WO2010013333A1 - Dispositif sous vide et procédé de traitement sous vide - Google Patents

Dispositif sous vide et procédé de traitement sous vide Download PDF

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Publication number
WO2010013333A1
WO2010013333A1 PCT/JP2008/063730 JP2008063730W WO2010013333A1 WO 2010013333 A1 WO2010013333 A1 WO 2010013333A1 JP 2008063730 W JP2008063730 W JP 2008063730W WO 2010013333 A1 WO2010013333 A1 WO 2010013333A1
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WIPO (PCT)
Prior art keywords
chamber
tray
workpiece
processing chamber
load
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Application number
PCT/JP2008/063730
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English (en)
Japanese (ja)
Inventor
澄人 坂口
芳夫 高見
英樹 岡本
大 北原
Original Assignee
株式会社島津製作所
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Priority to PCT/JP2008/063730 priority Critical patent/WO2010013333A1/fr
Publication of WO2010013333A1 publication Critical patent/WO2010013333A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Definitions

  • the present invention relates to a vacuum apparatus and a vacuum processing method used for thin film formation such as vapor deposition, sputtering, chemical vapor deposition (CVD), etc., or thin film processing such as etching.
  • Vacuum devices used for semiconductor, insulator, metal thin film formation and thin film processing are configured in an appropriate form in accordance with necessary characteristics. For example, as a typical form, “batch type” shown in FIG. 1A, “inline type” shown in FIG. 1B, “cluster” shown in FIG. 1C and FIG. Type "vacuum device (for example, see Patent Documents 1 and 2).
  • the processing time may be long.
  • the “in-line type” vacuum apparatus as shown in FIG. 1B is intermittently loaded because new workpieces are loaded and unloaded after the processing in each chamber is completed.
  • a waiting time until the processing in each room is completed occurs, the processing time becomes long, and the production efficiency may deteriorate.
  • a transport mechanism for individually transporting between the chambers is also required.
  • an object of the present invention is to provide a vacuum apparatus and a vacuum processing method that can simultaneously transfer workpieces to a plurality of chambers and have high production efficiency with a simple configuration.
  • an aspect of the present invention includes: (a) a chamber capable of being evacuated; (b) a processing chamber provided in a part above the chamber; A load chamber that is provided in another part of the upper side, and (d) is disposed inside the chamber, faces the processing chamber and the loading chamber, and conveys the workpiece below the processing chamber or the loading chamber. And (e) a first tray that moves up and down between the load chamber and the transfer mechanism to transfer workpieces between the load chamber and the transfer mechanism, and partitions the load chamber so that it can be evacuated.
  • the vacuum apparatus includes a second tray that moves up and down between the processing chamber and the transport mechanism and transports the workpiece between the processing chamber and the transport mechanism.
  • a chamber capable of being evacuated (b) a first processing chamber provided in a part above the chamber and processing a workpiece, and (c) a first processing chamber above the chamber.
  • a load chamber for loading and unloading the workpiece (d) a second processing chamber for processing the workpiece, facing the processing chamber across the load chamber above the chamber, and (e) disposed inside the chamber, A transport mechanism that simultaneously faces at least two chambers, the first processing chamber, the second processing chamber, and the load chamber;
  • the first tray that partitions the load chamber so that it can be evacuated, and (g) the workpiece is transported between the first processing chamber and the transport mechanism by moving up and down between the first processing chamber and the transport mechanism.
  • the vacuum apparatus includes a second tray.
  • aspects of the present invention include (a) a chamber capable of being evacuated, (b) a processing chamber provided in a part above the chamber, and (iii) adjacent to the processing chamber above the chamber, A first load chamber for loading and unloading a workpiece; (d) a second load chamber for processing the workpiece facing the first load across the processing chamber above the chamber; and (e) a processing chamber disposed inside the chamber.
  • a transport mechanism that simultaneously faces at least two of the first load chamber and the second load chamber; and (f) between the first load chamber and the transport mechanism by moving up and down between the first load chamber and the transport mechanism. Conveys workpieces and moves the first load chamber between the processing chamber and the transport mechanism by moving up and down between the first tray and the processing chamber and the transport mechanism.
  • the gist of the present invention is that the vacuum device includes a second tray.
  • a chamber capable of being evacuated, a processing chamber provided in a part above the chamber, and a workpiece processing chamber, provided in another part above the chamber, A load chamber to be taken in and out;
  • a transfer mechanism that is disposed inside the chamber, faces the processing chamber and the load chamber, and transfers workpieces below the processing chamber or the load chamber;
  • a load chamber and a transfer mechanism The first tray that partitions the load chamber so that the load chamber can be evacuated, and (d) the vertical movement between the processing chamber and the transport mechanism.
