AU2003242422A1 - Substrate processing device and substrate processing method - Google Patents

Substrate processing device and substrate processing method

Info

Publication number
AU2003242422A1
AU2003242422A1 AU2003242422A AU2003242422A AU2003242422A1 AU 2003242422 A1 AU2003242422 A1 AU 2003242422A1 AU 2003242422 A AU2003242422 A AU 2003242422A AU 2003242422 A AU2003242422 A AU 2003242422A AU 2003242422 A1 AU2003242422 A1 AU 2003242422A1
Authority
AU
Australia
Prior art keywords
substrate processing
processing device
processing method
substrate
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003242422A
Inventor
Seiichi Igawa
Hitoshi Nakagawara
Yoshifumi Unehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Publication of AU2003242422A1 publication Critical patent/AU2003242422A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
AU2003242422A 2002-05-23 2003-05-23 Substrate processing device and substrate processing method Abandoned AU2003242422A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002148690 2002-05-23
JP2002-148690 2002-05-23
PCT/JP2003/006454 WO2003100848A1 (en) 2002-05-23 2003-05-23 Substrate processing device and substrate processing method

Publications (1)

Publication Number Publication Date
AU2003242422A1 true AU2003242422A1 (en) 2003-12-12

Family

ID=29561191

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003242422A Abandoned AU2003242422A1 (en) 2002-05-23 2003-05-23 Substrate processing device and substrate processing method

Country Status (6)

Country Link
JP (1) JP4369866B2 (en)
KR (1) KR100951337B1 (en)
CN (1) CN1293621C (en)
AU (1) AU2003242422A1 (en)
TW (1) TWI232242B (en)
WO (1) WO2003100848A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4581602B2 (en) * 2004-09-29 2010-11-17 株式会社島津製作所 Vacuum processing equipment
CN1970828B (en) * 2005-11-26 2010-05-26 鸿富锦精密工业（深圳）有限公司 Method for forming multilayer coating on die
JP5036290B2 (en) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 Substrate processing apparatus, substrate transfer method, and computer program
KR101359401B1 (en) * 2007-06-21 2014-02-10 주성엔지니어링(주) High efficiency thin film solar cell and manufacturing method and apparatus thereof
WO2009130790A1 (en) * 2008-04-25 2009-10-29 キヤノンアネルバ株式会社 Tray transfer type inline film forming apparatus
US20090324826A1 (en) * 2008-06-27 2009-12-31 Hitoshi Kato Film Deposition Apparatus, Film Deposition Method, and Computer Readable Storage Medium
US8465591B2 (en) 2008-06-27 2013-06-18 Tokyo Electron Limited Film deposition apparatus
US8465592B2 (en) 2008-08-25 2013-06-18 Tokyo Electron Limited Film deposition apparatus
TWI424784B (en) * 2008-09-04 2014-01-21 Hitachi High Tech Corp Organic electroluminescent device manufacturing apparatus, manufacturing method thereof, film forming apparatus and film forming method
JP5835722B2 (en) * 2009-12-10 2015-12-24 オルボテック エルティ ソラー，エルエルシー Automatic ranking multi-directional serial processor
LU91685B1 (en) 2010-05-07 2011-11-08 Cppe Carbon Process & Plant Engineering S A Process for the catalytic removal of carbon dioxide and sulfur dioxide from exhaust gases
JP4535408B1 (en) * 2010-05-10 2010-09-01 智雄 松下 Substrate transport mechanism and substrate transport method
TWI451521B (en) * 2010-06-21 2014-09-01 Semes Co Ltd Substrate treating apparatus and substrate treating method
JP5741834B2 (en) * 2011-05-13 2015-07-01 株式会社ニコン Object carry-out method, object exchange method, object holding apparatus, exposure apparatus, flat panel display manufacturing method, and device manufacturing method
CN108231642B (en) * 2011-05-13 2023-05-02 株式会社尼康 Substrate replacing device
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
DE102012100929A1 (en) * 2012-02-06 2013-08-08 Roth & Rau Ag Substrate processing system
WO2015042302A1 (en) * 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
JP6088964B2 (en) * 2013-12-13 2017-03-01 株式会社東芝 Semiconductor manufacturing equipment
WO2018108266A1 (en) * 2016-12-14 2018-06-21 Applied Materials, Inc. Deposition system
JP6640759B2 (en) * 2017-01-11 2020-02-05 株式会社アルバック Vacuum processing equipment
CN108588667B (en) 2017-12-27 2020-10-02 深圳市华星光电技术有限公司 Air charging device and air charging method for vacuum atmosphere conversion cavity and vacuum sputtering equipment
CN108396294B (en) * 2018-01-26 2021-12-10 中国科学院物理研究所 Film deposition system and control method
KR20210071334A (en) * 2019-12-06 2021-06-16 주식회사 아바코 Sputtering System
JP2022155711A (en) * 2021-03-31 2022-10-14 芝浦メカトロニクス株式会社 Film deposition apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543995B2 (en) * 1994-04-07 2004-07-21 東京エレクトロン株式会社 Processing equipment
JPH08213446A (en) * 1994-12-08 1996-08-20 Tokyo Electron Ltd Processing equipment
JP4034860B2 (en) * 1997-10-31 2008-01-16 キヤノンアネルバ株式会社 Tray transfer film forming apparatus and auxiliary chamber
JP2002222846A (en) * 2001-01-26 2002-08-09 Shin Meiwa Ind Co Ltd Vacuum transport device

Also Published As

Publication number Publication date
CN1650416A (en) 2005-08-03
WO2003100848A1 (en) 2003-12-04
KR20050002862A (en) 2005-01-10
JPWO2003100848A1 (en) 2005-09-29
KR100951337B1 (en) 2010-04-08
CN1293621C (en) 2007-01-03
TWI232242B (en) 2005-05-11
JP4369866B2 (en) 2009-11-25
TW200403351A (en) 2004-03-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase