WO2003085723A1 - Alignment method and mounting method using the alignment method - Google Patents
Alignment method and mounting method using the alignment method Download PDFInfo
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- WO2003085723A1 WO2003085723A1 PCT/JP2003/003880 JP0303880W WO03085723A1 WO 2003085723 A1 WO2003085723 A1 WO 2003085723A1 JP 0303880 W JP0303880 W JP 0303880W WO 03085723 A1 WO03085723 A1 WO 03085723A1
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- WIPO (PCT)
- Prior art keywords
- recognition
- mark
- workpiece
- alignment
- recognition means
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T1/00—General purpose image data processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49137—Different components
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Definitions
- the present invention relates to an alignment method for aligning objects to be bonded and a mounting method using the method.
- the relative positions of the two In order to join objects to be joined, for example, when joining a chip to a substrate, the relative positions of the two must be precisely adjusted.
- at least one of the workpieces is provided with a positioning recognition mark, and the position of the recognition mark is read by a recognition means such as a camera to identify the recognition mark.
- the positions of the members are adjusted so that the relative positional relationship between the two workpieces is kept within a predetermined accuracy.
- the recognition marks provided at both ends thereof are read by moving the recognition means, and both marks are read based on the read information.
- the workpieces are aligned with each other, for example, as shown in Fig. 1, a first workpiece 2 (for example, a chip) held on a head 1 and a stage 3 held on a stage 3.
- the second visual field recognition means 5 having a vertical visual field is inserted between the second workpiece 4 (for example, a substrate) and the second visual field recognition means 5.
- an object of the present invention is to use an alignment method and a method capable of greatly reducing the alignment time and the mounting time by eliminating the need for securing the settling time as described above while maintaining high alignment accuracy. It is to provide an implementation method that has been used. It is another object of the present invention to prevent a decrease in recognition position accuracy of a recognition mark while achieving a reduction in alignment time and mounting time.
- the present invention also provides a basic technical idea of synchronously reading both recognition marks simultaneously from the viewpoint of significantly shortening the alignment time and, consequently, the mounting time, and greatly improving the alignment accuracy. That is, in the alignment method according to the present invention, the positions of the objects to be joined are read by reading the alignment recognition marks provided on both the objects to be joined with a two-view recognition means having a field of view in the direction of both the objects.
- An alignment method for matching wherein the two recognition marks are synchronously read at the same time (second alignment method).
- second alignment method By using the two-view recognition means, the recognition marks provided on both workpieces are synchronized and read at the same time. Even if there is an error, the upper and lower recognition marks are read synchronously, and the relative positional relationship is maintained. The alignment accuracy increases.
- a recognition unit having a visual field in both object directions for example, a recognition method of two visual fields is used as the movable recognition means.
- the respective recognition marks for alignment provided on both workpieces are read simultaneously in synchronization with each other, and based on the position feedback signal during the movement of the recognition means, the recognition means It is preferable that the read mark recognition positions are corrected to specify the absolute position of each recognition mark. Being able to specify the absolute position makes it possible to correct the rotation direction (0 direction). As a result, since the reading accuracy is high and the absolute position of the mark can be recognized, alignment with higher accuracy is possible, and the mounting time can be shortened.
- the first alignment In addition, the first alignment according to the present invention, a recognition means for reading the alignment recognition marks provided on both the workpieces from below is used as the movable recognition means, and each of the movable recognition means is moved during the movement before the complete stop of the recognition means.
- the recognition mark is read, and based on the position feedback signal during the movement of the recognition means, each mark recognition position read by the recognition means can be corrected to specify the absolute position of each recognition mark.
- a binocular camera may be used as the mobile recognition means disposed below.
- As an eyesight lens it is integrated with the camera movement mechanism. It is possible to use those that have been incorporated, that is, those that are integrally incorporated in a certain position.
- the above two-eye power lens may be configured by incorporating two separable cameras into the moving mechanism.
- at least one of the alignment recognition marks provided on one of the workpieces transmits measurement waves (for example, visible light or infrared light) through the workpiece or Z and the receiving member of the workpiece. Can also be read.