  • the gist of the present invention is a vacuum processing method including a step of forming a solar cell antireflection film on the surface of the solar cell while heating the solar cell.
  • FIG. 1A is a schematic diagram illustrating an example of the configuration of a batch type vacuum apparatus
  • FIG. 1B is a schematic diagram illustrating an example of the configuration of an inline type vacuum apparatus
  • FIG. 1D is a schematic diagram showing an example of the configuration of a cluster type vacuum apparatus.
  • FIG. 2 is a schematic diagram showing an example of the configuration of the vacuum apparatus according to the first embodiment of the present invention.
  • FIG. 3 is a schematic view showing an example when the vacuum apparatus according to the first embodiment of the present invention is viewed from above.
  • FIG. 4 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the first embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the first embodiment of the present invention.
  • FIG. 1A is a schematic diagram illustrating an example of the configuration of a batch type vacuum apparatus
  • FIG. 1B is a schematic diagram illustrating an example of the configuration of an inline type vacuum apparatus
  • FIG. 1D is a
  • FIG. 6 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the first embodiment of the present invention.
  • FIG. 7 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the first modification of the first embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing an example of the configuration of a vacuum device according to a second modification of the first embodiment of the present invention.
  • FIG. 9 is a schematic diagram showing an example of the configuration of a vacuum apparatus according to the second embodiment of the present invention.
  • FIG. 10 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the second embodiment of the present invention.
  • FIG. 11 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the second embodiment of the present invention.
  • FIG. 12 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the second embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the second embodiment of the present invention.
  • FIG. 14 is a schematic diagram showing an example of the operation of the vacuum apparatus according to the third embodiment of the present invention.
  • FIG. 15 is a schematic diagram showing an example of the configuration of a vacuum apparatus according to the third embodiment of the present invention.
  • FIG. 16 is a schematic diagram illustrating an example of the operation of the vacuum apparatus according to the third embodiment of the present invention.
  • FIG. 17 is a schematic diagram illustrating an example of a configuration of a vacuum apparatus according to a modification of the third embodiment of the present invention.
  • FIG. 18 is a schematic diagram showing an example of the configuration of a vacuum apparatus according to the fourth embodiment of the present invention.
  • FIG. 19 is a schematic view showing an example of a vacuum apparatus according to the fourth embodiment of the present invention as viewed from above.
  • the vacuum apparatus includes a chamber 30 that can be evacuated, and a processing chamber that is provided in a part of the chamber 30 and processes workpieces 1a and 1b. 20 and a load chamber 10 provided in another part above the chamber 30 for taking in and out the workpieces 1a and 1b, and a control device 40.
  • a vacuum pump 35 for evacuating the inside of the chamber 30 is connected via a valve 34.
  • a transport mechanism 36 that faces the processing chamber 20 and the load chamber 10 is disposed inside the chamber 30, a transport mechanism 36 that faces the processing chamber 20 and the load chamber 10 is disposed.
  • the transport mechanism 36 includes a flat plate-like rotation mechanism 31 having a surface facing the load chamber 10 and the processing chamber 20 as a rotation surface, and a rotation shaft 32 connected to the rotation mechanism 31.
  • the rod rotating shaft 32 is connected to the center of the rotating mechanism 31 as shown in FIG.
  • the rotation mechanism 31 rotates 180 degrees about the rotation shaft 32, thereby moving the workpiece 1a under the load chamber 10 below the processing chamber 20 and simultaneously moving the workpiece 1b below the processing chamber 20 into the load chamber. Move it below 10. That is, the workpieces 1a and 1b can be exchanged simultaneously between the load chamber 10 and the processing chamber 20 only by rotating the rotation mechanism 31 by 180 degrees.
  • the rotation mechanism 31 has a quadrangular shape, but may have another shape such as a disk shape.
  • the load chamber 10 is defined by a first tray 11 and a lid 12 facing the first tray 11 in the upper portion of the chamber 30.
  • the 1st tray 11 is provided with the function as a gate valve which partitions off between chamber 30 and load room 10 so that vacuum is possible.
  • the shapes of the first tray 11 and the lid portion 12 may be the same.
  • the first tray 11 and the lid portion 12 are in close contact with the wall surface of the chamber 30 via an O-ring, a bellows, etc. (not shown).
  • the load chamber 10 is provided with a valve 13 connected to a vent line for introducing vent gas and air and a valve 14 connected to a vacuum pump 15. Air gas or vent gas is supplied from a vent line connected to the tip of the valve 13, and the inside of the load chamber 10 can be changed to an air atmosphere or a vent gas atmosphere. Alternatively, the inside of the load chamber 10 can be evacuated by the vacuum pump 15 to reduce the inside of the load chamber 10 to a predetermined pressure.
