100848 A1 WO 03100848A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
carrier
chamber
substrate processing
holding
Prior art date
Application number
PCT/JP2003/006454
Other languages
English (en)
Japanese (ja)
Inventor
Hitoshi Nakagawara
Seiichi Igawa
Yoshifumi Unehara
Original Assignee
Anelva Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corporation filed Critical Anelva Corporation
Priority to KR1020047014556A priority Critical patent/KR100951337B1/ko
Priority to JP2004508403A priority patent/JP4369866B2/ja
Priority to AU2003242422A priority patent/AU2003242422A1/en
Publication of WO2003100848A1 publication Critical patent/WO2003100848A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

L'invention concerne un dispositif et un procédé de traitement de substrats à usages multiples conçus pour supprimer, au moyen de transporteurs, la contamination de l'atmosphère dans une chambre de traitement, pour assurer de manière continue un transport stable et un traitement de substrat de haute qualité et pour maîtriser des substrats d'augmentation et différents dimensions de substrats. Ce dispositif comprend une chambre de verrouillage de charge dans laquelle sont chargés les transporteurs qui transportent le substrat, une chambre de transfert de substrat comportant un mécanisme de transfert qui permet de transférer le substrat entre les transporteurs, enfin une chambre de traitement de substrat qui permet d'appliquer un traitement spécifique au substrat. Ce dispositif est caractérisé en ce que le premier transporteur se déplace entre la chambre de verrouillage de charge et la chambre de transfert de substrat, le second transporteur se déplace entre la chambre de transfert de substrat et la chambre de traitement de substrat et le substrat est transféré entre le premier transporteur et le second transporteur par le mécanisme de transfert.
PCT/JP2003/006454 2002-05-23 2003-05-23 Dispositif et procede de traitement de substrats WO2003100848A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020047014556A KR100951337B1 (ko) 2002-05-23 2003-05-23 기판처리장치 및 처리방법
JP2004508403A JP4369866B2 (ja) 2002-05-23 2003-05-23 基板処理装置及び処理方法
AU2003242422A AU2003242422A1 (en) 2002-05-23 2003-05-23 Substrate processing device and substrate processing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002148690 2002-05-23
JP2002-148690 2002-05-23

Publications (1)

Publication Number Publication Date
WO2003100848A1 true WO2003100848A1 (fr) 2003-12-04

Family

ID=29561191

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/006454 WO2003100848A1 (fr) 2002-05-23 2003-05-23 Dispositif et procede de traitement de substrats

Country Status (6)

Country Link
JP (1) JP4369866B2 (fr)
KR (1) KR100951337B1 (fr)
CN (1) CN1293621C (fr)
AU (1) AU2003242422A1 (fr)
TW (1) TWI232242B (fr)
WO (1) WO2003100848A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006096498A (ja) * 2004-09-29 2006-04-13 Shimadzu Corp 基板搬送装置およびこれを備える真空処理装置
WO2009130790A1 (fr) * 2008-04-25 2009-10-29 キヤノンアネルバ株式会社 Appareil de formation de film aligné de type à transfert de plateau
JP4535408B1 (ja) * 2010-05-10 2010-09-01 智雄 松下 基板搬送機構および基板搬送方法
WO2013118003A1 (fr) * 2012-02-06 2013-08-15 Roth & Rau Ag Installation de traitement de substrat
JP2020502778A (ja) * 2016-12-14 2020-01-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積システム

