JP6088964B2 - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
- Publication number
- JP6088964B2 JP6088964B2 JP2013257783A JP2013257783A JP6088964B2 JP 6088964 B2 JP6088964 B2 JP 6088964B2 JP 2013257783 A JP2013257783 A JP 2013257783A JP 2013257783 A JP2013257783 A JP 2013257783A JP 6088964 B2 JP6088964 B2 JP 6088964B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- transport
- tray
- supply unit
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Description
前記搬送部を制御する制御部と、を備え、
前記制御部は、電磁波シールドを行うべき未シールドの半導体パッケージが搭載されたトレイを収納するトレイ収納供給部から前記トレイを取り出して搬送キャリア上に載置し、この搬送キャリアを、電磁波シールドのためのスパッタ材料の付着を行うスパッタ装置まで搬送すると共に、電磁波シールド済の半導体パッケージを搭載する前記トレイが載置された前記搬送キャリアを前記スパッタ装置から取り出して搬送し、前記電磁波シールド済の半導体パッケージを搭載する前記トレイを前記搬送キャリアから回収して前記トレイ収納供給部に収納するように制御する半導体製造装置が提供される。
(第1の実施形態)
(第2の実施形態)
Claims (7)
- 電磁波シールドを行うべき未シールドの半導体パッケージが搭載されたトレイを搬送する搬送部と、
前記搬送部を制御する制御部と、を備え、
前記制御部は、電磁波シールドを行うべき未シールドの半導体パッケージが搭載されたトレイを収納するトレイ収納供給部から前記トレイを取り出して搬送キャリア上に載置し、前記搬送キャリアを、電磁波シールドのためのスパッタ材料の付着を行うスパッタ装置まで搬送すると共に、電磁波シールド済の半導体パッケージを搭載する前記トレイが載置された前記搬送キャリアを前記スパッタ装置から取り出して搬送し、前記電磁波シールド済の半導体パッケージを搭載する前記トレイを前記搬送キャリアから回収して前記トレイ収納供給部に収納するように制御する半導体製造装置。 - 前記搬送部は、同じ前記搬送キャリアを繰り返し連続して使用する請求項1に記載の半導体製造装置。
- 前記搬送部は、前記搬送キャリアから前記トレイを回収した後、当該搬送キャリアをキャリア収納供給部まで搬送して、当該搬送キャリアを前記キャリア収納供給部に収納するとともに、前記キャリア収納供給部に収納した前記搬送キャリアとは別個の搬送キャリアを前記キャリア収納供給部から取り出す請求項1に記載の半導体製造装置。
- 前記キャリア収納供給部は、複数の前記搬送キャリアを収納可能であり、
前記搬送部は、搬送された前記搬送キャリアの収納と前記キャリア収納供給部に収納された前記複数の搬送キャリアのうち一つの前記搬送キャリアの取り出しとを繰り返し行う請求項3に記載の半導体製造装置。 - 前記キャリア収納供給部から前記複数の搬送キャリアを一括で取り出す機構を備える請求項3または4に記載の半導体製造装置。
- 前記キャリア収納供給部は少なくとも2つ設けられ、
一つの前記キャリア収納供給部に対し、搬送された前記搬送キャリアの収納と前記キャリア収納供給部に収納された前記複数の搬送キャリアのうち一つの前記搬送キャリアの取り出しとを繰り返し行っている間に、他の一つの前記キャリア収納供給部から前記複数の搬送キャリアを一括で取り出し可能な請求項5に記載の半導体製造装置。 - 前記搬送キャリア上に、複数個の前記トレイが載置される請求項1乃至6のいずれかに記載の半導体製造装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013257783A JP6088964B2 (ja) | 2013-12-13 | 2013-12-13 | 半導体製造装置 |
US14/482,075 US9458535B2 (en) | 2013-12-13 | 2014-09-10 | Semiconductor manufacturing device and semiconductor manufacturing method |
CN201410751756.XA CN104716074B (zh) | 2013-12-13 | 2014-12-10 | 半导体制造装置 |
TW103143372A TWI556343B (zh) | 2013-12-13 | 2014-12-11 | Semiconductor manufacturing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013257783A JP6088964B2 (ja) | 2013-12-13 | 2013-12-13 | 半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015113511A JP2015113511A (ja) | 2015-06-22 |
JP6088964B2 true JP6088964B2 (ja) | 2017-03-01 |
Family
ID=53367710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013257783A Active JP6088964B2 (ja) | 2013-12-13 | 2013-12-13 | 半導体製造装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9458535B2 (ja) |
JP (1) | JP6088964B2 (ja) |
CN (1) | CN104716074B (ja) |
TW (1) | TWI556343B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6480823B2 (ja) * | 2015-07-23 | 2019-03-13 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
TWI814374B (zh) * | 2022-05-10 | 2023-09-01 | 鴻勁精密股份有限公司 | 分層置盤裝置及作業機 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58181866A (ja) * | 1982-04-14 | 1983-10-24 | Hitachi Ltd | インライン型スパツタ装置 |
JPH11340305A (ja) * | 1998-05-26 | 1999-12-10 | Sony Corp | 吸着装置及び吸着方法並びにこの吸着装置を備える半導体製造装置 |
JP2001135704A (ja) * | 1999-11-09 | 2001-05-18 | Sharp Corp | 基板処理装置及び基板搬送用トレイの搬送制御方法 |
JP4108896B2 (ja) | 2000-02-10 | 2008-06-25 | 松下電器産業株式会社 | 成膜装置 |
EP1310986A1 (de) * | 2001-11-08 | 2003-05-14 | F & K Delvotec Bondtechnik GmbH | Chipträgerplatten-Wechselmechanismus |