  • the workpieces 1a and 1b are taken in and out by removing the lid 12 (or moving the lid 12 up and down) in a state where the opening of the chamber 30 is closed by the first tray 11 and the chamber 30 is not opened to the atmosphere. Done.
  • the first tray 11 moves up and down between the load chamber 10 and the transport mechanism 36 (the rotation mechanism 31) and transports the workpiece 1 a between the load chamber 10 and the transport mechanism 36.
  • a pulling mechanism (not shown) is connected to the first tray 11.
  • details of the structure of the tension mechanism are not particularly limited here, for example, an air cylinder, a tension spring, a tension wire, a vacuum motor, or the like can be used.
  • the processing chamber 20 is defined by a second tray 21 in a part above the chamber 30.
  • a vacuum pump 25 is connected to the processing chamber 20 via a valve 24.
  • the processing chamber 20 is a chemical vapor deposition (CVD) apparatus
  • an electrode (not shown) for plasma discharge is disposed inside the processing chamber 20.
  • the processing chamber 20 is a vacuum deposition apparatus
  • an electron beam (EB) apparatus or the like is disposed inside the processing chamber 20.
  • EB electron beam
  • a discharge electrode is disposed inside the processing chamber 20.
  • the processing chamber 20 is a molecular beam epitaxial (MBE) apparatus, a Knudsen cell or the like is disposed inside the processing chamber 20.
  • MBE molecular beam epitaxial
  • the second tray 21 has a function as a gate valve or a shutter for partitioning the chamber 30 and the processing chamber 20 in a vacuumable manner.
  • the entire interior of the load chamber 10 is covered by the second tray 21, but the shape of the second tray 21 is not limited to this.
  • a convex portion or the like is formed at the peripheral end portion so as to surround the peripheral end portion of the work 1b, and the work 1b is transported from the second tray 21 to the inside of the chamber 30. Any structure can be used as long as it does not fall.
  • the second tray 21 moves up and down between the processing chamber 20 and the transport mechanism 36 (the rotation mechanism 31) and transports the workpiece 1 b between the processing chamber 20 and the transport mechanism 36.
  • a pulling mechanism (not shown) is connected to the second tray 21.
  • the tension mechanism are not particularly limited here, for example, an air cylinder, a spring, a tension wire, a vacuum motor, or the like can be used.
  • the second tray 21 and the first tray 11 preferably have the same shape. Thereby, as shown in FIG. 5, when the workpieces 1a and 1b are exchanged, the entire first tray 11 and the second tray 21 can be placed on the rotating mechanism 31 and exchanged. The work 1a, 1b can be carried in or out efficiently.
  • the control device 40 controls various operations of the vacuum device. For example, as shown in FIG. 2, while the workpiece 1 b is being processed in the processing chamber 20, a new workpiece 1 a is carried into the load chamber 10 and evacuated to a predetermined pressure, or the transfer mechanism 36. It is also possible to arrange the workpiece 1a on the top.
  • the workpieces 1a and 1b are, for example, a semiconductor substrate (semiconductor wafer) in the manufacture of a semiconductor device, a liquid crystal substrate in the manufacture of a liquid crystal device, a resin substrate in the manufacture of a magnetic recording medium or an optical recording medium, a magnetic material substrate in the manufacture of a thin film magnetic head,
  • a semiconductor substrate semiconductor wafer
  • liquid crystal substrate in the manufacture of a liquid crystal device
  • resin substrate in the manufacture of a magnetic recording medium or an optical recording medium
  • a magnetic material substrate in the manufacture of a thin film magnetic head
  • the workpieces 1a and 1b various organic materials such as synthetic resins, semiconductors, metals, ceramics, and glasses are selected according to the type of the intended product (industrial product). Is possible.
  • workpieces 1a and 1b are plate-like processing intermediates such as semiconductor wafers, which are called “manufacturing substrates”. It can be used according to the type of product (industrial product). In the case of a semiconductor wafer or the like, an intermediate product or the like in a state where a thin film is stacked on a semiconductor wafer in a narrow sense as a base material is also included in the “work”.
  • the lid 12 of the load chamber 10 is moved, and the work 1 a is carried onto the first tray 11. Thereafter, the lid 12 is closed to seal the load chamber 10, the valve 14 is opened, and the inside of the load chamber 10 is evacuated by the vacuum pump 15.
  • the processing chamber 20 performs a predetermined process on the workpiece 1b held on the second tray 21. After the processing of the workpiece 1b in the processing chamber 20, as shown in FIG. 5, the first tray 11 and the second tray 21 are moved up and down, and the first tray 11 and the second tray 21 are rotated by the rotation mechanism 31. Place on the surface.