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1970828B (zh) * 2005-11-26 2010-05-26 鸿富锦精密工业（深圳）有限公司 在模具上形成多层镀膜的方法
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
KR101359401B1 (ko) * 2007-06-21 2014-02-10 주성엔지니어링(주) 고효율 박막 태양전지와 그 제조방법 및 제조장치
US8465592B2 (en) 2008-08-25 2013-06-18 Tokyo Electron Limited Film deposition apparatus
US20090324826A1 (en) * 2008-06-27 2009-12-31 Hitoshi Kato Film Deposition Apparatus, Film Deposition Method, and Computer Readable Storage Medium
US8465591B2 (en) 2008-06-27 2013-06-18 Tokyo Electron Limited Film deposition apparatus
TWI424784B (zh) * 2008-09-04 2014-01-21 Hitachi High Tech Corp Organic electroluminescent device manufacturing apparatus, manufacturing method thereof, film forming apparatus and film forming method
TWI436831B (zh) 2009-12-10 2014-05-11 Orbotech Lt Solar Llc 真空處理裝置之噴灑頭總成
LU91685B1 (de) 2010-05-07 2011-11-08 Cppe Carbon Process & Plant Engineering S A Verfahren zur katalytischen Entfernung von Kohlendioxyd und Schwefeldioxid aus Abgasen
TWI451521B (zh) * 2010-06-21 2014-09-01 Semes Co Ltd 基板處理設備及基板處理方法
WO2012157231A1 (fr) * 2011-05-13 2012-11-22 株式会社ニコン Dispositif de remplacement de substrat
JP5741834B2 (ja) * 2011-05-13 2015-07-01 株式会社ニコン 物体の搬出方法、物体の交換方法、物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
KR20160062065A (ko) * 2013-09-20 2016-06-01 어플라이드 머티어리얼스, 인코포레이티드 통합된 정전 척을 갖는 기판 캐리어
JP6088964B2 (ja) * 2013-12-13 2017-03-01 株式会社東芝 半導体製造装置
JP6640759B2 (ja) * 2017-01-11 2020-02-05 株式会社アルバック 真空処理装置
CN108588667B (zh) 2017-12-27 2020-10-02 深圳市华星光电技术有限公司 一种真空大气转换腔的充气装置及充气方法、真空溅射设备
CN108396294B (zh) * 2018-01-26 2021-12-10 中国科学院物理研究所 一种薄膜沉积系统及控制方法
KR20210071334A (ko) * 2019-12-06 2021-06-16 주식회사 아바코 스퍼터링 시스템
JP2022155711A (ja) * 2021-03-31 2022-10-14 芝浦メカトロニクス株式会社 成膜装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283288A (ja) * 1994-04-07 1995-10-27 Tokyo Electron Ltd 処理装置
US5788448A (en) * 1994-12-08 1998-08-04 Tokyo Electron Limited Processing apparatus
JPH11131232A (ja) * 1997-10-31 1999-05-18 Anelva Corp トレイ搬送式成膜装置
JP2002222846A (ja) * 2001-01-26 2002-08-09 Shin Meiwa Ind Co Ltd 真空搬送装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283288A (ja) * 1994-04-07 1995-10-27 Tokyo Electron Ltd 処理装置
US5788448A (en) * 1994-12-08 1998-08-04 Tokyo Electron Limited Processing apparatus
JPH11131232A (ja) * 1997-10-31 1999-05-18 Anelva Corp トレイ搬送式成膜装置
JP2002222846A (ja) * 2001-01-26 2002-08-09 Shin Meiwa Ind Co Ltd 真空搬送装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006096498A (ja) * 2004-09-29 2006-04-13 Shimadzu Corp 基板搬送装置およびこれを備える真空処理装置
JP4581602B2 (ja) * 2004-09-29 2010-11-17 株式会社島津製作所 真空処理装置
WO2009130790A1 (fr) * 2008-04-25 2009-10-29 キヤノンアネルバ株式会社 Appareil de formation de film aligné de type à transfert de plateau
JP4535408B1 (ja) * 2010-05-10 2010-09-01 智雄 松下 基板搬送機構および基板搬送方法
JP2010258460A (ja) * 2010-05-10 2010-11-11 Tomoo Matsushita 基板搬送機構および基板搬送方法
WO2013118003A1 (fr) * 2012-02-06 2013-08-15 Roth & Rau Ag Installation de traitement de substrat
JP2015512152A (ja) * 2012-02-06 2015-04-23 ロート ウント ラウ アーゲー 基板処理装置
US10199250B2 (en) 2012-02-06 2019-02-05 Meyer Burger (Germany) Gmbh Substrate processing device
EP3916764A1 (fr) * 2012-02-06 2021-12-01 Meyer Burger (Germany) GmbH Installation de traitement de substrat
JP2020502778A (ja) * 2016-12-14 2020-01-23 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 堆積システム

Also Published As

Publication number Publication date
KR100951337B1 (ko) 2010-04-08
KR20050002862A (ko) 2005-01-10
TWI232242B (en) 2005-05-11
CN1650416A (zh) 2005-08-03
TW200403351A (en) 2004-03-01
JP4369866B2 (ja) 2009-11-25
CN1293621C (zh) 2007-01-03
JPWO2003100848A1 (ja) 2005-09-29
AU2003242422A1 (en) 2003-12-12

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