TWI232242B (en) * | 2002-05-23 | 2005-05-11 | Anelva Corp | Substrate processing apparatus and processing method |
CA2575186A1 (en) | 2004-08-04 | 2006-02-16 | Irm, Llc | Object storage devices, systems, and related methods |
RU2357000C2 (ru) * | 2004-08-30 | 2009-05-27 | Улвак, Инк. | Устройство для образования пленки |
JP4665155B2 (ja) * | 2004-10-22 | 2011-04-06 | 株式会社昭和真空 | 薄膜形成装置及びその方法 |
US8557093B2 (en) * | 2007-03-22 | 2013-10-15 | Sunpower Corporation | Deposition system with electrically isolated pallet and anode assemblies |
JP2009167519A (ja) | 2007-12-18 | 2009-07-30 | Hitachi Maxell Ltd | スパッタリング装置及びスパッタリング方法 |
JP2010135505A (ja) * | 2008-12-03 | 2010-06-17 | Shimadzu Corp | 真空装置 |
US9362196B2 (en) | 2010-07-15 | 2016-06-07 | Kabushiki Kaisha Toshiba | Semiconductor package and mobile device using the same |
TW201321542A (zh) * | 2011-11-29 | 2013-06-01 | Chenming Mold Ind Corp | 製造ic屏蔽鍍膜之設備及ic之金屬屏蔽膜層 |
JP2013161969A (ja) * | 2012-02-06 | 2013-08-19 | Sumitomo Heavy Ind Ltd | 太陽電池の製造方法および太陽電池の製造装置 |
TW201346050A (zh) | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | 成膜裝置及成膜方法 |
JP2013221176A (ja) * | 2012-04-17 | 2013-10-28 | Panasonic Corp | 薄膜製造方法および薄膜製造装置 |
JP2013241633A (ja) | 2012-05-18 | 2013-12-05 | Panasonic Corp | スパッタ装置およびスパッタ方法 |
JP5903668B2 (ja) * | 2013-02-21 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 部品実装装置および部品実装方法 |
-
2013
- 2013-12-13 JP JP2013257783A patent/JP6088964B2/ja active Active
-
2014
- 2014-09-10 US US14/482,075 patent/US9458535B2/en active Active
- 2014-12-10 CN CN201410751756.XA patent/CN104716074B/zh active Active
- 2014-12-11 TW TW103143372A patent/TWI556343B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20150167156A1 (en) | 2015-06-18 |
TW201528414A (zh) | 2015-07-16 |
TWI556343B (zh) | 2016-11-01 |
JP2015113511A (ja) | 2015-06-22 |
US9458535B2 (en) | 2016-10-04 |
CN104716074A (zh) | 2015-06-17 |
CN104716074B (zh) | 2017-11-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI433255B (zh) | 基板處理裝置、基板處理方法及記憶媒體 | |
KR102296010B1 (ko) | 기판 처리 장치 | |
JP4980978B2 (ja) | 基板処理装置 | |
KR20130032272A (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
JP2016201526A (ja) | 基板処理システム | |
KR20130118236A (ko) | 기판 처리 장치, 기판 처리 방법 및 기억 매체 | |
KR101986411B1 (ko) | 기판 처리 장치 | |
JP6190264B2 (ja) | 半導体製造装置 | |
JP6088964B2 (ja) | 半導体製造装置 | |
TWI462212B (zh) | Processing system and processing methods | |
JP6314161B2 (ja) | 基板搬送システムおよび方法 | |
CN213546285U (zh) | 基板处理装置 | |
JP5977729B2 (ja) | 基板処理システム | |
JP5977728B2 (ja) | 基板処理システム | |
TWI483882B (zh) | 電子元件轉載收料機 | |
JP5421043B2 (ja) | 基板処理装置及びこれを備えた基板処理システム | |
JP2006245486A (ja) | ストッカーの棚フレーム構造 | |
JP2013187463A (ja) | 基板処理装置 | |
KR102457336B1 (ko) | 기판 처리 장치 | |
JP2017065912A (ja) | 物品収容システム | |
JP5442968B2 (ja) | 基板処理ユニットおよび基板処理装置 | |
JP2006228886A (ja) | 基板の製造ライン | |
JP4467374B2 (ja) | ウエハ立替機、ウエハ処理システム | |
KR101520165B1 (ko) | 유리 기판 가공 장치 | |
JP2019051954A (ja) | 搬送装置及び搬送方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160219 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160915 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161007 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161206 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170206 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6088964 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |