CN104716074A - 半导体制造装置 - Google Patents
半导体制造装置 Download PDFInfo
- Publication number
- CN104716074A CN104716074A CN201410751756.XA CN201410751756A CN104716074A CN 104716074 A CN104716074 A CN 104716074A CN 201410751756 A CN201410751756 A CN 201410751756A CN 104716074 A CN104716074 A CN 104716074A
- Authority
- CN
- China
- Prior art keywords
- carrier
- conveyance
- pallet
- supply unit
- storage supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013257783A JP6088964B2 (ja) | 2013-12-13 | 2013-12-13 | 半導体製造装置 |
JP2013-257783 | 2013-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104716074A true CN104716074A (zh) | 2015-06-17 |
CN104716074B CN104716074B (zh) | 2017-11-03 |
Family
ID=53367710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410751756.XA Active CN104716074B (zh) | 2013-12-13 | 2014-12-10 | 半导体制造装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9458535B2 (zh) |
JP (1) | JP6088964B2 (zh) |
CN (1) | CN104716074B (zh) |
TW (1) | TWI556343B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373893A (zh) * | 2015-07-23 | 2017-02-01 | 株式会社东芝 | 半导体装置及其制造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI814374B (zh) * | 2022-05-10 | 2023-09-01 | 鴻勁精密股份有限公司 | 分層置盤裝置及作業機 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340305A (ja) * | 1998-05-26 | 1999-12-10 | Sony Corp | 吸着装置及び吸着方法並びにこの吸着装置を備える半導体製造装置 |
JP2001135704A (ja) * | 1999-11-09 | 2001-05-18 | Sharp Corp | 基板処理装置及び基板搬送用トレイの搬送制御方法 |
CN1650416A (zh) * | 2002-05-23 | 2005-08-03 | 安内华株式会社 | 基板处理装置及处理方法 |
CN101415630A (zh) * | 2004-08-04 | 2009-04-22 | Irm有限公司 | 物品储存装置、系统和相关的方法 |
JP2010135505A (ja) * | 2008-12-03 | 2010-06-17 | Shimadzu Corp | 真空装置 |
TW201346050A (zh) * | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | 成膜裝置及成膜方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58181866A (ja) * | 1982-04-14 | 1983-10-24 | Hitachi Ltd | インライン型スパツタ装置 |
JP4108896B2 (ja) | 2000-02-10 | 2008-06-25 | 松下電器産業株式会社 | 成膜装置 |
EP1310986A1 (de) * | 2001-11-08 | 2003-05-14 | F & K Delvotec Bondtechnik GmbH | Chipträgerplatten-Wechselmechanismus |
JP4691498B2 (ja) * | 2004-08-30 | 2011-06-01 | 株式会社アルバック | 成膜装置 |
JP4665155B2 (ja) * | 2004-10-22 | 2011-04-06 | 株式会社昭和真空 | 薄膜形成装置及びその方法 |
US8557093B2 (en) * | 2007-03-22 | 2013-10-15 | Sunpower Corporation | Deposition system with electrically isolated pallet and anode assemblies |
JP2009167519A (ja) | 2007-12-18 | 2009-07-30 | Hitachi Maxell Ltd | スパッタリング装置及びスパッタリング方法 |
US9362196B2 (en) | 2010-07-15 | 2016-06-07 | Kabushiki Kaisha Toshiba | Semiconductor package and mobile device using the same |
TW201321542A (zh) * | 2011-11-29 | 2013-06-01 | Chenming Mold Ind Corp | 製造ic屏蔽鍍膜之設備及ic之金屬屏蔽膜層 |
JP2013161969A (ja) * | 2012-02-06 | 2013-08-19 | Sumitomo Heavy Ind Ltd | 太陽電池の製造方法および太陽電池の製造装置 |
JP2013221176A (ja) * | 2012-04-17 | 2013-10-28 | Panasonic Corp | 薄膜製造方法および薄膜製造装置 |
JP2013241633A (ja) | 2012-05-18 | 2013-12-05 | Panasonic Corp | スパッタ装置およびスパッタ方法 |
JP5903668B2 (ja) * | 2013-02-21 | 2016-04-13 | パナソニックIpマネジメント株式会社 | 部品実装装置および部品実装方法 |
-
2013
- 2013-12-13 JP JP2013257783A patent/JP6088964B2/ja active Active
-
2014
- 2014-09-10 US US14/482,075 patent/US9458535B2/en active Active
- 2014-12-10 CN CN201410751756.XA patent/CN104716074B/zh active Active
- 2014-12-11 TW TW103143372A patent/TWI556343B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11340305A (ja) * | 1998-05-26 | 1999-12-10 | Sony Corp | 吸着装置及び吸着方法並びにこの吸着装置を備える半導体製造装置 |
JP2001135704A (ja) * | 1999-11-09 | 2001-05-18 | Sharp Corp | 基板処理装置及び基板搬送用トレイの搬送制御方法 |
CN1650416A (zh) * | 2002-05-23 | 2005-08-03 | 安内华株式会社 | 基板处理装置及处理方法 |
CN101415630A (zh) * | 2004-08-04 | 2009-04-22 | Irm有限公司 | 物品储存装置、系统和相关的方法 |
JP2010135505A (ja) * | 2008-12-03 | 2010-06-17 | Shimadzu Corp | 真空装置 |
TW201346050A (zh) * | 2012-02-06 | 2013-11-16 | Tokyo Electron Ltd | 成膜裝置及成膜方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106373893A (zh) * | 2015-07-23 | 2017-02-01 | 株式会社东芝 | 半导体装置及其制造方法 |
CN106373893B (zh) * | 2015-07-23 | 2019-08-02 | 东芝存储器株式会社 | 半导体装置及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6088964B2 (ja) | 2017-03-01 |
US9458535B2 (en) | 2016-10-04 |
TW201528414A (zh) | 2015-07-16 |
JP2015113511A (ja) | 2015-06-22 |
CN104716074B (zh) | 2017-11-03 |
TWI556343B (zh) | 2016-11-01 |
US20150167156A1 (en) | 2015-06-18 |
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170808 Address after: Tokyo, Japan Applicant after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Applicant before: Toshiba Corp. |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo Patentee after: Kaixia Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. Address after: Tokyo Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo Patentee before: Pangea Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211027 Address after: Tokyo Patentee after: Pangea Co.,Ltd. Address before: Tokyo Patentee before: TOSHIBA MEMORY Corp. |