  • the rotation mechanism 31 rotates 180 ° about the rotation shaft 32, the positions of the first tray 11 and the second tray 21 are simultaneously exchanged as shown in FIG. Thereafter, the first tray 11 and the second tray 21 are again pulled up to the top of the chamber 30 by a pulling mechanism (not shown).
  • the processed workpiece 1 b held on the second tray 21 is introduced into the load chamber 10 by the second tray 21.
  • the valve 13 is opened, and vent gas or air is introduced into the load chamber 10 so that the atmosphere around the work 1b is bent gas atmosphere, Or it returns to atmospheric pressure atmosphere.
  • the lid 12 is opened to take out the work 1b, and the next work is placed on the second tray 21.
  • the first tray 11 is pulled up to the top of the chamber 30 by a pulling mechanism (not shown).
  • the processing chamber 20 is defined in the upper part of the chamber 30.
  • a predetermined process is performed after being adjusted to a predetermined pressure by the vacuum pump 25 as necessary.
  • the vertical movement of the first tray 11 and the second tray 21 may be moved simultaneously or separately.
  • the first tray 11 and the second tray 21 convey the workpieces 1a and 1b to the processing chamber 20 or the load chamber 10 and the chamber 30.
  • the function as a gate valve for partitioning the load chamber 10 and the processing chamber 20 is also provided. Therefore, unlike the conventional apparatus, it is not necessary to separately provide a transport mechanism and a valve, and the number of apparatuses can be reduced and simplified. As a result, the load chamber 10 and the processing chamber 20 can be reduced to a size close to the workpiece size, and the size of the entire vacuum apparatus can be reduced. At the same time, by reducing the dead space in each room, it is possible to shorten exhaust / vent time and reduce running costs such as vent gas and power.
  • the rotating mechanism 31 as the transport mechanism 36 provided in the chamber 30, the workpieces 1a and 1b to be introduced next can be obtained simply by rotating the rotating mechanism 31 by 180 °. Since the two chambers can be simultaneously opposed to each other, the transfer from the load chamber 10 to the processing chamber 20 and from the processing chamber 20 to the load chamber 10 can be performed simultaneously, and the production efficiency is increased. Further, the waiting time can be reduced as compared with the conventional transport mechanism. By using the rotation mechanism 31, the mechanism becomes simpler than the case where a plurality of transport mechanisms are provided, and maintenance is also facilitated.
  • FIG. 7 shows a vacuum apparatus according to a first modification of the first embodiment.
  • openings 33 and 37 for passing the first tray 11 and the second tray 21 below the rotation mechanism 31 are provided in the rotation mechanism 31. Then, by moving the first tray 11 and the second tray 21 to the lower part of the rotation mechanism 31 from the openings 33 and 37, the workpieces 1a and 1b are placed directly on the rotation surface of the rotation mechanism 31.
  • the degree of freedom in selecting the apparatus is increased. Get higher.
  • a heating source or the like for heating the workpieces 1a and 1b may be disposed on the rotation surface of the rotation mechanism 31.
  • FIG. 8 shows a vacuum apparatus according to a second modification of the first embodiment.
  • the vacuum apparatus shown in FIG. 8 is a vacuum apparatus in which the load chambers 10a and 10b and the processing chambers 20a and 20b are alternately arranged in the rotation direction of the rotation mechanism 31 (0 °, 90 °, 180 ° 270 ° direction).
  • the rotation mechanism 31 can convey the workpieces 1a, 1b, 1c, and 1d by rotating 90 degrees about the rotation shaft 32 as an axis.
  • the processing efficiency is further improved.
  • the vacuum apparatus according to the second embodiment is different from the vacuum apparatus according to the first embodiment in that it has two processing chambers (first processing chamber 50 and second processing chamber 60). That is, as shown in FIG. 9, the vacuum apparatus includes a chamber 30 that can be evacuated, a first processing chamber 50 that is provided in a part above the chamber 30, and processes the workpieces 1 a and 1 b, and an upper portion of the chamber 30.
  • the first processing chamber 50 is adjacent to the load chamber 10 into and out of the workpieces 1a and 1b, and the first processing chamber 50 is opposed to the first processing chamber 50 across the load chamber 10 above the chamber 30 to process the workpieces 1a and 1b. 2 processing chambers 60.
  • the transport mechanism 360 includes a transport base 310 that transports the workpieces 1 a and 1 b and a moving mechanism (not shown) connected to the transport base 310.
  • the transport mechanism 360 can be moved in the horizontal direction of the paper surface of FIG. 9 inside the chamber 30 by a moving mechanism.
  • the moving mechanism is not particularly limited, and various means such as a roller can be used.
  • the transport mechanism 360 has openings 330 and 370 for passing the first tray 11 and the second tray 51 and the third tray 61 (described later) below the transport mechanism 360.
