EP3916764A1 - Installation de traitement de substrat - Google Patents

Installation de traitement de substrat Download PDF

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Publication number
EP3916764A1
EP3916764A1 EP21177601.8A EP21177601A EP3916764A1 EP 3916764 A1 EP3916764 A1 EP 3916764A1 EP 21177601 A EP21177601 A EP 21177601A EP 3916764 A1 EP3916764 A1 EP 3916764A1
Authority
EP
European Patent Office
Prior art keywords
substrate
carrier
processing system
area
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP21177601.8A
Other languages
German (de)
English (en)
Other versions
EP3916764B1 (fr
Inventor
Joachim Mai
Mirko Kehr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meyer Burger Germany GmbH
Original Assignee
Meyer Burger Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meyer Burger Germany GmbH filed Critical Meyer Burger Germany GmbH
Publication of EP3916764A1 publication Critical patent/EP3916764A1/fr
Application granted granted Critical
Publication of EP3916764B1 publication Critical patent/EP3916764B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
EP21177601.8A 2012-02-06 2013-01-17 Installation de traitement de substrat Active EP3916764B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012100929A DE102012100929A1 (de) 2012-02-06 2012-02-06 Substratbearbeitungsanlage
PCT/IB2013/050414 WO2013118003A1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat
EP13709538.6A EP2812915B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP13709538.6A Division EP2812915B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat
EP13709538.6A Division-Into EP2812915B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat

Publications (2)

Publication Number Publication Date
EP3916764A1 true EP3916764A1 (fr) 2021-12-01
EP3916764B1 EP3916764B1 (fr) 2022-09-14

Family

ID=47884424

Family Applications (2)

Application Number Title Priority Date Filing Date
EP21177601.8A Active EP3916764B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat
EP13709538.6A Active EP2812915B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP13709538.6A Active EP2812915B1 (fr) 2012-02-06 2013-01-17 Installation de traitement de substrat

Country Status (12)

Country Link
US (1) US10199250B2 (fr)
EP (2) EP3916764B1 (fr)
JP (1) JP6282983B2 (fr)
KR (1) KR102033694B1 (fr)
CN (1) CN104115264B (fr)
DE (1) DE102012100929A1 (fr)
ES (1) ES2882593T3 (fr)
HU (1) HUE055426T2 (fr)
PL (1) PL2812915T3 (fr)
PT (1) PT2812915T (fr)
TW (1) TWI512878B (fr)
WO (1) WO2013118003A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106531679B (zh) * 2015-09-10 2019-10-08 北京北方华创微电子装备有限公司 承载装置及反应腔室
TWI633644B (zh) * 2017-08-17 2018-08-21 矽品精密工業股份有限公司 打印設備
DE102018123523A1 (de) * 2018-09-25 2020-03-26 Meyer Burger (Germany) Gmbh Prozessmodul und Anlage mit wenigstens einem solchen Prozessmodul
CN112582498A (zh) * 2019-09-30 2021-03-30 中国电子科技集团公司第四十八研究所 一种连续式生产晶体硅太阳能电池的方法
CN113130345B (zh) * 2019-12-31 2023-12-08 中微半导体设备(上海)股份有限公司 基片处理系统及其维护方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154145A (ja) * 1990-10-18 1992-05-27 Fuji Electric Co Ltd 半導体ウェハ処理装置
US5788448A (en) * 1994-12-08 1998-08-04 Tokyo Electron Limited Processing apparatus
JP2003142393A (ja) * 2001-11-07 2003-05-16 Tokyo Seimitsu Co Ltd 電子ビーム露光装置
WO2003100848A1 (fr) * 2002-05-23 2003-12-04 Anelva Corporation Dispositif et procede de traitement de substrats
EP1749901A2 (fr) * 2005-07-29 2007-02-07 Applied Materials, Inc. Chambre CVD avec polarisation à deux fréquences et méthode de fabrication d'une photomasque
WO2011003484A1 (fr) * 2009-07-08 2011-01-13 Applied Materials, Inc. Appareil et procédé de manipulation de substrat endommagé pour systèmes de traitement de substrat
WO2011055482A1 (fr) * 2009-11-06 2011-05-12 村田機械株式会社 Dispositif de maintien sans contact, dispositif de transfert et procédé de maintien sans contact
US20110278205A1 (en) * 2010-05-11 2011-11-17 Tokyo Electron Limited Method and apparatus of conveying objects to be processed and computer-readable storage medium storing program
WO2011148924A1 (fr) 2010-05-24 2011-12-01 株式会社アルバック Dispositif de formation de films
US20110313565A1 (en) * 2010-06-17 2011-12-22 Semes Co., Ltd. Substrate Processing Apparatus And Method For Loading And Unloading Substrates