- the article to be joined or the receiving member of the article to be permeable to the measurement wave is made of, for example, glass.
- the aberration of the lens of the movable recognition means is corrected by software and read.
- the mark is read first before the complete stop during movement, the mark may be read when the mark has not yet reached the center of the camera. If there is lens aberration or distortion, a position recognition error will result. Therefore, if the distortion of the lens is corrected, for example, by memorizing the reference matrix mark in a soft matrix, the correct position can be recognized even if it is not the center of the lens, so that the accuracy is not affected.
- the recognition mark provided on the side of the object to be rained is attached at a position where it cannot be read at the same time when reading using the recognition means.
- one of the two alignment methods is used. After moving the recognition mark provided on the object side together with the recognition mark provided on the other object side to a position where it can be read at the same time, the two recognition marks are read simultaneously in synchronization, and then the movement is performed. The determined recognition mark is corrected in consideration of the movement amount, and the absolute position of the recognition mark can be specified.
- the article when moving the article to the position where simultaneous reading is possible, it is preferable that the article arrives at the recognition position first, or at the same time as the mobile recognition means.
- the absolute position of the recognition mark is specified based on the position feedback signal of the table before the table for moving the workpiece is completely stopped. Is preferred.
- the recognition means when the recognition means is stopped, hunting occurs during the settling time. Also, even if the table is stopped, the structure may flex and vibrate. Affects the accuracy of pair position recognition. Therefore, if the vehicle is moving at a constant speed rather than stopping, no vibration occurs, and the accuracy of absolute position recognition is improved as long as only the position feedback signal is accurately recognized.
- the movement of the workpiece when the workpiece is moved to a position where the mark can be recognized simultaneously, the movement of the workpiece must be completed before the recognition means arrives at the recognition position. If the movement of the workpiece is delayed, the recognition means must stop and wait, and vibration will occur as described above, affecting the absolute recognition accuracy. Therefore, the movement timing and movement speed of the recognition means are adjusted in advance so that the article arrives first. Also, while the object is moving, the recognition means is also moving, and the situation where the object intersects at the reading position can be measured with the least vibration. By calculating this in advance and setting the movement timing and movement speed, recognition can always be performed under optimal conditions.
- the recognition mark when the recognition mark is read during movement using the recognition means, the mark is enlarged in the movement direction due to the influence of the movement speed as shown in FIG. It is preferable to shorten the exposure time of the shutter of the recognition means in order to prevent the accuracy of the recognition position from being lowered after being recognized.
- the exposure time of the shutter of the recognition means For example, by using an electronic shutter and setting the exposure time to 1 Z 100 seconds or less, preferably 1/1000 seconds or less, it is possible to prevent the above-described mark enlargement recognition. Becomes However, if the exposure time of the electronic shirt is less than 1/1000 second, for example, the image becomes dark due to insufficient light quantity.
- the mounting method according to the present invention is characterized in that after positioning both workpieces using the first or second alignment method as described above, one workpiece is mounted on the other workpiece. It consists of a method. There is no need to secure settling time. Since the installation time is shortened, the implementation time can be significantly reduced.
- the one object is, for example, a chip
- the other object is, for example, a substrate.
- the above-mentioned chip includes, for example, IC chips, semiconductor chips, optical elements, surface-mounted components, wafers, and all forms of the side to be bonded to a substrate regardless of the type or size.
- the above-mentioned substrate includes, for example, all forms of a side to be bonded to a chip irrespective of type and size, such as a resin substrate, a glass substrate, a film substrate, a chip, and a wafer.
- a two-field recognition means having a field of view in both the upper and lower directions, or a recognition means (including a two-eye power lens) inserted below both objects to be bonded is used.
- any form can be used as long as it can recognize (or image) the recognition mark, such as a CCD camera, an infrared camera, an X-ray camera, and a sensor.
- FIG. 1 is a schematic configuration diagram of a mounting apparatus to which an alignment method according to an embodiment of the present invention can be applied.
- FIG. 2 is a characteristic diagram showing a conventional settling time in the mobile recognition means and an example of mark recognition timing in the method of the present invention.