  • the transport mechanism 360 By moving the first tray 11, the second tray 51, and the third tray 61 to the lower part of the transport mechanism 360 through the openings 330 and 370, as shown in FIG. 11.
  • the workpieces 1a and 1b conveyed by the second tray 51 or the third tray 61 are directly placed.
  • the load chamber 10 is disposed in the center above the chamber 30.
  • the configuration of the load chamber 10 is substantially the same as that in FIG.
  • the first processing chamber 50 is defined by a second tray 51 in the upper part of the chamber 30.
  • a valve 53 connected to a vent line and a valve 54 connected to a vacuum pump 55 are connected to the first processing chamber 50.
  • an electrode (not shown) for plasma discharge is disposed inside the first processing chamber 50.
  • an electron beam (EB) apparatus or the like is disposed inside the first processing chamber 50.
  • EB electron beam
  • a discharge electrode is disposed inside the first processing chamber 50.
  • the first processing chamber 50 is a molecular beam epitaxial (MBE) apparatus, a Knudsen cell or the like is disposed inside the first processing chamber 50.
  • MBE molecular beam epitaxial
  • the second tray 51 has a function as a gate valve or a shutter for partitioning the chamber 30 and the first processing chamber 50 in a vacuumable manner.
  • the entire inside of the load chamber 10 is covered by the second tray 51, but the shape of the second tray 51 is not limited to this.
  • a convex portion or the like is formed at the peripheral end portion so as to surround the peripheral end portion of the work 1b, so that the work 1b does not fall from the second tray 51 into the chamber 30. Any structure can be used.
  • the second tray 51 moves up and down in the chamber 30 and transports the workpiece 1b between the first processing chamber 50 and the transport mechanism 360.
  • a pulling mechanism (not shown) is connected to the second tray 51.
  • the tension mechanism are not particularly limited, for example, an air cylinder, a spring, a tension wire, a vacuum motor, or the like can be used.
  • the second processing chamber 60 is defined by a third tray 61 in the upper part of the chamber 30.
  • the second processing chamber 60 is connected to a valve 63 connected to the vent line, a valve 64 connected to the vacuum pump 65, and a power source.
  • a valve 63 connected to the vent line
  • a valve 64 connected to the vacuum pump 65
  • a power source for example, when the second processing chamber 60 is a chemical vapor deposition (CVD) apparatus, an electrode (not shown) for plasma discharge is disposed inside the second processing chamber 60. If the second processing chamber 60 is a vacuum deposition apparatus, an electron beam (EB) apparatus or the like is disposed inside the second processing chamber 60. If the second processing chamber 60 is a sputtering apparatus, a discharge electrode is disposed inside the second processing chamber 60. If the second processing chamber 60 is a molecular beam epitaxial (MBE) apparatus, a Knudsen cell or the like is disposed inside the second processing chamber 60.
  • MBE molecular beam epitaxial
  • the third tray 61 has a function as a gate valve or a shutter for partitioning the chamber 30 and the second processing chamber 60 in a vacuumable manner.
  • the entire load chamber 10 is covered with the third tray 61, but the shape of the third tray 61 is not limited to this.
  • a convex portion or the like is formed at the peripheral end portion so as to surround the peripheral end portion of the work 1b, so that the work 1b does not fall from the third tray 61 into the chamber 30. Any structure can be used.
  • the third tray 61 moves up and down in the chamber 30 and transports the workpiece between the second processing chamber 60 and the transport mechanism 360.
  • a pulling mechanism (not shown) is connected to the third tray 61.
  • the tension mechanism are not particularly limited, for example, an air cylinder, a spring, a tension wire, a vacuum motor, or the like can be used.
  • the control device 40 controls various operations of the vacuum device. For example, as shown in FIG. 11, while a workpiece 1 b is being processed in the first processing chamber 50, a new workpiece 1 a is loaded into the load chamber 10 or another workpiece is loaded into the second processing chamber 60. It is possible to For example, if one of the first processing chamber 50 and the second processing chamber is defined as a workpiece cleaning chamber and the other functions as a workpiece deposition chamber, a vacuum apparatus with higher production efficiency can be obtained.
  • the lid 12 of the load chamber 10 is moved and the work 1 a is placed on the first tray 11. Thereafter, the lid 12 is closed to seal the load chamber 10, the valve 14 is opened, and the inside of the load chamber 10 is evacuated by the vacuum pump 15.
  • the first processing chamber 50 for example, an AC power source or a DC power source is driven to form a film on the work 1b held on the second tray 51.
  • the valve 53 is opened and the cleaning gas is supplied into the first processing chamber 50 to perform the cleaning process.
  • the first tray 11, the second tray 51, and the third tray 61 are lowered by a pulling mechanism (not shown).