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0731539Y2 (ja) * 1989-02-15 1995-07-19 富士通株式会社 基板処理装置
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
JP3965343B2 (ja) 1994-08-19 2007-08-29 東京エレクトロン株式会社 処理装置
US6308818B1 (en) * 1999-08-02 2001-10-30 Asyst Technologies, Inc. Transport system with integrated transport carrier and directors
JP2001135704A (ja) * 1999-11-09 2001-05-18 Sharp Corp 基板処理装置及び基板搬送用トレイの搬送制御方法
US6630053B2 (en) 2000-08-22 2003-10-07 Asm Japan K.K. Semiconductor processing module and apparatus
JP4753224B2 (ja) * 2000-08-22 2011-08-24 日本エー・エス・エム株式会社 ガスラインシステム
JP2002141398A (ja) 2000-11-02 2002-05-17 Kobe Steel Ltd 表面処理装置および表面処理方法
JP2002261146A (ja) 2001-03-02 2002-09-13 Hitachi Ltd 半導体集積回路装置の製造方法および半導体製造装置
JP2002332570A (ja) * 2001-05-08 2002-11-22 Anelva Corp 基板処理装置
JP2004018215A (ja) * 2002-06-18 2004-01-22 Tokyo Electron Ltd フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法
JP4245387B2 (ja) * 2003-03-19 2009-03-25 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
JP2004349503A (ja) * 2003-05-22 2004-12-09 Tokyo Electron Ltd 被処理体の処理システム及び処理方法
JP2005142200A (ja) * 2003-11-04 2005-06-02 Sharp Corp 気相成長装置および気相成長方法
US20070269297A1 (en) * 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4376737B2 (ja) * 2004-08-31 2009-12-02 学校法人東京理科大学 非接触チャック
JP5330721B2 (ja) 2007-10-23 2013-10-30 オルボテック エルティ ソラー，エルエルシー 処理装置および処理方法
JP4997141B2 (ja) * 2008-02-21 2012-08-08 株式会社アルバック 真空処理装置、基板の温度制御方法
US8309374B2 (en) * 2008-10-07 2012-11-13 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
JP2010109089A (ja) * 2008-10-29 2010-05-13 Kyocera Corp 搬送装置および成膜基板の製造方法
US8246284B2 (en) * 2009-03-05 2012-08-21 Applied Materials, Inc. Stacked load-lock apparatus and method for high throughput solar cell manufacturing
TWI436831B (zh) * 2009-12-10 2014-05-11 Orbotech Lt Solar Llc 真空處理裝置之噴灑頭總成
US20110245957A1 (en) * 2010-04-06 2011-10-06 Applied Materials, Inc. Advanced platform for processing crystalline silicon solar cells
DE102010016512A1 (de) * 2010-04-19 2011-10-20 Roth & Rau Ag Mehrtagen-Rollenofen
DE102010017497A1 (de) * 2010-06-21 2011-12-22 Roth & Rau Ag Vorrichtung und Verfahren zum Be-und Entladen von Substratträgerarrays
US20130108406A1 (en) * 2011-11-02 2013-05-02 Varian Semiconductor Equipment Associates, Inc. High-throughput workpiece handling

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154145A (ja) * 1990-10-18 1992-05-27 Fuji Electric Co Ltd 半導体ウェハ処理装置
US5788448A (en) * 1994-12-08 1998-08-04 Tokyo Electron Limited Processing apparatus
JP2003142393A (ja) * 2001-11-07 2003-05-16 Tokyo Seimitsu Co Ltd 電子ビーム露光装置
WO2003100848A1 (fr) * 2002-05-23 2003-12-04 Anelva Corporation Dispositif et procede de traitement de substrats
EP1749901A2 (fr) * 2005-07-29 2007-02-07 Applied Materials, Inc. Chambre CVD avec polarisation à deux fréquences et méthode de fabrication d'une photomasque
WO2011003484A1 (fr) * 2009-07-08 2011-01-13 Applied Materials, Inc. Appareil et procédé de manipulation de substrat endommagé pour systèmes de traitement de substrat
WO2011055482A1 (fr) * 2009-11-06 2011-05-12 村田機械株式会社 Dispositif de maintien sans contact, dispositif de transfert et procédé de maintien sans contact
US20110278205A1 (en) * 2010-05-11 2011-11-17 Tokyo Electron Limited Method and apparatus of conveying objects to be processed and computer-readable storage medium storing program
WO2011148924A1 (fr) 2010-05-24 2011-12-01 株式会社アルバック Dispositif de formation de films
US20110313565A1 (en) * 2010-06-17 2011-12-22 Semes Co., Ltd. Substrate Processing Apparatus And Method For Loading And Unloading Substrates

Also Published As

Publication number Publication date
WO2013118003A1 (fr) 2013-08-15
PL2812915T3 (pl) 2021-11-22
EP3916764B1 (fr) 2022-09-14
US10199250B2 (en) 2019-02-05
TW201349374A (zh) 2013-12-01
CN104115264B (zh) 2017-03-22
US20140369791A1 (en) 2014-12-18
PT2812915T (pt) 2021-08-19
KR20140129038A (ko) 2014-11-06
HUE055426T2 (hu) 2021-11-29
CN104115264A (zh) 2014-10-22
ES2882593T3 (es) 2021-12-02
EP2812915B1 (fr) 2021-07-07
KR102033694B1 (ko) 2019-10-17
JP2015512152A (ja) 2015-04-23
DE102012100929A1 (de) 2013-08-08
JP6282983B2 (ja) 2018-02-21
TWI512878B (zh) 2015-12-11
EP2812915A1 (fr) 2014-12-17

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