- FIG. 3 is a plan view of the recognition mark showing that the mark may be enlarged and recognized when the recognition mark is recognized while moving by the mobile recognition means.
- Fig. 4 is a plan view of the recognition mark showing the smear phenomenon.
- FIG. 5 is an explanatory diagram showing an example of a relationship between a movement axis and a visual field in the mobile recognition means.
- FIG. 6 is an explanatory diagram showing an example of a relationship between a movement command and a movement axis coordinate in the mobile recognition means.
- FIG. 7 is a schematic configuration diagram of a mounting apparatus showing an example of the present invention in which one recognition mark is shifted to recognize upper and lower marks.
- FIG. 8 is a flowchart showing the operation of the alignment method according to an embodiment of the present invention.
- FIG. 9 is an operation flow chart of an alignment method according to another embodiment of the present invention.
- C FIG. 10 shows that the upper and lower cameras are synchronized at the same time by the upper and lower cameras during the movement of the two-view recognition means.
- 7 is a graph showing a measurement result when a recognition mark is repeatedly read.
- FIG. 11 is a graph showing the results of showing the relative positions of the upper and lower recognition marks according to the present invention in the characteristics shown in FIG.
- FIG. 12 is a schematic configuration diagram of a mounting apparatus to which an alignment method according to still another embodiment of the present invention can be applied.
- FIG. 14 is a schematic configuration diagram of a mounting apparatus to which an alignment method according to still another embodiment of the present invention can be applied. '
- FIG. 15 is a schematic front view of a mounting apparatus to which an alignment method according to still another embodiment of the present invention can be applied.
- FIG. 16 is a schematic side view of the apparatus of FIG.
- the mechanical device configuration in the present invention for example, the same one as shown in FIG. 1 can be used.
- a drive command for moving the recognition means (the two-field recognition means) 5 is issued, but the settling time T until the complete stop is set as in the prior art.
- the recognition marks A and C (or B and D) are read while moving.For example, reading is performed at point P 2 in Fig. 2 c.
- the position P 2 for this reading is It only needs to be within the range where the image can be read. For example, as shown in Fig.
- the position of the field of view of the recognition means 1 corresponds to the movement axis coordinate 11 of the recognition means moving by an encoder or magnetic scale provided in the recognition means moving mechanism or the recognition means position detection mechanism.
- 2 the center of the field of view
- reading can be started.
- a feedback signal is output. Based on this, it is possible to accurately correct the recognition mark reading position at the time of reading to the actual absolute position of the recognition mark. By performing such a correction, the absolute position of each recognition mark can be specified with high accuracy despite reading while moving, and the results Based on this, the workpieces can be positioned with high accuracy.
- the relative positional relationship between the upper and lower recognition marks can be accurately recognized without being affected by vibration or the like during movement, and highly accurate alignment can be performed based on the relative positional relationship.
- the upper and lower recognition marks cannot be read at the same time as they are, for example, an adhesive or film is applied to one of the workpieces, and a recognition mark is applied to the outside of the workpiece.
- it is possible to simultaneously read the upper and lower recognition marks by shifting the position of the recognition mark on one of the workpieces by a predetermined amount for each workpiece. Since the predetermined amount that is forcibly shifted is a known amount, it can be easily and accurately corrected at the time of positioning the two workpieces. For example, as shown in Fig. 7, the position of the second workpiece 4 is forcibly shifted by moving the stage 3 so that the recognition mark A and the recognition mark C are located at the same position in the vertical direction.
- the upper and lower recognition marks A, C can be read simultaneously in synchronization. This forced displacement may be detected when the two workpieces are aligned.
- the same method can be applied to recognition marks B and D.
- the head holding the first object (for example, a chip) is moved to the recognition mark reading height, and the two-field recognition means is connected to the first object and the second object. Between the objects to be bonded (for example, substrates).
- the encoder feedpack pulse of the moving axis before the complete stop is read and captured as the mark recognition position, and the upper and lower cameras in the two-view recognition means are used in the same way.