  • the second tray 51 holding the workpiece 1 b moves to the lower portion of the conveyance table 310 through the opening 330 after placing the workpiece 1 b on the conveyance table 310.
  • the first tray 11 holding the workpiece 1 a moves to the lower portion of the conveyance table 310 through the opening 370 after placing the workpiece 1 b on the conveyance table 310.
  • the third tray 61 that does not hold the workpiece moves to the lower part of the transport table 310 as it is.
  • the transfer table 310 is moved in the direction of the arrow (horizontal direction) in FIG. 12, and the workpiece 1b on the transfer table 310 is opposed to the load chamber 10 as shown in FIG. Make them face each other. Thereafter, the first tray 11, the second tray 51, and the third tray 61 at the lower part of the transport table 310 are raised by a pulling mechanism that is not shown.
  • the work 1 b is introduced into the load chamber 10 by the first tray 11.
  • the valve 13 is opened and vent gas or air is introduced into the load chamber 10, whereby the atmosphere around the work 1 b is returned to the vent gas atmosphere or the atmospheric pressure atmosphere.
  • the lid 12 is opened to take out the work 1b, and the next work is placed on the first tray 11.
  • the first tray 11, the second tray 51, and the third tray 61 are configured to transfer the workpieces 1a and 1b, as well as the load chamber 10 and the first tray. It also functions as a gate valve that partitions the first processing chamber 50, the second processing chamber 60, and the chamber 30. For this reason, it is not necessary to separately provide a transport mechanism and a valve, and the number of devices can be reduced and simplified. As a result, the load chamber 10, the first processing chamber 50, and the second processing chamber 60 can be downsized to near the work size, and the entire vacuum apparatus can be downsized. At the same time, by reducing the dead space in each room, it is possible to shorten exhaust / vent time and reduce running costs such as vent gas and power.
  • the workpieces 1a and 1b can be simultaneously opposed to the two chambers to be introduced next.
  • the production efficiency is higher than when the workpieces 1a and 1b are conveyed one by one by the conventional conveyance mechanism.
  • the second processing chamber 60 can be cleaned using a cleaning gas by using the time during which the film is formed in the first processing chamber 50, so that the waiting time until a specific processing is completed. Can be reduced.
  • the cleaning rate is several to several tens of times the film formation rate. Therefore, the cleaning rate of the vacuum apparatus according to the second embodiment is equal to or higher than the film formation rate. In some cases, 100% availability can be achieved.
  • the usage frequency of each processing chamber is 1 ⁇ 2 that of the load chamber 10.
  • the regular maintenance interval of the processing chamber becomes longer and the production efficiency can be improved.
  • the vacuum apparatus according to the third embodiment is different from the above-described embodiment in that it has two load chambers. That is, as shown in FIG. 14, the vacuum apparatus is provided in a chamber 30 that can be evacuated, a processing chamber 20 that processes the workpieces 1 a and 1 b, and a processing that is performed above the chamber 30.
  • the first load chamber 10 and the second load chamber 70 that are adjacent to the chamber 20 and are opposed to each other with the processing chamber 20 sandwiched above the chamber 30 are provided for loading and unloading the workpieces 1a and 1b.
  • the conveyance mechanism 361 includes a conveyance table 311 that conveys the workpieces 1 a and 1 b and a moving mechanism (not shown) connected to the conveyance table 311.
  • the moving mechanism is not particularly limited, and various means such as a roller can be used.
  • the transport mechanism 361 can move inside the chamber 30 in the horizontal direction of the paper surface of FIG. 14 by a moving mechanism.
  • the load chamber 10 is defined above the chamber 30.
  • the configuration of the load chamber 10 is substantially the same as that in FIG.
  • the processing chamber 20 is disposed in the central portion above the chamber 30.
  • the configuration of the processing chamber 20 is substantially the same as that shown in FIG.
  • the second load chamber 70 is provided in the upper part of the chamber 30 and has a lid 72 that can be opened and closed. As shown in FIG. 16, the second tray 21 is moved below the second load chamber 70 by the transport mechanism 360 to partition the chamber 30 and the first load chamber 10, so that the second load chamber 70 is separated. Is sealed so that it can be evacuated. The second tray 21 and the lid 72 are in close contact with the wall surface of the chamber 30 via an O-ring or bellows (not shown).
  • the second load chamber 70 is provided with a valve 73 connected to a vent line for introducing vent gas and air and a valve 74 connected to a vacuum pump 75. Atmospheric gas or vent gas is supplied from a vent line connected to the tip of the valve 73, and the inside of the second load chamber 70 is changed to an atmospheric atmosphere or a vent gas atmosphere. Alternatively, the inside of the second load chamber 70 is evacuated by the vacuum pump 75, and the inside of the second load chamber 70 is reduced to a predetermined pressure. The work is taken in and out by removing the lid 72 (or moving the lid 72 up and down) in a state where the opening of the chamber 30 is closed by the second tray 21 so that the chamber 30 is not opened to the atmosphere. In the vacuum apparatus shown in FIG. 14, since the second tray 21 is used as a mechanism for partitioning the second load chamber 70, the number of parts can be reduced and the cost can be reduced.
