JP3836479B2 - ワイヤボンディング装置 - Google Patents
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- JP3836479B2 JP3836479B2 JP2004195305A JP2004195305A JP3836479B2 JP 3836479 B2 JP3836479 B2 JP 3836479B2 JP 2004195305 A JP2004195305 A JP 2004195305A JP 2004195305 A JP2004195305 A JP 2004195305A JP 3836479 B2 JP3836479 B2 JP 3836479B2
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- 230000003287 optical effect Effects 0.000 claims description 56
- 238000001514 detection method Methods 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 21
- 238000007373 indentation Methods 0.000 claims description 12
- 238000012937 correction Methods 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 17
- 238000005286 illumination Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 6
- 238000000691 measurement method Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 3
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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- H01L2224/45001—Core members of the connector
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- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
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- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
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Description
まず、図4に示すツール6をワーク13に押し付けることにより、図5に示すようにワーク13にボンディング圧痕17を付ける。これは、ツール6の先端にはボール8を形成せず、ワイヤ7も出さない状態で、ツール6のみをワーク13に押し付けることで行われる。
図10は、従来のワイヤボンディング装置のオフセット量を検出する機構を説明する模式図である。図11は、オフセット量を検出する際に図10に示すカメラで撮影したモニタ画像である。
前記ツールに対してCTDだけオフセットさせて配置された、前記ワークの位置を検出する位置検出用カメラと、
前記ツール及び前記位置検出用カメラを移動させる移動手段と、
前記ツール又は前記ボールを前記位置検出用カメラに結像させる光学ユニットと、
を具備することを特徴とする。
尚、前記ワークはワイヤボンディングを行う対象物である。
前記第2ミラー、前記第1ミラー、前記レンズ及び前記プリズムをこの順に介することにより、前記ツール又は前記ボールを前記位置検出用カメラに結像させることが好ましい。
前記基準CTDを測定した直後に、前記ツール又は前記ボールを、前記光学ユニットを介して前記位置検出用カメラにより撮像し、この撮像した第2モニタ画像を画像処理する画像処理装置と、をさらに具備し、
前記画像処理装置によって前記ツール又は前記ボールの中心の第1座標を検出し、前記第1座標を前記メモリに記憶させ、CTD補正を行う際に前記第1座標を用いることが好ましい。
尚、前記基準CTDは、これを測定した時点で正確なCTDである。また、前記第1座標は、前記基準CTDに対応するものである。
(実施の形態1)
図1は、本発明の実施の形態1によるCTD補正光学ユニットを備えたワイヤボンディング装置を示す模式図である。図2は、図1に示すCTD補正光学ユニットの内部構成を示す模式図である。図3は、図1に示すワイヤボンディング装置の制御基板を示す構成図である。
まず、ワイヤボンディング装置によってワイヤボンディングを行う前に、図4に示すように、ボンディングワーク内の適当な場所のワーク13にツール6を押し付けることにより、図5に示すようにワーク13にボンディング圧痕17を付ける。これは、ツール6の先端にはボール8を形成せず、ワイヤ7も出さない状態で、ツール6のみをワーク13に押し付けることで行われる。
図1及び図2に示すように、位置検出用カメラの光軸1aをCTD補正光学ユニット19におけるプリズム9側ののぞき穴の直上に移動させると共に、ツール6の軸心6aをCTD補正光学ユニット19における第2ミラー12側ののぞき穴の直上に移動させる。これにより、カメラ1は、図7に示すようなツール6及びボール8を真下から写したモニタ画像を得る。この画像データが図3に示す画像処理装置27に送られ、この画像処理装置27においてツール6又はボール8の中心の第2座標を検出し、この第2座標をCTD補正光学ユニットにおける補正CTDとしてメモリに記憶する。補正CTDの第2座標は、例えばモニタ画像の中心を原点とすると(dx1,dy1)で表わされる。
図8は、本発明の実施の形態2によるワイヤボンディング装置の要部を示す模式図である。図9は、図8に示すワイヤボンディング装置によってワイヤボンディングを行うボンディングワークを模式的に示す平面図である。尚、実施の形態2においては実施の形態1と同一部分の説明は省略する。
Claims (6)
- ワイヤからなるボールをワークにボンディングするツールと、
前記ツールに対してCTDだけオフセットさせて配置された、前記ワークの位置を検出する位置検出用カメラと、
前記ツール及び前記位置検出用カメラを移動させる移動手段と、
前記ツール又は前記ボールを前記位置検出用カメラに結像させる光学ユニットと、
前記ワークに前記ツールを押し付けることにより該ワークに圧痕を付け、前記位置検出用カメラを前記移動手段により前記圧痕の直上に移動させ、前記位置検出用カメラにより前記圧痕を撮像し、この撮像した第1モニタ画像の中心と前記圧痕の中心が一致するように前記位置検出用カメラを移動させ、前記位置検出用カメラの移動量から基準となる基準CTDを測定し、前記基準CTDを記憶させるメモリと、
を具備することを特徴とするワイヤボンディング装置。 - 前記ツール又は前記ボールを前記位置検出用カメラに結像させる際、前記ツール又は前記ボールを前記移動手段により前記光学ユニットの上方に移動させることを特徴とする請求項1に記載のワイヤボンディング装置。
- 前記光学ユニットは、プリズム、レンズ、第1ミラー及び第2ミラーを有し、
前記第2ミラー、前記第1ミラー、前記レンズ及び前記プリズムをこの順に介することにより、前記ツール又は前記ボールを前記位置検出用カメラに結像させることを特徴とする請求項2に記載のワイヤボンディング装置。 - 前記第2ミラーが移動自在に形成されていることを特徴とする請求項3に記載のワイヤボンディング装置。
- 前記基準CTDを測定した直後に、前記ツール又は前記ボールを、前記光学ユニットを介して前記位置検出用カメラにより撮像し、この撮像した第2モニタ画像を画像処理する画像処理装置と、をさらに具備し、
前記画像処理装置によって前記ツール又は前記ボールの中心の第1座標を検出し、前記第1座標を前記メモリに記憶させることを特徴とする請求項1乃至4のいずれか一項に記載のワイヤボンディング装置。 - 前記第1座標を前記メモリに記憶させた後に、前記ワークにワイヤボンディング処理を行い、前記ツール又は前記ボールを、前記光学ユニットを介して前記位置検出用カメラにより撮像し、この撮像した第3モニタ画像を前記画像処理装置により画像処理して前記ツール又は前記ボールの中心の第2座標を検出し、前記第2座標から前記第1座標を差し引くことにより差分座標を算出し、前記差分座標を前記基準CTDに加算することによりCTDを補正することを特徴とする請求項5に記載のワイヤボンディング装置。
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KR20170129936A (ko) | 2015-03-31 | 2017-11-27 | 가부시키가이샤 신가와 | 와이어 본딩 장치 및 와이어 본딩 방법 |
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JP5164230B1 (ja) * | 2011-09-28 | 2013-03-21 | 株式会社カイジョー | ボンディング装置 |
JPWO2023026430A1 (ja) * | 2021-08-26 | 2023-03-02 |
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KR20170129936A (ko) | 2015-03-31 | 2017-11-27 | 가부시키가이샤 신가와 | 와이어 본딩 장치 및 와이어 본딩 방법 |
US10262968B2 (en) | 2015-03-31 | 2019-04-16 | Shinkawa Ltd. | Wire bonding apparatus and wire bonding method |
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