- the image of recognition mark C is preferable to read the feedback pulse using a linear scale attached to a tape instead of the encoder, since the position can be accurately recognized without being affected by backlash and thermal expansion between the tables from the encoder.
- the recognition means of the two fields of view are retracted, but the recognition positions of the marks and marks and the recognition positions of marks 8 and D are the feedback information of the movement axis at the time of reading the image.
- the absolute positions of the recognition marks A and C and the recognition marks B and D are recognized based on the correction calculation.
- the stage is moved and adjusted, and T-alignment is performed so that the relative positional relationship between the two workpieces falls within a predetermined accuracy range.
- the head is lowered, and the first workpiece is mounted on the second workpiece.
- the head is raised and a series of mounting operations are completed.
- the head holding the first workpiece (for example, a chip) is moved to the recognition mark reading height, and the two-field recognition means is connected to the first workpiece and the second workpiece. Insert between objects to be joined (for example, substrate).
- the stage is moved so that the recognition mark C 'can be taken in the same field of view as the recognition mark A.
- the encoder feedback pulse of the moving axis before the complete stop is captured as the read mark recognition position, and the upper and lower cameras in the two-view recognition means are synchronized and synchronized. Read the images of recognition marks A and C. Even in this case, if it is difficult to completely stop the stage with respect to the movement time of the camera, it is preferable to read the encoder feedpack pulse on the stage side tape. Also, a linear scale is more preferable instead of an encoder.
- Figures 10 and 11 show examples of data that read the images of the recognition marks A, C, and simultaneously by synchronizing the upper and lower cameras as described above.
- Figure 10 shows the movement of the two-view recognition means. The data of the image reading position from the reference position when the operation of reading the images of the recognition marks A, C, and simultaneously at the same time by synchronizing the upper and lower cameras is shown. As shown in Fig. 10, the image reading position of the upper camera A or the lower camera C 'alone is not stable during the movement of the two visual field recognition means, even if the measurement is repeated at the same coordinates. m variation occurred. In other words, when mounting is performed under these conditions, a variation of about 8 / zm occurs.
- the relative positions of the recognition mark and C are compared as shown in Fig. 11. As shown in the figure, it can be detected that the relative error is less than about 0.6 // m or less, indicating that the accuracy can be greatly improved. Also, by reading the encoder feedback pulse, this variation of about 8 // m can be recognized as an absolute position and canceled. For this reason, accuracy can be ensured even at the time of alignment with 0 correction that requires the absolute position of the rotation center.
- the stage is moved so that the recognition marks D, can be read in the same field of view as the recognition mark B, and the recognition means in the two fields of view is moved to the next recognition position.
- the encoder feedback pulse of the moving axis before the complete stop is taken in as read mark recognition, and the upper and lower cameras in the two visual field recognition means are synchronized and the recognition marks B and D 'are simultaneously displayed. Load an image.
- the recognition means for the two fields of view are retracted, but the recognition positions of the marks A and C and the recognition positions of the marks B and D 'are corrected based on the feedback information of the moving axis at the time of reading the image. Then, the absolute positions of the recognition marks C and C and the recognition marks 8, D are recognized.
- the stage is moved and adjusted based on the absolute position recognition information, and the alignment is performed so that the relative positional relationship between the two objects falls within a predetermined accuracy range.
- the head is lowered, and the first workpiece is mounted on the second workpiece.
- the head is raised and a series of mounting operations are completed.
- the read mark enlargement phenomenon shown in FIG. 3 can be prevented, and a strong exposure time is required to shorten the exposure time. Even when a light source is used, if the strobe light is emitted in synchronization with the exposure, the occurrence of the smear phenomenon as shown in FIG. 4 can be suppressed as much as possible, and higher recognition position accuracy can be achieved.
- FIGS. 12 and 13 show a mounting apparatus to which an alignment method according to still another embodiment of the present invention is applied.
- alignment recognition marks A and B are provided on the lower surface of the first workpiece 2 (for example, a chip) held on the head 1 and held on the stage 3.
- alignment marks C and D are provided on the lower surface of the second workpiece 4 (for example, a substrate).