  • the lid 12 of the first load chamber 10 is moved, and the work 1 a is placed on the first tray 11. Thereafter, the lid 12 is closed to seal the first load chamber 10, the valve 14 is opened, and the inside of the first load chamber 10 is evacuated by the vacuum pump 15.
  • the first tray 11 and the second tray 21 are lowered by a pulling mechanism (not shown), and the first tray and the second tray are placed on the transport table 311 as shown in FIG. Place the tray 21.
  • the transfer table 310 is moved in the direction of the arrow (horizontal direction) in FIG. 15, and the work 1b on the transfer table 310 is opposed to the second load chamber 70 as shown in FIG. Make them face each other.
  • the 1st tray 11 and the 2nd tray 21 are raised by the tension
  • the workpiece 1a held on the first tray 11 is carried into the processing chamber 20 and subjected to a predetermined process.
  • the processed workpiece 1 b held on the second tray 21 is carried into the second load chamber 70.
  • the valve 73 is opened, and vent gas or air is introduced into the second load chamber 70, so that the area around the work 1b is returned to atmospheric pressure. Thereafter, the lid 72 is opened to take out the work 1b, and the next work is placed on the first tray 11.
  • the first tray 11 and the second tray 21 transfer the workpieces 1a and 1b, in addition to the first load chamber 10 and the second tray 21. It also functions as a gate valve that partitions the load chamber / processing chamber 20 and the chamber 30. For this reason, it is not necessary to separately provide a transport mechanism and a valve, and the number of devices can be reduced and simplified. Further, since the second tray 21 performs the role of partitioning the second load chamber 70, it is not necessary to provide a tray dedicated to the second load chamber 70. As a result, the first load chamber 10, the second load chamber 70, and the processing chamber 20 can be downsized to near the work size, and the entire vacuum apparatus can be downsized. At the same time, by reducing the dead space in each room, it is possible to shorten exhaust / vent time and reduce running costs such as vent gas and power.
  • the workpieces 1a and 1b can be simultaneously opposed to the two chambers to be introduced next.
  • the production efficiency is also higher than when one piece is conveyed at a time.
  • the use frequency of the load chambers 10 and 70 is 1 ⁇ 2 that of the processing chamber 20.
  • the production efficiency can be improved.
  • FIG. 17 shows a vacuum apparatus according to a modification of the third embodiment.
  • openings 331 and 371 for allowing the first tray 11 and the second tray 21 to pass below the rotation mechanism 31 are provided in the transport table 311. Then, by moving the first tray 11 and the second tray 21 from the openings 331 and 371 to the lower part of the transport table 311, the workpieces 1 a and 1 b are placed directly on the rotation surface of the transport table 311.
  • the vacuum apparatus shown in FIG. 17 even if the first tray 11 and the second tray 21 have different shapes, the workpieces 1a and 1b can be conveyed, so that the degree of freedom in selecting the apparatus is increased. Get higher.
  • a heating source or the like for heating the workpieces 1a and 1b may be arranged on the transport table 311.
  • a fourth tray 71 that partitions the processing chamber 30 and the second load chamber 70 may be further arranged. According to the vacuum device shown in FIG. 17, even if the first tray 11, the second tray 21, and the fourth tray 71 have different shapes, the workpieces 1 a and 1 b are conveyed and the first load chamber 10 Since the two-load chamber 70, the processing chamber 20, and the chamber 30 can be partitioned, the degree of freedom in device selection is increased.
  • the vacuum apparatus according to the fourth embodiment is provided with heating mechanisms 81 and 91 on the bottom surfaces of the first tray 11 and the second tray 21 on which the workpieces 1a and 1b are mounted, respectively. This is different from the vacuum apparatus according to the first embodiment.
  • the heating mechanisms 81 and 91 a heater or a member provided with a hot plate that receives heat from the heater on the heater can be used.
  • a heat ray transmitting member such as glass that transmits heat radiation from the lamp heater and the lamp heater may be used as the heating mechanisms 81 and 91.
  • the heating mechanism 81 may be integrated with the bottom surfaces of the first tray 11 and the second tray, or may be separately disposed. When arrange
  • the first tray 11 or the second tray 21 is provided regardless of the process of the apparatus or the work of conveying the workpieces 1 a and 1 b.
