KR100951337B1 - 기판처리장치 및 처리방법 - Google Patents

기판처리장치 및 처리방법 Download PDF

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Publication number
KR100951337B1
KR100951337B1 KR1020047014556A KR20047014556A KR100951337B1 KR 100951337 B1 KR100951337 B1 KR 100951337B1 KR 1020047014556 A KR1020047014556 A KR 1020047014556A KR 20047014556 A KR20047014556 A KR 20047014556A KR 100951337 B1 KR100951337 B1 KR 100951337B1
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KR
South Korea
Prior art keywords
substrate
carrier
chamber
transfer
load lock
Prior art date
Application number
KR1020047014556A
Other languages
English (en)
Korean (ko)
Other versions
KR20050002862A (ko
Inventor
나까가와라히또시
이가와세이이찌
우네하라요시후미
Original Assignee
캐논 아네르바 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 캐논 아네르바 가부시키가이샤 filed Critical 캐논 아네르바 가부시키가이샤
Publication of KR20050002862A publication Critical patent/KR20050002862A/ko
Application granted granted Critical
Publication of KR100951337B1 publication Critical patent/KR100951337B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
KR1020047014556A 2002-05-23 2003-05-23 기판처리장치 및 처리방법 KR100951337B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2002-00148690 2002-05-23
JP2002148690 2002-05-23
PCT/JP2003/006454 WO2003100848A1 (fr) 2002-05-23 2003-05-23 Dispositif et procede de traitement de substrats

Publications (2)

Publication Number Publication Date
KR20050002862A KR20050002862A (ko) 2005-01-10
KR100951337B1 true KR100951337B1 (ko) 2010-04-08

Family

ID=29561191

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020047014556A KR100951337B1 (ko) 2002-05-23 2003-05-23 기판처리장치 및 처리방법

Country Status (6)

Country Link
JP (1) JP4369866B2 (fr)
KR (1) KR100951337B1 (fr)
CN (1) CN1293621C (fr)
AU (1) AU2003242422A1 (fr)
TW (1) TWI232242B (fr)
WO (1) WO2003100848A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180082977A (ko) * 2017-01-11 2018-07-19 가부시키가이샤 알박 성막 방법 및 진공 처리 장치

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4581602B2 (ja) * 2004-09-29 2010-11-17 株式会社島津製作所 真空処理装置
CN1970828B (zh) * 2005-11-26 2010-05-26 鸿富锦精密工业（深圳）有限公司 在模具上形成多层镀膜的方法
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
KR101359401B1 (ko) * 2007-06-21 2014-02-10 주성엔지니어링(주) 고효율 박막 태양전지와 그 제조방법 및 제조장치
WO2009130790A1 (fr) * 2008-04-25 2009-10-29 キヤノンアネルバ株式会社 Appareil de formation de film aligné de type à transfert de plateau
US8465592B2 (en) 2008-08-25 2013-06-18 Tokyo Electron Limited Film deposition apparatus
US8465591B2 (en) 2008-06-27 2013-06-18 Tokyo Electron Limited Film deposition apparatus
US20090324826A1 (en) * 2008-06-27 2009-12-31 Hitoshi Kato Film Deposition Apparatus, Film Deposition Method, and Computer Readable Storage Medium
TW201408133A (zh) * 2008-09-04 2014-02-16 Hitachi High Tech Corp 有機電激發光裝置製造裝置及其製造方法以及成膜裝置及成膜方法
TWI436831B (zh) * 2009-12-10 2014-05-11 Orbotech Lt Solar Llc 真空處理裝置之噴灑頭總成
LU91685B1 (de) 2010-05-07 2011-11-08 Cppe Carbon Process & Plant Engineering S A Verfahren zur katalytischen Entfernung von Kohlendioxyd und Schwefeldioxid aus Abgasen
JP4535408B1 (ja) * 2010-05-10 2010-09-01 智雄 松下 基板搬送機構および基板搬送方法
TWI451521B (zh) * 2010-06-21 2014-09-01 Semes Co Ltd 基板處理設備及基板處理方法
JP5741834B2 (ja) * 2011-05-13 2015-07-01 株式会社ニコン 物体の搬出方法、物体の交換方法、物体保持装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2012157231A1 (fr) * 2011-05-13 2012-11-22 株式会社ニコン Dispositif de remplacement de substrat
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
DE102012100929A1 (de) * 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
KR20160062065A (ko) * 2013-09-20 2016-06-01 어플라이드 머티어리얼스, 인코포레이티드 통합된 정전 척을 갖는 기판 캐리어
JP6088964B2 (ja) * 2013-12-13 2017-03-01 株式会社東芝 半導体製造装置
KR102188702B1 (ko) * 2016-12-14 2020-12-08 어플라이드 머티어리얼스, 인코포레이티드 증착 시스템
CN108588667B (zh) * 2017-12-27 2020-10-02 深圳市华星光电技术有限公司 一种真空大气转换腔的充气装置及充气方法、真空溅射设备
CN108396294B (zh) * 2018-01-26 2021-12-10 中国科学院物理研究所 一种薄膜沉积系统及控制方法
KR20210071334A (ko) * 2019-12-06 2021-06-16 주식회사 아바코 스퍼터링 시스템
JP2022155711A (ja) * 2021-03-31 2022-10-14 芝浦メカトロニクス株式会社 成膜装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543995B2 (ja) * 1994-04-07 2004-07-21 東京エレクトロン株式会社 処理装置
JPH08213446A (ja) * 1994-12-08 1996-08-20 Tokyo Electron Ltd 処理装置
JP4034860B2 (ja) * 1997-10-31 2008-01-16 キヤノンアネルバ株式会社 トレイ搬送式成膜装置及び補助チャンバー
JP2002222846A (ja) * 2001-01-26 2002-08-09 Shin Meiwa Ind Co Ltd 真空搬送装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180082977A (ko) * 2017-01-11 2018-07-19 가부시키가이샤 알박 성막 방법 및 진공 처리 장치
KR102428287B1 (ko) 2017-01-11 2022-08-02 가부시키가이샤 알박 성막 방법 및 진공 처리 장치

Also Published As

Publication number Publication date
CN1293621C (zh) 2007-01-03
KR20050002862A (ko) 2005-01-10
AU2003242422A1 (en) 2003-12-12
WO2003100848A1 (fr) 2003-12-04
TW200403351A (en) 2004-03-01
TWI232242B (en) 2005-05-11
JP4369866B2 (ja) 2009-11-25
JPWO2003100848A1 (ja) 2005-09-29
CN1650416A (zh) 2005-08-03

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