- the portion of the second object 4 that protrudes from the stage 3 when it protrudes from the stage 3 is supported by the receiving member 6 on the stage 3 side, and recognition marks C and D are attached to the lower surface of this portion. ing.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Operations Research (AREA)
- Theoretical Computer Science (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Wire Bonding (AREA)
- Length Measuring Devices By Optical Means (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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KR1020047015579A KR101086097B1 (ko) | 2002-04-04 | 2003-03-27 | 얼라이먼트 방법 및 그 방법을 이용한 실장 방법 |
US10/509,882 US7299545B2 (en) | 2002-04-04 | 2003-03-27 | Alignment method and mounting method using the alignment method |
JP2003582808A JP4033838B2 (ja) | 2002-04-04 | 2003-03-27 | アライメント方法およびその方法を用いた実装方法 |
US11/979,595 US7918953B2 (en) | 2002-04-04 | 2007-11-06 | Alignment method and mounting method using the alignment method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002102561 | 2002-04-04 | ||
JP2002-102561 | 2002-04-04 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10509882 A-371-Of-International | 2003-03-27 | ||
US11/979,595 Division US7918953B2 (en) | 2002-04-04 | 2007-11-06 | Alignment method and mounting method using the alignment method |
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WO2003085723A1 true WO2003085723A1 (en) | 2003-10-16 |
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PCT/JP2003/003880 WO2003085723A1 (en) | 2002-04-04 | 2003-03-27 | Alignment method and mounting method using the alignment method |
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US (2) | US7299545B2 (ja) |
JP (1) | JP4033838B2 (ja) |
KR (2) | KR101065899B1 (ja) |
CN (1) | CN100394577C (ja) |
TW (1) | TWI244710B (ja) |
WO (1) | WO2003085723A1 (ja) |
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JP2008135708A (ja) * | 2006-10-06 | 2008-06-12 | Asml Netherlands Bv | 接合基板の接合性測定 |
WO2009096454A1 (ja) * | 2008-01-30 | 2009-08-06 | Toray Engineering Co., Ltd. | チップ搭載方法およびチップ搭載装置 |
JP2012119459A (ja) * | 2010-11-30 | 2012-06-21 | Kyocera Kinseki Corp | 素子部品搭載装置 |
JP2020511784A (ja) * | 2017-03-16 | 2020-04-16 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 少なくとも3枚の基板を接合するための方法 |
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JP4356683B2 (ja) * | 2005-01-25 | 2009-11-04 | セイコーエプソン株式会社 | デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置 |
KR100913579B1 (ko) * | 2007-05-14 | 2009-08-26 | 주식회사 에스에프에이 | 구동용 회로기판의 본딩장치 및 그 방법 |
JP4659908B2 (ja) * | 2007-09-28 | 2011-03-30 | パナソニック株式会社 | 検査装置及び検査方法 |
JP2009194543A (ja) * | 2008-02-13 | 2009-08-27 | Panasonic Corp | 撮像装置およびその製造方法 |
JP2011519177A (ja) * | 2008-04-29 | 2011-06-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 電子テキスタイル |
KR101710631B1 (ko) * | 2010-12-23 | 2017-03-08 | 삼성전자주식회사 | 손 떨림 보정 모듈을 구비하는 디지털 영상 촬영 장치 및 이의 제어 방법 |
JP5277266B2 (ja) * | 2011-02-18 | 2013-08-28 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ及び半導体製造方法 |
US9265186B2 (en) | 2011-11-10 | 2016-02-16 | Delaware Capital Formation, Inc. | Camera system for aligning components of a PCB |