  • a heating plate or the like equipped with a heater is used as the heating mechanisms 81 and 91
  • the first tray 11 or the second tray before the workpieces 1a and 1b are mounted.
  • the temperature of the mounting surface 21 can be set to a target temperature. Thereby, the temperature of the workpieces 1a and 1b can be increased in a short time. Even when a lamp heater or the like is used, heating is performed immediately after the workpieces 1a and 1b are placed.
  • the temperature can be raised at In any case, by directly heating only the workpieces 1a and 1b by the heating mechanisms 81 and 91, the workpieces 1a and 1b can be quickly heated to a target temperature, the control response can be improved, and the waiting time can be increased. The production efficiency is also improved.
  • the first tray 11 and the second tray 21 including the heating mechanisms 81 and 91 are brought into the vacuum while the workpieces 1a and 1b are heated, Since vacuum unloading, vacuum transfer, and vacuum processing can be performed, the temperature can be quickly raised, the temperature control response is high, and a higher-quality solar cell antireflection film can be formed with high efficiency in a short time. .
  • a heating mechanism similar to the heating mechanisms 81 and 91 according to the fourth embodiment may be introduced into the vacuum devices according to the second and third embodiments.
  • the SiNx film is exemplified as the solar cell antireflection film, it is needless to say that other films such as a titanium oxide film and a silicon nitride film can be formed.
  • the present invention can be applied to a vacuum apparatus used for thin film formation such as vapor deposition, sputtering, chemical vapor deposition (CVD) or the like, or thin film processing such as etching.
  • a vacuum apparatus used for thin film formation such as vapor deposition, sputtering, chemical vapor deposition (CVD) or the like, or thin film processing such as etching.

Abstract

L'invention porte sur un dispositif sous vide qui présente une chambre pouvant être mise sous vide (30), une chambre de traitement (20) disposée au niveau d’une partie de la partie supérieure de la chambre pouvant être mise sous vide (30), une chambre de charge (10) disposée au niveau d'une autre partie de la partie supérieure de la chambre pouvant être mise sous vide (30), un mécanisme de transport (36) faisant face à  la chambre de traitement (20) et à la chambre de charge (10) et transportant une pièce à travailler (1a, 1b) vers une partie en dessous de la chambre de traitement (20) ou de la chambre de charge (10), un premier plateau (11) se déplaçant verticalement entre la chambre de charge (10) et le mécanisme de transport (36) pour transporter la pièce à travailler (1a, 1b) entre la chambre de charge (10) et le mécanisme de transport (36) et séparant la chambre de charge (10) de telle sorte que la chambre de charge (10) peut être évacuée jusqu'au vide, et un deuxième plateau (21) se déplaçant verticalement entre la chambre de traitement (20) et le mécanisme de transport (36) pour transporter la pièce à travailler (1a, 1b) entre la chambre de traitement (20) et le mécanisme de transport (36).
PCT/JP2008/063730 2008-07-31 2008-07-31 Dispositif sous vide et procédé de traitement sous vide WO2010013333A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/063730 WO2010013333A1 (fr) 2008-07-31 2008-07-31 Dispositif sous vide et procédé de traitement sous vide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/063730 WO2010013333A1 (fr) 2008-07-31 2008-07-31 Dispositif sous vide et procédé de traitement sous vide

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WO2010013333A1 true WO2010013333A1 (fr) 2010-02-04

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016196680A (ja) * 2015-04-03 2016-11-24 トヨタ自動車株式会社 成膜方法および成膜装置
JP2018190776A (ja) * 2017-04-28 2018-11-29 トヨタ自動車株式会社 ウエハの真空加工装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116372A (ja) * 1982-12-23 1984-07-05 Hitachi Ltd 連続真空処理装置
JPH0390569A (ja) * 1989-09-02 1991-04-16 Fujitsu Ltd スパッタリング装置
JPH0822791A (ja) * 1994-07-06 1996-01-23 Shimadzu Corp 真空処理装置
JPH10209481A (ja) * 1997-01-27 1998-08-07 Sanyo Electric Co Ltd 光電変換装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116372A (ja) * 1982-12-23 1984-07-05 Hitachi Ltd 連続真空処理装置
JPH0390569A (ja) * 1989-09-02 1991-04-16 Fujitsu Ltd スパッタリング装置
JPH0822791A (ja) * 1994-07-06 1996-01-23 Shimadzu Corp 真空処理装置
JPH10209481A (ja) * 1997-01-27 1998-08-07 Sanyo Electric Co Ltd 光電変換装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016196680A (ja) * 2015-04-03 2016-11-24 トヨタ自動車株式会社 成膜方法および成膜装置
JP2018190776A (ja) * 2017-04-28 2018-11-29 トヨタ自動車株式会社 ウエハの真空加工装置

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