US20140082935A1 (en) * | 2012-09-27 | 2014-03-27 | Volex Plc | Method for passive alignment of optical components to a substrate |
US20140115886A1 (en) * | 2012-10-26 | 2014-05-01 | Volex Plc | Method and system for marking substrate and placing components for high accuracy |
JP6242078B2 (ja) | 2013-05-20 | 2017-12-06 | オリンパス株式会社 | 半導体装置、および半導体装置の位置決め装置 |
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AT517259B1 (de) * | 2015-06-09 | 2020-01-15 | Zkw Group Gmbh | Verfahren zur positionsgenauen Bestückung eines Schaltungsträgers |
CN104965489A (zh) * | 2015-07-03 | 2015-10-07 | 昆山市佰奥自动化设备科技有限公司 | 基于机器人的ccd自动对位组装系统及方法 |
JP6390978B2 (ja) * | 2016-02-05 | 2018-09-19 | パナソニックIpマネジメント株式会社 | 半導体装置の製造装置 |
KR101935291B1 (ko) * | 2016-06-29 | 2019-01-04 | 서울엔지니어링(주) | 전사장치의 얼라인 광학측정장치 |
JP6985814B2 (ja) * | 2017-05-09 | 2021-12-22 | 株式会社Fuji | 基板作業機 |
CN110376699B (zh) * | 2019-07-26 | 2021-12-03 | 业成科技(成都)有限公司 | 镜片对位方法、镜头模组及成像装置 |
KR102048902B1 (ko) * | 2019-07-26 | 2019-11-26 | 성우테크론 주식회사 | 마이크로 엘이디 모듈 제조장치 |
CN115140531A (zh) * | 2021-12-11 | 2022-10-04 | 武汉帝尔激光科技股份有限公司 | 一种适用于大型尺寸片状物料的对正方法 |
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- 2003-03-27 KR KR1020097024936A patent/KR101065899B1/ko active IP Right Grant
- 2003-03-27 US US10/509,882 patent/US7299545B2/en not_active Expired - Fee Related
- 2003-03-27 KR KR1020047015579A patent/KR101086097B1/ko active IP Right Grant
- 2003-03-27 CN CNB038127504A patent/CN100394577C/zh not_active Expired - Fee Related
- 2003-03-27 JP JP2003582808A patent/JP4033838B2/ja not_active Expired - Lifetime
- 2003-03-27 WO PCT/JP2003/003880 patent/WO2003085723A1/ja active Application Filing
- 2003-04-03 TW TW092107647A patent/TWI244710B/zh not_active IP Right Cessation
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2007
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JPH088591A (ja) * | 1994-06-22 | 1996-01-12 | Toshiba Corp | 部品実装装置 |
JP2001217596A (ja) * | 1999-03-15 | 2001-08-10 | Toray Eng Co Ltd | チップ実装装置におけるアライメント方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008135708A (ja) * | 2006-10-06 | 2008-06-12 | Asml Netherlands Bv | 接合基板の接合性測定 |
JP4559461B2 (ja) * | 2006-10-06 | 2010-10-06 | エーエスエムエル ネザーランズ ビー.ブイ. | 接合基板の接合性測定 |
WO2009096454A1 (ja) * | 2008-01-30 | 2009-08-06 | Toray Engineering Co., Ltd. | チップ搭載方法およびチップ搭載装置 |
JP2012119459A (ja) * | 2010-11-30 | 2012-06-21 | Kyocera Kinseki Corp | 素子部品搭載装置 |
JP2020511784A (ja) * | 2017-03-16 | 2020-04-16 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 少なくとも3枚の基板を接合するための方法 |
JP7177781B2 (ja) | 2017-03-16 | 2022-11-24 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 少なくとも3枚の基板を接合するための方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200306634A (en) | 2003-11-16 |
TWI244710B (en) | 2005-12-01 |
US20050274869A1 (en) | 2005-12-15 |
CN100394577C (zh) | 2008-06-11 |
JP4033838B2 (ja) | 2008-01-16 |
US7299545B2 (en) | 2007-11-27 |
CN1659694A (zh) | 2005-08-24 |
KR101086097B1 (ko) | 2011-11-25 |
US20080073027A1 (en) | 2008-03-27 |
US7918953B2 (en) | 2011-04-05 |
KR20040094900A (ko) | 2004-11-10 |
KR20100005150A (ko) | 2010-01-13 |
JPWO2003085723A1 (ja) | 2005-08-18 |
KR101065899B1 (ko) | 2011-09-19 |
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